TWI656591B - Temporary storage of FCOB chips in chip-transfer devices - Google Patents

Abstract

The invention relates to a method for transferring chips from a wafer to an assembly head of an automatic assembly machine, a chip-transfer device and an assembly system with a chip-transfer device. The chip is flipped once at the first extraction position relative to its original position at the wafer, or twice at the second extraction position and provided to the mounting head. The method includes: removing the chip from the wafer by means of a rotatable extraction tool; twisting the extraction tool so that the chip is at the delivery position; and transferring the chip from the extraction tool to the rotatable storage tool. If the chip called FCOB chip below should be flipped once and transferred to the assembly head. The invention further includes a chip-transfer device for performing the method and an assembly system having such a chip-transfer device.

Description

   Temporary storage of FCOB chips in chip-to-pass devices   

The present invention relates to the technical field of assembling component carriers with electronic components, in particular, assembling component carriers with electronic components without shells that are configured as chips, and the electronic components are taken directly from the fabricated wafers and supplied to the assembly Craftsmanship. In particular, the present invention relates to a method of transferring chips from a wafer to an assembly head of an automatic assembly machine, as well as a chip-transfer apparatus that performs the method and an assembly system having an automatic assembly machine and such a chip-transfer apparatus.

In order to achieve a high degree of integration of electronic components in an efficient manner, it is known that electronic components configured as chips are taken directly from the wafer and placed on the component carrier to be assembled by means of the assembly head of an automatic assembly machine. In terms of its original orientation in the wafer, the chip can be positioned in a COB (chip on board) or flip-chip on board (flip-chip on board) manner (at 180 °) On the component carrier.

From the document EP 1 470 747 B1, a chip extraction system is known, with which chips removed from a wafer can optionally be transferred to the assembly head in the FCOB orientation at the first delivery position or in the COB orientation at the second delivery position To the assembly head. The chip take-out system has (a) a rotatable take-out tool for taking the chip from the wafer and turning the taken chip 180 ° around its longitudinal axis or lateral axis. And (b) a rotatable turning tool for turning the removed chip again 180 ° around its longitudinal axis or transverse axis, the turning tool co-acting with the removing tool in a common delivery position. The first extraction position is assigned to the removal tool, and the second extraction position is assigned to the turning tool. The chips are removed under the description of a so-called ejector, which releases the scattered chips of the wafer from the sticky carrier film and transfers them to the suction jig of the removal tool.

The speed of assembling the component carrier with COB components or COB chips and / or FCOB components or FCOB chips is mainly determined by the cycle time of the following two processes:

Cycle time 1: Transfer the chip from the wafer to the relevant extraction location. It is this cycle time to loosen or dig out the chip with the aid of the ejector tool, and the subsequent operations with the removal tool and, if necessary, with the turning tool.

Cycle time 2: Use the assembly head of the automatic assembly machine to assemble the COB or FCOB chip. Here, after receiving a plurality of chips, the assembly head moves to the assembly area of the automatic assembly machine. The received chip is then placed on the component carrier. Subsequently, the assembly head (with the chip released) is moved back to the first extraction position or to the second extraction position again, and then the COB or FCOB chip can be re-accepted here.

In the assembly process of COB or FCOB chips, the total cycle time is mainly determined by the above cycle time 1, specifically, the cycle time when the chip is loosened by the injector tool. The aforementioned cycle time 2 is typically significantly shorter.

Since the cycle times 1 and 2 are different, the utilization rate of the individual components of the mounting system is not uniform. The mounting system has an automatic mounting machine with a mounting head and a chip extraction system of the above type. This uneven utilization reduces the effective assembly efficiency, that is, reduces the number of COB or FCOB chips that can be assembled in a predetermined time period.

In summary, the object of the present invention is to improve the assembly efficiency when assembling a component carrier with a COB or FCOB chip.

This purpose is achieved by the content of the independent request item. The advantageous embodiments of the invention are described in the appendix.

According to a first aspect of the invention, a method of transferring a chip from a wafer to an assembly head of an automatic assembly machine is described, in which the chip can be flipped once at the first extraction position relative to its original position in the wafer (i), Or (ii) turn it over twice in the second extraction position and provide it to the assembly head. The methods described include: (a) removing the chip from the wafer by means of a rotatable removal tool; (b) twisting the removal tool so that the removed chip is at the delivery position; and (c) transferring the chip from the removal tool to the rotatable tool Storage tools. If the chip (hereinafter referred to as the FCOB chip) should be flipped once and transferred to the assembly head, the invention also includes: (d) sending the FCOB chip from the storage tool back to the removal tool, (e) re-twisting the removal tool, so that The chip is located at the first extraction position; and (f) at the first extraction position, the FCOB chip re-rotated by the extraction tool is received by the assembly head.

The method is based on the knowledge that not only COB chips can be stored by storage tools (referred to as flip tools in EP 1 470 747 B1). Instead, the FCOB chip can also be stored on the storage tool in an advantageous manner or by means of the storage tool in order to provide it to the first extraction location, as long as the FCOB chip is returned to the extraction tool again. That is, for the FCOB chip, there is no original function applied to the storage and flip tool, which has the function of re-fliping the COB chip.

Depending on the number of storage locations, more or less FCOB chips can be temporarily received by the storage tool, and these storage locations can be realized by means of conventional element-stop devices, respectively. It can be clearly seen here that as the number of temporarily stored FCOB chips increases, the period of time during which the FCOB chips are stored will also become longer. By reversing the rotation direction of the storage tool, the storage time of at least one FCOB chip can be shortened, but not the storage time of all temporarily stored FCOB chips.

It should be noted that the above method is only required when the FCOB chip should actually be temporarily stored. If such temporary storage is not required, it is of course possible to provide the FCOB chip at the first extraction location without using a storage tool.

Intuitively, the above method can be used to at least partially balance the difference between the above cycle times 1 and 2, so that the following processes can be achieved at least almost continuously and in time: (1) transferring the chip from the wafer to the relevant At the extraction location; and (2) mounting the chips provided at each extraction location on the component carrier to be assembled. In this way, the assembly efficiency of the assembly system with (1) the chip extraction system described above and known from EP 1 470 747 B1 (herein referred to as chip transfer system) and (ii) automatic Assembly machine. Especially in the case where the component carrier is mixed with both the FCOB chip and the COB chip, these two types of chips can achieve this balance.

Intuitively, it is possible to at least partially balance the relatively long cycle time 1 described above, which is determined by the process of loosening or digging out the chip by means of an ejector tool. That is, it is possible to avoid the long waiting time of the assembly head at the first extraction position, because the number of FCOB chips that can be provided at the first extraction position within the following time period is increased, and the assembly head has been used as the receiving FCOB during this period Chip preparation. Therefore, it is also possible to realize a substantially continuous assembly process for the FCOB chip. Accordingly, the assembly efficiency is improved accordingly.

It should be pointed out that due to the longer or more cycle time required for chip loosening or digging, the acceptance of FCOB chips and COB chips realized by the storage tool through the method cannot be accelerated. However, the storage tool receives the chips during a certain period of time during which the assembly head is responsible for positioning the chips received from the first extraction position and / or the second extraction position on the respective component carriers.

According to an embodiment of the present invention, if the chip (hereinafter referred to as a COB chip) should be flipped twice and transferred to the assembly head, the method further includes: (g) twisting the storage tool so that the COB chip is located at the second extraction position; And (h) The COB chip rotated by the storage tool is received by the assembly head in the first extraction position.

Intuitively, the storage tool now not only has the function of temporarily storing FCOB chips. Moreover, the storage device is also used to cause the COB chip to be turned over again after being turned once by the take-out tool, and thus brought (in the second extraction position) into the desired orientation. In this way, the component carrier can be effectively equipped with COB chips, but the component carrier can also be effectively mixed with COB chips and FCOB chips.

It should be noted that depending on the number of chip-storage locations, it is also possible to temporarily store COB chips on or at the storage tool. Therefore, not only can the assembly continuity of the FCOB chip be improved, but also the assembly continuity of the COB chip can be improved.

It should also be noted that the removal tool and / or the storage tool can be moved in different directions of rotation, ie in a clockwise or counterclockwise direction. Depending on the specific application, the rotation direction of the two tools can be the same or different. In addition, the rotation direction of the removal tool and / or storage tool can be changed or exchanged when necessary during operation.

According to another embodiment of the present invention, a plurality of chips are removed by means of an extraction tool and at least a few of them are transferred to the storage tool. At this time, the assembly head removes the previously received chips (a) from the first extraction position and / or The second extraction position is positioned on the component carrier, and / or (b) is moved back from the assembly area to the first extraction position and / or the second extraction position. This has the advantage that the chip-delivery device that executes the method is also activated in the time slot where the assembly head cannot receive the component. In this time slot, the stored FCOB chip and / or COB chip are transferred to the storage tool for the purpose of temporary storage. Then, the FCOB chip to be subsequently assembled is transferred to the removal tool, whereas the COB chip to be assembled is continuously and directly transferred from the storage tool to the second extraction location.

According to another aspect of the present invention, a chip-transfer device for transferring chips from a wafer to an assembly head of an automatic assembly machine is described. The chip-transfer device has a rotatable take-out tool, which (a) is used to take out the scattered chips from the wafer; (b) is used to flip the taken-out chip so that it is provided as a FCOB chip to the first extraction position, and (c) It is used to transfer the extracted chip to a rotatable storage tool, so as to provide it as a COB chip to the second extraction location. The chip-transfer device also has a rotatable storage tool, (a) to receive the chip from the removal tool; (b) to re-turn the received chip so that it is provided as a COB chip to the second extraction location, and (c) The chip temporarily stored by the storage tool is returned to the removal tool, so that it is finally flipped over once as another FCOB chip and provided to the second extraction location. In addition, the described chip-transfer device also has a processor for controlling the operation of the removal tool and the storage tool so that the above method can be performed.

The chip-transfer device is based on the following knowledge: In order to achieve a higher assembly efficiency, the relatively long chip removal time period given for transferring chips in the above method is at least partially balanced by means of Storage tools can not only temporarily store COB chips, but also temporarily store FCOB chips. If the assembly head can receive the FCOB chip at the first extraction position at a given time point, the temporarily stored FCOB chip can be transferred to the first extraction position very quickly. This makes it possible to significantly reduce the difficulty in providing the chip, especially at the first extraction location, in a simple and reliable manner.

It should be noted that the same mounting head can be used for both the FCOB chip provided at the first extraction location and the COB chip provided at the second extraction location. This is particularly advantageous if the electronic components should be produced by so-called mixed packaging of component carriers. In this mixed packaging situation, both the FCOB chip and the COB chip are positioned on the component carrier. Alternatively, however, the chips provided at different extraction positions can also be received by at least two different assembly heads.

According to an embodiment of the invention, the removal tool has a plurality of radially protruding first suction clamps for temporarily receiving the chips, wherein the first suction clamps are in particular active chip-stop devices, which can be removed relative The first axis of rotation of the tool moves in the radial direction. In addition, the storage tool has a plurality of radially protruding second suction jigs for respectively temporarily receiving another chip, wherein the second suction jig is a passive chip-stop device, which is statically arranged on the storage tool On the rack.

The use of passive chip-stop devices for storage tools has the effect that the storage tools can be implemented particularly simply. In addition to the actuator used to generate the controlled rotary motion, and in addition to the negative pressure generating device (which preferably can load the selected suction channel of the second suction clamp with negative pressure), the storage tool need not have other active components .

Intuitively, the storage tool can be realized with a simple suction gripper wheel, wherein the second suction gripper has no freedom of movement relative to the frame. With this, the second suction jig can be provided without moving parts such as a guide and a spring. Compared with active (movable) components, passive components are of course less prone to failure. Therefore, the (passive) storage wheel can reliably satisfy its function, and the sensor technology (eg, sensor) used to control the chip can be omitted. The storage tool can be realized in a cheap manner in this way, and is designed as a particularly robust tool.

The first suction jigs are radially displaceable in a first angular position and a second angular position. These suction jigs receive chips from the wafer in the first angular position, respectively, and the second angular position is assigned to a (common) delivery position. XX According to a particularly preferred embodiment below, the first angular position is also referred to as the 6 o'clock position, and the second angular position is also referred to as the 9 o'clock position. This radial displacement is not required in the third angular position (hereinafter also referred to as the 12 o'clock position), because the mounting head for extracting the FCOB chip usually has a z-axis with a Z-drive device. This means that the chip stopper of the mounting head, in particular as a suction gripper, can be moved (back and forth) along the first axis of rotation. The intuitive expression is that the movable z-axis of the mounting head in the first extraction position is responsible for receiving the FCOB chip in a gentle manner.

The radial displacement of the suction jig in the 6 o'clock position is responsible for removing the chip from the wafer in a mechanically gentle manner in a corresponding manner. In addition, the radial displacement of the suction jig in the 9 o'clock position has the effect of enabling the chip to transfer the chip mechanically and gently (in both directions) between the extraction tool and the storage tool.

It should be noted that the angular position mentioned above and, if necessary, below (which refers to the dial of the timepiece) does not necessarily have to coincide with the relevant time on the dial. According to a particularly preferred embodiment of the invention, these "clear expressions" are merely exemplary angular positions.

According to another embodiment of the invention, the first suction clamps each have a first pneumatic coupling element to which the first suction tube can be coupled. Alternatively or in combination, the second suction clamps each have a second pneumatic coupling element to which the second suction tube can be coupled. This has the advantage that these straws can be replaced in a simple manner when needed, and these straws are in practice components that are subject to intense wear.

In particular, the above-mentioned radial displacement of the first suction jig can be achieved by the radial displacement of the first pneumatic coupling element, which is also referred to as a pedestal sleeve. The first suction tube is arranged on the displaceable first pneumatic coupling element statically or without freedom of movement. As described above, since the second suction jig has no freedom of movement relative to the storage tool frame, the second pneumatic coupling element can be realized by a coupling structure that is simply statically disposed on the storage tool frame.

According to another embodiment of the invention, the first suction jig and / or the second suction jig can be rotated around its longitudinal axis. This has the advantage that, for subsequent correct positioning of the chip on the component carrier, the angular position of the chip received by each suction jig can be adjusted in a targeted manner when the chip is temporarily left on the extraction tool or storage tool. Therefore, if the chip is received by the mounting head, the twisting of the angular position of the chip can be avoided. However, it is also possible that by changing the angular position of the chip, the angular position of the chip can already be roughly adjusted on the chip-transfer device, so that the angular position only needs to be fine-tuned later on the assembly head.

The twisting of the suction jig can be achieved in a known manner in such a way that each suction jig of the removal tool and / or turning tool is equipped with its own rotary drive. In order to realize the structure of taking out the tool and / or turning the tool at a low cost, it is also possible to provide only a common rotary driving device for all the suction jigs of the related tools, which only interacts with the suction jig in the angular position of the related tools Mesh. In order to derive and change the angular position of the received chip in a targeted manner, a camera followed by an image evaluation device can be used in a known manner, which optically detects the chip located exactly in the imaging area of the camera.

According to the above concept, the storage tool is accordingly constructed as a particularly simple tool, and in many embodiments it is provided that only the removal tool is equipped with at least one rotary drive for the first suction jig. In order to be able to change the angular position of the chip to be communicated by means of the chip-transfer device described, this solution does not limit the FCOB chip. That is, the COB chip is temporarily held by the extraction tool when it is transferred from the wafer to the second extraction position, and as long as the extraction tool is equipped with a suitable rotation driving device, the angular position of the COB chip can also be changed.

According to another embodiment of the present invention, the first suction jig can be displaced in the radial direction relative to the rotatable removal tool frame. Alternatively or in combination, the first suction jig can be rotated relative to The storage tool rack is displaced in the radial direction. This has the advantage that the chip can be manipulated in a mechanically gentle manner, and in particular the chip can be transferred between the two tools in a mechanically gentle manner.

In this context, "movable in the radial direction" means that the associated suction jig can be displaced perpendicular to the axis of rotation of the tool that belongs to it.

As has been described above in connection with a storage tool having a simple structure, in a number of currently considered particularly preferred embodiments, it is provided that only the first suction jig of the removal tool can be displaced radially. If the two suction jigs involved in the transfer can be displaced radially, this is enough when the chip is transferred between the two tools. When the FCOB chip is received in the first extraction position and the COB chip is received in the second extraction position, such radial displacement of the relevant suction jig is unnecessary because the assembly head usually has a so-called Z-drive device, The chip-stop device of the head can be moved (or removed) to the relevant tool of the chip-stop device in a controlled manner by means of the Z-drive device.

According to another embodiment of the invention, the removal tool has a first common radial drive for radially moving the first suction clamp. Alternatively or in combination, the storage tool has a second common radial drive for radially moving the second suction clamp. This has the advantage that the radial displacement of the relevant suction jig can be achieved in a mechanically simple and structurally effective manner.

In order to achieve the radial movement of the suction jig, a common radial drive can be arranged at a fixed angular position relative to the rotation axis of each tool. This means that only the suction jig located exactly in the angular position subordinate to the relevant radial drive can be moved in the radial direction. This can be achieved in particular by suitably configured and movable levers and engaging elements, only when the relevant suction jig is in an angular position subordinate to the radial drives when it rotates around the axis of rotation of the tools, Only the lever and the engaging element are mechanically engaged.

In this context, according to the concepts already mentioned above, the storage tool is particularly structurally simple to construct, only the removal tool is provided with a common radial drive.

In particular, the removal tool preferably has two first radial drives. The first common radial drive is subordinate to the angular position of the removal tool, in which the chip is removed from the wafer. Especially in the case of combination with the above-mentioned injector-tool, the chip can be reliably taken out from the wafer through this. In such an embodiment, the second common radial drive is subordinate to the angular position of the removal tool, ie in this angular position the chip is transferred to the storage tool. Preferably, the chip is removed from the wafer at the so-called 6 o'clock position, and / or the chip is transferred between the removal tool and the storage tool at the so-called 9 o'clock position of the extraction tool. It is also preferable that the 9 o'clock position of the removal tool corresponds to the 3 o'clock position of the storage tool.

According to another embodiment of the invention, the first suction jig and / or the second suction jig is elastically supported at least in the radial direction. This allows the chip to be manipulated in an advantageous manner during all transfers. These transfer processes are in particular: (i) removing the chip from the wafer; (ii) transferring the chip between the turning tool and the storage tool; (iii) receiving the FCOB chip through the assembly head; and / or (iv) through one or Multiple assembly heads accept COB chips.

In particular, the elastic support can be achieved by a passive spring element, which elastically supports the associated suction clamp on its tool in the direction of the radial drive.

According to another embodiment of the present invention, the removal tool has a first suction jig whose number is divisible by four. Alternatively or in combination, the storage tool has a second suction jig whose number is divisible by four.

With this, the suction jig can be arranged symmetrically on the respective tool in an advantageous manner, and thus the tool removal or storage tool can be realized simply in structure.

According to another embodiment of the invention, the second number of the second suction jig is greater than the first number of the first suction jig, in particular by two factors and also by four factors. This has the advantage that, on the one hand, the removal tool can be implemented relatively simply and therefore economically relatively advantageous. On the other hand, the storage tool has a higher storage capacity, which can be realized with a simpler structure (no radial drive and / or rotary drive required).

According to another embodiment of the invention, the ratio between (a) the second number and (b) the first number is an integer, wherein the integer is especially 2, 3, 4, 5, or 6. The advantage is that the movement of the removal tool can be synchronized with the movement of the storage tool in a simple manner, wherein the chip can be transferred between the two tools in multiple combinations of the angular positions of the two tools.

According to another embodiment of the present invention, the first suction jig is distributed on the outer circumference of the extraction tool so that (a) while removing the chip from the crystal, (b) transferring the chip from the removal tool to the storage tool FCOB chips are provided on and / or at the first delivery location. Alternatively or in combination, the second suction jig is distributed on the outer circumference of the storage tool so that (a) while transferring the chip between the removal tool and the storage tool, (b) at the second delivery position The COB chip is provided. This embodiment can realize the synchronized operation of the entire chip-transfer device in an advantageous manner. This helps to improve chip-to-delivery efficiency, where chip-to-delivery efficiency refers to the number of FCOB chips and / or COB chips that can be transferred to the first or second extraction location within a predetermined time period.

According to another aspect of the invention, a mounting system is described for removing chips from a wafer and assembling the component carrier with the removed chips. The described assembly system has (a) a chip-transfer device of the type described above; and (b) an automatic assembly machine with an assembly head for extracting FCOB chips provided at the first extraction location, and / or for extracting The COB chip provided at the second extraction location.

The assembly system is based on the following knowledge: the above chip-transfer device can be functionally coupled to the automatic assembly machine in such a way that without a chip manipulation step, components or chips without a housing can be assembled Component carriers, especially on circuit boards.

According to an embodiment of the present invention, the sum of the number of first suction jigs and the number of second suction jigs is less than or equal to the number of chip-stop devices of the mounting head. This has the advantage that the operation of the automatic assembly machine and the operation of the chip-transfer device can be synchronized in a simple manner. Therefore, it is possible to avoid undesirable extra operation time during the overall operation, and to increase the assembly efficiency accordingly.

According to an embodiment of the invention, the chip-transfer device is statically arranged on the frame of the automatic assembly machine. This has the advantage that when assembling multiple chips, it is not necessary for the entire chip-transfer device to move relative to the wafer or relative to the automatic assembly machine. Only the wafer has to be moved relative to the automatic assembly machine and also to the chip-transfer device in order to take out different chips with the chip-transfer device (of course they are also located at different positions on the wafer) and then place it on the component carrier by means of the mounting head.

The movement of the wafer can be achieved by means of a common x-y-positioning system, where the stationary part of the x-y-positioning system is arranged to be fixed to the frame of the automatic assembly machine. The movable part of the x-y-positioning system carries the wafer along with it.

It should be noted that the embodiments of the present invention have been described with reference to different inventive content. In particular, several embodiments of the invention with device request items are described, and other embodiments of the invention with method request items are described. Professionals can immediately understand when reading this application, if there is no other detailed description, in addition to these combinations of features belonging to this type of invention, any combination of these features may also be realized, and these arbitrary combinations of features belong to other Type of invention.

Before describing the exemplary embodiments of the present invention with reference to the accompanying drawings, several technical ideas are also described in conjunction with the exemplary embodiments of the present invention.

According to the invention, the flip tool of the chip extraction system known from EP 1 470 747 B1 is used to temporarily store FCOB chips. The at least almost continuous assembly process of the FCOB chip and / or COB chip can be realized on the component carrier by positioning the chip on the component carrier to simultaneously remove the chips required for the next assembly cycle from the wafer in the current assembly cycle Take it out. These extracted chips are temporarily stored in the flip tool until it is extracted by the assembly head. This flip tool is referred to as a storage tool in this document. The number of chip storage locations on the storage tool is so large that at least most of the FCOB chips and / or COB chips needed for the next assembly cycle can be temporarily stored. The remaining required chips can be taken from the wafer and provided to the extraction location, at which time the assembly head extracts the temporarily stored chips at another extraction location.

The chip storage location can be realized in particular by means of a suction jig, which, together with another suction jig, is arranged on the storage tool so as to project radially in the circumferential direction. Appropriate vacuum or negative pressure production equipment is necessary in order to provide the suction force required to hold the chips with the aid of suction jigs. A suitable negative pressure generation method is sufficiently known from the prior art, so it will not be further described in this document. The same applies to the ejector or ejector tool, by means of which the chip is released from the sticky carrier film of the wafer.

Other advantages and features of the invention result from the following exemplary description of the presently preferred embodiments. The individual drawings in this file are only schematic and the scale is incorrect.

100‧‧‧ Assembly system

110‧‧‧Automatic assembly machine

112‧‧‧Rack

114‧‧‧Data processing unit

120‧‧‧Longmen system

122a‧‧‧First guide element / Longmen foundation

122b‧‧‧Additional first guide element / gantry foundation

124a‧‧‧slider

124b‧‧‧slider

125‧‧‧Supporting element

132‧‧‧Second guide element / movable lateral carrier

134‧‧‧Second slider

136‧‧‧ Assembly head

138‧‧‧chip-stop element / component-stop device

140‧‧‧chip-transfer device

144‧‧‧ data processing unit

150‧‧‧Removal tool

160‧‧‧First suction fixture

170‧‧‧Storage tool

180‧‧‧Second suction fixture

190‧‧‧Component carrier / circuit board

192‧‧‧chip / (without housing) components

195‧‧‧chip

y‧‧‧first direction

x‧‧‧Second direction

246‧‧‧Submit location

251‧‧‧The first axis of rotation

256‧‧‧First extraction location

260a‧‧‧Radial displacement

260b‧‧‧Radial displacement

271‧‧‧Second axis of rotation

276‧‧‧Second extraction location

292a‧‧‧FCOB chip

292b‧‧‧COB chip

361‧‧‧Pneumatic coupling element

362‧‧‧Hollow shaft / top sleeve

362a‧‧‧vacuum interface

362b‧‧‧ Torsion of hollow shaft

363‧‧‧External shell parts

364‧‧‧Radial bearing

364a‧‧‧Guide

364b‧‧‧slider

364c‧‧‧sensor ring

365‧‧‧coil spring (passive)

367‧‧‧Lever element

367a‧‧‧Ball bearings

367b‧‧‧Outer ring

369‧‧‧ straw

FIG. 1 shows in a schematic diagram an assembly system with a chip-transfer device according to an embodiment of the invention.

Figures 2a and 2b show the chip-transfer device in two different operating states, (a) providing a COB chip and (b) providing an FCOB chip.

Figures 3a and 3b show suction clamps in perspective and cut-away views, which can be used in particular for the removal tool of the chip-transfer device.

The following describes the implementation of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. In addition, the present invention can also be implemented or applied by other different specific embodiments, and various modifications and changes can be made without departing from the spirit of the present invention.

It should be noted that in the following detailed description, the features or components of different embodiments (they are the same or at least functionally the same as the corresponding features or components of other embodiments) are provided with the same reference marks or different reference marks, which are The last two letters have the same reference signs for the same or at least functionally identical features or components. In order to avoid unnecessary repetition, the features or components that have been explained with the aid of the previously described embodiments will not be explained in detail later.

In addition, it should be pointed out that the embodiments described below are only selected from possible embodiments of the present invention. In particular, it is possible that the features of the individual embodiments are combined with each other in an appropriate manner, so that the skilled person can consider many different embodiments with the help of the embodiments described in detail here as clearly disclosed.

In addition, it should be noted that the concepts of space such as "front" and "rear", "upper" and "lower", "left" and "right" are applied to describe the relationship between one element and another element or other elements As shown in these drawings. Therefore, these space-related concepts can be applied to orientations different from those shown in the drawings. However, it should be understood that in order to simplify the description, all of these space-related concepts refer to the orientation described in the drawings, but it is by no means limited because these described devices, components, etc. can occupy and be used in the drawings. The orientation described in is different.

FIG. 1 shows in a schematic diagram an assembly system 100 with a chip transfer device 140 and an automatic assembly machine 110. The automatic assembly machine 110 is equivalent to a conventional automatic assembly machine in terms of basic structural features. Therefore, the basic functions of the automatic assembling machine 110 and various components not shown are not explained in detail.

The automatic assembly machine 110 has a frame 112, which is schematically shown by solid lines in FIG. 1a. The frame 112 provides a frame structure on which the individual components of the automatic assembly machine 100 are directly or indirectly arranged.

A gantry system 120 is provided on the frame 112, which includes two guide elements in a known manner, which are the foundation of the gantry. According to the embodiment shown here, the gantry foundation consists of a first guide element 122a and another first guide element 122b. The two first guide elements 122a and 122b each have a longitudinal bearing rail which extends in the first direction. This first direction is shown in Figure 1a as the y-direction.

The gantry system 120 also has two sliders 124a and 124b. The slider 124a is movably arranged on the guide element 122a, so that it can be moved or positioned in the y-direction by means of a drive not shown. The slider 124b is arranged on the guide element 122b so as to be able to move in a corresponding manner. The purpose of the drive, also not shown, is to move the two sliders 124a and 124b in the same way or simultaneously in the y-direction. The function of the support element 125 is to reliably move the two sliders 124a and 124b along the precisely defined trajectory in the y-direction.

A second guide element 132 extends between the two sliders 124a and 124b, which is configured as a movable lateral carrier and has a longitudinal extension along the second direction. The second direction is also referred to as the x-direction in FIG. 1a and below. A second slide 134 is arranged on the transverse carrier 132 and is guided. The second slide 134 can be moved or positioned in the x-direction by means of a drive, also not shown. The second slider 134 is a mechanical platform on which the assembly head 136 is fixed. According to the embodiment shown here, the mounting head 136 is a so-called multi-body mounting head, which has a plurality of chip stoppers 138 configured as straws, which are each used to temporarily receive electronic components in a known manner.

In order to assemble the component carrier 190, the assembly head 136 is first moved in a known manner by appropriate control of the gantry system 120 to the unillustrated component-extraction area in which the electronic components or chips 192 without housings are replaced -Delivery device 140 provides. These provided chips 192 are extracted there by the mounting head 136 and are again transferred to the mounting area by appropriate control of the gantry system 120, where the chips 192 are placed on the component carrier 190.

The data processing unit 14 is responsible for coordinated control of the drives for the two sliders 124a, 124b, the assembly head 136, and other components known to the professional in the automatic assembly machine 110. Such a component is, for example, a transfer system, which is used to bring the component carrier 190 into the automatic assembly machine 110 before assembly, and to remove it from the automatic assembly machine 110 again after at least partial assembly thereof. According to the embodiment shown here, the data processing unit 114 is coupled to the data processing unit 144, which controls the chip-transfer device 140 in such a way that its operation is synchronized with the operation of the automatic assembly machine 110. In order to make the view clear, the communication coupling between the two data processing units 114 and 144 is not shown in FIG. 1. Of course, these two data processing units 114 and 144 can also be realized by a single common data processing unit. This can be achieved in particular by performing the function of the document processing unit 144 in the document processing unit 114 of the automatic assembly machine 110.

The chip-transfer device 140 has a rotatable removal tool 150 and a rotatable storage tool 170, which work together in a common delivery position not shown in FIG. 1 to transfer the chip 192. The axes of rotation of the two tools 150 and 170 are parallel to the y-direction marked on the upper left of FIG. 1. The extraction tool 150 can temporarily receive the chip 192 from the wafer 195 by means of the first suction jig 160, which is distributed along the outer circumference of the extraction tool 150 and extends radially outward from the frame of the extraction tool 150 Out. In a corresponding manner, the storage tool 170 can temporarily receive the chip 192 provided by the extraction tool 150 by means of the second suction jig 180, which is distributed along the outer circumference of the storage tool 170 and radially from the storage tool 170 The rack extends outward.

According to the embodiment shown here, the chip transfer device 160 is fixedly arranged on the automatic assembly machine 110. This means that when a different chip 192 is removed from the wafer 195, the wafer must be moved by means of a suitable and not shown xy-surface positioning system to enable the removal tool 150 to enter a different location or touch the wafer 195 Different chips 192.

Figures 2a and 2b show the chip-transfer device 140 in two different operating states. In the first operating state shown in FIG. 2a, the COB chip 292a is provided to the assembly head 136 of the automatic assembly machine 110, which is only partially shown, for extraction and subsequent assembly purposes. In the second operating state shown in FIG. 2b, the assembly head 136 is provided with FCOB chips. The FCOB chip 292a is provided at the first extraction location 256 (see FIG. 2b), and the COB chip 292b is provided at the second extraction location 276 (see FIG. 2a).

According to the embodiment shown here, the extraction tool 150 has four first suction jigs 160. As shown in these two figures 2a and 2b, the storage tool 170 has 16 suction jigs 180 in total. The extraction tool 150 can rotate around the first rotation axis 251, and the storage tool rotates around the second rotation axis 271 during operation.

To transfer the chip 192 (that is, the FCOB chip 292a and / or the COB chip 292b), the removal tool 150 and the storage tool 170 work together in a common delivery location 246. According to the embodiment shown here, this common delivery position 246 corresponds to the so-called "9 o'clock position" for the rotatable removal tool 150 and to the "3 o'clock position" for the rotatable storage tool 170 . At the "6 o'clock position" of the extraction tool 150, the chip is removed from the wafer 195. The first extraction position 256 is located at the "12 o'clock position" of the removal tool 150, and the second extraction position 276 is located at the "12 o'clock position" of the storage tool 170.

In order to reliably manipulate the chips 192, 292a, 292b, the first suction jig 160 that removes the chip 192 from the wafer 195 must be able to be displaced in the radial direction (relative to the first rotation axis 251). In FIGS. 2a and 2b, the radial displacement when removing the chip 192 is shown by the double arrow 260a. It is also necessary that at least one of the first suction jig 160 and the second suction jig 180 can be displaced in the radial direction, and these two suction jigs participate in the chip 192 between the removal tool 150 and the storage tool 170 Of passing. This radial displacement is preferably achieved by the radial displacement of the associated first suction jig 160 within the delivery position 246. In this way, the storage tool 170 can be realized as a substantially passive tool with respect to the second suction jig 180, and thus can be realized in a simple and economically advantageous manner. In FIGS. 2a and 2b, the radial displacement when transferring the chip 192 is shown by the double arrow 260b.

Typically, the first suction jig 160 does not need to be radially displaced at the first extraction position 256, and the second suction jig 180 does not need to be radially displaced at the second extraction position 276 because the chip-stop device of the mounting head 136 138 can usually move in the z-direction, and can gently drive to each extraction position 256, 276 when extracting the chip 292a or the chip 292b.

In particular, the above-mentioned radial displacement of the first suction jig 160 can be achieved by a separate radial drive (each first suction jig 160 is equipped with a radial drive) or by a common radial drive. In the common radial drive, only in the respective working position, that is to say, in the "6 o'clock position" in order to extract the chip 192 and in the "9 o'clock position" in order to transfer the chip 192, the fixed subordinate working position The radial drive and the first suction clamp 160 located exactly in the corresponding working position are mechanically engaged.

The following describes some other optional structures and features of the assembly system 100 and its chip-transfer device 140 with reference to FIGS. 1, 2a, and 2b: The two extraction positions 256 and 276 are located near the automatic assembly machine 110, so that they It can be reached by the assembly head 136. The chip transfer device 140 can also be integrated at least partially in the automatic assembly machine 110, so the two extraction positions 256 and 276 are located inside the automatic assembly machine at a height that does not require structural changes to the automatic assembly The machine 110 can extract the FCOB chip 292a and / or the COB chip 292b through the mounting head 136.

The two extraction positions 256 and 276 are preferably located at the same working height. In addition, the two extraction positions 256 and 276 can be reached by the same assembly head 136. When the mounting head 136 is appropriately configured, the FCOB chip 292a and / or the COB chip 292b can be extracted not only continuously but simultaneously. Therefore, the assembly system 100 can be used to realize the hybrid packaging (FCOB chip 292a and COB chip 292b) in an advantageous manner.

In addition, the chip-transfer system 140 can also be fixed on the second slider 134 instead of the assembly head 136 with the special retrofitting costs of the conventional automatic assembly machine. In this case, the chip-transfer device 140 not only satisfies the function of removing and flipping the chip 192, but also additionally satisfies the function of positioning or assembling the chip 192 on the component carrier 190.

The following describes the angles and features of the optional methods related to the methods described in this document, which are used to transfer chips from the wafer to the mounting head.

When the chip 192 is mounted on the component carrier 190, the chip 192 can be continuously removed from the wafer 195 to a large extent by the removal tool 150. Here, during the operation of the assembly system 100, the frequency of taking out the chips 192 from the wafer 195 can be changed or adjusted according to the process. (a) if there is no suitable free second suction jig 190 available, and / or (b) if the chip-removal frequency and the transfer frequency of the FCOB chip 292a and / or COB chip 292b to the assembly head 136 It must be synchronized between them, in particular, the frequency of taking out the chip from the wafer 195 can be adjusted when the FCOB chip 292a is transferred to the mounting head 136.

The removed chip 192 is transferred from the removal tool 150 to the storage tool 170 for the purpose of temporary storage. Therefore, the second suction jig 180 is at least partially occupied by the FCOB chip 292a and / or the COB chip 292b.

Additionally or additionally, at least several first suction jigs 160 of the turning tool 150 can also be used to temporarily store the FCOB chip 292a and / or the COB chip 292b. After the end of the assembly cycle, the temporarily stored chips are extracted by the assembly head 136. For this, the assembly head 136 is moved to the respective extraction position 256 or 276. The rotatable extraction tool 150 or the rotatable storage tool 170 positions the chips 292a or 292b to be extracted in the respective extraction positions 256 or 276 by appropriate rotation around the respective rotation axes 251 or 271. These processes are repeated so long until the mounting head 136 receives the required number of chips 192.

While extracting the chip 192 through the mounting head 136, the chip 192 can be taken out of the wafer 195 almost continuously by the taking-out tool 150, and then (a) the chip is transferred from the taking-out tool 150 or the storage tool 170 to the mounting head 126, To achieve immediate assembly; or (b) The storage tool 170 and / or removal tool 150 temporarily store the chip for the next assembly cycle.

Transfer COB chip 292b: transfer the COB chip 292b located on the storage tool 170 directly to the mounting head 136. First, the COB chip 292b located on the removal tool 150 is transferred to the storage tool 170, and transferred to the assembly head 136 there.

Transfer FCOB chip 292a: Transfer the FCOB chip 292a located on the extraction tool 150 directly to the assembly head 136. First, the FCOB chip 292a that is temporarily stored in the storage tool 170 is returned to the removal tool 150, and is transferred to the assembly head 136 there.

The chip 192 is removed from the wafer 195 by the first free suction jig 160 being brought into the removal position, in particular the "6 o'clock position" by the rotation of the removal tool 150. The idle first suction jig 160 is then moved out radially, and the chip 192 is taken out of the wafer 195, and the suction jig 160 now occupied is again moved radially inward into its original position.

Since the chip 192 is brought into the delivery position 246 by proper rotation of the removal tool 150, the chip 192 is transferred from the removal tool 150 to the storage tool 170. At the same time, the storage tool 170 rotates in such a way that the free second suction jig 180 is located at the delivery position 246. The transfer is achieved by activating the radial drive subordinate to the relevant first suction jig 160 and driving the first suction jig 160 radially out. Subsequently, the second suction jig 180, which has been idle so far, receives the chip 192.

Since the chip 192 is brought into the delivery position 246 by appropriate rotation of the storage tool 170, the chip 192 is transferred from the storage tool 170 to the removal tool 150. At the same time, the extraction tool 150 is rotated in such a way that the free or unoccupied suction jig 160 is located at the delivery position 246. Subsequently, the chip 192 is transferred, where the aforementioned radial drive is activated so that it moves out radially, which is subordinate to the first suction jig 160 located in the delivery position 246. Subsequently, the first suction jig 160 that has been idle so far receives the chip 192.

FIGS. 3 a and 3 b show suction clamps in perspective and cut-away views, which can be used in particular as a first suction clamp 160 for the extraction tool 150 of the chip-transfer device 140.

The suction jig 160 has a slider 364b that can move in the radial direction of the relevant tool (especially the storage tool 150) in the guide 364a. The guide 364a and the slider 364b constitute a radial bearing, wherein the guide 364a is statically arranged on the frame of the storage tool 150.

A pedestal sleeve formed as a hollow shaft 362 is located on the outer housing part 363, and the pedestal sleeve has a vacuum interface 362a on its upper side. The pedestal sleeve 362 is supported in the guide sleeve 362b in a sliding and torsional manner Therefore, the center seat sleeve 362 does not accidentally rotate around its longitudinal axis. The function of the coil spring 365 (which is a passive spring element) is to position the suction jig 160 in the lower position in the home position or the zero position.

A pneumatic coupling element 361 is arranged on the underside of the pedestal sleeve 362, and the suction tube 369 fits or is worn on this coupling element in a known manner. To demonstrate the function of the straw 369 (that is, to hold the element or chip 192), the chip 192 is shown in FIGS. 3a and 3b.

In the case of being fixed to the guide 364a, a sensor ring 364c is provided on a frame not shown. Its task is to detect whether the straw 369 pops in or out.

According to the embodiment shown here, the suction jig 160 is a passive component of the extraction tool 150 in terms of radial mobility. This means that the suction jig 160 is not equipped with its own radial drive. To this end, the suction jig 160 has a lever element 367 that moves into a fixed or non-rotatable groove of the link guide not shown when the extraction tool 150 is rotated. The groove is interrupted in the angular position (in the above-mentioned embodiment "6 o'clock position" and "9 o'clock position") by radially displaceable (and not shown) engagement elements, which can be subordinate to The stationary linear drive at each angular position moves radially. When the suction jig 160 is rotated into the relevant angular position, the lever member 367 is engaged with the engaging element, so in this angular position of the extraction tool 150, the suction jig 160 can be moved radially along with the movement of the lever member. In order to reduce the friction between the lever element 367 and the link guide, according to the embodiment shown here, the lever element 367 has an outer ring 367b, which can rotate freely by means of a ball bearing 367a.

It should be noted that the concept "having" does not exclude other elements, and "one" does not exclude multiple. Elements described in conjunction with different embodiments can also be combined with each other. It should also be noted that the reference mark in the request item is not used to limit the protection scope of the request item.

The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be subject to the scope of the patent application, and not limited to the above-mentioned embodiments.

Claims (13)

A chip-transfer device for transferring chips from a wafer to an assembly head of an automatic assembly machine, wherein: the chip-transfer device has a rotatable take-out tool, which (a) is used to take out scattered chips from the wafer; (b) It is used to turn over the removed chip and provide it as a FCOB chip to the first extraction location, and (c) to transfer the removed chip to a rotatable storage tool and to provide it as a COB chip to the second extraction Position; a rotatable storage tool, which (a) is used to remove the scattered chips from the removal tool; (b) is used to re-turn the received chip so that it is provided as a COB chip to the second extraction location, and (c ) Return the chip temporarily stored by the storage tool to the removal tool, so that it is finally flipped once as another FCOB chip and provided to the second extraction location; and a processor, which is used to control the removal tool and the storage tool; the removal tool A plurality of radially protruding first suction jigs for temporarily receiving chips, wherein the first suction jig is an active chip-stop device, which can The first axis of rotation moves in a radial direction; and the storage tool has a plurality of radially protruding second suction jigs for temporarily receiving another chip, wherein the second suction jig is a passive chip-stop The device is statically arranged on a rack storing tools. The chip-transfer device as described in item 1 of the patent application range, wherein: the first suction jigs each have a first pneumatic coupling element to which the first suction tube can be coupled; and / or the second suction jig Each has a second pneumatic coupling element to which a second straw can be coupled. The chip-delivery device according to any one of claims 1 or 2, wherein the first suction jig and / or the second suction jig can rotate about its longitudinal axis. The chip-transfer device as described in item 1 of the patent application range, wherein: the first suction jig can be displaced in a radial direction relative to the rotatable removal tool frame, and / or the second suction jig can be relative to The frame of the rotatable storage tool is displaced in the radial direction. The chip-transfer device according to item 4 of the patent application scope, wherein: the extraction tool has a first common radial drive for radially moving the first suction jig; and / or wherein the storage tool has a second common Radial drive for moving the second suction fixture radially. The chip transfer device according to item 1 of the patent application scope, wherein the first suction jig and / or the second suction jig is elastically supported at least in the radial direction. The chip-transfer device as described in item 1 of the patent application range, wherein: the extraction tool has a first suction jig, the number of the first suction jig is divisible by 4, and the storage tool has a second suction jig, the first 2. The number of suction jigs is divisible by 4. The chip-delivery device as described in item 1 of the patent application range, wherein the second number of the second suction jig is larger than the first number of the first suction jig, especially by two factors and also by four factors. The chip-transfer device as described in item 8 of the patent application scope, wherein: the ratio between (a) the second number and (b) the first number is an integer, wherein the integer is especially 2, 3, 4, 5 or 6. The chip-transfer device as described in item 1 of the patent application range, wherein the first suction jig is distributed on the outer circumference of the extraction tool so that (ii) while removing the chip from the crystal, (ii) The chip is transferred from the removal tool to the storage tool and / or the FCOB chip is provided at the first delivery position, and / or the second suction jig is distributed on the outer circumference of the storage tool so that (i) the removal tool and While transferring the chips between the storage tools, (ii) provide the COB chip at the second delivery location. An assembly system for extracting chips from a wafer and assembling the component carrier with the extracted chips, wherein: the assembly system has: a chip-transfer device as described in any one of items 1 to 10 of the patent application scope; and An automatic assembly machine with an assembly head for extracting FCOB chips provided at a first extraction location, and / or for extracting COB chips provided at a second extraction location. An assembly system as described in item 11 of the patent application range, wherein the sum of the number of first suction jigs and the number of second suction jigs is less than or equal to the number of chip-stop devices of the assembly head. The assembly system as described in any one of items 11 or 12 of the patent application scope, wherein the chip-transfer device is statically arranged on the frame of the automatic assembly machine.