DE102016117815B4 - Caching of FCOB chips in a chip transfer device - Google Patents

Abstract

A method is described for transferring chips (192, 292a, 292b) from a wafer (195) to a placement head (136) of a placement machine (110), wherein chips (292a, 292b) are moved relative to their original orientation in the wafer (195 ) (i) are simply turned at a first pick-up position (256) or (ii) are provided twice at a second pick-up position (276) to the placement head (136). The method comprises: (a) removing a chip (192) from the wafer (195) by means of a rotatable extraction tool (150); (b) rotating the picking tool (150) so that the chip (192) is at a transfer position (246); and (c) transferring the chip (192) from the removal tool (150) to a rotatable storage tool (170). If a chip (292a), in the following FCOB chip (292a), is simply to be transferred to the placement head (136), the method further comprises: (d) returning the FCOB chip (292a) from the memory tool (170 ) to the removal tool (150); (e) re-rotating the picking tool (150) so that the FCOB chip (292a) is at the first pick-up position (256); and (f) picking up the re-rotated FCOB chip (292a) at the first pick-up position (256) from the placement head (136). Furthermore, a chip transfer device (140) for carrying out said method as well as a placement system (100) with such a chip transfer device (140) are described.

Description

Technical area

The present invention generally relates to the technical field of mounting component carriers with electronic components, and more specifically to mounting component carriers having unhoused electronic components formed as chips, which are directly removed from a finished processed wafer and fed to a placement process. In particular, the present invention relates to a method for transferring chips from a wafer to a placement head of a placement machine, a chip transfer device for carrying out said method and a placement system with a placement machine and such a chip transfer device.

Background of the invention

In order to efficiently realize a high integration density of electronic assemblies, it is known to take as chips formed electronic components directly from a wafer and set up with a placement of a placement on a component carrier to be populated. In this case, with regard to their original orientation in the wafer, the chips can either be placed on the component carrier in a non-directional orientation COB (chip on board) or in a flip orientation FCOB (turned by 180 °).

From the document EP 1 470 747 B1 a chip removal system is known with which a removed from a wafer chip can be transferred either at a first transfer position in a FCOB orientation to a placement or in a second transfer position in a COB orientation to a placement. The chip removal system includes (a) a rotatable removal tool for withdrawing chips from the wafer and turning the withdrawn chips 180 ° about their longitudinal or transverse axes, and (b) a rotatable turning tool for reversing the withdrawn chips by 180 ° about their Longitudinal or transverse axis, which cooperates in a common transfer position with the removal tool. The first pick-up position is the removal tool and the second pick-up position is assigned to the turning tool. The chips are removed with the assistance of a so-called ejector, which removes an isolated chip of the wafer from a sticky carrier film and transfers it to a suction gripper of the removal tool.

The speed of placement of component carriers with COB components or COB chips and / or with FCOB components or FCOB chips is largely determined by the cycle times of the following two processes:
Cycle Time 1: Transfer the chips from the wafer to the relevant pickup position. This includes a detachment or cutout of the chips by means of an ejector tool and the subsequent handling by means of the removal tool and possibly also by means of the turning tool.
Cycle time 2: The loading of the COB or FCOB chips with the placement head of a placement machine. In this case, the placement head is moved after the reception of typically a plurality of chips in an assembly area of the placement machine. There, the recorded chips are then placed on the component carrier. After that, the placement head (freed of chips) is again moved back to the first pick-up position or back to the second pick-up position, where it can then again pick up COB or FCOB chips.

For assembly processes with COB or FCOB chips, the total cycle time is largely determined by the o. G. Cycle time 1 and more specifically determined by the cycle time of the detachment of the chips by means of the Ejektor tool. The o. G. Cycle time 2 is typically much shorter.

Due to the unequal cycle times 1 and 2 results regularly uneven utilization of the individual components of a placement system, which is a placement with a placement and a chip removal system of o. G. Type has. Such uneven utilization leads to a reduction of the effective placement performance, i. H. the number of COB or FCOB chips that can be populated within a given period of time.

The invention has for its object to increase the placement performance in a placement of component carriers with COB and / or FCOB chips.

Summary of the invention

This object is solved by the subject matters of the independent claims. Advantageous embodiments of the present invention are described in the dependent claims.

According to a first aspect of the invention, there is described a method of transferring chips from a wafer to a placement head of a placement machine, wherein chips are provided to the placement head at a first pick-up position and at a second pick-up position, the chips being in relation to their original orientation in the wafer (i) simply turned at the first pickup position or (ii) twofold at the second pickup position turned over the placement head can be provided. The described method comprises (a) removing a chip from the wafer by means of a rotatable extraction tool; (b) rotating the picking tool so that the removed chip is at a transfer position; and (c) transferring the chip from the picking tool to a rotatable storage tool. If a chip, hereinafter referred to as FCOB chip, is simply to be transferred to the placement head, the method further comprises (d) returning the FCOB chip from the memory tool to the removal tool; (e) re-rotating the picking tool so that the FCOB chip is at a first pick-up position; and (f) picking up the FCOB chip re-rotated with the picking tool at the first pickup position from the placement head.

The described method is based on the knowledge that not only COB chips are processed by the memory tool (in EP 1 470 747 B1 as turning tool) can be stored. Rather, FCOB chips can also advantageously be stored for provision at the first pick-up position on or with the storage tool, provided that these FCOB chips are transferred back to the picking tool. Thus, for FCOB chips, the original functionality of the memory or tapping tool is not used, which functionality is to re-use COB chips.

Depending on the number of memory locations, which can be realized in each case by means of a conventional device-holding device, more or fewer FCOB chips can be temporarily picked up by the memory tool. In this regard, it is obvious that as the number of cached FCOB chips increases, the length of time the FCOB chips are stored on average increases. By reversing the direction of rotation of the memory tool, the memory duration for at least one FCOB chip, but not for all cached FCOB chips, can be reduced.

It should be noted that the method described above only has to be used if FCOB chips are to be actually buffered. Of course, if such caching is not required, provision of FCOB chips at the first fetch location may also be done without the use of the storage tool.

Illustratively, differences between the aforementioned cycle times 1 and 2 can be at least partially compensated with the described method, so that the processes (i) of transferring the chips from the wafer to the respective collection position and (ii) of the wafer are at least approximately continuous and temporally parallel Bestückens the chips provided at the respective pickup positions can be realized on a component carrier to be populated. In this way, the Bestückleistung a Bestücksystems comprising (i) an above-described and from the EP 1 470 747 B1 known chip removal system, referred to herein as chip transfer system, and (ii) a placement machines are significantly increased. In particular, in the case of a mixed assembly of a component carrier with both FCOB chips and COB chips such compensation for both types of chips is possible.

Expressed in clear terms, therefore, the relatively long and significantly determined by the detachment or cutting out of chips by means of an ejector tool o. Cycle time 1 at least partially compensated. Thus, longer wait times of the placement head at the first pick-up position can be avoided as the number of FCOB chips which can be provided at the first pick-up position within a time period in which the placement head is ready to receive FCOB chips is increased. Thus, a largely continuous assembly process can also be realized for FCOB chips. The placement is increased accordingly.

It should be noted that due to the long or large cycle time of the detachment or cutting out of the chips, the picking up of the FCOB chips and possibly also of the COB chips by the storage tool is not accelerated by the described method. However, the storage of the chips by the storage tool can take place during the period in which the placement head is busy to place chips picked up from the first pickup position and / or second pickup position onto the respective component carrier.

According to an embodiment of the invention, if a chip, referred to hereinafter as a COB chip, is to be transferred onto the placement head twice, the method further comprises: (g) rotating the memory tool such that the COB chip is at a second pick-up position; and (h) picking up the COB chip rotated by the storage tool at the second pickup position from the placement head.

Illustratively, the described storage tool now not only has the function of buffering FCOB chips. Rather, the memory device is also used to turn COB chips after a single turn by the removal tool again and thus (in the second pick-up position) in the required To bring orientation. In this way, an efficient assembly of a component carrier with COB chips but also an efficient mixed assembly of a component carrier with FCOB chips and COB chips is made possible.

It should be noted that depending on the number of chip memory locations on or on the memory tool also COB chips can be cached. Thus, the continuity of a placement can be increased not only by FCOB chips but also by COB chips.

It is further noted that the removal tool and / or the storage tool in different directions of rotation, d. H. clockwise or counterclockwise. Depending on the specific application, the directions of rotation of both tools may be the same or different. Furthermore, if necessary, the directions of rotation of the removal tool and / or storage tool can be changed or changed during operation.

According to a further exemplary embodiment of the invention, a plurality of chips are removed by means of the removal tool and at least some of them are transferred to the storage tool, while the placement head places previously picked up chips (a) on a component carrier from the first pick-up position and / or from the second pick-up position and / or (b) moves back from a placement area to the first pick-up position and / or the second pick-up position. This has the advantage that a chip transfer device carrying out the method described is also active in a time window in which the placement head can not pick up any components. In this time window, in fact, FCOB chips and / or COB chips are transferred to the storage tool for the purpose of a temporary intermediate storage. Later FCOB chips to be loaded are then transferred back to the picking tool, whereas COB chips to be loaded are transferred sequentially and directly from the storage tool to the second pickup position.

According to a further aspect of the invention, a chip transfer device for transferring chips from a wafer to a placement head of a placement machine is described. The chip transfer device includes a rotatable removal tool (a) for withdrawing singulated chips from the wafer, (b) for turning the withdrawn chips to provide them as FCOB chips at a first pickup position, and (c) for transferring the chips taken chips to a rotatable storage tool to provide them as COB chips at a second pickup position. The chip transfer apparatus further comprises the rotatable storage tool (a) for accepting chips from the removal tool, (b) for re-turning the inherited chips to provide them as the COB chips at the second pick-up position, and (c) Return-transfer of chips temporarily stored by the storage tool to the removal tool, in order to provide them as further FCOB chips as a result, simply turned over at the second collection position. In addition, the described chip transfer device has a processor for controlling the operation of the removal tool and the storage tool, which is designed such that the method described above is executable.

The described chip transfer device is also based on the finding that the comparatively very long time duration of the removal of the chips given in the above-described method for transferring chips can at least partially be compensated for in view of high placement performance by not only using the storage tool COB chips but also FCOB chips are temporarily cached. If a placement head can pick up these FCOB chips at the first pickup position at a given time, then the temporarily cached FCOB chips can be transferred very quickly to the first pickup position. A bottleneck in the provision of chips, especially at the first pick-up position, can thus be significantly reduced in a simple and reliable manner.

It should be noted that one and the same placement head can be used for both the FCOB chips provided at the first pick-up position and the COB chips provided at the second pick-up position. This is particularly advantageous when electronic assemblies are to be manufactured with a so-called mixed assembly of component carriers. In such a mixed assembly both FCOB chips and COB chips are placed on a component carrier. Alternatively, however, the chips provided at different pickup positions can also be picked up by at least two different placement heads.

According to one exemplary embodiment of the invention, the removal tool has a plurality of radially protruding first suction grippers for temporarily receiving one chip each, wherein the first suction grippers are in particular active chip holders which are movable in the radial direction with respect to a first axis of rotation of the extraction tool. Furthermore, the storage tool has a plurality of radially projecting second suction pads for temporarily receiving each a further chip, wherein the second suction grippers are in particular passive chip holding devices, which are arranged stationary on a chassis of the storage tool.

The use of passive chip holding devices for the storage tool has the consequence that the storage tool can be realized particularly easily. Apart from an actuator for generating a controlled rotational movement and apart from a negative pressure generating device, which can preferably selectively apply selectively selected suction channels from the second suction pads with a negative pressure, namely, the storage tool need not have any further active components.

Illustratively, the storage tool can be realized by means of a simple suction gripper wheel, in which the second suction grippers have no freedom of movement of the storage tool relative to the chassis. This allows the attachment of the second suction pads without moving parts such as guides, springs, etc. Passive components are naturally less prone to error than active (moving) components. Thus, the (passive) memory wheel reliably fulfill its function and on a sensor such as a sensor for controlling the presence of chips can be dispensed with. In this way, the storage tool can be realized inexpensively and as a particularly robust tool.

The first suction pads are at least when they are radially displaceable in a first angular position in which they can each receive a chip from the wafer, and in a second angular position, which is assigned to the (common) transfer position. Hereinafter, based on a particularly preferred embodiment, this first angular position is also referred to as 6:00 o'clock position and the second angular position also as 9:00 o'clock position. At a third angular position, also referred to below as the 12:00 o'clock position, such a radial displaceability is typically not required, because an FCOB chips fetching placement usually has a movable z-axis with a z-drive. This means that a chip holding device of a placement head, in particular a chip holding device realized as a suction gripper, can be moved in the direction of the first axis of rotation (back and forth). To put it simply, in the first pick-up position, the movable z-axis of the placement head can ensure that the pickup of the FCOB chips can take place in a gentle manner.

Correspondingly, a radial displaceability of the suction gripper located in the 6:00 o'clock position ensures that the chip removal process can take place from the wafer in a mechanically gentle manner. Furthermore, a radial displaceability of the located in the 9:00 o'clock position suction pad ensures that a transfer of chips between the removal tool and the storage tool (in both directions) can be done in a gentle mechanical manner.

It should be noted that the above and possibly also below-mentioned angular positions, which are referred to in relation to a dial of an analog clock, do not necessarily have to coincide with the relevant time on the dial. In accordance with a particularly preferred embodiment of the invention, these "times" are to be understood as exemplary angular positions.

According to a further embodiment of the invention, the first suction pads each have a first pneumatic coupling element, to which a first pipette can be coupled. Alternatively or in combination, the second suction pads each have a second pneumatic coupling element, to which a second pipette can be coupled. This has the advantage that the pipettes, which in practice represent highly wear-prone elements, can be easily replaced if necessary.

The above-described radial displaceability of the first suction pads can be realized in particular by a radical displaceability of the first pneumatic coupling element, often also referred to as quill. The first pipette is then mounted stationary or without a degree of freedom of movement on the displaceable first pneumatic coupling element. As described above, since the second suction grippers have no freedom of movement with respect to the chassis of the storage tool, the second pneumatic coupling elements can be realized by simple coupling structures formed stationary on the chassis of the storage tool.

According to a further exemplary embodiment of the invention, the first suction grippers and / or the second suction grippers are rotatable about their longitudinal axis. This has the advantage that the angular position of the chip, which is taken up by the respective suction gripper, can already be selectively adapted during its temporary retention on the removal tool or the storage tool with regard to a later correct placement of the chip on a component carrier. As a result, a rotation of the angular position of the chip when it is received by the placement head can be avoided. However, it is also possible that by changing the angular position of the chip already on the chip transfer device described the Angular position of the chips is only roughly adjusted so that later on the placement only a fine adjustment of the angular position must be made.

The rotation of a suction pad can be realized in a known manner, that each suction pad of the removal tool and / or possibly also of the turning tool is associated with its own rotary drive. In view of a less complex constructive realization of removal tool and / or turning tool, it is also possible to provide only a common rotary drive for all suction pads of the tool in question, which is brought into engagement only at an angular position of the tool concerned with one of the suction pads. For determining and selectively modifying the angular position of a recorded chip, a camera with a downstream image evaluation device can be used in known manner, which optically detects the angular position of that chip which is currently in the detection range of the camera.

Based on the above-described idea that the storage tool is designed as a structurally particularly simple tool, it is provided in many embodiments that only the removal tool is equipped with at least one rotary drive for the first suction pads. With regard to the possibility of being able to change the angular position of chips to be transferred with the described chip transfer device, this solution is not restrictive for FCOB chips. Also, COB chips are held during their transfer from the wafer to the second pickup position for a short time by the removal tool, which, if equipped with a suitable rotary drive, the angular position of COB chips can change.

According to a further embodiment of the invention, the first suction pads are displaceable relative to the chassis of the rotary extraction tool in the radial direction. Alternatively or in combination, the second suction pads are displaceable relative to a chassis of the rotatable storage tool in the radial direction. This has the advantage that the chips can be handled in a mechanically gentle manner and, in particular, mechanically gently transferred between the two tools.

In this context, "slidable in the radial direction" means that the respective suction gripper is displaceable perpendicularly to the axis of rotation of the tool assigned to it.

As already described above in connection with a structurally simple memory tool, it is provided in many currently considered particularly preferred embodiments that only the first suction pads of the removal tool are radially displaceable. When transferring chips between the two tools, it is sufficient if only one of the two suction grippers involved in the transfer is radially displaceable. When receiving FCOB chips at the first pick-up position and when receiving COB chips at the second pickup position such radial displacement of the respective suction pad is typically not required because placement heads regularly have a so-called z-drive, by means of which a chip-holding device of the placement head in a controlled manner to the relevant tool of the chip transfer device towards (and away from) can be moved.

According to a further exemplary embodiment of the invention, the removal tool has a first common radial drive for a radial displacement of the first suction gripper. Alternatively or in combination, the storage tool has a second common radial drive for a radial displacement of the second suction pads. This has the advantage that a radial displaceability of the respective suction pads can be realized in a mechanically simple and structurally efficient manner.

For a radial movement of the suction pads, the common radial drive can be arranged on a fixed angular position relative to the axis of rotation of the respective tool. This means that only that Saugreifer, which is currently in the associated radial drive associated angular position, can be moved in the radial direction. This can be done in particular by suitably trained and movable driver and engagement elements, which are brought into mechanical engagement only when the respective suction gripper is in its rotation about the axis of rotation of the respective tool in the respective radial drive associated angular position.

Also in this context, based on the above-mentioned idea to design the storage tool structurally particularly simple, only the removal tool to be provided with a common radial drive.

In particular, the removal tool preferably has two first radial drives. In this case, a first common radial drive is assigned to that angular position of the removal tool in which the removal of the chips from the wafer is carried out. This is possible, especially in conjunction with one above described Ejektor tool, a reliable removal of the chips from the wafer. In such an embodiment, a second common radial drive is assigned to that angular position of the removal tool in which a transfer of chips to the storage tool takes place. Preferably, the removal of chips from the wafer takes place at the so-called 6:00 o'clock position and / or a transfer of chips between the removal tool and the storage tool at the so-called 9:00 o'clock position of the removal tool. More preferably, the 9 o'clock position of the picker corresponds to the 3 o'clock location of the storage tool.

According to a further exemplary embodiment of the invention, the first suction grippers and / or the second suction grippers are mounted sprung at least in the radial direction. This advantageously enables gentle handling of the chips during all transfer processes. In particular, in this regard, the handover operations are (i) removal of the chips from the wafer, (ii) handover of the chips between the turret tool and the storage tool, (iii) picking up of FCOB chips by the placement head and / or (iv) Recording of COB chips by the or another placement head.

The resilient mounting can be realized in particular by simple passive spring elements, which ensure that the respective suction pads in radial direction is resiliently mounted on his tool.

According to a further exemplary embodiment of the invention, the removal tool has a number of first suction grippers which can be divided by the number four. Alternatively or in combination, the storage tool has a number of second suction pads divisible by the number four. This advantageously enables a symmetrical arrangement of the suction grippers on the respective tool and thus facilitates a structurally simple realization of the removal tool or storage tool.

According to a further exemplary embodiment of the invention, a second number of second suction grippers is greater, in particular by a factor of two, more particularly by a factor of four, than a first number of first suction grippers. This has the advantage that, on the one hand, the removal tool can still be realized structurally relatively simply and thus economically advantageously. On the other hand, the storage tool, which can be realized by a simpler construction (a radial drive and / or a rotary drive is not required), have a high storage capacity.

According to a further embodiment of the invention, a ratio between (a) the second number and (b) the first number is an integer number, this integer number being in particular two, three, four, five or six. This has the advantage that the movement of the removal tool can be synchronized in a simple manner with the movement of the storage tool, wherein in a plurality of combinations of angular positions of the two tools a transfer of chips between the two tools is possible.

According to a further exemplary embodiment of the invention, the first suction grippers are distributed on an outer circumference of the removal tool such that (a) a removal of a chip from the wafer and (b) a transfer of chips from the removal tool to the storage tool and / or a provision a FCOB chip at the first pickup position is possible. Alternatively or in combination, the second suction grippers are distributed on an outer periphery of the storage tool so that (a) a transfer of a chip between the removal tool and the storage tool and (b) a provision of a COB chip at the second collection position is possible. This embodiment advantageously enables a synchronously clocked operation of the entire chip transfer device. This contributes to a high chip transfer performance, wherein the chip transfer rate is to be understood as the number of FCOB chips and / or COB chips which can be transferred to the first or second pick-up position within a predetermined period of time.

According to a further aspect of the invention, a placement system for removing chips from a wafer and for populating a device carrier with removed chips is described. The placement system described comprises (a) a chip transfer device of the type described above, and (b) a placement machine with a placement head for fetching FCOB chips provided at the first pick-up position and / or picking up COB chips provided at the second pick-up position.

The described placement system is based on the finding that the above chip transfer device can be functionally coupled to a placement machine such that unhoused components or chips can be fitted to a component carrier, in particular a printed circuit board, without further chip handling steps.

According to an embodiment of the invention, the sum of the number of first suction pads and the number of second suction pads is less than or equal to a number of chip suckers. Holding devices of the placement. This has the advantage that the operation of the placement machine and the operation of the chip transfer device can be synchronized in a simple manner. As a result, unwanted additional times can be avoided in the entire process and the placement power can be increased accordingly.

According to one embodiment of the invention, the chip transfer device is arranged stationarily on a chassis of the placement machine. This has the advantage that, when a plurality of chips are loaded, it is not necessary to move the entire chip transfer device in relation to the wafer or in relation to the placement machine. Rather, only the wafer needs to be moved with respect to the placement machine and also with respect to the chip transfer device to remove various chips, which are naturally located at different positions of the wafer, with the chip transfer device and later with the placement head on the chip transfer device Set up component carrier.

The movement of the wafer can be carried out by means of a conventional x-y positioning system, wherein a stationary part of the x-y positioning system is arranged fixed in space to the chassis of the placement machine. The moving part of the x-y positioning system then carries the wafer.

Before describing exemplary embodiments of the invention with reference to the drawing, some technical considerations in connection with the invention are presented below.

The turning tool of the EP 1 470 747 B1 known chip removal system is used according to the invention for buffering FCOB chips. An at least approximately continuous assembly process of FCOB chips and / or COB chips on a component carrier is made possible by removing chips required for a subsequent insertion cycle from the wafer at the same time as placing chips on the component carrier in the current insertion cycle. The removed chips are temporarily stored until they are picked up by the placement head in the turning tool, referred to in this document as a storage tool. Preferably, the number of chip memory locations present on the memory tool is so high that at least a majority of the FCOB chips and / or COB chips required for the following pop-up clock cycle can be temporarily stored. Other needed chips may be taken from the wafer and provided at a pick-up position while the placement head is picking up cached chips at the other pick-up position.

A chip storage space can be realized, in particular, by a suction gripper which, together with other suction grippers, is mounted so as to be radially projecting along a circumferential direction on the storage tool. A suitable vacuum generating means is required to provide with the suction grippers the respective required suction force for holding a chip. Proper vacuum generation is well known in the art and therefore will not be further described in this document. The same applies to an ejector or ejector tool with which the chips are detached from a sticky carrier film of the wafer.

Further advantages and features of the present invention will become apparent from the following exemplary description of presently preferred embodiments. The individual figures of the drawing of this document are merely schematic and not to scale.

Short description of the drawing

1 shows a schematic representation of a placement system with a chip transfer device according to an embodiment of the invention.

2a and 2 B show the chip transfer device in two different operating states, (a) in the provision of COB chips and (b) in the provision of FCOB chips.

3a and 3b show in a perspective and in a sectional view of a suction gripper, as it can be used in particular for the removal tool of the chip transfer device.

Detailed description

It should be noted that in the following detailed description, features of different embodiments, which are the same or at least functionally identical to the corresponding features or components of another embodiment, are provided with the same reference numerals or with reference numerals, which in The last two digits are identical to the reference numerals of corresponding same or at least functionally identical features or components. In order to avoid unnecessary repetitions, features or components already explained on the basis of a previously described embodiment will not be explained in detail later.

It should also be noted that spatial terms such as "front" and "back,""top," and "bottom,""left," and "right," etc., to describe the relationship of one element to another element or elements, as illustrated in the figures. Thus, the spatial terms may apply to orientations that differ from the orientations shown in the figures. It will be understood, however, that all such space-related terms, for convenience of description, refer to the orientations shown in the drawings and are not necessarily limiting, as the device, component, etc., as used herein, assume orientations when in use may be different from the orientations shown in the drawing.

1 shows a schematic representation of a placement system 100 with a chip transfer device 140 and a placement machine 110 , The placement machine 100 Corresponds essentially in particular structural features of a conventional placement machine. The basic function of the placement machine 110 and various components, not shown, are therefore not explained in detail below.

The placement machine 110 has a chassis 112 on which in 1a is shown schematically by a solid line. This chassis 112 provides a frame structure on which the individual components of the placement machine 110 are attached directly or indirectly.

On the chassis 112 is a portal system 120 attached, which comprises in a known manner two guide elements, which represent a portal root. According to the embodiment shown here, this portal root of a first guide element 122a as well as another first guide element 122b educated. Both first guide elements 122a and 122b each have an elongate carrier rail, which extend along a first direction. In 1a This first direction is called a y-direction.

The portal system 120 also has two carriages 124a and 124b on. The sled 124a is on the guide element 122a slidably mounted so that it can be moved or positioned along the y-direction by means of a drive, not shown. In a similar way is the carriage 124b on the guide element 122b slidably mounted. A likewise not shown drive ensures that both carriages 124a and 124b be moved in the same way or synchronously along the y-direction. bearing elements 125 make sure the two sleds 124a and 124b be moved reliably along a well-defined track along the y-direction.

Between the two sleds 124a and 124b extends as a movable cross member trained second guide element 132 which has a longitudinal extent along a second direction. This second direction is in 1a and also referred to below as the x-direction. At the crossbeam 132 is a second sled 134 attached or guided, which can be moved or positioned by means of a drive, also not shown along the x-direction. This second sled 134 represents a mechanical platform on which a placement head 136 is attached. According to the embodiment shown here is the placement 136 a so-called multiple placement head, which comprises a plurality of chip holding devices designed as suction pipettes 138 has, which are used in a known manner each for temporarily receiving an electronic component.

For populating a component carrier 190 becomes the placement head 136 in a known manner by a suitable control of the portal system 120 first moved into a non-illustrated component pick-up, in which unhoused electronic components or chips 192 from the chip transfer device 140 to be provided. There are the chips provided 192 from the placement head 136 picked up and again by a suitable control of the portal system 120 transferred to a placement area in which the chips 192 on the component carrier 190 be put on.

A data processing unit 114 ensures coordinated control of the drives for the two carriages 124a . 124b , for the placement head 136 and for further components of the placement machine known to the person skilled in the art 110 , Such a component is, for example, a transport system, which is intended for the component carrier 190 before its placement in the placement machine 110 bring in and after its at least partial assembly back from the placement machine 110 to remove. According to the embodiment illustrated here, the data processing unit 114 with a data processing unit 144 coupled to the chip transfer device 140 so controls that their operation synchronized to the operation of the placement machine 110 he follows. For reasons of clarity of presentation, the communicative coupling between the two data processing units 114 and 144 in 1 not shown. Of course, the two data processing units 114 and 144 be realized by means of a single common data processing unit. This can be realized in particular by the fact that the functionality of the data processing unit 144 in the Data processing unit 114 of the placement machine 110 is implemented.

The chip transfer device 140 has a rotatable removal tool 150 and a rotatable storage tool 170 on which in an in 1 not shown common transfer position with respect to a transfer of chips 192 interact. The axes of rotation of the two tools 150 and 170 are parallel to the in 1 Oriented in the upper left indicated y-direction. A temporary shot of chips 192 from a wafer 195 through the removal tool 150 takes place by means of first suction pads 160 , which along an outer circumference of the removal tool 150 are distributed and radially from a chassis of the removal tool 150 stand out. In a similar way, a temporary recording of chips takes place 192 that of the removal tool 150 be provided by the storage tool 170 by means of second suction pads 180 which extends along an outer circumference of the storage tool 170 are distributed and radially from a chassis of the storage tool 170 stand out.

According to the embodiment illustrated here, the chip transfer device 160 spatially fixed to the placement machine 110 arranged. This means that when taking out different chips 192 from the wafer 195 the wafer 195 must be moved by means of a suitable and not shown xy-Flächenpositioniersystems to the removal tool 150 an access to different positions or different chips 192 of the wafer 195 to enable.

2a and 2 B show the chip transfer device 140 in two different operating states. In a first in 2a shown operating state, are the only partially shown placement 136 of the placement machine 110 COB chips 292b provided for the purpose of collection and subsequent assembly. In the second in 2 B shown operating state of the placement 136 FCOB chips 292a provided. The provision of FCOB chips 292a takes place at a first pick-up position 256 (see. 2 B ), providing the COB chips 292b takes place at a second pick-up position 276 (see. 2a ).

According to the embodiment shown here, the removal tool 150 four first suction pads 160 on. The storage tool 170 shows how from both 2a and 2 B visible, a total of 16 second suction pads 180 on. The removal tool 150 is about a first axis of rotation 251 rotatable, the storage tool rotates in operation about a second axis of rotation 271 ,

The removal tool 150 and the storage tool 170 act in relation to a transfer of chips 192 ie FCOB chips 292a and / or COB chips 292b , in a common transfer position 246 together. According to the embodiment shown here corresponds to this common transfer position 246 at the rotatable removal tool 150 a so-called "9:00 clock position" and the rotatable storage tool 170 the "3 o'clock position". The removal of chips from the wafer 195 takes place at the "6:00 o'clock position" of the removal tool 150 , The first pick-up position 256 is located at the "12:00 o'clock position" of the picking tool 150 , the second pick-up position 276 is the "12:00 clock position" of the storage tool 170 ,

For reliable handling of chips 192 . 292a . 292b It is necessary that the first suction pad 160 which is a chip 192 from the wafer 195 takes in the radial direction (with respect to the first axis of rotation 251 ) is displaceable. A radial shift when removing chips 192 is in the 2a and 2 B with a double arrow 260a illustrated. Furthermore, it is necessary that at least one of a first suction pad 160 and a second suction pad 180 which both are at a handover from a chip 192 between the removal tool 150 and the storage tool 170 are involved, is displaceable in the radial direction. Preferably, such a radial displacement takes place in the region of the transfer position 246 by a radial displacement of the respective first suction pad 160 , Then the storage tool 170 namely in relation to the second suction pads 180 be implemented as a largely passive tool and thus in a structurally simple and also economically interesting way. A radial shift when passing chips 192 is in the 2a and 2 B with a double arrow 260b illustrated.

A radial displaceability of a first suction pad 160 at the first pick-up position 256 and a radial displaceability of a second suction pad 180 at the second pick-up position 276 is typically not required because the chip holders 138 of the placement head 136 usually along a z-direction are movable and picking up a chip 292a or a chip 292b gently to the respective pick-up position 256 . 276 can be moved up.

The above-described radial displacements, in particular of first suction pads 160 can by individual radial drives (every first suction pad 160 is assigned a radial drive) or realized by common radial drives. In a common radial drive takes place only in the respective Work position, ie here in the "6:00 o'clock position" to pick up chips 192 and in the "9:00 clock position" to pass chips 192 , A mechanical engagement between a working position permanently assigned radial drive and the first suction pads 160 , which is currently in the appropriate working position.

• • Die beiden Abholpositionen 256 und 276 befinden sich so nahe an dem Bestückautomaten 110, dass diese von dem Bestückkopf 136 erreicht werden können. Die Chip-Transfervorrichtung 140 kann auch zumindest teilweise in den Bestückautomaten 110 integriert werden, so dass sich die beiden Abholpositionen 256 und 276 innerhalb des Bestückautomaten auf einer Höhe befinden, das ein Abholen von FCOB Chips 292a und/oder COB Chips 292b ohne eine konstruktive Änderung des Bestückautomaten 110 durch den Bestückkopf 136 möglich ist.
• • Die beiden Abholpositionen 256 und 276 befinden sich bevorzugt auf gleicher Arbeitshöhe. Weiterhin können beide Abholpositionen 256 und 276 von ein und demselben Bestückkopf 136 erreicht werden. Bei einer geeigneten Ausbildung des Bestückkopfes 136 können die FCOB Chips 292a und/oder die COB Chips 292b dann nicht nur sequenziell sondern gegebenenfalls auch gleichzeitig abgeholt werden. Dadurch kann mit dem Bestücksystem 100 auf vorteilhafte Weise eine Mischbestückung (mit FCOB Chips 292a und mit COB Chips 292b) realisiert werden.
• • Ferner kann, mit einem gewissen apparativen Umbauaufwand eines herkömmlichen Bestückautomaten verbunden, das Chip-Transfersystem 140 auch anstelle des Bestückkopfes 136 an dem zweiten Schlitten 134 befestigt werden. In diesem Fall erfüllt die Chip-Transfervorrichtung 140 nicht nur die Funktionen des Entnehmens und Wendens von Chips 192 sondern zusätzlich auch noch die Funktion des Platzierens bzw. Bestückens der Chips 192 auf dem Bauelementeträger 190.

The following are with reference to the 1 . 2a and 2 B some further optional constructive aspects and representational features of the placement system 100 and its chip transfer device 140 explains:

• • The two pick-up positions 256 and 276 are so close to the placement machine 110 that this from the placement head 136 can be achieved. The chip transfer device 140 can also at least partially in the placement machines 110 be integrated, so that the two pickup positions 256 and 276 located within the placement machine at a height that is a pick-up of FCOB chips 292a and / or COB chips 292b without a constructive change of the placement machine 110 through the placement head 136 is possible.
• • The two pick-up positions 256 and 276 are preferably at the same working height. Furthermore, both pick-up positions 256 and 276 from one and the same placement head 136 be achieved. With a suitable design of the placement 136 can the FCOB chips 292a and / or the COB chips 292b then not only sequentially but possibly also picked up at the same time. This can be done with the placement system 100 advantageously a mixed assembly (with FCOB chips 292a and with COB chips 292b ) will be realized.
• Furthermore, the chip transfer system can be connected with a certain equipment conversion effort of a conventional placement machine 140 also in place of the placement head 136 on the second carriage 134 be attached. In this case, the chip transfer device satisfies 140 not just the functions of removing and turning chips 192 but in addition also the function of placing or placement of the chips 192 on the component carrier 190 ,

• • Während eines Bestückens von Chips 192 auf den Bauelementeträger 190 können durch das Entnahmewerkzeug 150 weitgehend kontinuierlich weitere Chips 192 von dem Wafer 195 entnommen werden. Dabei kann die Taktrate, mit der die Chips 192 von dem Wafer 195 entnommen werden, während des Betriebs des Bestücksystems 100 prozessabhängig variiert bzw. angepasst werden. Insbesondere kann eine Anpassung der Taktrate einer Chip-Entnahme von dem Wafer 195 während einer Übergabe von FCOB Chips 292a an den Bestückkopf 136 erfolgen, wenn (a) gerade kein geeignet freier zweiter Sauggreifer 180 verfügbar ist und/oder wenn (b) eine Synchronisation zwischen der Taktrate der Chip-Entnahme und der Taktrate einer Übergabe von FCOB Chips 292a und/oder COB Chips 292b an dem Bestückkopf 136 erforderlich ist.
• • Die entnommenen Chips 192 werden von dem Entnahmewerkzeug 150 zum Zwecke einer Zwischenspeicherung an das Speicherwerkzeugs 170 übergeben. Damit werden die zweiten Sauggreifer 180 zumindest teilweise mit FCOB Chips 292a und/oder COB Chips 292b belegt.
• • Zusätzlich oder alternativ können auch zumindest einige erste Sauggreifer 160 des Wendewerkzeugs 150 zum Zwischenspeichern von FCOB Chips 292a und/oder COB Chips 292b verwendet werden. Nach einer Beendigung eines Bestückungstakts werden die zwischengespeicherten Chips 192 von dem Bestückkopf 136 abgeholt. Hierzu wird der Bestückkopf 136 an die jeweiligen Abholposition 256 bzw. 276 verfahren. Das drehbare Entnahmewerkzeug 150 bzw. das drehbare Speicherwerkzeug 170 positioniert einen abzuholenden Chip 292a bzw. 292b durch eine geeignete Drehung um die jeweilige Drehachse 251 bzw. 271 in die jeweilige Abholposition 256 bzw. 276. Diese Vorgänge werden so lange wiederholt, bis der Bestückkopf 136 die benötigte Anzahl an Chips 192 aufgenommen hat.
• • Parallel zum Abholen von Chips 192 durch den Bestückkopf 136 können, quasi kontinuierlich, Chips 192 durch das Entnahmewerkzeug 150 von dem Wafer 195 entnommen und anschließend (a) dem Bestückkopf 136 vom Entnahmewerkzeug 150 bzw. Speicherwerkzeug 170 zur sofortigen Bestückung übergeben werden oder (b) vom Speicherwerkzeug 170 und/oder vom Entnahmewerkzeug 150 für einen darauffolgenden Bestückungstakt zwischengespeichert werden.
• • Übergabe von COB Chips 292b: COB Chips 292b, welche sich auf dem Speicherwerkzeug 170 befinden, werden direkt an den Bestückkopf 136 übergeben. COB Chips 292b, welche sich an dem Entnahmewerkzeug 150 befinden, werden zunächst an das Speicherwerkzeug 170 und von dort an den Bestückkopf 136 übergeben.
• • Übergabe von FCOB Chips 292a: FCOB Chips 292a, die sich an dem Entnahmewerkzeug 150 befinden, werden direkt an den Bestückkopf 136 übergeben. FCOB Chips 292a, die im Speicherwerkzeug 170 zwischengespeichert sind, werden zunächst zurück an das Entnahmewerkzeug 150 und von dort an den Bestückkopf 136 übergeben.
• • Eine Entnahme eines Chips 192 von bzw. aus dem Wafer 195 erfolgt dadurch, dass ein freier erster Sauggreifer 160 durch eine Drehung des Entnahmewerkzeugs 150 in der Entnahmeposition, insbesondere der ”6:00 Uhr Position”, gebracht wird. Dann wird der freie erste Sauggreifer 160 radial ausgefahren, der Chip 192 von dem Wafer 195 entnommen und der nun belegte erste Sauggreifer 160 wieder radial nach innen in seine ursprüngliche Position gefahren.
• • Eine Übergabe eines Chips 192 von dem Entnahmewerkzeug 150 auf das Speicherwerkzeug 170 erfolgt, indem der Chip 192 durch eine geeignete Drehung des Entnahmewerkzeugs 150 in die Übergabeposition 246 gebracht wird. Gleichzeitig wird das Speicherwerkzeug 170 so weit rotiert, dass sich an der Übergabeposition 246 ein freier zweiter Sauggreifer 180 befindet. Danach erfolgt die Übergabe, indem ein dem betreffenden ersten Sauggreifer 160 zugeordneter Radialantrieb aktiviert und der erste Sauggreifer 160 radial ausgefahren wird. Dann übernimmt der genannte bisher noch freie zweite Sauggreifer 180 den Chip 192.
• • Eine Übergabe eines Chips 192 von dem Speicherwerkzeug 170 auf das Entnahmewerkzeug 150 erfolgt, in dem der Chip 192 durch Drehung des Speicherwerkzeugs 170 in die Übergabeposition 246 gebracht wird. Gleichzeitig wird das Entnahmewerkzeug 150 so weit gedreht, dass sich an der Übergabeposition 246 ein freier bzw. unbelegter erster Sauggreifer 160 befindet. Danach erfolgt die Übergabe des Chips 192, in dem der oben genannte Radialantrieb, welcher dem sich in der Übergabeposition 246 befindlichen ersten Sauggreifer 160 zugeordnet ist, so aktiviert wird, dass dieser radial ausgefahren wird. Dann übernimmt in der Übergabeposition 246 der genannte bisher noch freie erste Sauggreifer 160 den Chip 192.

In the following some further optional procedural aspects and features of the method described in this document for transferring chips from a wafer to a placement head are described:

• • During a placement of chips 192 on the component carrier 190 can through the removal tool 150 largely continuously more chips 192 from the wafer 195 be removed. This can be the clock rate at which the chips 192 from the wafer 195 be removed during operation of the placement system 100 Depending on the process, it can be varied or adjusted. In particular, an adaptation of the clock rate of a chip removal from the wafer 195 during a transfer of FCOB chips 292a to the placement head 136 take place if (a) just no suitable free second suction pad 180 is available and / or if (b) a synchronization between the clock rate of the chip removal and the clock rate of a transfer of FCOB chips 292a and / or COB chips 292b at the placement head 136 is required.
• • The removed chips 192 be from the removal tool 150 for the purpose of caching to the storage tool 170 to hand over. This will be the second suction pads 180 at least partially with FCOB chips 292a and / or COB chips 292b busy.
• • Additionally or alternatively, at least some first suction pads 160 of the turning tool 150 for buffering FCOB chips 292a and / or COB chips 292b be used. Upon completion of a placement clock, the cached chips become 192 from the placement head 136 picked up. For this purpose, the placement is 136 to the respective pick-up position 256 respectively. 276 method. The rotatable removal tool 150 or the rotatable storage tool 170 positions a chip to be picked up 292a respectively. 292b by a suitable rotation about the respective axis of rotation 251 respectively. 271 in the respective pick-up position 256 respectively. 276 , These operations are repeated until the placement head 136 the required number of chips 192 has recorded.
• • Parallel to picking up chips 192 through the placement head 136 can, almost continuously, chips 192 through the removal tool 150 from the wafer 195 and then (a) the placement head 136 from the removal tool 150 or storage tool 170 for immediate loading or (b) from the storage tool 170 and / or the removal tool 150 be cached for a subsequent insertion cycle.
• • Transfer of COB chips 292b : COB chips 292b that are on the storage tool 170 are located directly to the placement head 136 to hand over. COB chips 292b , which are connected to the removal tool 150 are first to the storage tool 170 and from there to the placement head 136 to hand over.
• • Transfer of FCOB chips 292a : FCOB chips 292a , which are attached to the removal tool 150 are located directly to the placement head 136 to hand over. FCOB chips 292a in the storage tool 170 cached are first returned to the removal tool 150 and from there to the placement head 136 to hand over.
• • One pick of a chip 192 from or out of the wafer 195 takes place in that a free first suction gripper 160 by a rotation of the removal tool 150 in the removal position, in particular the "6:00 o'clock position". Then the free first suction pad 160 radially extended, the chip 192 from the wafer 195 taken and the now occupied first suction pads 160 again moved radially inward to its original position.
• • A handover of a chip 192 from the removal tool 150 on the storage tool 170 done by the chip 192 by a suitable rotation of the removal tool 150 in the transfer position 246 is brought. At the same time, the storage tool 170 rotated so far that is at the transfer position 246 a free second suction pad 180 located. Thereafter, the transfer takes place by a respective first suction pad 160 assigned radial drive activated and the first suction pad 160 is extended radially. Then takes the above-mentioned still free second suction pads 180 the chip 192 ,
• • A handover of a chip 192 from the storage tool 170 on the removal tool 150 takes place in which the chip 192 by rotation of the storage tool 170 in the transfer position 246 is brought. At the same time the removal tool 150 turned so far that at the transfer position 246 a free or unoccupied first suction gripper 160 located. Thereafter, the transfer of the chip takes place 192 , in which the above-mentioned radial drive, which in itself in the transfer position 246 located first suction pads 160 is assigned, is activated so that it is extended radially. Then take over in the transfer position 246 the said still free first suction pads 160 the chip 192 ,

3a and 3b show in a perspective and in a sectional representation of a suction gripper, as in particular as a first suction pads 160 for the removal tool 150 the chip transfer device 140 can be used.

The suction pad 160 has a sled 364b on which in a leadership 364a along the radial direction of the tool in question, in particular the storage tool 150 can be moved. The leadership 364a as well as the sled 364b form a radial bearing, taking the lead 364a stationary on a chassis of the storage tool 150 is appropriate.

Inside the outer housing part 363 is one as a hollow shaft 362 formed quill which at its top a vacuum connection 362a having. The quill 362 is in a guide bush 362b slidably mounted and secured against rotation, so that the quill 362 do not unintentionally turn around its longitudinal axis. A spiral spring 365 , which represents a passive spring element, ensures that in a starting position or zero position of the suction pads 160 in a lower position.

At the bottom of the quill 362 is a pneumatic coupling element 361 formed, to which in a known manner a pipette 369 can be infected or infected. For the sake of illustration of the function of the pipette 369 namely a component or here a chip 192 to hold on, is this chip 192 in the 3a and 3b shown.

At the chassis, not shown, is fixed in space with the guide 364a connected, a sensor ring 364c appropriate. This has the task of compressing or rebounding of the pipette 369 to detect.

According to the embodiment shown here is the suction pad 160 in terms of its radial mobility, a passive component of the removal tool 150 , This means that the suction pad 160 no own radial drive is assigned. For the suction pad has 160 a driver element 367 , which upon rotation of the removal tool 150 is moved in a fixed space or non-rotatable groove of a sliding guide, not shown. This groove is at the angular position, in the embodiment described above, the "6:00 o'clock position" and the "9:00 o'clock position", interrupted by a radially displaceable (and not shown) engagement element, which from one of the respective angular position associated stationary Linear drive is radially displaceable. With a rotation of the suction pad 160 in the relevant angular position is the driver element 367 brought into engagement with the engagement element, so that in this angular position of the removal tool 150 the suction pad 160 moved radially together with a movement of the driver. To a friction between the driver element 367 and reduce the slotted guide, according to the embodiment shown here, the driver element 367 an outer ring 367b on which by means of a ball bearing 367a is freely rotatable.

LIST OF REFERENCE NUMBERS

100

placement system

110

automatic placement

112

chassis

114

Data processing unit

120

portal system

122a

first guide element / portal root

122b

another first guide element / portal root

124a

carriage

124b

carriage

125

bearing elements

132

second guide element / movable cross member

134

second sled

136

placement

138

Chip holders / component-holding devices

140

Chip transfer device

144

Data processing unit

150

removal tool

160

first suction pad

170

memory tool

180

second suction pad

190

Component carrier / PCB

192

Chips / (unhoused) components

195

wafer

y

first direction

x

second direction

246

Transfer position

251

first axis of rotation

256

first pick-up position

260a

radial displacement

260b

radial displacement

271

second axis of rotation

276

second pick-up position

292a

FCOB chip

292b

COB chip

361

pneumatic coupling element

362

Hollow shaft / sleeve

362a

vacuum connection

362b

Anti-twist device for hollow shaft

363

outer housing part

364

radial bearings

364a

guide

364b

carriage

364c

sensor ring

365

Spiral spring (passive)

367

dogging

367a

ball-bearing

367b

outer ring

369

pipette

Claims (17)

Method for transferring chips ( 192 . 292a . 292b ) from a wafer ( 195 ) on a placement head ( 136 ) of a placement machine ( 110 ), where chips ( 292a respectively. 292b ) the placement head ( 136 ) at a first pick-up position ( 256 ) and at a second pick-up position ( 276 ), the chips ( 292a respectively. 292b ) with respect to their original orientation in the wafer ( 195 ) (i) at the first pick-up position ( 256 ) or (ii) at the second pick-up position ( 276 ) turned twice the placement head ( 136 ), the method comprising removing a chip ( 192 ) from the wafer ( 195 ) by means of a rotary removal tool ( 150 ); Turning the removal tool ( 150 ), so that the removed chip ( 192 ) at a transfer position ( 246 ) is located; and passing the chip ( 192 ) from the removal tool ( 150 ) to a rotatable storage tool ( 170 ); where, if a chip ( 292a ), hereinafter FCOB chip ( 292a ), simply turned to the placement head ( 136 ), the method further comprises: returning the FCOB chip ( 292a ) from the storage tool ( 170 ) to the removal tool ( 150 ); turning the removal tool again ( 150 ), so that the FCOB chip ( 292a ) at the first pick-up position ( 256 ) is located; and picking up the again with the removal tool ( 150 ) rotated FCOB chips ( 292a ) at the first pick-up position ( 256 ) from the placement head ( 136 ). Method according to the preceding claim, wherein if a chip ( 292b ), hereinafter COB chip ( 292b ), turned twice to the placement head ( 136 ), the method further comprises: rotating the storage tool ( 170 ), so that the COB chip ( 292b ) at the second pick-up position ( 276 ) is located; and picking up the from the storage tool ( 170 ) turned COB chips ( 292b ) at the second pick-up position ( 276 ) from the placement head ( 136 ). Method according to one of the preceding claims, wherein by means of the removal tool ( 150 ) a plurality of chips ( 192 ) and at least some of them to the storage tool ( 170 ) while the placement head ( 136 ) previously picked up chips (a) from the first pickup position ( 256 ) and / or from the second pick-up position ( 276 ) on a component carrier ( 190 ) and / or (b) back from a placement area to the first pick-up position ( 256 ) and / or the second pick-up position ( 276 ) emotional. Chip transfer device ( 140 ) for transferring chips ( 192 ) from a wafer ( 195 ) on a placement head ( 136 ) of a placement machine ( 110 ), the chip transfer device ( 140 ) comprising a rotatable removal tool ( 150 ) (a) for taking individual chips ( 192 ) from the wafer ( 195 ), (b) for turning the removed chips ( 192 ) as FCOB chips ( 292a ) at a first pick-up position ( 256 ) and (c) to transfer the removed chips ( 192 ) to a rotatable storage tool ( 170 ) as COB chips ( 292b ) at a second pick-up position ( 276 ) to provide; the rotatable storage tool ( 170 ) (a) for accepting chips ( 192 ) from the removal tool ( 150 ), (b) to re-invert the acquired chips ( 292b ) to these as the COB chips ( 292b ) at the second pick-up position ( 276 ) and (c) to be returned by the storage tool ( 170 ) temporarily cached chips ( 292a ) to the removal tool ( 150 ), as well as these as further FCOB chips ( 292a ) in the result simply turned at the second pick-up position ( 176 ) to provide; and a processor ( 144 ) for controlling the operation of the removal tool ( 150 ) and the storage tool, which is designed such that the method according to one of the preceding claims 1 to 3 is executable. Chip transfer device ( 140 ) according to the preceding claim, the removal tool ( 150 ) comprising a plurality of radially projecting first suction pads ( 160 ) for temporarily recording one chip at a time ( 192 . 292a . 292b ), with the first suction pads ( 160 ), in particular active chip holders ( 160 ) which are in relation to a first axis of rotation ( 251 ) of the removal tool ( 150 ) are movable in the radial direction; and the storage tool ( 170 ) comprising a plurality of radially projecting second suction pads ( 180 ) for temporarily recording each additional chip ( 192 . 292a . 292b ), wherein the second suction pads ( 180 ), in particular passive chip holders ( 180 ) which are stationary on a chassis of the storage tool ( 170 ) are arranged. Chip transfer device ( 140 ) according to the preceding claim, wherein the first suction pads ( 160 ) each have a first pneumatic coupling element ( 361 ) to which a first pipette ( 369 ) and / or wherein the second suction pads ( 180 ) each have a second pneumatic coupling element ( 361 ) to which a second pipette ( 369 ) can be coupled. Chip transfer device ( 140 ) according to one of the preceding claims 5 to 6, wherein the first suction pads ( 160 ) and / or the second suction pads ( 180 ) are rotatable about their longitudinal axis. Chip transfer device ( 140 ) according to one of the preceding claims 5 to 7, wherein the first suction pads ( 160 ) relative to the chassis of the rotary picking tool ( 150 ) are displaceable in the radial direction and / or the second suction pads ( 180 ) relative to a chassis of the rotatable storage tool ( 170 ) are displaceable in the radial direction. Chip transfer device ( 140 ) according to the preceding claim, wherein the removal tool ( 150 ) a first common radial drive for a radial displacement of the first suction pads ( 160 ) and / or wherein the storage tool ( 170 ) a second common radial drive for a radial displacement of the second suction pads ( 180 ) having. Chip transfer device ( 140 ) according to one of the preceding claims 5 to 9, wherein the first suction pads ( 160 ) and / or the second suction pads ( 180 ) are mounted sprung at least in the radial direction. Chip transfer device ( 140 ) according to one of the preceding claims 5 to 10, wherein the removal tool ( 150 ) a number of first suction pads ( 160 ) and / or wherein the storage tool ( 170 ) a number of second suction pads divisible by the number four ( 180 ) having. Chip transfer device ( 140 ) according to one of the preceding claims 5 to 11, wherein a second number of second suction pads ( 180 ) is greater, in particular by a factor of two, more particularly by a factor of four, as a first number of first suction pads ( 160 ). Chip transfer device ( 140 ) according to the preceding claim, wherein a ratio between (a) the second number and (b) the first number is an integer number, said integer number being in particular two, three, four, five or six. Chip transfer device ( 140 ) according to one of the preceding claims 5 to 13, wherein the first suction pads ( 160 ) on an outer circumference of the removal tool ( 150 ) are distributed so that at the same time (i) a removal of a chip ( 192 ) from the wafer ( 195 ) and (ii) a transfer of chips from the removal tool ( 150 ) to the storage tool ( 170 ) and / or a provision of an FCOB chip ( 292a ) at the first pick-up position ( 256 ) is possible and / or wherein the second suction pads ( 180 ) on an outer periphery of the storage tool ( 170 ) are distributed so that at the same time (i) a transfer of a chip ( 292a . 292b ) between the removal tool ( 150 ) and the storage tool ( 170 ) and (ii) providing a COB chip ( 292b ) at the second pick-up position ( 276 ) is possible. Placement system ( 100 ) for removing chips ( 192 ) from a wafer ( 195 ) and for loading a component carrier ( 190 ) with removed chips ( 292a . 292b ), the placement system ( 100 ) comprising a chip transfer device ( 140 ) according to any one of claims 4 to 14; and a placement machine ( 110 ) with a placement head ( 136 ) for picking up at the first pick-up position ( 256 ) provided FCOB chips ( 292a ) and / or for picking up at the second pick-up position ( 276 ) provided COB chips ( 292b ). Placement system ( 100 ) according to the preceding claim, wherein the sum of the number of first suction pads ( 160 ) and the number of second suction pads ( 180 ) is less than or equal to a number of chip holders ( 138 ) of the placement head ( 136 ). Placement system ( 100 ) according to one of the two preceding claims, wherein the chip transfer device ( 140 ) stationary on a chassis of the placement machine ( 110 ) is arranged.

Images