DE112019007800T5 - component feeder - Google Patents

Abstract

A component feeder capable of further size reduction is provided. The component feeder includes a pickup section and a transfer section. The pickup section picks up a first component with its first face facing up with the component holding head facing down, and the pickup section tilts up the component holding head that has picked up the first component to pick up the first component with its second Feed the mounting head to the surface that is pointing upwards. The passing section receives a second component from the component holding head which has picked up the second component, the component holding head being slanted upward while the component holding head is tilted up from below, the passing section then feeding the second component to the mounting head.

Description

technical field

The present invention relates to a component feeder.

State of the art

Heretofore, there has been known a component feeder which takes out a component from a feed section to feed the component to a mounting head (e.g., see Patent Document 1).

patent specification

Patent Document 1: JP-A-2005-93667

Summary of the Invention

The problem to be solved by the invention

However, there is still room for improvement from the viewpoint of downsizing the component feeder.

It is thus an object of the present invention to solve the above problem and to provide a component feeder capable of further size reduction.

means of solving the problem

In order to achieve the above-mentioned object, a component feeder according to an aspect of the present invention includes a pickup section and a transfer section. The component feeder feeds a component having a first surface and a second surface opposite the first surface to a mounting head that mounts the component on a substrate. The receiving portion includes a component holding head that holds a component. The accommodating portion accommodates a first component with the first surface facing upward with the component holding head facing downward. The pickup section tilts up the component holding head with the picked-up first component to convey the first component with its second face up to the mounting head. The passing portion receives a second component from the component holding head having the received second component, the component holding head being slanted upward while the component holding head is tilted from downward to upward. Then the delivery section delivers the second component to the mounting head.

effect of the invention

According to the component feeder of the present invention, the component feeder can be made even smaller.

character list

• 1 12 is a plan view showing a schematic configuration of a component mounter according to an embodiment of the present invention.
• 2 12 is a plan view showing a schematic configuration of a first component feeder according to the present invention.
• 3 14 is a cross-sectional view along the X-direction showing the schematic structure of the first component feeder according to the present invention.
• 4 12 is a plan view showing a schematic configuration of a carrier holding portion according to the embodiment of the present invention.
• 5 12 is a plan view showing a schematic configuration of the carrier holding portion that does not hold a carrier according to the embodiment of the present invention.
• 6 12 is a plan view showing a schematic configuration of a holder body according to the embodiment of the present invention.
• 7 12 is a plan view showing a schematic configuration of the carrier held by the carrier holding portion according to the embodiment of the present invention.
• 8th FIG. 14 is a cross-sectional view taken along line AA of FIG 5 12 showing the state before the carrier is held by the carrier holding portion according to the embodiment of the present invention.
• 9 FIG. 14 is a cross-sectional view taken along line AA of FIG 5 12 showing the state of holding the carrier by the carrier holding portion according to the embodiment of the present invention.
• 10 12 is a plan view showing a schematic configuration of a movable base according to the embodiment of the present invention.
• 11 FIG. 14 is a cross-sectional view taken along line BB of FIG 5 , representing the state of Hal tens of the carrier by the carrier holding portion according to the embodiment of the present invention.
• 12 12 is a cross-sectional view taken along line CC of FIG 5 12 showing the state of holding the carrier by the carrier holding portion according to the embodiment of the present invention.
• 13 12 is a cross-sectional view showing a schematic configuration of a pickup unit according to the present invention.
• 14 12 is a side view showing schematic configurations of a receiving section and a relaying section according to the embodiment of the present invention.
• 15 12 is a side view showing schematic configurations of the receiving section and the relaying section according to the embodiment of the present invention.
• 16 12 is a side view showing schematic configurations of the receiving section and the relaying section according to the embodiment of the present invention.
• 17 Fig. 12 is a plan view of the pickup unit according to the present invention.
• 18 FIG. 12 is a plan view of the pickup unit, with a cover of FIG 17 was removed.
• 19 12 is a view showing a schematic configuration of a holding head driving mechanism according to the embodiment of the present invention.
• 20 Fig. 14 is a side view showing a schematic configuration of the accommodating section, wherein a downward component holding head according to the embodiment of the present invention is connected to a first movable section.
• 21 12 is a side view showing a schematic configuration of a holding head changing device according to the embodiment of the present invention.
• 22 12 is a plan view showing a schematic structure of the holding head changing device according to the present invention.
• 23 12 is a plan view showing a schematic structure of the holding head changing device according to the present invention.
• 24A 12 is a schematic view showing the state before the component holding head is attached to a head holding portion according to the embodiment of the present invention.
• 24B 12 is a schematic view showing the state where the component holding head has been attached to the head holding portion according to the embodiment of the present invention.
• 25A 14 is a cross-sectional view of the holding head changing device, showing the removal of the component holding head according to the present embodiment from the head holding section.
• 25B 14 is a cross-sectional view of the holding head changing device, showing the removal of the component holding head according to the present embodiment from the head holding section.
• 25C 14 is a cross-sectional view of the holding head changing device, showing the removal of the component holding head according to the present embodiment from the head holding section.
• 25D 14 is a cross-sectional view of the holding head changing device, showing the removal of the component holding head according to the present embodiment from the head holding section.
• 26A 12 is a cross-sectional view of the holding head changing device, showing the attachment of the component holding head according to the present invention to the head holding portion.
• 26B 12 is a cross-sectional view of the holding head changing device, showing the attachment of the component holding head according to the present invention to the head holding portion.
• 26C 12 is a cross-sectional view of the holding head changing device, showing the attachment of the component holding head according to the present invention to the head holding portion.
• 26D 12 is a cross-sectional view of the holding head changing device, showing the attachment of the component holding head according to the present invention to the head holding portion.
• 27 12 is a plan view showing a schematic configuration of an ejector according to the present invention.
• 28 12 is a plan view showing a schematic configuration of the ejector according to the present invention.
• 29 12 is a schematic block diagram of a control portion of the component mounter according to the embodiment of the present invention.
• 30 Fig. 12 is a cross-sectional view showing calibration of the position of the ejector in the case that the carrier is off the carrier holding portion is held according to the present invention.
• 31 14 is a cross-sectional view showing calibration of the position of the ejector when the carrier is not held by the carrier holding portion according to the present invention.
• 32 12 is a schematic configuration diagram showing a relative positional relationship among the component holding head, a component holding head for delivery, and a component imaging section according to the embodiment of the present invention.
• 33 12 is a schematic configuration diagram showing a relative positional relationship among the component holding head, the component holding head for delivery, and the component imaging section according to the embodiment of the present invention.
• 34 12 shows an image of the component holding head according to the present invention and a component held by the component holding head, taken by a substrate detection camera.
• 35A 12 is a schematic view showing a pick-up and feed operation in the case of flip chip mounting according to the embodiment of the present invention.
• 35B 12 is a schematic view showing a pick-up and feed operation in the case of flip chip mounting according to the embodiment of the present invention.
• 35C 12 is a schematic view showing a pick-up and feed operation in the case of flip chip mounting according to the embodiment of the present invention.
• 35D 12 is a schematic view showing a pick-up and feed operation in the case of flip chip mounting according to the embodiment of the present invention.
• 35E 12 is a schematic view showing a pick-up and feed operation in the case of flip chip mounting according to the embodiment of the present invention.
• 35F 12 is a schematic view showing a pick-up and feed operation in the case of flip chip mounting according to the embodiment of the present invention.
• 36A 12 is a schematic view showing a pick-up and feed operation in the die-attach assembly according to the embodiment of the present invention.
• 36B 12 is a schematic view showing a pick-up and feed operation in the die-attach assembly according to the embodiment of the present invention.
• 36C 12 is a schematic view showing a pick-up and feed operation in the die-attach assembly according to the embodiment of the present invention.
• 36D 12 is a schematic view showing a pick-up and feed operation in the die-attach assembly according to the embodiment of the present invention.
• 36E 12 is a schematic view showing a pick-up and feed operation in the die-attach assembly according to the embodiment of the present invention.
• 36F 12 is a schematic view showing a pick-up and feed operation in the die-attach assembly according to the embodiment of the present invention.
• 36G 12 is a schematic view showing a pick-up and feed operation in the die-attach assembly according to the embodiment of the present invention.
• 36H 12 is a schematic view showing a pick-up and feed operation in the die-attach assembly according to the embodiment of the present invention.

embodiment(s) of the invention

• einen Aufnahmeabschnitt mit einem Komponentenhaltekopf, der eine Komponente hält, wobei der Aufnahmeabschnitt eine erste Komponente mit ihrer ersten Fläche, die nach oben zeigt, durch den nach unten gerichteten Komponentenhaltekopf aufnimmt, wobei der Aufnahmeabschnitt den Komponentenhaltekopf, der die erste Komponente aufgenommen hat, nach oben kippt, um die erste Komponente mit ihrer zweiten Fläche, die nach oben zeigt, dem Montagekopf zuzuführen; und
• einen Weitergabeabschnitt, der eine zweite Komponente von dem Komponentenhaltekopf empfängt, der die zweite Komponente aufgenommen hat, wobei der Komponentenhaltekopf schräg nach oben gerichtet ist, während der Komponentenhaltekopf von unten gerichtet nach oben gerichtet kippt, wobei der Weitergabeabschnitt anschließend die zweite Komponente dem Montagekopf zuführt.

A component feeder according to the first aspect of the present invention, wherein the component feeder feeds a component having a first surface and a second surface opposite the first surface to a mounting head that mounts the component on a substrate, comprising:

• an accommodating portion having a component holding head that holds a component, the accommodating portion accommodating a first component with its first surface facing up through the component holding head facing downward, the accommodating portion accommodating the component holding head that has received the first component upward tilts to feed the first component to the mounting head with its second face facing up; and
• a relaying section that receives a second component from the component holding head that has picked up the second component, the component holding head being directed obliquely upward while the component holding head tilts upward from below, the relaying then feeds the second component to the assembly head.

Because the component holding head can receive the second component in the upward slanting posture instead of a horizontal lateral posture or downward slanting posture, the path length of the transferring section from receiving the second component to delivering it to the mounting head through the transferring section can be reduced be shortened. This leads to downsizing of the component feeder.

• eine erste Drehwelle, die den Komponentenhaltekopf vertikal dreht, so dass der Komponentenhaltekopf, der die erste Komponente in ihrer nach unten gerichteten Stellung aufgenommen hat, nach oben kippt, um die erste Komponente dem Montagekopf zuzuführen; und
• eine zweite Drehwelle, die den Weitergabeabschnitt vertikal dreht, so dass der Weitergabeabschnitt, der die zweite Komponente in ihrer schräg nach unten gerichteten Stellung vom Komponentenhaltekopf aufgenommen hat, nach oben kippt, um die zweite Komponente dem Montagekopf zuzuführen.

The component feeder according to the second aspect of the present invention, according to the first aspect above, comprises:

• a first rotary shaft that rotates the component holding head vertically so that the component holding head, which has received the first component in its downward position, tilts up to feed the first component to the mounting head; and
• a second rotary shaft that vertically rotates the delivery section so that the delivery section, which has received the second component in its slanted downward position from the component holding head, tilts up to supply the second component to the mounting head.

By rotating the component holding head and the transfer section vertically, component pickup and delivery can be performed more easily.

The component feeder according to the third aspect of the present invention according to the second aspect above, wherein a radius of rotation of the transfer portion around the second rotating shaft is smaller than a radius of rotation of the component holding head around the first rotating shaft.

Since the distance between the first rotary shaft and the second rotary shaft can be shortened, the component feeder can be further downsized.

The component feeder according to the fourth aspect of the present invention according to the third aspect above, wherein a center of the second rotating shaft is over a center of the first rotating shaft.

By having the center of the second rotary shaft above the center of the first rotary shaft, the difference between the height at which the receiving section feeds the first component to the mounting head and the height at which the relaying section feeds the second component to the mounting head can be reduced. This further simplifies the feeding of the components to the mounting head through the receiving section and the forwarding section.

The component feeding device according to the fifth aspect of the present invention, according to the fourth aspect above, wherein a first feeding position at which the receiving portion delivers the first component to the mounting head is level with a second feeding position at which the delivering portion delivers the second component to the assembly head releases.

By arranging the first supply position and the second supply position at a level within a vertically movable range of the mounting head, the delivery of components to the mounting head through the receiving section and the forwarding section can be performed more easily.

The component feeder according to the sixth aspect of the present invention, according to the fifth aspect above, wherein the first feed position and the second feed position are horizontally spaced from each other.

By horizontally spacing the first supply position and the second supply position from each other, delivery of components to the mounting head through the receiving portion and the passing portion can be performed more easily.

The component feeder according to the seventh aspect of the present invention according to any one of the second to sixth aspects above, wherein the receiving portion includes a holding head driving mechanism that radially moves the component holding head away from the center of the first rotary shaft.

By moving the component holding head by the holding head driving mechanism, the pickup and delivery of components by the pickup section can be performed more easily.

The component feeder according to the eighth aspect of the present invention, according to any one of the above second to seventh aspects, wherein
the transferring section comprises a component holding head for handing over which receives the second component from the component holding head to supply the second component thus received to the mounting head, and
a distance between the component holding head is made constant for the transfer and the center of the second rotary shaft.

By forming the distance between the component holding head for transfer and the center of the second rotating shaft to be constant, thereby eliminating the need for the driving mechanism to radially move the component holding head for transfer away from the center of the second rotating shaft, the Component feeder achieve a further size reduction.

The component feeder according to the ninth aspect of the present invention, according to any one of the above first to eighth aspects, wherein
the receiving section includes a plurality of component holding heads and
at least one pair of component holding heads of the plurality of component holding heads is configured to face in opposite directions from each other.

When one component holding head of the pair of component holding heads picks up a supplied component, the other component holding head which has picked up a first component can deliver the first component to the mounting head. This can improve component supply efficiency.

The component feeder according to the tenth aspect of the present invention, according to any one of the above first to ninth aspects, wherein
the receiving section and the forwarding section form a receiving unit, and
the component feeder further includes a unit moving mechanism that adjusts a position of the pickup unit.

By adjusting the position of the pickup unit by the unit moving mechanism, the component holding head can pick up the first component more accurately. By joining the receiving section and the delivery section into one unit, the relative positions of the receiving section and the delivery section can be constant, thereby ensuring a more accurate delivery of the second component from the receiving section to the delivery section.

• einen Komponentenabbildungsabschnitt, der einen sich vertikal erstreckenden Objektivtubus enthält, wobei der Komponentenabbildungsabschnitt eine Komponente abbildet, die von dem Aufnahmeabschnitt aufgenommen wird, wobei

der Objektivtubus oberhalb des Komponentenhaltekopfes in einer nach unten gerichteten Stellung angeordnet ist.The component feeder according to the eleventh aspect of the present invention, according to any one of the above first to tenth aspects, further comprises:

• a component imaging section including a vertically extending lens barrel, the component imaging section imaging a component picked up by the pickup section, wherein

the lens barrel is located above the component holding head in a downward position.

By arranging the lens barrel of the component imaging section above the downward component holding head, the horizontal size of the component feeder can be further reduced.

An embodiment of the present invention will be described below with reference to the accompanying drawings. In the drawings, the elements are appropriately exaggerated to simplify the explanations. The present invention is not limited to this embodiment.

<Embodiment>

First, a schematic configuration of a component mounter 1 of the present embodiment is explained with reference to FIG 1 described. 1 12 is a plan view showing the schematic configuration of the component mounter 1 according to the embodiment of the present invention.

As in 1 As illustrated, the component mounter 1 includes a component feeder 2 and a component mounting section 7 . The component feeder 2 is a device that feeds various components to the component mounter section 7 . The component mounting section 7 is a mechanism that receives the components fed from the component feeder 2 and mounts the components on a substrate 9 . In the following, in the diagrams, the X and Y directions are orthogonal to each other in a horizontal plane, and the Z direction is a height direction (vertical direction) orthogonal to the X and Y directions.

The component feeder 2 according to the embodiment includes a variety of component feeders depending on the types of components. The component feeding device 2 comprises, for example, a first component feeding device 3 and a second component feeding device 5.

The first component supply device 3 supplies components (diced chips) cut out of a wafer W1, for example. A component fed from the first component feeder 3 has a first surface and one of the first ten surface opposite second surface. The component is cuboid or cube-shaped, for example. The second component feeder 5 is z. B. a tray, stick or tape feeder or the like. The second feeding device 5 can also be a different feeding device than the feeding devices mentioned above. The second component feeder 5 need not be arranged in the component mounter 1 .

The component mounting section 7 includes a mounting head 11 that mounts a component on the substrate 9 and a head moving mechanism 13 that moves the mounting head 11 . The mounting head 11 is arranged to be movable in a horizontal plane (XY plane) by the head moving mechanism 13 . The head moving mechanism 13 is, for example, a Cartesian coordinate table having an X-axis table 13A and a Y-axis table 13B. The X-axis table 13A and the Y-axis table 13B move the mounting head 11 in X and Y directions, respectively.

In the embodiment, the component mounter 1 includes a component detection camera 15 that detects a component mounted on the substrate 9 and a substrate detection camera 17 that detects the substrate 9 . The component detection camera 15 is arranged between the substrate 9 and the component feeder 2, for example. A component picked up by the mounting head 11 is recognized by the component detection camera 15 and then mounted on the substrate 9 . At this time, the mounting head 11 recognizes the position of the substrate 9 through the substrate detecting camera 17 to mount the component thereon. In this embodiment, the substrate detection camera 17 is arranged so that it can be moved together with the mounting head 11 in a horizontal plane. For example, the substrate detection camera 17 is arranged together with the mounting head 11 on the X-axis table 13A.

A configuration of the first component feeder 3 will be described below with reference to FIG 2 and 3 described. 2 FIG. 12 is a plan view showing a schematic configuration of the first component feeder 3. FIG. 3 12 is a cross-sectional view along the X direction showing a schematic configuration of the first component feeder 3. FIG. In 2 For the sake of simplicity, an upper plate 19 is not shown in part.

As in 2 or 3 1, the first component feeder 3 of the embodiment includes a carrier holding section 21, a pickup unit 23, and an ejector 25. The carrier holding section 21 holds a carrier 27 carrying a wafer from which components have been cut out. The accommodating unit 23 accommodates a component held by the carrier 27 of the carrier holding portion 21 . The pickup unit 23 of the present embodiment sucks and holds a component. The ejector 25 ejects a die (raw chip) held by the carrier holding section 21 toward the receiving unit 23 from below. The ejector 25 of the embodiment pushes up a die. The support 27 is a film that can be stretched in a stretching step described later. The carrier 27 is, for example, an adhesive sheet that holds the wafer W1 with an adhesive force.

In the first component supply device 3 of the embodiment, the wafer W<b>1 from which components have been cut out is accommodated in a magazine 29 while being held by the carrier 27 . The magazine 29 is arranged outside (in the +Y direction) of the carrier holding portion 21, for example. The carrier 27 inside the magazine 29 is transported to the carrier holding section 21 by a carrier transport section 31 . The carrier 27 being transported is held by the carrier holding portion 21 .

<carrier holding section>

4 FIG. 14 is a plan view showing a schematic configuration of the carrier holding portion 21. FIG. 5 14 is a plan view showing a schematic configuration of the carrier holding portion 21 that does not hold the carrier 27. FIG. As in the 4 and 5 1, the carrier holding portion 21 is arranged movably in a horizontal plane in this embodiment. The carrier holding section 21 includes a holding member moving mechanism (moving section) 33 which moves the carrier holding section 21 (a movable base 37 which will be described later).

The holding member moving mechanism 33 according to the embodiment moves the carrier holding portion 21 in one direction (Y direction). The holding member moving mechanism 33 includes, for example, a motor 33a, a feed screw 33b, and a guide rail 33c. The feed screw 33b linearly moves the carrier holding portion 21 in the Y-direction with rotation caused by the motor 33a. The feed screw 33b is arranged to extend in the Y direction. The guide rail 33c supports the carrier holding portion 21 slidably in the Y direction. For example, the guide rail 33c is arranged to extend in the Y direction to to support both ends of the carrier holding portion 21 in the X direction.

The carrier holding portion 21 includes a holder body 35 which holds the carrier 27 and the movable base (holding table) 37 which supports the holder body 35 . The movable base 37 is a base member connected to the feed screw 33b and arranged movably in the Y direction.

6 FIG. 14 is a plan view showing a schematic configuration of the holder body 35. FIG. 7 FIG. 14 is a plan view showing a schematic configuration of the carrier 27 held by the carrier holding portion 21. FIG.

As in 6 As shown, the retainer body 35 has an aperture 45 extending perpendicularly therethrough. The holding part body 35 holds the bracket 27 so as to cover the opening 45 . The holding part body 35 of the embodiment includes a holding member 39 and a support base 41. The opening 45 of the embodiment is formed depending on the shape of the wafer W1 held by the carrier 27 and is larger than the wafer W1. The opening 45 is z. B. circular and larger than the circular wafer W1.

The holding member 39 is a member including a ring member 43 ( 7 ) that holds the carrier 27, holds. When the holding member 39 holds the ring member 43, the carrier 27 is held by the carrier holding portion 21. As shown in FIG.

The support base 41 is connected to the holding member 39 below the holding member 39 . The support base 41 includes a carrier guide 41a which guides the movement of the carrier 27 transported by the carrier transporting section 31 ( 2 ). The carrier guide 41a is formed, for example, so as to extend in the Y direction at both ends in the X direction of the carrier base 41 to restrict the movement of the carrier 27 in the X direction. The support base 41 includes a support portion 41b extending upward to support the bracket 27. As shown in FIG. The opening 45 is formed inside the support portion 41b. The support portion 41b is annular in this embodiment.

As in 7 As shown, the carrier 27 held by the holding part body 35 holds the wafer W1 from which components have been cut out. The outer edge of the carrier 27 is held by the ring member (ring) 43 in this embodiment.

8th FIG. 14 is a cross-sectional view taken along line AA of FIG 5 12 showing the state before the carrier 27 is held by the carrier holding portion 21. FIG. 9 FIG. 14 is a cross-sectional view taken along line AA of FIG 5 12 showing the state in which the carrier 27 is held by the carrier holding portion 21. FIG.

The carrier 27 within the in 2 The magazine 29 shown in FIG 8th shown, is inserted into a space defined between the holding member 39 and the support base 41 . This allows the ring member 43 of the bracket 27 to cover the opening 45 and is supported by the support base 41 .

As in the 8th and 9 As shown, the support base 41 is connected via a rod 49 to a drive section 47 which moves the support base 41 vertically. By driving the drive section 47 from the in 8th As shown, the support base 41 moves downward together with the rod 49. As in 9 1, the carrier 27 is held by the carrier holding portion 21 while being expanded in the planar direction by the support portion 41b due to the movement of the holding member 39 to below the upper end of the support portion 41b. The expansion of the carrier 27 increases the distance between the components cut out of the wafer W1, so that the components can be easily picked up.

10 FIG. 14 is a plan view showing a schematic configuration of the movable base 37. FIG. 11 FIG. 14 is a cross-sectional view taken along line BB of FIG 5 12 showing the state of holding the carrier 27 by the carrier holding portion 21. FIG. 12 12 is a cross-sectional view taken along line CC of FIG 5 12 showing the state of holding the carrier 27 by the carrier holding portion 21. FIG.

As in 10 As shown, the movable base 37 has a vertical through hole 51 formed below the opening 45 of the holder body 35 . The size of the opening 51 is z. B. equal to or larger than that of the opening 45. Through the opening 51, the ejector 25 pushes out a component in the carrier 27 arranged above the movable base 37 from below toward the receiving unit 23 ( 23 ).

The movable base 37 of the embodiment includes a passage portion 52 extending vertically at a position outside the opening that is horizontally outside the opening 51 . A horizontal position adjustment between the receiving unit 23 and the ejector 25 is carried out through the passage area 52 . The passage area 52 is z. B. an opening arranged on the movable base 37 . The passage portion 52 is not limited to the opening and can be formed by notching the edge of the movable base 37 are formed. The passage portion 52 is disposed at the inner end (−Y direction end) of the movable base 37 .

The movable base 37 is arranged so that the holder body 35 ( 6 ) can be pivoted in a horizontal plane. The movable base 37 includes a swing gear 53 through which the holder body 35 is swung. As in 11 As shown, the bracket body 35 pivots when a motor 54 connected to the swing gear 53 rotates, so that the swing gear 53 rotates in mesh with a drive gear 55 disposed on the bracket body 35. As shown in FIG.

The movable base 37 includes a plurality of support rollers 57 (e.g. at four corners) supporting the holder body 35 ( 6 ) rotatable in a horizontal plane. The support rollers 57 are rollers that extend upward on the movable base 37 to rotate the holder body 35 . As in 12 As shown, the support rollers 57 pivotally support a pivot guide 59 formed on the retainer body 35 and extending downwardly therefrom. As in the 5 and 12 As shown, the support rollers 57 are disposed outside of the pivot guide 59 which extends circumferentially around the opening 45 in the outer peripheral portion thereof.

The passage portion 52 is formed so that at least a portion of the passage portion 52 vertically passes even when the holder body 35 is pivoted by the pivot gear 53 . Specifically, the outer edge of the through portion 52 is formed horizontally outside the rotational locus of the outer edge of the holder body 35 . As a result, the calibration between the receiving unit 23 and the ejector 25 can be performed even when the holding part body 35 is pivoted.

The movable base 37 of the present embodiment includes a holding head changing device 61. The holding head changing device 61 is for changing a component holding head 77, which will be described later in the receiving unit 23. FIG. A detailed configuration of the holding head changing device 61 will be described later.

<recording unit>

13 FIG. 14 is a cross-sectional view showing a schematic configuration of the pickup unit 23. FIG. As in 3 or 13 As shown, the accommodating unit 23 is arranged to be movable on the top plate 19 by a unit moving mechanism (accommodating unit moving portion) 63 . The receiving unit 23 is arranged movably in one direction (X direction) in this embodiment.

The unit moving mechanism 63 ( 1 ) comprises, for example, a motor 63a, a feed screw 63b and a guide rail 63c. The feed screw 63b linearly moves the pickup unit 23 in the X-direction with rotation caused by the motor 63a. The feed screw 63b is arranged to extend in the X direction. The guide rail 63c supports the pickup unit 23 to slide in the X direction. For example, the guide rail 63c is arranged to extend in the X-direction to support both ends of the receiving unit 23 in the Y-direction.

The top plate 19 has a vertical through hole 65 extending in the X-direction. As in 13 shown, the receiving unit 23 receives a component (die) held by the carrier 27 through the opening 65 . A cover 67 forming an outer shell of the accommodating unit 23 of this embodiment has an opening 69 extending vertically therethrough on its upper surface. The receiving unit 23 delivers the received component to the mounting head 11 through the opening 69 ( 3 ). At this time, the mounting head 11 recognizes the component by, for example, the substrate detection camera 17 ( 1 ) to accept the component from the recording unit 23.

As in 3 As shown, the pickup unit 23 includes a pickup section 71, a relay section 73, and a component imaging section (component detection section) 75 ( 13 ).

<recording section>

As in 13 shown, receiving portion 71 receives a component held by carrier 27 . Specifically, the accommodating portion 71 accommodates a component ejected from the ejector 25 . The accommodating portion 71 includes the component holding head 77 holding a component, and accommodates a component through the component holding head 77 . Specifically, the component holding head 77 sucks a component in the carrier 27 and holds it at its tip (lower end) to separate the component from the carrier 27 .

The component holding head 77 is configured to be able to change the head orientation by a first movement mechanism 79 . In this embodiment, the head orientation is the orientation of the tip of the component holding head 77. The component holding head 77 is configured so that it repeatedly picks up a first component in its downward position and then is inverted by the first movement mechanism 79 to deliver the first component in its upward position to the mounting head 11 ( 3 ). Specifically, the downward component holding head 77 receives the first component with a first surface of the first component facing upward. The component holding head 77 with the picked up first component is then tilted up to deliver the first component to the mounting head 11 with a second face of the first component facing up. At this time, the first face of the component held by the carrier 27 faces upward.

The first component is picked up by the component holding head 77 from the carrier 27 via its first surface facing up, changed in orientation so that its second surface faces up, and then supplied to the mounting head 11 . In addition, the first component is mounted on the substrate 9 with the first face down by the mounting head 11 while the second face is held thereby and the first face faces down (and the second face faces up). That is, the first component is a component that is supplied in flip-chip mounting.

The first moving mechanism 79 of the embodiment is a swing mechanism that swings the component holding head 77 . The first moving mechanism 79 includes a first rotating shaft 81 rotated by a motor 80 and a swing member 83 swinging with the rotation of the first rotating shaft 81 . The first rotary shaft 81 rotates the component holding head 77 vertically. The pivoting member 83 is, for example, a vertically extending plate-shaped member.

The component holding head 77 is arranged on the pivoting member 83, for example, at an outer end (radially outward) with respect to a central axis of the first rotary shaft 81. The accommodating portion 71 of the embodiment includes a plurality of component holding heads 77. At least a pair of component holding heads 77 of the plurality of Component holding heads 77 are configured so that the heads face in opposite directions from each other. For example, the accommodating portion 71 includes two component holding heads 77, the component holding head 77 on one side and the component holding head 77 on the other side facing in opposite directions from each other. Specifically, the tip of the component holding head 77 on one side is oriented 180 degrees opposite the tip of the component holding head 77 on the other side. The component holding head 77 on one side, which faces downward, picks up the first component, while the component holding head 77 on the other side, which faces upward, delivers the component to the mounting head 11 .

The component holding head 77 of the present embodiment is detachably mounted on a head holding portion 85 . This allows the component holding head 77 to be changed depending on the type of components to be mounted, for example. The component holding head 77 is connected to the swing member 83 via the head holding portion 85 so as to swing together with the swing member 83 .

The component holding head 77 of this embodiment includes a holding head driving mechanism 87 that moves the component holding head 77 away from the center of the first rotary shaft 81 in the radial direction. A concrete configuration of the holding head driving mechanism 87 will be described later.

<Propagation section>

14 until 16 12 are side views showing schematic configurations of the receiving section 71 and the relaying section 73. FIG. The in the 14 until 16 The transfer section 73 shown in the drawing receives from the component holding head 77 a second component picked up by the receiving section 71 (component holding head 77) with its first surface facing up, and delivers the second component to the mounting head 11 with its first surface facing up. The transfer section 73 includes a component holding head 89 for transfer, which holds one component and receives the second component to be delivered to the mounting head 11 through the component holding head 89 for transfer.

The second component is picked up from the carrier 27 by the component holding head 77 with its first surface facing up, and delivered to the transfer portion 73 with the orientation of the first surface changed (with the first surface slanting downward in the embodiment). The second component is held by the transfer section 73 with its second face oriented so that its first face faces up, and then transferred to the mounting head 11 . In addition, the second component is held by the mounting head 11 over its first surface with the first surface facing up (and the second surface facing down), and mounted on the substrate 9 in the state where the first surface faces up. That is, the second Component is a component to be supplied in the case of die-attach assembly (raw chip attachment).

The relaying section 73 is configured to be able to change the head orientation by a second moving mechanism 91 . Specifically, the transfer section 73 picks up the second component while the component holding head 77 tilts from the downward position to the upward position. In this embodiment, the transfer section 73 picks up the second component with the component holding head 77 pointing obliquely upward ( 16 ).

The second moving mechanism 91 of the embodiment is a swing mechanism that swings the component holding head 89 for transfer. The second moving mechanism 91 includes a second rotary shaft 93 driven by a motor 92 ( 18 ) is rotated, and a swing member 95 which swings with the rotation of the second rotary shaft 93. The second rotary shaft 93 rotates the relaying portion 73 vertically. The pivoting member 95 is formed in a disc shape, for example.

In this embodiment, the center O2 of the second rotating shaft 93 is located above the center O1 of the first rotating shaft 81 . As in 15 As shown, the radius of rotation R2 of the relaying portion 73 about the second rotary shaft 93 is smaller than the radius of rotation R1 of the component holding head 77 about the first rotary shaft 81. The radius of rotation R2 of the relaying portion 73 is configured to be constant. That is, the distance between the component holding head 89 for transfer and the center O2 of the second rotating shaft 93 is configured to be constant. In the embodiment, the relaying section 73 does not include a mechanism corresponding to the holding head driving mechanism 87 of the receiving section 71 . That is, the component holding head 89 for delivery does not move away from the center O2 of the second rotating shaft 93 in the radial direction.

In the embodiment, a first supply position TP1 where the receiving portion 71 supplies the first component to the mounting head 11 and a second supply position TP2 where the supplying portion 73 supplies the second component to the mounting head 11 are at levels within a vertical movement range of the mounting head 11. The feeding positions TP1 and TP2 are within the focal length of the substrate detection camera 17 ( 1 ) arranged. The heights of the feeding positions TP1 and TP2 can be the same (substantially the same) height, for example. The first feeding position TP1 and the second feeding position TP2 are spaced from each other in the horizontal direction.

<component mapping section>

As in 13 As illustrated, the component imaging section 75 accommodates a component held by the carrier 27 . The component imaging section 75 is configured to be movable together with the pickup unit 23 by the unit moving mechanism 63 in this embodiment. In the component imaging section 75, a lens barrel 99 extending vertically is connected to an imaging section body 97 extending horizontally. The lens barrel 99 is disposed above the component holding head 77 directed downward. The lens barrel 99 includes an illumination section 101, a half mirror 103 and a lens 105 inside. The light emitted from the illumination section 101 passes through the half mirror 103 to irradiate an underlying component. The half mirror 103 is configured to transmit the light from the illumination section 101 downward and reflect the light toward the imaging section body 97 upward.

<Holding Head Drive Mechanism>

17 is a plan view of the receiving unit 23. 18 13 is a plan view of the receiving unit 23 with the cover 67 removed 17 . 19 FIG. 12 is a view showing a schematic configuration of the holding head driving mechanism 87. FIG.

As in 18 As shown, the pickup unit 23 includes the holding head drive mechanism 87 within the cover 67 ( 17 ). The holding head drive mechanism 87 is a cam mechanism in this embodiment. As in the 18 and 19 As shown, the holding head drive mechanism 87 includes a cam drive motor 107, a first cam 109 and a second cam 111.

The cam drive motor 107 drives the first cam 109 and the second cam 111 . Rotation of first cam 109 causes rotation of a first lever 113 about a first support shaft 115. Rotation of second cam 111 causes rotation of a second lever 117 about a second support shaft 119. Rotation of first lever 113 causes a first movable element 121 moves radially. This allows a first movable portion 123 connected to the first movable portion 121 to move radially together with the first movable portion 121 . By rotating the second lever 117, a second movable member 125 is radially moved. This allows a second movable portion 127, which is movable with the second Section 125 is connected to move together with the second movable portion 125 in the radial direction.

As in 15 As shown, in this embodiment, the first movable portion 123 is located at a position where it comes into contact with the component holding head 77 when the component holding head 77 assumes a downward posture. Thereby, the downward component holding head 77 can be vertically movably arranged together with the first movable portion 123 .

As in 16 As shown, in this embodiment, the second movable portion 127 is located at a position where it comes into contact with the component holding head 77 when the component holding head 77 assumes an obliquely upward posture. This allows the component holding head 77 directed obliquely upward to be movable together with the second movable portion 127 obliquely to the vertical direction.

20 14 is a side view showing a schematic configuration of the accommodating portion 71 with the downward component holding head 77 connected to the first movable portion 123. FIG. As in 20 As shown, the head holding portion 85 includes a guide member 129 which guides the radial movement of the component holding head 77 . The guide member 129 includes a cam follower 131 radially engaged with the first movable portion 123 and the second movable portion 127 . The cam follower 131 moves along a cylindrical cam 132 as the pivot member 83 pivots.

In this embodiment, the guide member 129 is arranged to support the component holding head 77 by an elastic member 133, e.g. B. presses a spring radially inward. The radius of rotation of the component holding head 77 is constant at R1 except when picking up a component and transferring the component to the component holding head 89 for delivery.

When the component holding head 77 faces downward, the cam follower 131 is engaged with the first movable portion 123 so that the component holding head 77 can move vertically together with the first movable portion 123 . When the component holding head 77 is directed obliquely upward ( 16 ), the cam follower 131 is brought into connection with the second movable portion 127 so that the component holding head 77 can move radially together with the second movable portion 127.

<holding head changing device>

21 12 is a side view showing a schematic configuration of the holding head changing device 61. FIG. 22 and 23 12 are plan views each showing a schematic configuration of the holding head changing device 61. FIG. As in the 21 until 23 As shown, the holding head changing device 61 includes an accommodating portion 135 which supports the component holding head 77, and a stopper 137.

The accommodating portion 135 stores plural kinds of component holding heads 77, for example. The accommodating portion 135 of the embodiment has a longitudinal direction (X-direction) and stores the component holding heads 77 along the longitudinal direction. The accommodating portion 135 has an opening 141 which opens upward. The opening 141 stores the component holding heads 77 therein.

The stopper 137 partially covers the opening 141 of the accommodating portion 135 . The stopper 137 has a vertical through hole 143. In the plan view, the hole 143 has an enlarged diameter portion 143a larger than the component holding heads 77 and a small diameter portion 143b smaller than the component holding heads 77. In the embodiment the enlarged-diameter portion 143a and the small-diameter portion 143b are alternately formed side by side in the longitudinal direction.

The stopper 137 moves by driving a stopper driving section 139 so that the enlarged-diameter section 143a or the small-diameter section 143b is positioned over the component holding heads 77 stored in the accommodating section 135 . The movement of the stopper 137 allows the stopper 137 to vertically engage with an engaging portion 78a of each of the component holding heads 77 in the state where the small-diameter portion 143b is positioned above the component holding heads 77 stored in the accommodating section 135 .

The holding head changing device 61 of this embodiment includes an elevating and lowering portion 145 which moves the accommodating portion 135 up and down. When changing the component holding head 77, the accommodating portion 135 is moved closer to the head holding portion 85 ( 24B ) brought.

24A 14 is a schematic view showing the state before the component holding head 77 is attached to the head holding portion 85. FIG. 24B 14 is a schematic view showing the state where the component holding head 77 has been attached to the head holding portion 85. FIG.

As in 24A As shown, the accommodating portion 135 in the state before the component holding head 77 is attached to the head holding portion 85 is located below the height of the carrier 27 holding the wafer W1. In this embodiment, the upper end of the component holding head 77 stored in the accommodating portion 135 is located below the height of the bracket 27. As shown in FIG.

When detaching or attaching the component holding head 77 as in 24B As shown, the accommodating portion 135 moves up by the raising and lowering portion 145 . At this time, the head holding portion 85 moves downward by the holding head drive mechanism 87 . In this embodiment, the amount of vertical movement of the head holding portion 85 is less than the amount of vertical movement of the accommodating portion 135. By the accommodating portion 135 is moved up by the raising and lowering portion 145, the amount of vertical movement of the head holding portion 85 can be reduced . Thereby, the driving configuration of the holding head driving mechanism 87 can be simplified.

In the state of 24B a claw portion 85a of the head holding portion 85 engages a recessed portion 78b of the component holding head 77 perpendicularly. The claw portion 85a is z. B. pressed inwards by a resilient element 85b. The head holding portion 85 holds the component holding head 77 at this time. The recessed portion 78b is recessed inwardly on the component holding head 77 above the engaging portion 78a.

In the 25A until 25D the operation of removing the component holding head 77 from the head holding portion 85 will be described. the 25A until 25D 12 are cross-sectional views of the holding head changing device 61, showing the process of removing the component holding head 77 from the head holding portion 85. FIG.

As in 25A As shown, the component holding head 77 moves to overlie the opening 141 of the holding head changer 61 .

In the embodiment, the Y-direction positional adjustment of the relative position of the opening 141 relative to the component holding head 77 is performed by the holding member moving mechanism 33 ( 2 ) of the carrier holding section 21 holding the holding head changing device 61 is performed. The X-direction positional adjustment of the relative position of the opening 141 with respect to the component holding head 77 is performed by the unit moving mechanism 63 which moves the receiving unit 23 .

Starting from the in 25A As shown in FIG 25B state shown. As in 25B shown, the tip of the component holding head 77 is inserted into a first opening 141a ( 25A ) of the holding head changing device 61 introduced. The engaging portion 78a of the component holding head 77 is fitted in a second opening 141b ( 25A ) of the holding head changing device 61 is arranged.

The stopper driving portion 139 is driven so that the stopper 137 from the state of 23 into the state of 22 transforms. That is, the stopper 137 is moved to transition from the state where the enlarged-diameter portion 143a is outside the outer edge of the engaging portion 78a to the state where the small-diameter portion 143b is inside the outer edge of the engaging portion 78a lies. This allows the engaging portion 78a to vertically engage with the small-diameter portion 143b as shown in FIG 25C shown.

Starting from the state in 25C the head holding portion 85 is moved upward while the accommodating portion 135 is moved downward. At this time, since the engaging portion 78a is vertically engaged with the small-diameter portion 143b, the component holding head 77 is removed from the head holding section 85 as shown in FIG 25D shown. This completes the process of removing the component holding head 77 from the head holding section 85.

In the 26A until 26D how the component holding head 77 is attached to the head holding portion 85 will be described. the 26A until 26D 12 are cross-sectional views of the holding head changing device 61 showing the attachment of the component holding head 77 to the head holding portion 85. FIG.

As in 26A As shown, the head holding portion 85 moves to overlie the component holding head 77 .

Starting from the in 26A The state shown in FIG 26B state shown. As in 26B As shown, the claw portion 85a vertically engages with the recessed portion 78b so that the component holding head 77 is held by the head holding section 85. As shown in FIG.

The stopper driving portion 139 is driven so that the stopper 137 from the state of 22 into the state of 23 transforms. That is, the stopper 137 is moved to transition from the state where the small-diameter portion 143b is inside the outer edge of the engaging portion 78a to the state where the enlarged-diameter portion 143a is outside the outer edge of the engaging portion 78a lies. As a result, the engaging portion 78a, as shown in FIG 26C shown, to the state where it is vertically disengaged from the small-diameter portion 143b.

Starting from the state in 26C the head holding portion 85 is moved up and the accommodating portion 135 is moved down. This completes the attachment of the component holding head 77 to the head holding portion 85 .

<Ejector>

27 and 28 12 are plan views each showing a schematic configuration of the ejector 25 according to the embodiment. As in the 27 and 28 1, the ejector 25 in this embodiment comprises a first ejector (first push-up portion) 25a and a second ejector (second push-up portion) 25b. The first ejector 25a and the second ejector 25b are used selectively, e.g. B. depending on the types etc. of the carrier 27 to be transported components. The first ejector 25a and the second ejector 25b are configured to be movable in the Y direction by a selection portion 155 .

The ejector 25 is formed vertically and configured to be moved up and down by a rising and falling portion 156 . In the embodiment, the first ejector 25a moves up and down by a rising and falling portion 156a, while the second ejector 25b moves up and down by a rising and falling portion 156b.

The first ejector 25a and the second ejector 25b are both arranged on a base member 157 . In this embodiment, the base member 157 is configured to be movable in the X direction by an ejector moving mechanism (moving portion) 159 . The ejector moving mechanism 159 moves the base member 157 in one direction (X direction). The ejector moving mechanism 159 includes, for example, a motor 159a, a feed screw 159b, and a guide rail 159c. The feed screw 159b linearly moves the base member 157 in the X-direction with rotation caused by the motor 159a. The feed screw 159b is arranged to extend in the X direction. The guide rail 159c slidably supports the base member 157 in the X direction. The guide rail 159c is arranged to extend in the X-direction to support both ends of the base member 157 in the Y-direction, for example.

The functioning of the component mounting device 1 is described below. 29 12 is a schematic block diagram of a control section C1 of the component mounter 1.

As in 29 As shown, the control section C1 includes: a pickup control section C2 that controls the pickup unit 23; a mounting head control unit C3 that controls the mounting head 11; a calculation section C4; and a storage section M1 that stores information on component mounting. The calculation section c4 calculates the positions of the pickup unit 23 and the mounting head 11. The storage section M1 of the embodiment further stores information imaged by the component imaging section 75 and the substrate detection camera 17. FIG.

By having a processor (processing circuit) execute a program stored in the memory, the control section C1 can perform component mounting in accordance with a predetermined method based on mounting information of the memory section M1. A server or the like may store assembly information to provide the assembly information to the control section C1 through communication.

The control section C1 drives a substrate transport section 8 ( 1 ) to transport the substrate 9 in the X-direction (substrate transporting direction), thereby placing the substrate 9 at a predetermined position (substrate transporting step).

A component is fed from the component feeder 2 and mounted on the substrate 9 with the mounting head 11 . The Vor The process of feeding a component through the first component feed device 3 is described in more detail below. The feeding operations of the second component feeder 5 are the same as the conventional feeding operations and are therefore not described here.

The control section C1 controls the carrier transport section 31 ( 2 ) of the first component feeder 3 to transfer the carrier 27 stored in the magazine 29 to the carrier holding section 21 (carrier transfer step). When being transported to the carrier accommodating section 21 , the carrier 27 is inserted into a space defined between the holding member 39 and the support base 41 .

After being transported to the carrier holding section 21, the carrier 27 is stretched by the holding member 39 ( 8th ) and held by the carrier holding portion 21 (carrier holding step). Concretely, the control section C1 drives the driving section 47 to move the holding member 39 downward, thereby expanding the carrier 27. Thereby, the carrier 27 can be held by the carrier holding portion 21 .

The pickup control section C2 drives the pickup unit 23 to pickup a component carried by the carrier 27 from above the carrier 27 (pickup step). At this time, the control section C1 drives the ejector 25 to push up the component carried by the carrier 27 from below the carrier 27 toward the receiving unit 23 (push-up step). The calibration of the position of the pick-up unit 23 and the position of the ejector 25 is performed in the phase before the pick-up step and the push-up step. The calibration operations allow the horizontal position of the pickup unit 23 to match the horizontal position of the ejector 25, thereby achieving a more accurate pickup operation.

A component picked up by the pickup unit 23 is delivered to the mounting head 11 (feeding step). The calibration of the position of the mounting head 11 and the position of the pickup unit 23 are performed at the stage before the feeding step. Since the horizontal position of the mounting head 11 and the horizontal position of the pickup unit 23 can be more accurately detected due to the calibration operations, more accurate component delivery operations are ensured. In the present embodiment, the position calibration operations are performed by imaging the ejector 25 by the component imaging section 75 of the accommodating unit 23 .

The mounting head control section C3 drives the mounting head 11 (head moving mechanism 13) to move the mounting head 11 with a component received from the pickup unit 23 toward the substrate 9 to mount the component on the substrate 9 (component mounting step). In the component mounting step, the component is mounted using information (e.g., information on the position for mounting the component) from the substrate detection camera 17, for example.

Subsequently, the calibration of the position of the receiving unit 23 and the position of the ejector 25 will be described in detail. 30 14 is a cross-sectional view showing a process of calibrating the position of the ejector 25 when the carrier 27 is held by the carrier holding portion 21. FIG. 31 14 is a cross-sectional view showing a process of calibrating the position of the ejector 25 in the case where the carrier 27 is not held by the carrier holding portion 21. FIG.

The control section C1 of the embodiment selectively implements a first mode for calibrating the position of the ejector 25 by a position outside the opening horizontally outside the openings 45 and 51 and a second mode for calibrating the position of the ejector 25 by a position inside the openings 45 and 51 .

In the first mode, as in 30 As shown, when the carrier 27 is held by the carrier holding portion 21, the steps for calibrating the position of the receiving unit 23 and the position of the ejector 25 through the passage portion 52 are performed.

The control section C1 drives the unit moving mechanism 63 ( 1 ) and the ejector 25 to move the receiving unit 23 and the ejector 25. As a result, the pickup unit 23 (component imaging section 75) is positioned above the passage area 52, while the ejector 25 is positioned below the passage area 52. FIG. In addition, the control section C1 drives the ejector 25 (raising and lowering section 156) to move the ejector 25 upward.

In this embodiment, the ejector 25 is raised until the top end of the ejector 25 reaches a higher position than the height of the bracket 27. When the ejector 25 is raised, the ejector 25 is imaged by the component imaging section 75 (first detection step). The first detecting step (imaging step) is performed after the carrier holding step. The Positionka Calibration is performed using the horizontal position of the ejector 25 shown (first calibration step). The component mapping section 75 of the embodiment also serves as a recognition part that recognizes the horizontal position of the ejector 25 .

In the second mode, as in 31 4, when the carrier 27 is not held by the carrier holding section 21, the steps of calibrating the position of the receiving unit 23 and the position of the ejector 25 are performed through the opening 45 of the carrier holding section 21.

The control section C1 drives the unit moving mechanism 63 ( 1 ) and the ejector 25 to move the receiving unit 23 and the ejector 25. As a result, the receiving unit 23 (component imaging section 75) is positioned above the opening 45, while the ejector 25 is positioned below the opening 45. FIG. In addition, the control section C1 drives the ejector 25 to move upward.

In this embodiment, the ejector 25 is raised until the top end of the ejector 25 reaches a higher position than the height of the carrier 27 reached when the carrier 27 is held. When the ejector 25 is raised, the ejector 25 is imaged by the component imaging section 75 (second detection step). The second detecting step (imaging step) is performed before the carrier holding step. The position calibration is performed based on the position of the ejector 25 shown (second calibration step).

The calibration of the position of the mounting head 11 and the position of the pickup unit 23 will be described in detail below. 32 12 is a schematic configuration diagram of the carrier holding section 21 at the time of calibrating the position of the mounting head 11 and the position of the pickup unit 23.

As in 32 1, when calibrating the position of the mounting head 11 and the position of the pickup unit 23, a calibrating jig 147 is attached to the carrier holding portion 21. As shown in FIG. The calibration device 147 is a device for calibrating the position of the mounting head 11 and the position of the pickup unit 23. The calibration device 147 is supported, for example, by the support portion 41b in the state where the carrier 27 is not supported by the carrier holding portion 21 is held. The calibrating device 147 is formed, for example, in the form of a flat plate.

The calibration device 147 has a first reference mark 149 and a second reference mark 151. The first reference mark 149 is a mark detected by the component imaging section (first imaging part) 75. The second reference mark 151 is a mark captured by the substrate detection camera (second imaging part) 17 . The second reference mark 151 is formed on a vertical post 153 in this embodiment. By detecting the first reference marking 149 and the second reference marking 151, the coordinate system of the mounting head 11 and the coordinate system of the recording unit 23 are calibrated. Specifically, by using the relative positional relationship (horizontal distance D1 in the embodiment) between the first reference mark 149 and the second reference mark 151, coordinate transformation of the coordinate system of the mounting head 11 and the coordinate system of the pickup unit 23 is performed.

The pickup step and the delivery step will be concretely described below. 33 12 is a schematic configuration diagram showing a relative positional relationship among the component holding head 77, the component holding head 89 for transfer, and the component imaging section 75. FIG.

As in 33 1, as a stage before the pick-up step and the supplying step, a relative horizontal positional relationship is found between the downward component-holding head 77 on the one hand and the upward component-holding head 77 on the other hand. The horizontal positional relationship between the heads is stored in the memory section M1. In this embodiment, a relative horizontal positional relationship between an optical axis L1 of the component imaging section 75 and the component holding head 77 directed downward is detected. Concretely, the offset OF1 and the offset OF2 of the component holding head 77 from the optical axis L1 of the component imaging section 75 are measured. The offset OF1 is a horizontal distance between the component holding head 77 in its downward position and the optical axis L1, while OF2 is a horizontal distance between the component holding head 77 in its upward position and the optical axis L1.

Further, an offset OF3 of the position of the component holding head 89 directed upward detected by the substrate detecting camera 17 for relaying becomes from an estimated position EP1 is measured from which is estimated as a position of the center point of the upward component holding head 89 for delivery. The offset OF3 is a horizontal distance between the estimated position EP1 and the position of the upward component holding head 89 for delivery. The values OF1, OF2 and OF3 are stored in memory section M1 ( 29 ).

34 14 shows an image of the component holding head 77 and a component held by the component holding head 77 picked up by the substrate detection camera 17. FIG. As in 34 As shown, the value OF1 is measured by the substrate detecting camera 17 in this embodiment. In the state where the downward component holding head 77 picks up a component and is tilted upward, the substrate detecting camera 17 detects a component position P<b>1 of the component held by the component holding head 77 . Also, the substrate detection camera 17 images a head position P2 of the component holding head 77 not holding a component. In this case, a horizontal offset between the component position P1 and the head position P2 is measured in order to obtain the offset OF1. For example, the component position P1 is a center position of the component imaged by the substrate detection camera 17, while the head position P2 is a center position of the head imaged by the substrate detection camera 17.

The value OF2 is measured by the substrate detection camera 17. The substrate detection camera 17 moves on the optical axis L1 to image the component holding head 77 in its upright position. The value OF2 is e.g. B. a horizontal distance between the center position of the component holding head 77 and the optical axis L1.

The substrate detection camera 17 moves to the estimated position EP1 to image the upward component holding head 89 for transfer while measuring the value OF3. The estimated position EP1 is z. B. a position that is a predetermined distance D2 away from the optical axis L1. The predetermined distance D2 is, for example, a target value for the horizontal distance between the optical axis L1 and the upward component holding head 89 for transfer.

In the description, among a plurality of component holding heads 77, one component holding head is a first component holding head 77a and another component holding head is a second component holding head 77b. OFa1 is OF1 when the component holding head 77a faces downward; OFa2 is OF2 when the component holding head 77a faces upward; OFb1 is OF1 when the component holding head 77b faces downward; and OFb2 is OF2 when the component holding head 77b faces upward.

[Mathematischer Ausdruck 2] $$\text{OPb1}=\text{Position der optischen Achse L1}+\text{OFb1}$$

From the measured value OF1, the calculation section C4 calculates an object position OP1 at which the downward component holding head 77 can pick up a component from the carrier 27. An object position OPa1 of the component holding head 77a is calculated using Mathematical Expression (1) below, and an object position OPb1 of the component holding head 77b is calculated using Mathematical Expression (2) below.
[Mathematical Expression 1] $$\text{OPa1}=\text{Position of the optical axis L1}+\text{OFa1}$$

[Mathematical Expression 2] $$\text{OPb1}=\text{Position of the optical axis L1}+\text{OFb1}$$

[Mathematischer Ausdruck 4] $$\text{TPb1}=\text{OPb1}-\text{OFb1}+\text{OFa2}$$

From the measured values OF1 and OF2, the calculation section C4 calculates a stop position TP1 of the upward component holding head 77, which is reached when the pickup unit 23 (downward component holding head 77) is positioned at the object position OP1. Mathematical expression (3) below is used to calculate a stop position TPb1 of the upward component holding head 77b, which is reached when the component holding head 77a is downward. Mathematical expression (4) is used to determine a stopper position TPa1 of the upward component holding head 77a, which is reached when the component holding head 77b is downward.
[Mathematical expression 3] $$\text{TPb1}=\text{OPa1}-\text{OFa1}+\text{OFb2}$$

[Mathematical Expression 4] $$\text{TPb1}=\text{OPb1}-\text{OFb1}+\text{OFa2}$$

[Mathematischer Ausdruck 6] $$\text{TPb2}=\text{OPab1}-\text{OFb1}+\text{D2}+\text{OF3}$$

From the measured values OF1 and OF3, the calculation section C4 calculates a stop position TP2 of the upward component holding head 89 for transfer, which is reached when the pickup section 71 is at the object position OP1. Mathematical expression (5) below is used to calculate an upward striking position TPa2 of the component component holding head 89 for handover, which is achieved when the component holding head 89 for handover picks up a component picked up by the component holding head 77a. Mathematical expression (6) below is used to calculate an upward stop position TPb2 of the component holding head 89 for delivery, which is reached when the component holding head 89 for delivery picks up a component picked up by the component holding head 77b.
[Mathematical Expression 5] $$\text{TPa2}=\text{OPb1}-\text{OFb1}+\text{D2}+\text{OF3}$$

[Mathematical Expression 6] $$\text{TPb2}=\text{OPab1}-\text{OFb1}+\text{D2}+\text{OF3}$$

The following describes the pickup step and the delivery step in the case of flip chip mounting. 35A until 35F are schematic views of the pick and feed steps in flip chip assembly.

First, as in 35A shown, the components located on the carrier 27 are imaged by the component imaging section 75 . The component imaging section 75 images the components with the component holding head 77 not located below the component imaging section 75 (first component imaging step).

After the first component mapping step, as in 35B shown, the pivot member 83 ( 13 ) is pivoted so that the component holding head 77a assumes its downward position. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is positioned at the object position OPa1. Specifically, the pickup unit 23 is moved by OFa1 from the position mapped by the component mapping section 75 .

Also, the holding head driving mechanism 87 is driven to move the downward component holding head 77a downward to pick up a component. After picking up the component, the holding head driving mechanism 87 is driven to move the downward component holding head 77a upward.

As in 35C As shown, the pivoting member 83 is pivoted to change the attitude of the downward component holding head 77a, which has received the component, to an upward direction. A next component to be picked up by the component holding head 77b is moved while the component holding head 77a is pivoted.

The component to be picked up next is mapped by the component mapping section 75 . The component imaging section 75 images the component with the component holding head 77 not located below the component imaging section 75 (second component imaging step).

After the second component mapping step, as in 35D shown, the pivot member 83 ( 13 ) is pivoted so that the component holding head 77b assumes its downward position. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77b is positioned at the object position OPb1. More specifically, the pickup unit 23 is moved by OFb1 from the position mapped by the component mapping section 75 .

Using the above mathematical expression (4), the calculation section C4 calculates the abutment position TPa1 of the upward component holding head 77a. The mounting head 11 is moved to the stop position TPA1 calculated by the calculation section C4 and picks up a component. At this time, the holding head driving mechanism 87 is driven to move the downward component holding head 77b down and pick up a component. After picking up the component, the holding head driving mechanism 87 is driven to move the downward component holding head 77b upward. In this way, a step (first step) of delivering a component to the mounting head 11 by the component holding head 77a is performed while picking up a component by the component holding head 77b.

Next, as in 35E As shown, the pivoting member 83 is pivoted to change the posture of the downward component holding head 77b, which picks up the component, in the upward direction. A component to be picked up by the component holding head 77a is moved while the component holding head 77b is pivoted.

The component to be picked up next is selected from the component mapping section 75 pictured. The component imaging section 75 images the component with the component holding head 77 not located below the component imaging section 75 (third component imaging step).

After the third component mapping step, as in 35F shown, the pivot member 83 ( 13 ) is pivoted so that the component holding head 77a assumes its downward position. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is positioned at the object position OPa1. Specifically, the pickup unit 23 is moved by OFa1 from the position mapped by the component mapping section 75 .

Using the above mathematical expression (3), the calculation section C4 calculates the stopper position TPb1 of the upward component holding head 77b. The mounting head 11 is moved to the stop position TPb1 calculated by the calculation section C4 and picks up a component. At this time, the holding head driving mechanism 87 is moved to lower the downward component holding head 77a and pick up a component. After picking up the component, the holding head driving mechanism 87 is driven to move the downward component holding head 77a upward. In this way, a step (second step) of delivering a component to the mounting head 11 by the component holding head 77b is performed while picking up a component by the component holding head 77a.

As described above, in flip-chip mounting, the first step and the second step are alternately repeated to transfer the components from the carrier 27 to the mounting head 11.

A pickup step and a delivery step in the case of die-attach mounting will be described below. 36A until 36H 12 are schematic views showing the pick-up step and the feeding step t in the case of die-attach mounting.

First, as in 36A As shown, a component carried by carrier 27 is imaged by component imaging section 75 . The component imaging section 75 images the component with the component holding head 77 not located below the component imaging section 75 (fourth component imaging step).

After the fourth component mapping step, as in 36B shown, the pivot member 83 ( 13 ) is pivoted so that the component holding head 77a assumes its downward position. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is positioned at the object position OPa1. Specifically, the pickup unit 23 is moved by OFa1 from the position mapped by the component mapping section 75 .

Also, the holding head driving mechanism 87 is driven to move the downward component holding head 77a downward to pick up a component. After picking up the component, the holding head driving mechanism 87 is driven to move the downward component holding head 77a upward.

As in 36C As shown, the pivoting member 83 is pivoted to change the position of the downward component holding head 77a, which picks up the component, in the upward direction. A component to be picked up by the component holding head 77b is moved while the component holding head 77a is pivoted.

The component to be picked up next is mapped by the component mapping section 75 . The component imaging section 75 images the component with the component holding head 77 not located below the component imaging section 75 (fifth component imaging step).

As in 36D shown, the pivot member 83 ( 13 ) is pivoted so that the component holding head 77a assumes a position directed obliquely upwards. At this time, the component holding head 89 for transfer is driven by the second moving mechanism 91 ( 14 ) directed obliquely downwards. Specifically, the component holding head 77a and the component holding head 89 face each other collinearly for transfer.

In addition, the holding head driving mechanism 87 is driven to move the obliquely upward component holding head 77a obliquely upward (toward the component holding head 89 for transfer) to transfer the component to the component holding head 89 for transfer. After the component is discharged, the holding head drive mechanism 87 is driven to rotate the head obliquely upward directed component holding head 77a to move obliquely downward.

Next, as in 36E As shown, component holding head 89 is pivoted to assume its upward position for delivery, while component holding head 77b is pivoted to assume its downward position. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77b is positioned at the object position OPb1. More specifically, the pickup unit 23 is moved by OFb1 from the position mapped by the component mapping section 75 .

Using the above mathematical expression (5), the calculation section C4 calculates the abutment position TPa2 of the upward component holding head 89 for transfer. The mounting head 11 is moved to the stopper position TPa2 calculated by the calculation section C4 and picks up a component. At this time, the holding head driving mechanism 87 is driven to move the downward component holding head 77b down and pick up a component. After picking up the component, the holding head driving mechanism 87 is driven to move the downward component holding head 77b upward. In this way, a step (third step) of delivering a component to the mounting head 11 by the component holding head 89 for transfer is performed while a component is picked up by the component holding head 77b.

Next, as in 36F 1, the component holding head 77b is pivoted and a component to be picked up next is imaged by the component imaging section 75. The component imaging section 75 images the component with the component holding head 77 not under the component imaging section 75 (sixth component imaging step).

Next, as in 36G shown, the pivot member 83 ( 13 ) is pivoted so that the component holding head 77b is directed obliquely upward. At this time, the component holding head 89 for transfer is driven by the second moving mechanism 91 ( 14 ) directed obliquely downwards. Specifically, the component holding head 77b and the component holding head 89 face each other collinearly for transfer.

In addition, the holding head driving mechanism 87 is driven to move the obliquely upward component holding head 77b obliquely upward (toward the component holding head 89 for delivery) to deliver a component to the component holding head 89 for delivery. After the component is discharged, the holding head driving mechanism 87 is driven to obliquely move the component holding head 77b slanted upward downward.

Next, as in 36H As shown, component holding head 89 is pivoted to face upward for delivery, while component holding head 77a is pivoted to face downward. The unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is positioned at the object position OPa1. More specifically, the pickup unit 23 is moved by OFa1 from the position imaged by the component imaging section 75 .

Using the above mathematical expression (6), the calculation section C4 calculates the stopper position TPb2 of the upward component holding head 89 for transfer. The mounting head 11 is moved to the stop position TPb2 calculated by the calculation section C4 and picks up a component. At this time, the holding head driving mechanism 87 is driven to move the downward component holding head 77a downward and pick up a component. After picking up the component, the holding head driving mechanism 87 is driven to move the downward component holding head 77a upward. In this way, a step (fourth step) of delivering a component to the mounting head 11 by the component holding head 89 for transfer is performed while a component is picked up by the component holding head 77a.

As described above, the third and fourth steps are also alternately repeated in the die-attach assembly to supply the components from the carrier 27 to the assembly head 11 .

The present invention is not limited to the above embodiment and can be embodied in various other forms. Although in the above embodiment the horizontal offset between the component position P1 and the head position P2 is measured and indicated as OF1, this is not meant to be limiting. For example, the head position of the component holding head 77 with the component holding head 77 facing downward on one side tilted up to regard the relative horizontal positional relationship between the optical axis L1 and the head position as OF1.

Although OF1 was measured by the substrate detection camera 17, the operation is not limited to this. OF1 can e.g. B. can also be measured by a camera, which is arranged below the component holding head 77.

Although the example of calibrating the horizontal position of the pickup section 71 and the horizontal position of the ejector 25 imaged by the component imaging section 75 has been described, the calibration need not necessarily be performed. For example, the component mapping section 75 may check only the state (foreign matter attachment) of the ejector 25 instead of performing the calibration.

Although a configuration has been described in which the component holding head 77 is pivoted by the first moving mechanism 79 and the component holding head 89 is pivoted for transfer by the second moving mechanism 91, it is not limited thereto. That is, the component holding head 77 and the component holding head 89 for transfer need not be configured to rotate (pivot) around the first rotating shaft 81 and the second rotating shaft 93 . The component holding head 77 and the component holding head 89 for delivery may be configured to change the head orientation by a robotic arm, for example.

By appropriately combining the above various embodiments, the respective effects can be obtained.

Although the present invention has been fully described in terms of the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art. Such alterations and modifications are to be construed as being encompassed by the appended claims without departing from the scope of the present invention as defined by the claims. The combination and the order of elements in the embodiments can be changed without departing from the scope and spirit of the present invention.

Industrial Applicability

The component supply device according to the invention is suitable, for example, for supplying components to a mounting head which receives the components carried by a carrier and mounts them on a substrate.

Reference List

1

component assembly jig

2

component feeder

3

First component feeder

5

Second component feeder

7

component assembly section

8th

substrate transport section

9

substrate

11

mounting head

13

head movement mechanism

13A

X axis table

13B

Y axis table

15

component capture camera

17

substrate detection camera

19

top plate

21

carrier holding section

23

recording unit

25

ejector

25a

First ejector

25b

Second ejector

27

carrier

29

magazine

31

carrier transport section

33

retainer moving mechanism

33a

engine

33b

feed screw

33c

guide rail

35

holder body

37

Movable base

39

holding element

41

support base

41a

carrier guidance

41b

support section

43

ring element

45

opening

47

drive section

49

pole

51

opening

52

passage area

53

swivel gear

54

engine

55

Driven gear

57

support roller

59

swivel guide

61

holding head changer

63

unit movement mechanism

63a

engine

63b

feed screw

63c

guide rail

65

opening

67

cover

69

opening

71

recording section

73

sharing section

75

component mapping section

77, 77a, 77b

component holding head

78a

engagement section

78b

Recessed section

79

First movement mechanism

80

engine

81

First turning shaft

83

swivel element

85

head holding section

85a

claw section

85b

Springy element

87

holding head drive mechanism

89

Component holding head for passing

91

Second movement mechanism

92

engine

93

Second rotary shaft

95

swivel element

97

figure section body

99

lens barrel

101

lighting section

103

half mirror

105

lens

107

camshaft drive motor

109

First cam

111

Second cam

113

First Lever

115

First support shaft

117

second lever

119

Second support shaft

121

First moving element

123

First moving piece

125

Second moving element

127

Second moving piece

129

guide element

131

cam follower

132

Cylindrical cam

133

Springy element

135

accommodation section

137

attack

139

stop drive section

141

opening

141a

First opening

141b

Second opening

143

opening

143a

Increased diameter section

143b

Small diameter section

145

lifting and lowering section

147

calibration device

149

First reference mark

151

Second reference mark

153

post

155

selection section

156, 156a, 156b

lifting and lowering device

157

base element

159

Ejector Movement Mechanism

159a

engine

159b

feed screw

159c

guide rail

C1

control section

C2

recording control section

C3

Mounting Head Control Section

M1

Storage

w1

wafers

QUOTES INCLUDED IN DESCRIPTION

This list of the documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• JP2005093667A [0003]

Claims (11)

A component feeder that feeds a component having a first surface and a second surface opposite the first surface to a mounting head that mounts the component on a substrate, comprising: an accommodating portion having a component holding head that holds a component, the accommodating portion accommodating a first component with its first surface facing up through the component holding head facing downward, the accommodating portion accommodating the component holding head that has received the first component upward tilts to feed the first component to the mounting head with its second face facing up; and a passing section that receives a second component from the component holding head that has picked up the second component, the component holding head being slanted upward while the component holding head tilts upward from below, the passing section then feeding the second component to the mounting head. Component feeding device claim 1 comprising: a first rotary shaft that rotates the component holding head vertically so that the component holding head, which has received the first component in its downward position, tilts up to feed the first component to the mounting head; and a second rotary shaft that vertically rotates the delivery section so that the delivery section, which has received the second component in its slanted downward position from the component holding head, tilts up to supply the second component to the mounting head. Component feeding device claim 2 wherein a radius of rotation of the relaying portion around the second rotating shaft is smaller than a radius of rotation of the component holding head around the first rotating shaft. Component feeding device claim 3 , wherein a center of the second rotary shaft is over a center of the first rotary shaft. Component feeding device claim 4 , wherein a first feeding position at which the receiving section delivers the first component to the mounting head is at the same height as a second feeding position at which the transferring section delivers the second component to the mounting head. Component feeding device claim 5 , wherein the first feeding position and the second feeding position are horizontally spaced from each other. Component feeding device according to one of claims 2 until 6 wherein the accommodating portion includes a holding head driving mechanism that radially moves the component holding head away from the center of the first rotary shaft. Component feeding device according to one of claims 2 until 7 wherein the transferring portion includes a component holding head for transferring the second component from the component holding head to feed the second component picked up thereby to the mounting head, and a distance between the component holding head for transfer and the center of the second rotary shaft is made constant. Component feeding device according to one of Claims 1 until 8th wherein the accommodating portion includes a plurality of component holding heads, and at least a pair of component holding heads of the plurality of component holding heads is configured to face in opposite directions from each other. Component feeding device according to one of Claims 1 until 9 wherein the receiving section and the transferring section form a receiving unit, and the component feeder further comprises a unit moving mechanism that adjusts the position of the receiving unit. Component feeding device according to one of Claims 1 until 10 further comprising: a component imaging section including a vertically extending lens barrel, the component imaging section imaging a component picked up by the pickup section, the lens barrel being disposed above the component holding head in a downward position.

Images