TW202416427A - Die bonding apparatus - Google Patents

Abstract

The present invention provides a die bonding apparatus including an inspection unit. The die bonding apparatus according to the present invention includes an unload module. The unload module comprises an inspection unit, to perform an inspection process on a substrate bonded with a die; and an unload magazine unit, for recovering the substrate which has completed the bonding and inspection processes, and the inspection unit is configured above one side of the unload magazine unit.

Description

Die bonding equipment

The present invention relates to a die bonding device.

Generally, semiconductor devices are formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of processes. The wafer on which the semiconductor devices are formed can be cut into a plurality of dies by a dicing process, and the dies singulated by the dicing process can be bonded to a substrate such as a lead frame by a die bonding process.

However, recently, in order to manufacture semiconductor packages using a stacking method using through silicon vias (TSV), a wafer-level bonding process and device for directly bonding the singulated dies to a wafer on which semiconductor elements are formed is required. As an example, a device for picking up semiconductor dies stored in a tray and bonding them to a wafer is disclosed, and a device for picking up singulated dies from a frame wafer including dies singulated by a dicing process and bonding them to a wafer is disclosed.

Generally, a die can be pressed onto a wafer using a bonding tool by heating and pressurizing. However, the hot pressing of the die takes a long time, and thus there is a need for improvement. In particular, a separate device is required to check whether the die is properly bonded onto the wafer after the bonding process is completed, which leads to disadvantageous problems in terms of space occupied and productivity, and thus there is a need for improvement.

The present invention provides a new type of die bonding device that can improve the processing throughput per unit time and does not require a separate inspection device.

In addition, the present invention provides a new type of die bonding device which is advantageous in terms of space occupied by the bonding process and productivity.

The purpose of the present invention is not limited to the above-mentioned purpose, and other purposes and advantages of the present invention not mentioned can be understood through the following description.

According to one embodiment of the present invention, a die bonding device is provided, comprising: a die supply module, which supplies the die to be bonded to the substrate; at least one bonding module, which is used to pick up the die in sequence according to the process and bond the die to the substrate; at least one loading module, which supplies the substrate to the bonding module; at least one unloading module, which recovers and discharges the substrate to which the die is bonded by the bonding module; and at least one substrate transfer unit, which transfers the substrate between the loading module and the unloading module. The unloading module comprises: an inspection unit, which performs an inspection process on the substrate to which the die is bonded; and an unloading magazine unit, which is used to recover the substrate after the die bonding and inspection process are completed, and the unloading magazine unit is arranged between the bonding module and the inspection unit.

In one embodiment, the inspection unit includes: an inspection device for inspecting a substrate with a die bonded thereto; an inspection plate for supporting the substrate with the die bonded thereto; and a transport plate for supporting the substrate with the die bonded thereto.

In one embodiment, the transfer plate may load the substrate to which the die is bonded onto the inspection plate and may unload the substrate to which the die is bonded from the inspection plate.

In one embodiment, the inspection plate supplies air toward the substrate to which the die is bonded, thereby supporting the substrate in a state where the substrate is floated a certain distance from the inspection plate.

In one embodiment, the inspection plate may be held by vacuum suction.

In one embodiment, the transport plate may move left and right and up and down, and the inspection plate may move the substrate horizontally including in a rotational direction.

In one embodiment, the inspection device includes a visual part and a sensor part for inspecting the thickness and state of the substrate to which the die is bonded.

In one embodiment, the unloading magazine unit transfers the substrate with the die bonded thereto to the inspection unit and discharges the substrate unloaded from the inspection unit. In addition, the substrate with the die bonded thereto or the substrate unloaded from the inspection unit is temporarily stored.

On the other hand, the number of the joining modules may be plural.

According to one embodiment of the present invention, a discharging module for recovering and discharging a substrate with a die bonded thereto in a die bonding device is provided. The discharging module comprises: an inspection unit for performing an inspection process on the substrate with a die bonded thereto; and a die discharging magazine unit for recovering the substrate after the die bonding and inspection process are completed, and the inspection unit is disposed above one side of the discharging magazine unit.

The die bonding device according to the embodiment of the present invention may include: a bonding module for bonding a die on a wafer; a loading module for loading a substrate on the bonding module; and an unloading module for recovering the substrate bonded with the die. In particular, an inspection unit for inspecting the substrate after the bonding process is arranged in the unloading module, thereby greatly improving the efficiency of the die bonding process and the bonding inspection process.

That is, after the die bonding process is completed, the bonding inspection process is continuously performed and then unloaded, so a separate inspection device for the inspection process is not required, and the time required to transfer the substrate to the separate inspection device can be shortened.

In addition, the inspection device which is independently constructed may be constructed inside the die bonding device, thereby reducing the installation area of the equipment and minimizing and optimizing the occupied space.

The effects of the present invention are not limited to the above-mentioned effects, and a person having ordinary knowledge in the technical field to which the present invention belongs can clearly understand unmentioned or other effects from the following description.

Hereinafter, with reference to the attached drawings, embodiments of the present invention are described in detail so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different forms and is not limited to the embodiments described here.

In order to clearly explain the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same drawing marks throughout the specification.

In addition, in a plurality of embodiments, components having the same structure are denoted by the same reference numerals and described only in a representative embodiment, and in other embodiments, only the structure different from the representative embodiment is described.

Throughout the specification, when any part is “connected (or coupled)” to another part, it includes not only the case of “directly connected (or coupled)” but also the case of “indirectly connected (or coupled)” via other parts. In addition, when any part “includes” any constituent element, it means that other constituent elements may be included rather than excluded unless there is a special description to the contrary.

Unless otherwise defined, all terms used herein, including technical terms or scientific terms, have the same meanings as those commonly understood by persons skilled in the art to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having the same meanings as the contextual meanings of the relevant technology, and should not be interpreted as idealized or overly formalized meanings unless explicitly defined in this application.

FIG. 1 is a schematic diagram of a die bonding device according to an embodiment of the present invention. FIG. 2 to FIG. 5 schematically illustrate the structure of the die bonding device according to an embodiment of the present invention. FIG. 2 and FIG. 3 illustrate the structure of the die bonding device 100, FIG. 4 schematically illustrates the structure of the die ejection device, and FIG. 5 illustrates the process of bonding the die 20 to the substrate 30 after separating the die 20 from the wafer 10.

The die bonding apparatus 100 according to an embodiment of the present invention can be used to perform a bonding process of bonding a die to a substrate. In particular, the die bonding apparatus 100 according to an embodiment of the present invention has an inspection unit 200 disposed inside the unloading module 170, so that the substrate on which the die bonding is completed can be inspected immediately after the bonding process is completed in the bonding module 160, and the installation area of the equipment can be reduced.

The die bonding device 100 can be used to bond a die 20 to a substrate 30 (e.g., a printed circuit board (PCB), a lead frame) in a die bonding process for manufacturing a semiconductor package. The die bonding device 100 according to an embodiment of the present invention may include: a die supply module for supplying the die 20 to be bonded to the substrate 30; and a bonding module 160 for picking up the die according to a recipe and bonding it to the substrate 30.

1 , the die bonding apparatus 100 includes a loading module 150 , a bonding module 160 , and an unloading module 170 including an inspection unit 200 .

As an example, the die bonding apparatus 100 can pick up the die 20 from the wafer 10 including the die 20 singulated by the dicing process and bond the die 20 on the substrate 30. The wafer 10 can be provided in a state of being attached to the dicing tape 12, and the dicing tape 12 can be mounted on a substantially circular ring-shaped mounting frame 14.

The die supply module may pick up the die 20 to be bonded from the dicing tape 12 and transfer the die 20 to the bonding module 160 .

The die supply module may include: a loading port 102 for supporting a wafer box 50 containing multiple wafers 10; a wafer transfer unit 104 for taking out the wafer 10 from the wafer box 50 and loading it on a wafer stage 110 described later; and a guide rail 106 for guiding the wafer 10 between the wafer box 50 and the wafer stage 110.

If a cassette 50 containing a plurality of wafers 10 is placed in the loading port 102 , the wafer transfer unit 104 takes out the wafers 10 from the cassette 50 and loads them onto the wafer stage 110 , and the wafer transfer unit 104 can move along a guide rail 106 disposed between the cassette 50 and the wafer stage 110 .

In addition, the die supply module may include: a wafer stage 110, which supports the wafer and selectively separates the die 20; a die ejection unit 116, which selectively separates the die 20 from the wafer stage 110; a die transfer unit 120, which transfers the die 20 from the wafer stage 110; and a die stage 124, which places the die 20 transferred by the die transfer unit 120 and performs inspection on the die 20.

As shown in FIG4 , a circular expansion ring 112 may be disposed on the wafer stage 110, and the expansion ring 112 may support the edge of the dicing tape 12. In addition, a clamp 114 for holding the mounting frame 14 and a clamp driving unit (not shown) for lowering the clamp 114 to expand the dicing tape 12 while the expansion ring 112 supports the dicing tape 12 may be disposed on the wafer stage 110.

Although not shown, the wafer stage 110 can be configured to be movable in the horizontal direction by a loading stage driving unit (not shown), and the loading stage driving unit can move the wafer stage 110 to a wafer loading/unloading area adjacent to the end of the guide rail 106 for loading and unloading the wafer 10. In addition, the loading stage driving unit can move the wafer stage 110 to selectively pick up the die 20. That is, the loading stage driving unit can adjust the position of the wafer stage 110 so that the die 20 to be picked up among the die 20 is located above the die ejection unit 116.

5 , the die 20 separated by the die ejection unit 116 may be picked up by the die transfer unit 120 disposed above the wafer stage 110. After the die transfer unit 120 picks up the die 20, it may transfer the die 20 to a die stage 124 disposed on one side of the wafer stage 110.

The bonding module 160 can pick up the die 20 on the die stage 124 and bond it to the substrate 30. According to an embodiment of the present invention, the bonding module 160 may include a bonding head 130 for picking up the die 20 transferred to the die stage 124 and bonding it to the substrate 30. On the other hand, a first visual unit 115 for identifying the position of each die 20 in the wafer 10 may be arranged above the wafer stage 110, a second visual unit 125 for checking the state of the die 20 may be arranged above the die stage 124, and a third visual unit 135 for confirming the bonding position may be arranged above the bonding stage B.

In addition, the bonding module 160 may include: a first head driving unit 132, which moves the bonding head 130 in a direction perpendicular to the first horizontal direction (e.g., the X-axis direction) to pick up the die 20 on the die stage 124 and bond it to the substrate 30; and a second head driving unit 134, which moves the bonding head 130 between the die stage 124 and the bonding stage B along a second horizontal direction perpendicular to the first horizontal direction (e.g., the Y-axis direction). Although not shown in detail, the bonding head 130 may include: a bonding tool for picking up the die 20 using vacuum pressure; and a heater for heating the die 20. The bonding head 130 may pick up the die 20 on the die stage 124 and bond it to the substrate 30. In addition, the bonding head 130 may also pick up the die 20 from the wafer 10 and bond it immediately to the substrate 30.

On the other hand, a camera may be disposed above the bonding stage B. The camera captures the physical mark on the substrate 30 and the area to be bonded with the die 20 in order to adjust the position of the substrate 30, i.e., align the substrate 30.

On the other hand, a loading module 150 for supplying the substrate 30 to the bonding area may be configured on one side of the bonding module 160, and an unloading module 170 for recovering the substrate 30 after the bonding process is completed from the bonding area may be configured on the other side of the bonding module 160.

The substrate 30 can be taken out from the loading box 40 of the loading module 150 and transferred to the bonding area for forming the die bonding process. After completing the bonding process, it can be transferred to the inspection unit 200 of the unloading module 170 and after completing the inspection process, it is transferred to the unloading box 42 and stored.

The loading module 150 , the bonding module 160 , and the unloading module 170 may be arranged side by side in a row, and the substrate 30 may be transferred from the loading module 150 to the bonding module 160 , and then transferred from the bonding module 160 to the unloading module 170 , through the substrate transfer unit 140 .

That is, the die bonding apparatus 100 includes a substrate transfer unit 140 for transferring the substrate 30. The substrate transfer unit 140 may include: a guide rail 142 for guiding the substrate 30 between the loading magazine 40 and the bonding area and between the inspection unit 200 and the unloading magazine 42; a clamp 144 for holding one side end of the substrate 30; and a clamp driving unit 146 for moving the clamp 144 in the horizontal direction (X-axis direction). The clamp driving unit 146 can move the clamp 144 and load the substrate 30 onto the bonding station B after holding one side end of the substrate 30 by the clamp 144. Although not shown, the substrate transfer unit 140 may further include a second clamp (not shown) for moving the substrate 30 to the unloading module 170 after the bonding process is completed.

Referring again to FIG. 2 and FIG. 3 , the loading module 150 may include a loading box unit, which may include: a box loading port 152 for supporting a loading box 40 containing multiple substrates; a loading box operating robot 154 for moving the loading box 40 in the vertical and horizontal directions to transfer the substrate 30 to the substrate transfer unit 140; and a loading box transfer unit 156 for transferring the loading box 40 in a second horizontal direction, such as the Y-axis direction, between the box loading port 152 and the loading box operating robot 154. Buffers 153 and 155 for temporarily storing boxes containing multiple substrates to be supplied to the bonding module may be provided above the box loading port 152.

The unloading module 170 may include: an inspection unit 200 for inspecting the substrate 30 that has completed the die bonding process; and an unloading material box unit for storing the substrate 30 that has completed the bonding inspection process.

The unloading material box unit may include: a material box unloading port 172 for supporting the unloading material box 42; an unloading material box operating robot 174 for receiving and storing the substrate 30 that has completed the die bonding process and the inspection process from the substrate conveying unit 140, so as to move the unloading material box 42 in the vertical and horizontal directions; and an unloading material box conveying unit 176 for conveying the unloading material box 42 in the Y-axis direction and the Z-axis direction between the material box unloading port 172 and the unloading material box operating robot 174. The inspection unit 200 may be disposed above the unloading material box unit.

The inspection unit 200 may be disposed above one side of the unloading cartridge unit. That is, when viewed from the front, the joining module 160, the unloading cartridge unit, and the inspection unit 200 are arranged in a row. In other words, the unloading cartridge unit is disposed between the joining module 160 and the inspection unit 200.

The inspection unit 200 may include an inspection device, an inspection plate 242 , and a transport plate 244 .

As an example, the inspection device may include: a visual part 210 for inspecting the bonding thickness (Bond Level Thickness; BLT) of a substrate bonded with a die; a sensor part 220 for inspecting the bonding state (Post Bond Inspection; PBI); and a moving part 230 provided to support the visual part 210 and the sensor part 220 and to be movable. As an example, the visual part 210 and the sensor part 220 may be mounted side by side on the moving part 230. The moving part 230 may be movable in a vertical or horizontal direction above an inspection plate 242 described later, so that an inspection process may be performed on the entire area of the substrate. For example, the moving part 230 may be provided to be able to horizontally move an area corresponding to the entire area of the inspection plate 242 above the inspection plate 242. In addition, the moving member 230 may be provided so as to be able to move vertically in a direction approaching or separating from the inspection plate 242. On the other hand, the inspection of cracks and particles on the substrate can also be performed through the visual unit 210.

The inspection plate 242 can be used as a structure for supporting the substrate 30 to which the die is bonded in order to perform an inspection process, and is configured to support the substrate below the inspection device and be able to move horizontally. The inspection plate 242 can include an air supply hole for supplying air toward the substrate to which the die is bonded. The inspection plate 242 can supply air toward the substrate to which the die is bonded so as to transport the substrate in a state where the substrate is floated from the inspection plate 242 by a certain distance. As an example, in order to prevent friction and wear that can be generated when the substrate contacts the inspection plate 242 when loading or unloading the substrate on the inspection plate 242, the structure described above can be used. By lifting the substrate 30 from the inspection plate 242 by a certain distance and supporting it, friction and wear that may be generated during the transportation of the substrate 30 can be prevented.

The inspection plate 242 can be provided to be able to move horizontally including the rotation direction in one side of the unloading magazine unit. For example, the inspection plate 242 can be driven in the X-axis direction and the Y-axis direction and rotated to a certain angle.

The transport plate 244 is a structure for loading and unloading the substrate with the die bonded thereto on and from the inspection plate 242. The inspection plate 242 can enter and exit the space created by floating the substrate 30 in the air, thereby loading and unloading the substrate 30 with the die bonded thereto on and from the inspection plate 242. The transport plate 244 can be provided in the form of a clamp that absorbs and holds the substrate under the substrate using vacuum pressure.

The transport plate 244 can be configured to be movable in the X-axis direction and the Z-axis direction, so that the substrate with the die bonded thereto received from the unloading magazine unit is loaded on the inspection plate 242, and the substrate that has completed the inspection process is unloaded from the inspection plate 242 and transferred to the unloading magazine unit. The transport plate 244 can be moved in the X-axis direction by the X-axis driving component 241 disposed along the X-axis direction of the unloading module 170.

The unloading magazine unit that receives the substrate that has completed the inspection process from the transfer plate 244 can discharge the substrate that has completed all the bonding processes and the inspection process to the outside of the die bonding apparatus.

6 and 7 schematically illustrate a die bonding device according to another embodiment of the present invention.

Different from the above, the bonding module can be set to multiple. At this time, except for the increase in the number of loading modules and bonding modules, unloading modules and substrate transfer units, the structure is the same as the embodiment described above, so the detailed description of the same structure is omitted.

FIG6 and FIG7 illustrate that the number of the bonding modules is two. Although FIG6 and FIG7 illustrate that the number of the bonding modules is two, this is only an example and is not intended to limit the number of bonding modules. The number of loading modules, unloading modules and substrate transfer units can be set to be the same as the number of bonding modules.

According to another embodiment of the present invention, the die bonding device 100 may include a loading box unit and an unloading box unit. The loading box unit includes a first box loading port 152a, a first loading box operating robot 154a, a second box loading port 152b, and a second loading box operating robot 154b, and the unloading box unit includes a first box unloading port 172a, a first unloading box operating robot 174a, a second box unloading port 172b, and a second unloading box operating robot 174b. At this time, the first box loading port 152a supports the first loading box 40, the second box loading port 152b supports the second loading box 44, the first box unloading port 172a supports the first unloading box 42, and the second box unloading port 172b supports the second unloading box 46.

The first substrate S1 taken out from the first loading box 40 can be transferred to the unloading module 170 with the die bonded thereto by the first clamp 144a along the first guide rail 142a through the bonding area, and the second substrate S2 taken out from the second loading box 44 can be transferred to the unloading module 170 with the die bonded thereto by the second clamp 144b along the second guide rail 142b through the bonding area.

The first substrate S1 and the second substrate S2 with the die bonded thereto and transferred to the unloading module 170 may be carried into the inspection unit 200 via the unloading magazine unit, and then carried into the unloading magazine unit again to be stored in the first unloading magazine 42 and the second unloading magazine 46 , respectively.

When the bonding module 160 is provided in multiple numbers, the guide rail 142 is also provided in multiple numbers. However, the die bonding device according to the embodiment of the present invention can accommodate the substrates on the entire guide rail because the unloading material box conveying unit 176 and the inspection plate 242 and the transport plate 244 of the inspection unit 200 are all provided to be movable in the Y-axis direction. In addition, the unloading material box unit is configured to be able to temporarily store the substrate, thereby preventing the occurrence of logistics standby. According to the present invention, the unloading material box unit and the inspection unit 200 can be configured to be able to transport the substrate in both directions (loading and unloading), so that logistics simplification can be achieved without a separate buffer and a pick-up plate drive shaft.

As described above, the die bonding apparatus according to the present invention has a form in which the inspection device is built into the unloading module. Thus, the inspection process for the bonded substrate is continuously performed after the bonding process, which is very advantageous in terms of process time and productivity, and also has a very advantageous effect in terms of equipment occupation space by setting the independently constructed inspection device inside the bonding apparatus.

In addition, when a substrate with a bonded die is loaded onto or unloaded from the inspection unit 200, the substrate can be transported in a non-contact manner using air levitation, thereby preventing friction and wear and preventing particle problems. The inspection plate 242 is configured to be movable in all horizontal directions, and multiple bonding modules can also be configured to not cause logistics losses. The unloading box unit and the inspection unit 200 are configured to be able to load and unload substrates in both directions, thereby achieving high productivity through a simple logistics structure without the need for additional settings.

The above detailed description illustrates the present invention. In addition, the foregoing content depicts and illustrates the preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, changes or modifications can be made within the scope of the invention concept disclosed in this specification, the scope equal to the described disclosure, and/or the scope of technology or knowledge in this field. The embodiments described illustrate the best state for realizing the technical concept of the present invention, and various changes required for the specific application fields and uses of the present invention can also be made. Therefore, the above detailed description of the invention is not intended to limit the present invention to the disclosed implementation state. In addition, the attached patent application scope should be interpreted as also including other implementation states.

10: Wafer 12: Cutting tape 14: Mounting frame 20: Die 30: Substrate 40: First loading box 42: First unloading box 44: Second loading box 46: Second unloading box 50: Wafer box 100: Die bonding device 102: Loading port 104: Wafer transfer unit 106: Guide rail 110: Wafer stage 112: Extension ring 114: Clamp 115: First vision unit 116: Die ejection unit 120: Die transfer unit 124: Die stage 125: Second vision unit 130: Bonding head 132: First head drive unit 134: Second head drive unit 135: Third visual unit 140: Substrate transfer unit 142: Guide rail 142a: First guide rail 142b: Second guide rail 144: Clamp 144a: First clamp 144b: Second clamp 146: Clamp drive unit 150: Loading module 152: Material box loading port 152a: First material box loading port 152b: Second material box loading port 153: Buffer platform 154: Loading material box operation robot 154a: First loading material box operation robot 154b: Second loading material box operation robot 155: Buffer platform 156: Loading box conveying unit 160: Joining module 170: Unloading module 172: Box unloading port 172a: First box unloading port 172b: Second box unloading port 174: Unloading box operation robot 174a: First unloading box operation robot 174b: Second unloading box operation robot 176: Unloading box conveying unit 200: Inspection unit 210: Vision unit 220: Sensor unit 230: Moving part 241: Driving part 242: Inspection board 244: Transport board B: Joining station S1: First substrate S2: Second substrate

FIG. 1 is a schematic diagram showing the structure of a die bonding device according to an embodiment of the present invention.

FIG. 2 is a schematic structural diagram for illustrating an unloading module and a die bonding device including the unloading module according to an embodiment of the present invention.

FIG. 3 is a schematic plan view for explaining the bonding module shown in FIG. 2 .

FIG. 4 is a schematic structural diagram for explaining the wafer platform and die ejection unit shown in FIG. 3 .

FIG. 5 schematically illustrates the bonding process of the bonding module according to FIG. 3 .

6 and 7 are diagrams for explaining a die bonding device according to another embodiment of the present invention.

40: First loading box

42: First unloading box

100: Die bonding device

150: Loading module

152: Material box loading port

153: Buffer station

155: Buffer station

160:Joint module

170: Uninstall module

172: Material box unloading port

210: Visual Department

220: Sensor unit

230: Moving parts

241: Driving parts

242: Inspection board

244: Transport board

Claims (20)

A unloading module is used to recover and discharge a substrate bonded with a die in a die bonding device. The unloading module includes: an inspection unit for performing an inspection process on the substrate bonded with the die; and an unloading material box unit for recovering the substrate after the die bonding and inspection process are completed. The inspection unit is arranged above one side of the unloading material box unit. The unloading module as described in claim 1, wherein, the inspection unit comprises: an inspection device for inspecting the substrate to which the die is bonded; an inspection plate for supporting the substrate to which the die is bonded; and a transport plate for supporting the substrate to which the die is bonded. The unloading module as described in claim 2, wherein, the transport plate loads the substrate bonded with the die onto the inspection plate and unloads the substrate bonded with the die from the inspection plate. The unloading module as described in claim 3, wherein the inspection plate supplies air toward the substrate to which the die is bonded, thereby supporting the substrate in a state where the substrate is floated a certain distance from the inspection plate. The unloading module as described in claim 4, wherein the transport plate holds the inspection plate by vacuum adsorption. The unloading module as described in claim 5, wherein, the transport plate moves left and right and moves up and down, and the inspection plate causes the substrate to move horizontally including in a rotational direction. The unloading module as described in claim 2, wherein, the inspection device comprises: a visual part and a sensor part for inspecting the thickness and state of the substrate to which the die is bonded. The unloading module as described in claim 1, wherein, the unloading magazine unit transfers the substrate bonded with the die to the inspection unit, and discharges the substrate unloaded from the inspection unit. A die bonding device comprises: a loading module for supplying a substrate; a bonding module for bonding a die to the substrate; and an unloading module for recovering and discharging the substrate bonded with the die, the unloading module comprises: an inspection unit comprising an inspection device for performing an inspection process on the substrate bonded with the die; and an unloading material box unit for recovering the substrate after the die bonding and inspection process are completed, the unloading material box unit is arranged between the bonding module and the inspection unit. The die bonding device as described in claim 9, wherein, the inspection unit comprises: the inspection device for inspecting the substrate bonded with the die; an inspection plate for supporting the substrate bonded with the die; and a transport plate for supporting the substrate bonded with the die. The die bonding device as described in claim 10, wherein, the transport plate loads the substrate bonded with the die received from the unloading magazine unit onto the inspection plate, and unloads the substrate bonded with the die after inspection from the inspection plate. The die bonding device as described in claim 11, wherein, the inspection plate supplies air toward the substrate bonded with the die to support the substrate in a state where the substrate is floated a certain distance from the inspection plate, and the transport plate holds the substrate bonded with the die by vacuum adsorption. The die bonding device as described in claim 10, wherein, the bonding module is provided in multiple numbers, the transport plate moves left and right and moves up and down, the inspection plate moves horizontally including in a rotational direction. The die bonding device as described in claim 10, wherein, the inspection device comprises: a visual part and a sensor part, for inspecting the thickness and state of the substrate to which the die is bonded. The die bonding device as described in claim 9, wherein, the unloading magazine unit transfers the substrate bonded with the die received from the bonding module to the inspection unit, discharges the substrate unloaded from the inspection unit, and temporarily stores the substrate bonded with the die or the substrate unloaded from the inspection unit. A die bonding device comprises: a die supply module for supplying the die to be bonded on a substrate; at least one bonding module for picking up the die in sequence according to a process and bonding the die on the substrate; at least one loading module for supplying the substrate to the bonding module; at least one unloading module for recovering and discharging the substrate bonded with the die by the bonding module; and at least one substrate conveying unit for conveying the substrate between the loading module and the unloading module, the unloading module comprises: an unloading magazine unit for recovering the substrate after the die bonding and inspection process is completed, the unloading magazine unit is arranged between the bonding module and the inspection unit. The die bonding device as described in claim 16, wherein, the inspection unit comprises: an inspection device for inspecting the substrate bonded with the die; an inspection plate for supporting the substrate bonded with the die; and a transport plate for supporting the substrate bonded with the die. The die bonding device as described in claim 17, wherein, the transport plate loads the substrate bonded with the die received from the unloading magazine unit onto the inspection plate, and unloads the substrate after inspection from the inspection plate. The die bonding device as described in claim 18, wherein, the inspection plate supplies air toward the substrate bonded with the die to support the substrate in a state where the substrate is floated a certain distance from the inspection plate, and the transport plate holds the substrate bonded with the die by vacuum adsorption. The die bonding device as described in claim 16, wherein, the unloading magazine unit transfers the substrate bonded with the die received from the substrate conveying unit to the inspection unit, discharges the substrate unloaded from the inspection unit, and temporarily stores the substrate bonded with the die or the substrate unloaded from the inspection unit.