CN108873403A - A kind of Full-automatic COG bonding machine - Google Patents
A kind of Full-automatic COG bonding machine Download PDFInfo
- Publication number
- CN108873403A CN108873403A CN201810658800.0A CN201810658800A CN108873403A CN 108873403 A CN108873403 A CN 108873403A CN 201810658800 A CN201810658800 A CN 201810658800A CN 108873403 A CN108873403 A CN 108873403A
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- China
- Prior art keywords
- acf
- platform
- flattening
- manipulator
- lcd
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- 230000007246 mechanism Effects 0.000 claims abstract description 51
- 238000012546 transfer Methods 0.000 claims abstract description 10
- 230000001105 regulatory effect Effects 0.000 claims abstract description 5
- 238000007600 charging Methods 0.000 claims description 8
- 238000012797 qualification Methods 0.000 abstract description 2
- 230000007306 turnover Effects 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
The invention discloses a kind of Full-automatic COG bonding machines, it includes that ACF attaches mechanism, precompressed mechanism and this press mechanism, it includes ACF pressure head, ACF platform, the first manipulator and CCD regulating mechanism that the ACF, which attaches mechanism, the precompressed mechanism includes that pre- pressure head, pre- flattening bench, the second manipulator, IC feed mechanism, IC amendment platform, IC picking manipulator, IC transfer robot and CCD para-position mechanism, this described press mechanism include three this flattening benchs, three this pressure heads, third manipulator and the 4th manipulator.Work efficiency is high for it, can save labour turnover, and improves product qualification rate and quality.
Description
Technical field
The invention belongs to liquid crystal module technical field of processing equipment, especially a kind of Full-automatic COG bonding machine.
Background technique
Small size liquid crystal display product uses COG mode to drive liquid crystal display panel substantially at present, by original
IC (Integrated Circuit, integrated circuit board) the mode of circuit drives become IC binding on the glass substrate, be
After forming salient point on bare chip, directly it is connected on the glass substrate with the lead of liquid crystal display.Therefore, COG mounting means
It is more and more widely used, the use of COG bonding machines is also more and more, domestic semi-automatic such as Shenzhen " collection silver " company's production
COG bonding machines, the various bonding machines that foreign countries have the companies such as Panasonic, Hitachi to produce.
The bonding machines of the prior art is primarily present following problem：Feeding is carried out by manual operation, it is independent to carry out ACF patch
Attached, operator manual handling has attached the LCD of ACF, and IC precompressed and this pressure separate two bondings, and aligning accuracy is not high, low efficiency,
Yields is low, is completely dependent on manual operation
Summary of the invention
It is an object of the invention to overcome the above-mentioned problems of the prior art, provide it is a kind of work efficiency is high, it is at low cost,
A kind of Full-automatic COG bonding machine with high accuracy.
The object of the present invention is achieved like this：A kind of Full-automatic COG bonding machine, it is characterised in that：It includes that ACF is attached
Mechanism, precompressed mechanism and this press mechanism；It includes the ACF pressure head on top and the ACF platform of lower part, institute that the ACF, which attaches mechanism,
The precompressed mechanism stated includes the pre- pressure head on top and the pre- flattening bench of lower part, this described press mechanism includes three this flattening benchs,
Each flattening bench top is correspondingly arranged this pressure head；In the side of ACF platform be equipped with the LCD removed to ACF platform
The CCD regulating mechanism of one manipulator and the amendment position LCD；It is equipped in the side of ACF platform and pre- flattening bench and puts down LCD from ACF
Platform is removed to the second manipulator on pre- flattening bench；In the side of precompressed mechanism, one IC feed mechanism, the IC feeding are set
Mechanism includes IC charging tray platform, IC amendment platform, IC is removed from IC charging tray platform to IC to IC picking manipulator, the general for correcting platform
IC transfers to the IC transfer robot on pre- pressure head from IC amendment platform, and pre- pressure head, which will be equipped with, to carry out precisely between IC and LCD
The CCD para-position mechanism of contraposition；It is equipped in the side of pre- flattening bench and three this flattening benchs and successively removes LCD to three from pre- flattening bench
Third manipulator on this flattening bench；The 4th machine from three this flattening bench loading and unloading is equipped in the side of three this flattening benchs
Tool hand.
Workflow of the invention is as follows：
(1) artificial or other line board automatic chargings；
The suction nozzle of (2) first manipulators draws LCD and carries out position correction through CCD regulating mechanism；
LCD Jing Guo position correction is placed in ACF platform by (3) first manipulators；
(4) ACF platform advances, and pressure head decline attaches ACF；
(5) ACF platform retreats detection position, and detection ACF attaches effect；
(6) second manipulators draw LCD and are placed in pre- flattening bench/IC to IC amendment platform of IC picking manipulator absorption simultaneously
Carry out position correction；
(7) transfer transfers to pre- pressure head to IC transfer robot, carries out camera shooting contraposition precompressed；
(8) third manipulator absorption LCD, which is respectively placed on three this flattening benchs, carries out this pressure；
(9) the 4th manipulators are drawn the LCD originally pressed and are placed on blanking assembly line.
Compared with prior art, the beneficial effects of the invention are as follows：
1) present invention includes that ACF attaches mechanism, precompressed mechanism and this press mechanism, realizes ACF attaching, precompressed and this pressure collection
In in same equipment, disposably complete three kinds of processes.
2) one ACF of present invention setting attaches mechanism, a precompressed mechanism, three this press mechanisms, removes from pre- flattening bench
LCD be sequentially placed to this pressure is carried out on three this press mechanisms, solve the problems, such as that this pressure time is long, improve work effect
Rate.
3) present invention is automatic attaches ACF, and automatic to detect, IC and LCD look for MARK point, automatic aligning, automatic transporting automatically
LCD, automatic sucking IC, a series of automation movements such as auto-stitching, save cost of labor, improve product quality and product
Qualification rate.
Detailed description of the invention
The structural schematic diagram of Fig. 1 Full-automatic COG bonding machine of the present invention；
In figure：1-ACF pressure head, 2-ACF platform, the pre- pressure head of 3-, the pre- flattening bench of 4-, the first manipulator of 5-, 6-CCD adjust machine
Structure, the second manipulator of 7-, 8-IC charging tray platform, 9-IC correct platform, 10-IC picking manipulator, 11-IC transfer robot, 12-
CCD para-position mechanism, this flattening bench of 13-, this pressure head of 14-, this flattening bench of 15-, this pressure head of 16-, this flattening bench of 17-, this pressure of 18-
Head, 19- third manipulator, the 4th manipulator of 20-.
Specific embodiment
The following further describes the present invention with reference to the drawings.
As shown in Figure 1, a kind of Full-automatic COG bonding machine, it includes that ACF attaches mechanism, precompressed mechanism and this press mechanism, institute
It includes the ACF pressure head 1 on top and the ACF platform 2 of lower part that the ACF stated, which attaches mechanism, and the precompressed mechanism includes the pre- of top
The pre- flattening bench 4 of pressure head 3 and lower part；This described press mechanism includes three this flattening benchs 13,15,17, on each flattening bench
Portion is correspondingly arranged this pressure head 14,16,18；It is equipped in the side of ACF platform 2 and removes LCD to the first machine on ACF platform 2
The CCD regulating mechanism 6 of tool hand 5 and the amendment position LCD；It is equipped in the side of ACF platform 2 and pre- flattening bench 4 and puts down LCD from ACF
Platform 2 is removed to the second manipulator 7 on pre- flattening bench 4；On one IC feed mechanism of the side of precompressed mechanism setting, the IC
Material mechanism includes IC charging tray platform 8, IC amendment platform 9, IC is removed from IC charging tray platform 8 to IC to the IC pickup machine for correcting platform 9
IC is transferred to the IC transfer robot 11 on pre- pressure head 3 from IC amendment platform 9 by tool hand 10, pre- pressure head 3 be equipped with by IC with
The CCD para-position mechanism 12 precisely aligned between LCD；It is set in the side of pre- flattening bench 4 and three this flattening benchs 13,15,17
Have and successively removes LCD to the third manipulator 19 on three this flattening benchs 13,15,17 from pre- flattening bench 4；In three this flattening benchs
13,15,17 side is equipped with the 4th manipulator 20 from three 13,15,17 loading and unloading of this flattening bench.
Finally it should be noted that the above specific embodiment is merely illustrative of the technical solution of the present invention, rather than to this
The limitation of invention protection scope, those skilled in the art simply modify or wait to what technical solution of the present invention carried out
With replacement, all without departing from the spirit and scope of technical solution of the present invention.
Claims (1)
1. a kind of Full-automatic COG bonding machine, it is characterised in that：It includes that ACF attaches mechanism, precompressed mechanism and this press mechanism；Institute
It includes the ACF pressure head on top and the ACF platform of lower part that the ACF stated, which attaches mechanism, and the precompressed mechanism includes the precompressed on top
The pre- flattening bench of head and lower part, this described press mechanism include three this flattening benchs, and each flattening bench top is correspondingly arranged one
This pressure head；The CCD of the first manipulator removed LCD on ACF platform and the amendment position LCD is equipped in the side of ACF platform
Regulating mechanism；It is equipped in the side of ACF platform and pre- flattening bench and removes LCD to the second machinery on pre- flattening bench from ACF platform
Hand；One IC feed mechanism is set in the side of precompressed mechanism, the IC feed mechanism includes that IC charging tray platform, IC amendment are flat
Platform, by IC from IC charging tray platform remove to IC amendment platform IC picking manipulator, by IC from IC amendment platform transfer to pre- pressure head
On IC transfer robot, pre- pressure head is equipped with the CCD para-position mechanism that will precisely be aligned between IC and LCD；It is flattening in advance
The side of platform and three this flattening benchs is equipped with and successively removes LCD to the third manipulator on three this flattening benchs from pre- flattening bench；
The 4th manipulator from three this flattening bench loading and unloading is equipped in the side of three this flattening benchs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658800.0A CN108873403A (en) | 2018-06-17 | 2018-06-17 | A kind of Full-automatic COG bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658800.0A CN108873403A (en) | 2018-06-17 | 2018-06-17 | A kind of Full-automatic COG bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108873403A true CN108873403A (en) | 2018-11-23 |
Family
ID=64294469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810658800.0A Pending CN108873403A (en) | 2018-06-17 | 2018-06-17 | A kind of Full-automatic COG bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108873403A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109751305A (en) * | 2019-03-13 | 2019-05-14 | 惠科股份有限公司 | This pressure device |
| CN112799242A (en) * | 2021-03-02 | 2021-05-14 | 东莞晶汇半导体有限公司 | Processing method of LCD (liquid crystal display) liquid crystal screen attaching crystal grains |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202854444U (en) * | 2012-08-06 | 2013-04-03 | 辽宁益盛达机电设备制造有限公司 | Full-automatic chip-on-glass (COG) bonding machine |
| CN202854443U (en) * | 2012-08-06 | 2013-04-03 | 辽宁益盛达机电设备制造有限公司 | Intelligent semi-automatic chip on glass (COG) bonder |
| CN203643702U (en) * | 2013-11-11 | 2014-06-11 | 深圳市腾盛自动化设备有限公司 | Full-automatic COG (Chip on Glass) bonding machine |
| CN204480015U (en) * | 2015-01-22 | 2015-07-15 | 深圳市集银科技有限公司 | A kind of pre-this pressure all-in-one of COG of automatic aligning |
| CN105620001A (en) * | 2016-01-25 | 2016-06-01 | 深圳市福和大自动化有限公司 | FOG (Flexible Printed Circuit on Glass) prepressing and pressing integrated machine |
| CN105923377A (en) * | 2016-05-24 | 2016-09-07 | 深圳市联得自动化装备股份有限公司 | Bonding machine |
| CN205910447U (en) * | 2016-04-12 | 2017-01-25 | 深圳市联得自动化装备股份有限公司 | LCD module nation decides machine |
| CN106773190A (en) * | 2017-03-30 | 2017-05-31 | 深圳市极而峰工业设备有限公司 | LCD facade bonding devices |
| CN208705606U (en) * | 2018-06-17 | 2019-04-05 | 赤峰埃晶电子科技有限公司 | A kind of Full-automatic COG bonding machine |
-
2018
- 2018-06-17 CN CN201810658800.0A patent/CN108873403A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202854444U (en) * | 2012-08-06 | 2013-04-03 | 辽宁益盛达机电设备制造有限公司 | Full-automatic chip-on-glass (COG) bonding machine |
| CN202854443U (en) * | 2012-08-06 | 2013-04-03 | 辽宁益盛达机电设备制造有限公司 | Intelligent semi-automatic chip on glass (COG) bonder |
| CN203643702U (en) * | 2013-11-11 | 2014-06-11 | 深圳市腾盛自动化设备有限公司 | Full-automatic COG (Chip on Glass) bonding machine |
| CN204480015U (en) * | 2015-01-22 | 2015-07-15 | 深圳市集银科技有限公司 | A kind of pre-this pressure all-in-one of COG of automatic aligning |
| CN105620001A (en) * | 2016-01-25 | 2016-06-01 | 深圳市福和大自动化有限公司 | FOG (Flexible Printed Circuit on Glass) prepressing and pressing integrated machine |
| CN205910447U (en) * | 2016-04-12 | 2017-01-25 | 深圳市联得自动化装备股份有限公司 | LCD module nation decides machine |
| CN105923377A (en) * | 2016-05-24 | 2016-09-07 | 深圳市联得自动化装备股份有限公司 | Bonding machine |
| CN106773190A (en) * | 2017-03-30 | 2017-05-31 | 深圳市极而峰工业设备有限公司 | LCD facade bonding devices |
| CN208705606U (en) * | 2018-06-17 | 2019-04-05 | 赤峰埃晶电子科技有限公司 | A kind of Full-automatic COG bonding machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109751305A (en) * | 2019-03-13 | 2019-05-14 | 惠科股份有限公司 | This pressure device |
| CN112799242A (en) * | 2021-03-02 | 2021-05-14 | 东莞晶汇半导体有限公司 | Processing method of LCD (liquid crystal display) liquid crystal screen attaching crystal grains |
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Address after: 024000 Hongshan Economic Development Zone, Hongshan District, Chifeng City, Inner Mongolia Autonomous Region (east side of Haoke New Energy Company) Applicant after: Chifeng Guangding Technology Co.,Ltd. Applicant after: INNER MONGOLIA ZHONGSEN INTELLIGENT TERMINAL TECHNOLOGY RESEARCH AND DEVELOPMENT CO.,LTD. Address before: 024000 Hongshan Economic Development Zone, Hongshan District, Chifeng City, Inner Mongolia Autonomous Region (east side of Haoke New Energy Company) Applicant before: CHIFENG AIJING ELECTRONIC TECHNOLOGY CO.,LTD. Applicant before: INNER MONGOLIA ZHONGSEN INTELLIGENT TERMINAL TECHNOLOGY RESEARCH AND DEVELOPMENT CO.,LTD. |