CN106981434B - Full-automatic adhesive sheet bonding equipment and adhesive sheet bonding method - Google Patents
Full-automatic adhesive sheet bonding equipment and adhesive sheet bonding method Download PDFInfo
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- CN106981434B CN106981434B CN201710259766.5A CN201710259766A CN106981434B CN 106981434 B CN106981434 B CN 106981434B CN 201710259766 A CN201710259766 A CN 201710259766A CN 106981434 B CN106981434 B CN 106981434B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83908—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving monitoring, e.g. feedback loop
Abstract
The invention relates to the semiconductor packaging industry, and discloses full-automatic adhesive bonding equipment, which comprises: the device comprises a feeding part, a carrying part, a tin supply shaping part, an identification positioning part, a chip platform part, a chip pick-up part, a bonding conveying part, a bonding camera positioning part, a bonding head and a discharging part, and further comprises a track for connecting the feeding part and the discharging part, a first display screen for displaying the collected photo data in the camera and a second display screen in communication connection with the bonding camera positioning part, and a first operation table and a second operation table for operating the identification positioning part and the bonding camera positioning part. The beneficial effects of the invention are as follows: the purpose of controlling the bonding of the adhesive sheet with high precision can be realized.
Description
Technical Field
The invention relates to the semiconductor packaging industry, in particular to production equipment for a front-end adhesive sheet and a bonding process (Die bond-Wire bond) of a power module package.
Background
The semiconductor packaging chip bonding mode generally comprises 4 modes of eutectic, welding, conductive adhesive and glass adhesive, wherein each mode has the advantages and disadvantages of the characteristics, the power module packaging bonding sheet is more suitable for two modes of welding and conductive adhesive, and is more suitable for a soft solder (alloy solder such as lead tin silver and the like) in the welding mode and a spot tin paste mode in the conductive adhesive sheet, and the two modes mainly correspond to the mode that the stress and thermal resistance comprehensive effect after the chip and the frame bonding sheet in the power device are finished is better.
Semiconductor package wire bonding is one of the most important electronic packaging techniques currently used for packaging more than 90% of chips. Wire bonding can be classified into thermal compression bonding, ultrasonic bonding, thermal compression ultrasonic bonding, and ball star bonding and wedge bonding according to the shape of the bonding point. Power devices and module packages typically employ wire bonding. The high-power IGBT module is reliable by adopting ultrasonic wire bonding for the IGBT chip and the FRD chip. Because of the need of carrying large current, a wedge-shaped chopper is adopted to bond the coarse aluminum wire to the surface of the chip and the surface of the lining plate, and the method is called ultrasonic wedge bonding. The most commonly used power device packaging technology is a wire bonding method and a copper sheet bridging mode, and the bonding mode has the advantages of simple technology, low cost and high reliability.
At present, high-power IGBT modules, intelligent Power Modules (IPM) and technologies are not completely mastered in China, and corresponding module packaging technology is insufficient and lacks of process technology data accumulation, so that corresponding development in packaging equipment is slow. However, the intelligent power module IPM, the power electronic module PEBB and the integrated power electronic module IPEM are increasingly used in household appliances (microwave ovens, air conditioners, washing machines, etc.) and industrial appliances (servos, frequency converters, etc.), and have a broad market prospect.
Disclosure of Invention
In order to achieve the above purpose, the invention aims to provide a full-automatic adhesive bonding device, which adopts an industrial computer to be matched with a motion control card to control a servo motor and a stepping motor, and achieves the purpose of high-precision control by identifying and positioning through a camera, and the full-automatic adhesive bonding device is realized by the following technical scheme.
Full-automatic adhesive sheet bonding apparatus comprising:
feeding part: the feeding part is positioned at one side of the equipment and comprises a loading table for conveying the leads to the pick-up position, and the feeding part is used for picking up the leads to a feeding pushing table;
conveying part: the clamping jaw is connected with the feeding part and comprises a clamping jaw of a servo motor driving guide rail lead screw and is used for conveying a lead wire to a tin supply shaping area;
tin feeding shaping part: comprises a shaping head for flattening a tin layer or a tin paste layer;
identifying and positioning part: a camera that includes capturing photo data;
chip XY stage: the device comprises an X-direction servo motor guide rail lead screw and a Y-direction servo motor guide rail lead screw, and is used for moving a chip on a wafer to a pick-up position according to camera identification positioning data;
chip pickup: the device comprises a pick-up head driven by an X-direction servo motor guide rail lead screw and a Z-direction servo motor guide rail lead screw, wherein the pick-up head comprises a vacuum suction nozzle which is sucked to a chip and is placed at a lead welding position from pick-up;
a bonding conveying part: the bonding device comprises a lead clamp, a first bonding head and a second bonding head, wherein the lead clamp is used for conveying a lead with a chip bonded to the first bonding head;
bonding camera positioning portion: reading welding template data for ultrasonic welding positioning;
bonding head: the ultrasonic bonding device comprises a first bonding head and a second bonding head which are driven by a servo motor to move in the Z direction and the R direction, and also comprises an ultrasonic bonding device for respectively bonding an aluminum wire lead to a lead pin and a chip bonding pad;
and (3) blanking: the feeding part is used for automatically conveying the bonding-completed lead into the material box, automatically discharging the filled material box and replacing the empty material box;
the equipment further comprises a track connected with the feeding part and the discharging part, a first display screen for displaying the photo data acquired in the camera, a second display screen in communication connection with the bonding camera positioning part, and a first operation table and a second operation table for operating the identification positioning part and the bonding camera positioning part.
The feeding part picks up the lead wire to a feeding pushing table in a mode of sucking by a vacuum chuck or clamping by a finger cylinder.
The camera of the identification positioning part collects photo data and uploads the photo data to the computer communication module.
The ultrasonic bonding device consists of an ultrasonic generator, a piezoelectric transducer, an amplitude transformer and a bonding tool.
The pick-up head of the chip pick-up part comprises a vacuum suction nozzle for sucking the chip and a digital flowmeter for detecting the pick-up state.
The adhesive sheet bonding method based on the adhesive sheet bonding equipment comprises the following steps:
step one, automatically expanding a wafer on a chip XY platform part;
step two, a tin supply shaping part supplies soft solder or one of solder paste to the fuse frame, and a shaping head shapes according to the shape of the chip;
positioning an XY platform chip through a camera, and picking up the chip positioned by the camera by a pick-up head onto the lead frame solder with automatic feeding;
fourthly, the bonding system and the bonding system are in online communication, and the lead frame after bonding is operated to the bonding track area;
step five, a first bonding head bonding camera identifies a bonding positioning area, and the first bonding head bonds the aluminum wire and the aluminum strip to the chip and the pin wire;
and step six, after the first bonding head is finished, moving to a bonding area of a second bonding head, and enabling the camera to identify a keyboard area, wherein the second bonding head bonds the aluminum wire and the aluminum strip to the chip and the pin wire.
The beneficial effects of the invention are as follows: the purpose of controlling the bonding of the adhesive sheets with high precision can be realized, and the problem of mass production of module packaging is solved.
Drawings
Fig. 1 is a schematic structural view of a full-automatic die bonding apparatus.
Fig. 2 is a schematic flow chart of an adhesive sheet bonding method based on the adhesive sheet bonding apparatus of the present invention.
Description of the embodiments
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
As shown in fig. 1, fig. 1 is a schematic structural view of a full-automatic adhesive sheet bonding apparatus of the present invention, the structure of the apparatus comprising:
the feeding part 1 is positioned at one side of the equipment and comprises a carrying table for conveying the lead to a pick-up position, the feeding part is used for picking up the lead to the carrying part 2, and the carrying part 2 comprises a clamping jaw of a servo motor driving guide rail lead screw and is used for conveying the lead to a tin feeding shaping area; tin feeding shaping unit 3: comprises a shaping head for flattening a tin layer or a tin paste layer according to the size of a chip.
Identification positioning unit 4: the camera is used for collecting photo data and uploading the photo data after collecting the photo data;
chip platform portion: the device comprises an X-direction servo motor guide rail lead screw and a Y-direction servo motor guide rail lead screw (not shown in the figure), and is used for moving the chip on the wafer 5 to a pick-up position according to camera identification positioning data;
chip pickup section 6: the servo motor cam drives the ejector pin to jack up the positioned chip, the pick-up head driven by the X-direction servo motor guide rail lead screw and the Z-direction servo motor guide rail lead screw is sucked to the chip by the vacuum suction nozzle and placed at the lead welding position;
a bonding conveying part: the bonding device comprises a lead clamp, a first bonding head and a second bonding head, wherein the lead clamp is used for conveying a lead with a chip bonded to the first bonding head;
bonding camera positioning, namely acquiring images by a camera and a data acquisition card, positioning a welding area and reading welding template data;
bonding head: the bonding head comprises a first bonding head 10 and a second bonding head 11 which are driven by a servo motor to move in the Z direction and the R direction, and an ultrasonic bonding device 12 for respectively bonding an aluminum wire lead to a lead pin and a chip bonding pad;
blanking part 13: the automatic wire bonding machine comprises a material box carrying platform and a material box, wherein the material box carrying platform is used for automatically carrying the bonded wire into the material box, and the material box carrying platform automatically unloads the filled material box and carries an empty material box;
the device further comprises a track 14 for connecting the feeding part and the discharging part, a first display screen 15 for displaying photo data acquired in the camera, a second display screen 16 in communication connection with the bonding camera positioning part, and a first operation table 17 and a second operation table 18 for operating the identification positioning part and the bonding camera positioning part.
In the specific embodiment of the invention, the whole system realized by adopting the following scheme adopts an industrial computer to match with a motion control card to control a servo motor and a stepping motor, and realizes high-precision control by identifying and positioning through a camera, and the description of each component is as follows in combination with one embodiment.
Feeding part 1: the lead is conveyed to a pick-up position by a feed table formed by driving a lead screw guide rail by a stepping motor, and is sucked by a vacuum chuck or clamped by a finger cylinder to a feeding and pushing table. The stepping motor pushes the lead into the track to heat, and the heat engine heats the hydrogen-nitrogen gas mixture gas protection lead to the melting temperature of the soft solder, for example, the track is not heated by adopting a solder paste-pointing process, and the lead is directly conveyed to a tin-feeding shaping (or solder paste-pointing) part.
The conveying unit 2: the servo motor drives the guide rail lead screw, the clamping jaw is used for conveying the lead wire to a tin supply shaping area tin supply shaping (or solder paste dispensing) part 3, the stepping motor drives the roller to convey tin wires to the lead wire, the servo motor lead screw guide rail drives the shaping head to shape (or the servo motor lead screw guide rail drives the dispensing head to dispense glue by a dispensing machine), and a tin layer or a solder paste layer with the size of a die is formed and flattened.
Identification positioning unit 4: and the camera shoots and collects photo data, and is compared with the computer communication template data to position the chip.
Chip XY stage 5 (WFAER stage): and the X-direction servo motor guide rail lead screw and the Y-direction servo motor guide rail lead screw move the chip on the wafer to the pick-up position according to the camera identification positioning data.
Chip pickup section 6: the servo motor cam drives the ejector pin to jack up the positioned chip, the X-direction servo motor guide rail lead screw and the Z-direction servo motor guide rail lead screw drive the pick-up head to move to the positioned chip position, the vacuum suction nozzle is used for sucking the chip and placing the chip at the lead welding position, the pick-up head adopts the vacuum suction nozzle, the digital flowmeter is used for detecting the pick-up state, the chip is welded to the lead bonding pad by using about 100g pressure after the chip is picked up, the lead after the chip is welded is continuously conveyed forwards through the conveying part to the bonding track area, and the bonding conveying is started online.
A bonding conveying part: the lead screw guide rail of the stepping motor drives the lead wire clamp, and the lead wire after the chip is conveyed to the first bonding head position.
Bonding camera positioning portion 9: the camera and the data acquisition card acquire images, locate the welding area and read the welding template data
First bond head 10: the bonding head is driven by a servo motor to move in the Z direction and the R direction, an ultrasonic bonding system is arranged on the bonding head, the ultrasonic bonding system consists of an ultrasonic generator, a piezoelectric transducer, an amplitude transformer and a bonding tool (a chopper and the like), the working principle is that the piezoelectric ceramic converts sinusoidal power signals generated by an ultrasonic circuit into mechanical vibration energy, the vibration acts on a working interface after being amplified and converged by transmission, under the combined action of the mechanical energy and DIER bonding force, an aluminum wire penetrating through the chopper is driven to rub with a film by utilizing ultrasonic mechanical vibration at normal temperature, oxide films are broken, the pure metal surfaces are contacted with each other, and the metals are mutually diffused by heat generated by friction, so that an aluminum wire lead is respectively bonded to a lead pin and a chip bonding pad.
Second bond head 11: and after the first bonding head finishes bonding, the lead is conveyed to the second bonding by the conveying clamp to finish the second bonding.
Blanking part 13: the guide rail screw of the stepping motor drives the material box carrying platform, the lead wire which is bonded is automatically carried into the material box, the material box is automatically unloaded after being filled with the material box, the material box is empty up and down, and the bonding of the whole adhesive sheet is completed. The whole bonding process is that the upper track of the track 14 driven by a motor to circularly rotate is sequentially connected with a feeding part, a carrying part, a tin-feeding shaping part and an ultrasonic welding area, the discharging part is operated according to screen display through an operation table, and the whole process is sequentially completed according to the functional structure.
As shown in fig. 2, based on the explanation of the above functions, the method of die bonding of the present invention is:
s1, automatically expanding a wafer on a chip XY platform part;
s2, the tin supply shaping part supplies soft solder or one of solder paste to the fuse frame, and the shaping head shapes according to the shape of the chip;
s3, positioning an XY platform chip through a camera, and picking up the chip positioned by the camera by a pick-up head onto the lead frame solder with automatic feeding;
s4, carrying out online communication on the bonding system and the bonding system, and running the lead frame with the bonded sheet to a bonding track area;
s5, a first bonding head bonding camera identifies a bonding positioning area, and the first bonding head bonds the aluminum wire and the aluminum strip to the chip and the pin wire;
and S6, after the first bonding head is finished, moving to a bonding area of the second bonding head, and enabling the camera to identify a keyboard area, wherein the second bonding head bonds the aluminum wire and the aluminum strip to the chip and the pin wire.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (6)
1. Full-automatic adhesive sheet bonding apparatus comprising:
feeding part: the feeding part is positioned at one side of the equipment and comprises a loading table for conveying the leads to the pick-up position, and the feeding part is used for picking up the leads to a feeding pushing table;
conveying part: the clamping jaw is connected with the feeding part and comprises a clamping jaw of a servo motor driving guide rail lead screw and is used for conveying a lead wire to a tin supply shaping area;
tin feeding shaping part: comprises a shaping head for flattening a tin layer or a tin paste layer;
identifying and positioning part: a camera that includes capturing photo data;
chip XY stage: the device comprises an X-direction servo motor guide rail lead screw and a Y-direction servo motor guide rail lead screw, and is used for moving a chip on a wafer to a pick-up position according to camera identification positioning data;
chip pickup: the device comprises a pick-up head driven by an X-direction servo motor guide rail lead screw and a Z-direction servo motor guide rail lead screw, wherein the pick-up head comprises a vacuum suction nozzle which is sucked to a chip from a pick-up position to a lead welding position;
a bonding conveying part: the bonding device comprises a lead clamp, a first bonding head and a second bonding head, wherein the lead clamp is used for conveying a lead with a chip bonded to the first bonding head;
bonding camera positioning portion: reading welding template data for ultrasonic welding positioning;
bonding head: the ultrasonic bonding device comprises a first bonding head and a second bonding head which are driven by a servo motor to move in the Z direction and the R direction, and also comprises an ultrasonic bonding device for respectively bonding an aluminum wire lead to a lead pin and a chip bonding pad;
and (3) blanking: the feeding part is used for automatically conveying the bonding-completed lead into the material box, automatically discharging the filled material box and replacing the empty material box;
the equipment also comprises a track for connecting the feeding part and the discharging part, a first display screen for displaying the photo data acquired by the camera, a second display screen for displaying the photo data acquired by the camera, a first operation table and a second operation table for operating the identification positioning part and the bonding camera positioning part, wherein the second display screen is in communication connection with the bonding camera positioning part; the feeding part picks up the lead wire to a feeding pushing table in a mode of sucking by a vacuum chuck or clamping by a finger cylinder; the camera of the identification positioning part collects photo data and uploads the photo data to the computer communication module.
2. The full-automatic adhesive sheet bonding apparatus according to claim 1, wherein the ultrasonic bonding means is composed of an ultrasonic generator, a piezoelectric transducer, a horn and a bonding tool.
3. The full-automatic die bonding apparatus according to claim 1, wherein the pick-up head of the chip pick-up section includes a vacuum suction nozzle sucking the chip, a digital flowmeter detecting a pick-up state.
4. A die bonding method based on the full-automatic die bonding apparatus of any one of claims 1 to 3, comprising:
step one, automatically expanding a wafer on a chip XY platform part;
step two, a tin supply shaping part supplies soft solder or one of solder paste to the fuse frame, and a shaping head shapes according to the shape of the chip;
positioning an XY platform chip through a camera, and picking up the chip positioned by the camera by a pick-up head onto the lead frame solder with automatic feeding;
fourthly, the bonding system and the bonding system are in online communication, and the lead frame after bonding is operated to the bonding track area;
step five, a first bonding head bonding camera identifies a bonding positioning area, and the first bonding head bonds the aluminum wire and the aluminum strip to the chip and the pin wire;
and step six, after the first bonding head is finished, moving to a bonding area of a second bonding head, and enabling the camera to identify a keyboard area, wherein the second bonding head bonds the aluminum wire and the aluminum strip to the chip and the pin wire.
5. The die bonding method according to claim 4, wherein in the third step, the servo motor cam drives the ejector pin to eject the positioned die, the X-direction servo motor guide screw and the Z-direction servo motor guide screw drive the pick-up head to move to the positioned die position, the vacuum suction nozzle of the pick-up head sucks the die to be placed at the lead welding position, and the digital flowmeter detects the pick-up state to weld the die to the lead frame.
6. The bonding method of the adhesive sheet according to claim 4, wherein the first bonding head is driven by a servo motor to move in the Z direction and the R direction, an ultrasonic bonding device is arranged on the bonding head, and the ultrasonic bonding step is as follows:
step 11, converting a sinusoidal power signal generated by an ultrasonic circuit into mechanical vibration energy by piezoelectric ceramics of an ultrasonic bonding device, and enabling the vibration to act on a working interface after transmission, amplification and convergence;
and 12, utilizing ultrasonic mechanical vibration to drive aluminum wires passing through the chopper to rub the films at normal temperature to generate heat, and respectively bonding the aluminum wire leads to the lead pins and the chip bonding pads.
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| CN201710259766.5A CN106981434B (en) | 2017-04-19 | 2017-04-19 | Full-automatic adhesive sheet bonding equipment and adhesive sheet bonding method |
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| CN201710259766.5A CN106981434B (en) | 2017-04-19 | 2017-04-19 | Full-automatic adhesive sheet bonding equipment and adhesive sheet bonding method |
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| CN109132578A (en) * | 2018-10-12 | 2019-01-04 | 宁波尚进自动化科技有限公司 | Recycle stock conveyer system |
| CN109256352B (en) * | 2018-10-15 | 2021-10-08 | 深圳成为控股有限公司 | Chip hot melting, welding packaging machine |
| CN110085543A (en) * | 2019-06-04 | 2019-08-02 | 常州美索虹铭玻璃有限公司 | A kind of automatic bonder of power semiconductor and its die bond technique |
| CN113517212B (en) * | 2021-06-23 | 2021-11-19 | 四川通妙科技有限公司 | Lead frame is with gluing core device |
| CN115533294B (en) * | 2022-12-05 | 2023-03-21 | 宁波尚进自动化科技有限公司 | BTO automatic adjusting system and method of lead bonding machine |
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| WO2015072593A1 (en) * | 2013-11-14 | 2015-05-21 | (주)정원기술 | Chip supply apparatus of laser chip bonding machine |
| CN105070670A (en) * | 2015-07-17 | 2015-11-18 | 北京中电科电子装备有限公司 | Bonding head device and chip packaging device |
| CN205255159U (en) * | 2015-12-29 | 2016-05-25 | 深圳市奥赛瑞科技有限公司 | Wainscot component automatic molding mould equipment of binding foot |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| SG173943A1 (en) * | 2010-03-04 | 2011-09-29 | Ah Yoong Sim | Rotary die bonding apparatus and methodology thereof |
| KR102238649B1 (en) * | 2014-09-16 | 2021-04-09 | 삼성전자주식회사 | Bonding apparatus of semiconductor chip |
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| WO2015072593A1 (en) * | 2013-11-14 | 2015-05-21 | (주)정원기술 | Chip supply apparatus of laser chip bonding machine |
| CN105070670A (en) * | 2015-07-17 | 2015-11-18 | 北京中电科电子装备有限公司 | Bonding head device and chip packaging device |
| CN205255159U (en) * | 2015-12-29 | 2016-05-25 | 深圳市奥赛瑞科技有限公司 | Wainscot component automatic molding mould equipment of binding foot |
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Effective date of registration: 20230414 Address after: No.15, eco industrial park, Rongxin Road, rongjiawan Town, Yueyang County, Yueyang City, Hunan Province, 414000 Applicant after: Hunan aosairui Intelligent Technology Co.,Ltd. Address before: 518000, 4th Floor, Building 11, Honglong Science and Technology Industrial Park, Tangtou Avenue, Langxin Community, Shiyan Street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN AOSAIRUI TECHNOLOGY Co.,Ltd. |
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