CN114156217A

CN114156217A - High-precision die bonding chip mounter

Info

Publication number: CN114156217A
Application number: CN202111322385.XA
Authority: CN
Inventors: 程飞; 江艳峰; 郭俊军; 唐传晖
Original assignee: Shenzhen Aoxing Intelligent Equipment Co ltd
Current assignee: Shenzhen Aoxing Intelligent Equipment Co ltd
Priority date: 2021-11-09
Filing date: 2021-11-09
Publication date: 2022-03-08

Abstract

The invention provides a high-precision die bonding chip mounter, which relates to the field of chip mounters and comprises a rack, wherein a material pushing mechanism and a lifting mechanism are arranged inside the rack, the material pushing mechanism is positioned at the end part of the lifting mechanism, a base is arranged inside the material pushing mechanism, an air cylinder is fixedly arranged at the top of the base, a first guide rail is arranged on the side surface of the base, the first guide rail is in sliding connection with the inside of the material pushing mechanism, a push rod is arranged at the end part of the air cylinder, a second guide rail is arranged inside the lifting mechanism, an up-down sliding plate is arranged on the surface of the second guide rail, the up-down sliding plate is in sliding connection with the second guide rail, a material box is arranged on the surface of the up-down sliding plate, the material box and the up-down sliding plate are fixed through support plates, and pressure plates are arranged at two ends of the material box. The multi-repositioning mechanism can improve the die bonding and chip mounting precision through twice correction.

Description

High-precision die bonding chip mounter

Technical Field

The invention relates to the technical field of chip mounters, in particular to a high-precision die bonding chip mounter.

Background

The DIE BONDER is mainly used for various (DIE BONDER) chip mounting equipment, and comprises various suction nozzles, ejector pins, dispensing heads, ceramic nozzles, through pins, motors, carbon brushes, encoders, transmission belts and the like, various parts of automation equipment, installation of instruments and meters and the like. Along with the improvement of production technology, the packaging requirements of LEDs and semiconductors are higher and higher, the existing packaging equipment cannot meet the requirements and is not high in precision, the existing die bonder equipment is not high in die bonding precision, an angle correction function is omitted, and the higher and higher production requirements cannot be met.

Disclosure of Invention

The invention aims to solve the defects in the prior art and provides a high-precision die bonding chip mounter.

In order to achieve the purpose, the invention adopts the following technical scheme: high accuracy solid brilliant chip mounter, which comprises a frame, inside pushing equipment and the elevating system of including of frame, and pushing equipment is located elevating system's tip, the inside base that includes of pushing equipment, base top fixed mounting has the cylinder, the base side is equipped with first guide rail, and the inside sliding connection of first guide rail and pushing equipment, the cylinder tip is equipped with the push rod, the inside second guide rail that includes of elevating system, second guide rail surface is equipped with the skateboarding, and skateboarding and second guide rail sliding connection, the skateboarding surface is equipped with the magazine, and magazine and skateboarding pass through the backup pad fixedly, the magazine both ends are equipped with the clamp plate.

Preferably, elevating system's side is equipped with solid brilliant workstation, gu brilliant workstation includes the top slide, and the top slide with gu the inside sliding connection of brilliant workstation, top slide top surface fixed mounting has anchor clamps, anchor clamps include apron and roof, and the inside swing joint of roof and anchor clamps, and the apron is located the roof directly over.

Preferably, a glue tray is arranged right above the clamp, a glue dispensing welding head is arranged on the side face of the glue tray, the glue dispensing welding head comprises a glue dispensing needle and a glue dispensing arm, and the glue dispensing needle is located at the end of the glue dispensing arm.

Preferably, a die bonding lens barrel is arranged on the side surface of the dispensing welding head and is positioned at the top of the fixture, the die bonding lens barrel comprises a lens barrel and a CCD, and the CCD is positioned at the end part of the lens barrel; the die bonding lens barrel is used for preliminarily positioning the angle and the position of the wafer in the clamp, namely, calibrating for the first time.

Preferably, a welding head moving platform is arranged on the side face of the die bonding lens barrel, a welding head up-down mechanism is arranged on the top face of the welding head moving platform, and the welding head up-down mechanism is in sliding connection with the welding head moving platform through a sliding block.

Preferably, a correcting lens barrel is arranged on the side face of the welding head moving platform, a correcting table is arranged right below the correcting lens barrel and fixed inside the rack, a die bonding welding head is arranged on the side face of the correcting lens barrel, a swing arm is arranged on the side face of the die bonding welding head, and the die bonding welding head is fixed at the end of the swing arm. The swing arm picks up the wafer and rotates 90 degrees and places the wafer on the correction platform, and the angle and the position of the wafer are calibrated for the second time by the correction platform, and then the chip is sucked by the welding head moving platform and placed at the appointed position.

Preferably, a crystal taking lens barrel is arranged on the side surface of the crystal fixing welding head, a crystal ring is arranged right below the crystal taking lens barrel, a wafer workbench is arranged at the bottom of the crystal ring, and a thimble is arranged in the wafer workbench and is positioned at the center of the crystal ring.

Advantageous effects

In the invention, a multi-repositioning mechanism is adopted, a wafer in a fixture is positioned through a die bonding lens barrel, a die bonding welding head determines a swing arm to pick up a jacked chip, then the chip is placed on a correcting table, a vacuum adsorption chip is arranged on the correcting table to fix the chip, the die bonding lens barrel positions the wafer in the fixture, the die bonding worktable moves to a position where the chip needs to be attached, the correcting table calibrates chip materials through the correcting lens barrel, X, Y on the correcting table and a rotating mechanism, and the multi-repositioning mechanism can improve die bonding and chip attaching precision.

The invention adopts a twice calibration and positioning mode to improve the die bonding and chip pasting precision, firstly, a calibration mechanism for positioning the wafer in the fixture by the die bonding lens barrel performs primary positioning of the angle and the position of the wafer, then a swing arm picks up the chip and rotates the chip by 90 degrees to be placed on a calibration table, the calibration table performs secondary calibration on the angle and the position of the chip, then the chip is sucked by a welding head moving platform and is placed at a specified position, and the secondary suction adopts a linear operation mode to avoid the angle rotation in the movement process, thereby improving the angle precision.

Drawings

FIG. 1 is a schematic view of the internal structure of the present invention;

FIG. 2 is a schematic perspective view of the pushing mechanism and the lifting mechanism of the present invention;

FIG. 3 is a schematic perspective view of a die bonding table and a fixture according to the present invention;

FIG. 4 is a schematic perspective view of the rubber plate of the present invention;

FIG. 5 is a schematic perspective view of a dispensing bonding tool according to the present invention;

FIG. 6 is a schematic perspective view of a die bonding barrel according to the present invention;

FIG. 7 shows a moving platform for the welding head and a mechanism for moving the welding head up and down according to the present invention;

FIG. 8 is a schematic perspective view of a correction barrel according to the present invention;

FIG. 9 is a perspective view of a view-finding barrel according to the present invention;

FIG. 10 is a schematic perspective view of the thimble according to the present invention;

FIG. 11 is a schematic perspective view of a wafer ring and a wafer stage according to the present invention;

FIG. 12 is a schematic perspective view of a calibration stage according to the present invention;

FIG. 13 is a schematic perspective view of a die bonding horn and a swing arm according to the present invention;

fig. 14 is an isometric view of the present invention.

Illustration of the drawings:

1. a frame; 2. a material pushing mechanism; 201. a push rod; 202. a cylinder; 203. a base; 204. a first guide rail; 3. a lifting mechanism; 301. a magazine; 302. pressing a plate; 303. a second guide rail; 304. an up-down sliding plate; 4. a die bonding worktable; 401. an upper slide plate; 5. a clamp; 501. a cover plate; 502. a top plate; 6. a rubber plate; 7. dispensing a welding head; 701. dispensing an adhesive arm; 702. dispensing a glue needle; 8. fixing a lens cone; 801. a CCD; 802. a lens barrel; 9. the welding head moves the platform; 10. a correction lens barrel; 11. a welding head up-down mechanism; 12. a die bonding welding head; 13. taking a crystal lens barrel; 14. a thimble; 15. a crystal ring; 16. a wafer stage; 17. a correction table; 18. and (4) swinging arms.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easily understood, the invention is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the invention, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.

Specific embodiments of the present invention are described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-14, a high-precision die bonding chip mounter comprises a rack 1, wherein a material pushing mechanism 2 and a lifting mechanism 3 are arranged inside the rack 1, the material pushing mechanism 2 is located at the end of the lifting mechanism 3, a base 203 is arranged inside the material pushing mechanism 2, a cylinder 202 is fixedly mounted at the top of the base 203, a first guide rail 204 is arranged on the side face of the base 203, the first guide rail 204 is in sliding connection with the inside of the material pushing mechanism 2, a push rod 201 is arranged at the end of the cylinder 202, a second guide rail 303 is arranged inside the lifting mechanism 3, an upper sliding plate 304 and a lower sliding plate 304 are arranged on the surface of the second guide rail 303, the upper sliding plate 304 and the lower sliding plate 303 are in sliding connection, a material box 301 is arranged on the surface of the upper sliding plate and the lower sliding plate 304, the material box 301 and the upper sliding plate and the lower sliding plate 304 are fixed through support plates, and pressing plates 302 are arranged at two ends of the material box 301. The material pushing mechanism 2 pushes the material out of the material box 301 and enters the fixture 5, and the lifting mechanism 3 carries the material box 301 and the material box 301 to lift.

The side of elevating system 3 is equipped with solid brilliant workstation 4, and solid brilliant workstation 4 includes slide plate 401, and slide plate 401 and the inside sliding connection of solid brilliant workstation 4, and slide plate 401 top surface fixed mounting has anchor clamps 5, and anchor clamps 5 include apron 501 and roof 502, and roof 502 and the inside swing joint of anchor clamps 5, and apron 501 is located directly over roof 502. The die bonding stage 4 carries the jig 5 and the wafer plate, and the jig 5 positions the wafer plate and the support by the cover plate 501 and the top plate 502.

A glue tray 6 is arranged right above the clamp 5, a glue dispensing welding head 7 is arranged on the side face of the glue tray 6, the glue dispensing welding head 7 comprises a glue dispensing needle 702 and a glue dispensing arm 701, and the glue dispensing needle 702 is located at the end of the glue dispensing arm 701. The glue tray 6 is used for storing glue, and the glue dispensing welding head 7 is used for dispensing the wafer plate.

The side of the dispensing welding head 7 is provided with a die bonding lens barrel 8, the die bonding lens barrel 8 is positioned at the top of the fixture 5, the die bonding lens barrel 8 comprises a lens barrel 802 and a CCD801, the CCD801 is positioned at the end of the lens barrel 802, and the die bonding lens barrel 8 is used for positioning a wafer plate.

The side of solid brilliant lens cone 8 is equipped with bonding tool platform 9 that moves, the top surface of bonding tool platform 9 that moves is equipped with bonding tool upper and lower mechanism 11, and bonding tool upper and lower mechanism 11 passes through slider and bonding tool platform 9 sliding connection that moves, the side of bonding tool platform 9 that moves is equipped with correction lens cone 10, the side of correction lens cone 10, be equipped with correction platform 17 under the correction lens cone 10, and correction platform 17 fixes inside frame 1, the side of correction lens cone 10 is equipped with solid brilliant lens cone 12, the side of solid brilliant lens cone 12 is equipped with swing arm 18, and solid brilliant lens cone 12 fixes the tip at swing arm 18. The welding head moving platform 9 is used for moving the welding head up-and-down mechanism 11, the welding head up-and-down mechanism 11 is used for picking and placing chips, and the correction lens cone 10 is used for positioning and calibrating the chips.

A crystal taking lens barrel 13 is arranged on the side surface of the crystal fixing welding head 12, a crystal ring 15 is arranged right below the crystal taking lens barrel 13, a wafer workbench 16 is arranged at the bottom of the crystal ring 15, an ejector pin 14 is arranged inside the wafer workbench 16, and the ejector pin 14 is positioned at the center of the crystal ring 15. The die bonding welding head 12 drives the swing arm 18 to rotate up and down, the die taking lens barrel 13 is used for positioning a blue film chip of a wafer, the ejector pin 14 is used for ejecting the blue film chip, the crystal ring 15 is used for bearing a blue film of the crystal ring 15, the wafer workbench 16 is used for bearing the crystal ring 15 and moving the position, the correcting platform 17 is used for positioning the chip, and the swing arm 18 is used for taking and placing the chip.

The multi-repositioning mechanism is adopted, a wafer in the fixture 5 is positioned through the die bonding lens barrel 8, the die bonding welding head 12 determines that the swing arm 18 picks up the jacked chip and then places the chip on the correcting table 17, the vacuum adsorption chip is arranged on the correcting table 17 to fix the chip, meanwhile, the die bonding lens barrel 8 positions the wafer in the fixture 5 and moves the wafer to a position where the chip needs to be attached through the die bonding workbench 4, the correcting table 17 calibrates the chip material through X, Y on the correcting lens barrel 10 and the correcting table 17 and the rotating mechanism, the multi-repositioning mechanism can improve die bonding accuracy and reduce cost, and meanwhile, the product can guarantee timely after-sale service.

The working principle of the invention is as follows: loading a wafer plate needing die bonding into a material box 301, placing the wafer plate on a lifting mechanism 3, placing a wafer blue film of a chip on a wafer ring 15 carrier, assembling the wafer ring 15 on a wafer worktable 16, positioning the chip on the blue film assembled on the wafer ring 15 through a wafer taking lens barrel 13, simultaneously pushing the wafer placed in the material box 301 into a clamp 5 through a material pushing mechanism 2, fastening and fixing the wafer through the clamp 5, assembling the clamp 5 on a die bonding worktable 4, positioning the wafer in the clamp 5 through the wafer taking lens barrel 8, jacking the chip on the blue film through a thimble 14 after the wafer taking lens barrel 13 positions the chip, determining a swing arm 18 through a die bonding welding head 12 to pick up the jacked chip, then placing the chips on a correcting table 17, fixing the chips through a vacuum adsorption chip on the correcting table 17, and positioning the wafer in the clamp 5 through the wafer taking lens barrel 8, the die bonder moves to a position where a chip needs to be bonded from a die bonder workbench 4, a dispensing welding head 7 drives a dispensing arm 701, glue is dipped in a glue tray 6 firstly, then the glue is dispensed to the position where the chip needs to be bonded, a correcting table 17 calibrates chip materials through a correcting lens barrel 10, X, Y on the correcting table 17 and a rotating mechanism, a welding head moving platform 9 drives a welding head up-and-down mechanism 11 to suck the calibrated chip materials on the correcting table 17 and place the chip materials on a wafer with glue dipped on the left side to finish a die bonder operation, and the operations are repeated until all chips on the wafer or the blue film in a material box 301 are used up.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. Solid brilliant chip mounter of high accuracy, including frame (1), its characterized in that: the inside of the rack (1) comprises a material pushing mechanism (2) and a lifting mechanism (3), wherein the material pushing mechanism (2) is positioned at the end part of the lifting mechanism (3); pushing equipment (2) is inside to include base (203), base (203) top fixed mounting has cylinder (202), base (203) side is equipped with first guide rail (204), and first guide rail (204) and pushing equipment (2) inside sliding connection, cylinder (202) tip is equipped with push rod (201), elevating system (3) is inside to include second guide rail (303), second guide rail (303) surface is equipped with upper and lower slide (304), and upper and lower slide (304) and second guide rail (303) sliding connection, upper and lower slide (304) surface is equipped with magazine (301), and magazine (301) and upper and lower slide (304) are fixed through the backup pad, magazine (301) both ends are equipped with clamp plate (302).

2. The high-precision die bonding chip mounter according to claim 1, wherein: the side of elevating system (3) is equipped with solid brilliant workstation (4), gu brilliant workstation (4) include slide board (401), and slide board (401) and solid brilliant workstation (4) inside sliding connection, slide board (401) top surface fixed mounting has anchor clamps (5) on, anchor clamps (5) are including apron (501) and roof (502), and roof (502) and anchor clamps (5) inside swing joint, and apron (501) are located roof (502) directly over.

3. The high-precision die bonding chip mounter according to claim 2, wherein: be equipped with rubber tyer (6) directly over anchor clamps (5), the side of rubber tyer (6) is equipped with some bonding tool (7), some bonding tool (7) are including point gluey needle (702) and some gluey arm (701), and point gluey needle (702) are located the tip of some gluey arm (701).

4. The high-precision die bonding chip mounter according to claim 3, wherein: the side face of the dispensing welding head (7) is provided with a die bonding lens barrel (8), the die bonding lens barrel (8) is located at the top of the fixture (5), the die bonding lens barrel (8) comprises a lens barrel (802) and a CCD (801), and the CCD (801) is located at the end of the lens barrel (802).

5. The high-precision die bonding chip mounter according to claim 4, wherein: and a welding head moving platform (9) is arranged on the side surface of the die bonding lens barrel (8), a welding head up-and-down mechanism (11) is arranged on the top surface of the welding head moving platform (9), and the welding head up-and-down mechanism (11) is in sliding connection with the welding head moving platform (9) through a sliding block.

6. The high-precision die bonding chip mounter according to claim 5, wherein: the side of the welding head moving platform (9) is provided with a correcting lens barrel (10), a correcting table (17) is arranged under the correcting lens barrel (10), the correcting table (17) is fixed inside the rack (1), the side of the correcting lens barrel (10) is provided with a die bonding welding head (12), the side of the die bonding welding head (12) is provided with a swing arm (18), and the die bonding welding head (12) is fixed at the end part of the swing arm (18).

7. The high-precision die bonding chip mounter according to claim 6, wherein: a crystal taking lens barrel (13) is arranged on the side face of the crystal fixing welding head (12), a crystal ring (15) is arranged under the crystal taking lens barrel (13), a wafer workbench (16) is arranged at the bottom of the crystal ring (15), a thimble (14) is arranged inside the wafer workbench (16), and the thimble (14) is positioned at the center of the crystal ring (15).