CN219144148U - Double-end die bonding equipment - Google Patents
Double-end die bonding equipment Download PDFInfo
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- CN219144148U CN219144148U CN202223116006.4U CN202223116006U CN219144148U CN 219144148 U CN219144148 U CN 219144148U CN 202223116006 U CN202223116006 U CN 202223116006U CN 219144148 U CN219144148 U CN 219144148U
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Abstract
The utility model relates to the field of die bonding equipment, and discloses double-head die bonding equipment which comprises a die ring storage device, a die ring correction device, a manipulator for transferring a die ring in the die ring storage device to the die ring correction device, a chip position adjustment platform, a rotary die arm for transferring a chip on the die ring correction device to the chip position adjustment platform, a bearing table for bearing a substrate and a die bonding device for die bonding the chip on the chip position adjustment platform on the substrate, wherein the die ring storage device is arranged on the die ring correction device; the double-end die bonding equipment can effectively improve the accuracy of attaching chips to the substrate.
Description
Technical Field
The utility model relates to the field of die bonding equipment, in particular to double-head die bonding equipment.
Background
The die bonding equipment can absorb the chip from the blue film of the die ring on the die ring correcting device through the die bonding device, and attach the chip to the base to finish processing.
The existing die bonding equipment is characterized in that a die bonding device is arranged on a manipulator, then the manipulator directly drives the die bonding device to move to the position above a die ring correcting device, then the die bonding device absorbs chips on a blue film, then the chips are transferred to the position above a substrate, and the chips are attached to the substrate. Because the elongation rate of each part on the blue film may change, the position of the chip relative to the die bonding device may change after the chip is adsorbed, and the precision of the position of the chip attached to the substrate may be poor; in addition, the current die bonding device can only attach one chip on the substrate at a time, and in the moving process of the manipulator, the substrate is in an idle state actually, so that the die bonding efficiency of the chip is not improved.
Therefore, it is necessary to design a dual-head die bonding apparatus to improve the accuracy of attaching the chip to the substrate.
Disclosure of Invention
The utility model aims to provide double-end die bonding equipment so as to improve the accuracy of attaching a chip to a substrate.
To achieve the purpose, the utility model adopts the following technical scheme:
the double-end die bonding equipment comprises a die ring storage device, a die ring correction device, a manipulator for transferring a die ring in the die ring storage device to the die ring correction device, a chip position adjustment platform, a rotary die arm for transferring a chip on the die ring correction device to the chip position adjustment platform, a bearing table for bearing a substrate and a die bonding device for die bonding the chip on the chip position adjustment platform to the substrate, wherein the die ring storage device is used for transferring the die ring in the die ring storage device to the die ring correction device;
the die bonding device comprises a linear slide rail, a bonding head slidably mounted on the linear slide rail and a first driving device for driving the bonding head to move along the linear slide rail;
the bearing table comprises a feeding slide rail perpendicular to the linear slide rail, a vacuum adsorption table slidingly mounted on the feeding slide rail and a second driving device for driving the vacuum adsorption table to move along the feeding slide rail, and the vacuum adsorption table is positioned at one side of the bottom of the linear slide rail;
the chip position adjustment platform is arranged beside the vacuum adsorption platform and is positioned at one side of the bottom of the linear slide rail, and the die bonding device can move to the position right above the chip position adjustment platform along the linear slide rail.
Optionally, the chip position adjustment platform includes carrying core platform, is used for driving carrying core platform rotation's driving motor, is used for driving motor is followed the first translation device that the pay-off slide rail removed and is used for driving first translation device is followed the second translation device that the linear slide rail removed.
Optionally, the double-end die bonding equipment further comprises a detection camera for detecting the rotation angle of the chip on the core carrying platform, and the detection camera is electrically connected with the driving motor, the first translation device and the second translation device respectively.
Optionally, a supporting device for supporting the crystal ring is further arranged between the crystal ring storage device and the crystal ring correction device, and the supporting device comprises a supporting sliding rail and a height adjusting device for driving the supporting sliding rail to lift along the vertical direction;
the bearing slide rail is provided with two at least, and all bearing slide rail all is in on the same horizontal plane.
Optionally, the manipulator includes a clamp for clamping the crystal ring and a linear module for driving the clamp to move along the bearing slide rail, and the clamp is located at one side of the top of the bearing slide rail;
and the bottom surface of the crystal ring is propped against the bearing sliding rail in the process that the manipulator drives the crystal ring to move from the crystal ring storage device to the crystal ring correction device.
Optionally, the double-end die bonding equipment comprises two die ring storage devices, two die ring correction devices, two manipulators, two chip position adjustment platforms, two rotary die arms and two die bonding devices; the crystal ring storage device, the crystal ring correction device, the manipulator, the chip position adjustment platform, the rotary crystal arm and the crystal fixing device are arranged on one side of the bearing table; the other crystal ring storage device, the other crystal ring correction device, the other manipulator, the other chip position adjustment platform, the other rotary crystal arm and the one crystal fixing device are arranged on the other side of the bearing table.
Optionally, the bearing table comprises a bearing table plate, and a plurality of vacuum adsorption holes are arranged on the bearing table plate.
Optionally, the first driving device and the second driving device are both linear motors.
Compared with the prior art, the utility model has the following beneficial effects:
in the embodiment, the chip is transferred to the chip position adjusting platform by the rotary crystal arm, and then the chip position adjusting platform can adjust the position of the chip, so that the chip displacement caused by different local tensioning degrees of the blue film is reduced, and further the position with larger chip mounting position error is caused; moreover, in this embodiment, the first bonding head is driven to move on the linear slide rail by the first driving device, and the vacuum adsorption platform is driven to move on the feeding slide rail by the second driving device, so that the purpose of adjusting the chip mounting position is achieved, in the adjustment process, the first bonding head and the vacuum adsorption platform both move along the linear direction, and the mode of moving the design curve is not needed, so that the chip mounting position of the substrate is accurately positioned, and the chip mounting precision is improved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are therefore not intended to limit the scope of the utility model, since any modification, variation in proportions, or adjustment of the size, which would otherwise be used by those skilled in the art, would not have the essential significance of the present disclosure, would still fall within the scope of the present disclosure without affecting the efficacy or achievement of the present disclosure.
Fig. 1 is a schematic top view of a dual-head die bonding apparatus according to an embodiment of the present utility model;
fig. 2 is a schematic perspective view of a dual-head die bonding apparatus according to an embodiment of the present utility model.
Illustration of: the wafer ring storage device 1, the wafer ring correction device 2, the manipulator 3, the clamp 31, the linear module 32, the chip position adjustment platform 4, the core carrying platform 41, the first translation device 42, the second translation device 43, the rotary wafer arm 5, the carrying platform 6, the feeding slide rail 61, the vacuum adsorption platform 62, the wafer fixing device 7, the bonding head 71, the first driving device 72, the detection camera 8, the bearing device 9, the bearing slide rail 91 and the height adjustment device 92.
Detailed Description
In order to make the objects, features and advantages of the present utility model more comprehensible, the technical solutions in the embodiments of the present utility model are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
The embodiment of the utility model provides double-head die bonding equipment, which can effectively improve the accuracy of attaching a chip to a substrate and is beneficial to improving the die bonding efficiency.
Referring to fig. 1 to 2, the double-end die bonding apparatus is characterized by comprising a die ring storage device 1, a die ring correction device 2, a manipulator 3 for transferring a die ring in the die ring storage device 1 to the die ring correction device 2, a chip position adjustment platform 4, a rotary die arm 5 for transferring a chip on the die ring correction device 2 to the chip position adjustment platform 4, a bearing table 6 for bearing a substrate, and a die bonding device 7 for die bonding a chip on the chip position adjustment platform 4 to the substrate;
the die bonding device 7 comprises a linear slide rail, a bonding head 71 which is slidably arranged on the linear slide rail, and a first driving device 72 for driving the bonding head 71 to move along the linear slide rail;
the bearing table 6 comprises a feeding slide rail 61 perpendicular to the linear slide rail, a vacuum adsorption table 62 slidably mounted on the feeding slide rail 61 and a second driving device for driving the vacuum adsorption table 62 to move along the feeding slide rail, and the vacuum adsorption table 62 is positioned at one side of the bottom of the linear slide rail;
the chip position adjustment platform 4 is disposed beside the vacuum adsorption platform 62 and is located at one side of the bottom of the linear slide rail, and the die bonding device 7 can move to a position right above the chip position adjustment platform 4 along the linear slide rail.
Specifically, in the actual production process, the mechanical arm 3 transfers the crystal ring from the crystal ring storage device 1 to the crystal ring correction device 2, the crystal ring correction device 2 corrects the rotation angle of the crystal ring, so that the rotary crystal arm 5 can absorb the chip on the blue film and transfer the chip to the chip position adjustment platform 4, the chip position adjustment platform 4 adjusts the chip position, so that the chip can be accurately absorbed by the crystal fixing device 7, and the crystal fixing device 7 absorbs the chip at the same position each time, thereby effectively improving the mounting precision of the chip.
Optionally, the chip position adjustment platform 4 includes a core carrying platform 41, a driving motor for driving the core carrying platform 41 to rotate, a first translation device 42 for driving the driving motor to move along the feeding slide rail 61, and a second translation device 43 for driving the first translation device 42 to move along the linear slide rail.
Specifically, the chip position adjustment platform 4 can drive the chip to rotate and also can drive the chip to adjust the position on the plane, so that the adjustment of the chip position is realized.
Optionally, the dual-head die bonding apparatus further includes a detection camera 8 for detecting a rotation angle of the chip on the core stage 41, and the detection camera 8 is electrically connected to the driving motor, the first translation device 42, and the second translation device 43, respectively.
Specifically, the inspection camera 8 detects the position and rotation angle of the chip on the core stage 41, and then adjusts the chip position by the driving motor, the first translation device 42, and the second translation device 43.
Optionally, a supporting device 9 for supporting the crystal ring is further arranged between the crystal ring storage device 1 and the crystal ring correction device 2, and the supporting device 9 comprises a supporting sliding rail 91 and a height adjusting device 92 for driving the supporting sliding rail 91 to lift along the vertical direction;
the bearing slide rail 91 is provided with two at least, and all bearing slide rails 91 are on same horizontal plane.
Specifically, in the process of transferring the crystal ring, the crystal ring slides on the bearing slide rail 91, so that the situation that the crystal ring is deformed due to the fact that the large-size crystal ring is directly clamped by the clamping jaws can be effectively improved, the crystal ring is effectively prevented from being deformed, the position of the chip on the blue film is kept unchanged, namely, the tension degree of the blue film on the crystal ring is not changed excessively in the process that the crystal ring moves from the crystal ring storage device 1 to the crystal ring correction device 2, and therefore the displacement condition of the chip is improved, and the chip mounting precision can be effectively improved.
Optionally, the manipulator 3 includes a clamp 31 for clamping the wafer ring and a linear module 32 for driving the clamp 31 to move along the bearing slide rail 91, where the clamp 31 is located at one side of the top of the bearing slide rail 91;
the manipulator 3 drives the crystal ring to move from the crystal ring storage device 1 to the crystal ring correction device 2, and the bottom surface of the crystal ring is propped against the bearing slide rail 91.
Optionally, the double-end die bonding equipment comprises two die ring storage devices 1, two die ring correction devices 2, two manipulators 3, two chip position adjustment platforms 4, two rotary die arms 5 and two die bonding devices; the crystal ring storage device 1, the crystal ring correction device 2, the manipulator 3, the chip position adjustment platform 4, the rotary crystal arm 5 and the crystal fixing device are arranged on one side of the bearing table 6; the other crystal ring storage device 1, the other crystal ring correction device 2, the other manipulator 3, the other chip position adjustment platform 4, the other rotary crystal arm 5 and the one crystal fixing device are arranged on the other side of the bearing table 6.
Specifically, when the bonding head 71 on one side performs die bonding operation, the bonding head 71 on the other side is feeding, and the two bonding heads 71 alternately operate, so that die bonding efficiency of the chip can be effectively realized.
Optionally, the carrying platform 6 includes a carrying platform 6 plate, and a plurality of vacuum adsorption holes are arranged on the carrying platform 6 plate.
Specifically, the vacuum adsorption holes adsorb the substrate, so that the substrate is prevented from shifting relative to the bearing table 6, and the die bonding precision is improved.
Optionally, the first driving device 72 and the second driving device are both linear motors to ensure transmission accuracy.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (8)
1. The double-end die bonding equipment is characterized by comprising a die ring storage device (1), a die ring correction device (2), a manipulator (3) for transferring a die ring in the die ring storage device (1) onto the die ring correction device (2), a chip position adjustment platform (4), a rotary die arm (5) for transferring a chip on the die ring correction device (2) onto the chip position adjustment platform (4), a bearing table (6) for bearing a substrate and a die bonding device (7) for die bonding the chip on the chip position adjustment platform (4) onto the substrate;
the die bonding device (7) comprises a linear slide rail, a bonding head (71) which is slidably arranged on the linear slide rail, and a first driving device (72) which is used for driving the bonding head (71) to move along the linear slide rail;
the bearing table (6) comprises a feeding slide rail (61) perpendicular to the linear slide rail, a vacuum adsorption table (62) slidably mounted on the feeding slide rail (61) and a second driving device for driving the vacuum adsorption table (62) to move along the feeding slide rail, and the vacuum adsorption table (62) is positioned at one side of the bottom of the linear slide rail;
the chip position adjustment platform (4) is arranged beside the vacuum adsorption platform (62) and is positioned at one side of the bottom of the linear slide rail, and the die bonding device (7) can move to the position right above the chip position adjustment platform (4) along the linear slide rail.
2. The double-end die bonding equipment according to claim 1, wherein the chip position adjustment platform (4) comprises a core carrying platform (41), a driving motor for driving the core carrying platform (41) to rotate, a first translation device (42) for driving the driving motor to move along the feeding slide rail (61), and a second translation device (43) for driving the first translation device (42) to move along the linear slide rail.
3. The double-ended die bonding apparatus according to claim 2, further comprising a detection camera (8) for detecting a rotation angle of a chip on the core stage (41), and the detection camera (8) is electrically connected with the driving motor, the first translation device (42), and the second translation device (43), respectively.
4. The double-head die bonding equipment according to claim 1, wherein a bearing device (9) for bearing the crystal ring is further arranged between the crystal ring storage device (1) and the crystal ring correction device (2), and the bearing device (9) comprises a bearing sliding rail (91) and a height adjusting device (92) for driving the bearing sliding rail (91) to lift along the vertical direction;
the bearing sliding rails (91) are at least two, and all the bearing sliding rails (91) are on the same horizontal plane.
5. The double-end die bonding equipment according to claim 4, wherein the manipulator (3) comprises a clamp (31) for clamping a die ring and a linear module (32) for driving the clamp (31) to move along the bearing slide rail (91), and the clamp (31) is positioned at one side of the top of the bearing slide rail (91);
the crystal ring is driven by the mechanical arm (3) to move from the crystal ring storage device (1) to the crystal ring correction device (2), and the bottom surface of the crystal ring is propped against the bearing sliding rail (91).
6. The double-head die bonding equipment according to claim 4, wherein the double-head die bonding equipment comprises two die ring storage devices (1), two die ring correction devices (2), two manipulators (3), two chip position adjustment platforms (4), two rotary die arms (5) and two die bonding devices; the crystal ring storage device (1), the crystal ring correction device (2), the manipulator (3), the chip position adjustment platform (4), the rotary crystal arm (5) and the crystal fixing device are arranged on one side of the bearing table (6); the other crystal ring storage device (1), the other crystal ring correction device (2), the other manipulator (3), the other chip position adjustment platform (4), the other rotary crystal arm (5) and the one crystal fixing device are arranged on the other side of the bearing table (6).
7. The double-head die bonding equipment according to claim 4, wherein the bearing table (6) comprises a bearing table (6) plate, and a plurality of vacuum adsorption holes are arranged on the bearing table (6) plate.
8. The dual-head die bonding apparatus according to claim 4, wherein the first driving device (72) and the second driving device are linear motors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223116006.4U CN219144148U (en) | 2022-11-23 | 2022-11-23 | Double-end die bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223116006.4U CN219144148U (en) | 2022-11-23 | 2022-11-23 | Double-end die bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219144148U true CN219144148U (en) | 2023-06-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223116006.4U Active CN219144148U (en) | 2022-11-23 | 2022-11-23 | Double-end die bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219144148U (en) |
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2022
- 2022-11-23 CN CN202223116006.4U patent/CN219144148U/en active Active
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