CN112967964A - Automatic intelligent power module production line - Google Patents
Automatic intelligent power module production line Download PDFInfo
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- CN112967964A CN112967964A CN202110354676.0A CN202110354676A CN112967964A CN 112967964 A CN112967964 A CN 112967964A CN 202110354676 A CN202110354676 A CN 202110354676A CN 112967964 A CN112967964 A CN 112967964A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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Abstract
The invention discloses an automatic intelligent power module production line which comprises a raw material pretreatment equipment set, at least one first processing equipment line, an automatic chip mounter, a reflow oven and at least one second processing equipment line, wherein the raw material pretreatment equipment set comprises a plurality of groups of raw material pretreatment equipment; the raw material pretreatment equipment set comprises substrate feeding equipment, cleaning equipment, a substrate conveying device and a first conveying device; the first processing equipment line comprises first substrate caching equipment, solder paste printing equipment/dispensing equipment, first carrier conversion equipment and an automatic die bonding process group, wherein the automatic die bonding process group is connected with an automatic chip mounter through a conveying rail, the automatic chip mounter is connected with a reflow oven through the conveying rail, and a second conveying device is arranged between the cleaning equipment and the first substrate caching equipment; the second processing equipment line comprises second carrier conversion equipment, rosin cleaning equipment, third carrier conversion equipment and a bonding process group, wherein the second carrier conversion equipment is connected with the reflow oven through a conveying track. According to the technical scheme, the labor cost is reduced, and the production efficiency of the intelligent power module is improved.
Description
Technical Field
The invention relates to the field of intelligent power module production equipment, in particular to an automatic intelligent power module production line.
Background
The intelligent power module has the advantages of high current density, low saturation voltage and high voltage resistance of the high-power transistor, and the advantages of high input impedance, high switching frequency and low driving power of the field effect transistor. And logic, control, detection and protection circuits are integrated in the intelligent power module, so that the intelligent power module is convenient to use, the size and development time of the system are reduced, the reliability of the system is greatly enhanced, and the intelligent power module is more and more widely applied to the electronic field. At present, each process of the production line of the intelligent power module is independent, materials are conveyed and transported through operators among all process devices, a large amount of labor cost is needed, and the production efficiency is not high.
Disclosure of Invention
The invention mainly aims to provide an automatic intelligent power module production line, aiming at reducing labor cost and improving the production efficiency of intelligent power modules.
In order to achieve the purpose, the automatic intelligent power module production line provided by the invention comprises a raw material pretreatment equipment set, at least one first processing equipment line, an automatic chip mounter, a reflow oven and at least one second processing equipment line;
the raw material pretreatment equipment set comprises substrate feeding equipment, cleaning equipment and a substrate conveying device for conveying a substrate raw material to the substrate feeding equipment, wherein a first conveying device is arranged between the substrate feeding equipment and the cleaning equipment and is used for conveying the substrate material treated by the substrate feeding equipment to the cleaning equipment;
the first processing equipment line comprises a first substrate cache device, a solder paste printing device/dispensing device, a first carrier conversion device and an automatic die bonding process group which are sequentially connected through a conveying track, the automatic die bonding process group is connected with the automatic chip mounter through the conveying track, the automatic chip mounter is connected with a backflow inlet of the backflow furnace through the conveying track, a second conveying device is arranged between the cleaning device and the first substrate cache device, and the second conveying device is used for conveying substrate materials cleaned by the cleaning device to the first substrate cache device;
the second processing equipment line comprises a second carrier conversion device, a rosin cleaning device, a third carrier conversion device and a bonding process group which are connected sequentially through a conveying track, and the second carrier conversion device is connected with the backflow outlet of the backflow furnace through the conveying track.
Preferably, the automatic die bonding process group comprises a plurality of automatic die bonding devices sequentially arranged between the first carrier conversion device and the automatic chip mounter, and each automatic die bonding device is sequentially connected through a conveying rail.
Preferably, the first processing equipment line further comprises a passage conveying rail arranged between the automatic die bonding process group and the automatic chip mounter, and the automatic die bonding process group is connected with the automatic chip mounter through the passage conveying rail after passing through the passage conveying rail.
Preferably, the second processing equipment line further includes a second substrate buffer device disposed between the third carrier converting device and the bonding process group, the third carrier converting device is connected to the second substrate buffer device through a conveying track, the second substrate buffer device is connected to the bonding process group through a conveying track, and the second substrate buffer device is configured to buffer the print carriers with the products conveyed by the third carrier converting device.
Preferably, the bonding process group includes at least one first bonding device for bonding the metal wire in the first diameter range, at least one second bonding device for bonding the metal wire in the second diameter range, and a bonding detection device, the first bonding devices are sequentially arranged, the second bonding devices are sequentially arranged behind the first bonding devices, and the bonding detection device is arranged behind the second bonding devices; the feeding end of each first bonding device and the feeding end of each second bonding device are respectively provided with a first material conveying track, two adjacent first material conveying tracks are connected through a second material conveying track, and the bonding detection device is connected with the nearest second bonding device through the conveying tracks.
Preferably, the automatic intelligent power module production line further comprises a first combined conveying track and a second combined conveying track, and the automatic die bonding process group of each first processing equipment line is connected with the automatic die bonder through the first combined conveying track after passing through the conveying tracks respectively; and after the backflow outlet of the backflow furnace passes through the second combined conveying track, the backflow outlet of the backflow furnace is respectively connected with the second carrier conversion equipment of each second processing equipment line through the conveying track.
Preferably, the automatic intelligent power module production line further comprises a first combining machine and a second combining machine, wherein the first combining machine is correspondingly arranged at a reflow inlet of the reflow oven and is used for combining the reflow carriers conveyed by the automatic chip mounter into a specific carrier; the second combination machine is correspondingly arranged at a backflow outlet of the backflow furnace and is used for disassembling the backflow carrier in the specific carrier.
Preferably, the reflow outlet of the reflow carrier is further provided with a reflow detection device for detecting the soldering quality of the components on the reflowed substrate.
Preferably, the automatic intelligent power module production line further comprises a first cooling fin feeding device, a second cooling fin feeding device, a first soft solder die bonding device, a second soft solder die bonding device, a third soft solder die bonding device, a first die bonding detection device, a second die bonding detection device, a merging conveying platform and a material pushing platform, the first cooling fin feeding device, the first soft solder die bonding device, the second soft solder die bonding device, the first die bonding detection device and the combined conveying platform are sequentially connected through a conveying track, the second heat sink feeding device, the third soft solder die bonding device, the second die bonding detection device and the combined conveying platform are connected in sequence through a conveying track, the combined conveying platform is butted with the automatic chip mounter through the material pushing platform; the combined conveying platform is used for combining and conveying the materials conveyed by the first die bonding detection equipment and the second die bonding detection equipment to the material pushing platform, and the material pushing platform is used for pushing the materials conveyed by the combined conveying platform to a patch identification position of the automatic chip mounter.
Preferably, the automatic intelligent power module production line further comprises pre-baking equipment and at least one third processing equipment line, wherein the third processing equipment line comprises an injection molding machine, post-curing equipment, laser marking equipment, rib cutting forming equipment and electrical parameter testing equipment which are sequentially connected through a conveying track; a third conveying device is arranged between the bonding process group and the pre-baking equipment and is used for conveying the products output by the bonding process group to the pre-baking equipment; and a fourth conveying device is arranged between the pre-baking equipment and the injection molding machine and is used for conveying the product dried by the pre-baking equipment to the injection molding machine.
According to the technical scheme, all the procedures of the previous procedure for manufacturing the intelligent power module are automatically conveyed and connected, manual operation is not needed, the labor cost is reduced, the process stability is better, and the reliability of the product is improved; and the product materials among each process are automatically conveyed, and compared with manual carrying, the production efficiency of the intelligent power module is greatly improved.
Drawings
FIG. 1 is a schematic diagram of an automated intelligent power module production line according to a preferred embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
The invention provides an automatic intelligent power module production line which is used for producing intelligent power modules.
Referring to fig. 1, in the present embodiment, the automated intelligent power module production line includes a raw material pre-processing equipment group (not numbered), at least one first processing equipment line X (two lines are illustrated in the figure), an automatic chip mounter W9, a reflow oven W11, and at least one second processing equipment line Y (two lines are illustrated in the figure).
The raw material pretreatment equipment set comprises a substrate conveying device (not shown), a substrate loading device W1 and a cleaning device W2(plasma cleaning device or ultrasonic cleaning device), a first conveying device (not shown) is arranged between the substrate loading device W1 and the cleaning device W2, the substrate conveying device is used for conveying a substrate raw material (an aluminum substrate with vacuum packages) to the substrate loading device W1, and the first conveying device is used for conveying the substrate material processed by the substrate loading device W1 to the cleaning device W2. The processing operation flow of the raw material pretreatment equipment group is as follows: the substrate conveying device conveys the aluminum substrate raw materials with vacuum packages to the substrate feeding device W1, the substrate feeding device W1 carries out vacuum package dismantling treatment on the aluminum substrate raw materials with vacuum packages conveyed by the substrate conveying device, the aluminum substrates with the vacuum packages dismantled are converted into corresponding printing carriers, then the substrates with the printing carriers are stored in material boxes, the first conveying device receives the material boxes filled with the substrates with the printing carriers from the substrate feeding device W1, the material boxes are conveyed to the cleaning device W2, and the cleaning device W2 carries out plasma cleaning or ultrasonic cleaning on the substrates in the material boxes.
The first processing equipment line X comprises a first substrate cache device W3, a solder paste printing device W4 (which can be replaced by a dispensing device), a first carrier conversion device W5 and an automatic die bonding process group (not numbered) which are sequentially connected through a conveying track, the automatic die bonding process group is connected with an automatic chip mounter W9 through the conveying track, the automatic chip mounter W9 is connected with a backflow inlet of a backflow furnace W11 through the conveying track, a second conveying device (not shown) is arranged between the cleaning device W2 and the first substrate cache device W3, and the second conveying device is used for conveying substrate materials cleaned by the cleaning device W2 to the first substrate cache device W3. The processing operation flow of the first processing equipment line X is as follows: the second transport device receives the cassette loaded with the substrate with the print carrier after the cleaning process from the cleaning device W2 and transports the cassette to the first substrate buffer device W3; the first substrate caching device W3 automatically pushes out the substrates with the printing carriers in the material boxes one by one and conveys the substrates to the paste washing printing device, the solder paste printing device W4 pushes the substrates with the printing carriers sent by the first substrate caching device W3 to a working area, solder paste is printed on a component mounting position (namely a bonding pad) through a steel mesh, and then the solder paste printing device W4 conveys the printed printing carriers with the substrates to the first carrier conversion device W5 through a conveying track; the first carrier conversion equipment W5 takes out the substrate in the printing carrier and converts the substrate into a reflow carrier, places the lead frame into a mounting position, and conveys the substrate with the reflow carrier to the automatic die bonding process group through a conveying track; and the automatic die bonding process group carries out component bonding treatment on the substrate in the reflow carrier, and then conveys the substrate with the reflow carrier after the component bonding treatment to an automatic chip mounter W9 through a conveying rail for chip bonding treatment.
The automatic chip mounter W9 receives the substrate with the reflow carrier conveyed by the automatic die bonding process group, mounts corresponding chip resistors, chip capacitors and other components on corresponding mounting positions of the substrate, after mounting processing is finished, the automatic chip mounter W9 conveys the substrate with the reflow carrier to a reflow inlet of a reflow oven W11 through a conveying track, the reflow oven W11 conveys the substrate with the reflow carrier into a reflow oven W11 to weld the components on the substrate, and the substrate with the reflow carrier is conveyed out from a reflow outlet of a reflow oven W11.
The second processing equipment line Y comprises a second carrier conversion equipment W15, a rosin cleaning equipment W16, a third carrier conversion equipment W17 and a bonding process group J which are sequentially connected through a conveying rail, and the second carrier conversion equipment W15 is connected with a backflow outlet of the backflow furnace W11 through the conveying rail. The processing operation flow of the second processing equipment line Y is as follows: the substrate with the reflow carrier from the outlet of the reflow oven W11 is conveyed to a second carrier conversion device W15 through a conveying rail, the second carrier conversion device W15 converts the substrate in the reflow carrier into a cleaning carrier, and the substrate with the cleaning carrier is conveyed to a rosin cleaning device W16 through the conveying rail after conversion; the rosin cleaning device W16 cleans the substrate with the cleaning carrier through rosin, and conveys the cleaned substrate with the cleaning carrier to the third carrier conversion device W17 through a conveying track; the third carrier switching device W17 switches the conveyed substrate with the cleaning carrier into the printing carrier, and conveys the substrate with the printing carrier to the bonding process group J through the conveying rail after switching, the bonding process group J performs bonding metal wire processing on the conveyed substrate with the printing carrier, and after bonding, the previous process of manufacturing the intelligent power module is completed, and a semi-finished product is obtained.
In this embodiment, the substrate transportation device, the first transportation device, and the second transportation device may be AGV smart carts, or may be other transportation devices or transportation structures.
According to the automatic intelligent power module production line, all the procedures of the previous procedure for manufacturing the intelligent power module are automatically conveyed and connected, manual operation is not needed, the labor cost is reduced, the process stability is better, and the reliability of the product is improved; and the product materials among each process are automatically conveyed, and compared with manual carrying, the production efficiency of the intelligent power module is greatly improved.
Further, the automatic intelligent power module production line of the embodiment further includes a pre-baking device W34 and at least one third processing device line Z (two lines are taken as an example in the figure), and the third processing device line Z includes an injection molding machine W35, a post-curing device W36, a laser marking device W37, a tendon-cutting forming device W38 and an electrical parameter testing device W39 which are connected in sequence through a conveying track; a third conveying device S is arranged between the bonding process group J and the pre-baking device W34, and is used for conveying products output by the bonding process group J to the pre-baking device W34; a fourth conveying device (not shown) is arranged between the pre-baking device W34 and the injection molding machine W35, and the fourth conveying device is used for conveying the products dried by the pre-baking device W34 to the injection molding machine W35.
The semi-finished products processed by the bonding process group J can be stored in the material box, the material box with the semi-finished products at the bonding process group J is conveyed to the pre-baking equipment W34 by the third conveying device S, and certainly, because the former process and the latter process of the intelligent power module manufacturing are respectively in the environment of a ten-thousand clean room and a hundred-thousand clean room, dust can be removed by the cargo shower in the conveying process of the third conveying device S; and the pre-baking device W34 is used for baking the conveyed material box (baking for 15min at 105 ℃ under the nitrogen protection environment), drying residual moisture on the semi-finished product after rosin cleaning and eliminating stress generated by bonding. The processing operation flow of the third processing equipment line Z is as follows: the third conveying device S takes the roasted material box from the pre-roasting device W34 and conveys the material box to an injection molding machine W35; the injection molding machine W35 is used for packaging the semi-finished products in the magazine, stacking the packaged products through a cartridge clip (or other specific carriers), and conveying the packaged and stacked products to post-curing equipment W36 through a conveying track; the post-curing equipment W36 is used for baking the conveyed products (baking at the temperature of 170-180 ℃ for 240min under the nitrogen protection environment) to eliminate the stress generated in the packaged products, and after baking treatment, the post-curing equipment W36 is used for taking out the superposed products one by one and conveying the superposed products to the laser marking equipment W37 through a conveying track; marking the conveyed product by using a laser marking device W37 (marking product information such as product model, logo, batch number and the like), and conveying the marked product to a bar cutting forming device W38 by using a laser marking device W37 through a conveying track; and the bar cutting forming equipment W38 performs bar cutting treatment on the conveyed product, cuts off the lengths of the false pins, the reinforcing ribs and the redundant pins and shapes the false pins, the reinforcing ribs and the redundant pins into a required finished product, the finished product after the bar cutting treatment is conveyed to the electric parameter testing equipment W39 through a conveying rail to perform electric performance testing, and the finished product is obtained after the electric performance testing. And packaging the finished product obtained after the test by packaging equipment, and then warehousing the packaged finished product by warehousing transportation equipment.
In this embodiment, the substrate transportation device, the third transportation device S, and the fourth transportation device may be AGV smart carts, or may be other transportation devices or transportation structures, and the fourth transportation device may also be a robot arm.
The automatic intelligent power module production line of this embodiment is automatic transport connection between all processes of the preceding process that intelligent power module made and the next process, and is full automation, need not manual operation, and is with low costs, and process stability is good, has improved product reliability, and intelligent power module's production efficiency promotes by a wide margin. In addition, in the automatic intelligent power module production line of the embodiment, each processing equipment line shares the cleaning equipment W2, the automatic chip mounter W9, the reflow oven W11 and the pre-baking equipment W34, so that the equipment cost is reduced.
Further, in this embodiment, the automatic die bonding process group includes a plurality of automatic die bonding apparatuses W6 sequentially arranged between the first carrier switching apparatus W5 and the automatic die bonder W9, each automatic die bonding apparatus W6 is connected sequentially through a conveying rail, and each automatic die bonding apparatus W6 is used for respectively bonding different components. For the manufacture of intelligent power modules of different models or different models, the number of the automatic die bonding devices W6 included in the automatic die bonding process group may be different; for example, when a certain smart power module is manufactured, the die bonder process group includes three die bonder apparatuses W6, where a first die bonder apparatus W6 is used for bonding an IGBT (insulated gate bipolar transistor), a second die bonder apparatus W6 is used for bonding an FRD (fast recovery diode), and a third die bonder apparatus W6 is used for bonding an IC.
Further, in this embodiment, the first processing equipment line X further includes a passageway conveying track W7 disposed between the automatic die bonding process group and the automatic chip mounter W9, the automatic die bonding process group passes through the passageway conveying track W7 first and then is connected to the automatic chip mounter W9 through the conveying track, and by setting the passageway conveying track W7, when the material on the automatic chip mounter W9 is abnormal, the maintenance personnel can conveniently operate back and forth through the passageway conveying track W7, and the fault maintenance operation is facilitated.
Further, in this embodiment, the second processing facility line Y further includes a second substrate buffer device W18 disposed between the third carrier transferring device W17 and the bonding process group J, the third carrier transferring device W17 is connected to the second substrate buffer device W18 via a conveying track, the second substrate buffer device W18 is connected to the bonding process group J via a conveying track, and the second substrate buffer device W18 is configured to buffer the print carriers with the products conveyed by the third carrier transferring device W17. Since the bonding process of the bonding process group J generally requires a long time, the substrate with the print carrier is buffered by providing the second substrate buffer device W18 before the bonding process group J, which can balance the problem of a large difference in throughput before and after the second substrate buffer device W18.
Further, in the present embodiment, the bonding process group J includes at least one first bonding apparatus W20 for bonding the metal wires of the first diameter range, at least one second bonding apparatus W21 for bonding the metal wires of the second diameter range, and a bonding detection apparatus W22, the first bonding apparatuses W20 are arranged in series, the second bonding apparatuses W21 are arranged in series behind the first bonding apparatuses W20, and the bonding detection apparatus W22 is arranged behind the second bonding apparatus W21; the feeding end of each first bonding device W20 and the feeding end of each second bonding device W21 are respectively provided with a first material conveying track W19, two adjacent first material conveying tracks W19 are connected through second material conveying tracks W24, and the bonding detection device W22 is connected with the nearest second bonding device W21 through the conveying tracks. The bonding inspection apparatus W22 may employ an optical inspection apparatus to bond AOI. The first bonding device W20 is used for bonding thick and medium metal wires, the second bonding device W21 is used for bonding thin metal wires, the metal wires can be made of aluminum, copper and gold, the wire diameter of the thick metal wire is 300-.
In this embodiment, the operation mode of the bonding process group J is described by taking three first bonding apparatuses W20 and two second bonding apparatuses W21 as examples; the first material conveying track W19 can convey to the first bonding device W20 or the second bonding device W21, and also can convey to the second material conveying track W24 connected with the first material conveying track W19; when the first bonding device W20 is in operation, the product is transported to the second feeding track W24 through the first feeding track W19 in front of the first bonding device W20 and then to the second feeding track W19 in front of the second bonding device W20 and then enters the second bonding device W20, when the first bonding device W20 completes bonding of a product, the product is transported to the first feeding track W19 in front of the second bonding device W20 and then to the first feeding track W19 in front of the first bonding device W21 through the second feeding track W24 and then to the first bonding device W21 for bonding processing, when the first bonding device W21 completes bonding operation, the bonded product is transported to the first feeding track W19 in front of the second bonding device W21 and then to the second feeding track W24 and then to the bonding track W22, and then reaches the bonding detection apparatus W22 for detection. When the front first bonding device W20 performs bonding operation, the product to be bonded conveyed by the second material conveying track W24 directly crosses over the front first bonding device W20 during bonding operation, and enters the rear first bonding device W20 for bonding, so as to ensure that each first bonding device W20 can perform bonding operation simultaneously, and each second bonding device W21 is also in the same manner, so that the capacity of the bonding process group J is improved.
Further, in this embodiment, the automatic intelligent power module production line further includes a first merged conveying track W8 and a second merged conveying track W14, and the automatic die bonding process groups of each first processing equipment line X are respectively connected to the automatic chip mounter W9 through the first merged conveying track W8 after passing through the conveying tracks; the reflow outlet of the reflow oven W11 passes through the second merging conveying track W14 and then is connected to the second carrier conversion equipment W15 of each second processing equipment line Y through the conveying tracks, respectively. The first merging conveying track W8 is used for merging and conveying the substrates with the reflow carriers conveyed by the automatic die bonding process group of each first processing equipment line X to the automatic chip mounter W9; the second combined conveying track W14 is used for shunting the products with the reflow carriers conveyed by the reflow oven W11 onto the conveying tracks of the second processing equipment lines Y to be respectively conveyed to the second carrier converting equipment W15 of the second processing equipment lines Y through the conveying tracks.
Further, in this embodiment, the automated smart power module production line further includes a first assembly machine W10 and a second assembly machine W12, the first assembly machine W10 is correspondingly disposed at the reflow entrance of the reflow oven W11, and is used for assembling the reflow carriers conveyed by the automatic placement machine W9 into a specific carrier, and the specific carrier can be loaded with a plurality of reflow carriers, so that the reflow oven W11 can solder the substrates in the reflow carriers at one time, and the productivity of the reflow oven W11 is improved. The second combiner W12 is correspondingly disposed at the reflow outlet of the reflow oven W11, and the second combiner W12 is used for separating the reflow carriers in the specific carriers.
Further, in this embodiment, the reflow outlet of the reflow carrier is further provided with a reflow inspection apparatus W13 for inspecting the soldering quality of the components on the reflowed substrate, and the reflow inspection apparatus W13 may employ an optical inspection apparatus reflow AOI.
Further, in this embodiment, the automated intelligent power module production line further includes a first heat sink feeding device W25, a second heat sink feeding device W31, a first soft solder die bonding device W26, a second soft solder die bonding device W27, a third soft solder die bonding device W32, a first die bonding detection device W28, a second die bonding detection device W33, the combined conveying platform W29 and the material pushing platform W30 are connected in sequence by a conveying track, the first cooling fin feeding device W25, the first soft solder die bonding device W26, the second soft solder die bonding device W27, the first die bonding detection device W28 and the combined conveying platform W29 are connected in sequence by a conveying track, the second cooling fin feeding device W31, the third soft solder die bonding device W32, the second die bonding detection device W33 and the combined conveying platform W29 are connected in sequence by a conveying track, the first die bonding detection device W28 and the second die bonding detection device W33 are connected in sequence, and the combined conveying platform W29 is in butt joint with the automatic chip mounter W9 through the material pushing platform W30. First cooling fin charging equipment W25 is used for getting up big fin (pasting IGBT + little FRD on the fin), second cooling fin charging equipment W31 is used for getting up little fin (the fin pastes big FRD), first soft solder solid brilliant equipment W26 is used for the IGBT solid crystal, second soft solder solid brilliant equipment W27 is used for little FRD solid crystal, third soft solder solid brilliant equipment W32 is used for big FRD solid crystal, first solid brilliant check out test set W28 and second solid brilliant check out test set W33 are used for detecting solid brilliant quality, first solid brilliant check out test set W28 and second solid brilliant check out test set W33 can adopt optical inspection equipment AOI. The combined conveying platform W29 is used for combining and conveying the materials conveyed by the first die bonding detection device W28 and the second die bonding detection device W33 to the material pushing platform W30, and the material pushing platform W30 is used for pushing the materials conveyed by the combined conveying platform W29 to the patch recognition position of the automatic chip mounter W9.
The automated intelligent power module production line of the invention can be applied to production integration: the system comprises a rectifier bridge, a Power Factor Correction (PFC) circuit, a fan IPM, a compressor IPM and a control unit MCU five-in-one high-integration intelligent power module; it can also be used for production integration: the system comprises a rectifier bridge, a Power Factor Correction (PFC) circuit, a fan IPM and a compressor IPM four-in-one high-integration intelligent power module; it can also be used for production integration: the intelligent power module comprises a rectifier bridge, a Power Factor Correction (PFC) circuit and a compressor IPM; it can also be used for production integration: the Power Factor Correction (PFC) circuit and the compressor IPM two-in-one intelligent power module; it can also be used to produce a single smart power module without integration.
The above description is only a part of or preferred embodiments of the present invention, and neither the text nor the drawings should be construed as limiting the scope of the present invention, and all equivalent structural changes, which are made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An automatic intelligent power module production line is characterized by comprising a raw material pretreatment equipment set, at least one first processing equipment line, an automatic chip mounter, a reflow furnace and at least one second processing equipment line;
the raw material pretreatment equipment set comprises substrate feeding equipment, cleaning equipment and a substrate conveying device for conveying a substrate raw material to the substrate feeding equipment, wherein a first conveying device is arranged between the substrate feeding equipment and the cleaning equipment and is used for conveying the substrate material treated by the substrate feeding equipment to the cleaning equipment;
the first processing equipment line comprises a first substrate cache device, a solder paste printing device/dispensing device, a first carrier conversion device and an automatic die bonding process group which are sequentially connected through a conveying track, the automatic die bonding process group is connected with the automatic chip mounter through the conveying track, the automatic chip mounter is connected with a backflow inlet of the backflow furnace through the conveying track, a second conveying device is arranged between the cleaning device and the first substrate cache device, and the second conveying device is used for conveying substrate materials cleaned by the cleaning device to the first substrate cache device;
the second processing equipment line comprises a second carrier conversion device, a rosin cleaning device, a third carrier conversion device and a bonding process group which are connected sequentially through a conveying track, and the second carrier conversion device is connected with the backflow outlet of the backflow furnace through the conveying track.
2. The automated intelligent power module production line of claim 1, wherein the automatic die attach process group comprises a plurality of automatic die attach apparatuses arranged in sequence between the first carrier transfer apparatus and the automatic placement machine, the plurality of automatic die attach apparatuses are respectively used for attaching different components to a substrate, and each automatic die attach apparatus is connected in sequence by a conveying track.
3. The automated intelligent power module production line of claim 1, wherein the first processing equipment line further comprises a aisle transfer track disposed between the die attach cluster and the automatic die bonder, the die attach cluster passing through the aisle transfer track before being connected to the automatic die bonder via the transfer track.
4. The automated smart power module manufacturing line of claim 1, wherein the second processing equipment line further comprises a second substrate buffer device disposed between the third carrier transferring device and the bonding process group, the third carrier transferring device is connected to the second substrate buffer device through a conveying track, the second substrate buffer device is connected to the bonding process group through a conveying track, and the second substrate buffer device is configured to buffer the print carriers with the products conveyed by the third carrier transferring device.
5. The automated intelligent power module production line of claim 1, wherein the bonding process group comprises at least one first bonding device for bonding a metal wire in a first wire diameter range, at least one second bonding device for bonding a metal wire in a second wire diameter range, and a bonding detection device, wherein the first bonding devices are arranged in sequence, the second bonding devices are arranged in sequence behind the first bonding devices, and the bonding detection device is arranged behind the second bonding devices; the feeding end of each first bonding device and the feeding end of each second bonding device are respectively provided with a first material conveying track, two adjacent first material conveying tracks are connected through a second material conveying track, and the bonding detection device is connected with the nearest second bonding device through the conveying tracks.
6. The automated intelligent power module production line of claim 1, further comprising a first merged conveying track and a second merged conveying track, wherein the automatic die bonding process group of each first processing equipment line is connected to the automatic die bonder through the first merged conveying track after passing through the conveying tracks respectively; and after the backflow outlet of the backflow furnace passes through the second combined conveying track, the backflow outlet of the backflow furnace is respectively connected with the second carrier conversion equipment of each second processing equipment line through the conveying track.
7. The automated smart power module manufacturing line of claim 1, further comprising a first assembling machine and a second assembling machine, wherein the first assembling machine is correspondingly disposed at a reflow entrance of the reflow oven, and is used for assembling the reflow carriers conveyed by the automatic placement machine into specific carriers; the second combination machine is correspondingly arranged at a backflow outlet of the backflow furnace and is used for disassembling the backflow carrier in the specific carrier.
8. The automated smart power module manufacturing line of claim 1, wherein the reflow outlet of the reflow carrier is further provided with a reflow inspection apparatus for inspecting the soldering quality of the components on the reflowed substrate.
9. The automated intelligent power module production line of any one of claims 1 to 8, further comprising a first heat sink feeding device, a second heat sink feeding device, a first soft solder die bonding device, a second soft solder die bonding device, a third soft solder die bonding device, a first die bonding detection device, a second die bonding detection device, a combined conveying platform and a material pushing platform, wherein the first heat sink feeding device, the first soft solder die bonding device, the second soft solder die bonding device, the first die bonding detection device and the combined conveying platform are sequentially connected by a conveying rail, the second heat sink feeding device, the third soft solder die bonding device, the second die bonding detection device and the combined conveying platform are sequentially connected by a conveying rail, the combined conveying platform is butted with the automatic chip mounter through the material pushing platform; the combined conveying platform is used for combining and conveying the materials conveyed by the first die bonding detection equipment and the second die bonding detection equipment to the material pushing platform, and the material pushing platform is used for pushing the materials conveyed by the combined conveying platform to a patch identification position of the automatic chip mounter.
10. The automated intelligent power module production line of any one of claims 1 to 8, further comprising a pre-bake device and at least one third processing device line, the third processing device line comprising an injection molding machine, a post-cure device, a laser marking device, a tendon-cutting forming device and an electrical parameter testing device connected in sequence by a conveying track; a third conveying device is arranged between the bonding process group and the pre-baking equipment and is used for conveying the products output by the bonding process group to the pre-baking equipment; and a fourth conveying device is arranged between the pre-baking equipment and the injection molding machine and is used for conveying the product dried by the pre-baking equipment to the injection molding machine.
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