CN209785895U - LED wafer angular position adjustment mechanism and automatic LED die bonder - Google Patents
LED wafer angular position adjustment mechanism and automatic LED die bonder Download PDFInfo
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- CN209785895U CN209785895U CN201921094908.8U CN201921094908U CN209785895U CN 209785895 U CN209785895 U CN 209785895U CN 201921094908 U CN201921094908 U CN 201921094908U CN 209785895 U CN209785895 U CN 209785895U
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- 230000007246 mechanism Effects 0.000 title claims abstract description 26
- 239000007787 solid Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 49
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model relates to a solid brilliant machine of LED wafer angular position guiding mechanism and automatic LED. The device comprises a fixed table, wherein a transverse linear module is fixed on the fixed table and comprises a sliding table, an angle adjusting assembly is connected above the sliding table and comprises a base plate, the base plate is provided with two supporting seats, the supporting seats are provided with shaft holes, bearings are arranged in the shaft holes, a rotating shaft is connected between the two bearings, and one end of the rotating shaft is connected with a servo motor; the rotation axis is connected with the roating seat, and the roating seat is connected with the workstation, and the workstation is equipped with fixing device, and fixing device includes two brace tables, the middle part of brace table is equipped with vertical hole, the side of workstation is equipped with the horizontal groove with vertical hole intercommunication, and the one end of horizontal groove is connected with the end cap, and the other end of horizontal groove is connected with the solenoid valve that is used for controlling to bleed. The fixing device is driven to rotate by the servo motor, so that the purpose of adjusting the angle of the wafer is achieved, the whole structure is simple, and the operation is convenient.
Description
Technical Field
The utility model relates to a LED processing technology field, concretely relates to LED wafer angular position guiding mechanism and automatic LED solid brilliant machine.
Background
In the process of LED die bonding, an LED wafer needs to be attached to a wafer seat, the wafer is obtained from a wafer disk through a pickup device in the process, then the wafer is placed in a position adjusting mechanism, and then the wafer is taken out through the pickup device, placed in the wafer seat and bonded with the wafer seat; in the process, angle adjustment is needed, and when the angle adjustment is performed, the manipulator of the pickup device is generally adjusted, for example, an angle rotating device is added to the pickup device, so that the operation precision is low, and the whole structure is complex.
Disclosure of Invention
In order to overcome the shortcomings and deficiencies existing in the prior art, the utility model aims to provide a LED wafer angular position adjusting mechanism which is simple in structure and convenient to implement.
Another objective of the present invention is to provide an automatic LED die bonder, which has the above LED die angle position adjusting mechanism.
A LED wafer angular position adjusting mechanism comprises a fixed table, wherein a transverse linear module is fixed above the fixed table and comprises a sliding table capable of moving transversely, an angle adjusting assembly is connected above the sliding table and comprises a base plate, two supporting seats are arranged on one side of the base plate, a shaft hole is formed in the middle of each supporting seat, a bearing is arranged in the shaft hole, a rotating shaft is connected between the two bearings, and one end of each rotating shaft extends outwards and extends out of the corresponding supporting seat and is connected with a servo motor; the utility model discloses a rotary table, including workstation, rotation axis, swivel mount, vertical hole, end cap, the other end of horizontal groove, the rotation axis is connected with the swivel mount, and the swivel mount is connected with the workstation, and the workstation is equipped with the fixing device who is used for fixed wafer, and fixing device includes two brace tables that upwards extend in the middle part of the workstation, the middle part of brace table is equipped with vertical hole, the side of workstation is equipped with the horizontal groove with vertical hole intercommunication, and the one end in horizontal groove is connected with the end cap.
Furthermore, the workbench is respectively provided with transverse moving grooves at two sides of the supporting table, the transverse moving grooves are connected with transverse sliding blocks in a sliding mode, clamping seats are connected above the transverse sliding blocks, the clamping seats are connected with clamping blocks, the clamping blocks are located on one side of the supporting table, the supporting table is provided with fixed positioning columns, the clamping blocks are provided with movable positioning columns, and vertical holes are located between the fixed positioning columns and the movable positioning columns; the lower end of the clamping seat is connected with a stud, the side face of the workbench is connected with a fixed column, and a tension spring is connected between the fixed column and the stud.
Furthermore, the workbench is provided with a limiting table on one side of the supporting table, two gaps are formed between the two supporting tables and the limiting table, and the two clamping blocks are respectively located in the two gaps.
Further, be equipped with the connecting seat between slip table and the base plate, horizontal linear module is connected with horizontal baffle, the connecting seat is equipped with the perforation with horizontal baffle matched with.
Further, an angle sensor is connected to the rotating shaft.
further, horizontal linear module is connected with the sliding seat including fixing the driving motor in fixed station one side, the top of fixed station, be equipped with the lead screw in the sliding seat with the slip table, lead screw and slip table threaded connection, the lead screw passes through the shaft coupling and is connected with driving motor's pivot, the both ends and the sliding seat swing joint of lead screw.
An automatic LED die bonder comprises the LED die angle position adjusting mechanism.
the utility model has the advantages that: the fixing device is driven to rotate by the servo motor, so that the purpose of adjusting the angle of the wafer is achieved, the whole structure is simple, and the operation is convenient.
Drawings
Fig. 1 is the structural schematic diagram of the LED wafer angular position adjusting mechanism of the present invention.
Fig. 2 is a schematic structural diagram of the angle adjustment assembly of the present invention.
Fig. 3 is another schematic view of the angle adjustment assembly of the present invention.
Fig. 4 is a schematic structural diagram of the fixing device of the present invention.
The reference signs are:
1-fixed table; 2-transverse linear module; 21-drive motor; 22-sliding seat; 23-transverse guide plate; 24-a screw rod; 25-a slide; 26-a connecting seat;
3-angle adjusting component; 31-servo motor; 32-coupling; 33-support seat; 34-electromagnetic valve; 35-a substrate; 36-lateral slide; 37-lateral shifting groove; 38-the table; 39-support table; 310-a holder; 311-angle sensor; 312-stop table; 313-a rotating base; 314 — fixed locating post; 315-vertical hole; 316-moving the positioning post; 317-clamping block; 318-fixed column; 319-extension spring; 320-stud.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying fig. 1 to 4, which are not intended to limit the present invention.
Example 1: referring to fig. 1-4, an LED wafer angular position adjusting mechanism includes a fixed table 1, a transverse linear module 2 is fixed above the fixed table 1, the transverse linear module 2 includes a sliding table 25 capable of moving transversely, an angle adjusting assembly 3 is connected above the sliding table 25, the angle adjusting assembly 3 includes a base plate 35, two supporting seats 33 are arranged on one side of the base plate 35, a shaft hole is arranged in the middle of each supporting seat 33, a bearing is arranged in the shaft hole, a rotating shaft is connected between the two bearings, one end of the rotating shaft extends outwards and extends out of the corresponding supporting seat 33, and is connected with a servo motor 31 through a coupling 32; the rotation axis is connected with roating seat 313, and roating seat 313 is connected with workstation 38, and workstation 38 is equipped with the fixing device who is used for fixed wafer, and fixing device includes two brace tables 39 that workstation 38 middle part upwards extends, the middle part of brace table 39 is equipped with vertical hole 315, the side of workstation 38 is equipped with the horizontal groove with vertical hole 315 intercommunication, and the one end of horizontal groove is connected with the end cap, and the other end of horizontal groove is connected with the solenoid valve 34 that is used for controlling to bleed.
When the technical scheme works, the wafer is transferred above the vertical hole 315 of the support table 39, the electromagnetic valve 34 is connected with the vacuumizing device through a pipeline, negative pressure is formed in the vertical hole 315, and the wafer is adsorbed and fixed on the support table 39; then the servo motor 31 works to drive the rotation shaft to rotate, and the rotation shaft rotates and drives the rotating seat 313 and the supporting platform 39 to rotate, so that the problem of angle adjustment is solved; secondly, a transverse linear module 2 is also arranged, and the transverse linear module 2 adjusts the transverse position of the angle adjusting component 3; in actual work, two picking devices are used for picking up the wafer, one is to take the wafer out of the wafer tray and put the wafer into the angle adjusting component 3, and the other is to take the wafer out of the angle adjusting component 3 and then place the wafer in the wafer seat; in order to avoid mutual interference between the two pickup devices, the technical scheme is provided with a transverse linear module 2; the transverse linear module 2 is provided with two stations: the station is placed and the station is taken out, so that the whole operation is simple and convenient.
Further, the worktable 38 is provided with transverse moving grooves 37 on two sides of a supporting table 39, the transverse moving grooves 37 are connected with transverse sliding blocks 36 in a sliding manner, clamping seats 310 are connected above the transverse sliding blocks 36, the clamping seats 310 are connected with clamping blocks 317, the clamping blocks 317 are located on one side of the supporting table 39, the supporting table 39 is provided with a fixed positioning column 314, the clamping blocks 317 are provided with a movable positioning column 316, and a vertical hole 315 is located between the fixed positioning column 314 and the movable positioning column 316; the lower end of the holder 310 is connected with a stud 320, the side surface of the worktable 38 is connected with a fixed column 318, and a tension spring 319 is connected between the fixed column 318 and the stud 320.
The wafer needs to be positioned when it is placed on the support table 39; at present, two sides of a wafer are generally provided with positioning concave holes, when the wafer is placed, the clamping seat 310 can be shifted to one side, when the wafer is placed on the supporting platform 39, the clamping seat 310 is loosened, and the clamping seat 310 drives the movable positioning column 316 to move towards the supporting platform 39 under the action of the tension spring 319; the wafer is clamped and positioned by the movable positioning column 316 and the fixed positioning column 314, and then the support table 39 is vacuumized, adsorbed and fixed; the tension spring 319 is used to push the holder 310 to move, so that the movable positioning post 316 and the fixed positioning post 314 keep moving elastically, and when the size of the wafer changes, the wafer can still be held without damage.
Further, the worktable 38 is provided with a limiting table 312 at one side of the supporting table 39, two gaps are formed between the two supporting tables 39 and the limiting table 312, and the two clamping blocks 317 are respectively located in the two gaps.
The limiting table 312 is disposed such that the limiting table 312 and the two supporting tables 39 together form two gaps, which can limit the moving range of the two clamping blocks 317 and prevent the lateral sliding block 36 from being separated from the lateral moving groove 37.
Further, a connecting seat 26 is arranged between the sliding table 25 and the base plate 35, the transverse linear module 2 is connected with a transverse guide plate 23, and the connecting seat 26 is provided with a through hole matched with the transverse guide plate 23.
The connecting seat 26 and the through hole are arranged, so that when the sliding table 25 drives the connecting seat 26 to move, the connecting seat 26 can keep linear motion, and the shaking is reduced.
Further, an angle sensor 311 is connected to the rotation shaft.
By providing the angle sensor 311, the rotation angle of the rotation shaft can be controlled more accurately.
Further, horizontal linear module 2 is connected with sliding seat 22 including fixing the driving motor 21 in fixed station 1 one side, the top of fixed station 1, be equipped with in the sliding seat 22 lead screw 24 with slip table 25, lead screw 24 and slip table 25 threaded connection, lead screw 24 passes through the shaft coupling and is connected with driving motor 21's pivot, the both ends and the sliding seat 22 swing joint of lead screw 24.
The transverse linear module 2 adopts a screw rod 24 nut mechanism, the screw rod 24 is driven to rotate by the driving motor 21, and the sliding table 25 moves along the screw rod 24. Of course, other mechanisms, such as linear motors, air cylinders, etc., may be used.
Example 2: an automatic LED die bonder comprises the LED die angle position adjusting mechanism.
In specific implementation, the automatic LED die bonder further comprises: the wafer picking device comprises a wafer tray, a feeding mechanism, a picking device for picking and transferring wafers, a visual positioning system and a wafer seat.
The wafer dish is used for holding the wafer, carry the wafer to the transfer station through feed mechanism, the pickup attachment picks up the wafer, and place in LED wafer angular position guiding mechanism, visual positioning system shoots the LED wafer, obtain the position of wafer, the angle parameter, calculate the angle that the wafer needs to rotate, LED wafer angular position guiding mechanism carries out corresponding angle correction adjustment to the wafer, then another pickup attachment picks up the wafer to the wafer seat and pastes. The feeding mechanism, the picking device and the vision positioning system can all adopt the prior art.
The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.
Claims (7)
1. The utility model provides a LED wafer angular position guiding mechanism which characterized in that: the device comprises a fixed table, wherein a transverse linear module is fixed above the fixed table, the transverse linear module comprises a sliding table capable of moving transversely, an angle adjusting assembly is connected above the sliding table, the angle adjusting assembly comprises a base plate, two supporting seats are arranged on one side of the base plate, a shaft hole is formed in the middle of each supporting seat, a bearing is arranged in each shaft hole, a rotating shaft is connected between the two bearings, and one end of each rotating shaft extends outwards, extends out of the corresponding supporting seat and is connected with a servo motor; the utility model discloses a rotary table, including workstation, rotation axis, swivel mount, vertical hole, end cap, the other end of horizontal groove, the rotation axis is connected with the swivel mount, and the swivel mount is connected with the workstation, and the workstation is equipped with the fixing device who is used for fixed wafer, and fixing device includes two brace tables that upwards extend in the middle part of the workstation, the middle part of brace table is equipped with vertical hole, the side of workstation is equipped with the horizontal groove with vertical hole intercommunication, and the one end in horizontal groove is connected with the end cap.
2. The LED wafer angular position adjustment mechanism of claim 1, wherein: the worktable is provided with transverse moving grooves on two sides of a supporting table respectively, the transverse moving grooves are connected with transverse sliding blocks in a sliding mode, clamping seats are connected above the transverse sliding blocks and connected with clamping blocks, the clamping blocks are located on one side of the supporting table, the supporting table is provided with fixed positioning columns, the clamping blocks are provided with movable positioning columns, and vertical holes are located between the fixed positioning columns and the movable positioning columns; the lower end of the clamping seat is connected with a stud, the side face of the workbench is connected with a fixed column, and a tension spring is connected between the fixed column and the stud.
3. The LED wafer angular position adjustment mechanism of claim 2, wherein: the workbench is provided with a limiting table on one side of the supporting table, two gaps are formed between the two supporting tables and the limiting table, and the two clamping blocks are respectively located in the two gaps.
4. The LED wafer angular position adjustment mechanism of claim 3, wherein: a connecting seat is arranged between the sliding table and the base plate, the transverse linear module is connected with a transverse guide plate, and the connecting seat is provided with a through hole matched with the transverse guide plate.
5. The LED wafer angular position adjustment mechanism of claim 4, wherein: the rotating shaft is connected with an angle sensor.
6. The LED wafer angular position adjustment mechanism of claim 5, wherein: the transverse linear module comprises a driving motor fixed on one side of the fixed table, a sliding seat is connected above the fixed table, a lead screw is arranged in the sliding seat and is connected with the sliding table, the lead screw is in threaded connection with the sliding table, the lead screw is connected with a rotating shaft of the driving motor through a coupler, and two ends of the lead screw are movably connected with the sliding seat.
7. An automatic LED die bonder, comprising the LED die angle position adjusting mechanism of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921094908.8U CN209785895U (en) | 2019-07-14 | 2019-07-14 | LED wafer angular position adjustment mechanism and automatic LED die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921094908.8U CN209785895U (en) | 2019-07-14 | 2019-07-14 | LED wafer angular position adjustment mechanism and automatic LED die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209785895U true CN209785895U (en) | 2019-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921094908.8U Expired - Fee Related CN209785895U (en) | 2019-07-14 | 2019-07-14 | LED wafer angular position adjustment mechanism and automatic LED die bonder |
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| Country | Link |
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| CN (1) | CN209785895U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114352704A (en) * | 2022-01-14 | 2022-04-15 | 深圳特斯特半导体设备有限公司 | Blade main shaft structure of dicing saw |
-
2019
- 2019-07-14 CN CN201921094908.8U patent/CN209785895U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114352704A (en) * | 2022-01-14 | 2022-04-15 | 深圳特斯特半导体设备有限公司 | Blade main shaft structure of dicing saw |
| CN114352704B (en) * | 2022-01-14 | 2024-03-15 | 深圳特斯特半导体设备有限公司 | Blade spindle structure of dicing saw |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220708 Address after: 518100 104, building A3, Ligang South Road, Digang community, Shajing street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen Jingchuang investment partnership (L.P.) Address before: 523000 No.1, 4th floor, building a, Longsheng industrial park, huolianshu Waijing Industrial Park, Dongcheng Street, Dongguan City, Guangdong Province Patentee before: DONGGUAN JINGWANG ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191213 |
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| CF01 | Termination of patent right due to non-payment of annual fee |