SG10202000539UA - Bonding apparatus, system, and method of bonding - Google Patents

Bonding apparatus, system, and method of bonding

Info

Publication number
SG10202000539UA
SG10202000539UA SG10202000539UA SG10202000539UA SG10202000539UA SG 10202000539U A SG10202000539U A SG 10202000539UA SG 10202000539U A SG10202000539U A SG 10202000539UA SG 10202000539U A SG10202000539U A SG 10202000539UA SG 10202000539U A SG10202000539U A SG 10202000539UA
Authority
SG
Singapore
Prior art keywords
bonding
bonding apparatus
Prior art date
Application number
SG10202000539UA
Inventor
Wickramanayaka Sunil
Original Assignee
Airise Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Airise Pte Ltd filed Critical Airise Pte Ltd
Publication of SG10202000539UA publication Critical patent/SG10202000539UA/en

Links

SG10202000539UA 2019-01-23 2020-01-20 Bonding apparatus, system, and method of bonding SG10202000539UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201900578Q 2019-01-23

Publications (1)

Publication Number Publication Date
SG10202000539UA true SG10202000539UA (en) 2020-08-28

Family

ID=69917886

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202000539UA SG10202000539UA (en) 2019-01-23 2020-01-20 Bonding apparatus, system, and method of bonding

Country Status (2)

Country Link
CN (1) CN210223961U (en)
SG (1) SG10202000539UA (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021188042A1 (en) * 2020-03-18 2021-09-23 Airise Pte. Ltd. Bonding apparatus, system, and method of bonding
JP2022078625A (en) 2020-11-13 2022-05-25 タツモ株式会社 Joint device
CN113161250B (en) * 2020-12-08 2022-02-25 恩纳基智能科技无锡有限公司 Eutectic welding equipment and heating system thereof
CN113113336B (en) * 2021-04-21 2022-06-14 莆田学院 Anodic bonding equipment

Also Published As

Publication number Publication date
CN210223961U (en) 2020-03-31

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