WO2020100750A1 - Dispositif d'alimentation/récupération de plaque d'appui, microsoudeuse de puces et procédé de soudage - Google Patents

Dispositif d'alimentation/récupération de plaque d'appui, microsoudeuse de puces et procédé de soudage Download PDF

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Publication number
WO2020100750A1
WO2020100750A1 PCT/JP2019/043929 JP2019043929W WO2020100750A1 WO 2020100750 A1 WO2020100750 A1 WO 2020100750A1 JP 2019043929 W JP2019043929 W JP 2019043929W WO 2020100750 A1 WO2020100750 A1 WO 2020100750A1
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WO
WIPO (PCT)
Prior art keywords
backup plate
plate
backup
plate body
magazine
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Application number
PCT/JP2019/043929
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English (en)
Japanese (ja)
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WO2020100750A8 (fr
Inventor
永元　信裕
Original Assignee
キヤノンマシナリー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノンマシナリー株式会社 filed Critical キヤノンマシナリー株式会社
Priority to JP2019562022A priority Critical patent/JP6636681B1/ja
Priority to CN201980004821.3A priority patent/CN111436220B/zh
Priority to SG11202005714VA priority patent/SG11202005714VA/en
Publication of WO2020100750A1 publication Critical patent/WO2020100750A1/fr
Publication of WO2020100750A8 publication Critical patent/WO2020100750A8/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Definitions

  • the present invention relates to a backup plate supply / recovery device, a die bonder, and a bonding method.
  • a bonding apparatus for bonding a chip to a lead frame conveys the island portion of the lead frame to a paste application position, applies the paste to the island portion, and further, the island portion, as described in Patent Document 1, for example. Is transported to the bonding position and the chip is bonded to this island portion.
  • the lead frame is supported from below by a backup plate in order to stabilize the paste application work and the bonding work.
  • the adhesive film DAF: die attach film
  • the substrate laminated frame or organic substrate
  • a backup plate is used to mount the chips on the board with high accuracy and high quality (voidless, uniform bonding strength). Therefore, the backup plate is manufactured in accordance with the substrate size, the substrate design pattern, and the like, and there are various types, and it is necessary to replace the backup plate according to the substrate.
  • Patent No. 6124969 gazette
  • the replacement frequency of the backup plate is high, the productivity will be poor.
  • the backup plate being worked is heated and the replacement is done manually, it is necessary to wait until the backup plate cools down, and one replacement time is long.
  • there are many types of backup plates there is a risk that the backup plate may be replaced with a different backup plate. Further, there is a possibility that the backup plate may not be mounted in a proper state after the replacement.
  • the present invention provides a backup plate supply / recovery device, a die bonder, and a bonding method capable of automating the exchange of backup plates and improving productivity.
  • the backup plate supply / collection device of the present invention supplies an arbitrary one backup plate from a plurality of types of backup plates to the plate body, and a backup plate supply / collection device that collects the supplied backup plate from the plate body.
  • a recovery device which comprises a magazine mechanism capable of sending out any one backup plate from a plurality of types of backup plates, and an elevating mechanism for relatively elevating the plate body and the backup plate, The backup rate sent from the magazine mechanism is arranged at the upper position or the lower position, and the plate body and the backup plate are integrated by the relative raising or lowering of the plate body and the backup plate via the elevating mechanism.
  • the plate body and the backup plate are separated by the relative lowering or raising of the plate body and the backup plate via the elevating mechanism.
  • an arbitrary one backup plate can be sent from the plurality of types of backup plates from the magazine mechanism.
  • the plate body and the backup plate are integrated by raising the plate body via the elevating mechanism. Further, the plate body and the backup plate are separated from each other by lowering the plate body through the elevating mechanism in a state where the plate body and the backup plate are integrated. In this way, the backup plate separated in this way can automatically perform supply / collection (replacement) of the backup plate instead of manually.
  • the substrate and the backup plate can be transported from the magazine mechanism to the plate body side or can be collected from the plate body side to the magazine mechanism.
  • the backup plate of this magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via the one transport mechanism or another transport mechanism. , The magazine mechanism can be collected. With this configuration, only one magazine mechanism that can supply to the plate body and collect from the plate body is sufficient, and the entire apparatus can be made compact.
  • At least a pair of magazine mechanisms are provided, the backup plate of one magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via one transport mechanism or another transport mechanism. Then, the magazine may be collected in the one magazine mechanism or another magazine mechanism. With such a configuration, the backup plate to be collected can be collected in the magazine mechanism that has supplied or another magazine mechanism, and the workability can be improved.
  • At least three or more magazine mechanisms are provided, and the backup plate of any one of the magazine mechanisms is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is the one transport mechanism or another.
  • the configuration may be such that the backup plate is collected by the magazine mechanism to which the backup plate is supplied or another magazine mechanism via the transport mechanism. With this configuration, various types of backup plates can be supplied to the plate main body from three or more magazine mechanisms, and the backup plates can be recovered by any of the magazine mechanisms. Become.
  • the transfer mechanism transfers the backup plate from the magazine mechanism to the plate body along the transfer rail, or the backup plate separated from the plate body to the magazine mechanism along the transfer rail, and the transfer rail is It is preferable that the guide rails are provided with a pair of facing guide rails, and each guide rail has a plate support portion for receiving a backup plate. With this configuration, the backup plate is transported while being supported by the transport rail, and can be stably transported when the backup plate is transported by the transport mechanism.
  • the pair of guide rails can be expanded / contracted in the guide rail interval, allowing the backup plate to pass between the guide rails when the interval is expanded, and allowing the guide rails to receive the backup plate on the guide rails when the interval is reduced. Is preferred.
  • the backup plate preferably has information for identifying the product type. In this way, with the information that identifies the type of product, the backup plate to be supplied can be identified, and misuse (misinstallation) can be prevented.
  • an identification mechanism that identifies the backup plate information. As described above, in the case where the identification mechanism is provided, the reliability of preventing misuse (misinstallation) is improved.
  • the backup plate can be attached to the plate body in a stable posture (regular posture).
  • the backup plate and the plate body can be configured so as to be integrated by a concavo-convex fitting structure.
  • the backup plate and the plate body can be integrated with a simple structure.
  • the concavo-convex fitting structure means that a member on one side is provided with a convex portion, and a member on the other side is provided with a concave portion to which the convex portion fits. Then, these two members are integrated. Therefore, it is possible to provide a convex portion on the backup plate side and a concave portion on the plate body side, or conversely, provide a concave portion on the backup plate side and a convex portion on the plate body side.
  • the die bonder of the present invention is a die bonder for bonding a chip to an island portion of a substrate, wherein the backup plate is conveyed by the backup plate supply / collection device, and the backup plate and the plate body are integrated, The substrate is supported by this backup plate.
  • a backup plate suitable for the substrate size and the substrate design pattern can be used, and the substrate can be supported by this backup plate. Therefore, the chips on the substrate can be stably bonded.
  • the bonding method of the present invention is a bonding method for bonding a chip to an island portion of a substrate, wherein the backup plate supply / recovery device conveys the backup plate to the plate body and integrates the plate body and the backup plate. Then, the substrate is supported by the backup plate and bonded to the island portion of the substrate.
  • the substrate can be supported by the backup plate that matches the substrate size and the board design pattern. Therefore, the chips on the substrate can be stably bonded.
  • the present invention can automatically supply and recover (replace) the backup plate instead of manually. Even when the backup plate is heated and used, the backup plate can be replaced without waiting for so-called cooling, resulting in excellent productivity.
  • FIG. 2 is a perspective view of a backup plate supply / recovery transfer rail shown in FIG. 1. It is a simplified diagram of the backup plate supply and recovery device of the present invention.
  • FIG. 7 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, in a state where the backup plate is conveyed to a position above the plate body via the guide rail.
  • FIG. 7 is a simplified cross-sectional view showing the relationship between the backup plate, the plate body, and the guide rail, and showing a state in which the plate body is raised to integrate the backup plate and the plate body.
  • FIG. 6 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, in a state where a space between the guide rails is enlarged.
  • FIG. 7 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, and a state where the plate body is lowered in a state where a space between the guide rails is enlarged.
  • FIG. 6 is a simplified diagram showing a relationship between a backup plate, a plate body, and a guide rail, in which a substrate is conveyed onto the backup plate via the guide rail.
  • FIG. 6 is a simplified diagram showing a relationship between a backup plate, a plate body, and a guide rail, in which the plate body is lifted and a substrate is attracted to the backup plate. It is a simplified diagram showing a work. It is a simplified diagram which shows operation
  • FIG. 1 shows a simplified block diagram of a backup plate supply / collection device according to the present invention
  • FIG. 2 shows a perspective view of a transfer rail of the backup plate supply / collection device
  • FIG. 3 shows an overall simplified backup plate supply / collection device. The figure is shown.
  • this backup plate supply / collection device one arbitrary backup plate 2 is sent from a plurality of types of backup plates (adapter plates) 2 from a loader 15, and the backup plate is provided downstream via a transfer path provided with a transfer rail 5.
  • the backup plate 2 is supplied to the plate main body 1 that is conveyed to the side and is arranged on the transfer path, and the supplied backup plate 2 is recovered from the plate main body 1 and supplied to the unloader 16.
  • the backup plate supply / recovery device includes one magazine mechanism (upstream magazine mechanism 3) capable of delivering any one backup plate 2 from a plurality of types of backup plates 2, and a plurality of magazine mechanisms.
  • the other magazine mechanism (downstream magazine mechanism 4) capable of accommodating one arbitrary backup plate from among the backup plates 2 of a kind, and the backup plate 2 sent from the upstream magazine mechanism 3 to the transport rail 5.
  • One transport mechanism (upstream transport mechanism 6) that transports the plate body 1 along with another transport mechanism (downstream transport mechanism 7) that transports the plate body 1 to the downstream magazine mechanism 4 and the plate body 1
  • an elevating mechanism 8 for elevating.
  • the plate body 1 is reciprocated along the transport rail 5 in the horizontal direction by the reciprocation mechanism 9 in addition to the elevation by the elevation mechanism 8.
  • the plate body 1 and the backup plate 2 constitute a shuttle 10, and the shuttle 10 is moved up and down by a drive means 11 including an elevating mechanism 8 and a reciprocating mechanism 9, or is reciprocating along a horizontal direction.
  • the backup plate supply / recovery device shown in FIG. 1 includes a pair of magazine mechanisms 3 and 4 and a pair of transport mechanisms 6 and 7.
  • the lifting mechanism 8 and the reciprocating mechanism 9 for example, a known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used.
  • the plate body 1 is formed of a rectangular flat plate body, and a convex portion 1 a is provided on the upper surface thereof.
  • the backup plate 2 is provided with notches 2a and 2a on the long side of the lower surface, is formed of a flat rectangular body, and is provided with a recess 2b into which the protrusion 1a is fitted.
  • the convex portion 1a and the concave portion 2b fitted into the convex portion 1a can constitute a concave-convex fitting structure M in which the plate body 1 and the backup plate 2 are integrated.
  • the shuttle 10 composed of the plate body 1 and the backup plate 2 is provided with a heating mechanism 12 and a suction mechanism 13.
  • the heating mechanism 12 can be composed of, for example, a heating wire built in the plate body 1 and a power source for heating the heating wire, but the heating mechanism 12 is not limited to this, and may use steam. Alternatively, induction heating may be used. That is, it is only necessary that the substrate 22 needs to be heated and that the heating method does not adversely affect the substrate 22 and the chips.
  • the suction mechanism 13 is composed of, for example, a suction passage arranged in the shuttle 10 (the plate body 1 and the backup plate 2) and a vacuum generator connected to the suction passage. A suction port that opens on the upper surface of 2 is formed.
  • a vacuum pump may be used, or an ejector type that controls opening / closing of high-pressure air and discharges it from a nozzle to a diffuser to generate a negative pressure in the diffusion chamber may be used.
  • the upstream magazine mechanism 3 includes a loader 15 (see FIG. 3) in which a plurality of backup plates 2 are arranged in the vertical direction, an elevator mechanism (not shown) that raises and lowers the loader 15, and a predetermined height position. And a pusher mechanism (not shown) provided. Therefore, the loader 15 is moved up and down, and one of the plurality of backup plates 2 housed in the loader 15 corresponds to the pusher mechanism. Then, in this state, the height-aligned backup plate 2 is pushed out to the transport rail 5 side by the pusher mechanism.
  • the downstream magazine mechanism 4 includes an unloader 16 (see FIG. 3) in which a plurality of backup plates 2 are arranged in the vertical direction, an elevating mechanism (not shown) for elevating the unloader 16, and a predetermined height. And a pusher mechanism (not shown) disposed at a position.
  • the unloader 16 is moved up and down so that the storage portion at a predetermined height position corresponds to the pusher mechanism for the backup plate transported through the transport rail 5. Then, in this state, the backup plate 2 is pushed into the storage unit whose height is aligned.
  • FIG. 1 As shown in FIG. 2, FIG. 4A, FIG. 4B and FIG. 5A to FIG. And a guide rail expansion / contraction mechanism 17 (see FIG. 1).
  • Each of the guide rails 5a and 5a is made of a strip-shaped body, and receiving pieces 5a1 and 5a1 are projectingly provided at the central portions in the vertical direction of the facing surfaces.
  • the guide rail expansion / contraction mechanism 17 may be a known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, or a linear guide mechanism.
  • the pair of guide rails 5a, 5a approach each other to hold the backup plate 2, and as shown in FIG.
  • the guide rails 5a, 5a are separated from each other, and the backup plate 2 between the guide rails 5a, 5a is displaced so as to be able to descend.
  • each of the upstream side transport mechanism 6 and the downstream side transport mechanism 7 has a chuck portion that chucks the backup plate 2 and a reciprocating mechanism that reciprocates the chuck portion along the transport rail 5.
  • the chuck portion can be constituted by, for example, an openable / closable chuck claw and the like, and as the reciprocating mechanism, a well-known / official reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear guide mechanism or the like can be used.
  • this apparatus is provided with a posture detection mechanism 18 that detects the mounting posture of the backup plate 2 on the plate body 1, and an identification mechanism 19 that identifies the information of the backup plate 2.
  • the information of the backup plate 2 is information for matching the information of the substrate to be sucked by the backup plate.
  • the board information includes board size, board design pattern, and the like.
  • the attitude detection mechanism 18 includes an image recognition camera (not shown), and detects a difference between the position coordinates of the plate body 1 whose position coordinates are calculated in advance and the position coordinates of the backup plate 2 calculated using the image recognition camera. It is a thing. Therefore, by correcting this difference, the device can be mounted accurately. That is, this image recognition camera can detect (calculate) the position coordinates of the plate body 1 and detect (calculate) the position coordinates of the backup plate 2. Therefore, the difference between these positions is calculated by the calculation unit of the control means 20 (see FIG. 1), and thereby the position correction (position correction) of the plate body 1 and / or the backup plate 2 is performed, and the plate body is corrected. 1 and the backup plate 2 can be aligned.
  • this image recognition camera can detect (calculate) the position coordinates of the plate body 1 and detect (calculate) the position coordinates of the backup plate 2. Therefore, the difference between these positions is calculated by the calculation unit of the control means 20 (see FIG. 1), and thereby the position correction (position correction) of
  • the identification mechanism 19 reads the identified portion provided on the backup plate 2.
  • the identified portion can be composed of printed characters, symbols, figures, barcodes, QR codes (registered trademark), or the like.
  • the reading means characters, symbols, figures, etc. can be read by image processing and the like, and a bar code can be read by a bar code reader and a QR code can be read by a QR code reader.
  • control means 20 Similar to the above-mentioned bonding apparatus, for example, a microcomputer in which a CPU (Central Processing Unit) is central to a ROM (Read Only Memory), a RAM (Random Access Memory), etc., is interconnected via a bus. is there.
  • the ROM stores programs executed by the CPU and data.
  • the supply target member S (the substrate 22) transported via the transport rail 5 is transferred to the transport rail 5 as shown in FIG. 5C. 5 and is attracted to the shuttle 10 as shown in FIG. 5D, and the member S to be supplied is attracted to the feed position of the transport rail 5, and as shown in FIG.
  • the work W is mounted on the supply target portion Sa of S.
  • the work W is a chip 21 that is cut out from a wafer (work assembly) 26, and the chip 21 of this wafer 26 has a plurality of grades.
  • one wafer 26 has many first grades and few second grades and third grades.
  • the second grade may be larger than the third grade
  • the third grade may be larger than the second grade
  • the second grade and the third grade may be the same number.
  • the supply target member S is a substrate 22 such as a lead frame, and the supply target portion Sa is an island portion 22a on the substrate 22, and the chip 21 is bonded to each island portion 22a.
  • a bonding device die bonder as shown in FIG. 7 is used.
  • a chip (semiconductor chip) 21 cut out from a wafer 26 is picked up by a collet (suction collet) 23 at a pickup position P and transferred (mounted) to a bonding position Q of a substrate 22 such as a lead frame.
  • the wafer 26 is adhered onto a wafer sheet (adhesive sheet 25) stretched on a metal ring (wafer ring) and divided (divided) into a large number of chips 21 by a dicing process.
  • the collet 23 is raised in the arrow A direction and lowered in the arrow B direction on the pickup position P, raised in the arrow C direction and lowered in the arrow D direction on the bonding position Q, and picked up. Reciprocation between the position P and the bonding position Q in the directions of arrows E and F is possible.
  • the collet 23 is attached to a bonding head (not shown), and this bonding head is attached to a bonding arm (not shown). Therefore, the bonding arm is controlled by a control means (not shown) so that the collet 23 is controlled to move the arrows A, B, C, D, E and F.
  • the control means is, for example, a microcomputer in which a central processing unit (CPU), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus.
  • the ROM stores programs executed by the CPU and data.
  • the chip 21 has the first grade, the second grade, and the third grade in this embodiment. Further, chips 21 of the same grade are mounted on one substrate 22. Therefore, the board 22 includes the board 22 (22A) on which the first grade chip 21 is mounted, the board 22 (22B) on which the second grade chip 21 is mounted, and the third grade. There is a substrate 22 (22C) on which the chip 21 of FIG.
  • the backup plate 2 includes a first backup plate 2A corresponding to the substrate 22A, a second backup plate 2B corresponding to the substrate 22B, and a third backup plate 2A corresponding to the substrate 22C.
  • the loader 15 includes a first loader 15A that stores the backup plate 2A, a second loader 15B that stores the backup plate 2B, and a third loader 15C that stores the backup plate 2C.
  • the unloader 16 includes a first unloader 16A in which the backup plate 2A is stored, a second unloader 16B in which the backup plate 2B is stored, and a third unloader 16C in which the backup plate 2C is stored. ..
  • the operation of the backup plate supply / collection device configured as described above will be described.
  • the substrate 22 (22A) on which the chip 21 of the first grade is mounted is used. Therefore, as the backup plate 2 of the shuttle 10, the backup plate 2A corresponding to this substrate 22A is used.
  • the backup plate 2A is delivered from the loader 15, guided by the transport rail 5 (received by the receiving pieces 5a1 and 5a1), and the upstream side transport mechanism 6 is used to move the plate body 1 as shown in FIG. 4A.
  • the receiving pieces 5a1 and 5a1 of the transport rail 5 are fitted into the notches 2a and 2a of the backup plate 2 (2A) and are supported by the transport rail 5.
  • the plate body 1 descends and is positioned below the receiving pieces 5a1 and 5a1 of the transport rail 5.
  • the image recognition camera corrects the difference between the position coordinates of the shuttle 10 and the position coordinates of the backup plate 2.
  • the convex portion 1a of the plate body 1 is fitted into the concave portion 2b of the backup plate 2, and the plate body 1 and the backup plate 2 are separated from each other as shown in FIG. 4B.
  • the backup plate 2 is chucked by the chuck portion of the upstream side transport mechanism 6, the rise of the backup plate 2 due to the rise of the plate body 1 is restricted, and the convex portion 1a of the plate body 1 is moved to the backup plate 2. It can be fitted into the recess 2b.
  • the substrate 22 (22A) is guided by the transport rail 5 (received by the receiving pieces 5a1 and 5a1), and the upstream transport mechanism 6 is provided. As shown in FIG. 5A, the substrate 22A is positioned above the shuttle 10 composed of the plate body 1 and the backup plate 2.
  • the guide rails 5a, 5a of the transport rail 5 are relatively separated from each other. That is, the guide rails 5a, 5a are expanded to make the gap between the receiving pieces 5a1, 5a1 larger than the width dimension of the backup plate 2.
  • W1 the distance between the receiving pieces 5a1 and 5a1
  • W1> W the width dimension of the backup plate 2
  • the shuttle 10 is lowered. In this case, the guide rails 5a and 5s are positioned lower than the receiving pieces 5a1 and 5a1.
  • the board 22 (22A) is delivered from a loader (a loader different from the loader 15 housing the backup plate 2 and housing the board 22), and the board 22A is guided to the transport rail 5. Then, it is transported onto the shuttle 10 by using the upstream transport mechanism 6 as shown in FIG. 5C.
  • the backup plate 2 of the shuttle 10 has a shape corresponding to the substrate 22A, that is, the first plate 2A is attached to the plate body 1.
  • the distance between the receiving pieces 5a1 and 5a1 is smaller than the width dimension of the board 22 (22A), and the dimension between the facing surfaces of the guide rails 5a and 5a with respect to the receiving pieces 5a1 and 5a1 is the width of the board 22 (22A). It is larger than the size.
  • the width dimension of the substrate 22 is W3, and the dimension between the facing surfaces is W2, W1 ⁇ W3 ⁇ W2.
  • the substrate 22 can be received by the receiving pieces 5a1 and 5a1.
  • the shuttle 10 rises to adsorb the substrate 22 to the upper surface of the shuttle 10. At this time, it is preferable to press the substrate 22 with a clamper (not shown) or the like.
  • the substrate 22 sucked and held by the shuttle 10 is heated, and the chip 21 as the work W is bonded to the island portion 22a of the substrate 22.
  • the bonding step after the bonding to the island portion 22a (see FIG. 7) in a row in the direction orthogonal to the transport direction (longitudinal direction) is completed, the shuttle 10 receiving the bonded substrate 22 is moved to the downstream side. A predetermined amount is moved via the reciprocating mechanism 9 to enable bonding to the next row of island portions 22a.
  • the substrate 22 is supported by the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a as shown in FIG. Then, it is transported to the unloader on the downstream side (an unloader different from the unloader 16 in which the backup plate 2 is stored, in which the substrate 22 is stored), and the substrate 22 is stored in this unloader.
  • the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a are connected to the cutout portion 2a of the backup plate 2.
  • the plate body 1 is moved down while being fitted in 2a.
  • the backup plate 2 received by the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a only the plate body 1 is lowered and the plate body 1 and the backup plate 2 are separated.
  • the backup plate 2 is transported to the unloader 16 side via the downstream transport mechanism 7, and the backup plate 2 is stored in the unloader 16.
  • another backup plate 2 for example, the backup plate 2B is sent from the loader 15B, and the upstream transport mechanism 6 is used to arrange the backup plate 2B above the plate body 1 as shown in FIG. 4A. After that, the plate body 1 and the backup plate 2B are integrated by lowering the plate body 1.
  • the shuttle 10 for the board 22B can be configured, and the board 22B is delivered from the loader (a loader different from the loader 15 in which the backup plate 2 is housed and the board 22 is housed).
  • the chip 21 can be mounted on the substrate 22B.
  • the substrate 22B is unloaded on the downstream side (an unloader different from the unloader 16 in which the backup plate 2 is accommodated, and the substrate 22 is accommodated). Can be supplied to.
  • the backup plate 2 (2C) can be exchanged, the substrate 22C can be sucked and held by the backup plate 2C, and the substrate 22C The chip 21 can be mounted.
  • an arbitrary one backup plate 2 can be sent from the plurality of types of backup plates 2 from the upstream magazine mechanism 4, and this backup plate 2 is transported upstream. It can be transported to the plate body 1 by the mechanism 6. This transportation is carried to the plate body 1 while being supported by the transportation rail 5. Then, the plate body 1 is elevated via the elevating mechanism 8 so that the plate body 1 and the backup plate 2 are integrated. Further, when the plate body 1 and the backup plate 2 are integrated, the plate body 1 is lowered via the elevating mechanism 8 to separate the plate body 1 and the backup plate 2. The backup plate 2 separated in this way is transported to the downstream magazine mechanism 4 by the downstream transport mechanism 7. In this case, the backup plate 2 is transported while being supported by the transport rail 5.
  • the supply / collection (replacement) of the backup plate 2 can be performed automatically instead of manually. Even when the backup plate 2 is heated and used, the backup plate 2 can be replaced without waiting for so-called cooling, resulting in excellent productivity.
  • Each of the guide rails 5a, 5a has a plate supporting portion (receiving pieces 5a1, 5a1) for receiving the backup plate 2. With this configuration, the backup plate 2 can be stably transported when the upstream transport mechanism 6 and the downstream transport mechanism 7 transport the backup plate 2.
  • the pair of guide rails 5a and 5a can be expanded / contracted with respect to the guide rail interval, so that the backup plate 2 can be stably supported (received) according to the size of the back plate 2. Further, since the backup plate 2 has the information for identifying the product type, it is possible to identify the backup plate 2 to be supplied and prevent misuse (erroneous mounting). A device provided with an identification mechanism for identifying the information of the backup plate 2 improves the reliability of preventing misuse (misinstallation).
  • the backup plate 2 With the posture detection mechanism 18 that detects the mounting posture of the backup plate 2 on the plate body 1, the backup plate 2 can be mounted on the plate body 1 in a stable posture (regular posture).
  • the backup plate 2 and the plate body 1 are integrated by the concave-convex fitting structure M
  • the backup plate 2 and the plate body 1 can be integrated with a simple structure.
  • the concavo-convex fitting structure M means that a member on one side is provided with a convex portion and a member on the other side is provided with a concave portion into which the convex portion fits, and when they are overlapped, the convex portion fits into the concave portion. Then, these two members are integrated.
  • the backup plate supply / collection device since the backup plate supply / collection device according to the present invention is used, the backup plate 2 suitable for the substrate size and the substrate design pattern can be used, and the substrate 22 is supported by the backup plate 2. can do. Therefore, the chip 21 of the substrate 22 can be stably bonded.
  • the base can be supported by the backup plate that matches the board size and the board design pattern. Therefore, the chips on the substrate can be stably bonded.
  • the transfer mechanisms 6 and 7 for transferring the backup plate 2 can also serve as a transfer mechanism for transferring the substrate 22. That is, the transfer mechanisms 6 and 7 can be shared by the backup plate 2 and the substrate 22. By sharing in this way, the overall size of the device can be reduced.
  • the backup plate 2 is moved to the plate body 1 via the upstream side transport mechanism 6 having a chuck portion that chucks the backup plate 2 and a reciprocating mechanism that reciprocates the chuck portion along the transport rail 5.
  • the backup plate 2 may be conveyed to a position above the plate body 1 via another conveying means such as a crane. With this configuration, it is not necessary to use the transport rail 5, and the device can be made compact.
  • the backup plate 2 is carried by the upstream carrying mechanism 6, but the plate body 1 may be carried by the upstream carrying mechanism 6, and the backup plate 2 and the plate body may be carried. Any of the above items 1 and 2 may be one that can be carried by the upstream carrying mechanism 6. That is, at least one of the backup plate 2 and the plate body 1 is transported, and the backup plate 2 is arranged on the plate body 1 by the relative movement of the backup plate 2 and the plate body 1. Good.
  • a pair of magazine mechanisms 3 and 4 and a pair of transport mechanisms 6 and 7 are provided, and the backup plate 2 of the magazine mechanism 3 is transported by the transport mechanism 6 to the plate body 1 side.
  • the backup plate 2 separated from the plate body 1 is transported to the magazine mechanism 4 via the transport mechanism 7.
  • the backup plate 2 of the magazine mechanism 4 is transported to the plate body 1 side by the transport mechanism 7, and the backup plate 2 separated from the plate body 1 is transported to the magazine mechanism 3 via the transport mechanism 6. It may be one that does.
  • the backup plate 2 separated from the plate body 1 may be collected in the magazine mechanism 3 or the magazine mechanism 4 via the transport mechanism 6 or the transport mechanism 7. That is, the backup plate of the one magazine mechanism is supplied to the plate body via the one transport mechanism, and the backup plate separated from the plate body is transported to the one magazine via the one transport mechanism or another transport mechanism. It may be collected in a mechanism or other magazine mechanism. With such a configuration, the backup plate to be collected can be collected in the magazine mechanism that has supplied or another magazine mechanism, and the workability can be improved.
  • any magazine mechanism 3 (4) is provided, and the backup plate 2 of this magazine mechanism 3 (4) is collected in this magazine mechanism 3 (4) by any transport mechanism 6 (7). It may be. That is, the backup plate of the magazine mechanism is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is fed to the one magazine mechanism via the one transport mechanism or another transport mechanism. Can be configured to be recovered. With this configuration, only one magazine mechanism that can supply to the plate body and collect from the plate body is sufficient, and the entire apparatus can be made compact.
  • various types of backup plates can be supplied to the plate body from three or more magazine mechanisms, and the backup plates can be collected by any of the magazine mechanisms, resulting in a device with excellent convenience. ..
  • the present invention is not limited to the above-described embodiment, and various modifications can be made.
  • the substrate 22 for bonding the chip 21 cut out from the wafer 26 was used as the supply target member S.
  • a card such as a credit card, a cash card, an IC card, or a flat plate such as a sheet metal may be used. Therefore, the work W to be supplied to the supply target member S is not limited to the chip 21, but a component corresponding to the supply target member S. If the member S to be supplied is not the substrate 22 and does not require heating, the heating mechanism 12 of the shuttle 10 can be omitted.
  • the number of shuttles 10 is one in the above embodiment, but there may be two or more.
  • the types of the backup plate 2 are not limited to three types, and may be one type, two types, or three or more types.
  • a display means for example, an alarm sound is generated to indicate that
  • the backup plate 2 and the plate body 1 are not aligned (when an error occurs). It is also possible to provide such) on a monitor or the like.
  • the recess 1b of the concavo-convex fitting structure M is formed of a through hole, but it may be formed of a stop hole having a bottom surface instead of the through hole. Further, the number of the convex portions 1a and the concave portions 2b of the concave-convex fitting structure M is not limited to one each.
  • the pusher mechanism is provided as the magazine mechanisms 3 and 4 in the above-described embodiment, the magazine mechanism 3 or 4 may not have such a pusher mechanism. When the pusher mechanism is not provided, the backup plate in the magazine mechanism 3 (4) can be pulled out by the transporting means 6, 7 or other pulling mechanism.
  • It can be used for sending out any one backup plate from multiple types of backup plates in the loader, supplying the backup plate to the plate body, and collecting the supplied backup plate from the plate body. it can.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

La présente invention transporte une plaque d'appui dans un état supporté par un rail de transport à un corps de plaque principal par l'intermédiaire d'un mécanisme de transport, intègre le corps de plaque principale et la plaque de support l'une avec l'autre par élévation du corps de plaque principal à l'aide d'un mécanisme d'élévation/abaissement, amène la plaque d'appui à être supportée par le rail de transport lorsque le corps de plaque principale est abaissé à l'aide du mécanisme d'élévation/abaissement, ce qui entraîne la séparation du corps de plaque principale et de la plaque d'appui, et transporte la plaque d'appui séparée tout en étant supportée par le rail de transport vers un mécanisme de magasin par l'intermédiaire du mécanisme de transport.
PCT/JP2019/043929 2018-11-13 2019-11-08 Dispositif d'alimentation/récupération de plaque d'appui, microsoudeuse de puces et procédé de soudage WO2020100750A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019562022A JP6636681B1 (ja) 2018-11-13 2019-11-08 バックアッププレート供給・回収装置、ダイボンダ、及びボンディング方法
CN201980004821.3A CN111436220B (zh) 2018-11-13 2019-11-08 支承板供给回收装置、芯片接合机及接合方法
SG11202005714VA SG11202005714VA (en) 2018-11-13 2019-11-08 Backup plate feed and recovery apparatus, die bonder, and bonding method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-213188 2018-11-13
JP2018213188 2018-11-13

Publications (2)

Publication Number Publication Date
WO2020100750A1 true WO2020100750A1 (fr) 2020-05-22
WO2020100750A8 WO2020100750A8 (fr) 2020-07-23

Family

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Application Number Title Priority Date Filing Date
PCT/JP2019/043929 WO2020100750A1 (fr) 2018-11-13 2019-11-08 Dispositif d'alimentation/récupération de plaque d'appui, microsoudeuse de puces et procédé de soudage

Country Status (3)

Country Link
CN (1) CN111436220B (fr)
SG (1) SG11202005714VA (fr)
WO (1) WO2020100750A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10308404A (ja) * 1997-05-06 1998-11-17 Matsushita Electric Ind Co Ltd チップのボンディング装置
JPH1197460A (ja) * 1997-09-18 1999-04-09 Nichiden Mach Ltd ダイボンダ
JP2000150545A (ja) * 1998-11-05 2000-05-30 Matsushita Electric Ind Co Ltd ダイボンディング装置
JP2008218554A (ja) * 2007-03-01 2008-09-18 Canon Machinery Inc バックアッププレート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10308404A (ja) * 1997-05-06 1998-11-17 Matsushita Electric Ind Co Ltd チップのボンディング装置
JPH1197460A (ja) * 1997-09-18 1999-04-09 Nichiden Mach Ltd ダイボンダ
JP2000150545A (ja) * 1998-11-05 2000-05-30 Matsushita Electric Ind Co Ltd ダイボンディング装置
JP2008218554A (ja) * 2007-03-01 2008-09-18 Canon Machinery Inc バックアッププレート

Also Published As

Publication number Publication date
CN111436220B (zh) 2024-03-08
SG11202005714VA (en) 2020-07-29
CN111436220A (zh) 2020-07-21
WO2020100750A8 (fr) 2020-07-23

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