CN106981434A - Full-automatic bonding die bonding apparatus and bonding die bonding method - Google Patents
Full-automatic bonding die bonding apparatus and bonding die bonding method Download PDFInfo
- Publication number
- CN106981434A CN106981434A CN201710259766.5A CN201710259766A CN106981434A CN 106981434 A CN106981434 A CN 106981434A CN 201710259766 A CN201710259766 A CN 201710259766A CN 106981434 A CN106981434 A CN 106981434A
- Authority
- CN
- China
- Prior art keywords
- bonding
- chip
- head
- lead
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83908—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving monitoring, e.g. feedback loop
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
The present invention relates to semiconductor packaging industry, a kind of full-automatic bonding die bonding apparatus is disclosed, including：Feeding portion, trucking department, for tin shaping portion, identification location division, chip platform portion, chip pickup section, bonding conveying unit, bonding camera location division, bonding head, blanking portion, it is described also to include the track in connection feeding portion and blanking portion, show that the second display screen of the first display screen that picture data is collected in the camera and the communication connection of bonding camera location division, and operation recognize the first operating desk and the second operating desk of location division and bonding camera location division.The beneficial effects of the invention are as follows：The purpose of high-precision control bonding die bonding can be realized.
Description
Technical field
The present invention relates to semiconductor packaging industry, particularly power module package leading portion bonding die and bond sequence (Die
Bonder-Wire Bonder) production equipment.
Background technology
Semiconductor packaging chip bonding method typically has eutectic, welding, conducting resinl, glass cement this 4 kinds of modes, wherein respectively having
Its characteristic advantage and disadvantage, power module package bonding die is more suitable for using welding and both modes of conducting resinl, and is more suitable for welding
The point tin cream mode in slicken solder (solder such as slicker solder silver) and conductive sheet adhesive in mode, mainly both modes
Stress and thermal resistance resultant effect after the completion of correspondence power device chips and framework bonding die is relatively good.
Semiconductor package lead bonding is one of currently the most important Electronic Encapsulating Technology, and current more than 90% chip is equal
Encapsulated using this technology.Wire bonding can be divided into thermocompression bonding, ultrasonic bond, three kinds of hot pressing ultrasonic bond, according to bonding point
Shape is divided into soccer star's bonding and wedge bonding again.Power device and module encapsulation typically use wire bonding.High-power IGBT
Module is general reliable using ultrasonic lead key connection to igbt chip and FRD chips.Due to needing to carry high current, therefore use
Wedge-shaped chopper is by crude aluminum line bonding to chip surface and backing surface, and this method is ultrasonic Wedge Bond.Power device package work
Wire bonding method and copper sheet bridging mode are most commonly used that in skill, bonding pattern technique is simple, and cost is low, and reliability is high.
Domestic at present also no grasp high-power IGBT module and SPM (IPM) and technology completely, accordingly
Module packaging technology technology grasp not enough, lack technology data accumulation, so in the corresponding slower development of sealed in unit.
But intelligent power module, power electronics modules PEBB, integrated power electronic module I PEM is in household electrical appliance (micro-wave oven, sky
Adjust, washing machine etc.) and more and more extensive, the wide market of industrial electrical equipment (servo, frequency converter etc.) application.
The content of the invention
To achieve the above object, it is an object of the invention to provide one kind, full-automatic bonding die bonding apparatus, using industrial electro
Brain matches somebody with somebody motion control card, control servomotor and stepper motor, is recognized and positioned by camera, reaches the purpose of high-precision control,
It is achieved by the following technical solution.
Full-automatic bonding die bonding apparatus, including:
Feeding portion：Feeding portion is located at the side of equipment, including transports lead to the material carrier platform of pickup position, and the feeding portion is used
Platform is pushed in pickup lead to feeding；
Trucking department：It is connected with feeding portion, includes the clamping jaw that servomotor drives guide rail leading screw, for transporting lead to supplying tin
Shaping region；
For tin shaping portion：Including for smooth tin layers or tin paste layer shaping head；
Recognize location division：Camera including gathering picture data；
Chip XY platform parts：Including X to servomotor guide rail leading screw and Y-direction servomotor guide rail leading screw, known according to camera
Other location data is used to chip on wafer being moved to take-off location；
Chip pickup section：Including the pickup driven from X to servomotor guide rail leading screw and Z-direction servomotor guide rail leading screw
Head, the pick-up head includes being drawn to the vacuum slot that chip is placed into lead welding position from the pickup；
It is bonded conveying unit：Including cable guide, for transporting the lead of viscous complete chip to the first bonding head position；
It is bonded camera location division：Welding template data is read, for ultra-sonic welded positioning；
Bonding head：Bonding head Z-direction and the first bonding head from R to motion and the second bonding head are driven including servomotor, also
Including the ultrasonic bond device for aluminium wire lead to be bonded to terminal pin and chip bonding pad；
Blanking portion：Positioned at the equipment opposite side relative with the feeding portion, including some magazines, the blanking portion is used for will
The lead for completing bonding is transported in magazine automatically, the magazine after filling is unloaded automatically, and replace an empty magazine；
Wherein, the equipment also includes the track in connection feeding portion and blanking portion, shows in the camera and collects photo
First display screen of data and the second display screen of bonding camera location division communication connection, and operation identification location division and Bonded Phase
The first operating desk and the second operating desk of machine location division.
The feeding portion is to pick up lead by way of vacuum cup is drawn or finger cylinder is gripped to push platform to feeding.
The camera of identification location division collects picture data, and uploads to dataphone module.
Ultrasonic bond device is by ultrasonic generator, PZT (piezoelectric transducer), ultrasonic transformer and bonding tool composition.
The pick-up head of the chip pickup section includes the vacuum slot of absorption chip, detects the digital flow of pick-up situation
Meter.
The bonding die bonding method of bonding die bonding apparatus based on the present invention includes：
Step 1: wafer automatic spread sheet in chip XY platform parts；
Step 2: for tin shaping portion to fuse framework for one kind in slicken solder or point tin cream, shaping head is according to chip shape
Shape shaping；
Step 3: positioning XY platform chips, the chip that pick-up head pickup camera is navigated to automatic charging by camera
On lead frame solder；
Step 4: bonding die system and bonding system on-line communication, the lead frame that bonding die is completed run to bonding orbit area；
Step 5: the first bonding head bonding camera identification bonding localization region, the first bonding head is bonded aluminum steel and aluminium strip
To chip and lead-foot-line；
Step 6: after the completion of the first bonding head, being moved to the bond area of the second bonding head, camera recognizes keyboard area,
Aluminum steel and aluminium strip are bonded to chip and lead-foot-line by the second bonding head.
The beneficial effects of the invention are as follows：The purpose of high-precision control bonding die bonding can be realized, module encapsulation volume production is solved and asks
Topic.
Brief description of the drawings
Fig. 1 is the structural representation of full-automatic bonding die bonding apparatus.
Fig. 2 is the method flow diagram of bonding die bonding in the specific embodiment of the invention.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
As shown in figure 1, Fig. 1 is the structural representation of the full-automatic bonding die bonding apparatus of the present invention, the structure of equipment includes：
Positioned at the side feeding portion 1 of equipment, including lead is transported to the material carrier platform of pickup position, the feeding portion is used to pick up
Lead is to trucking department 2, and trucking department 2 includes the clamping jaw that servomotor drives guide rail leading screw, for transporting lead to for tin shaping region；
For tin shaping portion 3：Including shaping head, according to the smooth tin layers of chip size or tin paste layer.
Recognize location division 4：Uploaded after camera including gathering picture data, collection photo data；
Chip platform portion：Including X to servomotor guide rail leading screw and Y-direction servomotor guide rail leading screw (not shown),
Recognize that location data is used to chip on wafer 5 being moved to take-off location according to camera；
Chip pickup section 6：The chip that servomotor cam driven thimble jack-up is had good positioning, X is to servomotor guide rail leading screw
The pick-up head driven with Z-direction servomotor guide rail leading screw, chip is drawn to vacuum slot and is placed into lead welding position；
It is bonded conveying unit：Including cable guide, for transporting the lead of viscous complete chip to the first bonding head position；
It is bonded camera positioning:By camera and data collecting card collection image, weld zone positioning is given, welding template number is read
According to；
Bonding head：Bonding head Z-direction and R are driven to the first bonding head 10 of motion and the second bonding head including servomotor
11, in addition to for aluminium wire lead to be bonded to the ultrasonic bond device 12 of terminal pin and chip bonding pad；
Blanking portion 13：Including magazine microscope carrier and magazine, the blanking portion is used to the lead for completing bonding being transported to automatically
In magazine, magazine microscope carrier unloads the magazine after filling automatically, and carries an empty magazine；
Wherein, the equipment also includes the track 14 in connection feeding portion and blanking portion, shows in the camera and collects photograph
First display screen 15 of sheet data and the second display screen 16 of bonding camera location division communication connection, and operation identification location division and
It is bonded the first operating desk 17 and the second operating desk 18 of camera location division.
It is that the whole system realized by following scheme matches somebody with somebody motion using industrial computer in the specific embodiment of the present invention
Control card, control servomotor and stepper motor, are recognized by camera and positioned, reach high-precision control, are implemented with reference to wherein one
Example, is described as follows to each part.
Feeding portion 1：Drive lead screw guide rails composition material carrier platform to transport lead to pickup position with stepper motor, inhaled with vacuum cup
Take or finger cylinder grips lead and pushes platform to feeding.Stepper motor band pusher head pushes lead and enters track heating, and heat engine is by hydrogen
Nitrogen mixture protection lead is heated to slicken solder fusion temperature, and such as using point tin cream technique, heating track is not directly taken confession
Tin shaping (or point tin cream) portion.
Conveying unit 2：Drive guide rail leading screw with servomotor, with clamping jaw transport lead arrive for tin shaping region supply tin shaping (or
Point tin cream) portion 3, stepper motor drives roller tin feeding wire on lead, servomotor lead screw guide rails drive the shaping of shaping head (or
Servomotor lead screw guide rails drive Glue dripping head, point gum machine dispensing), the smooth tin layers or tin paste layer of shaping and chip size.
Recognize location division 4：Camera is taken pictures collection picture data, and the contrast of dataphone template data, positioning chip.
Chip XY platform parts 5 (WFAER platforms)：X is to servomotor guide rail leading screw and Y-direction servomotor guide rail leading screw according to phase
Chip is to take-off location on machine identification location data movement wafer.
Chip pickup section 6：The chip that servomotor cam driven thimble jack-up is had good positioning, X is to servomotor guide rail leading screw
Pick-up head is driven with Z-direction servomotor guide rail leading screw, the chip position navigated to is moved to, being drawn to chip with vacuum slot puts
Lead welding position is put, pick-up head uses vacuum slot, detect pick-up situation with digital flowmeter, used after pickup to chip
Chip is welded to lead pad by 100g or so pressure, and the lead after the completion of chip welding continues to transport forward by conveying unit,
To bonding orbit area, online startup bonding conveyance.
It is bonded conveying unit：Stepper motor lead screw guide rails drive cable guide, and the lead that chip has been glued in conveyance is sent to the first bonding
Head position.
It is bonded camera location division 9：By camera and data collecting card collection image, weld zone positioning is given, welding template is read
Data
First bonding head 10：Bonding head drives bonding head Z-direction and R to motion from servomotor, the ultrasonic key of dress on bonding head
Syzygy is united, and ultrasonic bond system is by ultrasonic generator, PZT (piezoelectric transducer), ultrasonic transformer and bonding tool (chopper etc.) composition, its work
Make principle and the sinusoidal power signal that ultrasound circuitry is produced is converted into mechanical shock energy for piezoelectric ceramics, vibrations are amplified simultaneously through transmission
Working interface is acted on after convergence, under the collective effect of mechanical energy and DIER bonding forces, is shaken at normal temperatures using ultrasonic machinery
It is dynamic to drive the aluminum steel through chopper to be rubbed with film, it is that oxide-film is crushed, pure metal surface is contacted with each other, and passes through friction
The heat of generation, makes phase counterdiffusion between metal, so that aluminium wire lead is bonded into terminal pin and chip bonding pad.
Second bonding head 11：Identical with principle with the first bonding header structure, the first bonding head is completed after bonding, is pressed from both sides by conveyance
Conveyance lead is to complete second to be bonded to the second bonding.
Blanking portion 12：Stepper motor guide rail leading screw drives magazine microscope carrier, and the lead for completing bonding is transported in magazine automatically,
Magazine unloads full magazine automatically after filling, upper next empty magazine, overall bonding die bonding is completed.Whole bonding process is by electricity
The upper rail of track 13 for the cycle rotation that machine drives is sequentially connected feeding portion, trucking department, for tin shaping portion, ultra-sonic welded region,
Blanking portion, is operated by operating desk according to screen display, and is sequentially completed whole process by foregoing functional structure.
Explanation based on above-mentioned functions, the method for bonding die bonding of the invention is：
S1, the wafer automatic spread sheet in chip XY platform parts；
S2, the one kind supplied for tin shaping portion to fuse framework in slicken solder or point tin cream, shaping head are whole according to chip form
Shape；
S3, pass through camera and position XY platform chips, the lead of the pick-up head chip that navigates to of pickup camera to automatic charging
On framework solder；
S4, bonding die system and bonding system on-line communication, the lead frame that bonding die is completed run to bonding orbit area；
Aluminum steel and aluminium strip are bonded to core by S5, the first bonding head bonding camera identification bonding localization region, the first bonding head
Piece and lead-foot-line；
After the completion of S6, the first bonding head, the bond area of the second bonding head, camera identification keyboard area, second are moved to
Aluminum steel and aluminium strip are bonded to chip and lead-foot-line by bonding head.
The technical principle of the present invention is described above in association with specific embodiment.These descriptions are intended merely to explain the present invention's
Principle, and limiting the scope of the invention can not be construed in any way.Based on explanation herein, the technology of this area
Personnel, which would not require any inventive effort, can associate other embodiments of the present invention, and these modes are fallen within
Within protection scope of the present invention.
Claims (8)
1. full-automatic bonding die bonding apparatus, including:
Feeding portion：Feeding portion is located at the side of equipment, including transports lead to the material carrier platform of pickup position, and the feeding portion is used to pick up
Lead is taken to push platform to feeding；
Trucking department：It is connected with feeding portion, including servomotor drives the clamping jaw of guide rail leading screw, for transporting lead to for tin shaping
Area；
For tin shaping portion：Including for smooth tin layers or tin paste layer shaping head；
Recognize location division：Camera including gathering picture data；
Chip XY platform parts：Including X to servomotor guide rail leading screw and Y-direction servomotor guide rail leading screw, it is fixed to be recognized according to camera
Position data are used to chip on wafer being moved to take-off location；
Chip pickup section：Including the pick-up head driven from X to servomotor guide rail leading screw and Z-direction servomotor guide rail leading screw, institute
Stating pick-up head includes being drawn to the vacuum slot that chip is placed into lead welding position from the pickup；
It is bonded conveying unit：Including cable guide, for transporting the lead of viscous complete chip to the first bonding head position；
It is bonded camera location division：Welding template data is read, for ultra-sonic welded positioning；
Bonding head：Bonding head Z-direction and the first bonding head from R to motion and the second bonding head are driven including servomotor, in addition to
Ultrasonic bond device for aluminium wire lead to be bonded to terminal pin and chip bonding pad；
Blanking portion：Positioned at the equipment opposite side relative with the feeding portion, including some magazines, the blanking portion is used to complete
The lead of bonding is transported in magazine automatically, the magazine after filling is unloaded automatically, and replace an empty magazine；
Wherein, the equipment also includes the track in connection feeding portion and blanking portion, shows in the camera and collects picture data
The first display screen and the communication connection of bonding camera location division second display screen, and operation identification location division and bonding camera determine
First operating desk and the second operating desk in position portion.
2. full-automatic bonding die bonding apparatus according to claim 1, it is characterised in that the feeding portion is inhaled by vacuum
Disk is drawn or the mode of finger cylinder gripping picks up lead to feeding push platform.
3. full-automatic bonding die bonding apparatus according to claim 1, it is characterised in that the camera of identification location division is collected
Picture data, and upload to dataphone module.
4. full-automatic bonding die bonding apparatus according to claim 1, it is characterised in that ultrasonic bond device is occurred by ultrasound
Device, PZT (piezoelectric transducer), ultrasonic transformer and bonding tool composition.
5. full-automatic bonding die bonding apparatus according to claim 1, it is characterised in that the pick-up head of the chip pickup section
Vacuum slot including absorption chip, the digital flowmeter for detecting pick-up situation.
6. a kind of bonding die bonding method based on equipment, including：
Step 1: wafer automatic spread sheet in chip XY platform parts；
Step 2: for tin shaping portion to fuse framework for one kind in slicken solder or point tin cream, shaping head is whole according to chip form
Shape；
Step 3: positioning XY platform chips, the lead of the chip that pick-up head pickup camera is navigated to automatic charging by camera
On framework solder；
Step 4: bonding die system and bonding system on-line communication, the lead frame that bonding die is completed run to bonding orbit area；
Step 5: aluminum steel and aluminium strip are bonded to core by the first bonding head bonding camera identification bonding localization region, the first bonding head
Piece and lead-foot-line；
Step 6: after the completion of the first bonding head, being moved to the bond area of the second bonding head, camera identification keyboard area, second
Aluminum steel and aluminium strip are bonded to chip and lead-foot-line by bonding head.
7. bonding die bonding method as claimed in claim 6, it is characterised in that in step 3, servomotor cam driven thimble
The chip that jack-up is had good positioning, X drives pick-up head to servomotor guide rail leading screw and Z-direction servomotor guide rail leading screw, and it is fixed to move to
The chip position that position is arrived, is drawn to chip with the vacuum slot of pick-up head and is placed into lead welding position, examined with digital flowmeter
Pick-up situation is surveyed, chip is welded to lead frame.
8. bonding die bonding method as claimed in claim 6, it is characterised in that the first bonding head drives bonding head by servomotor
Z-direction and R fill ultrasonic bond device, ultrasonic bond step is as follows to motion on bonding head：
The sinusoidal power signal that ultrasound circuitry is produced is converted into mechanical shock by step 11, the piezoelectric ceramics of ultrasonic bond device
Can, vibrations act on working interface through transmission amplification and after converging；
Step 12, the heat for carrying out friction generation through the aluminum steel and film of chopper using ultrasonic mechanical vibration drive at normal temperatures,
Aluminium wire lead is bonded to terminal pin and chip bonding pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710259766.5A CN106981434B (en) | 2017-04-19 | 2017-04-19 | Full-automatic adhesive sheet bonding equipment and adhesive sheet bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710259766.5A CN106981434B (en) | 2017-04-19 | 2017-04-19 | Full-automatic adhesive sheet bonding equipment and adhesive sheet bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106981434A true CN106981434A (en) | 2017-07-25 |
| CN106981434B CN106981434B (en) | 2023-06-23 |
Family
ID=59345655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710259766.5A Active CN106981434B (en) | 2017-04-19 | 2017-04-19 | Full-automatic adhesive sheet bonding equipment and adhesive sheet bonding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106981434B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109132578A (en) * | 2018-10-12 | 2019-01-04 | 宁波尚进自动化科技有限公司 | Recycle stock conveyer system |
| CN109256352A (en) * | 2018-10-15 | 2019-01-22 | 甄建文 | Chip hot melt, welding sealing machine |
| CN110085543A (en) * | 2019-06-04 | 2019-08-02 | 常州美索虹铭玻璃有限公司 | A kind of automatic bonder of power semiconductor and its die bond technique |
| CN113517212A (en) * | 2021-06-23 | 2021-10-19 | 四川通妙科技有限公司 | Lead frame is with gluing core device |
| CN114242623A (en) * | 2021-12-15 | 2022-03-25 | 江苏友润微电子有限公司 | Eutectic track temperature control device of integrated circuit chip packaging die bonder |
| CN115533294A (en) * | 2022-12-05 | 2022-12-30 | 宁波尚进自动化科技有限公司 | BTO automatic adjusting system and method of lead bonding machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110215134A1 (en) * | 2010-03-04 | 2011-09-08 | Sim Ah Yoong | Rotary die bonding apparatus and methodology thereof |
| WO2015072593A1 (en) * | 2013-11-14 | 2015-05-21 | (주)정원기술 | Chip supply apparatus of laser chip bonding machine |
| CN105070670A (en) * | 2015-07-17 | 2015-11-18 | 北京中电科电子装备有限公司 | Bonding head device and chip packaging device |
| US20160079199A1 (en) * | 2014-09-16 | 2016-03-17 | Seung-dae SEOK | Apparatus for bonding semiconductor chips |
| CN205255159U (en) * | 2015-12-29 | 2016-05-25 | 深圳市奥赛瑞科技有限公司 | Wainscot component automatic molding mould equipment of binding foot |
-
2017
- 2017-04-19 CN CN201710259766.5A patent/CN106981434B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110215134A1 (en) * | 2010-03-04 | 2011-09-08 | Sim Ah Yoong | Rotary die bonding apparatus and methodology thereof |
| WO2015072593A1 (en) * | 2013-11-14 | 2015-05-21 | (주)정원기술 | Chip supply apparatus of laser chip bonding machine |
| US20160079199A1 (en) * | 2014-09-16 | 2016-03-17 | Seung-dae SEOK | Apparatus for bonding semiconductor chips |
| CN105070670A (en) * | 2015-07-17 | 2015-11-18 | 北京中电科电子装备有限公司 | Bonding head device and chip packaging device |
| CN205255159U (en) * | 2015-12-29 | 2016-05-25 | 深圳市奥赛瑞科技有限公司 | Wainscot component automatic molding mould equipment of binding foot |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109132578A (en) * | 2018-10-12 | 2019-01-04 | 宁波尚进自动化科技有限公司 | Recycle stock conveyer system |
| CN109256352A (en) * | 2018-10-15 | 2019-01-22 | 甄建文 | Chip hot melt, welding sealing machine |
| CN109256352B (en) * | 2018-10-15 | 2021-10-08 | 深圳成为控股有限公司 | Chip hot melting, welding packaging machine |
| CN110085543A (en) * | 2019-06-04 | 2019-08-02 | 常州美索虹铭玻璃有限公司 | A kind of automatic bonder of power semiconductor and its die bond technique |
| CN113517212A (en) * | 2021-06-23 | 2021-10-19 | 四川通妙科技有限公司 | Lead frame is with gluing core device |
| CN113517212B (en) * | 2021-06-23 | 2021-11-19 | 四川通妙科技有限公司 | Lead frame is with gluing core device |
| CN114242623A (en) * | 2021-12-15 | 2022-03-25 | 江苏友润微电子有限公司 | Eutectic track temperature control device of integrated circuit chip packaging die bonder |
| CN114242623B (en) * | 2021-12-15 | 2024-10-11 | 江苏友润微电子有限公司 | Eutectic orbit temperature control device of chip-on-chip die bonder |
| CN115533294A (en) * | 2022-12-05 | 2022-12-30 | 宁波尚进自动化科技有限公司 | BTO automatic adjusting system and method of lead bonding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106981434B (en) | 2023-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106981434A (en) | Full-automatic bonding die bonding apparatus and bonding die bonding method | |
| CN104701199B (en) | A kind of flip-chip bonding apparatus | |
| CN206657800U (en) | Full-automatic bonding die bonding apparatus | |
| CN106373914A (en) | Chip bonding device | |
| US8196798B2 (en) | Solar substrate ribbon bonding system | |
| CN102074559A (en) | SiP (Session Initiation Protocol) system integrated-level IC (Integrated Circuit) chip packaging part and manufacturing method thereof | |
| CN101527271A (en) | Chip packaging method using conical bonding pad for thermosonic flip-chip bonding | |
| JPH11340249A (en) | Resin sealing semiconductor device and its manufacture | |
| WO2012068763A1 (en) | Gird-array ic chip package without carrier and manufacturing method thereof | |
| CN212412015U (en) | Double-chip die bonder | |
| CN103192188B (en) | A kind of packaging machine of double-interface card and method for packing | |
| CN107146779A (en) | The encapsulating structure and method for packing of fingerprint recognition chip | |
| CN108886002A (en) | Chip encapsulating device and its method | |
| CN102044517A (en) | Super-high-power IC chip package and production method thereof | |
| CN112967964A (en) | Automatic intelligent power module production line | |
| US6086641A (en) | Die bonder for a semiconductor producing apparatus | |
| CN208796987U (en) | A kind of lead frame and its ultrathin small shape flip-chip packaged part | |
| CN104636793A (en) | Intelligent card and method for manufacturing same | |
| CN217667093U (en) | Hot-press welding device applied to electrical connection of high-power chip | |
| CN101083217A (en) | Thermal-acoustic flip-chip bonding experimental bench | |
| Massa et al. | Process development for flip chip bonding with different bump compositions | |
| CN209206764U (en) | A kind of overlay film preformed soldering | |
| CN214848550U (en) | Automatic intelligent power module production line | |
| JP2003303845A (en) | Semiconductor device and wire bonding method | |
| CN208078010U (en) | LED chip eutectic welder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230414 Address after: No.15, eco industrial park, Rongxin Road, rongjiawan Town, Yueyang County, Yueyang City, Hunan Province, 414000 Applicant after: Hunan aosairui Intelligent Technology Co.,Ltd. Address before: 518000, 4th Floor, Building 11, Honglong Science and Technology Industrial Park, Tangtou Avenue, Langxin Community, Shiyan Street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN AOSAIRUI TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |