TW202416393A - Die bonding apparatus - Google Patents

Abstract

The present invention provides a die bonding apparatus including an inspection unit. According to the present invention, the die bonding apparatus includes an unloading module; the unloading module includes an inspection unit, an unloading magazine unit and a pickup robot. The inspection unit performs an inspection process on a substrate of a bonded die. The unloading magazine unit is configured under the inspection unit and configured to retrieve the substrate that the die bonding and the inspection processes are completed. The pickup robot transfers the substrate between the inspection unit and the unloading magazine unit.

Description

Die bonding equipment

The present invention relates to a die bonding device.

Generally, semiconductor devices are formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed can be divided into a plurality of dies by a dicing process, and the dies singulated by the dicing process can be bonded to a substrate such as a lead frame by a die bonding process.

However, recently, in order to manufacture semiconductor packages using a stacking method using through silicon vias (TSV), a wafer-level bonding process and device for directly bonding the singulated dies to a wafer formed with semiconductor elements are required. As an example, a device for picking up semiconductor dies stored in a tray and bonding them to a wafer is disclosed, and a device for picking up singulated dies from a frame wafer including dies singulated by a dicing process and bonding them to a wafer is disclosed.

Generally, a die can be pressed onto a wafer using a bonding tool by heating and pressurizing. However, the heat pressing of the die takes a long time, and thus there is a need for improvement. In particular, a separate device is required to check whether the die is normally bonded onto the wafer after the bonding process of the wafer is completed, which has disadvantageous problems in terms of space occupied and productivity, and thus there is a need for improvement.

The present invention provides a new type of die bonding device that can improve the processing throughput per unit time and does not require a separate inspection device.

In addition, the present invention provides a new type of die bonding device which is advantageous in terms of space occupied by the bonding process and productivity.

The purpose of the present invention is not limited to the above-mentioned purpose, and other purposes and advantages of the present invention not mentioned can be understood through the following description.

It can be that according to an embodiment of the present invention, a die bonding device is provided, comprising: a die supply module, supplying die to be bonded on a substrate; at least one bonding module, for picking up the die in sequence according to a recipe and bonding the die on the substrate; at least one loading module, supplying a substrate to the bonding module; at least one unloading module, recovering and discharging a substrate bonded with a die by the bonding module; and at least one substrate conveying unit, conveying a substrate between the loading module and the unloading module. The unloading module comprises: an inspection unit, performing an inspection process on the substrate bonded with the die; an unloading magazine unit, arranged below the inspection unit, and used to recover the substrate that has completed the die bonding and inspection process; and a picking robot, conveying the substrate between the inspection unit and the unloading magazine unit.

In one embodiment, the inspection unit includes: a plate supporting the substrate to which the die is bonded; and an inspection device disposed above the plate and inspecting the substrate to which the die is bonded.

It may be that, in one embodiment, the plate includes an adsorption pad for vacuum adsorbing the substrate.

In one embodiment, the inspection unit may further include: a driving stage provided below the plate and moving the plate. The driving stage horizontally moves the plate, and the horizontal movement includes rotational movement.

In one embodiment, the driving stage supplies air toward the plate to move the plate in a state of floating from the driving stage.

In one embodiment, the inspection device includes: a moving part, which is provided to be able to move above the plate; a visual part, which is installed on the moving part and inspects the bonding thickness of the grain; and a sensor part, which is installed on the moving part and provided on one side of the visual part and inspects the bonding state of the grain on the substrate.

It may be that, in one embodiment, the moving member moves above the plate in a horizontal direction as well as a vertical direction.

It can be that in one embodiment, the picking robot picks up the substrate that has completed the bonding process through the bonding module and transfers it to the plate. If the inspection of the substrate is completed, the substrate is picked up from the plate and transferred to the unloading box unit.

In one embodiment, when the pick-up robot transfers the substrate to the plate, the substrate is rotated 90° in a clockwise or counterclockwise direction and transferred.

In one embodiment, the bonding module is provided in plurality, and the unloading module further includes a buffer plate that provides a standby area for the substrate that has completed the inspection.

It can be that at this time, the picking robot picks up the substrate that has completed the inspection process from the plate and transfers it to the buffer plate, and picks up the substrate in the standby state from the buffer plate and transfers it to the unloading box unit.

According to one embodiment of the present invention, a discharging module for recovering a substrate with a bonded die in a die bonding device is provided. The discharging module includes: an inspection unit for performing an inspection process on the substrate with the die bonded thereto; an unloading magazine unit, disposed below the inspection unit and used to recover the substrate after the die bonding and inspection process are completed; and a picking robot for transferring the substrate between the inspection unit and the unloading magazine unit.

The die bonding device according to the embodiment of the present invention may include: a bonding module for bonding a die on a wafer; a loading module for loading a substrate into the bonding module; and an unloading module for recovering the substrate bonded with the die. In particular, an inspection unit for inspecting the substrate after the bonding process is arranged in the unloading module, thereby greatly improving the process efficiency of the die bonding process and the bonding inspection process.

That is, after the die bonding process is completed, the bonding inspection process is continuously performed and then unloaded, so a separate inspection device for the inspection process is not required, and the time required to transfer the substrate to the separate inspection device can be shortened.

In addition, the separately constructed inspection device may be disposed inside the die bonding device, thereby reducing the equipment installation area and minimizing and optimizing the occupied space.

The effects of the invention are not limited to the effects mentioned above, and a person having ordinary knowledge in the technical field to which the invention belongs can clearly understand unmentioned or other effects from the following description.

Hereinafter, with reference to the attached drawings, embodiments of the present invention are described in detail so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different forms and is not limited to the embodiments described here.

In order to clearly explain the present invention, parts that are not related to the description are omitted, and the same component symbols are attached to the same or similar components throughout the specification.

In addition, in a plurality of embodiments, components having the same structure are denoted by the same reference numerals and described only in a representative embodiment, and in other embodiments, only the structure different from the representative embodiment is described.

Throughout the specification, when any part is "connected (or coupled)" to other parts, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" via other parts. In addition, when any part "includes" any constituent element, it means that other constituent elements may be included rather than excluded unless there is a special description to the contrary.

Unless otherwise defined, all terms used herein, including technical terms or scientific terms, have the same meanings as those commonly understood by persons skilled in the art to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having the same meanings as the contextual meanings of the relevant technology, and should not be interpreted as idealized or overly formalized meanings unless explicitly defined in this application.

FIG. 1 is a schematic diagram showing a structure of a die bonding device according to an embodiment of the present invention. FIG. 2 to FIG. 5 schematically show the structure of a die bonding device according to an embodiment of the present invention. FIG. 2 and FIG. 3 show the structure of a die bonding device 100, FIG. 4 schematically shows the structure of a die ejection device, and FIG. 5 shows a process of bonding a die 20 to a substrate 30 after separating the die 20 from a wafer 10.

The die bonding apparatus 100 according to an embodiment of the present invention can be used to perform a bonding process of bonding a die to a substrate. In particular, the die bonding apparatus 100 according to an embodiment of the present invention has an inspection unit 200 disposed inside the unloading module 170, so that the substrate on which the die bonding is completed can be inspected immediately after the bonding process is completed in the bonding module 160, and the installation area of the equipment can be reduced.

The die bonding device 100 can be used to bond a die 20 to a substrate 30 (e.g., PCB (Printed Circuit Board), lead frame) in a die bonding process for manufacturing semiconductor packages. The die bonding device 100 according to an embodiment of the present invention may include: a die supply module for supplying the die 20 to be bonded to the substrate 30; and a bonding module 160 for picking up the die according to a recipe and bonding it to the substrate 30.

1 to 4 , the die bonding apparatus 100 includes a loading module 150 , a bonding module 160 , and an unloading module 170 including an inspection unit 200 .

As an example, the die bonding apparatus 100 can pick up the die 20 from the wafer 10 including the die 20 singulated by the dicing process and bond the die 20 on the substrate 30. The wafer 10 can be provided in a state of being attached to the dicing tape 12, and the dicing tape 12 can be mounted on a substantially circular ring-shaped mounting frame 14.

The die supply module can pick up the die 20 to be bonded from the dicing tape 12 and transfer the die 20 to the bonding module 160.

The die supply module may include: a loading port 102 for supporting a wafer box 50 containing multiple wafers 10; a wafer transfer unit 104 for taking out the wafer 10 from the wafer box 50 and loading it on a wafer stage 110 described later; and a guide rail 106 for guiding the wafer 10 between the wafer box 50 and the wafer stage 110.

If a cassette 50 containing a plurality of wafers 10 is placed in the loading port 102 , the wafer transfer unit 104 takes out the wafers 10 from the cassette 50 and loads them onto the wafer stage 110 , and the wafer transfer unit 104 can move along a guide rail 106 disposed between the cassette 50 and the wafer stage 110 .

In addition, the die supply module may include: a wafer table 110, which supports the wafer and selectively separates the die 20; a die ejection unit 116, which selectively separates the die 20 from the wafer table 110; a die transfer unit 120, which transfers the die 20 from the wafer table 110; and a die stage 124, which places the die 20 transferred by the die transfer unit 120 and performs inspection on the die 20.

As shown in FIG. 4 , a circular expansion ring 112 may be disposed on the wafer stage 110, and the expansion ring 112 may support the edge of the scribe tape 12. In addition, a clamp 114 for holding the mounting frame 14 and a clamp driving unit (not shown) for lowering the clamp 114 to expand the scribe tape 12 while the expansion ring 112 supports the scribe tape 12 may be disposed on the wafer stage 110.

Although not shown, the wafer stage 110 may be configured to be movable in the horizontal direction by a loading stage driving unit (not shown), and the loading stage driving unit may move the wafer stage 110 to a wafer loading/unloading area adjacent to the end of the guide rail 106 for loading and unloading the wafer 10. In addition, the loading stage driving unit may move the wafer stage 110 to selectively pick up the die 20. That is, the loading stage driving unit may adjust the position of the wafer stage 110 so that the die 20 to be picked up among the die 20 is located above the die ejection unit 116.

5 , the die 20 separated by the die ejection unit 116 can be picked up by the die transfer unit 120 disposed above the wafer stage 110. After the die transfer unit 120 picks up the die 20, it can transfer the die 20 to a die stage 124 disposed on one side of the wafer stage 110.

The bonding module 160 can pick up the die 20 on the die stage 124 and bond it to the substrate 30. According to one embodiment of the present invention, the bonding module 160 may include a bonding head 130 for picking up the die 20 transferred to the die stage 124 and bonding it to the substrate 30. On the other hand, a first visual unit 115 for identifying the position of each die 20 in the wafer 10 may be arranged above the wafer stage 110, a second visual unit 125 for checking the state of the die 20 may be arranged above the die stage 124, and a third visual unit 135 for confirming the bonding position may be arranged above the bonding stage B.

In addition, the bonding module 160 may include: a first head driving unit 132, which moves the bonding head 130 in a direction perpendicular to the first horizontal direction (e.g., X-axis direction) to pick up the die 20 on the die stage 124 and bond it to the substrate 30; and a second head driving unit 134, which moves the bonding head 130 between the die stage 124 and the bonding stage B along a second horizontal direction perpendicular to the first horizontal direction (e.g., Y-axis direction). Although not shown in detail, the bonding head 130 may include: a bonding tool for picking up the die 20 using vacuum pressure; and a heater for heating the die 20. The bonding head 130 may pick up the die 20 on the die stage 124 and bond it to the substrate 30. In addition, the bonding head 130 may also pick up the die 20 from the wafer 10 and immediately bond it to the substrate 30.

On the other hand, a camera may be disposed above the bonding stage B to photograph the physical mark on the substrate 30 and the area to be bonded with the die 20 in order to adjust the position of the substrate 30, i.e., align the substrate 30.

On the other hand, a loading module 150 for supplying the substrate 30 to the bonding area may be configured on one side of the bonding module 160, and an unloading module 170 for recovering the substrate 30 after the bonding process is completed from the bonding area may be configured on the other side of the bonding module 160.

The substrate 30 can be taken out from the loading box 40 of the loading module 150 and transferred to the bonding area for forming the die bonding process. After completing the bonding process, it can be transferred to the inspection unit 200 of the unloading module 170 and after completing the inspection process, it is transferred to the unloading box 42 and stored.

The loading module 150 , the bonding module 160 , and the unloading module 170 may be arranged side by side in a row, and the substrate 30 may be transferred from the loading module 150 to the bonding module 160 , and then transferred from the bonding module 160 to the unloading module 170 , through the substrate transfer unit 140 .

That is, the die bonding apparatus 100 includes a substrate transfer unit 140 for transferring the substrate 30. The substrate transfer unit 140 may include: a guide rail 142 for guiding the substrate 30 between the loading cassette 40 and the bonding area and between the inspection unit 200 and the unloading cassette 42; a clamp 144 for holding one side end of the substrate 30; and a clamp driving unit 146 for moving the clamp 144 in the horizontal direction (X-axis direction). The clamp driving unit 146 can move the clamp 144 and load the substrate 30 onto the bonding station B after holding one side end of the substrate 30 by the clamp 144. Although not shown, the substrate transfer unit 140 may further include a second clamp (not shown) for moving the substrate 30 to the inspection unit 200 after the bonding process is completed.

Referring again to FIG. 2 and FIG. 3 , the loading module 150 may include a loading material box unit, which may include: a material box loading port 152 for supporting a loading material box 40 containing a plurality of substrates; a loading material box operating robot 154 for moving the loading material box 40 in the vertical and horizontal directions to transfer the substrate 30 to the substrate transfer unit 140; and a loading material box transfer unit 156 for transferring the loading material box 40 in a second horizontal direction, such as the Y-axis direction, between the material box loading port 152 and the loading material box operating robot 154. Buffers 153 and 155 for temporarily storing a material box containing a plurality of substrates to be supplied to the bonding module may be provided above the material box loading port 152.

The unloading module 170 may include: an inspection unit 200 for inspecting the substrate 30 that has completed the die bonding process; an unloading material box unit for storing the substrate 30 that has completed the bonding inspection process; and a picking robot (not shown) for transferring the substrate 30 in the unloading module 170 .

The unloading material box unit may include: a material box unloading port 172 for supporting the unloading material box 42; an unloading material box operating robot 174 for receiving and storing the substrate 30 that has completed the die bonding process and the inspection process from the substrate conveying unit 140, so as to move the unloading material box 42 in the vertical and horizontal directions; and an unloading material box conveying unit 176 for conveying the unloading material box 42 in the second horizontal direction between the material box unloading port 172 and the unloading material box operating robot 174. The inspection unit 200 may be disposed above the unloading material box unit.

The pick-up unit (not shown) is a structure for transferring the substrate 30 inside the unloading module 170. The pick-up unit (not shown) can pick up the substrate 30 that has completed the bonding process from the clamp 144 of the substrate transfer unit 140 and transfer it to the plate 242. If the inspection process of the substrate is completed, the substrate 30 is picked up from the plate 242 and transferred to the unloading box unit.

The inspection unit 200 may include an inspection device, a plate 242, and a driving stage 244.

As an example, the inspection device may include: a visual part 210 for inspecting the bonding thickness (BLT, Bond Level Thickness) of a substrate bonded with a die; a sensor part 220 for inspecting the bonding state (PBI, Post Bond Inspection); and a moving part 230 provided to support the visual part 210 and the sensor part 220 and to be movable. As an example, the visual part 210 and the sensor part 220 may be mounted side by side on the moving part 230. The moving part 230 may be movable in a vertical or horizontal direction above a plate 242 described later, so that an inspection process may be performed on an entire area of the substrate. For example, the moving part 230 may be provided to be able to horizontally move an area corresponding to the entire area of the plate 242 above the plate 242. In addition, the moving member 230 may be provided to be able to move vertically in a direction approaching or separating from the plate 242. On the other hand, the inspection of cracks and particles on the substrate may also be performed through the visual unit 210.

The plate 242 can be used as a structure to support the substrate 30 for inspecting the substrate 30 with the die bonded thereto, and is disposed below the inspection device. The plate 242 can be located above the unloading magazine unit and be configured to be in a rectangular shape that is the same size as or larger than the size of the substrate. The plate 242 can use a vacuum adsorption method to fix the position of the substrate 30 placed on the plate 242. That is, the plate 242 can include an adsorption pad or adsorption protrusion for vacuum adsorption of the substrate 30.

The driving stage 244 is a structure disposed below the plate 242 and used to move the plate 242. The driving stage 244 can move the plate 242 on which the substrate 30 is placed horizontally and vertically, thereby being able to move the substrate 30 discharged from the substrate transfer unit 140 to the inspection area. Optionally, the driving stage 244 can supply air toward the plate 242 to move the plate 242 in a state of floating from the driving stage. By moving the plate 242 from a state of floating from the driving stage 244, it is possible to prevent the sinking phenomenon of the substrate bonded with the die, and has an effect of being conducive to improving uniformity.

On the other hand, as shown in Figures 6 and 7, the movement of the plate 242 of the drive platform 244 may include rotational movement. The drive platform 244 may rotate the plate 242 90 degrees clockwise or counterclockwise. According to this structure, the area of the unloading module may be further reduced.

Alternatively, when the pick-up unit (not shown) transfers the substrate 30 with the die bonded thereto from the clamp 144 to the plate 242, the substrate may be rotated 90° clockwise or counterclockwise and transferred. This structure can further reduce the area of the unloading module.

7 and 8 schematically show a die bonding device according to another embodiment of the present invention.

Different from the above, the bonding module can be set to multiple. At this time, except for the loading module and the bonding module, the number of the unloading module and the substrate transfer unit and the structure of the unloading module 170 also having the buffer plate 246 is the same as the embodiment described above, so the detailed description of the same structure is omitted.

FIG7 and FIG8 illustrate that the number of the bonding modules is two. Although FIG7 and FIG8 illustrate that the number of the bonding modules is two, this is only an example and is not intended to limit the number of bonding modules. The number of loading modules, unloading modules and substrate transfer units can be set to be the same as the number of bonding modules.

According to another embodiment of the present invention, the die bonding device 100 may include a loading material box unit and an unloading material box unit. The loading material box unit includes a first material box loading port 152a, a first loading material box operating robot 154a, a second material box loading port 152b, and a second loading material box operating robot 154b, and the unloading material box unit includes a first material box unloading port 172a, a first unloading material box operating robot 174a, a second material box unloading port 172b, and a second unloading material box operating robot 174b. At this time, the first material box loading port 152a supports the first loading material box 40, the second material box loading port 152b supports the second loading material box 44, the first material box unloading port 172a supports the first unloading material box 42, and the second material box unloading port 172b supports the second unloading material box 46.

The first substrate S1 taken out from the first loading box 40 can be transferred to the unloading module 170 with the die bonded thereto by the first clamp 144a along the first guide rail 142a through the bonding area, and the second substrate S2 taken out from the second loading box 44 can be transferred to the unloading module 170 with the die bonded thereto by the second clamp 144b along the second guide rail 142b through the bonding area.

The first substrate S1 and the second substrate S2 with the die bonded thereto and transferred to the unloading module 170 may pass through the inspection unit 200 and be stored in the first unloading magazine 42 and the second unloading magazine 46 , respectively.

When there are multiple bonding modules 160, due to the increase in quantity, it may happen that the substrates that have been inspected cannot be stored in the unloading box in time. For such substrates, a buffer plate 246 that provides a standby area can be provided to solve this problem. Therefore, according to another embodiment of the present invention, the die bonding device 100 may further include a buffer plate 246 for storing substrates that have completed the inspection process on one side of the plate 242 or one side of the guide rail. The substrates that have completed the inspection process can be transferred from the plate 242 to the buffer plate 246 by a picking robot (not shown), and transferred from the buffer plate 246 to the unloading box unit.

On the other hand, the unloading box conveying unit 176 can be configured to convey the unloading box not only in the Y-axis direction but also in the Z-axis direction.

As described above, the die bonding apparatus according to the present invention has a form in which the inspection device is built into the unloading module. Thus, the inspection process for the bonded substrate is continuously performed after the bonding process, which is not only very advantageous in terms of process time and productivity, but also has a very advantageous effect in terms of equipment space occupied by arranging the independently constructed inspection device inside the bonding apparatus.

The above detailed description illustrates the present invention. In addition, the foregoing content shows and illustrates the preferred embodiments of the present invention, and the present invention can be used in various other combinations, changes and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in this specification, the scope equal to the disclosed content described, and/or the scope of the technology or knowledge in this field. The embodiments described illustrate the best state for realizing the technical concept of the present invention, and various changes required for the specific application fields and uses of the present invention can also be made. Therefore, the above detailed description of the invention is not intended to limit the present invention to the disclosed implementation state. In addition, the attached patent application scope should be interpreted as also including other implementation states.

100: Die bonding device 10: Wafer 12: Scribing tape 14: Mounting frame 20: Die 30: Substrate 50: Crystal box 102: Loading port 104: Wafer transfer unit 106: Guide rail 110: Wafer table 112: Extension ring 114: Clamp 115: First visual unit 116: Die ejection unit 120: Die transfer unit 124: Die table 125: Second visual unit 135: Third visual unit B: Bonding table 150: Loading module 40: First loading material box 152: Material box loading port 152a: First material box loading port 152b: Second material box loading port 153, 155: Buffer platform 154: Loading material box operation robot 154a: First loading material box operation robot 154b: Second loading material box operation robot 156: Loading material box conveying unit 160: Joining module 130: Joining head 132: First head drive unit 134: Second head drive unit 140: Substrate conveying unit 142: Guide rail 142a: First guide rail 142b: Second guide rail 144: Clamp 144a: First clamp 144b: Second clamp 146: Clamp drive unit 170: Unloading module 42: First unloading material box 172: Material box unloading port 172a: First material box unloading port 172b: Second material box unloading port 174: Unloading material box operation robot 174a: First unloading material box operation robot 174b: Second unloading material box operation robot 176: Unloading material box conveying unit 200: Inspection unit 210: Vision unit 220: Sensor unit 230: Moving part 242: Plate 244: Drive platform 246: Buffer plate

FIG. 1 is a diagram schematically showing the structure of a die bonding device according to an embodiment of the present invention.

FIG. 2 is a schematic structural diagram for illustrating an unloading module and a die bonding device including the unloading module according to an embodiment of the present invention.

FIG. 3 is a schematic plan view for explaining the bonding module shown in FIG. 2 .

FIG. 4 is a schematic structural diagram for explaining the wafer stage and die ejection unit shown in FIG. 3 .

FIG. 5 schematically shows the bonding process of the bonding module according to FIG. 3 .

FIG. 6 shows a variation of FIG. 3 .

7 and 8 are diagrams for explaining a die bonding device according to another embodiment of the present invention.

100: Die bonding device

150: Loading module

40: First loading box

152: Material box loading port

153, 155: Buffer station

160:Joint module

170: Uninstall module

42: First unloading box

172: Material box unloading port

210: Visual Department

220: Sensor unit

230: Moving parts

242: Board

244:Drive station

Claims (20)

A unloading module is used to recover and discharge a substrate with a die bonded thereto in a die bonding device, wherein, the unloading module comprises: an inspection unit for performing an inspection process on the substrate with the die bonded thereto; an unloading magazine unit, which is arranged below the inspection unit and is used to recover the substrate after the die bonding and inspection process are completed; and a picking robot, which transfers the substrate between the inspection unit and the unloading magazine unit. The unloading module as described in claim 1, wherein, the inspection unit includes: a plate supporting the substrate to which the die is bonded; and an inspection device disposed above the plate and inspecting the substrate to which the die is bonded. The unloading module as described in claim 2, wherein, the plate comprises: an adsorption pad that vacuum adsorbs the substrate. The unloading module as described in claim 3, wherein, the inspection unit further comprises: a driving platform provided below the plate and moving the plate, the driving platform horizontally moving the plate, the horizontal movement comprising rotational movement. The unloading module as described in claim 4, wherein the drive platform supplies air toward the plate to move the plate in a state of floating from the drive platform. The unloading module as described in claim 1, wherein, the inspection device includes: a moving part provided to be movable above the plate; a visual part mounted on the moving part and inspecting the bonding thickness of the die; a sensor part mounted on the moving part and provided on one side of the visual part and inspecting the bonding state of the die of the substrate. An unloading module as described in claim 6, wherein the moving part moves horizontally and vertically above the plate. The unloading module as described in claim 1, wherein, the picking robot picks up the substrate that has completed the bonding process through the bonding module and transfers it to the board, and if the inspection of the substrate is completed, the substrate is picked up from the board and transferred to the unloading material box unit. The unloading module as described in claim 8, wherein, when the picking robot transfers the substrate to the plate, the substrate is rotated 90° clockwise or counterclockwise and transferred. A die bonding device comprises: a loading module for supplying a substrate; a bonding module for bonding a die on the substrate; and an unloading module for recovering and discharging the substrate bonded with the die, the unloading module comprises: an inspection unit comprising an inspection device for performing an inspection process on the substrate bonded with the die; an unloading material box unit disposed below the inspection unit and used to recover the substrate after the die bonding and inspection process are completed; and a picking robot for conveying the substrate in the unloading module. The die bonding device as described in claim 10, wherein, the inspection unit further includes: a plate disposed below the inspection device and supporting the substrate to which the die is bonded; and a drive stage provided below the plate and moving the plate. The die bonding device as described in claim 11, wherein, a suction pad for vacuum adsorbing the substrate is included on the plate, and the driving stage supplies air toward the plate to cause the plate to move horizontally in a state of floating from the driving stage. The die bonding device as described in claim 10, wherein, the inspection device comprises: a moving part provided to be movable in the vertical and horizontal directions above the plate; a visual part mounted on the moving part and inspecting the bonding thickness of the die; a sensor part mounted on the moving part and provided on one side of the visual part and inspecting the bonding state of the die on the substrate. The die bonding device as described in claim 10, wherein, the picking robot picks up the substrate that has completed the bonding process through the bonding module and transfers it to the board, if the inspection of the substrate is completed, the substrate is picked up from the board and transferred to the unloading box unit. The die bonding device as described in claim 10, wherein, the bonding module is provided in a plurality of pieces, the unloading module further includes a buffer plate that provides a standby area for the substrate that has completed the inspection. A die bonding device comprises: a die supply module for supplying die to be bonded to a substrate; at least one bonding module for picking up the die in sequence according to a recipe and bonding the die to the substrate; at least one loading module for supplying the substrate to the bonding module; at least one unloading module for recovering and discharging the substrate to which the die is bonded by the bonding module; and at least one substrate conveying unit for conveying the substrate between the loading module and the unloading module, the unloading module comprising: an inspection unit comprising an inspection device for performing an inspection process on the substrate bonded with the die; an unloading material box unit disposed below the inspection unit and used for recovering the substrate after the inspection; and a picking robot for conveying the substrate in the unloading module. The die bonding device as described in claim 16, wherein, the inspection unit further comprises: a plate supporting the substrate bonded with the die and disposed below the inspection device; a buffer plate providing a standby area for the substrate that has completed the inspection; and a drive stage provided below the plate and moving the plate. The die bonding device as described in claim 17, wherein, a suction pad for vacuum adsorbing the substrate is included on the plate, and the driving stage supplies air toward the plate to cause the plate to move horizontally in a state of floating from the driving stage. The die bonding device as described in claim 16, wherein, the inspection device comprises: a moving part provided to be movable in the vertical and horizontal directions above the plate; a visual part mounted on the moving part and inspecting the bonding thickness of the die; a sensor part mounted on the moving part and provided on one side of the visual part and inspecting the bonding state of the die on the substrate. The die bonding device as described in claim 16, wherein, the picking robot picks up the substrate that has completed the bonding process from the substrate transfer unit and transfers it to the board, if the inspection of the substrate is completed, the substrate is picked up from the board and transferred to the unloading box unit.

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