CN216435865U - Wafer taking and placing device - Google Patents
Wafer taking and placing device Download PDFInfo
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- CN216435865U CN216435865U CN202122923410.1U CN202122923410U CN216435865U CN 216435865 U CN216435865 U CN 216435865U CN 202122923410 U CN202122923410 U CN 202122923410U CN 216435865 U CN216435865 U CN 216435865U
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- pick
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Abstract
The utility model discloses a wafer taking and placing device, which comprises a taking and placing frame and a first elastic part; the pick-and-place frame is provided with a pick-and-place suction nozzle, a first driving piece and a second driving piece, the first driving piece comprises a first motor, a transmission belt and two transmission wheels, and the first motor is arranged on the pick-and-place frame; the two driving wheels are rotatably arranged on the taking and placing frame and are arranged at intervals in the height direction of the taking and placing frame; two ends of the transmission belt are respectively wound outside the two transmission wheels; the part of the transmission belt between the two transmission wheels forms two transmission sections distributed on two sides of the transmission wheels; mounting plates are arranged on the two transmission sections; a first elastic component is connected between the mounting plate and the taking and placing frame; the mounting plates are provided with pick-and-place suction nozzles and second driving pieces; the second driving piece is used for driving the pick-and-place suction nozzle to rotate. The utility model discloses a device is got to wafer is put, it can get in turn and put the wafer, improves the wafer and gets and put efficiency, can place the wafer again and get the in-process and interfere with each other.
Description
Technical Field
The utility model relates to a chip processing technology field especially relates to a wafer is got and is put device.
Background
At present, in the production process of a chip, operations such as die bonding and bonding need to be performed on the chip, the die bonding is to solder a wafer on the chip, and the bonding is a wire bonding mode in the production process of the chip, and the wire bonding mode is generally used for connecting a circuit inside the chip with a package pin or a circuit board gold-plated copper foil by using a gold wire or an aluminum wire before packaging. In the process of die bonding, the wafer is usually placed on the die by a pick-and-place device and then fixed. However, the existing pick-and-place device can only pick one wafer at a time, and the pick-and-place efficiency is low. The pick-and-place device capable of picking and placing a plurality of wafers is easy to cause wafer interference when the wafers are downward at the same time.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the present invention provides a wafer taking and placing device, which can alternately take and place wafers, improve the efficiency of taking and placing the wafers, and can also place the wafers to interfere with each other in the process of taking and placing the wafers.
The purpose of the utility model is realized by adopting the following technical scheme:
a chip taking and placing device comprises a taking and placing frame and a first elastic component; the pick-and-place frame is provided with a pick-and-place suction nozzle, a first driving piece and a second driving piece, the first driving piece comprises a first motor, a transmission belt and two transmission wheels, and the first motor is arranged on the pick-and-place frame; the two driving wheels are rotatably arranged on the taking and placing frame and are arranged at intervals in the height direction of the taking and placing frame; two ends of the transmission belt are respectively wound outside the two transmission wheels; the part of the transmission belt between the two transmission wheels forms two transmission sections distributed on two sides of the transmission wheels; mounting plates are arranged on the two transmission sections; the first elastic component is connected between the mounting plate and the taking and placing frame; the mounting plates are provided with the pick-and-place suction nozzle and a second driving piece; the second driving piece is used for driving the pick-and-place suction nozzle to rotate.
Furthermore, a slide block is arranged on the mounting plate, and a slide rail is arranged on the taking and placing frame; the slide rail extends along the height direction of the pick-and-place frame; the sliding block is in sliding fit with the sliding rail.
Furthermore, a second elastic component is arranged on the pick-and-place suction nozzle and used for stretching when the pick-and-place suction nozzle rotates.
Furthermore, the pick-and-place frame is provided with a limit switch, the pick-and-place suction nozzle is provided with a limit sheet, and the limit sheet is used for touching the limit switch when the pick-and-place suction nozzle moves along the height direction of the pick-and-place frame.
Further, still be equipped with the work piece on the frame of putting, the work piece detects the camera and is used for detecting the work piece position and conveying work piece signal.
Further, a light source is further arranged on the taking and placing frame and is arranged below the workpiece detection camera.
Compared with the prior art, the beneficial effects of the utility model reside in that: it can be by two transmission sections that the drive belt formed between two drive wheels at first motor around same direction rotation in-process, two transmission sections are one on the other, and then drive two mounting panels of being connected with two transmission sections one on the other, two are installed on the mounting panel and are got the suction nozzle one on the other promptly, carry out the wafer clamp in turn and get, both can improve the wafer and get efficiency of getting, can avoid two to get the suction nozzle and get simultaneously and press from both sides and get and cause the interference again.
In addition, in the up-and-down movement process of the mounting plate, the first elastic component can stretch out and draw back, the up-and-down movement speed of the pick-and-place suction nozzle can be buffered, and the damage to the wafer caused by the hard contact between the pick-and-place suction nozzle and the wafer is avoided.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of a partial structure of the present invention.
In the figure: 10. a taking and placing frame; 11. a workpiece detection camera; 12. a light source; 13. a slide rail; 20. an elastic member; 30. taking and placing the suction nozzle; 41. a driving wheel; 42. mounting a plate; 421. a slider; 43. a first motor; 50. a second motor.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific embodiments:
as shown in fig. 1 and 2, a wafer pick-and-place apparatus includes a pick-and-place frame 10 and a first elastic component 20, wherein a pick-and-place nozzle 30, a first driving component and a second driving component are disposed on the pick-and-place frame 10. The first driving member includes a first motor 43, a transmission belt and two transmission wheels 41, the first motor 43 is mounted on the rack 10, the two transmission wheels 41 are rotatably mounted on the rack 10, the two transmission wheels 41 are spaced apart in the height direction of the rack 10, and two ends of the transmission belt are respectively wound outside the two transmission wheels 41, so that the transmission belt between the two transmission wheels 41 forms two transmission sections distributed on two sides of the transmission wheels 41.
In addition, mounting plates 42 are arranged on the two transmission sections; the first elastic component 20 is connected between the mounting plate 42 and the rack 10. The mounting plate 42 is provided with a pick-and-place suction nozzle 30 and a second driving piece; the second driving member is used for driving the pick-and-place nozzle 30 to rotate.
On the basis of the structure, use the utility model discloses a during wafer is got and is put device, get and put frame 10 and can install on outside processing organism, get when pressing from both sides and get the wafer and assemble, the pivot of getting the first motor 43 on the frame 10 rotates, the pivot of first motor 43 rotates one of them drive wheel 41 that can drive and be connected with it and rotates, this drive wheel 41 rotates alright drive and rotates rather than another drive wheel 41 that is connected through the transmission of drive belt, so, two drive wheels 41 rotate alright drive the transmission belt circulation and rotate, because the transmission belt is cyclic annular around establishing outside two drive wheels 41, therefore two vertical transmission sections that form between two drive wheels 41 can be at the transmission belt rotation in-process one-on-one-off motion, and then drive two mounting panels 42 one-on-one-off connected with.
That is, the two pick-and-place suction nozzles 30 mounted on the mounting plate 42 are arranged one above the other, and the rotation direction of the rotating shaft of the first motor 43 is changed, so that the two pick-and-place suction nozzles 30 mounted on the mounting plate 42 can be driven to alternately clamp the wafer, the wafer clamping efficiency can be improved, and the interference caused by the simultaneous clamping of the two pick-and-place suction nozzles 30 can be avoided.
In addition, during the up-and-down movement of the mounting plate 42, the first elastic component 20 can stretch and retract, so as to buffer the up-and-down movement speed of the pick-and-place nozzle 30, and avoid the damage of the wafer caused by the hard contact between the pick-and-place nozzle 30 and the wafer.
It should be noted that the second driving component may include a second motor 50, a rotating shaft of the second motor 50 may be connected to the pick-and-place nozzle 30, the rotating shaft of the second motor 50 may rotate to drive the pick-and-place nozzle 30 to rotate, the pick-and-place nozzle 30 may perform angle adjustment, and the driving structure is simple and stable.
Further, can also be equipped with slider 421 on mounting panel 42, be equipped with slide rail 13 on putting frame 10 correspondingly, this slide rail 13 extends along the direction of height of putting frame 10, so, when the drive belt formed two transmission sections up-and-down motion between two drive wheels 41, slider 421 on the mounting panel 42 can with the slide rail 13 sliding fit who corresponds, mounting panel 42 and the motion of putting frame 10 can be by slider 421 and slide rail 13 sliding guide promptly, the motion structure of formation is more stable, prevent the condition of rocking that the transmission belt transmission in-process appears.
Further, a second elastic component 20 may be further disposed on the pick-and-place nozzle 30, and the second elastic component 20 may be stretched when the pick-and-place nozzle 30 rotates, that is, when the second driving component drives the pick-and-place nozzle 30 to rotate, the pick-and-place nozzle 30 may stretch along with the stretching, so that the rotation force of the pick-and-place nozzle 30 is more flexible, and hard impact caused by the rotation of the pick-and-place nozzle 30 and the wafer or the pick-and-place frame 10 is avoided.
It should be noted that the first elastic member 20 can be implemented by a linear spring in the prior art, and the second elastic member 20 can be implemented by a return spring (such as a torsion spring) in the prior art.
Further, a limit switch may be further disposed on the pick-and-place frame 10, a limit piece is disposed on the pick-and-place suction nozzle 30, the limit piece may be configured to be touched by the limit switch when the pick-and-place suction nozzle 30 moves along the height direction of the pick-and-place frame 10, specifically, the limit switch is disposed on the top end and the bottom end of the pick-and-place frame 10, the limit piece may be respectively touched by the limit switch located above and the limit switch located below when the pick-and-place suction nozzle 30 moves up and down, the up-and-down position of the pick-and-place suction nozzle 30 is limited, and the movement stroke of the pick-and-place suction nozzle 30 is controlled.
It should be noted that, the limit switch may be a touch switch or a photoelectric switch in the prior art.
Further, still be equipped with work piece detection camera 11 on the frame 10 of putting, work piece detection camera 11 detectable work piece position and conveying work piece signal, work piece detection camera 11 can shoot the location to the wafer when putting the suction nozzle 30 clamp and get the wafer, conveys work piece signal and gives first driving piece and second driving piece, adjusts the position of putting suction nozzle 30, and degree of automation is higher, and the wafer absorbs the position more accurately.
It should be noted that the workpiece detection camera may be implemented by using a CCD camera in the prior art.
More specifically, the pick-and-place frame 10 may further be provided with a light source 12, and the light source 12 is disposed below the workpiece detection camera 11, that is, when the workpiece detection camera 11 performs workpiece photographing positioning, the light source 12 may be used for polishing, so that the photographing positioning effect is better.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes are intended to fall within the scope of the claims.
Claims (6)
1. A chip taking and placing device is characterized by comprising a taking and placing frame and a first elastic component; the pick-and-place frame is provided with a pick-and-place suction nozzle, a first driving piece and a second driving piece, the first driving piece comprises a first motor, a transmission belt and two transmission wheels, and the first motor is arranged on the pick-and-place frame; the two driving wheels are rotatably arranged on the taking and placing frame and are arranged at intervals in the height direction of the taking and placing frame; two ends of the transmission belt are respectively wound outside the two transmission wheels; the part of the transmission belt between the two transmission wheels forms two transmission sections distributed on two sides of the transmission wheels; mounting plates are arranged on the two transmission sections; the first elastic component is connected between the mounting plate and the taking and placing frame; the mounting plates are provided with the pick-and-place suction nozzle and a second driving piece; the second driving piece is used for driving the pick-and-place suction nozzle to rotate.
2. The wafer pick-and-place apparatus as claimed in claim 1, wherein the mounting plate has a slider thereon, and the pick-and-place frame has a slide rail thereon; the slide rail extends along the height direction of the pick-and-place frame; the sliding block is in sliding fit with the sliding rail.
3. The wafer pick-and-place device as claimed in claim 1, wherein the pick-and-place nozzle is provided with a second elastic member for stretching when the pick-and-place nozzle rotates.
4. The wafer pick-and-place device as claimed in claim 1, wherein the pick-and-place frame is provided with a limit switch, the pick-and-place suction nozzle is provided with a limit sheet, and the limit sheet is used for touching the limit switch when the pick-and-place suction nozzle moves along the height direction of the pick-and-place frame.
5. The wafer pick-and-place device as claimed in any one of claims 1 to 4, wherein the pick-and-place frame is further provided with a workpiece detection camera for detecting the position of the workpiece and transmitting a workpiece signal.
6. The wafer pick-and-place apparatus of claim 5, wherein the pick-and-place frame further comprises a light source disposed below the workpiece inspection camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122923410.1U CN216435865U (en) | 2021-11-25 | 2021-11-25 | Wafer taking and placing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122923410.1U CN216435865U (en) | 2021-11-25 | 2021-11-25 | Wafer taking and placing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216435865U true CN216435865U (en) | 2022-05-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122923410.1U Active CN216435865U (en) | 2021-11-25 | 2021-11-25 | Wafer taking and placing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216435865U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116759368A (en) * | 2023-07-17 | 2023-09-15 | 珠海市申科谱工业科技有限公司 | Chip adsorption transfer mechanism |
-
2021
- 2021-11-25 CN CN202122923410.1U patent/CN216435865U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116759368A (en) * | 2023-07-17 | 2023-09-15 | 珠海市申科谱工业科技有限公司 | Chip adsorption transfer mechanism |
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