SG11202002666TA - Component handler - Google Patents

Component handler

Info

Publication number
SG11202002666TA
SG11202002666TA SG11202002666TA SG11202002666TA SG11202002666TA SG 11202002666T A SG11202002666T A SG 11202002666TA SG 11202002666T A SG11202002666T A SG 11202002666TA SG 11202002666T A SG11202002666T A SG 11202002666TA SG 11202002666T A SG11202002666T A SG 11202002666TA
Authority
SG
Singapore
Prior art keywords
component handler
handler
component
Prior art date
Application number
SG11202002666TA
Inventor
Chin Fong Han
Original Assignee
Semiconductor Tech & Instruments Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Tech & Instruments Pte Ltd filed Critical Semiconductor Tech & Instruments Pte Ltd
Publication of SG11202002666TA publication Critical patent/SG11202002666TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/84—Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
    • B65G47/846—Star-shaped wheels or wheels equipped with article-engaging elements
    • B65G47/848—Star-shaped wheels or wheels equipped with article-engaging elements the article-engaging elements being suction or magnetic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02—Control or detection
    • B65G2203/0208—Control or detection relating to the transported articles
    • B65G2203/0233—Position of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/04—Detection means
    • B65G2203/041—Camera
SG11202002666TA 2019-11-08 2019-11-08 Component handler SG11202002666TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2019/050547 WO2021091478A1 (en) 2019-11-08 2019-11-08 Component handler

Publications (1)

Publication Number Publication Date
SG11202002666TA true SG11202002666TA (en) 2021-06-29

Family

ID=75848645

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202002666TA SG11202002666TA (en) 2019-11-08 2019-11-08 Component handler

Country Status (8)

Country Link
US (1) US11887876B2 (en)
EP (1) EP4052291A4 (en)
JP (1) JP2023508820A (en)
KR (1) KR20220097920A (en)
CN (1) CN114467172A (en)
SG (1) SG11202002666TA (en)
TW (1) TW202142881A (en)
WO (1) WO2021091478A1 (en)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0654226B2 (en) 1988-03-31 1994-07-20 ティーディーケイ株式会社 Automatic visual inspection machine for chip parts
EP0906011A3 (en) * 1997-09-24 2000-05-24 Siemens Aktiengesellschaft Apparatus for mounting of electrical components on flat component carriers
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
KR100861050B1 (en) 2005-12-07 2008-09-30 세크론 주식회사 Pick and place system and the method thereof
US7556138B2 (en) * 2007-09-11 2009-07-07 Chi Hyun Kim Method and apparatus for collating nails
SG156544A1 (en) 2008-04-17 2009-11-26 Semiconductor Technologies Component handler
EP2339611B1 (en) 2009-12-23 2015-11-11 ISMECA Semiconductor Holding SA Wafer handler comprising a vision system
JP6113401B2 (en) 2011-06-17 2017-04-12 日立化成株式会社 Manufacturing method of semiconductor chip with adhesive film and manufacturing method of semiconductor device
US8967368B2 (en) * 2012-10-12 2015-03-03 Asm Technology Singapore Pte Ltd Apparatus for processing electronic devices
WO2014112041A1 (en) 2013-01-15 2014-07-24 上野精機株式会社 Posture correction device, electronic component conveyance device, and electronic component transfer device
JP5614825B1 (en) 2013-11-29 2014-10-29 上野精機株式会社 Classification device, classification method, and classification program
JP5892669B1 (en) 2014-11-28 2016-03-23 上野精機株式会社 Classification device
KR20170006343A (en) 2015-07-07 2017-01-18 주식회사 프로텍 Apparatus and Method for Bonding Flip Chip
KR102633105B1 (en) 2016-01-07 2024-02-02 (주)제이티 Transfer tool module and device handler having the same
US10056278B2 (en) 2016-08-22 2018-08-21 Asm Technology Singapore Pte Ltd Apparatus and method for transferring electronic devices
DE102016117815B4 (en) 2016-09-21 2018-04-12 Asm Assembly Systems Gmbh & Co. Kg Caching of FCOB chips in a chip transfer device
CN107887295B (en) 2016-09-30 2019-07-23 上海微电子装备（集团）股份有限公司 A kind of chip bonding device and bonding method
US11085810B2 (en) * 2017-02-08 2021-08-10 Griptech B.V. Hydraulic mass-determining unit and a method for determining the mass of a load using the same
DE102017008869B3 (en) 2017-09-21 2018-10-25 Mühlbauer Gmbh & Co. Kg component centering
FR3076538B1 (en) * 2018-01-08 2020-01-10 Id Development Limited ROLLING MACHINE INTENDED TO BE OVERLAPED BY A CHILD
CN110444498B (en) * 2018-05-03 2022-01-04 苏州艾科瑞思智能装备股份有限公司 Long-distance and accurate chip fast taking and installing device
TWI805795B (en) * 2018-07-20 2023-06-21 美商應用材料股份有限公司 Substrate positioning apparatus and methods
US10748794B1 (en) * 2019-07-09 2020-08-18 Asm Technology Singapore Pte Ltd Apparatus for transferring electronic devices

Also Published As

Publication number Publication date
US11887876B2 (en) 2024-01-30
WO2021091478A1 (en) 2021-05-14
EP4052291A4 (en) 2023-07-12
EP4052291A1 (en) 2022-09-07
JP2023508820A (en) 2023-03-06
CN114467172A (en) 2022-05-10
TW202142881A (en) 2021-11-16
KR20220097920A (en) 2022-07-08
US20220277980A1 (en) 2022-09-01

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