SG11202003214XA - Bonding head device, bonding method and bonding machine - Google Patents

Bonding head device, bonding method and bonding machine

Info

Publication number
SG11202003214XA
SG11202003214XA SG11202003214XA SG11202003214XA SG11202003214XA SG 11202003214X A SG11202003214X A SG 11202003214XA SG 11202003214X A SG11202003214X A SG 11202003214XA SG 11202003214X A SG11202003214X A SG 11202003214XA SG 11202003214X A SG11202003214X A SG 11202003214XA
Authority
SG
Singapore
Prior art keywords
bonding
head device
machine
bonding method
bonding machine
Prior art date
Application number
SG11202003214XA
Inventor
Hailin Cheng
Lili Zhao
Hai Xia
Feibiao Chen
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11202003214XA publication Critical patent/SG11202003214XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
SG11202003214XA 2017-10-09 2018-10-09 Bonding head device, bonding method and bonding machine SG11202003214XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710930963.5A CN109637942B (en) 2017-10-09 2017-10-09 Bonding head device, bonding method and bonding machine
PCT/CN2018/109405 WO2019072153A1 (en) 2017-10-09 2018-10-09 Bonding head device, bonding method and bonding machine

Publications (1)

Publication Number Publication Date
SG11202003214XA true SG11202003214XA (en) 2020-05-28

Family

ID=66050766

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202003214XA SG11202003214XA (en) 2017-10-09 2018-10-09 Bonding head device, bonding method and bonding machine

Country Status (5)

Country Link
KR (1) KR102394691B1 (en)
CN (1) CN109637942B (en)
SG (1) SG11202003214XA (en)
TW (1) TWI673800B (en)
WO (1) WO2019072153A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111009481B (en) * 2019-12-19 2023-04-18 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Chip substrate high-pressure flip-chip bonding flexible pressurization method
CN112881175B (en) * 2021-01-26 2022-07-22 湘潭大学 Low-cost indenter pressure head soft landing method and system based on composite deceleration algorithm
CN113146516B (en) * 2021-02-01 2022-05-27 北京理工大学 Modular flexible clamp
CN113241319B (en) * 2021-05-31 2021-11-30 广东工业大学 Rapid positioning method and system

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715182A (en) * 1993-06-24 1995-01-17 Toshiba Corp Device and method for treating semiconductor
JP2003224144A (en) * 2002-01-30 2003-08-08 Nidec Copal Corp Die bonding apparatus
JP2007335733A (en) * 2006-06-16 2007-12-27 Matsushita Electric Ind Co Ltd Flatness measuring method of stage and part mounter using the same
KR20090066458A (en) * 2007-12-20 2009-06-24 세크론 주식회사 Pressing unit and die bonding head having a pressing unit
JP5030857B2 (en) * 2008-05-14 2012-09-19 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP2010161211A (en) * 2009-01-08 2010-07-22 Renesas Technology Corp Method and device for manufacturing semiconductor device
KR102187124B1 (en) * 2013-12-19 2020-12-04 (주)제이티 Transfer tool, and link member thereof
JP6272676B2 (en) * 2013-11-07 2018-01-31 東レエンジニアリング株式会社 Bonding equipment
CN103915368B (en) * 2014-04-02 2016-08-31 华中科技大学 A kind of chip pick-and-place device
CN104966687B (en) * 2015-06-30 2017-08-25 北京中电科电子装备有限公司 A kind of bonding joint device
CN105070670B (en) * 2015-07-17 2017-12-29 北京中电科电子装备有限公司 A kind of bonding joint device and chip packaging device
CN106373914B (en) * 2016-11-10 2020-03-24 北京中电科电子装备有限公司 Chip bonding device
CN106385134B (en) * 2016-11-24 2019-02-22 宁波知了智能科技有限公司 It is straight to drive rotating electric machine bonding joint device
KR101736476B1 (en) * 2017-03-23 2017-05-16 한화테크윈 주식회사 A component keeping head
JP7325965B2 (en) * 2018-03-26 2023-08-15 芝浦メカトロニクス株式会社 Element mounting apparatus, adjustment method for element mounting apparatus, and element mounting method

Also Published As

Publication number Publication date
TWI673800B (en) 2019-10-01
CN109637942A (en) 2019-04-16
KR102394691B1 (en) 2022-05-06
TW201923912A (en) 2019-06-16
WO2019072153A1 (en) 2019-04-18
KR20200060500A (en) 2020-05-29
CN109637942B (en) 2021-02-05

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