JP7076518B2 - Transport equipment, transport method, die bonder, and bonding method - Google Patents

Description

The present invention relates to a transfer device, a transfer method, a die bonder, and a bonding method.

In the manufacture of semiconductor devices, a chip bonding method in which a wafer in which a large number of elements are built together is diced and separated into individual semiconductor chips, and these are bonded one by one to a predetermined position such as a lead frame. Has been adopted. A die bonder (bonding device) is used for this chip bonding.

As shown in FIG. 29, the bonding apparatus includes a bonding arm (not shown) having a collet 3 for adsorbing the semiconductor chip 1 of the supply unit 2 and a confirmation camera (not shown) for observing the semiconductor chip 1 of the supply unit 2. And a confirmation camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

The supply unit 2 includes a semiconductor wafer 6 (see FIG. 30), and the semiconductor wafer 6 is divided into a large number of semiconductor chips 1. That is, the wafer 6 is attached to an adhesive sheet (dicing sheet), and the dicing sheet is held in an annular frame. Then, the wafer 6 on the dicing sheet is individualized using a circular blade (dicing saw) or the like to form the chip 1. Further, the bonding arm holding the collet 3 can be moved between the pickup position and the bonding position via the transport mechanism.

Further, in the collet 3, the chip 1 is vacuum-sucked through a suction hole opened in the lower end surface of the collet 3, and the chip 1 is adsorbed on the lower end surface of the collet 3. If this vacuum suction (evacuation) is released, the chip 1 will be removed from the collet 3.

Next, a die bonding method using this die bonder will be described. First, the chip 1 to be picked up is observed with a confirmation camera arranged above the supply unit 2, the collet 3 is positioned above the chip 1 to be picked up, and then the collet 3 is indicated by an arrow B. Is lowered to pick up this chip 1. After that, the collet 3 is raised as shown by the arrow A.

Next, the island portion 5 of the lead frame 4 to be bonded is observed with a confirmation camera arranged above the bonding position, and the collet 3 is moved in the direction of arrow E to be above the island portion 5. After the position, the collet 3 is moved downward as shown by the arrow D to supply the chip 1 to the island portion 5. After supplying the chip to the island portion 5, the collet 3 is raised as shown by the arrow C and then returned to the standby position above the pickup position as shown by the arrow F.

The collet 3 is a moving mechanism (not shown) as a transport mechanism, and has an ascending arrow A direction and a descending arrow B direction on the pickup position P, and an ascending arrow C direction and an arrow D on the bonding position Q. It is possible to descend in the direction and reciprocate in the directions of arrows E and F between the pickup position P and the bonding position Q. The movement mechanism controls the movement of the arrows A, B, C, D, E, and F by a control means (not shown). The moving mechanism can be configured by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a motor linear mechanism, and an XYZ axis stage (stage device) can be used.

By the way, the die (chip) on the wafer to be picked up has a plurality of grades depending on the electrical characteristics. When mounting a die having such a plurality of grades on a substrate, a die bonder is used for each grade. For this reason, the working time is long and the productivity is inferior.

Therefore, conventionally, a classification map of a classification die in which dies having different electrical characteristics of a wafer are classified according to a plurality of grades is created, the die is picked up from the wafer, and the die is bonded onto a substrate or a die with a bonding head. A die bonder having a single transport lane and a single bonding head by transporting a classification substrate corresponding to the classification die by a transport lane in units of the classification substrate has been proposed (Patent Document 1).

That is, two transfer units having a function of transporting a plurality of substrates are installed in the apparatus, and the substrates are transported onto a heating stage equipped at a fixed position on each transport method unit, and the first is transferred from the wafer. The grade (highest grade) chip is picked up and bonded to the substrate supplied onto one transport unit (first lane) with a dedicated bonding head. Chips other than the first grade on the same wafer are bonded to multiple substrates supplied on the other transfer unit (second lane) while exchanging the substrates for each grade using the same dedicated bonding head. ..

Japanese Patent No. 6124969

In Patent Document 1, it is necessary to equip two bonding elements (head, arm, recognition mechanism, transfer mechanism). Therefore, the cost becomes high, and it is necessary to adjust and unify the two bonding elements, which may deteriorate the accuracy. In addition, the production is low with respect to the cost. Further, when only chips of the same grade are used on the wafer, a loss occurs in the substrate transfer of chips of other grades.

In view of the above problems, the present invention can simplify the entire apparatus, avoid complicated adjustment, and utilize information on the remaining number of chips for each grade on the wafer and the remaining number of bonding on the substrate. Provided are a transfer device, a transfer method, a die bonder, and a bonding method capable of performing a bonding operation and having excellent productivity.

The transport device of the present invention transports each of the supplied members to a supply position between the loader and the unloader in order to supply a plurality of types of workpieces of different grades to the supplied portion of the supplied member for each grade. , A transport device that carries out the supplied member for which work mounting has been completed to the unloader, and has a shuttle arranged at the supply position, an upstream transfer mechanism that transports the supplied member from the loader side to the shuttle at the supply position, and transport . A standby mechanism located on the line between the supply position and the unloader, transports the supplied member from the shuttle in the supply position to the standby mechanism, and returns the supplied member from the standby mechanism to the shuttle in the supply position. It is equipped with a downstream transfer mechanism capable of enabling the work to be carried out, and a carry-out mechanism for carrying out the supplied member whose work has been mounted from the standby mechanism to the unloader, and supplies the supplied member whose chip has not been mounted to the standby mechanism. Then, when only the supplied member for which the chip has been mounted is carried out to the unloader and the supplied member for which the chip has not been mounted is supplied to the standby mechanism, the work to the other supplied member is supplied at the supply position. It is possible to install it.

According to the transport device of the present invention, the supplied member can be transported from the loader side to the shuttle at the supply position. Therefore, the work can be supplied to the supplied portion of the supplied member. Then, the supplied member for which the work has been mounted can be carried out to the unloader via the standby mechanism.

If there is no work of the grade to be supplied from the work supply source before the work is mounted on the supplied member, the supplied member is transported from the shuttle to the standby mechanism and moved to the empty supply position. It is possible to transport the supplied member for the grade of. Therefore, other grades of workpieces can be supplied to the supplied member. Then, the supplied member for which the work has been mounted can be carried out to the unloader via the standby mechanism.

Then, when all the works of the work supply source are exhausted, new work is supplied to the work supply source. Therefore, the supplied member whose work has not been mounted, which has been waiting in the standby mechanism, can be returned to the shuttle in the supply position again. The work can be supplied to the remaining supplied portion of the supplied member that has returned to the supply position in this way.

By arranging the standby mechanism on the loader side, the stage can be arranged on this standby position, and further, the shuttle retract position can be provided at a position below the preheating stage.

Therefore, in the present invention, it is possible to utilize the remaining number of works for each grade in the work supply source (work aggregate) and the remaining number of supplied parts of the supplied member. It can be used regardless of whether the work grade is one type or multiple types. In addition, the transport mechanism can be a simple lane, and there are multiple shuttles.

It is preferable to have a shuttle reciprocating mechanism for reciprocating the shuttle in the transport direction between the loader and the unloader in the supply position. With this configuration, it is possible to receive the supplied member from the loader with the shuttle arranged on the upstream side in the supply position. Therefore, when the work is supplied to the supplied portion of the supplied member, for example, the work is supplied along the direction orthogonal to the transport direction of the supplied member, and the work is supplied to a plurality of supplied portions arranged in a row. After the work supply is completed, the shuttle can be moved downstream by a predetermined pitch to supply the work to a plurality of supplied parts in the next row. By performing this operation, the work can be supplied to all the supplied parts of the supplied member. Moreover, when the supply of the work is completed, the shuttle will be located on the downstream side and can be quickly carried out to the unloader side.

The standby mechanism can be composed of a storage shelf for vertically storing a plurality of supplied members and an elevating mechanism for raising and lowering the storage shelf. With this configuration, a plurality of supplied members can be compactly stored in the storage shelf, and the supplied member can be raised by the elevating mechanism, so that the supplied member can be carried out from the storage shelf. It is possible to position it at a high height.

The upstream transfer mechanism is a pair of chuck members that chuck the supplied member, a vertical motion mechanism that moves the pair of chuck members up and down, and a pair of chuck members in the transport direction between the loader and the unloader. Those provided with a reciprocating mechanism for performing are preferable. With this configuration, when the supplied member is to be conveyed to the supply position, even if another supplied member is arranged in the supply position on the upstream side of the supplied member, the supplied member is to be conveyed. The supplied member can be transported beyond this other supplied member to the supply position.

It may have a delivery mechanism for sending out the supplied member from the loader, and may be provided with a stage for receiving the supplied member sent from the loader. By providing such a device, the supplied member can be stably delivered from the loader. Further, the supplied member is transported to the supply stage by the upstream transfer mechanism. In this case, since the supplied member is received on the stage, the supplied member has a stable posture and position. Can be maintained, facilitating chucking on this stage by the upstream transfer mechanism.

The shuttle preferably has a suction mechanism that sucks the supplied member on the entire surface. Here, by adsorbing the entire surface, even if the supplied member is thin, it can be held flat without being deformed, and the work of supplying the work to the supplied member is stable.

The shuttle may have a heating mechanism that heats the supplied member. With such a heating mechanism, the supplied member can be heated, and when the work adheres to the supplied member via an adhesive, it can be bonded quickly and stably.

A preheating stage for applying preheating to the supplied member may be provided on the loader side of the supply position. By providing the preheating stage in this way, the supplied member can be quickly heated to a predetermined temperature when the work is supplied, and the working time can be shortened.

The die bonder of the present invention is a substrate in which the work is a chip of a wafer and the supplied member is an island portion which is a supplied portion thereof, and has been conveyed to a bonding position which is a supply position by using the transfer device. Chips are sequentially bonded to the island portion of the substrate.

In the die bonder of the present invention, the substrate is conveyed to the bonding position by using the transfer device. In this case, even if the chip as a work has a plurality of grades, the chips of each grade can be sequentially bonded to the substrate to which the chip of that grade is to be bonded.

In the transport method of the present invention, in order to supply a plurality of types of workpieces having different grades to the supplied portion of the supplied member for each grade, each supplied member is transported to a supply position between the loader and the unloader. This is a transfer method in which the supplied member for which the work has been mounted is carried out to the unloader. The supplied member is conveyed from the loader to the supply position, and the supplied member for which the work has been mounted is carried out to the unloader and sent to the supplied member. If there is no work of the grade to be supplied from the work supply source before the mounting of the work is completed, this supplied member is transferred from the shuttle to the standby position provided between the supply position and the unloader on the transfer line. However, other supplied members are transported from the loader upstream of the supply position to the empty supply position.

According to the transport method of the present invention, the work of the grade to be supplied to the supplied member can be supplied to the supplied member, and after all the workpieces have been mounted on the supplied member, the supplied member that has been mounted is used. It can be carried out to the unloader on the downstream side. If there is no work of the grade to be supplied from the work supply source before the work is mounted on the supplied member, the supplied member is transported from the shuttle to the standby position and moved to the empty supply position. Since the supplied member is conveyed, the work can be supplied to the supplied member.

With the work of the grade to be supplied to the work supply source, the work to be supplied that had been waiting in the standby position is returned to the supply position, and the work of the grade to be supplied to the supplied part of the returned member to be supplied. Is preferable to supply.

In the bonding method of the present invention, the work is a chip of a wafer, the supplied member is a substrate serving as an island portion which is a supplied portion thereof, and the work is conveyed to a bonding position which is a supply position by using the conveying method. Chips are sequentially bonded to the island portion of the substrate.

According to the bonding method of the present invention, the substrate is transported to the bonding position by using the transport method. In this case, even if the chip as a work has a plurality of grades, the chips of each grade can be sequentially bonded to the substrate to which the chip of that grade is to be bonded.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to utilize information on the remaining number of works for each grade in the work supply source (work aggregate) and the remaining number of supplied parts of the supplied member, and it is possible to reduce the transfer loss. It is possible to handle either one type of work or multiple types of work, and it is possible to improve production efficiency. In addition, the transport path can be set relatively short, and the device can be made compact.

If the standby mechanism is arranged on the loader side, the stage can be arranged on this standby position, and further, the shuttle 30 can be provided with a retract position below the preheating stage. Therefore, the distance between the loader and the unloader can be made smaller in the device in which the standby mechanism is arranged on the loader side than in the device in which the standby mechanism 32 is arranged on the unloader side, and the device as a whole can be made compact.

It is a simplified block diagram of the transport device of this invention. It is a simplified perspective view of the transport device of the present invention in a state of being transported on a shuttle of a substrate (supplied member) for the first grade. The main part of the upstream side transport mechanism or the downstream side transport mechanism is shown, (a) is a perspective view in a state where the supplied member is conveyed, and (b) is a perspective view in a state where the supplied member is placed on the shuttle. It is a figure. It is a simplified front view of the chuck member of the upstream side transport mechanism or the downstream side transport mechanism. It is a simplified front view of the other chuck member of the upstream side transport mechanism. It is a simplified front view of the other chuck member of the downstream side transport mechanism. It is a block diagram which shows the structure of the upstream side chuck device. It is a block diagram which shows the control part of the upstream side chuck device and the downstream side chuck device. The transfer method of this invention is shown, and it is the mounting process diagram of the 1st grade work to the 2nd grade work. The transport method of this invention is shown, and it is 3rd grade work mounting process diagram. It is a simplified perspective view of the transport device of this invention, in a state where a substrate (supplied member) is transported on a preheating stage for the first grade. It is a simplified perspective view of the transport device of the present invention in a state where a substrate (supplied member) for the first grade is transported on a stage. It is a simplified perspective view of the transport device of this invention, the state which transports the substrate (supplied member) for 1st grade to a shuttle. It is a simplified perspective view of the transport device of this invention, the state which transports the substrate (supplied member) for the 2nd grade to a standby mechanism. It is a simplified block diagram of the other transfer apparatus of this invention. It is a perspective view of the transfer device shown in FIG. It is a block diagram of the upstream side transport mechanism. It is a block diagram of the drive mechanism of the chuck device of the upstream side transfer mechanism. The chuck device of the upstream transfer mechanism is shown. FIG. It is a figure, (c) is a simplified cross-sectional view of a state in which a substrate is chucked. The chuck device of the upstream transfer mechanism is shown. FIG. (C) is a simplified cross-sectional view of a state in which the substrate is chucked. It is a block diagram of a carry-out mechanism. It is a block diagram of the drive mechanism of a receiving member. It is a simplified perspective view which shows the method of carrying out a substrate to an unloader using a carrying-out mechanism. It is a perspective view of the main part of the transport device provided with the switching mechanism between the unloader and the standby mechanism. It is a block diagram of the main part of the transport device shown in FIG. 24. The unloader and the standby mechanism are shown, (a) is a simplified plan view in a state where the unloader is arranged on the transfer line, and (b) is a simplified plan view in a state where the standby mechanism is arranged on the transfer line. be. It is a perspective view which shows the work. It is a simplified diagram which shows the operation of a bonding apparatus. It is a simplified diagram which shows the operation of a general bonding apparatus. It is a simplified diagram which shows a wafer.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 25.

FIG. 1 shows a simplified block diagram of a transfer device according to the present invention, in which, as shown in FIG. 2, each supplied member S from the loader 10 is placed in a supply position Q between the loader 10 and the unloader 11. The supplied member S, which has been transported and whose work has been mounted, is carried out to the unloader 11. That is, in order to supply a plurality of types of workpieces W (see FIG. 27) having different grades to the supplied portion Sa (see FIG. 28) of the supplied member S for each grade, each supplied member S is supplied to the supply position Q (see FIG. 28). (See FIG. 28). Here, as shown in FIG. 27, the work W is a chip 21 cut out from the wafer (work aggregate) 26, and the chip 21 of the wafer 26 has a plurality of grades. In this embodiment, there are three grades, and these three grades are referred to as a first grade, a second grade, and a third grade. Further, in one wafer 26, there are many first grades and few second grades and third grades. In this case, the second grade may be more than the third grade, the third grade may be more than the second grade, and the second grade and the third grade may be the same number.

The supplied member S is a substrate 22 such as a lead frame, and the supplied portion Sa is an island portion 22a on the substrate 22, and a chip 21 is bonded to each island portion 22a. At this time, a bonding device as shown in FIG. 28 is used. In such a bonding device, the chip (semiconductor chip) 21 cut out from the wafer 26 is picked up by the collet (adsorption collet) 23 at the pickup position P and transferred (mounted) to the bonding position Q of the substrate 22 such as a lead frame. It is something to do. The wafer 26 is adhered to a wafer sheet (adhesive sheet 25) stretched on a metal ring (wafer ring), and is divided (divided) into a large number of chips 21 by a dicing process.

As shown in FIG. 28, the collet 23 picks up ascending in the arrow A direction and descending in the arrow B direction on the pickup position P, ascending in the arrow C direction and descending in the arrow D direction on the bonding position Q. Reciprocating movement in the directions of arrows E and F between the position P and the bonding position Q is possible. The collet 23 is attached to a bonding head (not shown), and the bonding head is attached to a bonding arm (not shown). Therefore, the bonding arm is controlled by a control means (not shown), and the collet 23 controls the movement of the arrows A, B, C, D, E, and F. The control means is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus centering on a CPU (Central Processing Unit). The ROM stores programs and data executed by the CPU.

As shown in FIGS. 1 and 2, this transfer device includes a shuttle 30 arranged at the supply position Q between the loader 10 and the unloader 11, and a shuttle 30 for supplying the supplied member S from the loader 10 side to the supply position Q. The upstream transfer mechanism 31 that conveys to the standby mechanism 31, the standby mechanism 32 that is arranged between the supply position Q and the unloader 11, and the members to be supplied from the shuttle 30 of the supply position Q to the standby mechanism 32 are conveyed from the transfer and standby mechanism 32. The downstream side transport mechanism 33 capable of returning the supplied member S to the shuttle 30 of the supply position Q of the above, and the carry-out mechanism 34 for carrying out the supplied member S for which the work W has been mounted from the standby mechanism 32 to the unloader 11. And.

The shuttle 30 is provided with a heating mechanism 38 and a suction mechanism 39. That is, as shown in FIG. 3, the shuttle 30 includes a flat plate-shaped shuttle main body 30a and an auxiliary plate 30b that is placed and fixed on the upper surface of the shuttle main body 30a. The heating mechanism 38 can be composed of, for example, a heating wire built in the shuttle 30 and a power source for heating the heating wire, but the heating mechanism 38 is not limited to this, and steam is used. Alternatively, it may be one using induction heating. That is, it suffices as long as the supplied member S requires heating and the heating method does not adversely affect the supplied member S or the work W. Further, the suction mechanism 39 is composed of, for example, a suction passage 29 arranged in the shuttle 30 and a vacuum generator (not shown) connected to the suction passage, and the suction passage 29 is a sub-plate of the shuttle 30. A plurality of suction ports 29a that open on the upper surface (flat surface) 28 of 30b are formed. In this case, the suction port 29a is arranged over the entire surface of the upper surface 28 and sucks the supplied member S on the entire surface. The vacuum generator may be a vacuum pump or an ejector type that controls opening and closing of high-pressure air and discharges it from a nozzle to a diffuser to generate a negative pressure in the diffusion chamber.

In this case, the longitudinal dimension (transporting direction dimension) of the shuttle body 30a of the shuttle 30 is set longer than the longitudinal dimension (transporting direction dimension) of the auxiliary plate 30b. That is, when the longitudinal dimension (transport direction dimension) of the shuttle body 30a is L1, the longitudinal dimension (transport direction dimension) of the sub-plate 30b is L2, and the longitudinal dimension (transport direction dimension) of the substrate 22 is L. , L1> L2, L> L2, and L≈L1.

The loader 10 includes a first loader 10A that houses the supplied member S (board 22A) for the first grade, a second loader 10B that stores the supplied member S (board 22B) for the second grade, and a third loader. A third loader 10B for accommodating the supplied member S (board 22C) for the grade is provided. Then, the loader 10 can reciprocate in the Y direction of the arrow in the orthogonal direction and reciprocate in the Z direction (vertical movement) with the transport path T of the supplied member S (the transport path in the linear direction connecting the loader 10 to the unloader 11). It has become. That is, known and public reciprocating mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used for these reciprocating movements. Each of the first, second, and third loaders 10A, 10B, and 10C is moved up and down while being arranged on the transport path T, and when one desired supplied member S is positioned at a predetermined height position. The supplied member S can be pressed by a pusher (not shown) and pushed out from the loader 10 as shown in FIG.

The unloader 11 includes a first unloader 11A that houses the supplied member S (board 22A) for the first grade, a second unloader 11B that houses the supplied member S (board 22B) for the second grade, and a third. A third unloader 11B for accommodating the supplied member S (board 22C) for the grade is provided. Then, the unloader 11 has a reciprocating movement in the arrow Y direction and a reciprocating movement (vertical movement) in the arrow Y direction orthogonal to the transport path T (a linear transport path connecting the loader 10 and the unloader 11) of the supplied member S. It is possible. That is, known and public reciprocating mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used for these reciprocating movements. Each of the first, second, and third unloaders 11A, 11B, and 11C is moved up and down while being arranged on the transport path T, and when one desired supplied member S is positioned at a predetermined height position. When the supplied member S is pressed from the standby mechanism 32 by the carry-out mechanism 34, the supplied member S is housed in the unloader 11.

Further, in the transport path T connecting the loader 10 and the unloader 11, from the upstream side (loader side), the upstream side stage 41, the preheating stage 42, the shuttle 30 arranged at the supply position Q, and the standby mechanism 32 And are arranged.

The upstream stage 41 receives the supplied member S sent from the loader 10, and so-called width adjustment, height detection, and the like are performed. In this case, it is pulled out from the loader 10 by a delivery mechanism 48, which will be described later, in a cueing state in which the downstream end portion of the supplied member S protrudes, for example, as shown in FIG. After that, width adjustment, height detection, etc. will be performed.

The stage 41 includes a stage main body 41a and an auxiliary plate 41b arranged (arranged) on the stage main body 41a. In this case, the longitudinal dimension (transport direction dimension) of the sub-plate 41b is set shorter than the longitudinal dimension (transport direction dimension) of the stage main body 41a. That is, when the longitudinal dimension (transporting dimension) of the stage body 41a is L3 and the longitudinal dimension (transporting direction dimension) of the sub-plate 41b is L4, L3> L4 and the longitudinal dimension of the substrate 22. When (the dimension in the transport direction) is L, L> L2 and L≈L4.

The preheating stage 42 includes a preheating stage main body 42a and an auxiliary plate 42b arranged on the preheating stage main body 42a. The preheating stage 42 is provided with a preheating mechanism 43 (see FIG. 1) having a heating mechanism 38 similar to that of the shuttle 30, and an adsorption means (not shown). That is, a heating wire or the like is embedded in the preheating stage 42. Therefore, preheating is applied to the supplied member S conveyed to the preheating stage 42. Here, the preheating is a temperature to which the shuttle 30 is heated or a temperature lower than this heating temperature by a predetermined temperature, and when the temperature is transferred from the preheating stage 42 to the shuttle 30, the predetermined heating temperature is immediately reached. The temperature that can be. Further, the suction means can be configured with the same configuration as that of the shuttle 30. Therefore, when the substrate 22 is conveyed to the preheating stage 42, the substrate 22 can be adsorbed on the upper surface 40 (upper surface of the sub-plate 42b) of the preheating stage 42.

In this case, the longitudinal dimension (transport direction dimension) of the preheating stage main body 42a is set longer than the longitudinal dimension (transport direction dimension) of the sub-plate 42b. That is, when the longitudinal dimension (transport direction dimension) of the preheating stage main body 42a is L5, the longitudinal dimension (transport direction dimension) of the sub-plate 42b is L6, and the longitudinal dimension (transport direction dimension) of the substrate 22 is L. In addition, L5> L6, L> L6, and L≈L5.

A shuttle 30 is arranged at the supply position Q, and the shuttle 30 can reciprocate in the arrow X direction along the transport path T via the shuttle reciprocating mechanism 45 shown in FIG. That is, as shown in FIG. 2, it is possible to reciprocate between the receiveable position of the supplied member S arranged on the preheating stage 42 side and the dischargeable position of the supplied member S arranged on the standby mechanism 32 side. To. As the shuttle reciprocating mechanism 45, known and public reciprocating mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used.

The standby mechanism 32 includes a storage shelf 46 for vertically storing a plurality of supplied members S, and an elevating mechanism 47 for raising and lowering the storage shelf 46. The supplied member S raised to a predetermined height position can be pushed into the unloader 11 by the carry-out mechanism 34. An elevator structure can be used as the elevating mechanism 47. Further, the carry-out mechanism 34 can be composed of a known / public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism, and a substrate pressing portion that abuts or holds the supplied member S.

By the way, the upstream transport mechanism 31, the standby mechanism 32, the downstream transport mechanism 33, the carry-out mechanism 34, the heating mechanism 38, the suction mechanism 39, the preheating mechanism 43, the shuttle reciprocating mechanism 45, the delivery mechanism 48 and the like are shown in FIG. It is controlled by the control means 50 shown in 1. Similar to the bonding device, the control means 50 is, for example, a microcomputer in which a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus. be. The ROM stores programs and data executed by the CPU. Therefore, the control means 50 may be used to configure the control means of the bonding apparatus.

As shown in FIGS. 3 and 4, the transport mechanisms 31 and 33 have a first chuck member 51 that chucks the upstream end of the supplied member S and a second chuck member that chucks the downstream end of the supplied member S. 52 and. Then, as shown in FIGS. 3 and 7, the first chuck member 51 moves up and down in the arrow Z1 direction by the first vertical movement mechanism 54, and the first horizontal movement mechanism 55 moves the arrow along the horizontal direction. It reciprocates in the X1 direction. Further, the first chuck member 52 moves up and down in the arrow Z1 direction by the second vertical movement mechanism 56, and reciprocates in the arrow X1 direction along the horizontal direction by the second horizontal movement mechanism 57. Further, the vertical movement mechanism 54, 56 and the movement mechanism 55, 57 can also be composed of known and public reciprocating movement mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism.

Each chuck member 51, 52 includes receiving portions 51a, 52a for receiving the lower surface side of the supplied member, and pressing portions 51b, 52b for pressing the upper surface side of the supplied member. The receiving portions 51a and 52a and the pressing portions 51b and 52b can be relatively close to each other, and the first chuck member 51 is supplied by the receiving piece 51a1 of the receiving portion 51a and the pressing piece 51b1 of the pressing portion 51b. The upstream end of S is held, and the second chuck member 52 can hold the downstream end of the supplied member S by the receiving piece 52a1 of the receiving portion 52a and the holding piece 52b1 of the holding portion 52b.

The width dimension of the receiving pieces 51a1 and 52a1 of the receiving portions 51a and 52a is set longer than the width dimension of the holding pieces 51b1 and 52b1 of the holding portions 51b and 52b. That is, as shown in FIG. 4, when the width dimension of the receiving pieces 51a1 and 52a1 is W1 and the width dimension of the holding pieces 51b1 and 52b1 is W2, W1> W2.

In this case, as shown in FIG. 3, it has bases 60a and 60b reciprocating by the horizontal movement mechanisms 55 and 57, and arm portions 61a and 61b projecting from the bases 60a and 60b. The receiving portions 51a and 52a and the pressing portions 51b and 52b are attached to the 61a and 61b. Then, the pressing portions 51b and 52b move up and down with respect to the arm portions 61a and 61b by the pressing portion vertical movement mechanism 63 (see FIG. 7). Further, the receiving portions 51a and 52a may also be configured to move up and down with respect to the arm portions 61a and 61b by the receiving portion vertical movement mechanism 64 (see FIG. 7). The vertical movement mechanisms 63 and 64 can also be composed of known and public reciprocating mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism.

Therefore, the upstream transfer mechanism 31 includes an upstream chuck device M1 having one first chuck member 51 and one second chuck member 52, and the downstream transfer mechanism 33 has one first chuck member 51. A downstream chuck device M2 having the second chuck member 52 and the second chuck member 52 is provided. Then, as shown in FIG. 8, each chuck device M1 and M2 moves up and down in the arrow Z direction and reciprocates in the horizontal direction in the arrow X direction by the drive mechanism 67 having the vertical movement mechanism 65 and the horizontal reciprocating mechanism 66. It is possible to move. The vertical movement mechanism 65 and the horizontal reciprocating mechanism 66 of the drive mechanism 67 can also be configured by known and public reciprocating mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism.

As shown in FIG. 7, the first and second vertical movement mechanisms 54 and 56, the first and second horizontal movement mechanisms 55.57, the holding portion vertical movement mechanism 63, and the receiving portion vertical movement mechanism 64 are described above. The drive mechanism 67, which is controlled by the control means 70 and has the vertical movement mechanism 65 and the horizontal reciprocating mechanism 66 in each of the chuck devices M1 and M2, is controlled by the control means 71. The control means 70 and the control means 71 can be configured by a microcomputer or the like like the control means 50, and can be configured by the control means 50 as these control means 70 and 71.

By the way, as shown in FIG. 4, the basic configuration of the chuck members 51 and 52 has one receiving portion 51a and 52a and one holding portion 51b and 52b, respectively, on the upstream side. As shown in FIG. 5, the first chuck member 51 of the chuck device M1 may be provided with a chuck portion 53A having a receiving portion 51c having a receiving piece 51c1 and a holding portion 51d having a holding piece 51d1 on the upstream side. Further, as shown in FIG. 6, the second chuck member 52 of the downstream chuck device M2 is provided with a chuck portion 53B having a receiving portion 52c having a receiving piece 52c1 and a pressing portion 52d having a holding piece 52d1 on the downstream side. You may.

That is, the chuck portion 53A of the first chuck member 51, the vertical movement mechanism 54 that moves the first chuck member 51 up and down, and the horizontal movement mechanism 57 that reciprocates the first chuck member 51 in the horizontal direction. It is also possible to configure the delivery mechanism 48. Further, the unloading mechanism 34 is provided by the second chuck member 53B, the vertical movement mechanism 54 that moves the second chuck member 52 up and down, and the horizontal movement mechanism 57 that reciprocates the second chuck member 51 in the horizontal direction. It is also possible to configure.

Next, a transport method using the transport device configured as described above will be described with reference to FIGS. 9 to 14 and the like. The substrate 22 on which the first grade chip is mounted is the substrate 22A, the substrate 22 on which the second grade chip is mounted is the substrate 22B, and the substrate 22 on which the third grade chip is mounted is the substrate 22C.

First, as shown in FIG. 11, the substrate 22A as the supplied member S is conveyed onto the stage 41 for the first grade. In this case, if the first chuck member 51 of the upstream chuck device M1 is provided with the upstream chuck portion 53A as shown in FIG. 5, the receiving portion 51c and the pressing portion 51d are headed from the loader 10. The downstream end of the ejected substrate 22A can be chucked, and in this chucked state, the substrate 22 can be conveyed onto the stage 41 by moving the first chuck member 51 to the unloader side. Alignment and height detection are performed on the substrate 22 conveyed onto the stage 41. Therefore, the chuck portion 53A, the vertical movement mechanism 54, and the horizontal movement mechanism 55 form a delivery mechanism 48. Note that FIG. 2 shows a cueing state of the substrate 22B from the second loader 10B.

Then, as shown in FIG. 11, the substrate 22 conveyed on the stage and placed on the stage is chucked by the upstream chuck device M1. In this case, as shown in FIGS. 3A and 3B, the upstream end of the substrate 22 is chucked (held) by the first chuck member 51, and the downstream end of the substrate 22 is chucked by the second chuck member 52 (holding). Hold on).

That is, as shown in FIG. 4 (a), the first chuck member 51 and the second chuck member 52 are shown in FIG. 4 (b) with a distance wider than the longitudinal length (long side) of the substrate 22. As described above, the first chuck member 51 and the second chuck member 52 are lowered. In this case, since the longitudinal dimension (transporting direction dimension) of the sub-plate 41b is set shorter than the longitudinal dimension (transporting direction dimension) of the stage body 41a, the receiving pieces 51a1, 52a1 are set below the sub-plate 41b. In addition to being positioned, it can be positioned above the stage body 41a, and the presser pieces 51b1 and 52b1 can be positioned above the upper surface of the substrate 22.

In this state, as shown in FIG. 4C, the first chuck member 51 and the second chuck member 52 are brought close to each other, and the upstream of the substrate 22 is between the receiving piece 51a1 and the holding piece 51b1 of the first chuck member 51. An end portion is interposed, and a downstream end portion of the substrate 22 is interposed between the receiving piece 52a1 and the pressing piece 52b1 of the second chuck member 52. After that, the first chuck member 51 and the second chuck member 52 are raised, and the holding pieces 51b1 and 52b1 are lowered, and as shown in FIG. 4D, the receiving piece 51a1 and the holding piece 51b1 are upstream of the substrate 22. The end portion is held, and the downstream end portion of the substrate 22 is held by the receiving piece 52a1 and the holding piece 52b1.

As shown in FIG. 4D, the upstream chuck device M1 in a state where the substrate 22 (22A) is chucked by the first chuck member 51 and the second chuck member 52 is conveyed to the downstream side, and is shown in FIG. As shown, it is conveyed to the preheating stage 42. In this case, the upstream chuck device M1 is positioned on the preheating stage and then lowered to place the substrate 22 on the preheating stage 42. That is, the upstream chuck device M1 is in a state where the first chuck member 51 holds the upstream end portion of the substrate 22 and the second chuck member 52 holds the downstream end portion of the substrate 22 (22A). 22 (22A) is placed on the preheating stage 42 by lowering.

At this time, since the longitudinal dimension (conveyance direction dimension) L6 of the sub-plate 42b of the preheating stage 42 is set shorter than the longitudinal direction dimension (conveyance direction dimension) L5 of the main body 42a, the receiving pieces 51a1 and 52a1 are the substrate 22. It can be placed on the preheating stage 42 without contacting the preheating stage 42. After that, the holding pieces 51b1 and 52b1 are raised to relatively separate the first chuck member 51 and the second chuck member 52, and then the chuck device M1 is raised. As a result, the chuck device M1 is placed at a position above the substrate 22 on which the chuck device M1 is placed on the preheating stage 42.

Then, the substrate 22 heated to the predetermined preheating temperature in the preheating stage 42 is conveyed to the shuttle 30 located on the downstream side of the supply position Q. In this case, the substrate 22 on the preheating stage 42 can be chucked by the upstream chuck device M1 by performing the process shown in FIG. Therefore, with the substrate 22 chucked, the upstream chuck device M1 is moved to the unloader 11 side as shown in FIG. In this case, the shuttle 30 is positioned on the loader side, and in a state where the upstream chuck device M1 is raised, the shuttle 30 is conveyed to the unloader side, and the upstream chuck device M1 is positioned above the shuttle 30.

That is, it is located above the shuttle 30 in the state shown in FIG. 3 (a). After that, the upstream chuck device M1 is lowered to place the substrate 22 on the upper surface of the shuttle 30, that is, the upper surface 30b1 of the sub-plate 30b. At this time, the longitudinal dimension (transport direction dimension) L1 of the sub-plate 30b is set shorter than the longitudinal dimension L (transport direction dimension) of the shuttle body 30a. Therefore, as shown in FIG. 3B, the substrate 22 is placed on the upper surface of the shuttle 30 without the receiving pieces 51a1 and 52a1 of the chuck members 51 and 52 of the upstream chuck device M1 coming into contact with the sub-plate 30b. Can be placed. In this way, when the chuck members 51 and 52 are placed, the chuck members 51 and 52 are horizontally moved in a direction in which they are relatively separated from each other. As a result, tension in the longitudinal direction is applied to the substrate 22, and in this tension-applied state, the shuttle 30 completely adsorbs the substrate 22.

When the substrate 22 is attracted to the shuttle 30, the upstream chuck device M1 is separated from the substrate 22. That is, by performing the same process as the step of separating the upstream chuck device M1 from the state mounted on the preheating stage 42, the upstream chuck device M1 is arranged at an upper position of the substrate 22 adsorbed and held by the shuttle 30. It will be in the state of being. After that, the upstream side chuck device M1 returns to the upstream side.

Then, the substrate 22 attracted and held by the shuttle 30 is heated, and the chip 21 as the work W is bonded to the island portion 22a of the substrate 22. In this state, as shown in FIG. 9, bonding of the first grade chip 21 is started (step S1). After that, the process proceeds to step S2, and it is determined whether or not the mounting of the first grade chip 21 is completed (in this case, it is determined whether or not the mounting of the chip on the substrate 22A is completed). If it is completed in step S2, the process proceeds to step S3 to start bonding the second grade chip 21. At this time, the substrate 22A on which the first grade chip 21 has been mounted is conveyed to the standby mechanism 32 by the downstream chuck device M2 as shown in FIG.

In the bonding step, after bonding to a row of island portions 22a (see FIG. 10) in a direction orthogonal to the transport direction (longitudinal direction) is completed, the shuttle 30 receiving the bonded substrate 22 is moved downstream. It is moved by a predetermined amount via the shuttle reciprocating mechanism 45 to enable bonding to the next row of island portions 22a.

Since the downstream side chuck device M2 has the same configuration as the upstream side chuck device M1, the downstream side chuck device M2 is positioned above the shuttle 30 located on the downstream side by bonding. That is, the state shown in FIG. 4A is used. After that, by performing the steps shown in FIGS. 4 (b) to 4 (d), the substrate 22A on which the first grade chip has been mounted can be chucked by the downstream chuck device M2. Then, the substrate 22A can be conveyed to the standby mechanism 32 by the downstream side chuck device M2 as shown in FIG.

By the way, as shown in FIG. 6, if a downstream side chuck device M2 having a loader side chuck portion 53A on the downstream side of the second chuck member 52 is used, the chuck portion 53A is the upstream end portion of the substrate 22A. Can be chucked and pushed into the unloader 11. That is, the carry-out mechanism 34 can be configured by the chuck portion 53B of the second chuck member 52 of the downstream chuck device M2, the vertical movement mechanism 54 that moves the second chuck member 52 up and down, and the horizontal movement mechanism 55. Therefore, the substrate 22A can be discharged to the unloader 11.

If it is not completed in step S2, the process proceeds to step S4. In step S4, it is determined whether or not the first grade chip 21 remains on the wafer 26 (determines whether or not there is a residue). If there is a residue, the process returns to step S2 and the bonding of the first grade chip 21 is continued. In step S4, if there is no residue, the substrate 22A for the first grade is conveyed to the standby mechanism 32 to put the substrate 22 for the first grade in the retracted state. (Step S5).

In this case, during bonding to the substrate 22A for the first clade, the substrate 22B for the second grade is conveyed to the preheating stage 42 by using the upstream chuck device M1 to apply preheating to the substrate 22B. I will do it. Then, the substrate 22B is conveyed to the shuttle 30 located on the upstream side in an empty state, and the substrate 22B is fully adsorbed on the upper surface of the shuttle 30. As a result, the second grade chip 21 can be mounted on the second grade substrate 22B.

When the bonding of the second grade chip 21 is started, the process proceeds to step S6, and it is determined whether or not the mounting of the second grade chip 21 is completed. If it is completed, the process proceeds to step S7 in FIG. That is, the board 22B having been mounted is conveyed to the standby mechanism 32 by using the downstream chuck device M2, and then carried out to the unloader 11.

If it is not completed in step S6, the process proceeds to step S8. In step S8, it is determined whether or not the second grade chip 21 remains on the wafer 26 (determines whether or not there is a residue). If there is a residue, the process returns to step S6 and the bonding of the second grade chip 21 is continued. In step S8, if there is no residue, the second grade substrate 22B is put into a retracted state. That is, the substrate 22B is conveyed to the standby mechanism 32.

In step S7, bonding of the third grade chip 21 to the third grade substrate 22C is started. In this case, while the second grade chip 21 is being bonded to the second grade substrate 22B, the second grade substrate 22C is conveyed to the preheating stage 42 by using the upstream chuck device M1. Preheating is applied to the substrate 22C. Then, the substrate 22C is conveyed to the shuttle 30 located on the upstream side in an empty state, and the substrate 22C is fully adsorbed on the upper surface of the shuttle 30. As a result, the third grade chip 21 can be mounted on the third grade substrate 22C.

After starting the bonding of the third grade chip 21, the process proceeds to step S11, and it is determined whether or not the mounting of the third grade chip 21 is completed. If it is completed, the process proceeds to step S12. At this time, the substrate 22C is conveyed (discharged) to the unloader 11. If the mounting is completed in step S11, the process proceeds to step S12, and it is determined whether or not to end this work. If it ends, it ends, and if it does not end, the process returns to step S1 in FIG.

If the mounting is not completed in step S11, the process proceeds to step S13, and it is determined whether or not the third grade chip 21 remains on the wafer 26 (determines whether or not there is a residue). If there is a residue, the process returns to step S11 and the bonding of the third grade chip 21 is continued. In step S13, if there is no residue, the process proceeds to step S14, and it is determined whether or not all the chips 21 of the wafer 26 have been picked up. When all the chips 21 are picked up, the process proceeds to step S15, the wafer 26 at the pickup position is replaced, and the process proceeds to step S1 in FIG.

If not all the chips 21 have been picked up in step S14, the process proceeds to step S16, and the remaining chips 21 are picked up and bonded. In this case, if the first grade chip 21 remains, the first grade substrate 22A waiting in the standby mechanism 32 is returned to the shuttle 30, and the first grade chip 21 is bonded. If the second grade chip 21 remains, the second grade substrate 22B waiting in the standby mechanism 32 is returned to the shuttle 30, and the second grade chip 21 is bonded. If the third grade chip 21 remains, the third grade substrate 22C waiting in the standby mechanism 32 is returned to the shuttle 30, and the third grade chip 21 is bonded. Bonding work will be performed until all the chips 21 are picked up.

In this way, the chips 21 of different grades can be sequentially bonded to the boards 22A, 22B, 22C to be mounted, and the boards 22A, 22B, which have been mounted, are transferred to the unloader 11 on the downstream side. It can be carried out.

In the transport device of the present invention, the supplied member S can be transported from the loader side to the shuttle 30 at the supply position Q. Therefore, the work W can be supplied to the supplied portion Sa of the supplied member S. Then, the supplied member S for which the work W has been mounted can be carried out to the unloader 11 via the standby mechanism 32.

Further, if there is no work W of the grade to be supplied from the work supply source before the work W is mounted on the supplied member S, the supplied member S is transported from the shuttle S to the standby mechanism 32 to be in an empty state. It is possible to transport the supplied member S for another grade to the supply position Q that has become. Therefore, the work W of another grade can be supplied to the supplied member S. Then, the supplied member S for which the work W has been mounted can be carried out to the unloader 11 via the standby mechanism 32.

Then, when all the works of the work supply source are exhausted, a new work W is supplied to the work supply source. Therefore, the supplied member S for which the work W has not been mounted, which has been waiting in the standby mechanism 32, can be returned to the shuttle 30 at the supply position Q again. The work W can be supplied to the remaining supplied portion Sa of the supplied member S that has returned to the supply position Q in this way.

Therefore, in the present invention, it is possible to utilize the information on the remaining number of works for each grade in the work supply source (work aggregate) and the remaining number of supplied parts of the supplied member, and it is possible to reduce the transfer loss. It is possible to handle either one type of work or multiple types of work, and it is possible to improve production efficiency. Further, the transport path T can be designed to be relatively short, and the device can be made compact.

It is preferable that the supply position Q is provided with a shuttle reciprocating mechanism 45 that reciprocates the shuttle 30 in the transport direction between the loader 10 and the unloader 11. With this configuration, it is possible to receive the supplied member S from the loader 10 with the shuttle 30 arranged on the upstream side in the supply position Q. Therefore, when the work is supplied to the supplied portion Sa of the supplied member S, for example, the work W is supplied along a direction orthogonal to the transport direction of the supplied member S, and a plurality of coated members arranged in a row. After the work supply to the supply portion S is completed, the shuttle 30 can be moved downstream by a predetermined pitch to supply the work W to the plurality of supply portions S in the next row. By performing this operation, the work W can be supplied to all the supplied parts of the supplied member S. Moreover, when the supply of the work W is completed, the shuttle S will be located on the downstream side and can be quickly carried out to the unloader side.

The standby mechanism 32 can be configured to include a storage shelf 46 for vertically storing a plurality of supplied members S and an elevating mechanism 47 for raising and lowering the storage shelf 46. With this configuration, a plurality of supplied members S can be compactly stored in the storage shelf 46, and the supplied member S can be raised by the elevating mechanism 47, and is supplied from the storage shelf 46. It is possible to position the member S at a height at which it can be carried out.

The upstream transfer mechanism 31 is between a pair of chuck members 51, 52 that chuck the supplied member S, a vertical movement mechanism 54, 56 that moves the chuck members 51, 52 up and down, and a loader 10 and an unloader 11. Those provided with the reciprocating movement mechanisms 55 and 57 that reciprocate the chuck members 51 and 52 in the transport direction are preferable. With this configuration, when the supplied member S is to be conveyed to the supply position Q, even if another supplied member S is arranged at the supply position Q on the upstream side of the supplied member S. , The supplied member S to be transported can be transported to the supply position beyond the other supplied member S.

It may have a delivery mechanism 48 that sends out the supplied member S from the loader 10, and may include a stage 41 that receives the supplied member S sent from the loader 10. By providing such a device, the supplied member S can be stably delivered from the loader 10. Further, the supplied member S is transported to the stage 41 by the upstream transport mechanism 31, but in this case, since the supplied member S is received on the stage 41, the supplied member S is A stable posture and position can be maintained, and chucking on the stage 41 by the upstream transfer mechanism 31 becomes easy.

The shuttle 30 preferably has a suction mechanism 39 that completely sucks the supplied member S. Here, by adsorbing the entire surface, even if the supplied member S is thin, it can be held flat without being deformed, and the work of supplying the work W to the supplied member S is stable.

The shuttle 30 may have a heating mechanism 38 for heating the supplied member S. In the device having the heating mechanism 38 as described above, the supplied member S can be heated, and when the work W is bonded to the supplied member S via an adhesive, it can be quickly and stably bonded. ..

A preheating stage 42 for applying preheating to the supplied member S may be provided on the loader side of the supply position Q. By providing the preheating stage 42 in this way, the supplied member S can be quickly heated to a predetermined temperature when the work is supplied, and the working time can be shortened.

In the die bonder of the present invention, the substrate 22 is conveyed to the bonding position by using the transfer device. In this case, even if the chip 21 as the work W has a plurality of grades, the chips 21 of each grade can be sequentially bonded to the substrate 22 to which the chip 21 of that grade is to be bonded. ..

According to the transport method of the present invention, the work of the grade to be supplied to the supplied member S can be supplied to the supplied member S, and after all the work W has been mounted on the supplied member S, the mounting is completed. The supplied member S can be carried out to the unloader 11 on the downstream side. Further, if there is no work W of the grade to be supplied from the work supply source before the work W is mounted on the supplied member S, the supplied member S is transported from the shuttle 30 to the standby position and becomes empty. Since the other supplied member S is conveyed to the supplied position Q, the work W can be supplied to the supplied member S.

In a state where the work W of the grade to be supplied to the work supply source is supplied, the supplied member S that has been made to stand by in the standby position (standby mechanism 32) is returned to the supply position Q, and the supplied member S is returned. It is possible to supply the work W of the grade to be supplied to the supply site Sa. With such a configuration, efficient transportation can be performed.

In the embodiment, the supplied member S is held by chucking the upstream end of the supplied member S with the first chuck member 51 and chucking the downstream end of the supplied member S with the second chuck member 52. can do. Then, in this holding state, the first chuck member 51 and the second chuck member 52 can be integrally moved up and down and reciprocated in the horizontal direction. Therefore, the supplied member S is lifted and along the horizontal direction. Can be reciprocated. Therefore, the substrate 22 can be transported to a predetermined position without using a transport rail. Further, since the chuck members 51 and 52 can move up and down and reciprocate in the horizontal direction, they can correspond to the supplied members S of various sizes.

The width dimension W1 of the receiving pieces 51a1 and 52a1 of the receiving portions 51a and 52a can be set longer than the width dimension W2 of the holding pieces 51b1 and 52b2 of the holding portions 51b and 52b. As a result, the supplied member S can be stably received.

It is possible to apply tension to the supplied member S while the first chuck member 51 holds the upstream end of the supplied member S and the second chuck member 52 holds the downstream end of the supplied member S. Is preferable. By applying tension in this way, it is possible to correct the warp or bending of the supplied member S without using a pressing mechanism.

If the upstream side chuck device M1 and the downstream side chuck device M2 are provided, the upstream side chuck device M1 places the supplied member S from the loader 10 at a predetermined portion between the loader 10 and the unloader 11 (for example, a pong). It can be conveyed to the ding position), and at this site, a predetermined operation (for example, a mounting operation for mounting a chip) is performed on the supplied member S, and after this operation is completed, the supplied member S whose operation is completed is downstream. It can be conveyed to the unloader side by the side chuck device M2. Therefore, efficient transport work can be performed.

In the case where the loader side chuck portion 53A is provided on the first chuck member 51 of the upstream chuck device M1, the first chuck member 51 can move up and down and reciprocate in the horizontal direction. If the downstream end of the supply member S is held, the supplied member S housed in the loader 10 can be pulled out.

In the case where the unloader side chuck portion 53B is provided on the second chuck member 52 of the downstream side chuck device M2, the second chuck member 52 can move up and down and reciprocate in the horizontal direction. By holding the upstream end of the supplied member S, the supplied member S can be pushed into the unloader 11.

According to the die bonder of the embodiment, the substrate 22 can be transported to a predetermined position without using a transport rail. Further, since the chuck members 51 and 52 can move up and down and reciprocate in the horizontal direction, they can correspond to the members to be supplied of various sizes. That is, since the substrate 22 which is the supplied member S can be transported to a predetermined position without using a transport rail, stable transport can be performed without causing so-called "kneading", and the substrate 22 can be transported. There is no possibility that the substrate will be damaged due to rubbing or the like. Furthermore, it can be used for substrates of various sizes and is excellent in versatility.

15 and 16 show another embodiment, in which case the standby mechanism 32 is not arranged on the unloader 11 side but is arranged on the loader 10 side. Then, a preheating stage 42 is arranged on the downstream side of the standby mechanism 32, and a standby (evacuation) space for the shuttle 30 is provided below the preheating stage 42. The loader 10 includes a first loader 10A, a second loader 10B, a third loader 10C, and a fourth loader 10D for accommodating a substrate 22D for a fourth grade. Therefore, the unloader 11 includes a fourth unloader 11D for accommodating the substrate 22D for the fourth grade, in addition to the first unloader 11A, the second unloader 11B, and the third unloader 11C.

In this case, as shown in FIG. 19, the upstream transfer mechanism 31 has a third chuck member 81 that chucks one side side portion (long side side) of the supplied member S and the other side of the supplied member S. A fourth chuck member 82 for chucking the edge portion (long side side) is provided. Then, as shown in FIGS. 17 and 19, the third chuck member 81 moves up and down in the arrow Z1 direction by the third vertical movement mechanism 84, and the third horizontal movement mechanism 85 moves the arrow along the horizontal direction. It reciprocates in the Y1 direction. Further, the fourth chuck member 52 moves up and down in the arrow Z1 direction by the fourth vertical movement mechanism 86, and reciprocates in the arrow Y1 direction along the horizontal direction by the fourth horizontal movement mechanism 87. Further, the vertical movement mechanism 84, 86 and the movement mechanism 85, 87 can also be composed of known and public reciprocating movement mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism.

Each chuck member 81, 82 includes receiving portions 81a, 82a for receiving the lower surface side of the supplied member, and holding portions 81b, 82b for pressing the upper surface side of the supplied member. The receiving portions 81a, 82a and the pressing portions 81b, 82b can be relatively close to each other, and the third chuck member 81 is supplied by the receiving piece 81a1 of the receiving portion 81a and the pressing piece 81b1 of the pressing portion 81b. One side side portion of S may be held, and the fourth chuck member 82 may hold the other side side portion of the supplied member S between the receiving piece 82a1 of the receiving portion 82a and the holding piece 82b1 of the holding portion 82b. can.

The width dimension of the receiving pieces 81a1 and 82a1 of the receiving portions 81a and 82a is set longer than the width dimension of the holding pieces 81b1 and 82b1 of the holding portions 81b and 82b. That is, as shown in FIG. 19, when the width dimension of the receiving pieces 81a1 and 82a1 is W3 and the width dimension of the holding pieces 81b1 and 82b1 is W4, W4> W3.

In this case, the pressing portions 81b and 82b move up and down as shown by the arrow Z2 via the pressing portion vertical movement mechanism 75. Further, the receiving portions 81a and 82a are also configured to move up and down via the receiving portion vertical movement mechanism 76. The vertical movement mechanisms 75 and 76 can also be composed of known and public reciprocating mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism.

Further, as shown in FIG. 18, the chuck device M3 provided with the chuck members 81 and 82 is as shown in FIG.
The drive mechanism 92 having the vertical movement mechanism 90 and the horizontal reciprocating mechanism 91 enables vertical movement in the arrow Z direction and horizontal reciprocating movement in the arrow X direction. The vertical movement mechanism 90 and the horizontal reciprocating mechanism 91 of the drive mechanism 92 can also be configured by known and public reciprocating mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism.

As shown in FIG. 16, the upstream transfer mechanism 31 can chuck the substrate 22 extruded from the loader 10 and transport it onto the upstream stage 94 disposed above the standby mechanism 32. That is, each side portion of the substrate 22 is held by the receiving pieces 81a1, 82a1 and the holding pieces 81b1, 82b1 of the third and fourth chuck members 81, 82, and is conveyed onto the upstream stage 94, for example. , Cleaning etc. are performed. In this case, the width dimension H1 of the upstream stage 94 is set smaller than the width dimension H of the substrate 22, and the upstream stage 94 is an obstacle during the chuck operation and the chuck release operation of the third and fourth chuck members 81 and 82. It doesn't become.

Further, the preheating stage 42 includes a preheating stage main body 42a and an auxiliary plate 42b arranged on the preheating stage main body 42a, as in the above embodiment. In this case, as shown in FIG. 19, the width dimension H2 of the sub-plate 42b is made smaller than the width dimension H of the substrate 22. Then, as shown in FIG. 19, in a state where the third chuck member 81 and the fourth chuck member 82 are closest to each other, the receiving pieces 81a1 and 82a1 do not come into contact with the sub-plate 42b, and the side portions of the substrate 22 are formed. It can be in a state where it is located below, and further, it can be in a state where the holding pieces 81b1 and 82b1 are located above the side side portion of the substrate 22.

A method of supplying the substrate 22 to the preheating stage 42 by using the upstream transfer mechanism 31 will be described. first. As shown in FIG. 19C, the substrate 22 is chucked by the chuck device M3 (third chuck member 81 and fourth chuck member 82) and is positioned above the preheating stage 42. In this state, the chuck device M3 is lowered, and the substrate 22 is placed on the upper surface 40 of the preheating stage 42 as shown in FIG. 19B. In this case, the receiving pieces 81a1 and 82a1 can be placed on the preheating stage 42 without contacting the substrate 22. After that, as shown in FIG. 19A, the holding pieces 81b1 and 82b1 are raised to relatively separate the third chuck member 81 and the fourth chuck member 82, and then the chuck device M3 is raised. Let me. As a result, the chuck device M3 is placed at a position above the substrate 22 on which the chuck device M3 is placed on the preheating stage 42.

On the contrary, as shown in FIG. 19A, a method of picking up the substrate 22 mounted on the preheating stage 42 will be described. First, as shown in FIG. 19A, the side edges of the substrate 22 are interposed between the receiving pieces 81a1 and 82a1 and the holding pieces 81b1 and 82b1, respectively. After that, as shown in FIG. 19B, the holding pieces 81b1 and 82b1 are lowered, and the receiving pieces 81a1 and 82a1 are raised, so that the holding pieces 81b1, 82b1 and the receiving pieces 81a1 and 82a1 are used on the substrate 22, respectively. The preheating stage 42 can pick up the substrate by holding the side side portion and raising the chuck device M3 as shown in FIG. 19 (c).

By the way, since the supplied member standby mechanism 43 moves up and down (moves up and down), the delivery mechanism 48 on the loader side can be moved up and down in conjunction with this up and down movement. In this way, if the delivery mechanism 48 moves up and down, the board 22 at a desired height position can be sent out from the loader 10 without moving the loader 10 up and down. Of course, it is not necessary to interlock the supplied member standby mechanism 21 and the delivery mechanism 45.

A method of transporting the substrate 22 to the shuttle 30 via the chuck mechanism M3 will be described. First, as shown in FIG. 20 (c), the substrate 22 is chucked by the chuck device M3 (third chuck member 81 and fourth chuck member 82) and is positioned above the shuttle 30. In this state, the chuck device M3 is lowered, and the substrate 22 is placed on the upper surface of the shuttle 30 as shown in FIG. 20 (b).

In this case, the width dimension H3 of the sub-plate 30b is made smaller than the width dimension H of the substrate 22. Then, as shown in FIG. 20, in a state where the third chuck member 81 and the fourth chuck member 82 are closest to each other, the receiving pieces 81a1 and 82a1 do not come into contact with the sub-plate 30b, and the side portions of the substrate 22 are formed. The pressing pieces 81b1 and 82b1 are positioned below the side portions of the substrate 22. As a result, the receiving pieces 81a1 and 82a1 can be placed on the shuttle 30 without coming into contact with the substrate 22.

After that, as shown in FIG. 20A, the holding pieces 81b1 and 82b1 are raised to relatively separate the third chuck member 81 and the fourth chuck member 82, and then the chuck device M3 is raised. Let me. As a result, the chuck device M3 is arranged at a position above the substrate 22 mounted on the shuttle 30.

On the contrary, as shown in FIG. 20A, a method of picking up the substrate 22 mounted on the shuttle 30 will be described. First, as shown in FIG. 20A, the side edges of the substrate 22 are interposed between the receiving pieces 81a1 and 82a1 and the holding pieces 81b1 and 82b1, respectively. After that, as shown in FIG. 20 (b), the holding pieces 81b1, 82b1 are lowered and the receiving pieces 81a1 and 82a1 are raised, so that the holding pieces 81b1, 82b1 and the receiving pieces 81a1 and 82a1 are used on the substrate 22, respectively. As shown in FIG. 20 (c), if the chuck device M3 is raised while holding the side side portion, the shuttle 30 can pick up the substrate 22. In this embodiment, two shuttles (two) shuttles 30 are used.

By the way, as shown in FIG. 21, the carry-out mechanism 34 of this embodiment includes a chuck mechanism M4 having the same structure as the chuck mechanism M3 provided with the third chuck member 81 and the fourth chuck member 82, and a pushing mechanism 92. Be prepared.

As shown in FIG. 22, the pushing mechanism 92 includes a receiving member 93 that receives the substrate 22, an X-direction reciprocating mechanism 95 that reciprocates the receiving member 93 in the X direction, and Y that reciprocates the receiving member 93 in the Y direction. It is provided with a directional reciprocating mechanism 96. The receiving member 93 includes a receiving plate 93a made of a flat plate plate one size larger than the substrate 22, and a pressing protrusion 93b erected at the center of a short side portion on the upstream side of the receiving plate 93a. A Z-direction reciprocating mechanism (not shown) that reciprocates the receiving member 93 in the vertical direction (Z-direction) may be provided.

A method of unloading the board 22 to the unloader 11 by the unloading mechanism 34 configured in this way will be described. As shown in FIG. 23A, the height of the chuck device M4 is adjusted to the height position of the substrate 22 mounted and fixed on the shuttle 30. Then, as shown by the arrow X3, the shuttle 30 is moved to the unloader 11 side along the X direction, and as shown in FIG. 23B, the substrate 22 on the shuttle 30 is pressed into the receiving pieces 81a1 and 82a1 and the holding pieces. The side portions of the substrate 22 are interposed between the 81b1 and 82b1, respectively. After that, as shown in FIG. 20C, the chuck device M4 is set as a state in which the side portions of the substrate 22 are held between the receiving pieces 81a1 and 82a1 and the holding pieces 81b1 and 82b1, respectively (chucked state). While ascending in the direction of arrow Z3, the shuttle 30 is transported to the upstream side as shown by arrow X4.

After that, the receiving member 93 that has escaped from the transport path T in the direction of the arrow Y4 moves as shown by the arrow Y3 in FIG. 23 (d) and is made to enter the transport path T. In this case, the receiving plate 93a of the receiving member 93 is positioned below the third chuck member 81 and the fourth chuck member 82, and the pressing protrusion 93b is positioned upstream of the substrate 22. In this case, the position corresponds to the central portion of the short side on the upstream side of the substrate 22 of the pressing protrusion 93b.

In this state, the receiving member 93 is moved to the downstream side as shown by the arrow X5 in FIG. 23 (e). As a result, the substrate 22 can be pushed out to the downstream side, that is, the unloader 11 side via the pressing protrusion 93b, and the substrate 22 can be housed in the unloader 11.

In this case, the height position in which the substrate 22 is stored can be changed by moving the unloader side up and down according to the height of the substrate 22 pushed out by the carry-out mechanism 34, but the third chuck member and the fourth chuck member 4 If the receiving member 93 and the receiving member 93 move up and down, it is not necessary to move the unloader side up and down. The BH shown by the virtual line in FIG. 16 indicates the bonding space of the bonding apparatus.

Next, the operation (process) of the transfer device shown in FIG. 16 will be described. First, a case where the first grade work W (chip 21) is mounted on the island portion 22a of the substrate 22A will be described. The loader 10 sends out the substrate 22A and conveys the substrate 22A to the stage 94 via the delivery mechanism 48 (see FIG. 15) and the upstream transfer mechanism 31, and then transfers the substrate 22A to the stage 42 via the upstream transfer mechanism 31. Supply to.

The preheated substrate 22A is supplied to the shuttle 30 from the preheating stage 42. In this case, it will be supplied to the shuttle 30 at a position adjacent to the preheating stage 42 when viewed in a plane. Therefore, when the substrate 22 is supplied to the shuttle 30 on the downstream side of the two shuttles 30, it is necessary to arrange the shuttle 30 at a position adjacent to the preheating stage 42. Therefore, the shuttle 30 on the upstream side is made to stand by below the preheating stage 42.

The substrate 22A conveyed onto the shuttle 30 is adsorbed on the upper surface 28 of the shuttle 30 and heated to a predetermined temperature. Then, the chip 21 is bonded to the island portion 22a of the substrate 22A. In this case, the chips 21 are supplied along the direction orthogonal to the transport direction of the substrate 22A, and after the chip supply to the plurality of island portions 22a arranged in a row is completed, the shuttle 30 is moved to the downstream side by a predetermined pitch. Then, the chips 21 can be supplied to the plurality of island portions 22a in the next row. By performing this operation, the work W can be supplied to all the island portions of the substrate 22A. Moreover, when the supply of the chip 21 is completed, the shuttle 30 will be located on the downstream side and can be quickly carried out to the unloader side.

As described with reference to FIG. 23, the substrate 22A on which the chip 21 has been mounted can be supplied to the unloader 11 via the unloading mechanism 34 by moving the shuttle 30 to the unloading mechanism 34.

Further, when the first grade chip 21 to the substrate 22A is lost on the wafer 26 and the second grade chip 21 is on the wafer 26, it is necessary to make the substrate 22A stand by from the bonding position. In this case, the upstream transfer mechanism 31 conveys the substrate 22A to the standby position, that is, the standby mechanism 32, and causes the substrate 22A to stand by. Further, the substrate 22B on which the second grade chip 21 is mounted is supplied from the loader 10 to the preheating stage 42 via the stage 94, and the substrate 22B of the preheating stage 42 is supplied to the shuttle 30. Then, the second grade chip 21 is mounted (bonded) on the substrate 22B. When the mounting of the chip 21 on the board 22B is completed, the board 22B is supplied to the unloader 11.

If the second grade chip 21 is missing from the wafer 26 and the third grade chip 21 is present even though the mounting of the second grade chip 21 has not been completed, the substrate 22B is upstream. The side transport mechanism 31 transports the chip to the standby position, that is, the standby mechanism 32, and makes the standby mechanism stand by. At this time, the substrate 22C on which the third grade chip 21 should be mounted is arranged at the bonding position (that is, on the shuttle 30 arranged at the bonding position).

Then, the third grade chip 21 is mounted (bonded) on the substrate 22C, and the substrate 22C on which the chip 21 has been mounted is moved to the carry-out mechanism 34 (by moving the shuttle 30 to the carry-out mechanism 34). It is supplied to the unloader 11 via.

Further, if the third grade chip 21 disappears from the wafer 26 and the wafer 26 has the fourth grade chip 21 even though the mounting of the third grade chip 21 has not been completed. The substrate 22C is conveyed to the standby position, that is, the standby mechanism 32 by the upstream transfer mechanism 31 and is made to stand by. At this time, the substrate 22C on which the fourth grade chip 21 should be mounted is arranged at the bonding position.

Then, the fourth grade chip 21 is mounted (bonded) on the substrate 22D, and the substrate 22D on which the chip 21 has been mounted is transferred to the carry-out mechanism 34 (by moving the shuttle 30 to the carry-out mechanism 34). It is supplied to the unloader 11 via.

When the fourth grade chip 21 on the substrate 22D is lost on the wafer 26, if the steps are sequentially performed, all the chips 21 on the wafer 26 are lost. Therefore, the new wafer 26 will be supplied to the pickup position.

When the substrate 22A is on the standby mechanism 32, since the mounting of the chip 21 on the substrate 22A is not completed, the substrate 22A is supplied from the standby mechanism 32 to the shuttle 30 at the bonding position via the upstream transfer mechanism 31. Then, the first grade chip 21 is bonded to the remaining island portion 22a. Then, the board 22A on which the chip 21 has been mounted is carried out to the unloader 11. Further, if the first grade chip 21 disappears, the substrate 22A will be transported to the standby mechanism 32, and if the first grade chip 21 is on the wafer 26, the next substrate 22A will be supplied to the pickup position. become.

Further, when the first grade chip 21 disappears and the substrate 22B is on the standby mechanism 32, the chip 21 has not been mounted on the substrate 22B, so that the substrate 22B is transferred from the standby mechanism 32 to the upstream transfer mechanism 31. The second grade chip 21 is bonded to the remaining island portion 22a by supplying the shuttle 30 to the shuttle 30 at the bonding position. Then, the board 22B on which the chip 21 has been mounted is carried out to the unloader 11. Further, if the second grade chip 21 disappears, the substrate 22B will be conveyed to the standby mechanism 32, and if the second grade chip 21 is present, the next substrate 22B will be supplied to the pickup position.

Further, when the second grade chip 21 disappears and the substrate 22C is on the standby mechanism 32, the chip 21 has not been mounted on the substrate 22C, so that the substrate 22C is transferred from the standby mechanism 32 to the upstream transfer mechanism 31. It is supplied to the shuttle 30 at the bonding position via the above, and the third grade chip 21 is bonded to the remaining island portion 22a. Then, the board 22C on which the chip 21 has been mounted is carried out to the unloader 11. Further, if the third grade chip 21 disappears, the substrate 22C will be conveyed to the standby mechanism 32, and if there is a third grade chip 21, the next substrate 22C will be supplied to the pickup position.

Further, when the third grade chip 21 disappears and the substrate 22D is on the standby mechanism 32, the chip 21 has not been mounted on the substrate 22D, so that the substrate 22D is transferred from the standby mechanism 32 to the upstream transfer mechanism 31. It is supplied to the shuttle 30 at the bonding position via the above, and the fourth grade chip 21 is bonded to the remaining island portion 22a. Then, the board 22D on which the chip 21 has been mounted is carried out to the unloader 11. Further, if the fourth grade chip 21 disappears, the substrate 22D will be conveyed to the standby mechanism 32, and if the fourth grade chip 21 is present, the next substrate 22D will be supplied to the pickup position.

By performing such an operation, as in the above embodiment shown in FIG. 1 and the like, it is possible to utilize the remaining number of works for each grade in the work supply source (work aggregate) and the remaining number of supplied parts of the supplied member. .. It can be used regardless of whether the work grade is one type or multiple types. In addition, the transport mechanism can be a simple lane, and there are multiple shuttles.

In particular, by arranging the standby mechanism 32 on the loader side, the stage can be arranged on this standby position, and further, the retracted position of the shuttle 30 can be provided at a position below the preheating stage. Therefore, as shown in FIG. 2, the device in which the standby mechanism 32 is arranged on the loader side can make the distance between the loader 10 and the unloader 11 smaller than the device in which the standby mechanism 32 is arranged on the unloader side. It can be made compact as a whole.

Further, the chuck members 81 and 82 hold the side side portion (long side portion) of the substrate 22, and the chuck length can be increased, so that each substrate 22 can be easily maintained in a planar shape. , It can be stably adhered to the upper surface 28 of the shuttle 30, and the bonding work is stable.

By the way, in the above-described embodiment, the unloader 11 and the standby mechanism 32 are arranged on the transport line 100 (see FIG. 2). However, as shown in FIG. 24, either the unloader 11 or the standby mechanism 32 may be arranged on the transport line 100.

That is, in this case, as shown in FIG. 25, on the downstream side of the transport line 100, the standby mechanism 32 is arranged on the transport line 100 (state of FIG. 26B) and the unloader 11 is on the transport line 100. The switching mechanism 101 for switching from the state arranged in (the state of FIG. 26A) is provided. The switching mechanism 101 can be configured by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a motor linear mechanism, and an XYZ axis stage (stage device) can be used.

As described above, in the case of the one provided with the switching mechanism 101, it is not necessary to arrange the unloader 11 and the standby mechanism 32 on the transport line 100, the transport line 100 can be set short, and the device can be made compact.

The present invention is not limited to the above embodiment, and various modifications can be made. For example, as the supplied member S to be conveyed, in the above embodiment, the substrate 22 for bonding the chip 21 cut out from the wafer 26 is used. However, instead of such a substrate 22, a card such as a credit card, a cash card, an IC card, or a flat plate such as a sheet metal may be used. Therefore, the work W supplied to the supplied member S is not limited to the chip 21, but is a component corresponding to the supplied member S. Further, if the supplied member S is not the substrate 22 and does not require heating, the heating mechanism of the preheating stage and the shuttle can be omitted.

10, 10A, 10B, 10C Loader 11, 11A, 11B, 11C Unloader 12 Supply position 21 Chip 22, 22A, 22B, 22C Board 22a Irad part 26 Wafer 30 Shuttle 31 Upstream side transfer mechanism 32 Standby mechanism 33 Downstream side transfer mechanism 34 Carrying out mechanism 38 Heating mechanism 39 Suction mechanism 42 Preheating stage 45 Shuttle reciprocating mechanism 46 Storage shelf 47 Elevating mechanism 48 Sending mechanism 51, 52 Chuck member 54 Vertical movement mechanism 55 1st horizontal movement mechanism 56 2nd vertical movement mechanism 57 2nd Horizontal movement mechanism S Supply member Sa Supply part W Work

Claims (13)

In order to supply multiple types of workpieces of different grades to the supplied parts of the supplied members for each grade, each supplied member is transported to the supply position between the loader and the unloader, and the workpieces have been mounted. A transport device that carries out members to the unloader.
A shuttle arranged at the supply position, an upstream transfer mechanism for transporting the supplied member from the loader side to the shuttle at the supply position, and a standby mechanism arranged between the supply position and the unloader on the transfer line . A downstream transfer mechanism that can transport the supplied member from the shuttle in the supply position to the standby mechanism and return the supplied member from the standby mechanism to the shuttle in the supply position, and the supplied member for which the work has been mounted. Equipped with a unloading mechanism to unload from the standby mechanism to the unloader, the supplied member whose work has not been mounted is supplied to the standby mechanism, and only the supplied member whose work has been mounted is carried out to the unloader to carry out the work. A transport device characterized in that when a supplied member that has not been mounted is supplied to the standby mechanism, the work can be mounted on another supplied member at the supply position . The transport device according to claim 1 , further comprising a shuttle reciprocating mechanism for reciprocating the shuttle in the transport direction in the supply position. The transport device according to claim 1 or 2 , wherein the standby mechanism includes a storage shelf for vertically storing a plurality of supplied members and an elevating mechanism for raising and lowering the storage shelf. The upstream transfer mechanism is a pair of chuck members that chuck the supplied member, a vertical motion mechanism that moves the pair of chuck members up and down, and a pair of chuck members in the transport direction between the loader and the unloader. The transport device according to any one of claims 1 to 3 , further comprising a reciprocating mechanism for performing the reciprocating motion. The transport device according to any one of claims 1 to 4 , further comprising a delivery mechanism for delivering the supplied member from the loader and a stage for receiving the supplied member transmitted from the loader. .. The transport device according to any one of claims 1 to 5 , wherein the shuttle has a suction mechanism that sucks the supplied member on the entire surface. The transport device according to any one of claims 1 to 6 , wherein the shuttle has a heating mechanism for heating the supplied member. The transfer device according to claim 7 , wherein a preheating stage for applying preheating to the supplied member is provided on the loader side of the supply position. 1 . The transport device according to any one of claims 8 . The work is a chip of a wafer, and the supplied member is a substrate serving as an island portion which is a supplied portion thereof, and is supplied by using the transport device according to any one of claims 1 to 9 . A die bonder characterized in that chips are sequentially bonded to the island portion of the substrate that has been conveyed to the bonding position, which is the position. In order to supply multiple types of workpieces of different grades to the supplied parts of the supplied members for each grade, each supplied member is transported to the supply position between the loader and the unloader, and the workpieces have been mounted. It is a transportation method to carry out the member to the unloader.
The supplied member is transported from the loader to the supply position, the supplied member for which the work has been mounted is carried out to the unloader, and the work of the grade to be supplied from the work supply source disappears before the work has been mounted on the supplied member. For example, this supplied member is transported from the shuttle to a standby position provided between the supply position and the unloader on the transfer line, and is transferred to the empty supply position on the upstream side of the supply position. A transport method characterized by transporting other supplied members from a loader . With the work of the grade to be supplied to the work supply source, the work to be supplied that had been waiting in the standby position is returned to the supply position, and the work of the grade to be supplied to the supplied part of the returned member to be supplied. 11. The transport method according to claim 11 . The work is a chip of a wafer, and the supplied member is a substrate serving as an island portion which is a supplied portion thereof, and has been transported to a bonding position by using the transport method according to claim 11 or 12 . A bonding method characterized by sequentially bonding chips to the island portion of the substrate.

Images