WO2020100750A1 - Backup plate supply/recovery device, die bonder and bonding method - Google Patents

Backup plate supply/recovery device, die bonder and bonding method Download PDF

Info

Publication number
WO2020100750A1
WO2020100750A1 PCT/JP2019/043929 JP2019043929W WO2020100750A1 WO 2020100750 A1 WO2020100750 A1 WO 2020100750A1 JP 2019043929 W JP2019043929 W JP 2019043929W WO 2020100750 A1 WO2020100750 A1 WO 2020100750A1
Authority
WO
WIPO (PCT)
Prior art keywords
backup plate
plate
backup
plate body
magazine
Prior art date
Application number
PCT/JP2019/043929
Other languages
French (fr)
Japanese (ja)
Other versions
WO2020100750A8 (en
Inventor
永元　信裕
Original Assignee
キヤノンマシナリー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノンマシナリー株式会社 filed Critical キヤノンマシナリー株式会社
Priority to SG11202005714VA priority Critical patent/SG11202005714VA/en
Priority to JP2019562022A priority patent/JP6636681B1/en
Priority to CN201980004821.3A priority patent/CN111436220B/en
Publication of WO2020100750A1 publication Critical patent/WO2020100750A1/en
Publication of WO2020100750A8 publication Critical patent/WO2020100750A8/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Definitions

  • the present invention relates to a backup plate supply / recovery device, a die bonder, and a bonding method.
  • a bonding apparatus for bonding a chip to a lead frame conveys the island portion of the lead frame to a paste application position, applies the paste to the island portion, and further, the island portion, as described in Patent Document 1, for example. Is transported to the bonding position and the chip is bonded to this island portion.
  • the lead frame is supported from below by a backup plate in order to stabilize the paste application work and the bonding work.
  • the adhesive film DAF: die attach film
  • the substrate laminated frame or organic substrate
  • a backup plate is used to mount the chips on the board with high accuracy and high quality (voidless, uniform bonding strength). Therefore, the backup plate is manufactured in accordance with the substrate size, the substrate design pattern, and the like, and there are various types, and it is necessary to replace the backup plate according to the substrate.
  • Patent No. 6124969 gazette
  • the replacement frequency of the backup plate is high, the productivity will be poor.
  • the backup plate being worked is heated and the replacement is done manually, it is necessary to wait until the backup plate cools down, and one replacement time is long.
  • there are many types of backup plates there is a risk that the backup plate may be replaced with a different backup plate. Further, there is a possibility that the backup plate may not be mounted in a proper state after the replacement.
  • the present invention provides a backup plate supply / recovery device, a die bonder, and a bonding method capable of automating the exchange of backup plates and improving productivity.
  • the backup plate supply / collection device of the present invention supplies an arbitrary one backup plate from a plurality of types of backup plates to the plate body, and a backup plate supply / collection device that collects the supplied backup plate from the plate body.
  • a recovery device which comprises a magazine mechanism capable of sending out any one backup plate from a plurality of types of backup plates, and an elevating mechanism for relatively elevating the plate body and the backup plate, The backup rate sent from the magazine mechanism is arranged at the upper position or the lower position, and the plate body and the backup plate are integrated by the relative raising or lowering of the plate body and the backup plate via the elevating mechanism.
  • the plate body and the backup plate are separated by the relative lowering or raising of the plate body and the backup plate via the elevating mechanism.
  • an arbitrary one backup plate can be sent from the plurality of types of backup plates from the magazine mechanism.
  • the plate body and the backup plate are integrated by raising the plate body via the elevating mechanism. Further, the plate body and the backup plate are separated from each other by lowering the plate body through the elevating mechanism in a state where the plate body and the backup plate are integrated. In this way, the backup plate separated in this way can automatically perform supply / collection (replacement) of the backup plate instead of manually.
  • the substrate and the backup plate can be transported from the magazine mechanism to the plate body side or can be collected from the plate body side to the magazine mechanism.
  • the backup plate of this magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via the one transport mechanism or another transport mechanism. , The magazine mechanism can be collected. With this configuration, only one magazine mechanism that can supply to the plate body and collect from the plate body is sufficient, and the entire apparatus can be made compact.
  • At least a pair of magazine mechanisms are provided, the backup plate of one magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via one transport mechanism or another transport mechanism. Then, the magazine may be collected in the one magazine mechanism or another magazine mechanism. With such a configuration, the backup plate to be collected can be collected in the magazine mechanism that has supplied or another magazine mechanism, and the workability can be improved.
  • At least three or more magazine mechanisms are provided, and the backup plate of any one of the magazine mechanisms is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is the one transport mechanism or another.
  • the configuration may be such that the backup plate is collected by the magazine mechanism to which the backup plate is supplied or another magazine mechanism via the transport mechanism. With this configuration, various types of backup plates can be supplied to the plate main body from three or more magazine mechanisms, and the backup plates can be recovered by any of the magazine mechanisms. Become.
  • the transfer mechanism transfers the backup plate from the magazine mechanism to the plate body along the transfer rail, or the backup plate separated from the plate body to the magazine mechanism along the transfer rail, and the transfer rail is It is preferable that the guide rails are provided with a pair of facing guide rails, and each guide rail has a plate support portion for receiving a backup plate. With this configuration, the backup plate is transported while being supported by the transport rail, and can be stably transported when the backup plate is transported by the transport mechanism.
  • the pair of guide rails can be expanded / contracted in the guide rail interval, allowing the backup plate to pass between the guide rails when the interval is expanded, and allowing the guide rails to receive the backup plate on the guide rails when the interval is reduced. Is preferred.
  • the backup plate preferably has information for identifying the product type. In this way, with the information that identifies the type of product, the backup plate to be supplied can be identified, and misuse (misinstallation) can be prevented.
  • an identification mechanism that identifies the backup plate information. As described above, in the case where the identification mechanism is provided, the reliability of preventing misuse (misinstallation) is improved.
  • the backup plate can be attached to the plate body in a stable posture (regular posture).
  • the backup plate and the plate body can be configured so as to be integrated by a concavo-convex fitting structure.
  • the backup plate and the plate body can be integrated with a simple structure.
  • the concavo-convex fitting structure means that a member on one side is provided with a convex portion, and a member on the other side is provided with a concave portion to which the convex portion fits. Then, these two members are integrated. Therefore, it is possible to provide a convex portion on the backup plate side and a concave portion on the plate body side, or conversely, provide a concave portion on the backup plate side and a convex portion on the plate body side.
  • the die bonder of the present invention is a die bonder for bonding a chip to an island portion of a substrate, wherein the backup plate is conveyed by the backup plate supply / collection device, and the backup plate and the plate body are integrated, The substrate is supported by this backup plate.
  • a backup plate suitable for the substrate size and the substrate design pattern can be used, and the substrate can be supported by this backup plate. Therefore, the chips on the substrate can be stably bonded.
  • the bonding method of the present invention is a bonding method for bonding a chip to an island portion of a substrate, wherein the backup plate supply / recovery device conveys the backup plate to the plate body and integrates the plate body and the backup plate. Then, the substrate is supported by the backup plate and bonded to the island portion of the substrate.
  • the substrate can be supported by the backup plate that matches the substrate size and the board design pattern. Therefore, the chips on the substrate can be stably bonded.
  • the present invention can automatically supply and recover (replace) the backup plate instead of manually. Even when the backup plate is heated and used, the backup plate can be replaced without waiting for so-called cooling, resulting in excellent productivity.
  • FIG. 2 is a perspective view of a backup plate supply / recovery transfer rail shown in FIG. 1. It is a simplified diagram of the backup plate supply and recovery device of the present invention.
  • FIG. 7 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, in a state where the backup plate is conveyed to a position above the plate body via the guide rail.
  • FIG. 7 is a simplified cross-sectional view showing the relationship between the backup plate, the plate body, and the guide rail, and showing a state in which the plate body is raised to integrate the backup plate and the plate body.
  • FIG. 6 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, in a state where a space between the guide rails is enlarged.
  • FIG. 7 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, and a state where the plate body is lowered in a state where a space between the guide rails is enlarged.
  • FIG. 6 is a simplified diagram showing a relationship between a backup plate, a plate body, and a guide rail, in which a substrate is conveyed onto the backup plate via the guide rail.
  • FIG. 6 is a simplified diagram showing a relationship between a backup plate, a plate body, and a guide rail, in which the plate body is lifted and a substrate is attracted to the backup plate. It is a simplified diagram showing a work. It is a simplified diagram which shows operation
  • FIG. 1 shows a simplified block diagram of a backup plate supply / collection device according to the present invention
  • FIG. 2 shows a perspective view of a transfer rail of the backup plate supply / collection device
  • FIG. 3 shows an overall simplified backup plate supply / collection device. The figure is shown.
  • this backup plate supply / collection device one arbitrary backup plate 2 is sent from a plurality of types of backup plates (adapter plates) 2 from a loader 15, and the backup plate is provided downstream via a transfer path provided with a transfer rail 5.
  • the backup plate 2 is supplied to the plate main body 1 that is conveyed to the side and is arranged on the transfer path, and the supplied backup plate 2 is recovered from the plate main body 1 and supplied to the unloader 16.
  • the backup plate supply / recovery device includes one magazine mechanism (upstream magazine mechanism 3) capable of delivering any one backup plate 2 from a plurality of types of backup plates 2, and a plurality of magazine mechanisms.
  • the other magazine mechanism (downstream magazine mechanism 4) capable of accommodating one arbitrary backup plate from among the backup plates 2 of a kind, and the backup plate 2 sent from the upstream magazine mechanism 3 to the transport rail 5.
  • One transport mechanism (upstream transport mechanism 6) that transports the plate body 1 along with another transport mechanism (downstream transport mechanism 7) that transports the plate body 1 to the downstream magazine mechanism 4 and the plate body 1
  • an elevating mechanism 8 for elevating.
  • the plate body 1 is reciprocated along the transport rail 5 in the horizontal direction by the reciprocation mechanism 9 in addition to the elevation by the elevation mechanism 8.
  • the plate body 1 and the backup plate 2 constitute a shuttle 10, and the shuttle 10 is moved up and down by a drive means 11 including an elevating mechanism 8 and a reciprocating mechanism 9, or is reciprocating along a horizontal direction.
  • the backup plate supply / recovery device shown in FIG. 1 includes a pair of magazine mechanisms 3 and 4 and a pair of transport mechanisms 6 and 7.
  • the lifting mechanism 8 and the reciprocating mechanism 9 for example, a known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used.
  • the plate body 1 is formed of a rectangular flat plate body, and a convex portion 1 a is provided on the upper surface thereof.
  • the backup plate 2 is provided with notches 2a and 2a on the long side of the lower surface, is formed of a flat rectangular body, and is provided with a recess 2b into which the protrusion 1a is fitted.
  • the convex portion 1a and the concave portion 2b fitted into the convex portion 1a can constitute a concave-convex fitting structure M in which the plate body 1 and the backup plate 2 are integrated.
  • the shuttle 10 composed of the plate body 1 and the backup plate 2 is provided with a heating mechanism 12 and a suction mechanism 13.
  • the heating mechanism 12 can be composed of, for example, a heating wire built in the plate body 1 and a power source for heating the heating wire, but the heating mechanism 12 is not limited to this, and may use steam. Alternatively, induction heating may be used. That is, it is only necessary that the substrate 22 needs to be heated and that the heating method does not adversely affect the substrate 22 and the chips.
  • the suction mechanism 13 is composed of, for example, a suction passage arranged in the shuttle 10 (the plate body 1 and the backup plate 2) and a vacuum generator connected to the suction passage. A suction port that opens on the upper surface of 2 is formed.
  • a vacuum pump may be used, or an ejector type that controls opening / closing of high-pressure air and discharges it from a nozzle to a diffuser to generate a negative pressure in the diffusion chamber may be used.
  • the upstream magazine mechanism 3 includes a loader 15 (see FIG. 3) in which a plurality of backup plates 2 are arranged in the vertical direction, an elevator mechanism (not shown) that raises and lowers the loader 15, and a predetermined height position. And a pusher mechanism (not shown) provided. Therefore, the loader 15 is moved up and down, and one of the plurality of backup plates 2 housed in the loader 15 corresponds to the pusher mechanism. Then, in this state, the height-aligned backup plate 2 is pushed out to the transport rail 5 side by the pusher mechanism.
  • the downstream magazine mechanism 4 includes an unloader 16 (see FIG. 3) in which a plurality of backup plates 2 are arranged in the vertical direction, an elevating mechanism (not shown) for elevating the unloader 16, and a predetermined height. And a pusher mechanism (not shown) disposed at a position.
  • the unloader 16 is moved up and down so that the storage portion at a predetermined height position corresponds to the pusher mechanism for the backup plate transported through the transport rail 5. Then, in this state, the backup plate 2 is pushed into the storage unit whose height is aligned.
  • FIG. 1 As shown in FIG. 2, FIG. 4A, FIG. 4B and FIG. 5A to FIG. And a guide rail expansion / contraction mechanism 17 (see FIG. 1).
  • Each of the guide rails 5a and 5a is made of a strip-shaped body, and receiving pieces 5a1 and 5a1 are projectingly provided at the central portions in the vertical direction of the facing surfaces.
  • the guide rail expansion / contraction mechanism 17 may be a known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, or a linear guide mechanism.
  • the pair of guide rails 5a, 5a approach each other to hold the backup plate 2, and as shown in FIG.
  • the guide rails 5a, 5a are separated from each other, and the backup plate 2 between the guide rails 5a, 5a is displaced so as to be able to descend.
  • each of the upstream side transport mechanism 6 and the downstream side transport mechanism 7 has a chuck portion that chucks the backup plate 2 and a reciprocating mechanism that reciprocates the chuck portion along the transport rail 5.
  • the chuck portion can be constituted by, for example, an openable / closable chuck claw and the like, and as the reciprocating mechanism, a well-known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear guide mechanism or the like can be used.
  • this apparatus is provided with a posture detection mechanism 18 that detects the mounting posture of the backup plate 2 on the plate body 1, and an identification mechanism 19 that identifies the information of the backup plate 2.
  • the information of the backup plate 2 is information for matching the information of the substrate to be sucked by the backup plate.
  • the board information includes board size, board design pattern, and the like.
  • the attitude detection mechanism 18 includes an image recognition camera (not shown), and detects a difference between the position coordinates of the plate body 1 whose position coordinates are calculated in advance and the position coordinates of the backup plate 2 calculated using the image recognition camera. It is a thing. Therefore, by correcting this difference, the device can be mounted accurately. That is, this image recognition camera can detect (calculate) the position coordinates of the plate body 1 and detect (calculate) the position coordinates of the backup plate 2. Therefore, the difference between these positions is calculated by the calculation unit of the control means 20 (see FIG. 1), and thereby the position correction (position correction) of the plate body 1 and / or the backup plate 2 is performed, and the plate body is corrected. 1 and the backup plate 2 can be aligned.
  • this image recognition camera can detect (calculate) the position coordinates of the plate body 1 and detect (calculate) the position coordinates of the backup plate 2. Therefore, the difference between these positions is calculated by the calculation unit of the control means 20 (see FIG. 1), and thereby the position correction (position correction) of
  • the identification mechanism 19 reads the identified portion provided on the backup plate 2.
  • the identified portion can be composed of printed characters, symbols, figures, barcodes, QR codes (registered trademark), or the like.
  • the reading means characters, symbols, figures, etc. can be read by image processing and the like, and a bar code can be read by a bar code reader and a QR code can be read by a QR code reader.
  • control means 20 Similar to the above-mentioned bonding apparatus, for example, a microcomputer in which a CPU (Central Processing Unit) is central to a ROM (Read Only Memory), a RAM (Random Access Memory), etc., is interconnected via a bus. is there.
  • the ROM stores programs executed by the CPU and data.
  • the supply target member S (the substrate 22) transported via the transport rail 5 is transferred to the transport rail 5 as shown in FIG. 5C. 5 and is attracted to the shuttle 10 as shown in FIG. 5D, and the member S to be supplied is attracted to the feed position of the transport rail 5, and as shown in FIG.
  • the work W is mounted on the supply target portion Sa of S.
  • the work W is a chip 21 that is cut out from a wafer (work assembly) 26, and the chip 21 of this wafer 26 has a plurality of grades.
  • one wafer 26 has many first grades and few second grades and third grades.
  • the second grade may be larger than the third grade
  • the third grade may be larger than the second grade
  • the second grade and the third grade may be the same number.
  • the supply target member S is a substrate 22 such as a lead frame, and the supply target portion Sa is an island portion 22a on the substrate 22, and the chip 21 is bonded to each island portion 22a.
  • a bonding device die bonder as shown in FIG. 7 is used.
  • a chip (semiconductor chip) 21 cut out from a wafer 26 is picked up by a collet (suction collet) 23 at a pickup position P and transferred (mounted) to a bonding position Q of a substrate 22 such as a lead frame.
  • the wafer 26 is adhered onto a wafer sheet (adhesive sheet 25) stretched on a metal ring (wafer ring) and divided (divided) into a large number of chips 21 by a dicing process.
  • the collet 23 is raised in the arrow A direction and lowered in the arrow B direction on the pickup position P, raised in the arrow C direction and lowered in the arrow D direction on the bonding position Q, and picked up. Reciprocation between the position P and the bonding position Q in the directions of arrows E and F is possible.
  • the collet 23 is attached to a bonding head (not shown), and this bonding head is attached to a bonding arm (not shown). Therefore, the bonding arm is controlled by a control means (not shown) so that the collet 23 is controlled to move the arrows A, B, C, D, E and F.
  • the control means is, for example, a microcomputer in which a central processing unit (CPU), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus.
  • the ROM stores programs executed by the CPU and data.
  • the chip 21 has the first grade, the second grade, and the third grade in this embodiment. Further, chips 21 of the same grade are mounted on one substrate 22. Therefore, the board 22 includes the board 22 (22A) on which the first grade chip 21 is mounted, the board 22 (22B) on which the second grade chip 21 is mounted, and the third grade. There is a substrate 22 (22C) on which the chip 21 of FIG.
  • the backup plate 2 includes a first backup plate 2A corresponding to the substrate 22A, a second backup plate 2B corresponding to the substrate 22B, and a third backup plate 2A corresponding to the substrate 22C.
  • the loader 15 includes a first loader 15A that stores the backup plate 2A, a second loader 15B that stores the backup plate 2B, and a third loader 15C that stores the backup plate 2C.
  • the unloader 16 includes a first unloader 16A in which the backup plate 2A is stored, a second unloader 16B in which the backup plate 2B is stored, and a third unloader 16C in which the backup plate 2C is stored. ..
  • the operation of the backup plate supply / collection device configured as described above will be described.
  • the substrate 22 (22A) on which the chip 21 of the first grade is mounted is used. Therefore, as the backup plate 2 of the shuttle 10, the backup plate 2A corresponding to this substrate 22A is used.
  • the backup plate 2A is delivered from the loader 15, guided by the transport rail 5 (received by the receiving pieces 5a1 and 5a1), and the upstream side transport mechanism 6 is used to move the plate body 1 as shown in FIG. 4A.
  • the receiving pieces 5a1 and 5a1 of the transport rail 5 are fitted into the notches 2a and 2a of the backup plate 2 (2A) and are supported by the transport rail 5.
  • the plate body 1 descends and is positioned below the receiving pieces 5a1 and 5a1 of the transport rail 5.
  • the image recognition camera corrects the difference between the position coordinates of the shuttle 10 and the position coordinates of the backup plate 2.
  • the convex portion 1a of the plate body 1 is fitted into the concave portion 2b of the backup plate 2, and the plate body 1 and the backup plate 2 are separated from each other as shown in FIG. 4B.
  • the backup plate 2 is chucked by the chuck portion of the upstream side transport mechanism 6, the rise of the backup plate 2 due to the rise of the plate body 1 is restricted, and the convex portion 1a of the plate body 1 is moved to the backup plate 2. It can be fitted into the recess 2b.
  • the substrate 22 (22A) is guided by the transport rail 5 (received by the receiving pieces 5a1 and 5a1), and the upstream transport mechanism 6 is provided. As shown in FIG. 5A, the substrate 22A is positioned above the shuttle 10 composed of the plate body 1 and the backup plate 2.
  • the guide rails 5a, 5a of the transport rail 5 are relatively separated from each other. That is, the guide rails 5a, 5a are expanded to make the gap between the receiving pieces 5a1, 5a1 larger than the width dimension of the backup plate 2.
  • W1 the distance between the receiving pieces 5a1 and 5a1
  • W1> W the width dimension of the backup plate 2
  • the shuttle 10 is lowered. In this case, the guide rails 5a and 5s are positioned lower than the receiving pieces 5a1 and 5a1.
  • the board 22 (22A) is delivered from a loader (a loader different from the loader 15 housing the backup plate 2 and housing the board 22), and the board 22A is guided to the transport rail 5. Then, it is transported onto the shuttle 10 by using the upstream transport mechanism 6 as shown in FIG. 5C.
  • the backup plate 2 of the shuttle 10 has a shape corresponding to the substrate 22A, that is, the first plate 2A is attached to the plate body 1.
  • the distance between the receiving pieces 5a1 and 5a1 is smaller than the width dimension of the board 22 (22A), and the dimension between the facing surfaces of the guide rails 5a and 5a with respect to the receiving pieces 5a1 and 5a1 is the width of the board 22 (22A). It is larger than the size.
  • the width dimension of the substrate 22 is W3, and the dimension between the facing surfaces is W2, W1 ⁇ W3 ⁇ W2.
  • the substrate 22 can be received by the receiving pieces 5a1 and 5a1.
  • the shuttle 10 rises to adsorb the substrate 22 to the upper surface of the shuttle 10. At this time, it is preferable to press the substrate 22 with a clamper (not shown) or the like.
  • the substrate 22 sucked and held by the shuttle 10 is heated, and the chip 21 as the work W is bonded to the island portion 22a of the substrate 22.
  • the bonding step after the bonding to the island portion 22a (see FIG. 7) in a row in the direction orthogonal to the transport direction (longitudinal direction) is completed, the shuttle 10 receiving the bonded substrate 22 is moved to the downstream side. A predetermined amount is moved via the reciprocating mechanism 9 to enable bonding to the next row of island portions 22a.
  • the substrate 22 is supported by the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a as shown in FIG. Then, it is transported to the unloader on the downstream side (an unloader different from the unloader 16 in which the backup plate 2 is stored, in which the substrate 22 is stored), and the substrate 22 is stored in this unloader.
  • the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a are connected to the cutout portion 2a of the backup plate 2.
  • the plate body 1 is moved down while being fitted in 2a.
  • the backup plate 2 received by the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a only the plate body 1 is lowered and the plate body 1 and the backup plate 2 are separated.
  • the backup plate 2 is transported to the unloader 16 side via the downstream transport mechanism 7, and the backup plate 2 is stored in the unloader 16.
  • another backup plate 2 for example, the backup plate 2B is sent from the loader 15B, and the upstream transport mechanism 6 is used to arrange the backup plate 2B above the plate body 1 as shown in FIG. 4A. After that, the plate body 1 and the backup plate 2B are integrated by lowering the plate body 1.
  • the shuttle 10 for the board 22B can be configured, and the board 22B is delivered from the loader (a loader different from the loader 15 in which the backup plate 2 is housed and the board 22 is housed).
  • the chip 21 can be mounted on the substrate 22B.
  • the substrate 22B is unloaded on the downstream side (an unloader different from the unloader 16 in which the backup plate 2 is accommodated, and the substrate 22 is accommodated). Can be supplied to.
  • the backup plate 2 (2C) can be exchanged, the substrate 22C can be sucked and held by the backup plate 2C, and the substrate 22C The chip 21 can be mounted.
  • an arbitrary one backup plate 2 can be sent from the plurality of types of backup plates 2 from the upstream magazine mechanism 4, and this backup plate 2 is transported upstream. It can be transported to the plate body 1 by the mechanism 6. This transportation is carried to the plate body 1 while being supported by the transportation rail 5. Then, the plate body 1 is elevated via the elevating mechanism 8 so that the plate body 1 and the backup plate 2 are integrated. Further, when the plate body 1 and the backup plate 2 are integrated, the plate body 1 is lowered via the elevating mechanism 8 to separate the plate body 1 and the backup plate 2. The backup plate 2 separated in this way is transported to the downstream magazine mechanism 4 by the downstream transport mechanism 7. In this case, the backup plate 2 is transported while being supported by the transport rail 5.
  • the supply / collection (replacement) of the backup plate 2 can be performed automatically instead of manually. Even when the backup plate 2 is heated and used, the backup plate 2 can be replaced without waiting for so-called cooling, resulting in excellent productivity.
  • Each of the guide rails 5a, 5a has a plate supporting portion (receiving pieces 5a1, 5a1) for receiving the backup plate 2. With this configuration, the backup plate 2 can be stably transported when the upstream transport mechanism 6 and the downstream transport mechanism 7 transport the backup plate 2.
  • the pair of guide rails 5a and 5a can be expanded / contracted with respect to the guide rail interval, so that the backup plate 2 can be stably supported (received) according to the size of the back plate 2. Further, since the backup plate 2 has the information for identifying the product type, it is possible to identify the backup plate 2 to be supplied and prevent misuse (erroneous mounting). A device provided with an identification mechanism for identifying the information of the backup plate 2 improves the reliability of preventing misuse (misinstallation).
  • the backup plate 2 With the posture detection mechanism 18 that detects the mounting posture of the backup plate 2 on the plate body 1, the backup plate 2 can be mounted on the plate body 1 in a stable posture (regular posture).
  • the backup plate 2 and the plate body 1 are integrated by the concave-convex fitting structure M
  • the backup plate 2 and the plate body 1 can be integrated with a simple structure.
  • the concavo-convex fitting structure M means that a member on one side is provided with a convex portion and a member on the other side is provided with a concave portion into which the convex portion fits, and when they are overlapped, the convex portion fits into the concave portion. Then, these two members are integrated.
  • the backup plate supply / collection device since the backup plate supply / collection device according to the present invention is used, the backup plate 2 suitable for the substrate size and the substrate design pattern can be used, and the substrate 22 is supported by the backup plate 2. can do. Therefore, the chip 21 of the substrate 22 can be stably bonded.
  • the base can be supported by the backup plate that matches the board size and the board design pattern. Therefore, the chips on the substrate can be stably bonded.
  • the transfer mechanisms 6 and 7 for transferring the backup plate 2 can also serve as a transfer mechanism for transferring the substrate 22. That is, the transfer mechanisms 6 and 7 can be shared by the backup plate 2 and the substrate 22. By sharing in this way, the overall size of the device can be reduced.
  • the backup plate 2 is moved to the plate body 1 via the upstream side transport mechanism 6 having a chuck portion that chucks the backup plate 2 and a reciprocating mechanism that reciprocates the chuck portion along the transport rail 5.
  • the backup plate 2 may be conveyed to a position above the plate body 1 via another conveying means such as a crane. With this configuration, it is not necessary to use the transport rail 5, and the device can be made compact.
  • the backup plate 2 is carried by the upstream carrying mechanism 6, but the plate body 1 may be carried by the upstream carrying mechanism 6, and the backup plate 2 and the plate body may be carried. Any of the above items 1 and 2 may be one that can be carried by the upstream carrying mechanism 6. That is, at least one of the backup plate 2 and the plate body 1 is transported, and the backup plate 2 is arranged on the plate body 1 by the relative movement of the backup plate 2 and the plate body 1. Good.
  • a pair of magazine mechanisms 3 and 4 and a pair of transport mechanisms 6 and 7 are provided, and the backup plate 2 of the magazine mechanism 3 is transported by the transport mechanism 6 to the plate body 1 side.
  • the backup plate 2 separated from the plate body 1 is transported to the magazine mechanism 4 via the transport mechanism 7.
  • the backup plate 2 of the magazine mechanism 4 is transported to the plate body 1 side by the transport mechanism 7, and the backup plate 2 separated from the plate body 1 is transported to the magazine mechanism 3 via the transport mechanism 6. It may be one that does.
  • the backup plate 2 separated from the plate body 1 may be collected in the magazine mechanism 3 or the magazine mechanism 4 via the transport mechanism 6 or the transport mechanism 7. That is, the backup plate of the one magazine mechanism is supplied to the plate body via the one transport mechanism, and the backup plate separated from the plate body is transported to the one magazine via the one transport mechanism or another transport mechanism. It may be collected in a mechanism or other magazine mechanism. With such a configuration, the backup plate to be collected can be collected in the magazine mechanism that has supplied or another magazine mechanism, and the workability can be improved.
  • any magazine mechanism 3 (4) is provided, and the backup plate 2 of this magazine mechanism 3 (4) is collected in this magazine mechanism 3 (4) by any transport mechanism 6 (7). It may be. That is, the backup plate of the magazine mechanism is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is fed to the one magazine mechanism via the one transport mechanism or another transport mechanism. Can be configured to be recovered. With this configuration, only one magazine mechanism that can supply to the plate body and collect from the plate body is sufficient, and the entire apparatus can be made compact.
  • various types of backup plates can be supplied to the plate body from three or more magazine mechanisms, and the backup plates can be collected by any of the magazine mechanisms, resulting in a device with excellent convenience. ..
  • the present invention is not limited to the above-described embodiment, and various modifications can be made.
  • the substrate 22 for bonding the chip 21 cut out from the wafer 26 was used as the supply target member S.
  • a card such as a credit card, a cash card, an IC card, or a flat plate such as a sheet metal may be used. Therefore, the work W to be supplied to the supply target member S is not limited to the chip 21, but a component corresponding to the supply target member S. If the member S to be supplied is not the substrate 22 and does not require heating, the heating mechanism 12 of the shuttle 10 can be omitted.
  • the number of shuttles 10 is one in the above embodiment, but there may be two or more.
  • the types of the backup plate 2 are not limited to three types, and may be one type, two types, or three or more types.
  • a display means for example, an alarm sound is generated to indicate that
  • the backup plate 2 and the plate body 1 are not aligned (when an error occurs). It is also possible to provide such) on a monitor or the like.
  • the recess 1b of the concavo-convex fitting structure M is formed of a through hole, but it may be formed of a stop hole having a bottom surface instead of the through hole. Further, the number of the convex portions 1a and the concave portions 2b of the concave-convex fitting structure M is not limited to one each.
  • the pusher mechanism is provided as the magazine mechanisms 3 and 4 in the above-described embodiment, the magazine mechanism 3 or 4 may not have such a pusher mechanism. When the pusher mechanism is not provided, the backup plate in the magazine mechanism 3 (4) can be pulled out by the transporting means 6, 7 or other pulling mechanism.
  • It can be used for sending out any one backup plate from multiple types of backup plates in the loader, supplying the backup plate to the plate body, and collecting the supplied backup plate from the plate body. it can.

Abstract

The present invention transports a backup plate in a state of being supported by a transport rail to a main plate body via a transport mechanism, integrates the main plate body and the backup plate with one another by raising the main plate body using a raising/lowering mechanism, causes the backup plate to be supported by the transport rail when the main plate body is lowered using the raising/lowering mechanism, resulting in the separation of the main plate body and the backup plate, and transports the separated backup plate while supported by the transport rail to a magazine mechanism via the transport mechanism.

Description

バックアッププレート供給・回収装置、ダイボンダ、及びボンディング方法Backup plate supply / collection device, die bonder, and bonding method
　本発明は、バックアッププレート供給・回収装置、ダイボンダ、及びボンディング方法に関するものである。 The present invention relates to a backup plate supply / recovery device, a die bonder, and a bonding method.
　リードフレームにチップをボンディングするボンディング装置は、例えば、特許文献１に記載のように、リードフレームのアイランド部をペースト塗布位置まで搬送して、そのアイランド部にペーストを塗布した後、さらにこのアイランド部をボンディング位置まで搬送し、このアイランド部にチップをボンディングするものである。ペースト塗布位置及びボンディング位置においては、リードフレームは、ペースト塗布作業やボンディング作業を安定させるために、バックアッププレートにて下方から支持される。 A bonding apparatus for bonding a chip to a lead frame conveys the island portion of the lead frame to a paste application position, applies the paste to the island portion, and further, the island portion, as described in Patent Document 1, for example. Is transported to the bonding position and the chip is bonded to this island portion. At the paste application position and the bonding position, the lead frame is supported from below by a backup plate in order to stabilize the paste application work and the bonding work.
　すなわち、予めチップ（半導体チップ）の裏面に貼付けられた接着フィルム（ＤＡＦ：ダイアタッチフィルム）を加熱して基板（リードフレームもしくは有機基板）に貼付けた場合、ボンディング位置（ボンディングポジション）まで搬送された基板に精度よくかつ高品質（ボイドレス、接合強度均一）にチップを搭載するために、バックアッププレートを用いる。このため、バックアッププレートは、基板サイズや基板設計パターン等に合わせて製作され、種々の種類のものがあり、基板に合わせてバックアッププレートを交換する必要があった。 That is, when the adhesive film (DAF: die attach film) previously attached to the back surface of the chip (semiconductor chip) is heated and attached to the substrate (lead frame or organic substrate), it is conveyed to the bonding position (bonding position). A backup plate is used to mount the chips on the board with high accuracy and high quality (voidless, uniform bonding strength). Therefore, the backup plate is manufactured in accordance with the substrate size, the substrate design pattern, and the like, and there are various types, and it is necessary to replace the backup plate according to the substrate.
　従来では、同一の基板に対してボンディングする日数が多く、バックアッププレートの交換頻度は、数週間から１か月程度と少なかった。このため、あまり生産性に問題がなかった。しかしながら、近年、少量多品種生産が主流となり、ユーザによっても数十種類に及ぶことがあり、交換頻度が多くなり、時には毎日、さらには、１日に数回になる場合がある。 Previously, the number of days for bonding to the same substrate was large, and the replacement frequency of the backup plate was a few weeks to a month. Therefore, there was not much problem in productivity. However, in recent years, low-volume, high-mix production has become the mainstream, and there are dozens of types depending on the user, and the frequency of replacement increases, sometimes every day, and sometimes several times a day.
特許第６１２４９６９号公報Patent No. 6124969 gazette
　バックアッププレートの交換頻度が多くなれば、生産性に劣ることになる。しかも、作業を行っていたバックアッププレートは加熱されており、かつ交換は手作業で行うものであるので、バックアッププレートが冷めるまで待つ必要があり、１回の交換時間が大となっていた。また、バックアッププレートの種類も多く、交換すべきバックアッププレートと相違するバックアッププレートに交換してしまうおそれもあった。さらに、交換後にバックアッププレートが正規状態で装着されないおそれもあった。 If the replacement frequency of the backup plate is high, the productivity will be poor. In addition, since the backup plate being worked is heated and the replacement is done manually, it is necessary to wait until the backup plate cools down, and one replacement time is long. In addition, since there are many types of backup plates, there is a risk that the backup plate may be replaced with a different backup plate. Further, there is a possibility that the backup plate may not be mounted in a proper state after the replacement.
　本発明は、上記課題に鑑みて、バックアッププレートの交換の自動化を図ることができて生産性の向上を達成できるバックアッププレートの供給・回収装置、ダイボンダ、およびボンディング方法を提供する。 In view of the above problems, the present invention provides a backup plate supply / recovery device, a die bonder, and a bonding method capable of automating the exchange of backup plates and improving productivity.
　本発明のバックアッププレート供給・回収装置は、プレート本体に、複数種のバックアッププレートの中から任意の一枚のバックアッププレートを供給するとともに、供給されたバックアッププレートをプレート本体から回収するバックアッププレート供給・回収装置であって、複数種のバックアッププレートの中から任意の一枚のバックアッププレートを送出可能なマガジン機構と、プレート本体とバックアッププレートとを相対的に昇降させる昇降機構とを備え、プレート本体の上方位置又は下方位置に、マガジン機構から送出されたバックアップレートを配置し、昇降機構を介してのプレート本体とバックアッププレートとの相対的な上昇又は下降にて、プレート本体とバックアッププレートとが一体化し、昇降機構を介してのプレート本体とバックアッププレートとの相対的な下降又は上昇にて、プレート本体とバックアッププレートとが分離するものである。 The backup plate supply / collection device of the present invention supplies an arbitrary one backup plate from a plurality of types of backup plates to the plate body, and a backup plate supply / collection device that collects the supplied backup plate from the plate body. A recovery device, which comprises a magazine mechanism capable of sending out any one backup plate from a plurality of types of backup plates, and an elevating mechanism for relatively elevating the plate body and the backup plate, The backup rate sent from the magazine mechanism is arranged at the upper position or the lower position, and the plate body and the backup plate are integrated by the relative raising or lowering of the plate body and the backup plate via the elevating mechanism. The plate body and the backup plate are separated by the relative lowering or raising of the plate body and the backup plate via the elevating mechanism.
　本発明のバックアッププレートの供給・回収装置では、マガジン機構から複数種のバックアッププレートの中から任意の一枚のバックアッププレートを送出することができる。プレート本体が昇降機構を介して上昇することによって、プレート本体とバックアッププレートとが一体化する。また、プレート本体とバックアッププレートとが一体化した状態で、プレート本体を昇降機構を介して下降させることによって、プレート本体とバックアッププレートが分離する。このように分離したバックアッププレートは、このように、バックアッププレートの供給・回収（交換）を手動ではなく自動的に行うことができる。 With the backup plate supply / collection device of the present invention, an arbitrary one backup plate can be sent from the plurality of types of backup plates from the magazine mechanism. The plate body and the backup plate are integrated by raising the plate body via the elevating mechanism. Further, the plate body and the backup plate are separated from each other by lowering the plate body through the elevating mechanism in a state where the plate body and the backup plate are integrated. In this way, the backup plate separated in this way can automatically perform supply / collection (replacement) of the backup plate instead of manually.
　プレート本体とバックアッププレートと一体化されてなるシャトルに保持されるべき基板と、マガジン機構のバックアッププレートとのいずれかを搬送する搬送機構を備えたものとできる。このような搬送機構を備えたものでは、基板やバックアッププレートをマガジン機構からプレート本体側へ搬送したり、プレート本体側からマガジン機構へ回収させたりできる。 It can be equipped with a transport mechanism that transports either the substrate to be held on the shuttle, which is integrated with the plate body and the backup plate, or the backup plate of the magazine mechanism. In the one provided with such a transport mechanism, the substrate and the backup plate can be transported from the magazine mechanism to the plate body side or can be collected from the plate body side to the magazine mechanism.
　一つのマガジン機構を備え、このマガジン機構のバックアッププレートは一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、前記一の搬送機構又は他の搬送機構を介して、前記一のマガジン機構に回収されるように構成できる。このように構成することによって、プレート本体へ供給したり、プレート本体から回収したりできるマガジン機構が１機で済み、装置全体のコンパクト化が可能となる。 It is equipped with one magazine mechanism, the backup plate of this magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via the one transport mechanism or another transport mechanism. , The magazine mechanism can be collected. With this configuration, only one magazine mechanism that can supply to the plate body and collect from the plate body is sufficient, and the entire apparatus can be made compact.
　少なくとも一対のマガジン機構を備え、一のマガジン機構のバックアッププレートは一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、一の搬送機構又は他の搬送機構を介して、前記一のマガジン機構又は他のマガジン機構に回収される構成としてもよい。このように構成することによって、回収するバックアッププレートを供給したマガジン機構又は他のマガジン機構に回収することができ、作業性の向上を図ることができる。 At least a pair of magazine mechanisms are provided, the backup plate of one magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via one transport mechanism or another transport mechanism. Then, the magazine may be collected in the one magazine mechanism or another magazine mechanism. With such a configuration, the backup plate to be collected can be collected in the magazine mechanism that has supplied or another magazine mechanism, and the workability can be improved.
　少なくとも３機以上のマガジン機構を備え、いずれかのマガジン機構のバックアッププレートが一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、前記一の搬送機構又は他の搬送機構を介して、前記バックアッププレートが供給されたマガジン機構又は他のマガジン機構に回収される構成であってもよい。このように構成することによって、３機以上のマガジン機構から種々の種類のバックアッププレートをプレート本体に供給でき、また、バックアッププレートをいずれかのマガジン機構の回収ができ、至便性に優れた装置となる。 At least three or more magazine mechanisms are provided, and the backup plate of any one of the magazine mechanisms is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is the one transport mechanism or another. The configuration may be such that the backup plate is collected by the magazine mechanism to which the backup plate is supplied or another magazine mechanism via the transport mechanism. With this configuration, various types of backup plates can be supplied to the plate main body from three or more magazine mechanisms, and the backup plates can be recovered by any of the magazine mechanisms. Become.
　搬送機構は、マガジン機構からバックアッププレートを搬送レールに沿ってプレート本体まで搬送、又は、プレート本体から分離された状態のバックアッププレートを、搬送レールに沿ってマガジン機構まで搬送し、搬送レールは、相対向する一対のガイドレールを備え、各ガイドレールには、バックアッププレートを受けるプレート支持部を有するものが好ましい。このように構成することによって、バックアッププレートは搬送レールに支持された状態で搬送され、搬送機構にてバックアッププレートを搬送する際に、安定して搬送できる。 The transfer mechanism transfers the backup plate from the magazine mechanism to the plate body along the transfer rail, or the backup plate separated from the plate body to the magazine mechanism along the transfer rail, and the transfer rail is It is preferable that the guide rails are provided with a pair of facing guide rails, and each guide rail has a plate support portion for receiving a backup plate. With this configuration, the backup plate is transported while being supported by the transport rail, and can be stably transported when the backup plate is transported by the transport mechanism.
　一対のガイドレールは、ガイドレール間隔の拡縮が可能であり、間隔拡大状態で、バックアッププレートのガイドレール間の通過を許容し、間隔縮小状態でガイドレールにプレート支持部によるバックアッププレートの受けが可能であるのが好ましい。 The pair of guide rails can be expanded / contracted in the guide rail interval, allowing the backup plate to pass between the guide rails when the interval is expanded, and allowing the guide rails to receive the backup plate on the guide rails when the interval is reduced. Is preferred.
　バックアッププレートは、品種を識別する情報を具備しているのが好ましい。このように、品種を識別する情報を具備するものでは、供給すべきバックアッププレートを識別でき、誤使用（誤取付）を防止できる。 -The backup plate preferably has information for identifying the product type. In this way, with the information that identifies the type of product, the backup plate to be supplied can be identified, and misuse (misinstallation) can be prevented.
　この場合、バックアッププレートの情報を識別する識別機構を備えているのが好ましい。このように、識別機構を備えているものでは、誤使用（誤取付）の防止の信頼性が向上する。 In this case, it is preferable to have an identification mechanism that identifies the backup plate information. As described above, in the case where the identification mechanism is provided, the reliability of preventing misuse (misinstallation) is improved.
　前記バックアッププレートのプレート本体への装着姿勢を検出する姿勢検出機構を備えているものが好ましい。このような姿勢検出機構を備えたものでは、バックアッププレートを安定した姿勢(正規姿勢)でプレート本体に装着することができる。 It is preferable to have a posture detection mechanism for detecting the mounting posture of the backup plate on the plate body. With a device provided with such a posture detection mechanism, the backup plate can be attached to the plate body in a stable posture (regular posture).
　バックアッププレートとプレート本体とが凹凸嵌合構造にて一体化されるように構成できる。このように凹凸嵌合構造にて一体化するものでは、簡単か構造でバックアッププレートとプレート本体との一体化を図ることができる。ここで、凹凸嵌合構造とは、一方側の部材に凸部を設け、他方側の部材にこの凸部が嵌合する凹部を設け、重ね合わせた際に、凸部が凹部に嵌合して、この２つの部材が一体化する。このため、バックアッププレート側に凸部を設け、プレート本体側に凹部を設けたり、逆にバックアッププレート側に凹部を設け、プレート本体側に凸部を設けたりできる。なお、プレート本体とバックアッププレートとが一体化状態を維持するための手段として、真空吸着やロック機構を持ち合わせることが望ましい。 -The backup plate and the plate body can be configured so as to be integrated by a concavo-convex fitting structure. In the case of using the concave-convex fitting structure for integration, the backup plate and the plate body can be integrated with a simple structure. Here, the concavo-convex fitting structure means that a member on one side is provided with a convex portion, and a member on the other side is provided with a concave portion to which the convex portion fits. Then, these two members are integrated. Therefore, it is possible to provide a convex portion on the backup plate side and a concave portion on the plate body side, or conversely, provide a concave portion on the backup plate side and a convex portion on the plate body side. In addition, it is desirable to have a vacuum suction or a lock mechanism as a means for maintaining the plate body and the backup plate in an integrated state.
　本発明のダイボンダは、チップを基板のアイランド部にボンディングするダイボンダであって、前記バックアッププレート供給・回収装置にてバックアッププレートが搬送され、バックアッププレートとプレート本体とが一体化された状態にて、このバックアッププレートにて基板が支持されるものである。 The die bonder of the present invention is a die bonder for bonding a chip to an island portion of a substrate, wherein the backup plate is conveyed by the backup plate supply / collection device, and the backup plate and the plate body are integrated, The substrate is supported by this backup plate.
　本発明のダイボンダによれば、基板サイズや基板設計パターンにあったバックアッププレートを用いることができ、このバックアッププレートにて基板を支持することができる。このため、基板のチップを安定してボンディングすることができる。 According to the die bonder of the present invention, a backup plate suitable for the substrate size and the substrate design pattern can be used, and the substrate can be supported by this backup plate. Therefore, the chips on the substrate can be stably bonded.
　本発明のボンディング方法は、チップを基板のアイランド部にボンディングするボンディング方法であって、前記バックアッププレート供給・回収装置にて、プレート本体までバックアッププレートを搬送して、プレート本体とバックアッププレートとを一体化して、このバックアッププレートにて基板を支持させた状態で、基板のアイランド部にボンディングするものである。 The bonding method of the present invention is a bonding method for bonding a chip to an island portion of a substrate, wherein the backup plate supply / recovery device conveys the backup plate to the plate body and integrates the plate body and the backup plate. Then, the substrate is supported by the backup plate and bonded to the island portion of the substrate.
　本発明のボンディング方法によれば、基板サイズや基板設計パターンにあったバックアッププレートにて基板を支持することができる。このため、基板のチップを安定してボンディングすることができる。 According to the bonding method of the present invention, the substrate can be supported by the backup plate that matches the substrate size and the board design pattern. Therefore, the chips on the substrate can be stably bonded.
　本発明は、バックアッププレートの供給・回収（交換）を手動ではなく自動的に行うことができる。バックアッププレートを加熱して用いる場合も、いわゆる冷却待ちを行うことなく、バックアッププレートを交換でき、生産性に優れることになる。 The present invention can automatically supply and recover (replace) the backup plate instead of manually. Even when the backup plate is heated and used, the backup plate can be replaced without waiting for so-called cooling, resulting in excellent productivity.
本発明のバックアッププレート供給・回収装置の簡略ブロック図である。It is a simplified block diagram of the backup plate supply and recovery device of the present invention. 図１に示すバックアッププレート供給・回収の搬送レールの斜視図である。FIG. 2 is a perspective view of a backup plate supply / recovery transfer rail shown in FIG. 1. 本発明のバックアッププレート供給・回収装置の簡略図である。It is a simplified diagram of the backup plate supply and recovery device of the present invention. バックアッププレートとプレート本体とガイドレールとの関係を示し、バックアッププレートがプレート本体の上方位置にガイドレールを介して搬送された状態の要部簡略断面図である。FIG. 7 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, in a state where the backup plate is conveyed to a position above the plate body via the guide rail. バックアッププレートとプレート本体とガイドレールとの関係を示し、プレート本体を上昇させてバックアッププレートとプレート本体とを一体化した状態の要部簡略断面図である。FIG. 7 is a simplified cross-sectional view showing the relationship between the backup plate, the plate body, and the guide rail, and showing a state in which the plate body is raised to integrate the backup plate and the plate body. バックアッププレートとプレート本体とガイドレールとの関係を示し、ガイドレールの間隔拡大状態の要部簡略断面図である。FIG. 6 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, in a state where a space between the guide rails is enlarged. バックアッププレートとプレート本体とガイドレールとの関係を示し、ガイドレールの間隔拡大状態で、プレート本体を下降させた状態の要部簡略断面図である。FIG. 7 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, and a state where the plate body is lowered in a state where a space between the guide rails is enlarged. バックアッププレートとプレート本体とガイドレールとの関係を示し、ガイドレールを介して基板がバックアッププレート上に搬送された状態の簡略図である。FIG. 6 is a simplified diagram showing a relationship between a backup plate, a plate body, and a guide rail, in which a substrate is conveyed onto the backup plate via the guide rail. バックアッププレートとプレート本体とガイドレールとの関係を示し、プレート本体を上昇させて、基板をバックアッププレートに吸着された状態の簡略図である。FIG. 6 is a simplified diagram showing a relationship between a backup plate, a plate body, and a guide rail, in which the plate body is lifted and a substrate is attracted to the backup plate. ワークを示す簡略図である。It is a simplified diagram showing a work. ボンディング装置の動作を示す簡略図である。It is a simplified diagram which shows operation | movement of a bonding apparatus.
  以下本発明の実施の形態を図１～図６に基づいて説明する。 Embodiments of the present invention will be described below with reference to FIGS. 1 to 6.
　図１は本発明に係るバックアッププレート供給・回収装置の簡略ブロック図を示し、図２はバックアッププレート供給・回収装置の搬送レールの斜視図を示し、図３はバックアッププレート供給・回収装置の全体簡略図を示している。このバックアッププレート供給・回収装置は、ローダ１５から複数種のバックアッププレート（アダプタプレート）２の中から任意の一枚のバックアッププレート２を送出して、搬送レール５を備えた搬送路を介して下流側へ搬送され、その搬送路に配置されたプレート本体１に、このバックアッププレート２を供給するとともに、供給されたバックアッププレート２をプレート本体１から回収してアンローダ１６へ供給するものである。 FIG. 1 shows a simplified block diagram of a backup plate supply / collection device according to the present invention, FIG. 2 shows a perspective view of a transfer rail of the backup plate supply / collection device, and FIG. 3 shows an overall simplified backup plate supply / collection device. The figure is shown. In this backup plate supply / collection device, one arbitrary backup plate 2 is sent from a plurality of types of backup plates (adapter plates) 2 from a loader 15, and the backup plate is provided downstream via a transfer path provided with a transfer rail 5. The backup plate 2 is supplied to the plate main body 1 that is conveyed to the side and is arranged on the transfer path, and the supplied backup plate 2 is recovered from the plate main body 1 and supplied to the unloader 16.
　バックアッププレート供給・回収装置は、図１に示すように、複数種のバックアッププレート２の中から任意の一枚のバックアッププレート２を送出可能な一のマガジン機構（上流側マガジン機構３）と、複数種のバックアッププレート２の中から任意の一枚のバックアッププレートの収納が可能な他のマガジン機構（下流側マガジン機構４）と、上流側マガジン機構３から送出されたバックアッププレート２を搬送レール５に沿ってプレート本体１まで搬送する一の搬送機構（上流側搬送機構６）と、プレート本体１から下流側マガジン機構４まで搬送する他の搬送機構（下流側搬送機構７）と、プレート本体１を昇降させる昇降機構８とを備える。また、プレート本体１は、昇降機構８による昇降に加えて往復動機構９にて水平方向に搬送レール５に沿って往復動する。プレート本体１とバックアッププレート２とでシャトル１０を構成し、このシャトル１０が、昇降機構８と往復動機構９とで構成される駆動手段１１で昇降したり、水平方向に沿って往復動したりする。すなわち、図１に示すバックアッププレート供給・回収装置では、一対のマガジン機構３，４と、一対の搬送機構６，７を備えたものである。 As shown in FIG. 1, the backup plate supply / recovery device includes one magazine mechanism (upstream magazine mechanism 3) capable of delivering any one backup plate 2 from a plurality of types of backup plates 2, and a plurality of magazine mechanisms. The other magazine mechanism (downstream magazine mechanism 4) capable of accommodating one arbitrary backup plate from among the backup plates 2 of a kind, and the backup plate 2 sent from the upstream magazine mechanism 3 to the transport rail 5. One transport mechanism (upstream transport mechanism 6) that transports the plate body 1 along with another transport mechanism (downstream transport mechanism 7) that transports the plate body 1 to the downstream magazine mechanism 4 and the plate body 1 And an elevating mechanism 8 for elevating. Further, the plate body 1 is reciprocated along the transport rail 5 in the horizontal direction by the reciprocation mechanism 9 in addition to the elevation by the elevation mechanism 8. The plate body 1 and the backup plate 2 constitute a shuttle 10, and the shuttle 10 is moved up and down by a drive means 11 including an elevating mechanism 8 and a reciprocating mechanism 9, or is reciprocating along a horizontal direction. To do. That is, the backup plate supply / recovery device shown in FIG. 1 includes a pair of magazine mechanisms 3 and 4 and a pair of transport mechanisms 6 and 7.
　昇降機構８及び往復動機構９は、例えば、シリンダ機構、ボールねじ機構、リニアガイド機構等の公知・公用の往復動機構を用いることができる。プレート本体１は、図４Ａと図４Ｂと図５に示すように、矩形平板体からなり、その上面には凸部１ａが設けられている。また、バックアッププレート２は、下面の長辺側に切欠き部２ａ、２ａが設けられて扁平矩形体からなり、凸部１ａが嵌合する凹部２ｂが設けられている。すなわち。この凸部１ａとこれに嵌合する凹部２ｂとで、プレート本体１とバックアッププレート２とを一体化する凹凸嵌合構造Ｍを構成できる。 As the lifting mechanism 8 and the reciprocating mechanism 9, for example, a known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used. As shown in FIG. 4A, FIG. 4B, and FIG. 5, the plate body 1 is formed of a rectangular flat plate body, and a convex portion 1 a is provided on the upper surface thereof. Further, the backup plate 2 is provided with notches 2a and 2a on the long side of the lower surface, is formed of a flat rectangular body, and is provided with a recess 2b into which the protrusion 1a is fitted. Ie. The convex portion 1a and the concave portion 2b fitted into the convex portion 1a can constitute a concave-convex fitting structure M in which the plate body 1 and the backup plate 2 are integrated.
　また、プレート本体１とバックアッププレート２とで構成されるシャトル１０には、加熱機構１２及び吸着機構１３が設けられている。加熱機構１２は、例えば、プレート本体１に内蔵される電熱線と、この電熱線を加熱するための電源等とに構成することができるが、これに限るものではなく、蒸気を用いたものであっても、誘導加熱を用いたものであってもよい。すなわち、基板２２として加熱を必要とし、かつ、その加熱方法が基板２２やチップに悪影響を与えないものであればよい。また、吸着機構１３は、例えば、シャトル１０（プレート本体１とバックアッププレート２）に配設される吸引通路と、この吸引通路に接続される真空発生器とで構成され、吸引通路は、バックアッププレート２の上面に開口する吸着口が形成されている。なお、真空発生器としては、真空ポンプを用いるものであっても、高圧空気を開閉制御してノズルよりディフューザに放出して拡散室に負圧を発生させるエジェクタ方式のものであってもよい。 Further, the shuttle 10 composed of the plate body 1 and the backup plate 2 is provided with a heating mechanism 12 and a suction mechanism 13. The heating mechanism 12 can be composed of, for example, a heating wire built in the plate body 1 and a power source for heating the heating wire, but the heating mechanism 12 is not limited to this, and may use steam. Alternatively, induction heating may be used. That is, it is only necessary that the substrate 22 needs to be heated and that the heating method does not adversely affect the substrate 22 and the chips. The suction mechanism 13 is composed of, for example, a suction passage arranged in the shuttle 10 (the plate body 1 and the backup plate 2) and a vacuum generator connected to the suction passage. A suction port that opens on the upper surface of 2 is formed. As the vacuum generator, a vacuum pump may be used, or an ejector type that controls opening / closing of high-pressure air and discharges it from a nozzle to a diffuser to generate a negative pressure in the diffusion chamber may be used.
　上流側マガジン機構３は、複数枚のバックアッププレート２が上下方向に沿って配設されるローダ１５（図３参照）と、このローダ１５を昇降させる図示省略の昇降機構と、所定高さ位置に配設された図示省略のプッシャ機構とを備える。このため、ローダ１５を昇降させて、ローダ１５内に収納された複数のバックアッププレート２の内の一のバックアッププレート２をプッシャ機構に対応させる。そして、この状態で、高さ位置合わせしたバックアッププレート２がプッシャ機構にて搬送レール５側へ押し出される。 The upstream magazine mechanism 3 includes a loader 15 (see FIG. 3) in which a plurality of backup plates 2 are arranged in the vertical direction, an elevator mechanism (not shown) that raises and lowers the loader 15, and a predetermined height position. And a pusher mechanism (not shown) provided. Therefore, the loader 15 is moved up and down, and one of the plurality of backup plates 2 housed in the loader 15 corresponds to the pusher mechanism. Then, in this state, the height-aligned backup plate 2 is pushed out to the transport rail 5 side by the pusher mechanism.
　また、下流側マガジン機構４は、複数枚のバックアッププレート２が上下方向に沿って配設されるアンローダ１６（図３参照）と、このアンローダ１６を昇降させる図示省略の昇降機構と、所定高さ位置に配設された図示省略のプッシャ機構とを備える。アンローダ１６を昇降させて、搬送レール５を介して搬送されてきたバックアッププレートを所定の高さ位置の収納部をプッシャ機構に対応させる。そして、この状態で、高さ位置合わせした収納部に、バックアッププレート２を押し込む。 Further, the downstream magazine mechanism 4 includes an unloader 16 (see FIG. 3) in which a plurality of backup plates 2 are arranged in the vertical direction, an elevating mechanism (not shown) for elevating the unloader 16, and a predetermined height. And a pusher mechanism (not shown) disposed at a position. The unloader 16 is moved up and down so that the storage portion at a predetermined height position corresponds to the pusher mechanism for the backup plate transported through the transport rail 5. Then, in this state, the backup plate 2 is pushed into the storage unit whose height is aligned.
　搬送レール５は、図２と図４Ａと図４Ｂと図５Ａ～図５Ｄに示すように、一対の平行に配設されるガイドレール５ａ、５ａと、ガイドレール５ａ、５ａのガイドレール間隔の拡縮を行うガイドレール拡縮機構１７（図１参照）とを備える。各ガイドレール５ａ、５ａは帯板形状体からなり、各対向面上下方向中央部に受け片５ａ１、５ａ１が突設されている。ガイドレール拡縮機構１７は、シリンダ機構、ボールねじ機構、リニアガイド機構等の公知・公用の往復動機構を用いることができる。このガイドレール拡縮機構１７にて、図４Ａと図４Ｂとに示すように一対のガイドレール５ａ、５ａが接近してバックアッププレート２の保持が可能な状態と、図５Ｄに示すように、一対のガイドレール５ａ、５ａが離間して、ガイドレール５ａ、５ａ間のバックアッププレート２の下降可能な状態に変位する。 As shown in FIG. 2, FIG. 4A, FIG. 4B and FIG. 5A to FIG. And a guide rail expansion / contraction mechanism 17 (see FIG. 1). Each of the guide rails 5a and 5a is made of a strip-shaped body, and receiving pieces 5a1 and 5a1 are projectingly provided at the central portions in the vertical direction of the facing surfaces. The guide rail expansion / contraction mechanism 17 may be a known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, or a linear guide mechanism. With this guide rail expansion / contraction mechanism 17, as shown in FIGS. 4A and 4B, the pair of guide rails 5a, 5a approach each other to hold the backup plate 2, and as shown in FIG. The guide rails 5a, 5a are separated from each other, and the backup plate 2 between the guide rails 5a, 5a is displaced so as to be able to descend.
　また、上流側搬送機構６及び下流側搬送機構７は、それぞれ、バックアッププレート２をチャックするチャック部と、このチャック部を搬送レール５に沿って往復動させる往復動機構とを有する。チャック部は、例えば、開閉可能のチャック爪等から構成でき、往復動機構としては、シリンダ機構、ボールねじ機構、リニアガイド機構等の公知・公用の往復動機構を用いることができる。 Further, each of the upstream side transport mechanism 6 and the downstream side transport mechanism 7 has a chuck portion that chucks the backup plate 2 and a reciprocating mechanism that reciprocates the chuck portion along the transport rail 5. The chuck portion can be constituted by, for example, an openable / closable chuck claw and the like, and as the reciprocating mechanism, a well-known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear guide mechanism or the like can be used.
　また、この装置には、図１に示すように、バックアッププレート２のプレート本体１への装着姿勢を検出する姿勢検出機構１８と、バックアッププレート２の情報を識別する識別機構１９とを備える。バックアッププレート２の情報とは、バックアッププレートに吸着されるべき基板の情報と整合するための情報である。ここで、基板の情報とは、基板サイズや基板設計パターン等である。 Further, as shown in FIG. 1, this apparatus is provided with a posture detection mechanism 18 that detects the mounting posture of the backup plate 2 on the plate body 1, and an identification mechanism 19 that identifies the information of the backup plate 2. The information of the backup plate 2 is information for matching the information of the substrate to be sucked by the backup plate. Here, the board information includes board size, board design pattern, and the like.
　姿勢検出機構１８は、図示省略の画像認識カメラを備え、予め位置座標が算出されたプレート本体１の位置座標と、画像認識カメラを用いて算出したバックアッププレート２の位置座標との差異を検出するものである。そこで、この差異を補正することによって正確に装着できる。すなわち、この画像認識カメラによって、プレート本体１の位置座標を検出（算出）と、バックアッププレート２の位置座標を検出（算出）とを行うことができる。このため、これらの位置の差異を制御手段２０（図１参照）の演算部にて演算し、これによって、プレート本体１及び／又はバックアッププレート２の位置補正（位置修正）を行って、プレート本体１とバックアッププレート２との位置合わせを行うことができる。 The attitude detection mechanism 18 includes an image recognition camera (not shown), and detects a difference between the position coordinates of the plate body 1 whose position coordinates are calculated in advance and the position coordinates of the backup plate 2 calculated using the image recognition camera. It is a thing. Therefore, by correcting this difference, the device can be mounted accurately. That is, this image recognition camera can detect (calculate) the position coordinates of the plate body 1 and detect (calculate) the position coordinates of the backup plate 2. Therefore, the difference between these positions is calculated by the calculation unit of the control means 20 (see FIG. 1), and thereby the position correction (position correction) of the plate body 1 and / or the backup plate 2 is performed, and the plate body is corrected. 1 and the backup plate 2 can be aligned.
　識別機構１９は、バックアッププレート２に設けられた被識別部を読み取るものである。ここで、被識別部としては、印字された文字、記号、図形、バーコード、ＱＲコード（登録商標）等で構成できる。また、読み取り手段として、文字、記号、及び図形等では、画像処理等で読み取ることができ、バーコードではバーコードリーダで、ＱＲコードではＱＲコードリーダで読み取ることができる。 The identification mechanism 19 reads the identified portion provided on the backup plate 2. Here, the identified portion can be composed of printed characters, symbols, figures, barcodes, QR codes (registered trademark), or the like. As the reading means, characters, symbols, figures, etc. can be read by image processing and the like, and a bar code can be read by a bar code reader and a QR code can be read by a QR code reader.
　ところで、前記各機構３，４，６，７，１２，１３，１７，１８，１９は制御手段２０にて制御される。制御手段２０としては、前記ボンディング装置と同様、例えば、ＣＰＵ（Central Processing Unit）を中心としてＲＯＭ（Read Only Memory）やＲＡＭ（Random Access Memory）等がバスを介して相互に接続されたマイクロコンピューターである。なお、ＲＯＭには、ＣＰＵが実行するプログラムやデータが格納されている。 By the way, the respective mechanisms 3, 4, 6, 7, 12, 13, 17, 18, 19 are controlled by the control means 20. As the control means 20, similar to the above-mentioned bonding apparatus, for example, a microcomputer in which a CPU (Central Processing Unit) is central to a ROM (Read Only Memory), a RAM (Random Access Memory), etc., is interconnected via a bus. is there. The ROM stores programs executed by the CPU and data.
　また、バックアッププレート２とプレート本体１とが一体化させてなるシャトル１０には、搬送レール５を介して搬送される被供給部材Ｓ(基板２２)が、図５Ｃに示すように、搬送レール５に案内され、図５Ｄに示すようにシャトル１０に吸着され、この被供給部材Ｓが吸着された状態で、搬送レール５の供給ポジションに搬送されて、図７に示すように、この被供給部材Ｓの被供給部位ＳａにワークＷが搭載される。 Further, in the shuttle 10 in which the backup plate 2 and the plate body 1 are integrated, the supply target member S (the substrate 22) transported via the transport rail 5 is transferred to the transport rail 5 as shown in FIG. 5C. 5 and is attracted to the shuttle 10 as shown in FIG. 5D, and the member S to be supplied is attracted to the feed position of the transport rail 5, and as shown in FIG. The work W is mounted on the supply target portion Sa of S.
　ワークＷとしては、図６に示すように、ウェハ(ワーク集合体)２６から切り出されるチップ２１であり、このウェハ２６のチップ２１には複数種のグレードを有する。この実施形態では、３種類のグレードを有し、この３種類のグレードを、第１グレードと第２グレードと第３グレードと呼ぶ。また、１枚のウェハ２６においては、第１グレードが多く、第２グレード及び第３グレードが少ない。この場合、第２グレードが第３グレードよりも多くても、第３グレードが第２グレードよりも多くても、第２グレードと第３グレードとが同数であってもよい。 As shown in FIG. 6, the work W is a chip 21 that is cut out from a wafer (work assembly) 26, and the chip 21 of this wafer 26 has a plurality of grades. In this embodiment, there are three kinds of grades, and these three kinds of grades are called a first grade, a second grade and a third grade. In addition, one wafer 26 has many first grades and few second grades and third grades. In this case, the second grade may be larger than the third grade, the third grade may be larger than the second grade, or the second grade and the third grade may be the same number.
　被供給部材Ｓとは、リードフレームなどの基板２２であり、被供給部位Ｓａとは、基板２２上のアイランド部２２ａであり、各アイランド部２２ａにチップ２１がボンディングされる。この際、図７に示すようなボンディング装置（ダイボンダ）が用いられる。このようなボンディング装置は、ウェハ２６から切り出されるチップ（半導体チップ）２１をピックアップポジションＰにてコレット（吸着コレット）２３でピックアップして、リードフレームなどの基板２２のボンディングポジションＱに移送（搭載）するものである。ウェハ２６は、金属製のリング（ウェハリング）に張設されたウェハシート（粘着シート２５）上に粘着されており、ダイシング工程によって、多数のチップ２１に分断（分割）される。 The supply target member S is a substrate 22 such as a lead frame, and the supply target portion Sa is an island portion 22a on the substrate 22, and the chip 21 is bonded to each island portion 22a. At this time, a bonding device (die bonder) as shown in FIG. 7 is used. In such a bonding apparatus, a chip (semiconductor chip) 21 cut out from a wafer 26 is picked up by a collet (suction collet) 23 at a pickup position P and transferred (mounted) to a bonding position Q of a substrate 22 such as a lead frame. To do. The wafer 26 is adhered onto a wafer sheet (adhesive sheet 25) stretched on a metal ring (wafer ring) and divided (divided) into a large number of chips 21 by a dicing process.
　コレット２３は、図７に示すように、ピックアップポジションＰ上での矢印Ａ方向の上昇および矢印Ｂ方向の下降と、ボンディングポジションＱ上での矢印Ｃ方向の上昇および矢印Ｄ方向の下降と、ピックアップポジションＰとボンディングポジションＱとの間の矢印Ｅ、Ｆ方向の往復動とが可能とされる。コレット２３は、図示省略のボンディングヘッドに付設され、このボンディングヘッドはボンディングアーム（図示省略）に付設される。そこで、このボンディングアームが図示省略の制御手段にて制御されて、コレット２３が前記矢印Ａ、Ｂ、Ｃ、Ｄ、Ｅ、Ｆの移動が制御される。制御手段は、例えば、ＣＰＵ（Central Processing Unit）を中心としてＲＯＭ（Read Only Memory）やＲＡＭ（Random Access Memory）等がバスを介して相互に接続されたマイクロコンピューターである。なお、ＲＯＭには、ＣＰＵが実行するプログラムやデータが格納されている。 As shown in FIG. 7, the collet 23 is raised in the arrow A direction and lowered in the arrow B direction on the pickup position P, raised in the arrow C direction and lowered in the arrow D direction on the bonding position Q, and picked up. Reciprocation between the position P and the bonding position Q in the directions of arrows E and F is possible. The collet 23 is attached to a bonding head (not shown), and this bonding head is attached to a bonding arm (not shown). Therefore, the bonding arm is controlled by a control means (not shown) so that the collet 23 is controlled to move the arrows A, B, C, D, E and F. The control means is, for example, a microcomputer in which a central processing unit (CPU), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus. The ROM stores programs executed by the CPU and data.
　前記したように、チップ２１には、この実施形態では、第１のグレードと第２のグレードと第３のグレードを有するものである。また、一の基板２２には同一のグレードのチップ２１が搭載される。このため、基板２２には、第１のグレードのチップ２１が搭載される基板２２（２２Ａ）があり、第２のグレードのチップ２１が搭載される基板２２（２２Ｂ）があり、第３のグレードのチップ２１が搭載される基板２２（２２Ｃ）がある。 As described above, the chip 21 has the first grade, the second grade, and the third grade in this embodiment. Further, chips 21 of the same grade are mounted on one substrate 22. Therefore, the board 22 includes the board 22 (22A) on which the first grade chip 21 is mounted, the board 22 (22B) on which the second grade chip 21 is mounted, and the third grade. There is a substrate 22 (22C) on which the chip 21 of FIG.
　このため、バックアッププレート２は、基板２２Ａに対応する第１のバックアッププレート２Ａと、基板２２Ｂに対応する第２のバックアッププレート２Ｂと、基板２２Ｃに対する第３のバックアッププレート２Ａとを備える。ローダ１５にはバックアッププレート２Ａが収納される第１のローダ１５Ａと、バックアッププレート２Ｂが収納される第２のローダ１５Ｂと、バックアッププレート２Ｃが収納される第３のローダ１５Ｃとがある。また、アンローダ１６には、バックアッププレート２Ａが収納される第１のアンローダ１６Ａと、バックアッププレート２Ｂが収納される第２のアンローダ１６Ｂと、バックアッププレート２Ｃが収納される第３のアンローダ１６Ｃとがある。 Therefore, the backup plate 2 includes a first backup plate 2A corresponding to the substrate 22A, a second backup plate 2B corresponding to the substrate 22B, and a third backup plate 2A corresponding to the substrate 22C. The loader 15 includes a first loader 15A that stores the backup plate 2A, a second loader 15B that stores the backup plate 2B, and a third loader 15C that stores the backup plate 2C. Further, the unloader 16 includes a first unloader 16A in which the backup plate 2A is stored, a second unloader 16B in which the backup plate 2B is stored, and a third unloader 16C in which the backup plate 2C is stored. ..
　次に前記のように構成されたバックアッププレート供給・回収装置の動作を説明する。例えば、第１のグレードのチップ２１を搭載する場合、この第１グレードのチップ２１が搭載される基板２２（２２Ａ）が用いられる。このため、シャトル１０のバックアッププレート２は、この基板２２Ａに対応するバックアッププレート２Ａが用いられる。 Next, the operation of the backup plate supply / collection device configured as described above will be described. For example, when the chip 21 of the first grade is mounted, the substrate 22 (22A) on which the chip 21 of the first grade is mounted is used. Therefore, as the backup plate 2 of the shuttle 10, the backup plate 2A corresponding to this substrate 22A is used.
　このバックアッププレート２Ａは、ローダ１５から送出され、搬送レール５にガイドされて（受け片５ａ１、５ａ１にて受けられて）、上流側搬送機構６を用いて図４Ａに示すように、プレート本体１の上方に位置させる。すなわち、搬送レール５の受け片５ａ１、５ａ１が、バックアッププレート２（２Ａ）の切欠き部２ａ、２ａに嵌合して、この搬送レール５に支持された状態となっている。また、プレート本体１は下降して、搬送レール５の受け片５ａ１、５ａ１よりも下位に位置している。この場合、前記したように、画像認識カメラによって、シャトル１０の位置座標と、バックアッププレート２の位置座標との差異の修正が行われている。 The backup plate 2A is delivered from the loader 15, guided by the transport rail 5 (received by the receiving pieces 5a1 and 5a1), and the upstream side transport mechanism 6 is used to move the plate body 1 as shown in FIG. 4A. Located above. That is, the receiving pieces 5a1 and 5a1 of the transport rail 5 are fitted into the notches 2a and 2a of the backup plate 2 (2A) and are supported by the transport rail 5. Further, the plate body 1 descends and is positioned below the receiving pieces 5a1 and 5a1 of the transport rail 5. In this case, as described above, the image recognition camera corrects the difference between the position coordinates of the shuttle 10 and the position coordinates of the backup plate 2.
　そして、この状態からプレート本体１を上昇させることによって、プレート本体１の凸部１ａをバックアッププレート２の凹部２ｂに嵌合させて、図４Ｂに示すように、プレート本体１とバックアッププレート２とが一体化する。この場合、上流側搬送機構６のチャック部にてバックアッププレート２はチャックされおり、プレート本体１の上昇に伴ったバックアッププレート２の上昇が規制され、プレート本体１の凸部１ａをバックアッププレート２の凹部２ｂに嵌合させることができる。 Then, by raising the plate body 1 from this state, the convex portion 1a of the plate body 1 is fitted into the concave portion 2b of the backup plate 2, and the plate body 1 and the backup plate 2 are separated from each other as shown in FIG. 4B. Unify. In this case, the backup plate 2 is chucked by the chuck portion of the upstream side transport mechanism 6, the rise of the backup plate 2 due to the rise of the plate body 1 is restricted, and the convex portion 1a of the plate body 1 is moved to the backup plate 2. It can be fitted into the recess 2b.
　このようにプレート本体１とバックアッププレート２とが一体化された状態で、基板２２（２２Ａ）が搬送レール５にガイドされて（受け片５ａ１、５ａ１にて受けられて）、上流側搬送機構６を用いて図５Ａに示すように、プレート本体１とバックアッププレート２とで構成されるシャトル１０の上方にこの基板２２Ａを位置させる。 In this manner, in the state where the plate body 1 and the backup plate 2 are integrated, the substrate 22 (22A) is guided by the transport rail 5 (received by the receiving pieces 5a1 and 5a1), and the upstream transport mechanism 6 is provided. As shown in FIG. 5A, the substrate 22A is positioned above the shuttle 10 composed of the plate body 1 and the backup plate 2.
　このため、図５Ａに示すように、搬送レール５のガイドレール５ａ，５ａを相対的に離間させる。すなわち、ガイドレール５ａ，５ａを拡開させて、受け片５ａ１、５ａ１の間隔をバックアッププレート２の幅寸法よりも大きくする。受け片５ａ１、５ａ１の間隔をＷ１とし、バックアッププレート２の幅寸法をＷとした場合、Ｗ１＞Ｗとなっている。そして、図５Ｂに示すように、シャトル１０を下降させる。この場合、ガイドレール５ａ、５ｓの受け片５ａ１、５ａ１よりも下位に位置させる。 Therefore, as shown in FIG. 5A, the guide rails 5a, 5a of the transport rail 5 are relatively separated from each other. That is, the guide rails 5a, 5a are expanded to make the gap between the receiving pieces 5a1, 5a1 larger than the width dimension of the backup plate 2. When the distance between the receiving pieces 5a1 and 5a1 is W1 and the width dimension of the backup plate 2 is W, W1> W. Then, as shown in FIG. 5B, the shuttle 10 is lowered. In this case, the guide rails 5a and 5s are positioned lower than the receiving pieces 5a1 and 5a1.
　また、基板２２（２２Ａ）がローダ（バックアッププレート２が収納されたローダ１５とは相違したローダであって、基板２２が収納されている）から送出され、この基板２２Ａが、搬送レール５にガイドされて、上流側搬送機構６を用いてシャトル１０上に図５Ｃに示すように、搬送される。この場合、シャトル１０のバックアッププレート２がこの基板２２Ａに対応する形状のもの、すなわち、第１のプレート２Ａがプレート本体１に装着された状態となっている。また、受け片５ａ１、５ａ１の間隔が、基板２２（２２Ａ）の幅寸法よりも小さいとともに、ガイドレール５ａ，５ａの受け片５ａ１，５ａ１よりの対向面間の寸法を基板２２（２２Ａ）の幅寸法よりも大きくしている。すなわち、受け片５ａ１、５ａ１の間隔をＷ１とし、基板２２の幅寸法をＷ３とし、対向面間の寸法をＷ２としたときに、Ｗ１＜Ｗ３＜Ｗ２とする。これによって、基板２２を受け片５ａ１，５ａ１にて受けることができる。 Further, the board 22 (22A) is delivered from a loader (a loader different from the loader 15 housing the backup plate 2 and housing the board 22), and the board 22A is guided to the transport rail 5. Then, it is transported onto the shuttle 10 by using the upstream transport mechanism 6 as shown in FIG. 5C. In this case, the backup plate 2 of the shuttle 10 has a shape corresponding to the substrate 22A, that is, the first plate 2A is attached to the plate body 1. In addition, the distance between the receiving pieces 5a1 and 5a1 is smaller than the width dimension of the board 22 (22A), and the dimension between the facing surfaces of the guide rails 5a and 5a with respect to the receiving pieces 5a1 and 5a1 is the width of the board 22 (22A). It is larger than the size. That is, when the distance between the receiving pieces 5a1 and 5a1 is W1, the width dimension of the substrate 22 is W3, and the dimension between the facing surfaces is W2, W1 <W3 <W2. As a result, the substrate 22 can be received by the receiving pieces 5a1 and 5a1.
　そして、図５Ｃに示すように、シャトル１０上の基板２２が配設された状態で、図５Ｄに示すように、シャトル１０が上昇して、基板２２をシャトル１０の上面に吸着させる。この際、図示省略のクランパー等で基板２２を押さえるようにするのが好ましい。 Then, as shown in FIG. 5C, in a state where the substrate 22 on the shuttle 10 is arranged, as shown in FIG. 5D, the shuttle 10 rises to adsorb the substrate 22 to the upper surface of the shuttle 10. At this time, it is preferable to press the substrate 22 with a clamper (not shown) or the like.
　このように、シャトル１０に吸着保持された基板２２は加熱されて、この基板２２のアイランド部２２ａにワークＷとしてのチップ２１がボンディングされる。ボンディング工程は、搬送方向（長手方向）と直交する方向の一列のアイランド部２２ａ（図７参照）へのボンディングが完了した後に、このボンディングしている基板２２を受けているシャトル１０を下流側へ所定量だけ往復動機構９を介して移動させて、次の一列のアイランド部２２ａへのボンディングを可能とする。 In this way, the substrate 22 sucked and held by the shuttle 10 is heated, and the chip 21 as the work W is bonded to the island portion 22a of the substrate 22. In the bonding step, after the bonding to the island portion 22a (see FIG. 7) in a row in the direction orthogonal to the transport direction (longitudinal direction) is completed, the shuttle 10 receiving the bonded substrate 22 is moved to the downstream side. A predetermined amount is moved via the reciprocating mechanism 9 to enable bonding to the next row of island portions 22a.
　また、基板２２（２２Ａ）へのチップ２１の搭載が終了すれば、図５Ｃに示すように、ガイドレール５ａ，５ａの受け片５ａ１、５ａ１に基板２２を支持させ、下流側搬送機構７を介して、下流側のアンローダ（バックアッププレート２が収納されるアンローダ１６とは相違したアンローダであって、基板２２が収納される）に搬送し、このアンローダに基板２２を収納する。 When the mounting of the chip 21 on the substrate 22 (22A) is completed, the substrate 22 is supported by the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a as shown in FIG. Then, it is transported to the unloader on the downstream side (an unloader different from the unloader 16 in which the backup plate 2 is stored, in which the substrate 22 is stored), and the substrate 22 is stored in this unloader.
　そして、搭載すべきチップ２１が変更等されて基板２２Ａを基板２２Ｂに変更する場合、図４Ｂに示すように、ガイドレール５ａ，５ａの受け片５ａ１、５ａ１を、バックアッププレート２の切欠き部２ａ、２ａに嵌入した状態として、プレート本体１を下降させる。これによって、バックアッププレート２がガイドレール５ａ、５ａの受け片５ａ１、５ａ１に受けられた状態で、プレート本体１のみが下降し、プレート本体１とバックアッププレート２とが分離する状態となる。この状態で、下流側搬送機構７を介してこのバックアッププレート２をアンローダ１６側へ搬送して、このバックアッププレート２をアンローダ１６に収納することになる。 When the board 22A is changed to the board 22B due to a change in the chip 21 to be mounted, as shown in FIG. 4B, the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a are connected to the cutout portion 2a of the backup plate 2. The plate body 1 is moved down while being fitted in 2a. As a result, with the backup plate 2 received by the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a, only the plate body 1 is lowered and the plate body 1 and the backup plate 2 are separated. In this state, the backup plate 2 is transported to the unloader 16 side via the downstream transport mechanism 7, and the backup plate 2 is stored in the unloader 16.
　その後、他のバックアッププレート２例えば、バックアッププレート２Ｂをローダ１５Ｂから送出して、上流側搬送機構６を用いて、図４Ａに示すように、このバックアッププレート２Ｂをプレート本体１の上方に配置する。その後は、プレート本体１を下降させることによって、プレート本体１とバックアッププレート２Ｂとが一体化する。 Thereafter, another backup plate 2, for example, the backup plate 2B is sent from the loader 15B, and the upstream transport mechanism 6 is used to arrange the backup plate 2B above the plate body 1 as shown in FIG. 4A. After that, the plate body 1 and the backup plate 2B are integrated by lowering the plate body 1.
　これにより、基板２２Ｂ用のシャトル１０を構成でき、基板２２Ｂが、ローダ（バックアッププレート２が収納されたローダ１５とは相違したローダであって、基板２２が収納されている）から送出され、このシャトル１０に基板２２Ｂを供給することによって、この基板２２Ｂにチップ２１を搭載していくことができる。そして、この基板２２Ｂへのチップ２１の搭載が完了すれば、この基板２２Ｂを下流側のアンローダ（バックアッププレート２が収納されるアンローダ１６とは相違したアンローダであって、基板２２が収納される）へ供給することができる。 As a result, the shuttle 10 for the board 22B can be configured, and the board 22B is delivered from the loader (a loader different from the loader 15 in which the backup plate 2 is housed and the board 22 is housed). By supplying the substrate 22B to the shuttle 10, the chip 21 can be mounted on the substrate 22B. Then, when the mounting of the chip 21 on the substrate 22B is completed, the substrate 22B is unloaded on the downstream side (an unloader different from the unloader 16 in which the backup plate 2 is accommodated, and the substrate 22 is accommodated). Can be supplied to.
　以下、相違する基板２２のチップ２１を搭載（ボンディング）する場合には、前記した工程によって、バックアッププレート２（２Ｃ）を交換でき、このバックアッププレート２Ｃに基板２２Ｃを吸着保持でき、この基板２２Ｃにチップ２１を搭載できる。 Hereinafter, when the chips 21 of different substrates 22 are mounted (bonded), the backup plate 2 (2C) can be exchanged, the substrate 22C can be sucked and held by the backup plate 2C, and the substrate 22C The chip 21 can be mounted.
　本発明のバックアッププレートの供給・回収装置では、上流側マガジン機構４から複数種のバックアッププレート２の中から任意の一枚のバックアッププレート２を送出することができ、このバックアッププレート２を上流側搬送機構６にてプレート本体１まで搬送できる。この搬送は搬送レール５にて支持された状態でプレート本体１まで搬送される。そして、プレート本体１が昇降機構８を介して上昇することによって、プレート本体１とバックアッププレート２とが一体化する。また、プレート本体１とバックアッププレート２とが一体化した状態で、プレート本体１を昇降機構８を介して下降させることによって、プレート本体１とバックアッププレート２が分離する。このように分離したバックアッププレート２は、下流側搬送機構７にて下流側マガジン機構４まで搬送される。この場合、バックアッププレート２は搬送レール５に支持された状態で搬送される。 In the backup plate supply / collection device of the present invention, an arbitrary one backup plate 2 can be sent from the plurality of types of backup plates 2 from the upstream magazine mechanism 4, and this backup plate 2 is transported upstream. It can be transported to the plate body 1 by the mechanism 6. This transportation is carried to the plate body 1 while being supported by the transportation rail 5. Then, the plate body 1 is elevated via the elevating mechanism 8 so that the plate body 1 and the backup plate 2 are integrated. Further, when the plate body 1 and the backup plate 2 are integrated, the plate body 1 is lowered via the elevating mechanism 8 to separate the plate body 1 and the backup plate 2. The backup plate 2 separated in this way is transported to the downstream magazine mechanism 4 by the downstream transport mechanism 7. In this case, the backup plate 2 is transported while being supported by the transport rail 5.
　すなわち、バックアッププレート２の供給・回収（交換）を手動ではなく自動的に行うことができる。バックアッププレート２を加熱して用いる場合も、いわゆる冷却待ちを行うことなく、バックアッププレート２を交換でき、生産性に優れることになる。 That is, the supply / collection (replacement) of the backup plate 2 can be performed automatically instead of manually. Even when the backup plate 2 is heated and used, the backup plate 2 can be replaced without waiting for so-called cooling, resulting in excellent productivity.
　各ガイドレール５ａ、５ａには、バックアッププレート２を受けるプレート支持部（受け片５ａ１、５ａ１）を有するものである。このように構成することによって、上流側搬送機構６や下流側搬送機構７にてバックアッププレート２を搬送する際に、安定して搬送できる。 Each of the guide rails 5a, 5a has a plate supporting portion (receiving pieces 5a1, 5a1) for receiving the backup plate 2. With this configuration, the backup plate 2 can be stably transported when the upstream transport mechanism 6 and the downstream transport mechanism 7 transport the backup plate 2.
　一対のガイドレール５ａ、５ａは、ガイドレール間隔の拡縮が可能であるので、バックプレート２のサイズに対応させて、バックアッププレート２の支持(受け)を安定して行うことができる。また、バックアッププレート２は、品種を識別する情報を具備しているので、供給すべきバックアッププレート２を識別でき、誤使用（誤取付）を防止できる。バックアッププレート２の情報を識別する識別機構を備えているものでは、誤使用（誤取付）の防止の信頼性が向上する。 The pair of guide rails 5a and 5a can be expanded / contracted with respect to the guide rail interval, so that the backup plate 2 can be stably supported (received) according to the size of the back plate 2. Further, since the backup plate 2 has the information for identifying the product type, it is possible to identify the backup plate 2 to be supplied and prevent misuse (erroneous mounting). A device provided with an identification mechanism for identifying the information of the backup plate 2 improves the reliability of preventing misuse (misinstallation).
　バックアッププレート２のプレート本体１への装着姿勢を検出する姿勢検出機構１８を備えたものでは、バックアッププレート２を安定した姿勢(正規姿勢)でプレート本体１に装着することができる。 With the posture detection mechanism 18 that detects the mounting posture of the backup plate 2 on the plate body 1, the backup plate 2 can be mounted on the plate body 1 in a stable posture (regular posture).
　バックアッププレート２とプレート本体１とが凹凸嵌合構造Ｍにて一体化するものでは、簡単な構造でバックアッププレート２とプレート本体１との一体化を図ることができる。ここで、凹凸嵌合構造Ｍとは、一方側の部材に凸部を設け、他方側の部材にこの凸部が嵌合する凹部を設け、重ね合わせた際に、凸部が凹部に嵌合して、この２つの部材が一体化する。このため、バックアッププレート２側に凸部を設け、プレート本体１側に凹部を設けたり、逆にバックアッププレート２側に凹部を設け、プレート本体１側に凸部を設けたりできる。なお、プレート本体とバックアッププレートとが一体化状態を維持するための手段として、真空吸着やロック機構を持ち合わせることが望ましい。 In the case where the backup plate 2 and the plate body 1 are integrated by the concave-convex fitting structure M, the backup plate 2 and the plate body 1 can be integrated with a simple structure. Here, the concavo-convex fitting structure M means that a member on one side is provided with a convex portion and a member on the other side is provided with a concave portion into which the convex portion fits, and when they are overlapped, the convex portion fits into the concave portion. Then, these two members are integrated. Therefore, it is possible to provide a convex portion on the backup plate 2 side and a concave portion on the plate body 1 side, or conversely, provide a concave portion on the backup plate 2 side and a convex portion on the plate body 1 side. In addition, it is desirable to have a vacuum suction or a lock mechanism as a means for maintaining the plate body and the backup plate in an integrated state.
　本発明のダイボンダによれば、本発明にかかるバックアッププレート供給・回収装置を用いるので、基板サイズや基板設計パターンにあったバックアッププレート２を用いることができ、このバックアッププレート２にて基板２２を支持することができる。このため、基板２２のチップ２１を安定してボンディングすることができる。 According to the die bonder of the present invention, since the backup plate supply / collection device according to the present invention is used, the backup plate 2 suitable for the substrate size and the substrate design pattern can be used, and the substrate 22 is supported by the backup plate 2. can do. Therefore, the chip 21 of the substrate 22 can be stably bonded.
　本発明のボンディング方法によれば、本発明にかかるバックアッププレート供給・回収装置を用いるので、基板サイズや基板設計パターンにあったバックアッププレートにて基を支持することができる。このため、基板のチップを安定してボンディングすることができる。 According to the bonding method of the present invention, since the backup plate supply / collection device according to the present invention is used, the base can be supported by the backup plate that matches the board size and the board design pattern. Therefore, the chips on the substrate can be stably bonded.
　ところで、バックアッププレート２を搬送する搬送機構６、７として、基板２２を搬送する搬送機構を兼ねるこができる。すなわち、搬送機構６、７として、バックアッププレート２の搬送用と、基板２２の搬送用とに共有することができる。このように共用することによって、装置全体としてのコンパクト化を図ることができる。 By the way, the transfer mechanisms 6 and 7 for transferring the backup plate 2 can also serve as a transfer mechanism for transferring the substrate 22. That is, the transfer mechanisms 6 and 7 can be shared by the backup plate 2 and the substrate 22. By sharing in this way, the overall size of the device can be reduced.
　前記実施形態では、バックアッププレート２をチャックするチャック部と、このチャック部を搬送レール５に沿って往復動させる往復動機構とを有する上流側搬送機構６を介して、バックアッププレート２をプレート本体１の上方位置まで搬送するものであったが、クレーン等の他の搬送手段を介して、バックアッププレート２をプレート本体１の上方位置まで搬送するものであってもよい。このように構成することによって、搬送レール５を用いなくて済み、装置のコンパクト化を図ることができる。 In the above-described embodiment, the backup plate 2 is moved to the plate body 1 via the upstream side transport mechanism 6 having a chuck portion that chucks the backup plate 2 and a reciprocating mechanism that reciprocates the chuck portion along the transport rail 5. However, the backup plate 2 may be conveyed to a position above the plate body 1 via another conveying means such as a crane. With this configuration, it is not necessary to use the transport rail 5, and the device can be made compact.
　また、前記実施形態では、上流側搬送機構６にてバックアッププレート２を搬送していたが、プレート本体１を上流側搬送機構６にて搬送するものであってもよく、バックアッププレート２とプレート本体１とのいずれも上流側搬送機構６にて搬送できるものであってもよい。すなわち、バックアッププレート２とプレート本体１の少なくともいずれかを搬送させて、バックアッププレート２とプレート本体１との相対的な移動にて、プレート本体１上にバックアッププレート２が配置されるものであってもよい。 Further, in the above-described embodiment, the backup plate 2 is carried by the upstream carrying mechanism 6, but the plate body 1 may be carried by the upstream carrying mechanism 6, and the backup plate 2 and the plate body may be carried. Any of the above items 1 and 2 may be one that can be carried by the upstream carrying mechanism 6. That is, at least one of the backup plate 2 and the plate body 1 is transported, and the backup plate 2 is arranged on the plate body 1 by the relative movement of the backup plate 2 and the plate body 1. Good.
　前記実施形態では、一対のマガジン機構３，４と、一対の搬送機構６，７を備えたものであり、マガジン機構３のバックアッププレート２を搬送機構６でプレート本体１側へ搬送し、また、プレート本体１から分離されたバックアッププレート２を搬送機構７を介して、マガジン機構４へ搬送するものであった。 In the above-described embodiment, a pair of magazine mechanisms 3 and 4 and a pair of transport mechanisms 6 and 7 are provided, and the backup plate 2 of the magazine mechanism 3 is transported by the transport mechanism 6 to the plate body 1 side. The backup plate 2 separated from the plate body 1 is transported to the magazine mechanism 4 via the transport mechanism 7.
　これに対して、マガジン機構４のバックアッププレート２を搬送機構７でプレート本体１側へ搬送し、また、プレート本体１から分離されたバックアッププレート２を搬送機構６を介して、マガジン機構３へ搬送するものであってもよい。 On the other hand, the backup plate 2 of the magazine mechanism 4 is transported to the plate body 1 side by the transport mechanism 7, and the backup plate 2 separated from the plate body 1 is transported to the magazine mechanism 3 via the transport mechanism 6. It may be one that does.
  また、プレート本体１から分離されたバックアッププレート２を搬送機構６又は搬送機構７を介してマガジン機構３又はマガジン機構４に回収するようにしてもよい。すなわち、一のマガジン機構のバックアッププレートは一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、一の搬送機構又は他の搬送機構を介して、前記一のマガジン機構又は他のマガジン機構に回収されるものであってもよい。このように構成することによって、回収するバックアッププレートを供給したマガジン機構又は他のマガジン機構に回収することができ、作業性の向上を図ることができる。 Further, the backup plate 2 separated from the plate body 1 may be collected in the magazine mechanism 3 or the magazine mechanism 4 via the transport mechanism 6 or the transport mechanism 7. That is, the backup plate of the one magazine mechanism is supplied to the plate body via the one transport mechanism, and the backup plate separated from the plate body is transported to the one magazine via the one transport mechanism or another transport mechanism. It may be collected in a mechanism or other magazine mechanism. With such a configuration, the backup plate to be collected can be collected in the magazine mechanism that has supplied or another magazine mechanism, and the workability can be improved.
　マガジン機構として、一機であってもよい。すなわち、いずれかのマガジン機構３（４）を備え、このマガジン機構３（４）のバックアッププレート２をいずれかの搬送機構６（７）にて、このマガジン機構３（４）に回収するものであってもよい。すなわち、マガジン機構のバックアッププレートは一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、前記一の搬送機構又は他の搬送機構を介して、前記一のマガジン機構に回収されるように構成できる。このように構成することによって、プレート本体へ供給したり、プレート本体から回収したりできるマガジン機構が１機で済み、装置全体のコンパクト化が可能となる。 As a magazine mechanism, one machine may be used. That is, any magazine mechanism 3 (4) is provided, and the backup plate 2 of this magazine mechanism 3 (4) is collected in this magazine mechanism 3 (4) by any transport mechanism 6 (7). It may be. That is, the backup plate of the magazine mechanism is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is fed to the one magazine mechanism via the one transport mechanism or another transport mechanism. Can be configured to be recovered. With this configuration, only one magazine mechanism that can supply to the plate body and collect from the plate body is sufficient, and the entire apparatus can be made compact.
　さらに、マガジン機構として、少なくとも３機以上あってもよい。すなわち、少なくとも３機以上のマガジン機構を備え、いずれかのマガジン機構のバックアッププレートが一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、前記一の搬送機構又は他の搬送機構を介して、前記バックプレートが供給されたマガジン機構又は他のマガジン機構に回収されるように構成してもよい。このように構成することによって、３機以上のマガジン機構から種々の種類のバックアッププレートをプレート本体に供給でき、また、バックアッププレートをいずれかのマガジン機構の回収でき、至便性に優れた装置となる。 Furthermore, there may be at least 3 or more magazine mechanisms. That is, at least three or more magazine mechanisms are provided, and the backup plate of any one of the magazine mechanisms is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is the one transport mechanism or The back plate may be collected by the supplied magazine mechanism or another magazine mechanism via another conveyance mechanism. With this configuration, various types of backup plates can be supplied to the plate body from three or more magazine mechanisms, and the backup plates can be collected by any of the magazine mechanisms, resulting in a device with excellent convenience. ..
　本発明は前記実施形態に限定されることなく種々の変形が可能であって、例えば、被供給部材Ｓとして、前記実施形態では、ウェハ２６から切り出されたチップ２１をボンディングする基板２２であったが、このような基板２２ではなく、クレジットカード、キャッシュカード、ＩＣカード等のカードや、板金等の平板体であってもよい。このため、被供給部材Ｓに供給するワークＷとして、チップ２１に限るものではなく、被供給部材Ｓに応じた部品となる。また、被供給部材Ｓとして、基板２２でなく加熱を必要としないものであれば、シャトル１０の加熱機構１２を省略することができる。 The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, as the supply target member S, in the above-described embodiment, the substrate 22 for bonding the chip 21 cut out from the wafer 26 was used. However, instead of such a substrate 22, a card such as a credit card, a cash card, an IC card, or a flat plate such as a sheet metal may be used. Therefore, the work W to be supplied to the supply target member S is not limited to the chip 21, but a component corresponding to the supply target member S. If the member S to be supplied is not the substrate 22 and does not require heating, the heating mechanism 12 of the shuttle 10 can be omitted.
　シャトル１０として、前記実施形態では、１個であったが、２個以上あってもよい。また、バックアッププレート２の種類としても３種類に限るものではなく、１種類であっても、２種類であっても、３種類以上であってもよい。識別機構１９を備えたものにおいて、バックアッププレート２とプレート本体１とが整合しない場合に、整合しないときに（エラーが生じたときに）、その旨をしらせる表示手段（例えば、警報音を発生させたり、モニター等にその旨を表示させたりする）を設けることも可能である。 The number of shuttles 10 is one in the above embodiment, but there may be two or more. The types of the backup plate 2 are not limited to three types, and may be one type, two types, or three or more types. In the case where the backup plate 2 and the plate body 1 are not aligned with each other in the identification mechanism 19, a display means (for example, an alarm sound is generated to indicate that) when the backup plate 2 and the plate body 1 are not aligned (when an error occurs). It is also possible to provide such) on a monitor or the like.
　実施形態では凹凸嵌合構造Ｍの凹部１ｂが貫通孔にて構成されているが、貫通孔ではなく、底面を有する止め穴で構成してもよい。また、凹凸嵌合構造Ｍの凸部１ａ及び凹部２ｂとしてそれぞれ１個に限るものではない。マガジン機構３、４として、前記実施形態では、プッシャ機構を備えるものであったが、このようなプッシャ機構を有さなないものであってもよい。プッシャ機構を有さない場合、マガジン機構３（４）内のバックアッププレートを搬送手段６，７又は他の引き出し機構で引き出すように構成できる。 In the embodiment, the recess 1b of the concavo-convex fitting structure M is formed of a through hole, but it may be formed of a stop hole having a bottom surface instead of the through hole. Further, the number of the convex portions 1a and the concave portions 2b of the concave-convex fitting structure M is not limited to one each. Although the pusher mechanism is provided as the magazine mechanisms 3 and 4 in the above-described embodiment, the magazine mechanism 3 or 4 may not have such a pusher mechanism. When the pusher mechanism is not provided, the backup plate in the magazine mechanism 3 (4) can be pulled out by the transporting means 6, 7 or other pulling mechanism.
　ローダ内の複数種のバックアッププレートの中から任意の一枚のバックアッププレートを送出して、プレート本体に、バックアッププレートを供給するとともに、供給されたバックアッププレートをプレート本体から回収するものに用いることができる。 It can be used for sending out any one backup plate from multiple types of backup plates in the loader, supplying the backup plate to the plate body, and collecting the supplied backup plate from the plate body. it can.
１     プレート本体
１ａ   凸部
２、２Ａ、２Ｂ、２Ｃ バックアッププレート
２ｂ   凹部
３、４     マガジン機構
５     搬送レール
５ａ   ガイドレール
５ａ１ 受け片
６、７     搬送機構
８     昇降機構
９     往復動機構
１０   シャトル
１７   ガイドレール拡縮機構
１８   姿勢検出機構
１９   識別機構
２１   チップ
２２、２２Ａ、２２Ｂ、２２Ｃ       基板 1 plate body 1a convex part 2, 2A, 2B, 2C backup plate 2b concave part 3, 4 magazine mechanism 5 carrier rail 5a guide rail 5a1 receiving piece 6, 7 carrier mechanism 8 lifting mechanism 9 reciprocating mechanism 10 shuttle 17 guide rail scaling mechanism 18 Attitude Detection Mechanism 19 Identification Mechanism 21 Chips 22, 22A, 22B, 22C Substrate

Claims (13)

  1. 　プレート本体に、複数種のバックアッププレートの中から任意の一枚のバックアッププレートを供給するとともに、供給されたバックアッププレートをプレート本体から回収するバックアッププレート供給・回収装置であって、
    　複数種のバックアッププレートの中から任意の一枚のバックアッププレートを送出可能なマガジン機構と、プレート本体とバックアッププレートとを相対的に昇降させる昇降機構とを備え、
    　プレート本体の上方位置又は下方位置に、マガジン機構から送出されたバックアップレートを配置し、昇降機構を介してのプレート本体とバックアッププレートとの相対的な上昇又は下降にて、プレート本体とバックアッププレートとが一体化し、昇降機構を介してのプレート本体とバックアッププレートとの相対的な下降又は上昇にて、プレート本体とバックアッププレートとが分離することを特徴とするバックアッププレート供給・回収装置。     A backup plate supply / recovery device for supplying an arbitrary one backup plate from a plurality of types of backup plates to the plate body and collecting the supplied backup plate from the plate body,
    A magazine mechanism that can send out any one backup plate from a plurality of types of backup plates, and an elevating mechanism that relatively elevates the plate body and the backup plate are provided.
    The backup rate sent from the magazine mechanism is arranged at the upper position or the lower position of the plate body, and the plate body and the backup plate are moved relative to each other by ascending or descending the plate body and the backup plate via the elevating mechanism. The backup plate supply / collection device is characterized in that the plate body and the backup plate are separated by the relative lowering or raising of the plate body and the backup plate via the lifting mechanism.
  2. 　プレート本体とバックアッププレートとが一体化されてなるシャトルに保持されるべき基板と、マガジン機構のバックアッププレートとのいずれかを搬送する搬送機構を備えたことを特徴とする請求項１に記載のバックアッププレート供給・回収装置。 2. The backup according to claim 1, further comprising a transfer mechanism that transfers either a substrate to be held by a shuttle, which is an integrated body of a plate and a backup plate, or a backup plate of a magazine mechanism. Plate supply / collection device.
  3. 　一つのマガジン機構を備え、このマガジン機構のバックアッププレートは一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、前記一の搬送機構又は他の搬送機構を介して、前記一のマガジン機構に回収されることを特徴とする請求項１又は請求項２に記載のバックアッププレート供給・回収装置。 It is equipped with one magazine mechanism, the backup plate of this magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via the one transport mechanism or another transport mechanism. The backup plate supply / collection device according to claim 1 or 2, wherein the backup plate is collected into the one magazine mechanism.
  4. 　少なくとも一対のマガジン機構を備え、一のマガジン機構のバックアッププレートは一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、一の搬送機構又は他の搬送機構を介して、前記一のマガジン機構又は他のマガジン機構に回収されることを特徴とする請求項１又は請求項２に記載のバックアッププレート供給・回収装置。 At least a pair of magazine mechanisms are provided, the backup plate of one magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via one transport mechanism or another transport mechanism. The backup plate supply / recovery device according to claim 1 or 2, wherein the backup plate supply / recovery device is recovered by the one magazine mechanism or another magazine mechanism.
  5. 　少なくとも３機以上のマガジン機構を備え、いずれかのマガジン機構のバックアッププレートが一の搬送機構を介してプレート本体に供給され、プレート本体から分離されたバックアッププレートは、前記一の搬送機構又は他の搬送機構を介して、前記バックアッププレートが供給されたマガジン機構又は他のマガジン機構に回収されることを特徴とする請求項１又は請求項２に記載のバックアッププレート供給・回収装置。 At least three or more magazine mechanisms are provided, and the backup plate of any one of the magazine mechanisms is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is the one transport mechanism or another. The backup plate supply / recovery device according to claim 1 or 2, wherein the backup plate is recovered by a magazine mechanism to which the backup plate is supplied or another magazine mechanism via a transport mechanism.
  6. 搬送機構は、マガジン機構からバックアッププレートを搬送レールに沿ってプレート本体まで搬送、又は、プレート本体から分離された状態のバックアッププレートを、搬送レールに沿ってマガジン機構まで搬送し、搬送レールは、相対向する一対のガイドレールを備え、各ガイドレールには、バックアッププレートを受けるプレート支持部を有することを特徴とする請求項１又は請求項２に記載のバックアッププレート供給・回収装置。 The transfer mechanism transfers the backup plate from the magazine mechanism to the plate body along the transfer rail, or the backup plate separated from the plate body to the magazine mechanism along the transfer rail, and the transfer rail is The backup plate supply / recovery device according to claim 1 or 2, further comprising a pair of facing guide rails, each guide rail having a plate support portion for receiving a backup plate.
  7. 　一対のガイドレールは、ガイドレール間隔の拡縮が可能であり、間隔拡大状態で、バックアッププレートのガイドレール間の通過を許容し、間隔縮小状態でガイドレールにプレート支持部によるバックアッププレートの受けが可能であることを特徴とする請求項６に記載のバックアッププレート供給・回収装置。 The pair of guide rails can be expanded / contracted in the guide rail interval, allowing the backup plate to pass between the guide rails when the interval is expanded, and allowing the guide rails to receive the backup plate on the guide rails when the interval is reduced. The backup plate supply / recovery device according to claim 6, wherein
  8. 　バックアッププレートは、品種を識別する情報を具備していることを特徴とする請求項１～請求項７のいずれか１項に記載のバックアッププレート供給・回収装置。 The backup plate supply / recovery device according to any one of claims 1 to 7, wherein the backup plate has information for identifying a product type.
  9. 　前記バックアッププレートの情報を識別する識別機構を備えていることを特徴とする請求項８に記載のバックアッププレート供給・回収装置。 The backup plate supply / collection device according to claim 8, further comprising an identification mechanism for identifying information of the backup plate.
  10. 　前記バックアッププレートのプレート本体への装着姿勢を検出する姿勢検出機構を備えていることを特徴とする請求項１～請求項９のいずれか１項に記載のバックアッププレート供給・回収装置。 The backup plate supply / recovery device according to any one of claims 1 to 9, further comprising an attitude detection mechanism that detects an installation attitude of the backup plate on the plate body.
  11. 　バックアッププレートとプレート本体とが凹凸嵌合構造にて一体化されることを特徴とする請求項１～請求項１０のいずれか1項に記載のバックアッププレート供給・回収装置。 The backup plate supply / recovery device according to any one of claims 1 to 10, wherein the backup plate and the plate body are integrated by a concave-convex fitting structure.
  12. 　チップを基板のアイランド部にボンディングするダイボンダであって、
    　前記請求項１から請求項１１のいずれか１項のバックアッププレート供給・回収装置にてバックアッププレートが搬送され、バックアッププレートとプレート本体とが一体化された状態にて、このバックアッププレートにて基板が支持されることを特徴とするダイボンダ。     A die bonder for bonding a chip to an island portion of a substrate,
    The backup plate is conveyed by the backup plate supply / recovery device according to any one of claims 1 to 11, and the backup plate and the plate body are integrated with each other, so that the substrate is transferred by the backup plate. A die bonder characterized by being supported.
  13. 　チップを基板のアイランド部にボンディングするボンディング方法であって、
    　前記請求項１から請求項１１のいずれか１項のバックアッププレート供給・回収装置にて、プレート本体までバックアッププレートを搬送して、プレート本体とバックアッププレートとを一体化して、このバックアッププレートにて基板を支持させた状態で、基板のアイランド部にボンディングするボンディング方法。
     
     
     
     
          A bonding method for bonding a chip to an island portion of a substrate,
    The backup plate supply / recovery device according to any one of claims 1 to 11, wherein the backup plate is conveyed to the plate body, the plate body and the backup plate are integrated, and the backup plate is used as a substrate. Bonding method for bonding to the island part of the substrate with the substrate supported.




PCT/JP2019/043929 2018-11-13 2019-11-08 Backup plate supply/recovery device, die bonder and bonding method WO2020100750A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG11202005714VA SG11202005714VA (en) 2018-11-13 2019-11-08 Backup plate feed and recovery apparatus, die bonder, and bonding method
JP2019562022A JP6636681B1 (en) 2018-11-13 2019-11-08 Backup plate supply / recovery device, die bonder, and bonding method
CN201980004821.3A CN111436220B (en) 2018-11-13 2019-11-08 Support plate supply and recovery device, chip bonding machine and bonding method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-213188 2018-11-13
JP2018213188 2018-11-13

Publications (2)

Publication Number Publication Date
WO2020100750A1 true WO2020100750A1 (en) 2020-05-22
WO2020100750A8 WO2020100750A8 (en) 2020-07-23

Family

ID=70731134

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/043929 WO2020100750A1 (en) 2018-11-13 2019-11-08 Backup plate supply/recovery device, die bonder and bonding method

Country Status (3)

Country Link
CN (1) CN111436220B (en)
SG (1) SG11202005714VA (en)
WO (1) WO2020100750A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10308404A (en) * 1997-05-06 1998-11-17 Matsushita Electric Ind Co Ltd Chip bonding device
JPH1197460A (en) * 1997-09-18 1999-04-09 Nichiden Mach Ltd Die bonder
JP2000150545A (en) * 1998-11-05 2000-05-30 Matsushita Electric Ind Co Ltd Die bonder
JP2008218554A (en) * 2007-03-01 2008-09-18 Canon Machinery Inc Backup plate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10308404A (en) * 1997-05-06 1998-11-17 Matsushita Electric Ind Co Ltd Chip bonding device
JPH1197460A (en) * 1997-09-18 1999-04-09 Nichiden Mach Ltd Die bonder
JP2000150545A (en) * 1998-11-05 2000-05-30 Matsushita Electric Ind Co Ltd Die bonder
JP2008218554A (en) * 2007-03-01 2008-09-18 Canon Machinery Inc Backup plate

Also Published As

Publication number Publication date
CN111436220B (en) 2024-03-08
SG11202005714VA (en) 2020-07-29
CN111436220A (en) 2020-07-21
WO2020100750A8 (en) 2020-07-23

Similar Documents

Publication Publication Date Title
JP6692376B2 (en) Electronic component mounting apparatus and mounting method, and package component manufacturing method
US7306695B2 (en) Apparatus and method for picking up semiconductor chip
KR20130030196A (en) Die bonder and bonding method
JP7126906B2 (en) Transfer device, transfer method, die bonder, and bonding method
US7598729B2 (en) Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same
KR102649912B1 (en) Bonding module and die bonding apparatus having the same
JP3861710B2 (en) Electronic component supply device and electronic component mounting device
CN108428643B (en) Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
JP7281266B2 (en) Magazine device, transfer device, transfer method, die bonder, and bonding method
WO2020100750A1 (en) Backup plate supply/recovery device, die bonder and bonding method
JP6636681B1 (en) Backup plate supply / recovery device, die bonder, and bonding method
US20210050239A1 (en) Laser marking device and laser marking method
KR20190043731A (en) Die bonding apparatus
US20230086461A1 (en) Method for controlling boat/strip type solder ball placement system
KR100315514B1 (en) Two-head type CSP bonder apparatus
JP7076518B2 (en) Transport equipment, transport method, die bonder, and bonding method
JP3757900B2 (en) Electronic component mounting method for electronic component mounting apparatus
JP7284328B2 (en) Die bonding apparatus and semiconductor device manufacturing method
US20230028219A1 (en) Die bonding method and die bonding apparatus
JP2022076180A (en) Transport device, transport method, die bonder, and bonding method
KR100483467B1 (en) Apparatus for sorting ic card
KR20240047240A (en) Die bonding apparatus
KR20240048052A (en) Die bonding apparatus
KR20230076584A (en) Die bonding method and die bonding apparatus
JPS6122637A (en) Bonding device

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2019562022

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19885164

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19885164

Country of ref document: EP

Kind code of ref document: A1