CN115172217A - Die bonder with single-head four swing arms of semiconductor die bonder - Google Patents
Die bonder with single-head four swing arms of semiconductor die bonder Download PDFInfo
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- CN115172217A CN115172217A CN202210806882.5A CN202210806882A CN115172217A CN 115172217 A CN115172217 A CN 115172217A CN 202210806882 A CN202210806882 A CN 202210806882A CN 115172217 A CN115172217 A CN 115172217A
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- die bonder
- swing arm
- sliding block
- arm
- swing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the technical field of semiconductor packaging, in particular to a single-head four-swing-arm die bonder of a semiconductor die bonder, which comprises a substrate, a bracket arranged at the top of the substrate, a swing arm unit and a lower pressing piece, wherein the bracket is arranged at the top of the substrate; the top of the bracket is provided with a rotating motor, the axial direction of an output shaft of the rotating motor is provided with a rotating shaft, and the bottom end of the rotating shaft is integrally provided with a four-claw frame; at least more than two groups of swing arm units are coupled on the peripheral sides of the four-jaw frames; the bracket comprises a main bracket plate and side plates arranged at two ends; by arranging the four groups of swing arm units, the running tracks of the four groups of swing arm units are respectively that the first group is in crystal absorption, the third group opposite to the first group is in crystal fixation, the second group is prepared for crystal absorption, and the fourth group opposite to the second group is in crystal fixation.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a single-head four-swing-arm die bonder of a semiconductor die bonder.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: a wafer from a wafer previous process is cut into small chips (Die) through a scribing process, then the cut chips are pasted on small islands of corresponding substrate (Lead frame) frames through glue, and bonding pads (Bond pads) of the chips are connected to corresponding pins (Lead) of the substrate through superfine metal (gold tin copper aluminum) wires or conductive resin to form a required circuit; then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out procedures such as inspection Incoming, test testing, packaging and the like, and finally warehousing and shipping;
die Bond or Die attach. Die bonding is a process of bonding a wafer to a designated area of a support through a glue (generally, a conductive glue or an insulating glue for an LED), forming a thermal or electrical path, and providing conditions for subsequent wire bonding.
In the prior art, a single-head single-pendulum mode is generally used for sucking a wafer, then the sucked wafer is placed in a designated area of a support, and only one swing arm is used for die bonding, so that the die bonding efficiency is low, and the requirements of the conventional semiconductor packaging cannot be met.
Disclosure of Invention
The invention provides a single-head four-swing-arm die bonder of a semiconductor die bonder, aiming at the problems that in the prior art, the single-head single-swing-arm die bonder is low in die bonding efficiency and cannot meet the requirements of the existing semiconductor packaging production.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a die bonder with a single head and four swing arms of a semiconductor die bonder comprises a substrate, a bracket arranged at the top of the substrate, a swing arm unit and a lower pressing piece;
the top of the bracket is provided with a rotating motor, the axial direction of an output shaft of the rotating motor is provided with a rotating shaft, and the bottom end of the rotating shaft is integrally provided with a four-claw frame;
at least more than two groups of swing arm units are coupled on the peripheral sides of the four claw frames;
the bracket comprises a main bracket plate and side plates arranged at two ends of the main bracket plate;
the rotating piece is arranged on the inner side of the main bracket plate;
the rotating piece comprises an outer ring and an inner ring arranged in the outer ring;
the swing arm unit comprises a connecting block, a sliding block, a swing arm piece connected with the sliding block and a vacuum suction nozzle arranged at the tail end of the swing arm piece, wherein the sliding block is connected to the inner side of the connecting block in a sliding manner;
a return spring A is arranged between the connecting block and the sliding block;
a suction pipe mounting cylinder is arranged outside the rotating shaft, a vacuum suction pipe is arranged in the suction pipe mounting cylinder, and two ends of the vacuum suction pipe are respectively positioned at the top of the suction pipe mounting cylinder and outside the mounting frame;
two groups of driving units are arranged at the rear end of the side plate;
the driving unit comprises driving motors and a cam arranged at the front ends of output shafts of the driving motors, wherein the rotation directions of the two groups of driving motors are opposite;
the lower pressing piece comprises a lower pressing arm and a lower pressing head integrally arranged at the top of the lower pressing arm, a fixed shaft is arranged on the inner side of the lower pressing head, a roller is movably connected to the position, corresponding to the cam, of the outer side of the middle of the fixed shaft, fixed columns are arranged on the lower pressing arm and the side plate, and a reset spring B is arranged between the two fixed columns;
and pulleys are arranged on the inner side of the top of the sliding block and correspond to the lower pressing arm.
And a coupling is arranged between the output shaft of the rotating motor and the rotating shaft.
The outer ring is fixedly connected with the main support plate, and the inner ring is rotatably connected with the outer ring to form a bearing so as to reduce the friction resistance of the rotating shaft.
The inner ring is fixedly connected with the connecting block, and the inner ring is fixedly connected with the connecting block.
The outer wall of the front side of the side plate is fixedly provided with a guide rail, the outer side of the guide rail is connected with a sliding block in a sliding mode, and the sliding block is fixedly arranged inside the pressing arm.
Wherein, the arm is the J style of calligraphy down.
The invention has the beneficial effects that:
(1) According to the die bonding device with the single-head four swing arms of the semiconductor die bonder, the four groups of swing arm units are arranged, the running tracks of the four groups of swing arm units are respectively that the first group is in die bonding, the third group opposite to the first group is in die bonding, the second group is prepared for die bonding, the fourth group opposite to the second group is in die bonding preparation, and the four groups of swing arm units work simultaneously, so that the die bonding efficiency of a semiconductor is greatly improved.
(2) According to the die bonder with the single head and the four swing arms of the semiconductor die bonder, the driving units are arranged, the rotation directions of the two driving units are opposite, so that the swing arm units positioned on the same straight line can be helped to complete die sucking and die bonding at the same time, and the die bonder efficiency is further improved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic front view of a die bonding apparatus with a single head and four swing arms of a semiconductor die bonding machine according to the present invention;
FIG. 2 is a schematic perspective view of FIG. 1;
FIG. 3 is a schematic view of a portion of the enlarged structure at A in FIG. 2;
FIG. 4 is a schematic view showing a connection structure between the swing arm unit, the rotary member and the straw mounting cylinder;
FIG. 5 is a schematic structural view of the positional relationship between the outer ring, the inner ring and the swing arm unit;
FIG. 6 is a schematic view of a portion of the enlarged structure at B in FIG. 5;
FIG. 7 is a schematic view of a connection structure among the inner ring, the connecting block, the rotating shaft, the four-jaw frame and the mounting frame;
fig. 8 is a schematic view of a connection structure between the pressing arm, the side plate, the slider and the guide rail.
In the figure: 1. a substrate; 2. rotating the motor; 3. a support; 301. a main bracket plate; 302. a side plate; 303. a guide rail; 4. a drive unit; 401. a drive motor; 402. a cam; 5. a swing arm unit; 501. connecting blocks; 502. a vacuum suction nozzle; 503. a swinging arm member; 504. a slider; 505. a pulley; 6. a push-down member; 601. a pressing arm; 602. a roller; 603. a lower pressure head; 604. a fixed shaft; 605. a slider; 7. fixing the column; 8. a return spring B; 9. a coupling; 10. a rotating member; 101. an outer ring; 102. an inner ring; 103. a rotating shaft; 104. a mounting frame; 105. four-claw frame; 11. a straw placement cylinder; 12. a vacuum suction pipe; 13. and a return spring A.
Detailed Description
The present invention will be further described with reference to the following detailed description so that the technical means, the creation features, the achievement purposes and the effects of the present invention can be easily understood.
As shown in fig. 1, the die bonding device with a single head and four swing arms of a semiconductor die bonder of the present invention comprises a substrate 1, a support 3 disposed on the top of the substrate 1, a swing arm unit 5 and a lower pressing member 6;
as shown in fig. 1 and fig. 4-7, a rotating motor 2 is arranged at the top of the bracket 3, a rotating shaft 103 is arranged in the axial direction of an output shaft of the rotating motor 2, and a four-jaw frame 105 is integrally formed at the bottom end of the rotating shaft 103; at least more than two groups of swing arm units 5 are coupled on the peripheral side of the four-claw frame 105; the bracket 3 comprises a main bracket plate 301 and side plates 302 arranged at two ends; the inner side of the main supporting plate 301 is provided with a rotating part 10; the swing arm unit 5 comprises a connecting block 501, a sliding block 504, a swing arm member 503 connected with the sliding block 504, and a vacuum suction nozzle 502 arranged at the end of the swing arm member 503, wherein the sliding block 504 is slidably connected to the inner side of the connecting block 501; a return spring A13 is arranged between the connecting block 501 and the sliding block 504; a suction pipe placing cylinder 11 is arranged outside the rotating shaft 103, a vacuum suction pipe 12 is arranged in the suction pipe placing cylinder 11, and two ends of the vacuum suction pipe 12 are respectively positioned at the top of the suction pipe placing cylinder 11 and outside the mounting frame 104;
the vacuum suction nozzle 502 arranged on the swing arm unit 5 is connected with the extraction opening of the vacuum pump (not shown in the figure) through the vacuum suction pipe 12, the vacuum pump is used for enabling the suction nozzle position of the vacuum suction nozzle 502 arranged at the tail end of the swing arm part 503 to generate negative pressure to suck the wafer on the wafer tray, then the output shaft of the rotating motor 2 is used for driving the rotating shaft 103 to rotate, the four claw frames 105 at the bottom end of the rotating shaft 103 drive the four groups of swing arm units 5 on the periphery side to rotate to a specified area, then the operation of the vacuum pump is stopped, the wafer on the suction nozzle of the vacuum suction nozzle 502 falls into the specified area, and then the wafer is bonded through colloid, so that the wafer bonding process is completed, and the wafer bonding efficiency is improved by the four groups of swing arm units 5;
as shown in fig. 1-3 and 8, two sets of driving units 4 are disposed at the rear end of the side plate 302; the driving unit 4 comprises driving motors 401 and a cam 402 arranged at the front ends of output shafts of the driving motors 401, and the rotation directions of the two groups of driving motors 401 are opposite; the lower pressing piece 6 comprises a lower pressing arm 601 and a lower pressing head 603 integrally arranged at the top of the lower pressing arm 601, a fixed shaft 604 is arranged at the inner side of the lower pressing head 603, the outer side of the middle part of the fixed shaft 604 is movably connected with a roller 602 corresponding to the cam 402, fixed columns 7 are arranged on the lower pressing arm 601 and the side plate 302, and a return spring B8 is arranged between the two fixed columns 7; the outer wall of the front side of the side plate 302 is fixedly provided with a guide rail 303, the outer side of the guide rail 303 is connected with a sliding block 605 in a sliding manner, and the sliding block 605 is fixedly arranged inside the lower pressure arm 601; a pulley 505 is arranged on the inner side of the top of the sliding block 504 corresponding to the lower pressing arm 601; the lower pressing arm 601 is J-shaped; the swing arm units 5 on a straight line are used for completing the processes of crystal suction and crystal fixation by utilizing two driving units 4, a driving motor 401 drives a cam 402 fixedly connected with the outer side wall of an output shaft to rotate, a large circular part of the rotation of the cam 402 is pressed down onto a roller 602, the roller 602 is fixedly connected with a lower pressing arm 601 through a fixed shaft 604, so that the lower pressing arm 601 moves downwards, the bottom end of the lower pressing arm 601 is connected with a sliding block 504, a pulley 505 is also arranged in the sliding block 504 to reduce the frictional resistance between the lower pressing arm and the sliding block, the sliding block 504 slides downwards in a connecting block 501, the swing arm units 5 on the same straight line complete the processes of crystal suction and crystal fixation at the same time due to the opposite rotation directions of the two driving units 4, the remaining two swing arm units 5 are in the actions of preparing crystal suction and preparing crystal fixation, and the swing arm members 503 and the lower pressing arm 601 are reset by virtue of a reset spring A13 grade reset spring B8;
as shown in fig. 4, the rotating member 10 includes an outer ring 101 and an inner ring 102 disposed inside the outer ring 101; the outer ring 101 is fixedly connected with the main bracket plate 301, and the inner ring 102 is rotatably connected with the outer ring 101 to form a bearing so as to reduce the frictional resistance of the rotating shaft 103;
the suction pipe placing cylinder 11 is fixedly sleeved outside the rotating shaft 103, the bottom end of the suction pipe placing cylinder 11 is fixedly sleeved with the bottom of the inner ring 102, the opening of the inner ring 102 is wide at the top and narrow at the bottom, so that the vacuum suction pipe 12 can be conveniently placed, meanwhile, the suction pipe placing cylinder 11 can be fixedly connected with the inner ring 102, when the rotating shaft 103 drives the suction pipe placing cylinder 11 to rotate, the inner ring 102 and the outer ring 101 rotate relatively, the friction resistance can be reduced, and the service life of the equipment can be prolonged;
as shown in fig. 4, a coupling 9 is disposed between the output shaft of the rotating motor 2 and the rotating shaft 103, and the coupling 9 is used to transmit the rotating torque and the direction of the output shaft of the rotating motor 2 to the rotating shaft 103 to drive the four sets of swing arm units 5 to rotate;
as shown in fig. 7, the bottom of the inner ring 102 is integrally connected with a mounting frame 104, and the mounting frame 104 is fixedly connected with the connecting block 501, so that the fixing strength of the connecting block 501 is improved.
The working principle is as follows: when the wafer fixing device is used, firstly, the driving motor 401 on the driving unit 4 drives the large circular part of the cam 402 to press down, so that the pressing arm 601 in the pressing piece 6 moves downwards, the pressing arm 601 moves downwards, the sliding block 504 slides in the connecting block 501, the swinging arm 503 presses down, the vacuum suction nozzle 502 arranged at the tail end of the swinging arm 503 presses down, as the vacuum suction nozzle 502 is arranged on the swinging arm unit 5, through the through connection between the vacuum suction pipe 12 and the vacuum suction nozzle 502, the suction nozzle of the vacuum suction nozzle 502 generates negative pressure to suck a wafer on a wafer disk by virtue of a vacuum pump, the wafer is transferred to a designated area by rotating the rotating motor 2, and then the wafer is fixed by pressing down, so that the operation tracks of the swinging arm units of the four groups are that the first group sucks the wafer, the third group opposite to the first group fixes the wafer, the second group prepares for sucking the wafer, and the fourth group opposite to the second group prepares for fixing the wafer.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the embodiments and descriptions given above are only illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a solid brilliant device of four swing arms of semiconductor solid brilliant machine single-end which characterized in that: comprises a substrate (1), a bracket (3) arranged at the top of the substrate (1), a swing arm unit (5) and a lower pressing piece (6);
a rotating motor (2) is arranged at the top of the support (3), a rotating shaft (103) is arranged in the axial direction of an output shaft of the rotating motor (2), and a four-jaw frame (105) is integrally formed at the bottom end of the rotating shaft (103);
at least more than two groups of swing arm units (5) are coupled on the peripheral side of the four-claw frame (105);
the bracket (3) comprises a main bracket plate (301) and side plates (302) arranged at two ends;
a rotating part (10) is arranged on the inner side of the main support plate (301);
the rotating piece (10) comprises an outer ring (101) and an inner ring (102) arranged in the outer ring (101);
the swing arm unit (5) comprises a connecting block (501), a sliding block (504), a swing arm piece (503) connected with the sliding block (504) and a vacuum suction nozzle (502) arranged at the tail end of the swing arm piece (503), wherein the sliding block (504) is connected to the inner side of the connecting block (501) in a sliding mode;
a return spring A (13) is arranged between the connecting block (501) and the sliding block (504);
a suction pipe placing cylinder (11) is arranged on the outer side of the rotating shaft (103), a vacuum suction pipe (12) is arranged in the suction pipe placing cylinder (11), and two ends of the vacuum suction pipe (12) are respectively positioned at the top of the suction pipe placing cylinder (11) and outside the mounting frame (104);
two groups of driving units (4) are arranged at the rear end of the side plate (302);
the driving unit (4) comprises driving motors (401) and a cam (402) arranged at the front ends of output shafts of the driving motors (401), wherein the rotation directions of the two groups of driving motors (401) are opposite;
the pressing piece (6) comprises a pressing arm (601) and a pressing head (603) integrally arranged at the top of the pressing arm (601), a fixed shaft (604) is arranged on the inner side of the pressing head (603), a roller (602) is movably connected to the position, corresponding to the cam (402), of the outer side of the middle of the fixed shaft (604), fixed columns (7) are arranged on the pressing arm (601) and the side plate (302), and a reset spring B (8) is arranged between the two fixed columns (7);
and a pulley (505) is arranged on the inner side of the top of the sliding block (504) and corresponds to the position of the lower pressing arm (601).
2. The die bonder with a single head and four swing arms of a semiconductor die bonder as claimed in claim 1, wherein: and a coupling (9) is arranged between the output shaft of the rotating motor (2) and the rotating shaft (103).
3. The die bonder with a single head and four swing arms of a semiconductor die bonder as claimed in claim 1, wherein: the outer ring (101) is fixedly connected with the main support plate (301), and the inner ring (102) is rotatably connected with the outer ring (101) and used for forming a bearing to reduce the friction resistance of the rotating shaft (103).
4. The die bonder with a single head and four swing arms of a semiconductor die bonder as claimed in claim 3, wherein: the inner ring (102) is characterized in that the bottom of the inner ring (102) is integrally connected with an installation frame (104), and the installation frame (104) is fixedly connected with the connecting block (501).
5. The die bonder with a single head and four swing arms of a semiconductor die bonder as claimed in claim 1, wherein: the outer wall of the front side of the side plate (302) is fixedly provided with a guide rail (303), the outer side of the guide rail (303) is connected with a sliding block (605) in a sliding manner, and the sliding block (605) is fixedly arranged in the lower pressing arm (601).
6. The die bonder with a single head and four swing arms of a semiconductor die bonder as claimed in claim 1, wherein: the pressing arm (601) is J-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210806882.5A CN115172217A (en) | 2022-07-08 | 2022-07-08 | Die bonder with single-head four swing arms of semiconductor die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210806882.5A CN115172217A (en) | 2022-07-08 | 2022-07-08 | Die bonder with single-head four swing arms of semiconductor die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115172217A true CN115172217A (en) | 2022-10-11 |
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ID=83492757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210806882.5A Pending CN115172217A (en) | 2022-07-08 | 2022-07-08 | Die bonder with single-head four swing arms of semiconductor die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115172217A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115360127A (en) * | 2022-10-19 | 2022-11-18 | 江苏新智达新能源设备有限公司 | Double-head driving device of DieBond process |
-
2022
- 2022-07-08 CN CN202210806882.5A patent/CN115172217A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115360127A (en) * | 2022-10-19 | 2022-11-18 | 江苏新智达新能源设备有限公司 | Double-head driving device of DieBond process |
| CN115360127B (en) * | 2022-10-19 | 2023-02-03 | 江苏新智达新能源设备有限公司 | Double-head driving device for DieBond process |
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