WO2020100750A8 - Backup plate feed and recovery apparatus, die bonder, and bonding method - Google Patents

Backup plate feed and recovery apparatus, die bonder, and bonding method Download PDF

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Publication number
WO2020100750A8
WO2020100750A8 PCT/JP2019/043929 JP2019043929W WO2020100750A8 WO 2020100750 A8 WO2020100750 A8 WO 2020100750A8 JP 2019043929 W JP2019043929 W JP 2019043929W WO 2020100750 A8 WO2020100750 A8 WO 2020100750A8
Authority
WO
WIPO (PCT)
Prior art keywords
backup plate
bonding method
recovery apparatus
die bonder
plate feed
Prior art date
Application number
PCT/JP2019/043929
Other languages
French (fr)
Japanese (ja)
Other versions
WO2020100750A1 (en
Inventor
永元　信裕
Original Assignee
キヤノンマシナリー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノンマシナリー株式会社 filed Critical キヤノンマシナリー株式会社
Priority to JP2019562022A priority Critical patent/JP6636681B1/en
Priority to CN201980004821.3A priority patent/CN111436220B/en
Priority to SG11202005714VA priority patent/SG11202005714VA/en
Publication of WO2020100750A1 publication Critical patent/WO2020100750A1/en
Publication of WO2020100750A8 publication Critical patent/WO2020100750A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Abstract

The present invention transports a backup plate in a state of being supported by a transport rail to a main plate body via a transport mechanism, integrates the main plate body and the backup plate with one another by raising the main plate body using a raising/lowering mechanism, causes the backup plate to be supported by the transport rail when the main plate body is lowered using the raising/lowering mechanism, resulting in the separation of the main plate body and the backup plate, and transports the separated backup plate while supported by the transport rail to a magazine mechanism via the transport mechanism.
PCT/JP2019/043929 2018-11-13 2019-11-08 Backup plate supply/recovery device, die bonder and bonding method WO2020100750A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019562022A JP6636681B1 (en) 2018-11-13 2019-11-08 Backup plate supply / recovery device, die bonder, and bonding method
CN201980004821.3A CN111436220B (en) 2018-11-13 2019-11-08 Support plate supply and recovery device, chip bonding machine and bonding method
SG11202005714VA SG11202005714VA (en) 2018-11-13 2019-11-08 Backup plate feed and recovery apparatus, die bonder, and bonding method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-213188 2018-11-13
JP2018213188 2018-11-13

Publications (2)

Publication Number Publication Date
WO2020100750A1 WO2020100750A1 (en) 2020-05-22
WO2020100750A8 true WO2020100750A8 (en) 2020-07-23

Family

ID=70731134

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/043929 WO2020100750A1 (en) 2018-11-13 2019-11-08 Backup plate supply/recovery device, die bonder and bonding method

Country Status (3)

Country Link
CN (1) CN111436220B (en)
SG (1) SG11202005714VA (en)
WO (1) WO2020100750A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3314659B2 (en) * 1997-05-06 2002-08-12 松下電器産業株式会社 Chip bonding equipment
JP3176573B2 (en) * 1997-09-18 2001-06-18 エヌイーシーマシナリー株式会社 Die bonder
JP3456153B2 (en) * 1998-11-05 2003-10-14 松下電器産業株式会社 Die bonding equipment
JP5160105B2 (en) * 2007-03-01 2013-03-13 キヤノンマシナリー株式会社 Backup plate

Also Published As

Publication number Publication date
CN111436220B (en) 2024-03-08
SG11202005714VA (en) 2020-07-29
CN111436220A (en) 2020-07-21
WO2020100750A1 (en) 2020-05-22

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