CN116727797A - Semiconductor element welding equipment and welding method thereof - Google Patents
Semiconductor element welding equipment and welding method thereof Download PDFInfo
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- CN116727797A CN116727797A CN202310655326.7A CN202310655326A CN116727797A CN 116727797 A CN116727797 A CN 116727797A CN 202310655326 A CN202310655326 A CN 202310655326A CN 116727797 A CN116727797 A CN 116727797A
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- 238000003466 welding Methods 0.000 title claims abstract description 166
- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000007664 blowing Methods 0.000 claims description 8
- 238000005057 refrigeration Methods 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Resistance Welding (AREA)
Abstract
The invention discloses a semiconductor element welding device and a welding method thereof, wherein the device solves the problem that the welding temperature of the current device cannot be changed according to the different sizes of LED circuit boards, and comprises an operation table, wherein a welding assembly is arranged on the operation table and comprises a third mechanical arm, a first camera and a welding gun, the third mechanical arm is arranged on the operation table, the welding gun is arranged at one end of the third mechanical arm, the first camera is fixedly arranged at the top of the third mechanical arm, the temperature during welding can be controlled through the matched use of a device program and the welding gun, the welding temperature of the welding gun is changed through detecting and identifying welding materials selected by workers, and when welding operations with different production requirements are carried out, the welding of the welding gun is not required to be replaced additionally, so that the production procedures are reduced, the complexity of procedures is reduced, the consumption of tin bars is reduced, the production quality is ensured, and the production cost is reduced.
Description
Technical Field
The invention belongs to the technical direction of semiconductor light emitting, and particularly relates to semiconductor element welding equipment and a welding method thereof.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and the semiconductor is applied to the fields of integrated circuits, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a light emitting diode is a device manufactured by the semiconductor, and the semiconductor light emitting diode is a device used for producing LED indicator lamps and the like.
In the soldering tin in-process of semiconductor light emitting diode circuit board, current welding equipment's welder is mostly perpendicular angle with the operation panel, can't adjust, often can cause the phenomenon of rosin joint and unwelding in the welding process, current welding technique is generally manual work welding moreover, continuity when welding is relatively poor, semiconductor light emitting diode's welding efficiency has been reduced, can produce high temperature when welding, current device can't carry out effective cooling according to the height of temperature semiconductor light emitting diode, often need a plurality of staff to weld it respectively when facing not semiconductor light emitting diode of equidimension, welding efficiency has been reduced, the process is comparatively loaded down with trivial details.
Disclosure of Invention
The invention aims at solving the problems in the background technology by aiming at the prior device, namely semiconductor element welding equipment and a welding method thereof.
In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides a semiconductor element welding equipment and welding method thereof, includes welding set, operation panel, be provided with transportation subassembly on the operation panel, press from both sides and get subassembly, welding subassembly, refrigeration subassembly, discernment subassembly, transportation subassembly sets up in one side of operation panel, press from both sides and get the subassembly setting in the operation panel, be located transportation subassembly's one side, welding subassembly sets up in the operation panel, be located one side of welding subassembly, welding subassembly is including third arm, first camera, welder, the third arm sets up in one side of operation panel, welder sets up in the one end of third arm, first camera fixed mounting is at the top of third arm, be provided with first supporting seat, second supporting seat, welding table, collection frame on the operation panel, first supporting seat fixed mounting is in one side of operation panel, second supporting seat fixed mounting is in the opposite side of operation panel, the welding table sets up in the operation panel, collection frame is seted up in one end of operation panel.
The invention further discloses a conveying assembly, which comprises a first conveying belt, a semiconductor element support, a second conveying belt and a conveying plate, wherein the first conveying belt is arranged on a welding table and is positioned on one side of the welding table, the semiconductor element support array is arranged on the first conveying belt, a pressure sensor is arranged in the semiconductor element support, and the second conveying belt is arranged on the welding table and is positioned on the other side of the welding table.
The invention further discloses that the clamping assembly comprises a first mechanical arm, a first temperature sensor, a first mechanical arm, a second temperature sensor and a second mechanical arm, wherein the first mechanical arm and the second mechanical arm are fixedly arranged at the other end of the operation table, the second mechanical arm is positioned at one side of the first mechanical arm, the first mechanical arm is arranged at one end of the first mechanical arm, the second mechanical arm is arranged at one end of the second mechanical arm, the first temperature sensor is arranged on the first mechanical arm and positioned at one side of the first mechanical arm, and the second temperature sensor is arranged on the second mechanical arm and positioned at one side of the second mechanical arm.
The invention further discloses that the refrigeration assembly comprises a fourth mechanical arm, an air outlet pipe and a cold air pipe, wherein the fourth mechanical arm is arranged on the operating platform and positioned on the other side of the second supporting seat, the air outlet pipe is arranged at one end of the fourth mechanical arm, and the cold air pipe is arranged at one end of the fourth mechanical arm and positioned above the air outlet pipe.
The specific method comprises the following steps:
s1, when an equipment program detects that the pressure value is X1, the equipment program judges that the LED circuit board is a small circuit board;
s2, when the equipment program detects that the pressure value is X2, the equipment program judges that the LED circuit board is a medium-sized circuit board;
and S3, when the equipment program detects that the pressure value is X3, the equipment program judges that the LED circuit board is a large-sized circuit board, after the judgment is finished, the equipment program feeds signals back to the clamping assembly and the welding assembly, and then the equipment program controls the next operation.
The specific method comprises the following steps:
s1, when the equipment program detects that the pressure value fed back by the identification operation is X1, the equipment program controls the clamping values of the two groups of manipulators to be M3 (the LED circuit board is usually thinner, so that the maximum clamping value is adopted), the equipment program detects the feedback value of the LED circuit board, if N1 is not operated, if the feedback value is larger than the error value, the clamping value is controlled to be M2, the equipment program detects the feedback value of the LED circuit board again, if N1 is not operated, if the feedback value is still larger than the error value, the clamping value is controlled to be M1 (M1 is the minimum clamping value and the situation that the LED circuit board cannot be clamped does not occur);
s2, when the equipment program detects that the pressure value fed back by the identification operation is X2 and X3, the equipment program controls the clamping values of the two groups of manipulators to be M2, at the moment, the equipment program detects the feedback value of the LED circuit board, if the feedback value is N2, no operation is performed, if the feedback value is larger than the error value, the clamping value is controlled to be changed to be M1, at the moment, the feedback value is not required to be detected again, if the feedback value is smaller than the error value, the clamping value is controlled to be changed to be M3, and after the clamping operation is completed, the equipment program controls the next operation.
The specific method comprises the following steps:
s1, when an equipment program detects that a worker selects lead-free solder, the equipment program controls the welding temperature of a welding gun 411 to be T1, and the tin bar is heated and then welded on a welding spot;
s2, when the equipment program detects that the welding flux selected by the worker is lead-containing welding flux, the equipment program controls the welding temperature of the welding gun 411 to be T2, and the tin bar is heated and then welded on the welding spot;
s3, when a worker controls an equipment program to carry out the re-welding operation, the equipment program controls the welding temperature of the welding gun 411 to be T3 (the temperature is more than 350 ℃ and less than 380 ℃ and the lead-free solder needs to be higher in the re-welding process), the tin bar is heated and then welded on the welding spot, and the equipment program is controlled to carry out subsequent operation after the welding is completed.
The specific method comprises the following steps:
s1, when an equipment program detects that the values of two groups of temperature sensors are H1, the equipment program controls an electric valve of an air outlet pipe 52 to be opened, the air outlet quantity of the air outlet pipe 52 is V1, and air blowing and cooling are carried out on an LED circuit board after welding is finished;
s2, when the equipment program detects that the numerical values of the two groups of temperature sensors are H2, the equipment program controls the air outlet quantity of the air outlet pipe 52 to be V2, and the air outlet quantity is improved to cool the LED circuit board;
s3, when the equipment program detects that the values of the two groups of temperature sensors are H3, the equipment program controls the air outlet quantity of the air outlet pipe 52 to be V2, at the moment, the equipment program controls the blowing time of the air outlet pipe 52 to be Z1, and when Z1 reaches the rear, the equipment program controls the electric valve of the cold air pipe 53 to be opened, so that the phenomenon that welding spots of the LED circuit board fall off in a high temperature state due to sudden temperature drop is prevented, and cold air is sprayed out to cool the LED circuit board while air blowing and cooling.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the welding assembly comprises the third mechanical arm, the first camera and the welding gun, the third mechanical arm is arranged on one side of the operating platform, the welding gun is arranged at one end of the third mechanical arm, the first camera is fixedly arranged at the top of the third mechanical arm, the temperature during welding can be controlled through the cooperation of the equipment program and the welding gun, the welding temperature of the welding gun is changed through detecting and identifying the welding materials selected by a worker, and when the welding operation with different production requirements is carried out, the welding gun does not need to be replaced in addition, the production procedure is reduced, the complexity of the procedure is reduced, meanwhile, the consumption of tin bars is reduced, the production quality is ensured, and meanwhile, the production cost is reduced.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a transport assembly 2 of the present invention;
FIG. 3 is a schematic view of the clamping assembly 3 of the present invention;
FIG. 4 is a schematic view of a welding assembly 4 of the present invention;
FIG. 5 is a schematic view of area A of FIG. 4 in accordance with the present invention;
FIG. 6 is a schematic view of region B of FIG. 4 in accordance with the present invention;
FIG. 7 is a schematic view of region C of FIG. 3 in accordance with the present invention;
fig. 8 is a schematic view of the area D of fig. 3 in accordance with the present invention.
In the figure: 1. a welding device; 11. an operation table; 12. a first support base; 13. a second support base; 14. a welding table; 15. a collection frame;
2. a transport assembly; 21. a first conveyor belt; 211. a semiconductor element holder; 22. a second conveyor belt; 23. a transfer plate;
3. a clamping assembly; 31. a first mechanical arm; 311. a first temperature sensor; 312. a first manipulator; 32. a second mechanical arm; 321. a second temperature sensor; 322. a second manipulator;
4. welding the assembly; 41. a third mechanical arm; 411. a welding gun; 42. a first camera;
5. a refrigeration assembly; 51. a fourth mechanical arm; 52. an air outlet pipe; 53. a cold air pipe;
6. an identification component; 61. a second camera; 62. and a third camera.
Detailed Description
The technical scheme of the present invention is further described in non-limiting detail below with reference to the preferred embodiments and the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-8, the present invention provides the following technical solutions: a semiconductor element welding device and a welding method thereof, comprises a welding device 1 and an operation table 11, wherein a first supporting seat 12, a second supporting seat 13, a welding table 14 and a collecting frame 15 are arranged on the operation table 11;
the first supporting seat 12 is fixedly arranged on one side of the operation table 11 and used for placing the second camera 61, the second supporting seat 13 is fixedly arranged on the other side of the operation table 11 and used for placing the third camera 62, the welding table 14 is arranged on the operation table 11 and used for performing welding operation, and the collecting frame 15 is arranged at one end of the operation table 11 and used for collecting the welded LED circuit boards;
the operation table 11 is provided with a transportation assembly 2, a clamping assembly 3, a welding assembly 4, a refrigeration assembly 5 and an identification assembly 6;
the transport assembly 2 includes a first conveyor 21, a semiconductor element holder 211, a second conveyor 22, and a conveyor plate 23;
the first conveyor belt 21 is arranged on the welding table 14 and is positioned at one side of the welding table 14, two groups of fixed frames (not shown in the figure) are fixedly arranged at two sides of the first conveyor belt 21 and are fixedly arranged on the welding table 14 for placing the LED circuit board matched with equipment program transmission of the first conveyor belt 21, the semiconductor element support 211 is arranged on the first conveyor belt 21 and is used for placing the LED circuit board, a pressure sensor (not shown in the figure) is arranged in the semiconductor element support 211 and is used for detecting the weight of the placed LED circuit board matched with equipment program, the second conveyor belt 22 is arranged on the welding table 14 and is positioned at the other side of the welding table 14, two groups of fixed frames (not shown in the figure) are fixedly arranged at two sides of the second conveyor belt 22 and are fixedly arranged on the welding table 14 and are used for placing the LED circuit board matched with equipment program transmission of the second conveyor belt 22 and are finished;
the clamping assembly 3 comprises a first mechanical arm 31, a first temperature sensor 311, a first mechanical arm 312, a second mechanical arm 32, a second temperature sensor 321 and a second mechanical arm 322, wherein the first mechanical arm 31 and the second mechanical arm 32 are fixedly arranged at the other end of the operation table 11, the second mechanical arm 32 is positioned at one side of the first mechanical arm 31, two groups of mechanical arms are used for clamping and fixing an LED circuit board, subsequent welding is convenient, the first mechanical arm 312 is arranged at one end of the first mechanical arm 31, the second mechanical arm 322 is arranged at one end of the second mechanical arm 32, the two groups of mechanical arms can freely rotate in cooperation with an equipment program, pressure sensors (not shown in the figure) are arranged in the two groups of mechanical arms, the two groups of pressure sensors are in signal connection with the equipment program, the first temperature sensor 311 is arranged on the first mechanical arm 31 and positioned at one side of the first mechanical arm 312, the second temperature sensor 321 is arranged on the second mechanical arm 32 and positioned at one side of the second mechanical arm 322, and the two groups of temperature sensors are used for detecting the temperature of the LED circuit board when the equipment is welded in cooperation with the equipment program;
the welding assembly 4 comprises a third mechanical arm 41, a first camera 42 and a welding gun 411, wherein the third mechanical arm 41 is arranged on one side of the operating table 11 and is positioned on one side of the second supporting seat 13, the welding gun 411 is arranged at one end of the third mechanical arm 41 and is used for welding an LED circuit board in cooperation with an equipment program, and the first camera 42 is fixedly arranged at the top of the third mechanical arm 41 and is used for identifying the welding position of the LED circuit board in cooperation with the equipment program;
the refrigeration assembly 5 comprises a fourth mechanical arm 51, an air outlet pipe 52 and a cold air pipe 53, wherein the fourth mechanical arm 51 is arranged on the operating platform 11 and is positioned at the other side of the second supporting seat 13 and is used for cooling an LED circuit in cooperation with equipment programs, the air outlet pipe 52 is arranged at one end of the fourth mechanical arm 51, one end of the air outlet pipe 52 is connected to the fourth mechanical arm 51, the other end of the air outlet pipe 52 is connected with a ventilation device (not shown in the figure) and is used for cooling an LED circuit board in an air-cooling manner, the cold air pipe 53 is arranged at one end of the fourth mechanical arm 51 and is positioned above the air outlet pipe 52, one end of the cold air pipe 53 is connected to the fourth mechanical arm 51, and the other end of the cold air pipe 53 is connected with the refrigeration device (not shown in the figure) and is used for cooling the LED circuit in cooperation with the equipment programs, and electric valves (not shown in the air outlet pipe 52 and the cold air pipe 53 are all internally provided with electric valves (not shown in the figure) and are in signal connection with the equipment programs;
the identification component 6 comprises a second camera 61 and a third camera 62, the second camera 61 is fixedly arranged on the first supporting seat 12, the third camera 62 is fixedly arranged on the second supporting seat 13, and the two groups of cameras are used for detecting the position of the LED circuit board in cooperation with equipment programs;
the welding device 1 is internally provided with a device program in a matching way, the device program can control the movement of four groups of mechanical arms, the starting and stopping of two groups of conveyor belts, the clamping and loosening of the two groups of mechanical arms, the opening and closing of the built-in electric valves of the air outlet pipe 52 and the cold air pipe 53, and the opening and closing of the welding gun 411;
the operation panel 11 provides electric drive for internal equipment through external power supply, and four groups of arms pass through external power supply drive, and three groups of cameras all are connected with equipment program signal, and two groups of conveyer belts pass through external motor and equipment program signal connection, and the built-in pressure sensor of semiconductor component support 211 is connected with equipment program signal.
Embodiment one:
when a worker needs to perform welding operation on the LED circuit board, the worker starts an external power supply and then starts the welding device 1, then the worker places the LED circuit board to be welded on the semiconductor element support 211 arranged in an array, at the moment, the equipment program recognizes that the placement of the LED circuit board is finished through the second camera 61, then the equipment program controls the external motor of the first conveyor belt 21 to operate, the first conveyor belt 21 moves leftwards, the equipment program recognizes the position of the semiconductor element support 211 through the second camera 61, and when the semiconductor element support 211 moves to be close to the clamping assembly 3, the equipment program controls the first conveyor belt 21 to stop, and subsequent production operation is performed.
Identification operation:
when a worker places an LED circuit board to be welded on the semiconductor element holders 211 arranged in an array, at this time, the equipment program detects the numerical value of the built-in pressure sensor of the semiconductor element holders 211, the equipment program sets the pressure values to be X1, X2 and X3, when the equipment program detects the pressure value to be X1, the equipment program judges that the LED circuit board is a small circuit board, when the equipment program detects the pressure value to be X2, the equipment program judges that the LED circuit board is a medium circuit board, when the equipment program detects the pressure value to be X3, the equipment program judges that the LED circuit board is a large circuit board, after the judgment is finished, the equipment program feeds signals back to the clamping component 3 and the welding component 4, and then the equipment program controls to perform the next operation;
through the cooperation of the built-in pressure sensor of semiconductor component support 211 and equipment program, can detect the weight of the LED circuit board of placing to judge the size of LED circuit board with this, take different clamping forces according to the LED circuit board of equidimension in the follow-up operation, ensure that the LED circuit board can not rock when welding, can improve welding precision and welding efficiency.
Clamping operation:
when the semiconductor element holder 211 moves to the side of the gripping assembly 3, the apparatus program controls the first conveyor 21 to stop and detects the feedback signal of the above-mentioned recognition operation, at this time, the apparatus program recognizes the position of the LED circuit board through the second camera 61 and the third camera 62, and then the apparatus program controls the first robot arm 31, the second robot arm 32 to move downward and to operate the first robot 312 and the second robot arm 322 to grip the LED circuit board, at this time, the apparatus program detects the values of the pressure sensors built in the inside of the two sets of robots, at this time, the apparatus program sets the grip values of the two sets of robots to M3, M2, M1, the feedback values of the LED circuit board to N1, N2, N3, the error to ±10, and when the apparatus program detects the pressure value fed back by the recognition operation to X1, the apparatus program controls the grip values of the two sets of the robot to M3 (since the LED circuit board is generally thin, so the maximum clamping value is adopted), at the moment, the equipment program detects the feedback value of the LED circuit board, if N1 is not operated, if the feedback value is larger than the error value, the control clamping value becomes M2, at the moment, the equipment program detects the feedback value of the LED circuit board again, if the feedback value is N1, the control clamping value becomes M1 (M1 is the minimum clamping value and the condition that the LED circuit board cannot be clamped does not occur), when the equipment program detects the pressure value fed back by the identification operation is X2 and X3, the equipment program controls the clamping values of two groups of manipulators to be M2, at the moment, the equipment program detects the feedback value of the LED circuit board, if N2 is not operated, if the feedback value is larger than the error value, the control clamping value is changed to M1, at the moment, the feedback value is not required to be detected again, if the feedback value is smaller than the error value, the control clamping value is changed to M3, after the clamping operation is completed, the equipment program control carries out the next operation;
through the cooperation of the built-in pressure sensor of two sets of manipulators and equipment program, can detect the clamping force of LED circuit board, prevent to clamp the too big damage that leads to the fact the LED circuit board of clamping force, also can be because of the cold joint that does not tightly lead to of clamp the LED circuit board, detect the pressure value that feeds back when discernment operation through equipment program, the clamping value of two sets of manipulators is controlled according to the difference of LED circuit board size, can use different clamping force when welding the LED circuit board of different sizes, prevent to clamp the too big LED circuit board damage or clamping force degree and shake the solder joint position and produce the skew when leading to welding of LED circuit board, carry out the correction of clamping value according to the feedback value of LED circuit board again, welding accuracy and roughness can be guaranteed.
Welding operation:
after the clamping operation is completed, the equipment program controls the third mechanical arm 41 to descend, the equipment program identifies the welding spot position of the LED circuit board through the first camera 42, then the equipment program controls the welding gun 411 to carry out soldering operation, at this moment, the equipment program controls the equipment program to select lead-containing solder and lead-free solder according to production requirements, the equipment program changes the temperature of the welding gun 411 according to different solders selected by workers (the welding temperature of the lead-containing solder is 200-300 ℃ and the welding temperature of the lead-free solder is 350-400 ℃), the equipment program sets the welding temperature to be T1, T2 and T3, when the equipment program detects that the workers select the lead-free solder, the welding temperature of the welding gun 411 is T1, the tin bar is welded on the welding spot after being heated, when the equipment program detects that the solders selected by workers are lead-containing solder, the welding temperature of the welding gun 411 is T2, the tin bar is welded on the welding spot after being heated, at this moment, the equipment program controls the welding temperature of the welding gun 411 to be T3 (the temperature is less than 350 ℃ and less than 380 ℃ when the welding operation is carried out by the workers, the equipment program is required to carry out the re-welding operation), the subsequent welding operation is completed after the welding operation is carried out;
through the cooperation of equipment program and welder 411, the temperature during welding can be controlled, through the welding material that detects the staff and select, change welder 411's welding temperature, when carrying out the welding operation of different production requirements, need not to change welder in addition and weld, reduced production process, the consumption of tin strip also can be reduced simultaneously to reduction process complexity, reduction in production cost when guaranteeing production quality.
Refrigeration operation:
after the welding operation is finished, the equipment program controls the fourth mechanical arm 51 to descend and carries out temperature detection on the LED circuit board through two groups of temperature sensors arranged on the two groups of mechanical arms, the equipment program sets the values of the two groups of temperature sensors to be H1, H2 and H3, the air outlet quantity of the air outlet pipe 52 to be V1 and V2, when the equipment program detects the values of the two groups of temperature sensors to be H1, the equipment program controls the electric valve of the air outlet pipe 52 to be opened, the air outlet quantity of the air outlet pipe 52 to be V1, air blowing cooling is carried out on the LED circuit board after the welding is finished, when the equipment program detects the values of the two groups of temperature sensors to be H2, the equipment program controls the air outlet quantity of the air outlet pipe 52 to be V2, when the equipment program detects the values of the two groups of temperature sensors to be H3, the equipment program controls the air outlet quantity of the air outlet pipe 52 to be V2, at the moment, when the equipment program controls the air blowing time of the air outlet pipe 52 to be Z1, and then controls the electric valve of the equipment to be opened, and simultaneously carries out cooling on the LED circuit board after the welding is finished;
through the cooperation of two sets of temperature sensor and equipment procedure, can carry out temperature detection to the LED circuit board, through the cooperation use of play tuber pipe 52, cold air pipe 53, can cool down the processing to the LED circuit board after the welding, according to the height of LED circuit board temperature, control the play amount of wind of play tuber pipe 52, start the air jetting earlier and cool down then start cold air pipe 53 and cool down when the LED circuit board is in the high temperature state, can prevent that the LED circuit board from appearing the temperature dip and leading to the desoldering when cooling down in the high temperature state after the welding, cold air pipe 52 and cold air pipe 53's cooperation use, can start the air-cooled cooling when the high temperature, use the air-cooled cooling under the normal temperature, reduce the energy consumption.
Collecting operation:
after the welding is finished, the first mechanical arm 31 and the second mechanical arm 32 are controlled by the equipment program to move downwards and control the first mechanical arm 312 and the second mechanical arm 322 to be loosened, the LED circuit boards are placed on the second conveyor belt 22, then the second conveyor belt 22 is controlled by the equipment program to be started, the LED circuit boards are transported rightwards to fall onto the conveying plate 23 and then slide downwards into the collecting frame 15, at the moment, the LED circuit boards in the collecting frame 15 are sorted one by workers, the subsequent production operation is convenient, the LED circuit boards are prevented from being stacked in the collecting frame 15, and the welding parts are damaged by mutual collision.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Finally, it should be pointed out that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting. Although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified or some technical features may be equivalently replaced, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. Semiconductor component welding equipment, including welding set (1), operation panel (11), its characterized in that: the operation table (11) is provided with a conveying assembly (2), a clamping assembly (3), a welding assembly (4), a refrigerating assembly (5) and an identification assembly (6);
the conveying assembly (2) is arranged on one side of the operating table (11), the clamping assembly (3) is arranged on the operating table (11) and is positioned on one side of the conveying assembly (2), the welding assembly (4) is arranged on the operating table (11) and is positioned on one side of the clamping assembly (3), and the refrigerating assembly (5) is arranged on the operating table (11) and is positioned on one side of the welding assembly (4);
the welding assembly (4) comprises a third mechanical arm (41), a first camera (42) and a welding gun (411), wherein the third mechanical arm (41) is arranged on one side of the operating platform (11), the welding gun (411) is arranged at one end of the third mechanical arm (41), and the first camera (42) is fixedly arranged at the top of the third mechanical arm (41);
the operation table (11) is provided with a first supporting seat (12), a second supporting seat (13), a welding table (14) and a collecting frame (15);
the first supporting seat (12) is fixedly arranged on one side of the operation table (11), the second supporting seat (13) is fixedly arranged on the other side of the operation table (11), the welding table (14) is arranged on the operation table (11), and the collecting frame (15) is arranged at one end of the operation table (11).
2. A semiconductor component bonding apparatus according to claim 1, wherein: the transport assembly (2) comprises a first conveyor belt (21), a semiconductor element bracket (211), a second conveyor belt (22) and a conveying plate (23);
the first conveyor belt (21) is arranged on the welding table (14) and is positioned on one side of the welding table (14), the semiconductor element supports (211) are arranged on the first conveyor belt (21) in an array mode, pressure sensors are arranged in the semiconductor element supports (211), and the second conveyor belt (22) is arranged on the welding table (14) and is positioned on the other side of the welding table (14).
3. A semiconductor component bonding apparatus according to claim 1, wherein: the clamping assembly (3) comprises a first mechanical arm (31), a first temperature sensor (311), a first mechanical arm (312), a second mechanical arm (32), a second temperature sensor (321) and a second mechanical arm (322);
first arm (31) and second arm (32) fixed mounting are in the other end of operation panel (11), second arm (32) are located one side of first arm (31), first manipulator (312) set up the one end at first arm (31), second manipulator (322) set up the one end at second arm (32), first temperature sensor (311) set up on first arm (31), are located one side of first manipulator (312), second temperature sensor (321) set up on second arm (32) are located one side of second manipulator (322).
4. A semiconductor component bonding apparatus according to claim 1, wherein: the refrigeration assembly (5) comprises a fourth mechanical arm (51), an air outlet pipe (52) and a cold air pipe (53);
the fourth mechanical arm (51) is arranged on the operating platform (11) and is positioned on the other side of the second supporting seat (13), the air outlet pipe (52) is arranged at one end of the fourth mechanical arm (51), the cold air pipe (53) is arranged at one end of the fourth mechanical arm (51) and is positioned above the air outlet pipe (52).
5. A semiconductor component bonding apparatus according to claims 1 to 4, characterized in that:
the specific method comprises the following steps:
s1, when an equipment program detects that the pressure value is X1, the equipment program judges that the LED circuit board is a small circuit board;
s2, when the equipment program detects that the pressure value is X2, the equipment program judges that the LED circuit board is a medium-sized circuit board;
and S3, when the equipment program detects that the pressure value is X3, the equipment program judges that the LED circuit board is a large-sized circuit board, after the judgment is finished, the equipment program feeds signals back to the clamping assembly 3 and the welding assembly 4, and then the equipment program controls the next operation.
6. A semiconductor component bonding apparatus according to claims 1 to 5, characterized in that:
the specific method comprises the following steps:
s1, when the equipment program detects that the pressure value fed back by the identification operation is X1, the equipment program controls the clamping values of the two groups of manipulators to be M3 (the LED circuit board is usually thinner, so that the maximum clamping value is adopted), the equipment program detects the feedback value of the LED circuit board, if N1 is not operated, if the feedback value is larger than the error value, the clamping value is controlled to be M2, the equipment program detects the feedback value of the LED circuit board again, if N1 is not operated, if the feedback value is still larger than the error value, the clamping value is controlled to be M1 (M1 is the minimum clamping value and the situation that the LED circuit board cannot be clamped does not occur);
s2, when the equipment program detects that the pressure value fed back by the identification operation is X2 and X3, the equipment program controls the clamping values of the two groups of manipulators to be M2, at the moment, the equipment program detects the feedback value of the LED circuit board, if the feedback value is N2, no operation is performed, if the feedback value is larger than the error value, the clamping value is controlled to be changed to be M1, at the moment, the feedback value is not required to be detected again, if the feedback value is smaller than the error value, the clamping value is controlled to be changed to be M3, and after the clamping operation is completed, the equipment program controls the next operation.
7. A semiconductor component bonding apparatus according to claims 1 to 6, characterized in that:
the specific method comprises the following steps:
s1, when an equipment program detects that a worker selects lead-free solder, the equipment program controls the welding temperature of a welding gun 411 to be T1, and the tin bar is heated and then welded on a welding spot;
s2, when the equipment program detects that the welding flux selected by the worker is lead-containing welding flux, the equipment program controls the welding temperature of the welding gun 411 to be T2, and the tin bar is heated and then welded on the welding spot;
s3, when a worker controls an equipment program to carry out the re-welding operation, the equipment program controls the welding temperature of the welding gun 411 to be T3 (the temperature is more than 350 ℃ and less than 380 ℃ and the lead-free solder needs to be higher in the re-welding process), the tin bar is heated and then welded on the welding spot, and the equipment program is controlled to carry out subsequent operation after the welding is completed.
8. A semiconductor component bonding apparatus according to claim 7, wherein:
the specific method comprises the following steps:
s1, when an equipment program detects that the values of two groups of temperature sensors are H1, the equipment program controls an electric valve of an air outlet pipe 52 to be opened, the air outlet quantity of the air outlet pipe 52 is V1, and air blowing and cooling are carried out on an LED circuit board after welding is finished;
s2, when the equipment program detects that the numerical values of the two groups of temperature sensors are H2, the equipment program controls the air outlet quantity of the air outlet pipe 52 to be V2, and the air outlet quantity is improved to cool the LED circuit board;
s3, when the equipment program detects that the values of the two groups of temperature sensors are H3, the equipment program controls the air outlet quantity of the air outlet pipe 52 to be V2, at the moment, the equipment program controls the blowing time of the air outlet pipe 52 to be Z1, and when Z1 reaches the rear, the equipment program controls the electric valve of the cold air pipe 53 to be opened, so that the phenomenon that welding spots of the LED circuit board fall off in a high temperature state due to sudden temperature drop is prevented, and cold air is sprayed out to cool the LED circuit board while air blowing and cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310655326.7A CN116727797A (en) | 2023-06-05 | 2023-06-05 | Semiconductor element welding equipment and welding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310655326.7A CN116727797A (en) | 2023-06-05 | 2023-06-05 | Semiconductor element welding equipment and welding method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116727797A true CN116727797A (en) | 2023-09-12 |
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ID=87909068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310655326.7A Withdrawn CN116727797A (en) | 2023-06-05 | 2023-06-05 | Semiconductor element welding equipment and welding method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116727797A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118023792A (en) * | 2024-04-15 | 2024-05-14 | 云南建源电力器材有限公司 | Welding device for suspension type electric power iron tower welding piece |
| CN118162831A (en) * | 2024-05-16 | 2024-06-11 | 常州美通新能源科技有限公司 | Intelligent copper plate welding equipment and welding method thereof |
-
2023
- 2023-06-05 CN CN202310655326.7A patent/CN116727797A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118023792A (en) * | 2024-04-15 | 2024-05-14 | 云南建源电力器材有限公司 | Welding device for suspension type electric power iron tower welding piece |
| CN118162831A (en) * | 2024-05-16 | 2024-06-11 | 常州美通新能源科技有限公司 | Intelligent copper plate welding equipment and welding method thereof |
| CN118162831B (en) * | 2024-05-16 | 2024-08-09 | 常州美通新能源科技有限公司 | Intelligent copper plate welding equipment and welding method thereof |
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Application publication date: 20230912 |
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| WW01 | Invention patent application withdrawn after publication |