WO2020100750A8 - Dispositif d'alimentation/récupération de plaque d'appui, microsoudeuse de puces et procédé de soudage - Google Patents
Dispositif d'alimentation/récupération de plaque d'appui, microsoudeuse de puces et procédé de soudage Download PDFInfo
- Publication number
- WO2020100750A8 WO2020100750A8 PCT/JP2019/043929 JP2019043929W WO2020100750A8 WO 2020100750 A8 WO2020100750 A8 WO 2020100750A8 JP 2019043929 W JP2019043929 W JP 2019043929W WO 2020100750 A8 WO2020100750 A8 WO 2020100750A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- backup plate
- bonding method
- recovery apparatus
- die bonder
- plate feed
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000011084 recovery Methods 0.000 title 1
- 230000032258 transport Effects 0.000 abstract 5
- 230000007246 mechanism Effects 0.000 abstract 3
- 230000007723 transport mechanism Effects 0.000 abstract 2
- 238000000926 separation method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
La présente invention transporte une plaque d'appui dans un état supporté par un rail de transport à un corps de plaque principal par l'intermédiaire d'un mécanisme de transport, intègre le corps de plaque principale et la plaque de support l'une avec l'autre par élévation du corps de plaque principal à l'aide d'un mécanisme d'élévation/abaissement, amène la plaque d'appui à être supportée par le rail de transport lorsque le corps de plaque principale est abaissé à l'aide du mécanisme d'élévation/abaissement, ce qui entraîne la séparation du corps de plaque principale et de la plaque d'appui, et transporte la plaque d'appui séparée tout en étant supportée par le rail de transport vers un mécanisme de magasin par l'intermédiaire du mécanisme de transport.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG11202005714VA SG11202005714VA (en) | 2018-11-13 | 2019-11-08 | Backup plate feed and recovery apparatus, die bonder, and bonding method |
CN201980004821.3A CN111436220B (zh) | 2018-11-13 | 2019-11-08 | 支承板供给回收装置、芯片接合机及接合方法 |
JP2019562022A JP6636681B1 (ja) | 2018-11-13 | 2019-11-08 | バックアッププレート供給・回収装置、ダイボンダ、及びボンディング方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-213188 | 2018-11-13 | ||
JP2018213188 | 2018-11-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2020100750A1 WO2020100750A1 (fr) | 2020-05-22 |
WO2020100750A8 true WO2020100750A8 (fr) | 2020-07-23 |
Family
ID=70731134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/043929 WO2020100750A1 (fr) | 2018-11-13 | 2019-11-08 | Dispositif d'alimentation/récupération de plaque d'appui, microsoudeuse de puces et procédé de soudage |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN111436220B (fr) |
SG (1) | SG11202005714VA (fr) |
WO (1) | WO2020100750A1 (fr) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3314659B2 (ja) * | 1997-05-06 | 2002-08-12 | 松下電器産業株式会社 | チップのボンディング装置 |
JP3176573B2 (ja) * | 1997-09-18 | 2001-06-18 | エヌイーシーマシナリー株式会社 | ダイボンダ |
JP3456153B2 (ja) * | 1998-11-05 | 2003-10-14 | 松下電器産業株式会社 | ダイボンディング装置 |
JP5160105B2 (ja) * | 2007-03-01 | 2013-03-13 | キヤノンマシナリー株式会社 | バックアッププレート |
-
2019
- 2019-11-08 CN CN201980004821.3A patent/CN111436220B/zh active Active
- 2019-11-08 SG SG11202005714VA patent/SG11202005714VA/en unknown
- 2019-11-08 WO PCT/JP2019/043929 patent/WO2020100750A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN111436220A (zh) | 2020-07-21 |
SG11202005714VA (en) | 2020-07-29 |
CN111436220B (zh) | 2024-03-08 |
WO2020100750A1 (fr) | 2020-05-22 |
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