SG11202005714VA - Backup plate feed and recovery apparatus, die bonder, and bonding method - Google Patents
Backup plate feed and recovery apparatus, die bonder, and bonding methodInfo
- Publication number
- SG11202005714VA SG11202005714VA SG11202005714VA SG11202005714VA SG11202005714VA SG 11202005714V A SG11202005714V A SG 11202005714VA SG 11202005714V A SG11202005714V A SG 11202005714VA SG 11202005714V A SG11202005714V A SG 11202005714VA SG 11202005714V A SG11202005714V A SG 11202005714VA
- Authority
- SG
- Singapore
- Prior art keywords
- bonding method
- backup plate
- recovery apparatus
- die bonder
- plate feed
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000011084 recovery Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018213188 | 2018-11-13 | ||
| PCT/JP2019/043929 WO2020100750A1 (fr) | 2018-11-13 | 2019-11-08 | Dispositif d'alimentation/récupération de plaque d'appui, microsoudeuse de puces et procédé de soudage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202005714VA true SG11202005714VA (en) | 2020-07-29 |
Family
ID=70731134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202005714VA SG11202005714VA (en) | 2018-11-13 | 2019-11-08 | Backup plate feed and recovery apparatus, die bonder, and bonding method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN111436220B (fr) |
| SG (1) | SG11202005714VA (fr) |
| WO (1) | WO2020100750A1 (fr) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3314659B2 (ja) * | 1997-05-06 | 2002-08-12 | 松下電器産業株式会社 | チップのボンディング装置 |
| JP3176573B2 (ja) * | 1997-09-18 | 2001-06-18 | エヌイーシーマシナリー株式会社 | ダイボンダ |
| JP3456153B2 (ja) * | 1998-11-05 | 2003-10-14 | 松下電器産業株式会社 | ダイボンディング装置 |
| JP5160105B2 (ja) * | 2007-03-01 | 2013-03-13 | キヤノンマシナリー株式会社 | バックアッププレート |
-
2019
- 2019-11-08 CN CN201980004821.3A patent/CN111436220B/zh active Active
- 2019-11-08 WO PCT/JP2019/043929 patent/WO2020100750A1/fr active Application Filing
- 2019-11-08 SG SG11202005714VA patent/SG11202005714VA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN111436220A (zh) | 2020-07-21 |
| WO2020100750A1 (fr) | 2020-05-22 |
| WO2020100750A8 (fr) | 2020-07-23 |
| CN111436220B (zh) | 2024-03-08 |
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