CN116759368A - Chip adsorption transfer mechanism - Google Patents
Chip adsorption transfer mechanism Download PDFInfo
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- CN116759368A CN116759368A CN202310868862.5A CN202310868862A CN116759368A CN 116759368 A CN116759368 A CN 116759368A CN 202310868862 A CN202310868862 A CN 202310868862A CN 116759368 A CN116759368 A CN 116759368A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 25
- 238000012546 transfer Methods 0.000 title claims abstract description 25
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 3
- 230000006698 induction Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 3
- 230000033001 locomotion Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manipulator (AREA)
Abstract
The invention aims to provide a chip adsorption transfer mechanism which is accurate in material positioning, compact in structure and capable of efficiently adsorbing and transferring micro chips. The invention comprises a fixed seat, a lifting driving device, an eccentric wheel, a sliding seat, a suction head rotating module and a suction nozzle head, wherein the lifting moving module is connected with the fixed seat, the sliding seat is in sliding fit with the fixed seat, the sliding seat is provided with a clamping block, the clamping block is connected with the extending end of the lifting moving module, the suction head rotating module is connected with the sliding seat, and the suction nozzle head is arranged at the movable end of the suction head rotating module and is in adsorption fit with a product. The invention is applied to the technical field of chip adsorption transfer mechanisms.
Description
Technical Field
The invention relates to the technical field of chip adsorption transfer mechanisms, in particular to a chip adsorption transfer mechanism.
Background
The semiconductor industry is constantly breaking through a great technological breakthrough, more and more semiconductor chips and integrated circuit boards enter the era of standardized, automated and intelligent production, and automated equipment gradually enters the original production mode. In the chip manufacturing industry, the detection of the external dimension of a semiconductor element with the microminiature dimension of less than 1mm is an important ring in the production link. The existing chip rotating lifting conveying mechanism is difficult to accurately control the material taking and discharging and pressing distances for microminiature-sized chips, meanwhile, the appearance of the chip is too tiny in the aspect of visual positioning, whether a product is accurately picked up or not is difficult to accurately detect by a common visual camera, and the chip adsorption condition needs to be detected by using a laser sensor with high accuracy.
Chinese patent with publication No. CN209880564U, the chip handling mechanism includes a frame, a first moving module structure, a second moving module structure, a third moving module structure and a fourth moving module structure, the first moving module structure includes a first moving module, a first moving block, a first suction nozzle blue film portion and a first suction nozzle adjusting piece, a first moving module is arranged in the frame, a first moving block is arranged on one side of the first moving module, the chip adsorption welding that this patent set up through the symmetry can realize double-station simultaneous working, and the chip is adsorbed and welded, but the industrial camera is used in this technical scheme to detect the work flow, and whether the product is picked up correctly cannot be identified.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and providing the chip adsorption transfer mechanism which has the advantages of accurate material positioning, compact structure and high efficiency in adsorption transfer of micro chips.
The technical scheme adopted by the invention is as follows: the invention comprises a fixed seat, a lifting driving device, an eccentric wheel, a sliding seat, a suction head rotating module and a suction nozzle head, wherein the lifting moving module is connected with the fixed seat, the sliding seat is in sliding fit with the fixed seat, the sliding seat is provided with a clamping block, the clamping block is connected with the extending end of the lifting moving module, the suction head rotating module is connected with the sliding seat, and the suction nozzle head is arranged at the movable end of the suction head rotating module and is in adsorption fit with a product.
Further, the rotatory module of suction head includes connecting plate, rotary driving device, roating seat, suction nozzle connecting block and contact switch, the connecting plate with sliding seat fixed connection, rotary driving device pass through the extension frame with connecting plate fixed connection, the roating seat with the connecting plate rotates to be connected, rotary driving device's output pass through the drive belt with roating seat transmission cooperation, suction nozzle connecting block sliding connection in the lower extreme of roating seat, the suction nozzle connecting block with the suction nozzle head is connected, contact switch with the roating seat with the suction nozzle connecting block is connected, contact switch with suction nozzle connecting block spacing fit.
Further, the contact switch comprises a first limiting part, a second limiting part and two groups of contact points, wherein the first limiting part is connected with the rotating seat, the second limiting part is connected with the suction nozzle connecting block, and the two groups of contact points are respectively arranged in the first limiting part and the second limiting part.
Further, the lower extreme of suction nozzle connecting block is equipped with the trompil, transparent glass board has been placed to trompil department.
Further, the upper end of the suction nozzle connecting block is provided with an elastic piece, the elastic piece is in pushing fit with the connecting plate, and the lower end of the rotating seat is provided with a stop block in limiting fit with the suction nozzle connecting block.
Further, the connecting plate is provided with a rotary sensor, and the rotary seat is provided with an induction piece matched with the rotary sensor.
Further, the suction nozzle head is provided with a through hole, a preformed hole is formed in the circle center of the rotating seat, and the through hole coincides with the circle center of the preformed hole.
Further, the fixture block is U-shaped, one end of the eccentric wheel, which is in contact with the fixture block, is provided with a follow-up bearing, and the follow-up bearing is in sliding fit with the fixture block.
Further, the lifting moving assembly comprises a lifting driving device and an eccentric wheel, wherein the fixed end of the lifting driving device is connected with the fixed seat, the eccentric wheel is connected with the movable end of the lifting driving device, and the eccentric wheel is in sliding fit with the clamping block.
Further, the eccentric wheel comprises an eccentric connecting piece and a locking piece, the eccentric connecting piece and the locking piece are matched and fixed at the output end of the lifting driving device, the eccentric connecting piece is provided with an eccentric column, the eccentric column is provided with a follow-up bearing, and the follow-up bearing is in sliding fit with the clamping block.
The beneficial effects of the invention are as follows: the invention adopts the design that the eccentric wheel rotates to drive the suction head to move up and down, the power output direction is changed into the horizontal direction from the vertical mode, the whole structure is more compact, the required installation space is small, the field space is saved, meanwhile, the suction nozzle head is in floating design, the floating displacement is limited by the contact switch at the upper and lower floating forming position, the suction nozzle head is close to the suction product to avoid hard downward pressing, and the appearance of the suction product is protected from being damaged; the suction nozzle head can rotate in a certain range under the drive of the rotating seat, the angle of the adsorption chip can be adjusted, the blanking placement is convenient, the compatibility is good, and the debugging is convenient.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of a rotary die set of a suction head according to the present invention;
FIG. 3 is a schematic view of the structure of the rotary base and the contact switch of the present invention;
FIG. 4 is a schematic view of the structure of the contact switch of the present invention;
FIG. 5 is a schematic view of the structure of the lift drive and the slide base of the present invention;
fig. 6 is a schematic structural view of the eccentric of the present invention.
Detailed Description
As shown in fig. 1 to 6, in the present embodiment, the present invention includes a fixing base 1, a lifting moving assembly, a sliding base 4, a suction nozzle rotating module 5, and a suction nozzle head 6, wherein the lifting moving assembly is connected with the fixing base 1, the sliding base 4 is slidingly matched with the fixing base 1, the sliding base 4 is provided with a clamping block 41, the clamping block 41 is connected with an extending end of the lifting moving assembly, the suction nozzle rotating module 5 is connected with the sliding base 4, the suction nozzle head 6 is arranged at a movable end of the suction nozzle rotating module 5 and is in adsorption fit with a product, the suction nozzle head 6 is communicated with an external negative pressure generating device, a flowmeter is arranged at one side of an air pipe joint of the suction nozzle head 6 for detecting whether the suction nozzle head 6 is sucked with the product or not, the lifting driving device 2 is a rotating motor, the fixing base 1 is connected with an external transfer mechanism to drive the whole motion, the periphery of the fixed seat 1, which is close to the output end of the lifting driving device 2, is provided with a sliding rail and a sliding block, the sliding seat 4 is fixedly connected with the sliding block and is driven by the lifting driving device 2 to reciprocate up and down along the direction of the sliding rail, the external transfer mechanism drives the suction head to the upper part of a product during operation, the lifting driving device 2 rotates to drive the eccentric wheel 3 to rotate, the follow-up bearing 34 connected on the eccentric wheel 3 slides left and right in the clamping block 41, the movement quantity in the up and down direction enables the sliding seat 4 to move down along the sliding rail, the suction nozzle head 6 is close to the product and adsorbs the product through negative pressure, the flow meter detects the change of negative pressure air flow and feeds back to the external control device, the lifting driving device 2 rotates to reset and lift the suction nozzle head 6, the external transfer mechanism transfers the product to the corresponding position, when the position of an adsorption chip has offset condition, the suction head rotating module 5 drives the chip to rotate by the corresponding angle, so that the method meets the detection requirement.
In this embodiment, the suction head rotating module 5 includes a connection board 51, a rotation driving device 52, a rotating seat 53, a suction nozzle connection block 54 and a contact switch 55, the connection board 51 is fixedly connected with the sliding seat 4, the rotation driving device 52 is fixedly connected with the connection board 51 through an extension frame 56, the rotating seat 53 is rotationally connected with the connection board 51, an output end of the rotation driving device 52 is in transmission fit with the rotating seat 53 through a transmission belt 57, the suction nozzle connection block 54 is slidingly connected with a lower end of the rotating seat 53, the suction nozzle connection block 54 is connected with the suction nozzle head 6, the contact switch 55 is connected with the rotating seat 53 and the suction nozzle connection block 54, the rotating seat 53 is further provided with a rotating bearing and a transmission wheel, the rotating bearing is connected with the connection board 51, the transmission wheel is arranged at an upper end of the rotating seat 53 and is connected with the transmission belt 57, the transmission belt 57 has good transmission performance, the rotation driving device 52 is a rotating motor, two sets of position limiting screws are respectively arranged at two sets of two sides of the rotating seat 53, and used for preventing a second sliding block from moving excessively under a second sliding block and a sliding block, and a second sliding block is arranged at a second sliding block and a sliding block is connected with the second sliding block and a second sliding block is rotated excessively under the sliding block and is provided.
In this embodiment, the contact switch 55 includes a first limiting member 551, a second limiting member 552 and two sets of contact pins 553, the first limiting member 551 is connected with the rotating seat 53, the second limiting member 552 is connected with the nozzle connecting block 54, the two sets of contact pins 553 are respectively disposed in the first limiting member 551 and the second limiting member 552, the second limiting member 552 is in a spacing fit with the nozzle connecting block 54, the first limiting member 551 and the second limiting member 552 are all in a step shape, a preformed hole is disposed at the step, the two sets of contact pins 553 are disposed in the preformed hole, the contact pins 553 are in a rubber structure, move upwards along the second slide rail when the nozzle connecting block 54 approaches and presses down the suction chip, at this time, the first limiting member 551 and the second limiting member 552 are far away from each other, the two sets of contact pins 553 are in contact, a signal is disconnected, and the suction nozzle 6 is not in contact with the chip, and at this time, the external control device determines whether the suction chip is sucked according to the feedback condition of the flowmeter.
In this embodiment, the lower end of the nozzle connecting block 54 is provided with an opening, a transparent glass plate 58 is placed at the opening, the axes of the opening, the nozzle head 6 through hole and the preformed hole of the rotating seat 53 are on the same straight line, and the external laser detection device is used for detecting whether the product is completely adsorbed and whether the hole blocking condition exists.
In this embodiment, the upper end of the nozzle connecting block 54 is provided with an elastic member 59, the elastic member 59 is in pushing fit with the connecting plate 51, the lower end of the rotating seat 53 is provided with a stop block in limit fit with the nozzle connecting block 54, the elastic member 59 is a spring, and the elastic member 59 is disposed at the upper end of the nozzle connecting block 54, so that the nozzle head 6 has a certain floating formation when moving downward, and the nozzle head 6 is prevented from rigidly contacting with the chip to damage the outer surface of the chip.
In this embodiment, the connection plate 51 is provided with a rotation sensor, and the rotation seat 53 is provided with an induction piece adapted to the rotation sensor.
In this embodiment, the nozzle head 6 is provided with a through hole, and a preformed hole is formed at the center of the circle of the rotating seat 53, and the through hole coincides with the center of the preformed hole.
In this embodiment, the clamping block 41 is U-shaped, and the U-shaped clamping block 41 is designed to facilitate daily maintenance and installation, and the following bearing 34 is only required to be placed from the opening side during installation, so that the daily maintenance process is simplified, and the working efficiency is improved.
In this embodiment, the lifting moving assembly includes a lifting driving device 2 and an eccentric wheel 3, a fixed end of the lifting driving device 2 is connected with the fixing seat 1, the eccentric wheel 3 is connected with a movable end of the lifting driving device 2, and the eccentric wheel 3 is in sliding fit with the clamping block 41.
In this embodiment, the eccentric wheel 3 includes an eccentric connecting member 31 and a locking member 32, the eccentric connecting member 31 and the locking member 32 are matched and fixed at the output end of the lifting driving device 2, the eccentric connecting member 31 is provided with an eccentric column 33, the eccentric column 33 is provided with a follower bearing 34, the follower bearing 34 is in sliding fit with the clamping block 41, the follower bearing 34 is of a rubber structure, and has a better friction force, and the follower bearing 34 can roll left and right in the U-shaped clamping block 41 and drive the sliding seat 4 to move up and down.
The working principle of the invention is as follows:
the fixed seat 1 is connected with an external transfer mechanism to drive the whole motion, so that the suction nozzle 6 moves to the upper part of the chip, the lifting driving device 2 rotates to drive the eccentric wheel 3 to rotate, the follow-up bearing 34 connected to the eccentric wheel 3 slides left and right in the clamping block 41, the motion quantity in the vertical direction enables the sliding seat 4 to move downwards along the sliding rail, the suction nozzle 6 is close to the chip and adsorbs the chip through negative pressure, at the moment, the elastic piece 59 contracts, the two contact heads 553 of the contact switch are in contact, the flow meter detects the change of negative pressure air flow in a matching manner, the feedback is fed back to the external control device to detect whether the chip is sucked, the lifting driving device 2 rotates to reset to lift the suction nozzle 6, the external transfer mechanism transfers the chip to the corresponding position, and when the position of the adsorbed chip has the offset condition, the suction nozzle rotating module 5 drives the chip to rotate by the corresponding angle.
While the embodiments of this invention have been described in terms of practical aspects, they are not to be construed as limiting the meaning of this invention, and modifications to the embodiments and combinations with other aspects thereof will be apparent to those skilled in the art from this description.
Claims (10)
1. The utility model provides a chip adsorbs moves mechanism of carrying, it includes fixing base (1), its characterized in that: the chip adsorption transfer mechanism further comprises a lifting moving assembly, a sliding seat (4), a suction head rotating module (5) and a suction nozzle head (6), wherein the lifting moving assembly is connected with the fixed seat (1), the sliding seat (4) is in sliding fit with the fixed seat (1), a clamping block (41) is arranged on the sliding seat (4), the clamping block (41) is connected with the extending end of the lifting moving assembly, the suction head rotating module (5) is connected with the sliding seat (4), and the suction nozzle head (6) is arranged at the movable end of the suction head rotating module (5) and is in adsorption fit with a product.
2. The die attach transfer mechanism of claim 1, wherein: the suction head rotating module (5) comprises a connecting plate (51), a rotating driving device (52), a rotating seat (53), a suction nozzle connecting block (54) and a contact switch (55), wherein the connecting plate (51) is fixedly connected with the sliding seat (4), the rotating driving device (52) is fixedly connected with the connecting plate (51) through an extension frame (56), the rotating seat (53) is rotationally connected with the connecting plate (51), the output end of the rotating driving device (52) is in transmission fit with the rotating seat (53) through a transmission belt (57), the suction nozzle connecting block (54) is slidably connected with the lower end of the rotating seat (53), the suction nozzle connecting block (54) is connected with the suction nozzle head (6), and the contact switch (55) is connected with the rotating seat (53) and the suction nozzle connecting block (54).
3. The die attach transfer mechanism of claim 2, wherein: the contact switch (55) comprises a first limiting piece (551), a second limiting piece (552) and two groups of contact pins (553), the first limiting piece (551) is connected with the rotating seat (53), the second limiting piece (552) is connected with the suction nozzle connecting block (54), the two groups of contact pins (553) are respectively arranged in the first limiting piece (551) and the second limiting piece (552), and the second limiting piece (552) is in limiting fit with the suction nozzle connecting block (54).
4. The die attach transfer mechanism of claim 2, wherein: the lower end of the suction nozzle connecting block (54) is provided with an opening, and a transparent glass plate (58) is placed at the opening.
5. The die attach transfer mechanism of claim 2, wherein: the upper end of the suction nozzle connecting block (54) is provided with an elastic piece (59), the elastic piece (59) is in pushing fit with the connecting plate (51), and the lower end of the rotating seat (53) is provided with a stop block in limit fit with the suction nozzle connecting block (54).
6. The die attach transfer mechanism of claim 2, wherein: the connecting plate (51) is provided with a rotation sensor, and the rotating seat (53) is provided with an induction piece matched with the rotation sensor.
7. The die attach transfer mechanism of claim 4, wherein: the suction nozzle head (6) is provided with a through hole, a preformed hole is arranged at the center of the rotating seat (53), and the through hole coincides with the center of the preformed hole.
8. The die attach transfer mechanism of claim 1, wherein: the clamping block (41) is U-shaped.
9. The die attach transfer mechanism of claim 1, wherein: the lifting moving assembly comprises a lifting driving device (2) and an eccentric wheel (3), wherein the fixed end of the lifting driving device (2) is connected with the fixed seat (1), the eccentric wheel (3) is connected with the movable end of the lifting driving device (2), and the eccentric wheel (3) is in sliding fit with the clamping block (41).
10. The die attach transfer mechanism of claim 9, wherein: eccentric wheel (3) include eccentric connecting piece (31) and retaining member (32), eccentric connecting piece (31) with retaining member (32) are cooperateed and are fixed the output of lift drive (2), eccentric connecting piece (31) are equipped with eccentric post (33), eccentric post (33) are equipped with follow-up bearing (34), follow-up bearing (34) with fixture block (41) sliding fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310868862.5A CN116759368A (en) | 2023-07-17 | 2023-07-17 | Chip adsorption transfer mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310868862.5A CN116759368A (en) | 2023-07-17 | 2023-07-17 | Chip adsorption transfer mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116759368A true CN116759368A (en) | 2023-09-15 |
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ID=87957178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310868862.5A Pending CN116759368A (en) | 2023-07-17 | 2023-07-17 | Chip adsorption transfer mechanism |
Country Status (1)
| Country | Link |
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| CN (1) | CN116759368A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014011287A (en) * | 2012-06-29 | 2014-01-20 | Ohashi Seisakusho:Kk | Feeding device for semiconductor chips |
| WO2019210628A1 (en) * | 2018-05-03 | 2019-11-07 | 苏州艾科瑞思智能装备股份有限公司 | Chip pick-up and mounting device and chip mounting machine using same |
| CN216435865U (en) * | 2021-11-25 | 2022-05-03 | 深圳市经元智能技术有限公司 | Wafer taking and placing device |
| CN114932089A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Feeding mechanism of laser chip testing and sorting machine and working method thereof |
| CN218447853U (en) * | 2022-10-11 | 2023-02-03 | 珠海市申科谱工业科技有限公司 | Microchip transport module |
-
2023
- 2023-07-17 CN CN202310868862.5A patent/CN116759368A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014011287A (en) * | 2012-06-29 | 2014-01-20 | Ohashi Seisakusho:Kk | Feeding device for semiconductor chips |
| WO2019210628A1 (en) * | 2018-05-03 | 2019-11-07 | 苏州艾科瑞思智能装备股份有限公司 | Chip pick-up and mounting device and chip mounting machine using same |
| CN216435865U (en) * | 2021-11-25 | 2022-05-03 | 深圳市经元智能技术有限公司 | Wafer taking and placing device |
| CN114932089A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Feeding mechanism of laser chip testing and sorting machine and working method thereof |
| CN218447853U (en) * | 2022-10-11 | 2023-02-03 | 珠海市申科谱工业科技有限公司 | Microchip transport module |
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