CN216437891U - Full-automatic solid brilliant equipment - Google Patents

Abstract

The utility model discloses a full-automatic die bonding device, which comprises a machine body, wherein a plate wiping station and a die bonding station are arranged on the machine body; the conveying mechanism is used for conveying the PCB; the plate wiping station and the die bonding station are positioned on a conveying track of the conveying mechanism; the plate wiping stations and the die bonding stations are distributed at intervals in the conveying direction of the conveying mechanism; the plate wiping mechanism comprises a laser emitting head, and the laser emitting head is arranged above a plate wiping station; the wafer picking and placing mechanism comprises a picking and placing frame, a picking and placing suction nozzle, a glue dispensing piece and a picking and placing frame driving piece, wherein the picking and placing frame driving piece is used for driving the picking and placing frame to move along the X-axis direction, and the picking and placing frame driving piece is used for driving the picking and placing frame to move along the Y-axis direction; the picking and placing suction nozzle is arranged on the picking and placing frame and used for clamping the wafer; the glue dispensing piece is arranged on the taking and placing frame and used for dispensing glue on the PCB. The utility model discloses can realize carrying out laser cleanness, automatic point and wafer fixed to the PCB board, improve PCB production efficiency.

Description

Full-automatic solid brilliant equipment

Technical Field

The utility model relates to a PCB board production facility technical field especially relates to a full-automatic solid brilliant equipment.

Background

At present, in the production process of a chip, operations such as die bonding and binding need to be performed on the chip, die bonding refers to welding a wafer on the chip, and binding refers to a routing manner of the chip in the production process, and the routing manner is generally used for connecting a circuit inside the chip with a gold wire or an aluminum wire and a packaging pin or a circuit board gold-plated copper foil before packaging. In the process of die bonding, the wafer is usually placed on the die by a pick-and-place device and then fixed.

However, if there is a dirt or oxide layer on the PCB pad, it is not beneficial to the subsequent die bonding and wire bonding, so it should be removed in advance, and the existing die bonding equipment generally directly fixes the wafer, so dirt is easily left on the workpiece, which affects the die bonding quality, and the automation degree is low.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a full-automatic solid brilliant equipment, it can realize carrying out laser cleaning, automatic point gluing and wafer fixing to the PCB board, improves PCB production efficiency.

The purpose of the utility model is realized by adopting the following technical scheme:

a full-automatic die bonding device comprises a die,

the machine body is provided with a plate wiping station and a die bonding station;

the conveying mechanism is used for conveying the PCB; the plate wiping station and the die bonding station are positioned on a conveying track of the conveying mechanism; the plate wiping stations and the die bonding stations are distributed at intervals in the conveying direction of the conveying mechanism;

the plate wiping mechanism comprises a laser emitting head, and the laser emitting head is arranged above the plate wiping station;

the wafer picking and placing mechanism comprises a picking and placing frame, a picking and placing suction nozzle, a glue dispensing piece and a picking and placing frame driving piece, wherein the picking and placing frame driving piece is used for driving the picking and placing frame to move along the X-axis direction, and the picking and placing frame driving piece is used for driving the picking and placing frame to move along the Y-axis direction; the picking and placing suction nozzle is arranged on the picking and placing frame and used for clamping the wafer; the glue dispensing part is arranged on the taking and placing frame and is used for dispensing glue on the PCB; the die bonding station is positioned on the motion track of the pick-and-place frame.

Furthermore, the machine body is also provided with a feeding table, and the feeding table is used for placing a material tray for storing a plurality of wafers.

Furthermore, a wafer detection piece is arranged on the feeding table.

Further, the taking and placing frame driving part comprises a first motor, a first screw rod, a first nut, a first guiding piece, a second motor, a second screw rod, a second nut and a second guiding piece,

the first motor is arranged on the machine body, and the first screw rod extends along the Y-axis direction; the first nut is sleeved outside the first screw rod in a threaded manner; the first guide piece is used for guiding the first nut to move along the Y-axis direction when the first screw rod rotates; the first nut is provided with a mounting seat;

the second motor is arranged on the mounting seat, the second screw rod is connected with a rotating shaft of the second motor, the second nut is sleeved outside the second screw rod in a threaded manner, and the second guide piece is used for guiding the second nut to move along the X-axis direction when the second screw rod rotates; the taking and placing frame is connected with the second nut.

Furthermore, a first driving part and a second driving part are arranged on the pick-and-place frame, the first driving part comprises a third motor, a transmission belt and two transmission wheels, and the third motor is arranged on the pick-and-place frame; the two driving wheels are rotatably arranged on the taking and placing frame and are arranged at intervals in the height direction of the taking and placing frame; two ends of the transmission belt are respectively wound outside the two transmission wheels; the part of the transmission belt between the two transmission wheels forms two transmission sections distributed on two sides of the transmission wheels; mounting plates are arranged on the two transmission sections; elastic components are connected between the mounting plate and the taking and placing frame; the mounting plates are provided with the pick-and-place suction nozzle and a second driving piece; the second driving piece is used for driving the pick-and-place suction nozzle to rotate.

Furthermore, the conveying mechanism comprises a belt conveying assembly, two conveying frames and a conveying frame driving part, and the two conveying frames are arranged on the machine body at intervals; the two conveying frames are provided with the belt conveying assemblies; the belt conveying components on the two conveying frames are used for supporting the workpiece; the conveying frame driving part is used for driving the two conveying frames to be close to each other or be far away from each other.

Furthermore, a jacking mechanism is arranged between the two conveying frames, and the plate wiping station and the die bonding station are both provided with the jacking mechanism; the jacking mechanism comprises a jacking plate and a jacking plate driving part, and the jacking plate driving part is used for driving the jacking plate to move along the Z-axis direction.

Furthermore, at least two workpiece pressing blocks are arranged on the conveying frame, and the two sides of the plate wiping station and the two sides of the die bonding station are provided with the at least two workpiece pressing blocks; at least two workpiece pressing blocks are distributed at intervals in the conveying direction of the belt conveying assembly; the workpiece pressing block is arranged above the jacking plate.

Furthermore, the jacking plate is provided with at least two jacking blocks, and the at least two jacking blocks are detachably mounted on the jacking plate.

Further, wipe trigger structure still includes work piece detection piece and light source board, work piece detection piece and light source board are all located and are wiped the top of board station.

Compared with the prior art, the beneficial effects of the utility model reside in that: when the wafer and the PCB are fixed, the PCB can be conveyed to a board wiping station through the conveying mechanism, at the moment, the laser emitting head can emit laser, and impurities such as dirt or an oxide layer on the surface of a workpiece are burnt by the laser, so that the purpose of cleaning is achieved.

After the cleaning is completed, the conveying mechanism can continue to convey the PCB to the die bonding station, then the taking and placing frame driving piece can drive the taking and placing frame to move back and forth and move left and right, so that the glue dispensing piece on the taking and placing frame and the taking and placing suction nozzle align to the die bonding position of the PCB, glue dispensing and wafer gluing fixing actions are carried out, and after the die bonding is completed, the conveying mechanism continues to convey the processed PCB to the discharging position.

Drawings

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a schematic view of the wafer fixing portion of the present invention;

fig. 3 is a schematic view of a partial structure of the wafer pick-and-place mechanism of the present invention;

FIG. 4 is a schematic view of a part of the structure of the wiping mechanism of the present invention;

fig. 5 is a schematic structural view of the conveying mechanism and the jacking mechanism of the present invention;

fig. 6 is a schematic structural diagram of the jacking mechanism of the present invention.

In the figure: 10. a body; 11. a feeding table; 12. a wafer detection member; 20. a conveying mechanism; 21. a carriage; 211. pressing the workpiece into a block; 22. a belt transport assembly; 231. a synchronous belt; 232. a synchronizing wheel; 233. a third screw rod; 234. a third nut; 30. a chip pick and place mechanism; 31. a taking and placing frame; 311. a driving wheel; 312. mounting a plate; 313. an elastic member; 32. taking and placing the suction nozzle; 321. a second driving member; 33. a first motor; 34. a first lead screw; 35. a mounting seat; 36. a second motor; 37. a second lead screw; 38. dispensing a glue part; 40. a jacking mechanism; 41. a jacking plate; 411. jacking blocks; 412. a guide sleeve; 43. a guide rod; 51. a laser emitting head; 52. a workpiece detection member; 53. a light source.

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments:

as shown in fig. 1-6, the full-automatic die bonder includes a machine body 10, a conveying mechanism 20, a plate wiping mechanism and a wafer picking and placing mechanism 30, wherein the machine body 10 is provided with a plate wiping station and a die bonding station. In addition, the conveying mechanism 20 can convey the PCB, the board wiping stations and the die bonding stations are located on a conveying track of the conveying mechanism 20, and the board wiping stations and the die bonding stations are distributed at intervals in a conveying direction of the conveying mechanism 20. The plate wiping mechanism comprises a laser emitting head 51, and the laser emitting head 51 is arranged above the plate wiping station;

specifically, the wafer pick and place mechanism 30 includes a pick and place frame 31, a pick and place nozzle 32, a dispensing element 38 and a pick and place frame driving element, specifically, the pick and place frame driving element may be configured to drive the pick and place frame 31 to move along an X-axis direction, the pick and place frame driving element may also be configured to drive the pick and place frame 31 to move along a Y-axis direction, the die bonding station is located on a movement track of the pick and place frame 31, the pick and place nozzle 32 is installed on the pick and place frame 31 and is used for clamping a wafer, and the dispensing element 38 is installed on the pick and place frame 31 and is used for dispensing on a PCB.

On the basis of the structure, use the utility model discloses a when full-automatic solid brilliant equipment it is carrying out wafer and PCB board when fixed, can carry the PCB board earlier to wiping the board station through conveying mechanism 20, at this moment, laser emission head 51 can launch laser, utilizes laser to burn impurity such as the dirty or oxide layer of workpiece surface, reaches clean purpose.

After the cleaning, the conveying mechanism 20 can continue to convey the PCB to the die bonding station, and then the driving part of the pick-and-place frame can drive the pick-and-place frame 31 to move back and forth and left and right, so that the dispensing part 38 and the pick-and-place suction nozzle 32 on the pick-and-place frame 31 are aligned to the die bonding position of the PCB, dispensing and wafer gluing are performed, and after the die bonding is completed, the conveying mechanism 20 continues to convey the processed PCB to the blanking position. In addition, the dispensing and chip fixing operations are realized by the chip pick-and-place mechanism 30, so that the automation degree is high, and the production efficiency is improved.

It should be noted that, the laser emitting head 51 can be realized by a laser emitter in the prior art, and specifically, when installing, a stand column and a connecting arm may be arranged on the machine body 10, the bottom end of the stand column is fixed on the machine body 10, and the connecting arm is installed at the top end of the stand column and extends out of the upper side of the board wiping station, and the laser emitter is installed on the connecting arm.

Further, a feeding table 11 may be further disposed on the machine body 10, the feeding table 11 is used for placing trays for storing a plurality of wafers, that is, the trays for storing a plurality of wafers may be placed on the feeding table 11, the pick-and-place frame driving member may drive the pick-and-place frame 31 to move to the position of the feeding table 11, and the pick-and-place nozzle 32 directly clamps the wafers and then moves to the die bonding station for die bonding.

In the present embodiment, the loading platform 11 and the picking and placing mechanism 30 are respectively disposed on two sides of the conveying mechanism 20, and the picking and placing nozzle 32 of the picking and placing mechanism 30 only needs to pick and place the wafer to and fro between the conveying mechanism 20 and the loading platform 11, so as to save the movement stroke of the picking and placing mechanism 30.

Further, be equipped with wafer detection spare 12 on material loading platform 11, this wafer detection spare 12 can choose for use to realize for the CCD camera among the prior art, gets on putting frame 31 promptly and puts suction nozzle 32 and carry out the wafer clamp and get the time, and the CCD camera can shoot the location to getting the wafer on putting suction nozzle 32, and the image signal who shoots can transmit for the system, and the motion of control is got and is put the frame driving piece, realizes getting of accuracy of wafer and puts.

Further, referring to fig. 1, the rack driving unit may include a first motor 33, a first lead screw 34, a first nut, a first guide, a second motor 36, a second lead screw 37, a second nut, and a second guide, specifically, the first motor 33 may be mounted on the body 10, the first lead screw 34 may extend in the Y-axis direction, the first nut may be threadedly mounted outside the first lead screw 34, and the first guide may be configured to guide the first nut to move in the Y-axis direction when the first lead screw 34 rotates.

In addition, the first nut is provided with a mounting seat 35, the second motor 36 is mounted on the mounting seat 35, the second lead screw 37 is connected with a rotating shaft of the second motor 36, the second nut is sleeved outside the second lead screw 37 in a threaded manner, the second guide piece is used for guiding the second nut to move along the X-axis direction when the second lead screw 37 rotates, and the taking and placing frame 31 is connected with the second nut.

Further, referring to fig. 3, the pick-and-place frame 31 is provided with a first driving member and a second driving member 321, specifically, the first driving member includes a third motor, a belt and two driving wheels 311, the third motor is mounted on the rack 31, and both the two driving wheels 311 are rotatably mounted on the rack 31, and the two driving wheels 311 are arranged at intervals in the height direction of the rack 31, and both ends of the driving belt are respectively wound outside the two driving wheels 311, thus, the part of the transmission belt between the two transmission wheels 311 forms two transmission sections distributed at two sides of the transmission wheels 311, and the two transmission sections are both provided with mounting plates 312, the elastic component 313 is connected between the mounting plate 312 and the pick-and-place frame 31, and the pick-and-place nozzle 32 and the second driving component 321 are disposed on the mounting plate 312, and the second driving component 321 is used for driving the pick-and-place nozzle 32 to rotate.

So set up, when getting the wafer and assemble, the pivot of the third motor on the rack 31 rotates, the pivot of the third motor rotates and can drive one of them drive wheel 311 that is connected with it and rotate, this drive wheel 311 rotates alright drive with its another drive wheel 311 that is connected through the drive belt transmission and rotate, so, two drive wheel 311 rotate alright drive belt circulation and rotate, because the drive belt is cyclic annular around establishing outside two drive wheels 311, therefore two vertical transmission sections that form between two drive wheels 311 can be at the drive belt rotation in-process one-up-down motion, and then drive two mounting panels 312 connected with it one-up-down.

That is, the two pick-and-place suction nozzles 32 installed on the mounting plate 312 are arranged one above the other, and the rotation direction of the rotating shaft of the third motor is changed, so that the two pick-and-place suction nozzles 32 installed on the mounting plate 312 can be driven to alternately clamp the wafer, the wafer clamping efficiency can be improved, and the interference caused by the simultaneous clamping of the two pick-and-place suction nozzles 32 can be avoided.

In addition, during the up-and-down movement of the mounting plate 312, the elastic component 313 can stretch and retract, so as to buffer the up-and-down movement speed of the pick-and-place nozzle 32 and avoid the damage of the wafer caused by the hard contact between the pick-and-place nozzle 32 and the wafer.

It should be noted that, the second driving component 321 can also be implemented by a motor in the prior art, a rotating shaft of the motor can be connected with the pick-and-place nozzle 32, so as to drive the pick-and-place nozzle 32 to rotate, and the pick-and-place nozzle 32 can be angularly adjusted, and the driving structure is simple and stable.

Furthermore, a torsion spring can be arranged on the pick-and-place suction nozzle 32, and the torsion spring can be stretched when the pick-and-place suction nozzle 32 rotates, that is, when the second driving member 321 drives the pick-and-place suction nozzle 32 to rotate, the pick-and-place suction nozzle 32 can stretch along with the torsion spring, the rotating force of the pick-and-place suction nozzle 32 is more flexible, and hard impact caused by the chip or the pick-and-place frame 31 in the rotating process of the pick-and-place suction nozzle 32 is avoided.

Further, a limit switch may be further disposed on the pick-and-place frame 31, a limit piece is disposed on the pick-and-place suction nozzle 32, the limit piece may be configured to be a touch limit switch when the pick-and-place suction nozzle 32 moves along the height direction of the pick-and-place frame 31, specifically, the limit switch is disposed on the top end and the bottom end of the pick-and-place frame 31, the limit piece may be configured to be respectively in touch with the limit switch located above and the limit switch located below when the pick-and-place suction nozzle 32 moves up and down, so as to limit the upper and lower positions of the pick-and-place suction nozzle 32, and control the movement stroke of the pick-and-place suction nozzle 32.

It should be noted that, the limit switch may be a touch switch or a photoelectric switch in the prior art.

Further, still be equipped with the work piece detection camera on the frame 31 of putting, the work piece detection camera detectable work piece position and conveying work piece signal, the work piece detection camera can shoot the location to the wafer when getting to put suction nozzle 32 clamp and get the wafer, and conveying work piece signal gives first driving piece and second driving piece 321, adjusts the position of getting to put suction nozzle 32, and degree of automation is higher, and the wafer absorbs the position more accurate.

Further, referring to fig. 5, the conveying mechanism 20 includes a belt conveying assembly 22, two conveying frames 21 and a conveying frame driving member, specifically, the two conveying frames 21 are disposed on the machine body 10 at intervals, the belt conveying assemblies 22 are disposed on the two conveying frames 21, the belt conveying assemblies 22 on the two conveying frames 21 are used for supporting the workpiece, and the conveying frame driving member is used for driving the two conveying frames 21 to approach to each other or to move away from each other, so that the interval between the belt conveying assemblies 22 on the two conveying frames 21 can be reduced or increased, and thus the conveying mechanism can be adjusted according to the size of the workpiece, and is suitable for conveying workpieces with different sizes.

Further, the driving member of the conveying rack comprises a fourth motor, a synchronous belt 231, a synchronous wheel 232 and two third screw rods 233, the fourth motor is mounted on the machine body 10, a rotating shaft of the fourth motor is connected with one of the synchronous wheels 232, the synchronous belt 231 is synchronously wound outside the two synchronous wheels 232, the two third lead screws 233 are connected with the two synchronous wheels 232, third nuts 234 are sleeved outside the third lead screws 233, the third nuts 234 are connected with the bottom end of the conveying frame 21, in this way, can drive one of the synchronous wheels 232 to rotate by the rotation of the fourth motor, the rotation of the synchronous wheel 232 can be driven by the synchronous belt 231, that is, the other synchronizing wheel 232 can rotate synchronously, so that the two third lead screws 233 rotate simultaneously, so that the third nut 234 connected with it moves along the third screw 233 to bring the carriage 21 connected with it closer to or farther from the other carriage 21.

It should be noted that the bottom end of the conveying frame 21 is provided with a sliding block, the machine body 10 is provided with a sliding rail, and the two conveying frames 21 can be guided to approach or move away from each other by sliding fit between the house opening and the sliding rail.

Further, a jacking mechanism 40 is arranged between the two conveying frames 21, specifically, the jacking mechanism 40 is arranged at both the plate wiping station and the die bonding station, and the jacking mechanism 40 comprises a jacking plate 41 and a jacking plate driving part which is used for driving the jacking plate 41 to move along the Z-axis direction.

So set up, carry to wiping the board station at the work piece, when wiping the board action, can be through when locating to the jacking board 41, the jacking board 41 can be upward movement under the drive of jacking board driving piece, on leaving belt conveyor components 22 with the work piece top, the roof board can leave belt conveyor components 22 with the work piece top, at this moment, laser emission head 51 can launch laser, utilize laser to burn the impurity such as dirty or the oxide layer on work piece surface, reach clean purpose, jacking board 41 descends again under the effect of jacking board driving piece again, the work piece alright again by belt conveyor components 22 continue to carry, need not the manipulator alright make work piece and belt conveyor components 22 break away from, fix a position processing, equipment cost is reduced.

When the workpiece is continuously conveyed to the die bonding station, the lifting plate 41 of the lifting mechanism 40 located at the die bonding station can move upwards, the lifting plate 41 can also lift the workpiece away from the belt conveying assembly 22, then the wafer taking and placing mechanism 30 can perform dispensing and die bonding actions, and after the dispensing and die bonding actions are completed, the lifting plate 41 descends to the belt conveying assembly 22 again and is continuously conveyed for blanking.

Further, referring to fig. 6, at least two jacking blocks 411 may be further disposed on the jacking plate 41, and the two jacking blocks 411 are spaced on the jacking plate 41, so that when the workpiece is jacked, the workpiece can be jacked by two jacking blocks, the jacking blocks 411 protrude out of the jacking plate 41, and the jacking blocks 411 are in contact with the bottom end of the workpiece, so as to quickly jack the workpiece away from the conveying end surface of the belt conveying assembly 22.

Specifically, two at least jacking pieces 411 are installed on jacking board 41 with detachable mode in this embodiment, and the interval between two adjacent jacking pieces 411 can be adjusted promptly, and after the work piece size change, the interval between two adjacent jacking also can be adjusted along with the work piece size, and applicable work piece scope is wider.

More specifically, the mode of installing on jacking board 41 is inhaled with magnetism to the bottom of above-mentioned jacking piece 411, can be in the bottom of jacking piece 411 sets up magnet, sets up the magnet on jacking board 41, jacking piece 411 alright magnetism inhale adsorb on jacking board 41, the dismouting of being convenient for, the interval between two jacking pieces 411 of easier according to work piece size adjustment.

Of course, in order to stabilize the up-and-down movement of the lifting plate 41, a guide sleeve 412 may be disposed at the bottom end of the lifting plate 41, a guide rod 43 may be disposed on the machine body 10, the guide rod 43 may extend along the Z-axis direction, and the guide sleeve 412 of the lifting plate 41 is slidably sleeved outside the guide rod 43, so as to play a guiding role in the up-and-down movement of the lifting plate 41.

Further, be equipped with two at least work piece briquetting 211 on carriage 21, two at least work piece briquetting 211 are at the direction of delivery of belt conveyor component 22 interval distribution, and work piece briquetting 211 locates the top of jacking board 41, so set up for when the work piece was upwards jacked by jacking board 41, the border upper end of work piece alright be compressed tightly on jacking board 41 by a plurality of work piece briquetting 211, the work piece is compressed tightly by jacking board 41 and work piece briquetting 211 promptly, be convenient for carry out operations such as cleaning, gluing, binding or solid crystal to the work piece.

Further, a first blocking cylinder may be further disposed between the two conveying frames 21, a piston rod of the first blocking cylinder moves along the Z-axis direction, and the first blocking cylinder is disposed on both sides of the jacking mechanism 40 in the conveying direction of the belt conveying assembly 22.

Thus, when a workpiece is conveyed by the belt conveying assembly 22 to the lifting plate 41, the piston rod of the first blocking cylinder located in the front of the conveying direction of the belt conveying assembly 22 can be lowered, the workpiece can be conveyed to the lifting mechanism 40, the first blocking cylinder located in the rear of the conveying direction of the belt conveying assembly 22 can extend upwards to block the workpiece in front of the conveying direction, the workpiece can be temporarily positioned above the lifting plate 41 by the first blocking cylinder, the lifting plate 41 can be lifted to stabilize the lifted workpiece, after the positioning and processing of the workpiece on the lifting plate 41 are completed, the lifting plate 41 is lowered to return the workpiece to the belt conveying assembly 22 again, the piston rod of the first blocking cylinder located in the rear of the conveying direction of the belt conveying assembly 22 is lowered, and the workpiece can be conveyed continuously.

In the jacking process, the piston rod of the first blocking cylinder positioned in front of the belt conveying assembly 22 in the conveying direction can be lifted to block the next workpiece, the jacking plate 41 is lowered after the workpiece on the jacking plate 41 is processed, the workpiece is placed back on the belt conveying assembly 22 again, and the first blocking cylinder positioned in front can be lowered to facilitate the inflow of the next workpiece.

Further, still can be equipped with the second on carriage 21 and block the cylinder, this second blocks the cylinder and is located belt conveyor component 22's transport end, and when the work piece processing was accomplished and is carried to carriage 21's end, the piston rod that the second blocked the cylinder can stretch out, blocks the work piece, waits for the unloading, prevents that the work piece from dropping.

Further, wipe board mechanism in this embodiment still includes work piece detection piece 52 and light source board, all locates the top of wiping the board station with work piece detection piece 52 and light source board, so, can detect the work piece position of wiping the board station through work piece detection piece 52 and detect, above-mentioned laser emission head 51 driving piece can drive laser emission head 51 motion according to the detection position of work piece detection piece 52, aims at the work piece position, carries out accurate cleanness.

Of course, the light source plate can emit light to illuminate the workpiece, and the laser emitting head 51 can be more ready for cleaning dirt or oxide.

Specifically, the workpiece detection element 52 in this embodiment can be implemented by a CCD camera in the prior art, and the light source plate can be implemented by a light reflection plate provided with a plurality of LED light sources 53.

Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes are intended to fall within the scope of the claims.

Claims (10)

1. A full-automatic die bonding device is characterized by comprising,

the machine body is provided with a plate wiping station and a die bonding station;

the conveying mechanism is used for conveying the PCB; the plate wiping station and the die bonding station are positioned on a conveying track of the conveying mechanism; the plate wiping stations and the die bonding stations are distributed at intervals in the conveying direction of the conveying mechanism;

the plate wiping mechanism comprises a laser emitting head, and the laser emitting head is arranged above the plate wiping station;

the wafer picking and placing mechanism comprises a picking and placing frame, a picking and placing suction nozzle, a glue dispensing piece and a picking and placing frame driving piece, wherein the picking and placing frame driving piece is used for driving the picking and placing frame to move along the X-axis direction, and the picking and placing frame driving piece is used for driving the picking and placing frame to move along the Y-axis direction; the picking and placing suction nozzle is arranged on the picking and placing frame and used for clamping the wafer; the glue dispensing part is arranged on the taking and placing frame and is used for dispensing glue on the PCB; the die bonding station is positioned on the motion track of the pick-and-place frame.

2. The full-automatic die bonder of claim 1, wherein a loading platform is further arranged on the machine body, and a tray for storing a plurality of wafers is arranged on the loading platform.

3. The full-automatic die bonder of claim 2, wherein a wafer detector is disposed on the loading platform.

4. The full-automatic die bonder of claim 1, wherein the pick-and-place frame driving member comprises a first motor, a first lead screw, a first nut, a first guiding member, a second motor, a second lead screw, a second nut, and a second guiding member,

the first motor is arranged on the machine body, and the first screw rod extends along the Y-axis direction; the first nut is sleeved outside the first screw rod in a threaded manner; the first guide piece is used for guiding the first nut to move along the Y-axis direction when the first screw rod rotates; the first nut is provided with a mounting seat;

the second motor is arranged on the mounting seat, the second screw rod is connected with a rotating shaft of the second motor, the second nut is sleeved outside the second screw rod in a threaded manner, and the second guide piece is used for guiding the second nut to move along the X-axis direction when the second screw rod rotates; the taking and placing frame is connected with the second nut.

5. The full-automatic die bonder of claim 4, wherein the pick-and-place frame is provided with a first driving member and a second driving member, the first driving member comprises a third motor, a transmission belt and two transmission wheels, and the third motor is mounted on the pick-and-place frame; the two driving wheels are rotatably arranged on the taking and placing frame and are arranged at intervals in the height direction of the taking and placing frame; two ends of the transmission belt are respectively wound outside the two transmission wheels; the part of the transmission belt between the two transmission wheels forms two transmission sections distributed on two sides of the transmission wheels; mounting plates are arranged on the two transmission sections; elastic components are connected between the mounting plate and the taking and placing frame; the mounting plates are provided with the pick-and-place suction nozzle and a second driving piece; the second driving piece is used for driving the pick-and-place suction nozzle to rotate.

6. The full-automatic die bonder equipment as claimed in any one of claims 1 to 5, wherein the conveying mechanism comprises a belt conveying assembly, two conveying frames and a conveying frame driving part, and the two conveying frames are arranged on the machine body at intervals; the two conveying frames are provided with the belt conveying assemblies; the belt conveying components on the two conveying frames are used for supporting the workpiece; the conveying frame driving part is used for driving the two conveying frames to be close to each other or be far away from each other.

7. The full-automatic die bonding equipment according to claim 6, wherein a jacking mechanism is arranged between the two conveying frames, and the plate wiping station and the die bonding station are both provided with the jacking mechanism; the jacking mechanism comprises a jacking plate and a jacking plate driving part, and the jacking plate driving part is used for driving the jacking plate to move along the Z-axis direction.

8. The full-automatic die bonding equipment as claimed in claim 7, wherein at least two workpiece pressing blocks are arranged on the conveying frame, and the at least two workpiece pressing blocks are arranged on both sides of the plate wiping station and the die bonding station; at least two workpiece pressing blocks are distributed at intervals in the conveying direction of the belt conveying assembly; the workpiece pressing block is arranged above the jacking plate.

9. The full-automatic die bonder of claim 7, wherein the lifting plate is provided with at least two lifting blocks, and the at least two lifting blocks are detachably mounted on the lifting plate.

10. The full-automatic die bonder equipment as claimed in any one of claims 1 to 5, wherein the plate-wiping mechanism further comprises a workpiece detector and a light source plate, and the workpiece detector and the light source plate are both arranged above the plate-wiping station.

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