WO2021070381A1 - Component supply device - Google Patents

Component supply device Download PDF

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Publication number
WO2021070381A1
WO2021070381A1 PCT/JP2019/040302 JP2019040302W WO2021070381A1 WO 2021070381 A1 WO2021070381 A1 WO 2021070381A1 JP 2019040302 W JP2019040302 W JP 2019040302W WO 2021070381 A1 WO2021070381 A1 WO 2021070381A1
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WO
WIPO (PCT)
Prior art keywords
component
head
holding head
unit
component holding
Prior art date
Application number
PCT/JP2019/040302
Other languages
French (fr)
Japanese (ja)
Inventor
勉 糀谷
Original Assignee
パナソニックIpマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックIpマネジメント株式会社 filed Critical パナソニックIpマネジメント株式会社
Priority to DE112019007800.3T priority Critical patent/DE112019007800T5/en
Priority to CN201980100829.XA priority patent/CN114556535B/en
Priority to PCT/JP2019/040302 priority patent/WO2021070381A1/en
Priority to JP2021551088A priority patent/JP7378098B2/en
Publication of WO2021070381A1 publication Critical patent/WO2021070381A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Definitions

  • the present invention relates to a parts supply device.
  • an object of the present invention is to provide a parts supply device that can be further miniaturized in order to solve the above problems.
  • the component supply device has a first surface and a second surface opposite to the first surface with respect to a mounting head for mounting components on a substrate.
  • a component supply device for supplying a component to be held which has a component holding head for holding the component, and the first component is held by the component holding head with the first surface facing upward while the first surface of the first component is facing upward.
  • a pickup unit that picks up and hands over the component holding head that picks up the first component to the mounting head with the second surface of the first component facing upward, and a component that picks up the second component. While the holding head is flipping from downward to upward, the component holding head is provided with a relay unit that receives the second component from the component holding head and delivers it to the mounting head in a state of being obliquely upward.
  • the parts supply device can be further miniaturized.
  • a plan view showing a schematic configuration of a component mounting device according to an embodiment of the present invention The plan view which shows the schematic structure of the 1st component supply apparatus of the Embodiment of this invention.
  • Top view showing schematic structure of carrier holding part of embodiment of this invention A plan view showing a schematic configuration of a carrier holding portion in a state where the carrier of the embodiment of the present invention is not held.
  • Top view showing schematic structure of holding part main body of embodiment of this invention Top view showing schematic structure of carrier held by carrier holding part of embodiment of this invention A cross-sectional view taken along the line AA of FIG.
  • FIG. 5 showing a state before the carrier is held by the carrier holding portion according to the embodiment of the present invention.
  • FIG. 5A cross-sectional view taken along the line AA showing a state in which the carrier is held by the carrier holding portion according to the embodiment of the present invention.
  • FIG. 5B is a cross-sectional view taken along the line BB showing a state in which the carrier is held by the carrier holding portion according to the embodiment of the present invention.
  • FIG. 5 is a cross-sectional view taken along the line CC of FIG. 5, showing a state in which the carrier is held by the carrier holding portion according to the embodiment of the present invention.
  • Sectional drawing which shows the schematic structure of the pickup unit of embodiment of this invention.
  • a side view showing a schematic configuration of a pickup unit and a relay unit according to an embodiment of the present invention A side view showing a schematic configuration of a pickup unit and a relay unit according to an embodiment of the present invention.
  • a side view showing a schematic configuration of a pickup unit and a relay unit according to an embodiment of the present invention A side view showing a schematic configuration of a pickup unit and a relay unit according to an embodiment of the present invention.
  • Top view of the pickup unit according to the embodiment of the present invention Top view of the pickup unit with the cover of FIG. 17 removed.
  • the figure which shows the schematic structure of the holding head drive mechanism of embodiment of this invention A side view showing a schematic configuration of a pickup unit in a state where the downward component holding head according to the embodiment of the present invention is connected to the first moving piece.
  • FIG. 1 Top view showing schematic structure of holding head changer of embodiment of this invention
  • FIG. 1 The schematic diagram which shows the state before attaching the component holding head to the head holding part of embodiment of this invention.
  • Sectional drawing of the holding head changer which shows the operation of removing the component holding head of embodiment of this invention from a head holding part.
  • Sectional drawing of the holding head changer which shows the operation of removing the component holding head of embodiment of this invention from a head holding part.
  • Sectional drawing of the holding head changer which shows the operation of removing the component holding head of embodiment of this invention from a head holding part.
  • Sectional drawing of the holding head changer which shows the operation of removing the component holding head of embodiment of this invention from a head holding part.
  • Sectional drawing of the holding head changer which shows the operation of attaching the component holding head of embodiment of this invention to a head holding part.
  • Sectional drawing of the holding head changer which shows the operation of attaching the component holding head of embodiment of this invention to a head holding part.
  • Sectional drawing of the holding head changer which shows the operation of attaching the component holding head of embodiment of this invention to a head holding part.
  • Sectional drawing of the holding head changer which shows the operation of attaching the component holding head of embodiment of this invention to a head holding part.
  • a plan view showing a schematic configuration of an ejector according to an embodiment of the present invention.
  • Sectional drawing which shows the calibration operation of the position of an ejector when a carrier is held in the carrier holding part of embodiment of this invention.
  • Sectional drawing which shows the calibration operation of the position of an ejector when a carrier is not held in the carrier holding part of embodiment of this invention.
  • FIG. 1 An image of the component holding head according to the embodiment of the present invention and the component held by the component holding head taken by a substrate recognition camera.
  • Schematic diagram showing a pickup operation and a delivery operation in the case of flip-chip mounting according to the embodiment of the present invention Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention.
  • Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention.
  • Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention.
  • the component supply device is a component supply device that supplies a component having a first surface and a second surface opposite to the first surface to a mounting head for mounting the component on a substrate. That is, it has a component holding head for holding a component, and the first component is picked up by the component holding head turned downward while the first surface of the first component is facing upward, and the first component is picked up.
  • the pickup unit that flips the picked-up component holding head upward and delivers it to the mounting head with the second surface of the first component facing upward, and the component holding head that picks up the second component are flipped from downward to upward.
  • a relay unit that receives the second component from the component holding head and delivers it to the mounting head while the component holding head is obliquely upward is provided.
  • the relay unit When the relay unit receives the second component in a state where the component holding head is oriented diagonally upward rather than horizontally or diagonally downward, the relay unit receives the second component and delivers it to the mounting head.
  • the path length of the relay unit can be shortened. As a result, the parts supply device can be miniaturized.
  • the component holding head that picks up the first component in a downward state is inverted upward and delivers the first component to the mounting head.
  • the first rotating shaft that rotates the second component in the vertical direction and the relay unit that receives the second component diagonally downward from the component holding head are inverted upward and deliver the second component to the mounting head.
  • it may have a second rotation shaft that rotates the relay portion in the vertical direction.
  • the radius of gyration of the relay portion centered on the second axis of rotation is larger than the radius of gyration of the component holding head centered on the first axis of rotation. It may be small.
  • the parts supply device can be further miniaturized.
  • the center of the second rotation shaft may be located above the center of the first rotation shaft.
  • the height at which the pickup unit delivers the first component to the mounting head and the relay unit are second to the mounting head. It is possible to reduce the difference from the height at which the parts are delivered. As a result, the parts can be more easily delivered to the mounting head by the pickup unit and the relay unit.
  • the positions may be located at the same height.
  • the first delivery position and the second delivery position are arranged at a height within the movable range in the vertical direction of the mounting head, it is easier to deliver parts to the mounting head by the pickup unit and the relay unit. Can be done.
  • the first delivery position and the second delivery position may be separated from each other in the horizontal direction.
  • the pickup unit may have a holding head drive mechanism for moving the component holding head in the radial direction away from the center of the first rotation shaft.
  • the relay unit has a relay component holding head that receives the second component from the component holding head and delivers it to the mounting head, and has the relay component holding head and the second component holding head.
  • the distance from the center of the rotation axis of the above may be constant.
  • a drive mechanism that is configured so that the distance between the relay component holding head and the center of the second rotating shaft is constant, and moves the relay component holding head in the radial direction away from the center of the second rotating shaft.
  • the pickup unit has a plurality of component holding heads, and at least one set of component holding heads among the plurality of component holding heads is oriented in opposite directions. It may be configured.
  • the pickup unit and the relay unit may further include a unit moving mechanism that constitutes the pickup unit and adjusts the position of the pickup unit.
  • the first part can be received more accurately by the part holding head. Further, by combining the pickup unit and the relay unit into one unit, the relative position between the pickup unit and the relay unit can be made constant, and the delivery of the second component from the pickup unit to the relay unit can be performed more accurately. It can be carried out.
  • the component supply device has a lens barrel extending in the vertical direction, further includes a component imaging unit that images a component picked up by the pickup unit, and the lens barrel is a component holding head in a downward state. It may be placed above.
  • the component supply device can be further miniaturized in the horizontal direction.
  • FIG. 1 is a plan view showing a schematic configuration of a component mounting device 1 according to an embodiment of the present invention.
  • the component mounting device 1 includes a component supply device 2 and a component mounting unit 7.
  • the component supply device 2 is a device that supplies various components to the component mounting unit 7.
  • the component mounting unit 7 is a mechanism that receives the components supplied from the component supply device 2 and mounts the components on the substrate 9.
  • the X direction and the Y direction are directions orthogonal to each other in the horizontal plane
  • the Z direction is a height direction (vertical direction) orthogonal to the X direction and the Y direction.
  • the parts supply device 2 of the present embodiment includes a plurality of parts supply devices according to the types of parts.
  • the parts supply device 2 includes, for example, a first parts supply device 3 and a second parts supply device 5.
  • the first component supply device 3 supplies, for example, the components (dies) cut out from the wafer W1.
  • the parts supplied by the first parts supply device 3 have a first surface and a second surface opposite to the first surface.
  • the part is formed, for example, in the shape of a rectangular parallelepiped or a cube.
  • the second component supply device 5 is, for example, a tray feeder, a stick feeder, a tape feeder, or the like.
  • the second component supply device 5 may be a component supply device other than the feeder. Further, the second component supply device 5 may not be provided in the component mounting device 1.
  • the component mounting unit 7 includes a mounting head 11 for mounting the component on the substrate 9 and a head moving mechanism 13 for moving the mounting head 11.
  • the mounting head 11 is provided so as to be movable in a horizontal plane (XY plane) by a head moving mechanism 13.
  • the head moving mechanism 13 is, for example, an orthogonal coordinate table having an X-axis table 13A and a Y-axis table 13B.
  • the X-axis table 13A and the Y-axis table 13B move the mounting head 11 in the X direction and the Y direction, respectively.
  • the component mounting device 1 is provided with a component recognition camera 15 for recognizing components mounted on the substrate 9 and a substrate recognition camera 17 for recognizing the substrate 9.
  • the component recognition camera 15 is provided, for example, between the substrate 9 and the component supply device 2.
  • the component received by the mounting head 11 is recognized by the component recognition camera 15 and then mounted on the substrate 9.
  • the mounting head 11 recognizes the position of the board 9 by the board recognition camera 17 and mounts the components.
  • the substrate recognition camera 17 of the present embodiment is provided so as to be movable in a horizontal plane together with the mounting head 11.
  • the substrate recognition camera 17 is provided together with the mounting head 11 on the X-axis table 13A.
  • FIG. 2 is a plan view showing a schematic configuration of the first component supply device 3.
  • FIG. 3 is a cross-sectional view cut along the X direction showing a schematic configuration of the first component supply device 3.
  • a part of the top plate 19 is omitted.
  • the first component supply device 3 of the present embodiment includes a carrier holding unit 21, a pickup unit 23, and an ejector 25.
  • the carrier holding portion 21 holds the carrier 27 that supports the wafer from which the parts have been cut out.
  • the pickup unit 23 picks up the parts held by the carrier 27 of the carrier holding unit 21.
  • the pickup unit 23 of the present embodiment sucks and holds the parts.
  • the ejector 25 pushes the die held by the carrier holding portion 21 toward the pickup unit 23 from below.
  • the ejector 25 of the present embodiment pushes up the die upward.
  • the carrier 27 is a sheet having elasticity in the expanding operation described later.
  • the carrier 27 is an adhesive sheet that holds the wafer W1 with adhesive force.
  • the wafer W1 from which the components have been cut out is housed in the magazine 29 in a state of being held by the carrier 27.
  • the magazine 29 is provided, for example, on the outer side (+ Y direction) of the carrier holding portion 21.
  • the carrier 27 in the magazine 29 is conveyed toward the carrier holding unit 21 by the carrier conveying unit 31.
  • the conveyed carrier 27 is held by the carrier holding unit 21.
  • FIG. 4 is a plan view showing a schematic configuration of the carrier holding portion 21.
  • FIG. 5 is a plan view showing a schematic configuration of the carrier holding portion 21 in a state where the carrier 27 is not held.
  • the carrier holding portion 21 of the present embodiment is provided so as to be movable in a horizontal plane.
  • the carrier holding unit 21 has a holding unit moving mechanism (moving unit) 33 that moves the carrier holding unit 21 (moving base 37 described later).
  • the holding unit moving mechanism 33 of the present embodiment moves the carrier holding unit 21 in one direction (Y direction).
  • the holding portion moving mechanism 33 has, for example, a motor 33a, a feed screw 33b, and a guide rail 33c.
  • the feed screw 33b linearly moves the carrier holding portion 21 in the Y direction by the rotary motion of the motor 33a.
  • the feed screw 33b is provided so as to extend in the Y direction.
  • the guide rail 33c supports the carrier holding portion 21 so as to be slidable in the Y direction.
  • the guide rail 33c is provided, for example, extending in the Y direction to support both ends of the carrier holding portion 21 in the X direction.
  • the carrier holding portion 21 has a holding portion main body 35 for holding the carrier 27 and a moving base (holding table) 37 for supporting the holding portion main body 35.
  • the moving base 37 is a base member that is connected to the feed screw 33b and is movably provided in the Y direction.
  • FIG. 6 is a plan view showing a schematic configuration of the holding portion main body 35.
  • FIG. 7 is a plan view showing a schematic configuration of the carrier 27 held by the carrier holding portion 21.
  • the holding portion main body 35 is provided with an opening 45 penetrating in the vertical direction.
  • the holding portion main body 35 holds the carrier 27 so as to cover the opening 45.
  • the holding portion main body 35 of the present embodiment has a pressing member 39 and a support base 41.
  • the opening 45 of the present embodiment is formed according to the shape of the wafer W1 held by the carrier 27, and is formed larger than the wafer W1.
  • the opening 45 is formed in a circular shape larger than, for example, the circular wafer W1.
  • the pressing member 39 is a member that presses the annular member 43 (FIG. 7) that holds the carrier 27.
  • the carrier 27 is held by the carrier holding portion 21 by pressing the annular member 43 by the pressing member 39.
  • the support base 41 is connected to the pressing member 39 below the pressing member 39.
  • the support base 41 is provided with a carrier guide 41a that guides the movement of the carrier 27 transported by the carrier transport unit 31 (FIG. 2).
  • the carrier guide 41a is formed, for example, extending in the Y direction at both ends of the support base 41 in the X direction to restrict the movement of the carrier 27 in the X direction.
  • the support base 41 is formed with a support portion 41b that extends upward to support the carrier 27.
  • An opening 45 is formed inside the support portion 41b.
  • the support portion 41b of the present embodiment is formed in an annular shape.
  • the carrier 27 held by the holding portion main body 35 holds the cut-out wafer W1.
  • the outer edge of the carrier 27 of this embodiment is held by an annular member (ring) 43.
  • FIG. 8 is a cross-sectional view taken along the line AA of FIG. 5 showing a state before the carrier 27 is held by the carrier holding portion 21.
  • FIG. 9 is a cross-sectional view taken along the line AA of FIG. 5 showing a state in which the carrier 27 is held by the carrier holding portion 21.
  • the carrier 27 in the magazine 29 shown in FIG. 2 is conveyed toward the carrier holding portion 21 by the carrier conveying portion 31, and is inserted into the space between the pressing member 39 and the support base 41 as shown in FIG. To.
  • the annular member 43 of the carrier 27 is in a state of covering the opening 45 and being supported by the support base 41.
  • the support base 41 is connected to the drive unit 47 that moves the support base 41 in the vertical direction via the rod 49.
  • the drive unit 47 By driving the drive unit 47 from the state shown in FIG. 8, the support base 41 moves downward together with the rod 49.
  • the carrier 27 is expanded (expanded) in the plane direction by the support portion 41b by the carrier holding portion 21. Be retained. By expanding the carrier 27, the distance between the parts cut out in the wafer W1 is widened, and the parts can be easily picked up.
  • FIG. 10 is a plan view showing a schematic configuration of the moving base 37.
  • FIG. 11 is a cross-sectional view taken along the line BB of FIG. 5 showing a state in which the carrier 27 is held by the carrier holding portion 21.
  • FIG. 12 is a sectional view taken along line CC of FIG. 5 showing a state in which the carrier 27 is held by the carrier holding portion 21.
  • the moving base 37 is provided with an opening 51 penetrating in the vertical direction below the opening 45 of the holding portion main body 35.
  • the size of the opening 51 is, for example, the size of the opening 45 or more of the holding portion main body 35.
  • the ejector 25 pushes out the parts in the carrier 27 arranged above the moving base 37 from below toward the pickup unit 23 (FIG. 3).
  • the moving base 37 of the present embodiment is provided with a penetrating portion 52 penetrating in the vertical direction at a position outside the opening in the horizontal direction outside the opening 51.
  • the horizontal position of the pickup unit 23 and the ejector 25 is calibrated through the penetrating portion 52.
  • the penetrating portion 52 is, for example, an opening provided in the moving base 37.
  • the penetrating portion 52 is not limited to the opening, and may have a configuration in which the edge of the moving base 37 is cut out.
  • the penetrating portion 52 is provided at the inner end portion (-Y direction end portion) of the moving base 37.
  • the moving base 37 is provided with a plurality of support rollers 57 (for example, at the four corners) that rotatably support the holding portion main body 35 (FIG. 6) in a horizontal plane.
  • the support roller 57 is a roller that extends upward on the moving base 37 to rotate the holding portion main body 35.
  • the support roller 57 rotatably supports the swivel guide 59 formed by extending downward in the holding portion main body 35.
  • the support roller 57 is provided on the outer peripheral portion of the opening 45 outside the swivel guide 59 extending in the circumferential direction.
  • the penetrating portion 52 is formed so that at least a part of the penetrating portion 52 penetrates in the vertical direction even when the holding portion main body 35 is swiveled by the swivel gear 53. Specifically, the outer edge of the penetrating portion 52 is formed on the outer side in the horizontal direction from the rotation locus of the outer edge of the holding portion main body 35. As a result, the pickup unit 23 and the ejector 25 can be calibrated even when the holding portion main body 35 is rotated.
  • a holding head changer 61 is provided on the moving base 37 of the present embodiment.
  • the holding head changer 61 is provided to replace the component holding head 77 described later in the pickup unit 23.
  • the detailed configuration of the holding head changer 61 will be described later.
  • FIG. 13 is a cross-sectional view showing a schematic configuration of the pickup unit 23.
  • the pickup unit 23 is provided so as to be movable on the top plate 19 by a unit moving mechanism (pickup moving portion) 63.
  • the pickup unit 23 of the present embodiment is provided so as to be movable in one direction (X direction).
  • the unit moving mechanism 63 (FIG. 1) has, for example, a motor 63a, a feed screw 63b, and a guide rail 63c.
  • the feed screw 63b linearly moves the pickup unit 23 in the X direction by the rotary motion of the motor 63a.
  • the feed screw 63b is provided so as to extend in the X direction.
  • the guide rail 63c supports the pickup unit 23 so as to be slidable in the X direction.
  • the guide rail 63c extends in the X direction and is provided on the top plate 19 to support both ends of the pickup unit 23 in the Y direction.
  • the top plate 19 is formed with an opening 65 penetrating in the vertical direction extending in the X direction. As shown in FIG. 13, the pickup unit 23 picks up the component (die) held by the carrier 27 through the opening 65. An opening 69 penetrating in the vertical direction is provided on the upper surface of the cover 67 forming the outer shell of the pickup unit 23 of the present embodiment. Through the opening 69, the pickup unit 23 delivers the picked-up component to the mounting head 11 (FIG. 3). At this time, the mounting head 11 recognizes the component by, for example, the board recognition camera 17 (FIG. 1) and receives the component from the pickup unit 23.
  • the mounting head 11 recognizes the component by, for example, the board recognition camera 17 (FIG. 1) and receives the component from the pickup unit 23.
  • the pickup unit 23 includes a pickup unit 71, a relay unit 73, and a component imaging unit (component detection unit) 75 (FIG. 13).
  • the pickup unit 71 picks up the parts held by the carrier 27. Specifically, the pickup unit 71 picks up a component pushed up by the ejector 25.
  • the pickup unit 71 has a component holding head 77 for holding the component, and the component holding head 77 picks up the component. Specifically, the component holding head 77 attracts and holds the component in the carrier 27 at the tip end portion (lower end portion) to separate the component from the carrier 27.
  • the component holding head 77 is configured so that the orientation of the head can be changed by the first moving mechanism 79.
  • the orientation of the head is the orientation of the tip end portion of the component holding head 77.
  • the component holding head 77 is configured to repeat the operation of picking up the first component in a downward state, then reversing it by the first moving mechanism 79 and delivering it to the mounting head 11 (FIG. 3) in an upward state.
  • the downward component holding head 77 picks up the first component with the first surface of the first component facing upward.
  • the component holding head 77 that picks up the first component is inverted upward and delivered to the mounting head 11 with the second surface of the first component facing upward.
  • the first surface of the parts held by the carrier 27 is in an upward state.
  • the first component is picked up by the component holding head 77 from the carrier 27 on the first surface with the first surface facing upward, and is mounted after being reoriented so that the second surface faces upward. It is delivered to the head 11. Further, in the first component, the mounting head 11 holds the second surface in a state where the first surface faces downward (a state in which the second surface faces upward), and the first surface faces downward. It is mounted on the substrate 9. That is, the first component is a component supplied in the case of flip chip mounting.
  • the first moving mechanism 79 of the present embodiment is a swivel mechanism that swivels the component holding head 77.
  • the first moving mechanism 79 includes a first rotating shaft 81 that is rotated by a motor 80, and a swivel member 83 that rotates with the rotation of the first rotating shaft 81.
  • the first rotation shaft 81 rotates the component holding head 77 in the vertical direction.
  • the swivel member 83 is, for example, a plate-shaped member extending in the vertical direction.
  • the component holding head 77 is provided in the swivel member 83, for example, at an outer end portion (diameter outer end portion) of the first rotating shaft 81 with respect to the central axis.
  • the pickup unit 71 of the present embodiment has a plurality of component holding heads 77. At least one set of component holding heads 77 among the plurality of component holding heads 77 is configured so that the heads are oriented in opposite directions to each other.
  • the pickup unit 71 has two component holding heads 77, and one component holding head 77 and the other component holding head 77 face each other in opposite directions.
  • the tip of one component holding head 77 faces 180 ° in the opposite direction to the tip of the other component holding head 77.
  • One component holding head 77 faces downward to pick up the first component, and the other component holding head 77 faces upward to deliver the component to the mounting head 11.
  • the component holding head 77 of the present embodiment is detachably provided with respect to the head holding portion 85. As a result, the component holding head 77 is replaced according to, for example, the type of component to be mounted.
  • the component holding head 77 is connected to the swivel member 83 via the head holding portion 85 and swivels together with the swivel member 83.
  • the component holding head 77 of the present embodiment has a holding head drive mechanism 87 that moves the component holding head 77 in the radial direction away from the center of the first rotation shaft 81.
  • the specific configuration of the holding head drive mechanism 87 will be described later.
  • ⁇ Relay section> 14 to 16 are side views showing a schematic configuration of the pickup unit 71 and the relay unit 73.
  • the relay unit 73 shown in FIGS. 14 to 16 receives the second component picked up by the pickup unit 71 (component holding head 77) with the first surface facing upward from the component holding head 77, and receives the first surface from the component holding head 77. Is handed over to the mounting head 11 in a state of facing upward.
  • the relay unit 73 has a relay component holding head 89 for holding the component, and the relay component holding head 89 receives the second component and delivers it to the mounting head 11.
  • the second component is picked up from the carrier 27 by the component holding head 77 with the first surface facing upward, and the orientation of the first surface is changed (in the present embodiment, the first surface is It is delivered to the relay unit 73 in a diagonally downward state).
  • the second component is held by the relay unit 73, is reoriented so that the first surface faces upward, and then is delivered to the mounting head 11.
  • the mounting head 11 holds the first surface in a state where the first surface faces upward (a state in which the second surface faces downward), and the first surface faces upward. It is mounted on the substrate 9. That is, the second component is a component supplied in the case of die attach mounting.
  • the relay unit 73 is configured so that the direction of the head can be changed by the second moving mechanism 91. Specifically, the relay unit 73 receives the second component while the component holding head 77 is inverted from the downward state to the upward state. The relay unit 73 of the present embodiment receives the second component in a state where the component holding head 77 is obliquely upward (FIG. 16).
  • the second moving mechanism 91 of the present embodiment is a swivel mechanism that swivels the relay component holding head 89.
  • the second moving mechanism 91 has a second rotating shaft 93 that is rotated by the motor 92 (FIG. 18), and a swivel member 95 that rotates with the rotation of the second rotating shaft 93.
  • the second rotation shaft 93 rotates the relay portion 73 in the vertical direction.
  • the swivel member 95 is formed in a disk shape, for example.
  • the center O2 of the second rotation shaft 93 is arranged above the center O1 of the first rotation shaft 81. Further, as shown in FIG. 15, the turning radius R2 of the relay portion 73 centered on the second rotating shaft 93 is the turning radius R1 of the component holding head 77 centered on the first rotating shaft 81. Smaller than The turning radius R2 of the relay unit 73 is configured to be constant. That is, the distance between the relay component holding head 89 and the center O2 of the second rotating shaft 93 is configured to be constant. In the present embodiment, the relay unit 73 does not have a mechanism corresponding to the holding head drive mechanism 87 in the pickup unit 71. That is, the relay component holding head 89 does not move in the radial direction away from the center O2 of the second rotation shaft 93.
  • the first delivery position TP1 in which the pickup unit 71 delivers the first component to the mounting head 11 and the second delivery position TP2 in which the relay unit 73 delivers the second component to the mounting head 11.
  • the delivery positions TP1 and TP2 are arranged within the focal length of the substrate recognition camera 17 (FIG. 1).
  • the heights of the delivery positions TP1 and TP2 may be, for example, the same height (substantially the same).
  • the first delivery position TP1 and the second delivery position TP2 are separated from each other in the horizontal direction.
  • the component imaging unit 75 images the components held by the carrier 27.
  • the component imaging unit 75 of the present embodiment is configured to be movable together with the pickup unit 23 by the unit moving mechanism 63.
  • a lens barrel 99 extending in the vertical direction is connected to the imaging unit main body 97 extending in the horizontal direction.
  • the lens barrel 99 is arranged above the component holding head 77 in the downward state.
  • An illumination unit 101, a half mirror 103, and a lens (objective lens) 105 are provided in the lens barrel 99.
  • the light illuminated by the illumination unit 101 passes through the half mirror 103 and illuminates the lower component.
  • the half mirror 103 is configured to transmit the light from the illumination unit 101 from above and reflect the light from below toward the image pickup unit main body 97.
  • FIG. 17 is a plan view of the pickup unit 23.
  • FIG. 18 is a plan view of the pickup unit 23 with the cover 67 of FIG. 17 removed.
  • FIG. 19 is a diagram showing a schematic configuration of the holding head drive mechanism 87.
  • the pickup unit 23 has a holding head drive mechanism 87 in the cover 67 (FIG. 17).
  • the holding head drive mechanism 87 of the present embodiment is a cam mechanism.
  • the holding head drive mechanism 87 includes a cam drive motor 107, a first cam 109, and a second cam 111.
  • the cam drive motor 107 rotates the first cam 109 and the second cam 111.
  • the rotation of the first cam 109 causes the first lever 113 to rotate about the first support shaft 115.
  • the rotation of the second cam 111 causes the second lever 117 to rotate about the second support shaft 119.
  • the rotation of the first lever 113 causes the first moving member 121 to move in the radial direction.
  • the first moving piece 123 connected to the first moving member 121 moves in the radial direction together with the first moving member 121.
  • the rotation of the second lever 117 causes the second moving member 125 to move in the radial direction.
  • the second moving piece 127 connected to the second moving member 125 moves in the radial direction together with the second moving member 125.
  • the first moving piece 123 of the present embodiment is arranged at a position where it is connected to the component holding head 77 when the component holding head 77 is in a downward state.
  • the downward component holding head 77 is provided so as to be movable in the vertical direction together with the first moving piece 123.
  • the second moving piece 127 of the present embodiment is arranged at a position where the component holding head 77 is connected to the component holding head 77 when the component holding head 77 is in an obliquely upward state.
  • the diagonally upward component holding head 77 is provided together with the second moving piece 127 so as to be movable in the oblique direction inclined with respect to the vertical direction.
  • FIG. 20 is a side view showing a schematic configuration of the pickup unit 71 in a state where the downward component holding head 77 is connected to the first moving piece 123.
  • the head holding portion 85 is provided with a guide member 129 that guides the radial movement of the component holding head 77.
  • the guide member 129 is provided with a cam follower 131 that radially engages with the first moving piece 123 and the second moving piece 127.
  • the cam follower 131 moves along the cylindrical cam 132 when the swivel member 83 is swiveled.
  • the guide member 129 of the present embodiment is provided so as to urge the component holding head 77 inward in the radial direction by, for example, an elastic member 133 such as a spring.
  • the turning radius of the component holding head 77 is constant at R1 except when the component is picked up and when the component is delivered to the relay component holding head 89.
  • the cam follower 131 When the component holding head 77 is in the downward state, the cam follower 131 is connected to the first moving piece 123 and moves the component holding head 77 in the vertical direction together with the first moving piece 123. When the component holding head 77 is in an obliquely upward state (FIG. 16), the cam follower 131 is connected to the second moving piece 127 to move the component holding head 77 in the radial direction together with the second moving piece 127.
  • FIG. 21 is a side view showing a schematic configuration of the holding head changer 61.
  • 22 and 23 are plan views showing a schematic configuration of the holding head changer 61.
  • the holding head changer 61 includes a storage portion 135 for storing the component holding head 77 and a stopper 137.
  • the storage unit 135 of the present embodiment has a longitudinal direction (X direction), and stores the component holding head 77 along the longitudinal direction. Further, the storage portion 135 has an opening 141 that opens upward. The component holding head 77 is housed through the opening 141.
  • the stopper 137 covers a part of the opening 141 of the storage portion 135.
  • the stopper 137 has an opening 143 that penetrates in the vertical direction.
  • the opening 143 has an enlarged diameter portion 143a larger than the component holding head 77 and a smaller diameter portion 143b smaller than the component holding head 77.
  • the enlarged diameter portion 143a and the small diameter portion 143b are alternately formed along the longitudinal direction.
  • the stopper 137 is driven by the stopper drive unit 139 so that the enlarged diameter portion 143a or the small diameter portion 143b is positioned above the component holding head 77 housed in the storage portion 135.
  • the stopper 137 engages with the engaging portion 78a of the component holding head 77 in the vertical direction in a state where the small diameter portion 143b is located above the component holding head 77 housed in the housing portion 135. To do.
  • the holding head changer 61 of the present embodiment has an elevating portion 145 that moves the accommodating portion 135 in the vertical direction.
  • the accommodating portion 135 is brought closer to the head holding portion 85 (FIG. 24B) by the elevating portion 145.
  • FIG. 24A is a schematic view showing a state before attaching the component holding head 77 to the head holding portion 85.
  • FIG. 24B is a schematic view showing a state in which the component holding head 77 is attached to the head holding portion 85.
  • the storage portion 135 is arranged below the height of the carrier 27 that holds the wafer W1.
  • the upper end portion of the component holding head 77 housed in the storage portion 135 is arranged below the height of the carrier 27.
  • the accommodating portion 135 is moved upward by the elevating portion 145 as shown in FIG. 24B.
  • the head holding portion 85 is moved downward by the holding head driving mechanism 87.
  • the amount of vertical movement of the head holding portion 85 is smaller than the amount of vertical movement of the storage portion 135.
  • the claw portion 85a of the head holding portion 85 is vertically engaged with the recess 78b of the component holding head 77.
  • the claw portion 85a is urged inward by, for example, an elastic member 85b.
  • the head holding portion 85 holds the component holding head 77.
  • the claw portion 85a is formed so as to project from the head holding portion 85 toward the side that holds the component holding head 77.
  • the recess 78b is formed by being recessed inward above the engaging portion 78a of the component holding head 77.
  • FIGS. 25A to 25D are cross-sectional views of a holding head changer 61 showing an operation of removing the component holding head 77 from the head holding portion 85.
  • the component holding head 77 moves so as to be located above the opening 141 of the holding head changer 61.
  • the position adjustment in the Y direction at the relative position of the opening 141 with respect to the component holding head 77 is performed by the holding portion moving mechanism 33 (FIG. 2) of the carrier holding portion 21 that holds the holding head changer 61. Further, the position adjustment in the X direction at the relative position of the opening 141 with respect to the component holding head 77 is performed by the unit moving mechanism 63 that moves the pickup unit 23.
  • the component holding head 77 moves downward and the storage unit 135 moves upward to reach the state shown in FIG. 25B.
  • the tip of the component holding head 77 is inserted into the first opening 141a (FIG. 25A) of the holding head changer 61.
  • the engaging portion 78a of the component holding head 77 is arranged in the second opening 141b (FIG. 25A) of the holding head changer 61.
  • the stopper drive unit 139 is driven so that the stopper 137 changes from the state shown in FIG. 23 to the state shown in FIG. 22. That is, the stopper 137 is moved so that the enlarged diameter portion 143a is located outside the outer edge of the engaging portion 78a and the small diameter portion 143b is located inside the outer edge of the engaging portion 78a. As a result, as shown in FIG. 25C, the engaging portion 78a can be engaged with the small diameter portion 143b in the vertical direction.
  • the head holding portion 85 is moved upward and the storage portion 135 is moved downward.
  • the engaging portion 78a is vertically engaged with the small diameter portion 143b, the component holding head 77 is removed from the head holding portion 85 as shown in FIG. 25D. This completes the operation of removing the component holding head 77 from the head holding portion 85.
  • FIGS. 26A to 26D are cross-sectional views of a holding head changer 61 showing an operation of attaching the component holding head 77 to the head holding portion 85.
  • the head holding portion 85 moves so as to be located above the component holding head 77.
  • the head holding portion 85 moves downward and the storage portion 135 moves upward to reach the state shown in FIG. 26B.
  • the claw portion 85a engages with the recess 78b in the vertical direction, and the component holding head 77 is held by the head holding portion 85.
  • the stopper drive unit 139 is driven so that the stopper 137 changes from the state shown in FIG. 22 to the state shown in FIG. 23. That is, the stopper 137 is moved so that the small diameter portion 143b is located inside the outer edge of the engaging portion 78a and the enlarged diameter portion 143a is located outside the outer edge of the engaging portion 78a. As a result, as shown in FIG. 26C, the engaging portion 78a is not engaged with the small diameter portion 143b in the vertical direction.
  • the head holding portion 85 is moved upward and the storage portion 135 is moved downward. As a result, the operation of attaching the component holding head 77 to the head holding portion 85 is completed.
  • ⁇ Ejector> 27 and 28 are plan views showing a schematic configuration of the ejector 25 of the present embodiment.
  • the ejector 25 has a first ejector (first push-up portion) 25a and a second ejector (second push-up portion) 25b.
  • the first ejector 25a and the second ejector 25b are selectively used depending on, for example, the type of parts supported on the carrier 27.
  • the first ejector 25a and the second ejector 25b of the present embodiment are configured to be movable in the Y direction by the selection unit 155.
  • the ejector 25 is formed so as to extend in the vertical direction, and is configured to be movable up and down by the elevating portion 156.
  • the first ejector 25a moves up and down by the elevating part 156a
  • the second ejector 25b moves up and down by the elevating part 156b.
  • Both the first ejector 25a and the second ejector 25b are provided on the base member 157.
  • the base member 157 is configured to be movable in the X direction by the ejector moving mechanism (moving portion) 159.
  • the ejector moving mechanism 159 moves the base member 157 in one direction (X direction).
  • the ejector moving mechanism 159 includes, for example, a motor 159a, a feed screw 159b, and a guide rail 159c.
  • the feed screw 159b linearly moves the base member 157 in the X direction by the rotary motion of the motor 159a.
  • the feed screw 159b is provided so as to extend in the X direction.
  • the guide rail 159c supports the base member 157 so as to be slidable in the X direction.
  • the guide rail 159c is provided, for example, extending in the X direction to support both ends of the base member 157 in the Y direction.
  • FIG. 29 is a schematic block diagram of the control unit C1 of the component mounting device 1.
  • the control unit C1 stores the pickup control unit C2 that controls the pickup unit 23, the mounting head control unit C3 that controls the mounting head 11, the calculation unit C4, and information related to component mounting. It has a part M1 and.
  • the calculation unit C4 calculates the positions of the pickup unit 23 and the mounting head 11.
  • the storage unit M1 of the present embodiment further stores information captured by the component image pickup unit 75 and the substrate recognition camera 17.
  • the control unit C1 may mount the components according to a predetermined procedure based on the mounting information of the storage unit M1 by executing the program stored in the memory by the processor (processing circuit). It should be noted that the implementation information may be stored in a server or the like, and the implementation information may be provided to the control unit C1 by communication.
  • the control unit C1 drives the board transfer unit 8 (FIG. 1) to transfer the board 9 in the X direction (board transfer direction), and arranges the board 9 at a predetermined position (board transfer step).
  • Parts are supplied by the parts supply device 2, and the parts are mounted (mounted) on the board 9 by the mounting head 11.
  • the component supply operation by the first component supply device 3 will be specifically described. Since the parts supply operation by the second parts supply device 5 is the same as the conventional parts supply operation, the description thereof is omitted here.
  • the control unit C1 drives the carrier transport unit 31 (FIG. 2) of the first parts supply device 3 to transport the carrier 27 stored in the magazine 29 to the carrier holding unit 21 (carrier transfer step).
  • carrier transport unit 31 FIG. 2
  • carrier transfer step When transported to the carrier holding portion 21, the carrier 27 is inserted into the space between the pressing member 39 and the support base 41.
  • the control unit C1 expands the carrier 27 by driving the drive unit 47 and moving the pressing member 39 downward. As a result, the carrier 27 is held by the carrier holding unit 21.
  • the pickup control unit C2 drives the pickup unit 23 to pick up the parts supported on the carrier 27 from above the carrier 27 (pickup step). At this time, the control unit C1 drives the ejector 25 to push up the component supported on the carrier 27 from below the carrier 27 toward the pickup unit 23 (push-up step).
  • a calibration operation for the position of the pickup unit 23 and the position of the ejector 25 is performed before the pickup step and the push-up step. By the calibration operation, the horizontal position of the pickup unit 23 and the horizontal position of the ejector 25 can be matched, and the pickup operation can be performed more accurately.
  • the parts picked up by the pickup unit 23 are delivered to the mounting head 11 (delivery step).
  • a calibration operation is performed for the position of the mounting head 11 and the position of the pickup unit 23 at a stage prior to the delivery step.
  • the horizontal position of the mounting head 11 and the horizontal position of the pickup unit 23 can be grasped more accurately, so that the parts delivery operation can be performed more accurately.
  • the component imaging unit 75 of the pickup unit 23 images the ejector 25 to perform the position calibration operation.
  • the mounting head control unit C3 drives the mounting head 11 (head moving mechanism 13), moves the mounting head 11 that has received the components from the pickup unit 23 to the board 9, and mounts the components on the board 9 (component mounting). Step).
  • the component mounting step the component is mounted using, for example, information from the board recognition camera 17 (for example, information such as a position where the component is mounted).
  • FIG. 30 is a cross-sectional view showing a calibration operation of the position of the ejector 25 when the carrier 27 is held by the carrier holding portion 21.
  • FIG. 31 is a cross-sectional view showing a calibration operation of the position of the ejector 25 when the carrier 27 is not held by the carrier holding portion 21.
  • the control unit C1 of the present embodiment has a first mode in which the position of the ejector 25 is calibrated through the position outside the opening horizontally outside the openings 45 and 51, and the ejector through the position inside the opening inside the openings 45 and 51.
  • a second mode in which the calibration operation of the 25 positions is performed is selectively performed.
  • the control unit C1 drives the unit moving mechanism 63 (FIG. 1) and the ejector 25 to move the pickup unit 23 and the ejector 25.
  • the pickup unit 23 (component imaging unit 75) is located above the penetrating portion 52, and the ejector 25 is located below the penetrating portion 52.
  • the control unit C1 drives the ejector 25 (elevating unit 156) to move the ejector 25 upward.
  • the ejector 25 is raised until the upper end of the ejector 25 is higher than the height of the carrier 27. With the ejector 25 raised, the component imaging unit 75 images the ejector 25 (first detection step). The first detection (imaging) step is performed after the carrier retention step. The position is calibrated using the imaged ejector 25 in the horizontal direction (first calibration step).
  • the component imaging unit 75 of the present embodiment also functions as a detection unit that detects the horizontal position of the ejector 25.
  • the control unit C1 drives the unit moving mechanism 63 (FIG. 1) and the ejector 25 to move the pickup unit 23 and the ejector 25.
  • the pickup unit 23 (component imaging unit 75) is located above the opening 45, and the ejector 25 is located below the opening 45. Further, the control unit C1 drives the ejector 25 to move the ejector 25 upward.
  • the ejector 25 is raised until the upper end portion of the ejector 25 is higher than the height of the carrier 27 when the carrier 27 is held. With the ejector 25 raised, the component imaging unit 75 images the ejector 25 (second detection step). The second detection (imaging) step is performed before the carrier retention step. The position is calibrated using the position of the ejector 25 that has been imaged (second calibration step).
  • FIG. 32 is a schematic configuration diagram of the carrier holding unit 21 when performing a calibration operation of the position of the mounting head 11 and the position of the pickup unit 23.
  • the calibration jig 147 is attached to the carrier holding portion 21.
  • the calibration jig 147 is a jig for performing a calibration operation of the position of the mounting head 11 and the position of the pickup unit 23.
  • the calibration jig 147 is supported by the support portion 41b, for example, in a state where the carrier 27 is not held by the carrier holding portion 21.
  • the calibration jig 147 is formed in a flat plate shape, for example.
  • the calibration jig 147 has a first reference mark 149 and a second reference mark 151.
  • the first reference mark 149 is a mark detected by the component imaging unit (first imaging unit) 75.
  • the second reference mark 151 is a mark detected by the substrate recognition camera (second imaging unit) 17.
  • the second reference mark 151 of the present embodiment is formed on the post 153 extending in the vertical direction.
  • FIG. 33 is a schematic configuration diagram showing the relative positional relationship between the component holding head 77, the relay component holding head 89, and the component imaging unit 75.
  • the relative horizontal positional relationship between the heads of one downward component holding head 77 and the other upward component holding head 77 is obtained.
  • the horizontal positional relationship between the heads is stored in the storage unit M1.
  • the relative optical axis-head-to-head horizontal positional relationship between the optical axis L1 of the component imaging unit 75 and the downward component holding head 77 is obtained.
  • the deviation amounts (offsets) OF1 and OF2 of the component holding head 77 from the optical axis L1 of the component imaging unit 75 are measured.
  • OF1 is the horizontal distance between the component holding head 77 in the downward state and the optical axis L1
  • OF2 is the horizontal distance between the component holding head 77 in the upward state and the optical axis L1.
  • the amount of deviation (offset) OF3 of the position of the upward relay component holding head 89 recognized by the board recognition camera 17 from the estimated position EP1 where the center of the upward relay component holding head 89 is estimated to be located is set. measure. OF3 is the horizontal distance between the estimated position EP1 and the position of the upward relay component holding head 89. OF1, OF2, and OF3 are stored in the storage unit M1 (FIG. 29).
  • FIG. 34 shows an image of the component holding head 77 and the component held by the component holding head 77 taken by the substrate recognition camera 17.
  • OF1 is measured by the substrate recognition camera 17.
  • the board recognition camera 17 takes an image of the component position P1 of the component held by the component holding head 77 in a state where the component holding head 77 facing downward picks up the component and flips it upward.
  • the substrate recognition camera 17 takes an image of the head position P2 of the component holding head 77 in a state where the component is not held.
  • the amount of deviation between the component position P1 and the head position P2 in the horizontal direction is measured, and the amount of deviation is set to OF1.
  • the component position P1 is the center position of the component imaged by the substrate recognition camera 17
  • the head position P2 is the center position of the head imaged by the substrate recognition camera 17.
  • OF2 is measured by the board recognition camera 17.
  • the substrate recognition camera 17 moves on the optical axis L1 and images the component holding head 77 in an upward state.
  • OF2 is, for example, the horizontal distance between the center position of the component holding head 77 and the optical axis L1.
  • the board recognition camera 17 moves to the estimated position EP1 and takes an image of the upward relay component holding head 89 to measure OF3.
  • the estimated position EP1 is, for example, a position separated from the optical axis L1 by a predetermined distance D2.
  • the predetermined distance D2 is, for example, a design value of a horizontal distance between the optical axis L1 and the upward relay component holding head 89.
  • one component holding head will be referred to as a first component holding head 77a
  • the other component holding head will be referred to as a second component holding head 77b.
  • the OF1 when the component holding head 77a is downward is OFa1
  • the OF2 when the component holding head 77a is upward is OFa2
  • the OF1 with the component holding head 77b downward is OFb1
  • the component holding head 77b is upward.
  • OF2 be OFb2.
  • the calculation unit C4 calculates the target position OP1 at which the downward component holding head 77 can pick up components from the carrier 27.
  • the target position OPa1 of the component holding head 77a is calculated using the following mathematical formula (1)
  • the target position OPb1 of the component holding head 77b is calculated using the following mathematical formula (2).
  • the calculation unit C4 calculates the stop position TP1 of the upward component holding head 77 when the pickup unit 71 (downward component holding head 77) is located at the target position OP1.
  • the stop position TPb1 of the upward component holding head 77b when the component holding head 77a is downward is calculated using the following mathematical formula (3).
  • the stop position TPa1 of the upward component holding head 77a when the component holding head 77b is downward is calculated using the following mathematical formula (4).
  • the calculation unit C4 calculates the stop position TP2 of the upward relay component holding head 89 when the pickup unit 71 is located at the target position OP1.
  • the upward stop position TPa2 of the relay component holding head 89 is calculated using the following mathematical formula (5).
  • the upward stop position TPb2 of the relay component holding head 89 is calculated using the following mathematical formula (6).
  • 35A to 35F are schematic views showing a pickup operation and a delivery operation in the case of flip-chip mounting.
  • the component imaging unit 75 images the component supported on the carrier 27.
  • the component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (first component imaging step).
  • the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77a faces downward.
  • the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is located at the target position OPa1.
  • the pickup unit 23 is moved by OFa 1 minute from the position imaged by the component imaging unit 75.
  • the holding head drive mechanism 87 is driven to move the downward component holding head 77a downward to pick up the component. After picking up the parts, the holding head drive mechanism 87 is driven to move the downward parts holding head 77a upward.
  • the swivel member 83 is swiveled to change the posture of the downward component holding head 77a that picks up the component upward. While turning the component holding head 77a, the next component picked up by the component holding head 77b is moved.
  • the component imaging unit 75 images the component to be picked up next.
  • the component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (second component imaging step).
  • the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77b faces downward.
  • the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77b is located at the target position OPb1.
  • the pickup unit 23 is moved by OFb 1 minute from the position imaged by the component imaging unit 75.
  • the calculation unit C4 calculates the stop position TPa1 of the upward component holding head 77a using the above mathematical formula (4).
  • the mounting head 11 is moved to the stop position TPa1 calculated by the calculation unit C4 to receive the component.
  • the holding head drive mechanism 87 is driven to move the downward component holding head 77b downward to pick up the component.
  • the holding head drive mechanism 87 is driven to move the downward parts holding head 77b upward. In this way, the component holding head 77b picks up the component, and the component holding head 77a delivers the component to the mounting head 11 (first operation).
  • the swivel member 83 is swiveled to change the posture of the downward component holding head 77b that picks up the component upward. While turning the component holding head 77b, the component picked up by the component holding head 77a is moved.
  • the component imaging unit 75 images the component to be picked up next.
  • the component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (third component imaging step).
  • the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77a faces downward.
  • the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is located at the target position OPa1.
  • the pickup unit 23 is moved by OFa 1 minute from the position imaged by the component imaging unit 75.
  • the calculation unit C4 calculates the stop position TPb1 of the upward component holding head 77b using the above mathematical formula (3).
  • the mounting head 11 is moved to the stop position TPb1 calculated by the calculation unit C4 to receive the component.
  • the holding head drive mechanism 87 is driven to move the downward component holding head 77a downward to pick up the component.
  • the holding head drive mechanism 87 is driven to move the downward parts holding head 77a upward. In this way, the component holding head 77a picks up the component, and the component holding head 77b delivers the component to the mounting head 11 (second operation).
  • the first operation and the second operation are alternately repeated to supply the components from the carrier 27 to the mounting head 11.
  • 36A to 36H are schematic views showing a pickup operation and a delivery operation in the case of the die attach mounting.
  • the component imaging unit 75 images the component supported on the carrier 27.
  • the component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (fourth component imaging step).
  • the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77a faces downward.
  • the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is located at the target position OPa1.
  • the pickup unit 23 is moved by OFa 1 minute from the position imaged by the component imaging unit 75.
  • the holding head drive mechanism 87 is driven to move the downward component holding head 77a downward to pick up the component. After picking up the parts, the holding head drive mechanism 87 is driven to move the downward parts holding head 77a upward.
  • the swivel member 83 is swiveled to change the posture of the downward component holding head 77a that picks up the component upward. While turning the component holding head 77a, the component picked up by the component holding head 77b is moved.
  • the component imaging unit 75 images the component to be picked up next.
  • the component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (fifth component imaging step).
  • the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77a faces diagonally upward.
  • the relay component holding head 89 is oriented diagonally downward by driving the second moving mechanism 91 (FIG. 14). Specifically, the component holding head 77a and the relay component holding head 89 are in a state of facing each other on the same straight line.
  • the holding head drive mechanism 87 is driven to move the component holding head 77a diagonally upward (toward the relay component holding head 89) and deliver the component to the relay component holding head 89. After the parts are delivered, the holding head drive mechanism 87 is driven to move the diagonally upward component holding head 77a diagonally downward.
  • the relay component holding head 89 is swiveled upward, and the component holding head 77b is swiveled downward.
  • the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77b is located at the target position OPb1.
  • the pickup unit 23 is moved by OFb 1 minute from the position imaged by the component imaging unit 75.
  • the calculation unit C4 calculates the stop position TPa2 of the upward relay component holding head 89 using the above mathematical formula (5).
  • the mounting head 11 is moved to the stop position TPa2 calculated by the calculation unit C4 to receive the component.
  • the holding head drive mechanism 87 is driven to move the downward component holding head 77b downward to pick up the component.
  • the holding head drive mechanism 87 is driven to move the downward parts holding head 77b upward. In this way, the component holding head 77b picks up the component, and the relay component holding head 89 delivers the component to the mounting head 11 (third operation).
  • the component holding head 77b is swiveled, and the component imaging unit 75 images the component to be picked up next.
  • the component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (sixth component imaging step).
  • the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77b faces diagonally upward.
  • the relay component holding head 89 is oriented diagonally downward by driving the second moving mechanism 91 (FIG. 14). Specifically, the component holding head 77b and the relay component holding head 89 are in a state of facing each other on the same straight line.
  • the holding head drive mechanism 87 is driven to move the component holding head 77b diagonally upward (toward the relay component holding head 89) and deliver the component to the relay component holding head 89. After the parts are delivered, the holding head drive mechanism 87 is driven to move the diagonally upward component holding head 77b diagonally downward.
  • the relay component holding head 89 is swiveled upward, and the component holding head 77a is swiveled downward.
  • the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is located at the target position OPa1. Specifically, the pickup unit 23 is moved by OFa 1 minute from the position imaged by the component imaging unit 75.
  • the calculation unit C4 calculates the stop position TPb2 of the upward relay component holding head 89 using the above mathematical formula (6).
  • the mounting head 11 is moved to the stop position TPb2 calculated by the calculation unit C4 to receive the component.
  • the holding head drive mechanism 87 is driven to move the downward component holding head 77a downward to pick up the component.
  • the holding head drive mechanism 87 is driven to move the downward parts holding head 77a upward. In this way, the component holding head 77a picks up the component, and the relay component holding head 89 delivers the component to the mounting head 11 (fourth operation).
  • the third operation and the fourth operation are alternately repeated to supply the parts from the carrier 27 to the mounting head 11.
  • the present invention is not limited to the above embodiment, and can be implemented in various other embodiments.
  • the amount of horizontal deviation between the component position P1 and the head position P2 is measured, and the amount of deviation is defined as OF1, but the present invention is not limited to this.
  • the head position of the component holding head 77 in a state where one of the component holding heads 77 facing downward is inverted upward may be imaged, and the relative horizontal positional relationship between the optical axis L1 and the head position may be regarded as OF1. ..
  • OF1 is measured by the substrate recognition camera 17, but the present invention is not limited to this.
  • OF1 may be measured by, for example, a camera provided below the component holding head 77.
  • the calibration may not be performed.
  • the component imaging unit 75 may simply check the state of the ejector 25 (the state of foreign matter adhering) without performing the calibration.
  • the present invention is not limited to this. That is, the component holding head 77 and the relay component holding head 89 do not have to be configured to rotate (turn) around the first rotating shaft 81 and the second rotating shaft 93.
  • the component holding head 77 and the relay component holding head 89 may be configured so that the orientation of the head can be changed by, for example, a robot arm or the like.
  • the component supply device is useful, for example, when picking up a component supported on a carrier and supplying the component to a mounting head for mounting the component on a substrate.

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Abstract

Provided is a component supply device that can realize further size reduction. The component supply device is provided with: a picking up unit for, in a state where a first surface of a first component is oriented upward, picking up the first component by a downward-oriented component holding head, reversing upward the component holding head having picked up the first component, and delivering the first component to a mounting head in a state where a second surface of the first component is oriented upward; and a relay unit for, in the middle of when the component holding head having picked up a second component is reversed from a downward orientation to an upward orientation, receiving, in a state where the component holding head is oriented upward in an inclined manner, the second component from the component holding head and delivering the second component to the mounting head.

Description

部品供給装置Parts supply equipment
 本発明は、部品供給装置に関する。 The present invention relates to a parts supply device.
 従来、供給部から部品を取り出して搭載ヘッドに部品を受け渡す部品供給装置が知られている(例えば、特許文献1参照)。 Conventionally, there is known a parts supply device that takes out parts from a supply unit and delivers the parts to a mounting head (see, for example, Patent Document 1).
特開2005-93667号公報Japanese Unexamined Patent Publication No. 2005-93667
 しかしながら、部品供給装置をより小型化するという観点において未だ改善の余地がある。 However, there is still room for improvement in terms of making the parts supply device smaller.
 したがって、本発明の目的は、上記課題を解決することにあって、より小型化することができる部品供給装置を提供することにある。 Therefore, an object of the present invention is to provide a parts supply device that can be further miniaturized in order to solve the above problems.
 上記目的を達成するために、本発明の一態様に係る部品供給装置は、基板に部品を搭載する搭載ヘッドに対して、第1の面及び第1の面と反対側の第2の面を有する部品を供給する部品供給装置であって、部品を保持する部品保持ヘッドを有し、第1の部品の第1の面が上向きの状態で、下向きにした部品保持ヘッドによって第1の部品をピックアップし、第1の部品をピックアップした部品保持ヘッドを上向きに反転させて第1の部品の第2の面が上向きの状態で搭載ヘッドに受け渡すピックアップ部と、第2の部品をピックアップした部品保持ヘッドが下向きから上向きに反転する途中において、部品保持ヘッドが斜め上向きの状態で、第2の部品を部品保持ヘッドから受け取って搭載ヘッドに受け渡す中継部とを備える。 In order to achieve the above object, the component supply device according to one aspect of the present invention has a first surface and a second surface opposite to the first surface with respect to a mounting head for mounting components on a substrate. A component supply device for supplying a component to be held, which has a component holding head for holding the component, and the first component is held by the component holding head with the first surface facing upward while the first surface of the first component is facing upward. A pickup unit that picks up and hands over the component holding head that picks up the first component to the mounting head with the second surface of the first component facing upward, and a component that picks up the second component. While the holding head is flipping from downward to upward, the component holding head is provided with a relay unit that receives the second component from the component holding head and delivers it to the mounting head in a state of being obliquely upward.
 本発明に係る部品供給装置によれば、部品供給装置をより小型化することができる。 According to the parts supply device according to the present invention, the parts supply device can be further miniaturized.
本発明の実施の形態の部品搭載装置の概略構成を示す平面図A plan view showing a schematic configuration of a component mounting device according to an embodiment of the present invention. 本発明の実施の形態の第1の部品供給装置の概略構成を示す平面図The plan view which shows the schematic structure of the 1st component supply apparatus of the Embodiment of this invention. 本発明の実施の形態の第1の部品供給装置の概略構成を示す、X方向に沿って切断した断面図A cross-sectional view cut along the X direction showing a schematic configuration of a first component supply device according to an embodiment of the present invention. 本発明の実施の形態のキャリア保持部の概略構成を示す平面図Top view showing schematic structure of carrier holding part of embodiment of this invention 本発明の実施の形態のキャリアを保持していない状態のキャリア保持部の概略構成を示す平面図A plan view showing a schematic configuration of a carrier holding portion in a state where the carrier of the embodiment of the present invention is not held. 本発明の実施の形態の保持部本体の概略構成を示す平面図Top view showing schematic structure of holding part main body of embodiment of this invention 本発明の実施の形態のキャリア保持部によって保持されるキャリアの概略構成を示す平面図Top view showing schematic structure of carrier held by carrier holding part of embodiment of this invention 本発明の実施の形態のキャリア保持部によってキャリアを保持する前の状態を示す、図5のA-A線断面図A cross-sectional view taken along the line AA of FIG. 5 showing a state before the carrier is held by the carrier holding portion according to the embodiment of the present invention. 本発明の実施の形態のキャリア保持部によってキャリアを保持している状態を示す、図5のA-A線断面図FIG. 5A cross-sectional view taken along the line AA showing a state in which the carrier is held by the carrier holding portion according to the embodiment of the present invention. 本発明の実施の形態の移動ベースの概略構成を示す平面図A plan view showing a schematic configuration of a movement base according to an embodiment of the present invention. 本発明の実施の形態のキャリア保持部によってキャリアを保持している状態を示す、図5のB-B線断面図FIG. 5B is a cross-sectional view taken along the line BB showing a state in which the carrier is held by the carrier holding portion according to the embodiment of the present invention. 本発明の実施の形態のキャリア保持部によってキャリアを保持している状態を示す、図5のC-C線断面図FIG. 5 is a cross-sectional view taken along the line CC of FIG. 5, showing a state in which the carrier is held by the carrier holding portion according to the embodiment of the present invention. 本発明の実施の形態のピックアップユニットの概略構成を示す断面図Sectional drawing which shows the schematic structure of the pickup unit of embodiment of this invention. 本発明の実施の形態のピックアップ部及び中継部の概略構成を示す側面図A side view showing a schematic configuration of a pickup unit and a relay unit according to an embodiment of the present invention. 本発明の実施の形態のピックアップ部及び中継部の概略構成を示す側面図A side view showing a schematic configuration of a pickup unit and a relay unit according to an embodiment of the present invention. 本発明の実施の形態のピックアップ部及び中継部の概略構成を示す側面図A side view showing a schematic configuration of a pickup unit and a relay unit according to an embodiment of the present invention. 本発明の実施の形態のピックアップユニットの平面図Top view of the pickup unit according to the embodiment of the present invention 図17のカバーを取り外した状態のピックアップユニットの平面図Top view of the pickup unit with the cover of FIG. 17 removed. 本発明の実施の形態の保持ヘッド駆動機構の概略構成を示す図The figure which shows the schematic structure of the holding head drive mechanism of embodiment of this invention. 本発明の実施の形態の下向きの部品保持ヘッドが第1の移動片に接続された状態のピックアップ部の概略構成を示す側面図A side view showing a schematic configuration of a pickup unit in a state where the downward component holding head according to the embodiment of the present invention is connected to the first moving piece. 本発明の実施の形態の保持ヘッドチェンジャの概略構成を示す側面図A side view showing a schematic configuration of a holding head changer according to an embodiment of the present invention. 本発明の実施の形態の保持ヘッドチェンジャの概略構成を示す平面図Top view showing schematic structure of holding head changer of embodiment of this invention 本発明の実施の形態の保持ヘッドチェンジャの概略構成を示す平面図Top view showing schematic structure of holding head changer of embodiment of this invention 本発明の実施の形態のヘッド保持部に部品保持ヘッドを取り付ける前の状態を示す概略図The schematic diagram which shows the state before attaching the component holding head to the head holding part of embodiment of this invention. 本発明の実施の形態のヘッド保持部に部品保持ヘッドを取り付けた状態を示す概略図Schematic diagram showing a state in which a component holding head is attached to a head holding portion according to an embodiment of the present invention. 本発明の実施の形態の部品保持ヘッドをヘッド保持部から取り外す動作を示す保持ヘッドチェンジャの断面図Sectional drawing of the holding head changer which shows the operation of removing the component holding head of embodiment of this invention from a head holding part. 本発明の実施の形態の部品保持ヘッドをヘッド保持部から取り外す動作を示す保持ヘッドチェンジャの断面図Sectional drawing of the holding head changer which shows the operation of removing the component holding head of embodiment of this invention from a head holding part. 本発明の実施の形態の部品保持ヘッドをヘッド保持部から取り外す動作を示す保持ヘッドチェンジャの断面図Sectional drawing of the holding head changer which shows the operation of removing the component holding head of embodiment of this invention from a head holding part. 本発明の実施の形態の部品保持ヘッドをヘッド保持部から取り外す動作を示す保持ヘッドチェンジャの断面図Sectional drawing of the holding head changer which shows the operation of removing the component holding head of embodiment of this invention from a head holding part. 本発明の実施の形態の部品保持ヘッドをヘッド保持部に取り付ける動作を示す保持ヘッドチェンジャの断面図Sectional drawing of the holding head changer which shows the operation of attaching the component holding head of embodiment of this invention to a head holding part. 本発明の実施の形態の部品保持ヘッドをヘッド保持部に取り付ける動作を示す保持ヘッドチェンジャの断面図Sectional drawing of the holding head changer which shows the operation of attaching the component holding head of embodiment of this invention to a head holding part. 本発明の実施の形態の部品保持ヘッドをヘッド保持部に取り付ける動作を示す保持ヘッドチェンジャの断面図Sectional drawing of the holding head changer which shows the operation of attaching the component holding head of embodiment of this invention to a head holding part. 本発明の実施の形態の部品保持ヘッドをヘッド保持部に取り付ける動作を示す保持ヘッドチェンジャの断面図Sectional drawing of the holding head changer which shows the operation of attaching the component holding head of embodiment of this invention to a head holding part. 本発明の実施の形態のエジェクタの概略構成を示す平面図A plan view showing a schematic configuration of an ejector according to an embodiment of the present invention. 本発明の実施の形態のエジェクタの概略構成を示す平面図A plan view showing a schematic configuration of an ejector according to an embodiment of the present invention. 本発明の実施の形態の部品搭載装置の制御部の概略ブロック図Schematic block diagram of the control unit of the component mounting device according to the embodiment of the present invention. 本発明の実施の形態のキャリア保持部にキャリアが保持された場合のエジェクタの位置の較正動作を示す断面図Sectional drawing which shows the calibration operation of the position of an ejector when a carrier is held in the carrier holding part of embodiment of this invention. 本発明の実施の形態のキャリア保持部にキャリアが保持されていない場合のエジェクタの位置の較正動作を示す断面図Sectional drawing which shows the calibration operation of the position of an ejector when a carrier is not held in the carrier holding part of embodiment of this invention. 本発明の実施の形態の部品保持ヘッド、中継用部品保持ヘッド、及び部品撮像部の相対的な位置関係を示す概略構成図Schematic configuration diagram showing the relative positional relationship between the component holding head, the relay component holding head, and the component imaging unit according to the embodiment of the present invention. 本発明の実施の形態の部品保持ヘッド、中継用部品保持ヘッド、及び部品撮像部の相対的な位置関係を示す概略構成図Schematic configuration diagram showing the relative positional relationship between the component holding head, the relay component holding head, and the component imaging unit according to the embodiment of the present invention. 本発明の実施の形態の部品保持ヘッド及び部品保持ヘッドに保持される部品を基板認識カメラによって撮像した画像An image of the component holding head according to the embodiment of the present invention and the component held by the component holding head taken by a substrate recognition camera. 本発明の実施の形態のフリップチップ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing a pickup operation and a delivery operation in the case of flip-chip mounting according to the embodiment of the present invention. 本発明の実施の形態のフリップチップ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing a pickup operation and a delivery operation in the case of flip-chip mounting according to the embodiment of the present invention. 本発明の実施の形態のフリップチップ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing a pickup operation and a delivery operation in the case of flip-chip mounting according to the embodiment of the present invention. 本発明の実施の形態のフリップチップ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing a pickup operation and a delivery operation in the case of flip-chip mounting according to the embodiment of the present invention. 本発明の実施の形態のフリップチップ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing a pickup operation and a delivery operation in the case of flip-chip mounting according to the embodiment of the present invention. 本発明の実施の形態のフリップチップ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing a pickup operation and a delivery operation in the case of flip-chip mounting according to the embodiment of the present invention. 本発明の実施の形態のダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. 本発明の実施の形態のダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. 本発明の実施の形態のダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. 本発明の実施の形態のダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. 本発明の実施の形態のダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. 本発明の実施の形態のダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. 本発明の実施の形態のダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention. 本発明の実施の形態のダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図Schematic diagram showing the pickup operation and the delivery operation in the case of the die attach mounting according to the embodiment of the present invention.
 本発明の第1態様の部品供給装置は、基板に部品を搭載する搭載ヘッドに対して、第1の面及び第1の面と反対側の第2の面を有する部品を供給する部品供給装置であって、部品を保持する部品保持ヘッドを有し、第1の部品の第1の面が上向きの状態で、下向きにした部品保持ヘッドによって第1の部品をピックアップし、第1の部品をピックアップした部品保持ヘッドを上向きに反転させて第1の部品の第2の面が上向きの状態で搭載ヘッドに受け渡すピックアップ部と、第2の部品をピックアップした部品保持ヘッドが下向きから上向きに反転する途中において、部品保持ヘッドが斜め上向きの状態で、第2の部品を部品保持ヘッドから受け取って搭載ヘッドに受け渡す中継部と、を備える。 The component supply device according to the first aspect of the present invention is a component supply device that supplies a component having a first surface and a second surface opposite to the first surface to a mounting head for mounting the component on a substrate. That is, it has a component holding head for holding a component, and the first component is picked up by the component holding head turned downward while the first surface of the first component is facing upward, and the first component is picked up. The pickup unit that flips the picked-up component holding head upward and delivers it to the mounting head with the second surface of the first component facing upward, and the component holding head that picks up the second component are flipped from downward to upward. A relay unit that receives the second component from the component holding head and delivers it to the mounting head while the component holding head is obliquely upward is provided.
 部品保持ヘッドが水平方向横向き又は斜め下向きの状態よりも、斜め上向きの状態で中継部が第2の部品を受け取ることで、中継部が第2の部品を受け取ってから搭載ヘッドに受け渡すまでの中継部の経路長を短くすることができる。これにより、部品供給装置を小型化することができる。 When the relay unit receives the second component in a state where the component holding head is oriented diagonally upward rather than horizontally or diagonally downward, the relay unit receives the second component and delivers it to the mounting head. The path length of the relay unit can be shortened. As a result, the parts supply device can be miniaturized.
 本発明の第2態様の部品供給装置においては、第1の部品を下向きの状態でピックアップした部品保持ヘッドが、上向きに反転して第1の部品を搭載ヘッドに受け渡すように、部品保持ヘッドを上下方向に回動させる第1の回動軸と、第2の部品を部品保持ヘッドから斜め下向きの状態で受け取った中継部が、上向きに反転して第2の部品を搭載ヘッドに受け渡すように、中継部を上下方向に回動させる第2の回動軸とを有していてもよい。 In the component supply device of the second aspect of the present invention, the component holding head that picks up the first component in a downward state is inverted upward and delivers the first component to the mounting head. The first rotating shaft that rotates the second component in the vertical direction and the relay unit that receives the second component diagonally downward from the component holding head are inverted upward and deliver the second component to the mounting head. As described above, it may have a second rotation shaft that rotates the relay portion in the vertical direction.
 部品保持ヘッド及び中継部を、回動軸を中心に上下方向に回動させることで部品の受け取り及び受け渡しをより容易に行うことができる。 By rotating the component holding head and the relay unit in the vertical direction around the rotation axis, it is possible to more easily receive and deliver the component.
 本発明の第3態様の部品供給装置においては、第2の回動軸を中心とする中継部の回動半径は、第1の回動軸を中心とする部品保持ヘッドの回動半径よりも小さくてもよい。 In the component supply device of the third aspect of the present invention, the radius of gyration of the relay portion centered on the second axis of rotation is larger than the radius of gyration of the component holding head centered on the first axis of rotation. It may be small.
 第1の回動軸と第2の回動軸との軸間距離を短くすることができるため、部品供給装置をより小型化することができる。 Since the distance between the first rotating shaft and the second rotating shaft can be shortened, the parts supply device can be further miniaturized.
 本発明の第4態様の部品供給装置においては、第2の回動軸の中心は、第1の回動軸の中心よりも上方に位置していてもよい。 In the component supply device of the fourth aspect of the present invention, the center of the second rotation shaft may be located above the center of the first rotation shaft.
 第2の回動軸の中心を第1の回動軸の中心よりも上方に配置することで、ピックアップ部が搭載ヘッドに第1の部品を受け渡す高さと、中継部が搭載ヘッドに第2の部品を受け渡す高さとの差を低減することができる。これにより、ピックアップ部及び中継部による搭載ヘッドへの部品の受け渡しをより容易に行うことができる。 By arranging the center of the second rotation shaft above the center of the first rotation shaft, the height at which the pickup unit delivers the first component to the mounting head and the relay unit are second to the mounting head. It is possible to reduce the difference from the height at which the parts are delivered. As a result, the parts can be more easily delivered to the mounting head by the pickup unit and the relay unit.
 本発明の第5態様の部品供給装置においては、ピックアップ部が搭載ヘッドへ第1の部品を受け渡す第1の受け渡し位置、及び中継部が搭載ヘッドへ第2の部品を受け渡す第2の受け渡し位置は、同じ高さに位置していてもよい。 In the component supply device according to the fifth aspect of the present invention, a first delivery position in which the pickup unit delivers the first component to the mounting head, and a second delivery position in which the relay unit delivers the second component to the mounting head. The positions may be located at the same height.
 第1の受け渡し位置及び第2の受け渡し位置を、搭載ヘッドの上下方向の可動範囲内の高さに配置することで、ピックアップ部及び中継部による搭載ヘッドへの部品の受け渡しをより容易に行うことができる。 By arranging the first delivery position and the second delivery position at a height within the movable range in the vertical direction of the mounting head, it is easier to deliver parts to the mounting head by the pickup unit and the relay unit. Can be done.
 本発明の第6態様の部品供給装置においては、第1の受け渡し位置及び第2の受け渡し位置は、互いに水平方向に離間していてもよい。 In the parts supply device of the sixth aspect of the present invention, the first delivery position and the second delivery position may be separated from each other in the horizontal direction.
 第1の受け渡し位置と第2の受け渡し位置とを互いに水平方向に離すことで、ピックアップ部及び中継部から搭載ヘッドへの部品の受け渡しをより容易に行うことができる。 By separating the first delivery position and the second delivery position in the horizontal direction from each other, it is possible to more easily deliver the parts from the pickup unit and the relay unit to the mounting head.
 本発明の第7態様の部品供給装置においては、ピックアップ部は、第1の回動軸の中心から遠ざかる径方向に部品保持ヘッドを移動させる保持ヘッド駆動機構を有していてもよい。 In the component supply device according to the seventh aspect of the present invention, the pickup unit may have a holding head drive mechanism for moving the component holding head in the radial direction away from the center of the first rotation shaft.
 保持ヘッド駆動機構によって部品保持ヘッドを移動させることで、ピックアップ部による部品の受け取り及び受け渡しをより容易に行うことができる。 By moving the parts holding head by the holding head drive mechanism, it is possible to more easily receive and deliver the parts by the pickup unit.
 本発明の第8態様の部品供給装置においては、中継部は、第2の部品を部品保持ヘッドから受け取って搭載ヘッドに受け渡す中継用部品保持ヘッドを有し、中継用部品保持ヘッドと第2の回動軸の中心との距離は一定となるように構成されてもよい。 In the component supply device according to the eighth aspect of the present invention, the relay unit has a relay component holding head that receives the second component from the component holding head and delivers it to the mounting head, and has the relay component holding head and the second component holding head. The distance from the center of the rotation axis of the above may be constant.
 中継用部品保持ヘッドと第2の回動軸の中心との距離を一定となるように構成して、第2の回動軸の中心から遠ざかる径方向に中継用部品保持ヘッドを移動させる駆動機構を不要とすることで、部品供給装置をより小型化することができる。 A drive mechanism that is configured so that the distance between the relay component holding head and the center of the second rotating shaft is constant, and moves the relay component holding head in the radial direction away from the center of the second rotating shaft. By eliminating the need for, the parts supply device can be further miniaturized.
 本発明の第9態様の部品供給装置においては、ピックアップ部は、複数の部品保持ヘッドを有し、複数の部品保持ヘッドのうちの少なくとも1組の部品保持ヘッドは、互いに反対方向を向くように構成されてもよい。 In the component supply device according to the ninth aspect of the present invention, the pickup unit has a plurality of component holding heads, and at least one set of component holding heads among the plurality of component holding heads is oriented in opposite directions. It may be configured.
 1組の部品保持ヘッドのうちの一方の部品保持ヘッドが、供給される部品をピックアップするときに、第1の部品をピックアップしている他方の部品保持ヘッドによって、当該第1の部品を搭載ヘッドに受け渡すことができる。これにより、部品の受け渡しの効率を向上させることができる。 When one component holding head of a set of component holding heads picks up the supplied component, the other component holding head picking up the first component mounts the first component. Can be handed over to. As a result, the efficiency of delivery of parts can be improved.
 本発明の第10態様の部品供給装置においては、ピックアップ部及び中継部は、ピックアップユニットを構成し、ピックアップユニットの位置を調整するユニット移動機構をさらに有していてもよい。 In the component supply device according to the tenth aspect of the present invention, the pickup unit and the relay unit may further include a unit moving mechanism that constitutes the pickup unit and adjusts the position of the pickup unit.
 ユニット移動機構によりピックアップユニットの位置を調整することで、部品保持ヘッドによって第1の部品をより精確に受け取ることができる。また、ピックアップ部及び中継部を1つのユニットにすることで、ピックアップ部と中継部との相対位置を一定にすることができ、ピックアップ部から中継部への第2の部品の受け渡しをより精確に行うことができる。 By adjusting the position of the pickup unit with the unit movement mechanism, the first part can be received more accurately by the part holding head. Further, by combining the pickup unit and the relay unit into one unit, the relative position between the pickup unit and the relay unit can be made constant, and the delivery of the second component from the pickup unit to the relay unit can be performed more accurately. It can be carried out.
 本発明の第11態様の部品供給装置においては、上下方向に延びる鏡筒を有し、ピックアップ部によってピックアップされる部品を撮像する部品撮像部をさらに備え、鏡筒は、下向き状態の部品保持ヘッドの上方に配置されてもよい。 The component supply device according to the eleventh aspect of the present invention has a lens barrel extending in the vertical direction, further includes a component imaging unit that images a component picked up by the pickup unit, and the lens barrel is a component holding head in a downward state. It may be placed above.
 部品撮像部の鏡筒を、下向き状態の部品保持ヘッドの上方に配置することで、水平方向において部品供給装置をより小型化することができる。 By arranging the lens barrel of the component imaging unit above the component holding head in the downward state, the component supply device can be further miniaturized in the horizontal direction.
 以下、本開示の実施の形態について、添付図面を参照しながら説明する。また、各図においては、説明を容易なものにするため、適宜、各要素を誇張して示している。なお、この実施形態によって本発明が限定されるものではない。 Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Further, in each figure, each element is exaggerated as appropriate for easy explanation. The present invention is not limited to this embodiment.
(実施の形態)
 まず、本実施の形態の部品搭載装置1の概略構成について、図1を用いて説明する。図1は、本発明の実施の形態の部品搭載装置1の概略構成を示す平面図である。
(Embodiment)
First, the schematic configuration of the component mounting device 1 of the present embodiment will be described with reference to FIG. FIG. 1 is a plan view showing a schematic configuration of a component mounting device 1 according to an embodiment of the present invention.
 図1に示すように、部品搭載装置1は、部品供給装置2と、部品搭載部7とを備える。部品供給装置2は、各種部品を部品搭載部7に供給する装置である。部品搭載部7は、部品供給装置2から供給される部品を受け取って当該部品を基板9に搭載する機構である。以下、図において、X方向及びY方向は、水平面内で互いに直交する方向であって、Z方向は、X方向及びY方向に直交する高さ方向(上下方向)である。 As shown in FIG. 1, the component mounting device 1 includes a component supply device 2 and a component mounting unit 7. The component supply device 2 is a device that supplies various components to the component mounting unit 7. The component mounting unit 7 is a mechanism that receives the components supplied from the component supply device 2 and mounts the components on the substrate 9. Hereinafter, in the figure, the X direction and the Y direction are directions orthogonal to each other in the horizontal plane, and the Z direction is a height direction (vertical direction) orthogonal to the X direction and the Y direction.
 本実施の形態の部品供給装置2は、部品の種類に応じて複数の部品供給装置を備える。部品供給装置2は、例えば、第1の部品供給装置3と、第2の部品供給装置5とを有する。 The parts supply device 2 of the present embodiment includes a plurality of parts supply devices according to the types of parts. The parts supply device 2 includes, for example, a first parts supply device 3 and a second parts supply device 5.
 第1の部品供給装置3では、例えば、ウエハW1から切り出された部品(ダイ)を供給する。第1の部品供給装置3によって供給される部品は、第1の面及び第1の面と反対側の第2の面を有する。当該部品は、例えば直方体又は立方体形状に形成される。第2の部品供給装置5は、例えば、トレイフィーダ、スティックフィーダ、テープフィーダ等である。なお、第2の部品供給装置5は、上記フィーダ以外の部品供給装置であってもよい。また、第2の部品供給装置5は、部品搭載装置1に設けられていなくてもよい。 The first component supply device 3 supplies, for example, the components (dies) cut out from the wafer W1. The parts supplied by the first parts supply device 3 have a first surface and a second surface opposite to the first surface. The part is formed, for example, in the shape of a rectangular parallelepiped or a cube. The second component supply device 5 is, for example, a tray feeder, a stick feeder, a tape feeder, or the like. The second component supply device 5 may be a component supply device other than the feeder. Further, the second component supply device 5 may not be provided in the component mounting device 1.
 部品搭載部7は、部品を基板9に搭載する搭載ヘッド11と、搭載ヘッド11を移動させるヘッド移動機構13とを備える。搭載ヘッド11は、ヘッド移動機構13によって水平面(XY平面)内を移動可能に設けられる。ヘッド移動機構13は、例えば、X軸テーブル13A及びY軸テーブル13Bを有する直交座標テーブルである。X軸テーブル13A及びY軸テーブル13Bは、それぞれ、搭載ヘッド11をX方向及びY方向に移動させる。 The component mounting unit 7 includes a mounting head 11 for mounting the component on the substrate 9 and a head moving mechanism 13 for moving the mounting head 11. The mounting head 11 is provided so as to be movable in a horizontal plane (XY plane) by a head moving mechanism 13. The head moving mechanism 13 is, for example, an orthogonal coordinate table having an X-axis table 13A and a Y-axis table 13B. The X-axis table 13A and the Y-axis table 13B move the mounting head 11 in the X direction and the Y direction, respectively.
 本実施の形態では、部品搭載装置1には、基板9に搭載する部品を認識する部品認識カメラ15及び基板9を認識する基板認識カメラ17が設けられる。部品認識カメラ15は、例えば、基板9と部品供給装置2との間に設けられる。搭載ヘッド11が受け取った部品は、部品認識カメラ15によって認識された後、基板9に搭載される。このとき、搭載ヘッド11は、基板認識カメラ17によって基板9の位置を認識して部品の搭載を行う。本実施の形態の基板認識カメラ17は、搭載ヘッド11と共に水平面内を移動可能に設けられる。例えば、基板認識カメラ17は、X軸テーブル13Aにおいて、搭載ヘッド11と共に設けられる。 In the present embodiment, the component mounting device 1 is provided with a component recognition camera 15 for recognizing components mounted on the substrate 9 and a substrate recognition camera 17 for recognizing the substrate 9. The component recognition camera 15 is provided, for example, between the substrate 9 and the component supply device 2. The component received by the mounting head 11 is recognized by the component recognition camera 15 and then mounted on the substrate 9. At this time, the mounting head 11 recognizes the position of the board 9 by the board recognition camera 17 and mounts the components. The substrate recognition camera 17 of the present embodiment is provided so as to be movable in a horizontal plane together with the mounting head 11. For example, the substrate recognition camera 17 is provided together with the mounting head 11 on the X-axis table 13A.
 次に、第1の部品供給装置3の構成について図2及び図3を用いて説明する。図2は、第1の部品供給装置3の概略構成を示す平面図である。図3は、第1の部品供給装置3の概略構成を示す、X方向に沿って切断した断面図である。図2において、説明の便宜上、天板19の一部を省略して図示している。 Next, the configuration of the first component supply device 3 will be described with reference to FIGS. 2 and 3. FIG. 2 is a plan view showing a schematic configuration of the first component supply device 3. FIG. 3 is a cross-sectional view cut along the X direction showing a schematic configuration of the first component supply device 3. In FIG. 2, for convenience of explanation, a part of the top plate 19 is omitted.
 図2又は図3に示すように、本実施の形態の第1の部品供給装置3は、キャリア保持部21と、ピックアップユニット23と、エジェクタ25とを備える。キャリア保持部21は、部品を切り出したウエハを支持するキャリア27を保持する。ピックアップユニット23は、キャリア保持部21のキャリア27によって保持された部品をピックアップする。本実施の形態のピックアップユニット23は、部品を吸着保持する。エジェクタ25は、キャリア保持部21によって保持されたダイを下方からピックアップユニット23に向けて押し出す。本実施の形態のエジェクタ25は、ダイを上方に向けて突き上げる。ここで、キャリア27は、後述のエキスパンド動作において伸縮性を有するシートである。例えば、キャリア27は、ウエハW1を粘着力で保持する粘着シートである。 As shown in FIG. 2 or 3, the first component supply device 3 of the present embodiment includes a carrier holding unit 21, a pickup unit 23, and an ejector 25. The carrier holding portion 21 holds the carrier 27 that supports the wafer from which the parts have been cut out. The pickup unit 23 picks up the parts held by the carrier 27 of the carrier holding unit 21. The pickup unit 23 of the present embodiment sucks and holds the parts. The ejector 25 pushes the die held by the carrier holding portion 21 toward the pickup unit 23 from below. The ejector 25 of the present embodiment pushes up the die upward. Here, the carrier 27 is a sheet having elasticity in the expanding operation described later. For example, the carrier 27 is an adhesive sheet that holds the wafer W1 with adhesive force.
 本実施の形態の第1の部品供給装置3では、部品を切り出したウエハW1がキャリア27に保持された状態でマガジン29内に収容されている。マガジン29は、例えば、キャリア保持部21よりも外側(+Y方向)に設けられる。マガジン29内のキャリア27は、キャリア搬送部31によってキャリア保持部21に向けて搬送される。搬送されたキャリア27は、キャリア保持部21によって保持される。 In the first component supply device 3 of the present embodiment, the wafer W1 from which the components have been cut out is housed in the magazine 29 in a state of being held by the carrier 27. The magazine 29 is provided, for example, on the outer side (+ Y direction) of the carrier holding portion 21. The carrier 27 in the magazine 29 is conveyed toward the carrier holding unit 21 by the carrier conveying unit 31. The conveyed carrier 27 is held by the carrier holding unit 21.
<キャリア保持部>
 図4は、キャリア保持部21の概略構成を示す平面図である。図5は、キャリア27を保持していない状態のキャリア保持部21の概略構成を示す平面図である。図4及び図5に示すように、本実施の形態のキャリア保持部21は、水平面内で移動可能に設けられる。キャリア保持部21は、キャリア保持部21(後述の移動ベース37)を移動させる保持部移動機構(移動部)33を有する。
<Carrier holding part>
FIG. 4 is a plan view showing a schematic configuration of the carrier holding portion 21. FIG. 5 is a plan view showing a schematic configuration of the carrier holding portion 21 in a state where the carrier 27 is not held. As shown in FIGS. 4 and 5, the carrier holding portion 21 of the present embodiment is provided so as to be movable in a horizontal plane. The carrier holding unit 21 has a holding unit moving mechanism (moving unit) 33 that moves the carrier holding unit 21 (moving base 37 described later).
 本実施の形態の保持部移動機構33は、一方向(Y方向)にキャリア保持部21を移動させる。保持部移動機構33は、例えば、モータ33aと、送りねじ33bと、ガイドレール33cとを有する。送りねじ33bは、モータ33aによる回転運動でキャリア保持部21をY方向に直線移動させる。送りねじ33bは、Y方向に延びて設けられる。ガイドレール33cは、キャリア保持部21をY方向にスライド移動可能に支持する。ガイドレール33cは、例えば、Y方向に延びて設けられてキャリア保持部21のX方向両端部を支持する。 The holding unit moving mechanism 33 of the present embodiment moves the carrier holding unit 21 in one direction (Y direction). The holding portion moving mechanism 33 has, for example, a motor 33a, a feed screw 33b, and a guide rail 33c. The feed screw 33b linearly moves the carrier holding portion 21 in the Y direction by the rotary motion of the motor 33a. The feed screw 33b is provided so as to extend in the Y direction. The guide rail 33c supports the carrier holding portion 21 so as to be slidable in the Y direction. The guide rail 33c is provided, for example, extending in the Y direction to support both ends of the carrier holding portion 21 in the X direction.
 キャリア保持部21は、キャリア27を保持する保持部本体35と、保持部本体35を支持する移動ベース(保持テーブル)37とを有する。移動ベース37は、送りねじ33bに接続されて、Y方向に移動可能に設けられるベース部材である。 The carrier holding portion 21 has a holding portion main body 35 for holding the carrier 27 and a moving base (holding table) 37 for supporting the holding portion main body 35. The moving base 37 is a base member that is connected to the feed screw 33b and is movably provided in the Y direction.
 図6は、保持部本体35の概略構成を示す平面図である。図7は、キャリア保持部21によって保持されるキャリア27の概略構成を示す平面図である。 FIG. 6 is a plan view showing a schematic configuration of the holding portion main body 35. FIG. 7 is a plan view showing a schematic configuration of the carrier 27 held by the carrier holding portion 21.
 図6に示すように、保持部本体35には、上下方向に貫通した開口45が設けられる。保持部本体35は、開口45を覆うようにキャリア27を保持する。本実施の形態の保持部本体35は、押さえ部材39と、支持ベース41とを有する。本実施の形態の開口45は、キャリア27に保持されるウエハW1の形状に応じて形成され、ウエハW1よりも大きく形成される。開口45は、例えば、円形のウエハW1よりも大きな円形に形成される。 As shown in FIG. 6, the holding portion main body 35 is provided with an opening 45 penetrating in the vertical direction. The holding portion main body 35 holds the carrier 27 so as to cover the opening 45. The holding portion main body 35 of the present embodiment has a pressing member 39 and a support base 41. The opening 45 of the present embodiment is formed according to the shape of the wafer W1 held by the carrier 27, and is formed larger than the wafer W1. The opening 45 is formed in a circular shape larger than, for example, the circular wafer W1.
 押さえ部材39は、キャリア27を保持する環状部材43(図7)を押さえる部材である。押さえ部材39によって環状部材43が押さえられることで、キャリア27がキャリア保持部21に保持される。 The pressing member 39 is a member that presses the annular member 43 (FIG. 7) that holds the carrier 27. The carrier 27 is held by the carrier holding portion 21 by pressing the annular member 43 by the pressing member 39.
 支持ベース41は、押さえ部材39の下方で押さえ部材39と接続する。支持ベース41には、キャリア搬送部31(図2)によって搬送されるキャリア27の移動をガイドするキャリアガイド41aが設けられる。キャリアガイド41aは、例えば、支持ベース41のX方向両端部においてY方向に延びて形成され、キャリア27のX方向の移動を規制する。また、支持ベース41には、上方に延びてキャリア27を支持する支持部41bが形成される。支持部41bの内側には、開口45が形成される。本実施の形態の支持部41bは、環状に形成される。 The support base 41 is connected to the pressing member 39 below the pressing member 39. The support base 41 is provided with a carrier guide 41a that guides the movement of the carrier 27 transported by the carrier transport unit 31 (FIG. 2). The carrier guide 41a is formed, for example, extending in the Y direction at both ends of the support base 41 in the X direction to restrict the movement of the carrier 27 in the X direction. Further, the support base 41 is formed with a support portion 41b that extends upward to support the carrier 27. An opening 45 is formed inside the support portion 41b. The support portion 41b of the present embodiment is formed in an annular shape.
 図7に示すように、保持部本体35によって保持されるキャリア27は、切り出し済みのウエハW1を保持する。本実施の形態のキャリア27の外縁部は、環状部材(リング)43によって保持される。 As shown in FIG. 7, the carrier 27 held by the holding portion main body 35 holds the cut-out wafer W1. The outer edge of the carrier 27 of this embodiment is held by an annular member (ring) 43.
 図8は、キャリア保持部21によってキャリア27を保持する前の状態を示す、図5のA-A線断面図である。図9は、キャリア保持部21によってキャリア27を保持している状態を示す、図5のA-A線断面図である。 FIG. 8 is a cross-sectional view taken along the line AA of FIG. 5 showing a state before the carrier 27 is held by the carrier holding portion 21. FIG. 9 is a cross-sectional view taken along the line AA of FIG. 5 showing a state in which the carrier 27 is held by the carrier holding portion 21.
 図2に示すマガジン29内のキャリア27は、キャリア搬送部31によってキャリア保持部21に向けて搬送されて、図8に示すように、押さえ部材39と支持ベース41との間の空間に挿入される。これにより、キャリア27の環状部材43は、開口45を覆って支持ベース41によって支持された状態となっている。 The carrier 27 in the magazine 29 shown in FIG. 2 is conveyed toward the carrier holding portion 21 by the carrier conveying portion 31, and is inserted into the space between the pressing member 39 and the support base 41 as shown in FIG. To. As a result, the annular member 43 of the carrier 27 is in a state of covering the opening 45 and being supported by the support base 41.
 図8及び図9に示すように、支持ベース41は、支持ベース41を上下方向に移動させる駆動部47に対して、ロッド49を介して接続される。図8に示す状態から駆動部47を駆動することで、ロッド49と共に支持ベース41は下方に移動する。図9に示すように、押さえ部材39が支持部41bの上端部よりも下方に移動することで、キャリア27は、支持部41bによって面方向にエキスパンド(拡張)された状態でキャリア保持部21によって保持される。キャリア27をエキスパンドすることで、ウエハW1において切り出された部品同士の間隔が広まり、部品のピックアップを容易に行うことができる。 As shown in FIGS. 8 and 9, the support base 41 is connected to the drive unit 47 that moves the support base 41 in the vertical direction via the rod 49. By driving the drive unit 47 from the state shown in FIG. 8, the support base 41 moves downward together with the rod 49. As shown in FIG. 9, by moving the pressing member 39 below the upper end portion of the support portion 41b, the carrier 27 is expanded (expanded) in the plane direction by the support portion 41b by the carrier holding portion 21. Be retained. By expanding the carrier 27, the distance between the parts cut out in the wafer W1 is widened, and the parts can be easily picked up.
 図10は、移動ベース37の概略構成を示す平面図である。図11は、キャリア保持部21によってキャリア27を保持している状態を示す、図5のB-B線断面図である。図12は、キャリア保持部21によってキャリア27を保持している状態を示す、図5のC-C線断面図である。 FIG. 10 is a plan view showing a schematic configuration of the moving base 37. FIG. 11 is a cross-sectional view taken along the line BB of FIG. 5 showing a state in which the carrier 27 is held by the carrier holding portion 21. FIG. 12 is a sectional view taken along line CC of FIG. 5 showing a state in which the carrier 27 is held by the carrier holding portion 21.
 図10に示すように、移動ベース37には、上下方向に貫通した開口51が保持部本体35の開口45の下方に設けられる。開口51の大きさは、例えば、保持部本体35の開口45以上の大きさである。開口51を通じて、エジェクタ25は、移動ベース37の上方に配置されるキャリア27内の部品を下方からピックアップユニット23(図3)に向けて押し出す。 As shown in FIG. 10, the moving base 37 is provided with an opening 51 penetrating in the vertical direction below the opening 45 of the holding portion main body 35. The size of the opening 51 is, for example, the size of the opening 45 or more of the holding portion main body 35. Through the opening 51, the ejector 25 pushes out the parts in the carrier 27 arranged above the moving base 37 from below toward the pickup unit 23 (FIG. 3).
 本実施の形態の移動ベース37には、開口51よりも水平方向外側の開口外位置において、上下方向に貫通した貫通部52が設けられる。貫通部52を通じて、ピックアップユニット23とエジェクタ25との水平方向の位置の較正(キャリブレーション)が行われる。貫通部52は、例えば、移動ベース37内に設けられた開口である。貫通部52は、開口に限らず、移動ベース37の縁を切り欠いた構成であってもよい。貫通部52は、移動ベース37において内側端部(-Y方向端部)に設けられる。 The moving base 37 of the present embodiment is provided with a penetrating portion 52 penetrating in the vertical direction at a position outside the opening in the horizontal direction outside the opening 51. The horizontal position of the pickup unit 23 and the ejector 25 is calibrated through the penetrating portion 52. The penetrating portion 52 is, for example, an opening provided in the moving base 37. The penetrating portion 52 is not limited to the opening, and may have a configuration in which the edge of the moving base 37 is cut out. The penetrating portion 52 is provided at the inner end portion (-Y direction end portion) of the moving base 37.
 移動ベース37は、保持部本体35(図6)を水平面内で旋回可能に設けられる。移動ベース37には、保持部本体35を旋回させる旋回用ギア53が設けられる。図11に示すように、旋回用ギア53に接続するモータ54が回転して、旋回用ギア53が保持部本体35に設けられた従動ギア55と噛み合って回転することによって、保持部本体35が旋回する。 The moving base 37 is provided so that the holding portion main body 35 (FIG. 6) can be swiveled in a horizontal plane. The moving base 37 is provided with a turning gear 53 for turning the holding portion main body 35. As shown in FIG. 11, the motor 54 connected to the turning gear 53 rotates, and the turning gear 53 meshes with the driven gear 55 provided on the holding portion main body 35 to rotate, so that the holding portion main body 35 is rotated. Turn.
 移動ベース37には、保持部本体35(図6)を水平面内で回転可能に支持する支持ローラ57が複数(例えば四隅に)設けられる。支持ローラ57は、移動ベース37上において上方に延びて保持部本体35を回転させるローラである。図12に示すように、支持ローラ57は、保持部本体35において下方に延びて形成される旋回ガイド59を旋回可能に支持する。図5及び図12に示すように、支持ローラ57は、開口45の外周部において周方向に延びる旋回ガイド59よりも外側に設けられる。 The moving base 37 is provided with a plurality of support rollers 57 (for example, at the four corners) that rotatably support the holding portion main body 35 (FIG. 6) in a horizontal plane. The support roller 57 is a roller that extends upward on the moving base 37 to rotate the holding portion main body 35. As shown in FIG. 12, the support roller 57 rotatably supports the swivel guide 59 formed by extending downward in the holding portion main body 35. As shown in FIGS. 5 and 12, the support roller 57 is provided on the outer peripheral portion of the opening 45 outside the swivel guide 59 extending in the circumferential direction.
 貫通部52は、旋回用ギア53によって保持部本体35が旋回した状態でも貫通部52の少なくとも一部が上下方向に貫通しているように形成される。具体的には、貫通部52の外縁は、保持部本体35の外縁の回転軌跡よりも水平方向外側において形成される。これにより、保持部本体35が旋回した状態でも、ピックアップユニット23とエジェクタ25との較正を行うことができる。 The penetrating portion 52 is formed so that at least a part of the penetrating portion 52 penetrates in the vertical direction even when the holding portion main body 35 is swiveled by the swivel gear 53. Specifically, the outer edge of the penetrating portion 52 is formed on the outer side in the horizontal direction from the rotation locus of the outer edge of the holding portion main body 35. As a result, the pickup unit 23 and the ejector 25 can be calibrated even when the holding portion main body 35 is rotated.
 本実施の形態の移動ベース37には、保持ヘッドチェンジャ61が設けられる。保持ヘッドチェンジャ61は、ピックアップユニット23における後述の部品保持ヘッド77を交換するために設けられる。保持ヘッドチェンジャ61の詳細の構成については後述する。 A holding head changer 61 is provided on the moving base 37 of the present embodiment. The holding head changer 61 is provided to replace the component holding head 77 described later in the pickup unit 23. The detailed configuration of the holding head changer 61 will be described later.
<ピックアップユニット>
 図13は、ピックアップユニット23の概略構成を示す断面図である。図3又は図13に示すように、ピックアップユニット23は、ユニット移動機構(ピックアップ移動部)63によって天板19上を移動可能に設けられる。本実施の形態のピックアップユニット23は、一方向(X方向)に移動可能に設けられる。
<Pickup unit>
FIG. 13 is a cross-sectional view showing a schematic configuration of the pickup unit 23. As shown in FIG. 3 or 13, the pickup unit 23 is provided so as to be movable on the top plate 19 by a unit moving mechanism (pickup moving portion) 63. The pickup unit 23 of the present embodiment is provided so as to be movable in one direction (X direction).
 ユニット移動機構63(図1)は、例えば、モータ63aと、送りねじ63bと、ガイドレール63cとを有する。送りねじ63bは、モータ63aによる回転運動でピックアップユニット23をX方向に直線移動させる。送りねじ63bは、X方向に延びて設けられる。ガイドレール63cは、ピックアップユニット23をX方向にスライド移動可能に支持する。ガイドレール63cは、例えば、X方向に延びて天板19上に設けられてピックアップユニット23のY方向両端部を支持する。 The unit moving mechanism 63 (FIG. 1) has, for example, a motor 63a, a feed screw 63b, and a guide rail 63c. The feed screw 63b linearly moves the pickup unit 23 in the X direction by the rotary motion of the motor 63a. The feed screw 63b is provided so as to extend in the X direction. The guide rail 63c supports the pickup unit 23 so as to be slidable in the X direction. The guide rail 63c extends in the X direction and is provided on the top plate 19 to support both ends of the pickup unit 23 in the Y direction.
 天板19には、上下方向に貫通した開口部65がX方向に延びて形成される。図13に示すように、開口部65を通じて、ピックアップユニット23は、キャリア27に保持された部品(ダイ)をピックアップする。本実施の形態のピックアップユニット23の外郭を構成するカバー67の上面には、上下方向に貫通した開口部69が設けられる。開口部69を通じて、ピックアップユニット23は、ピックアップした部品を搭載ヘッド11(図3)に受け渡す。このとき、搭載ヘッド11は、例えば基板認識カメラ17(図1)によって部品を認識してピックアップユニット23から部品を受け取る。 The top plate 19 is formed with an opening 65 penetrating in the vertical direction extending in the X direction. As shown in FIG. 13, the pickup unit 23 picks up the component (die) held by the carrier 27 through the opening 65. An opening 69 penetrating in the vertical direction is provided on the upper surface of the cover 67 forming the outer shell of the pickup unit 23 of the present embodiment. Through the opening 69, the pickup unit 23 delivers the picked-up component to the mounting head 11 (FIG. 3). At this time, the mounting head 11 recognizes the component by, for example, the board recognition camera 17 (FIG. 1) and receives the component from the pickup unit 23.
 図3に示すように、ピックアップユニット23は、ピックアップ部71と、中継部73と、部品撮像部(部品検出部)75(図13)を備える。 As shown in FIG. 3, the pickup unit 23 includes a pickup unit 71, a relay unit 73, and a component imaging unit (component detection unit) 75 (FIG. 13).
<ピックアップ部>
 図13に示すように、ピックアップ部71は、キャリア27に保持された部品をピックアップする。具体的には、ピックアップ部71は、エジェクタ25によって突き上げられる部品をピックアップする。ピックアップ部71は、部品を保持する部品保持ヘッド77を有し、部品保持ヘッド77によって部品をピックアップする。具体的には、部品保持ヘッド77は、先端部(下端部)でキャリア27内の部品を吸着保持して、キャリア27から部品を離間させる。
<Pickup section>
As shown in FIG. 13, the pickup unit 71 picks up the parts held by the carrier 27. Specifically, the pickup unit 71 picks up a component pushed up by the ejector 25. The pickup unit 71 has a component holding head 77 for holding the component, and the component holding head 77 picks up the component. Specifically, the component holding head 77 attracts and holds the component in the carrier 27 at the tip end portion (lower end portion) to separate the component from the carrier 27.
 部品保持ヘッド77は、第1の移動機構79によって、ヘッドの向きを変更可能に構成される。本実施の形態では、ヘッドの向きは、部品保持ヘッド77の先端部の向きである。部品保持ヘッド77は、下向きの状態で第1の部品をピックアップした後、第1の移動機構79によって反転して上向きの状態で搭載ヘッド11(図3)に受け渡す動作を繰り返すように構成される。具体的には、下向きの部品保持ヘッド77が、第1の部品の第1の面が上向きの状態で、当該第1の部品をピックアップする。さらに、当該第1の部品をピックアップした部品保持ヘッド77を上向きに反転させて第1の部品の第2の面が上向きの状態で搭載ヘッド11に受け渡す。ここで、キャリア27に保持された部品は、第1の面が上向きの状態となっている。 The component holding head 77 is configured so that the orientation of the head can be changed by the first moving mechanism 79. In the present embodiment, the orientation of the head is the orientation of the tip end portion of the component holding head 77. The component holding head 77 is configured to repeat the operation of picking up the first component in a downward state, then reversing it by the first moving mechanism 79 and delivering it to the mounting head 11 (FIG. 3) in an upward state. To. Specifically, the downward component holding head 77 picks up the first component with the first surface of the first component facing upward. Further, the component holding head 77 that picks up the first component is inverted upward and delivered to the mounting head 11 with the second surface of the first component facing upward. Here, the first surface of the parts held by the carrier 27 is in an upward state.
 第1の部品は、部品保持ヘッド77によって第1の面が上向きの状態でキャリア27から第1の面でピックアップされて、第2の面が上向きになるように向きを変更された後、搭載ヘッド11に受け渡される。さらに、第1の部品は、搭載ヘッド11によって、第1の面が下向きの状態(第2の面が上向きの状態)で第2の面を保持されて、第1の面が下向きの状態で基板9に搭載される。すなわち、第1の部品は、フリップチップ実装の場合に供給される部品である。 The first component is picked up by the component holding head 77 from the carrier 27 on the first surface with the first surface facing upward, and is mounted after being reoriented so that the second surface faces upward. It is delivered to the head 11. Further, in the first component, the mounting head 11 holds the second surface in a state where the first surface faces downward (a state in which the second surface faces upward), and the first surface faces downward. It is mounted on the substrate 9. That is, the first component is a component supplied in the case of flip chip mounting.
 本実施の形態の第1の移動機構79は、部品保持ヘッド77を旋回させる旋回機構である。第1の移動機構79は、モータ80によって回動する第1の回動軸81と、第1の回動軸81の回動に伴って旋回する旋回部材83とを有する。第1の回動軸81は、部品保持ヘッド77を上下方向に回動させる。旋回部材83は、例えば、上下方向に延びる板状部材である。 The first moving mechanism 79 of the present embodiment is a swivel mechanism that swivels the component holding head 77. The first moving mechanism 79 includes a first rotating shaft 81 that is rotated by a motor 80, and a swivel member 83 that rotates with the rotation of the first rotating shaft 81. The first rotation shaft 81 rotates the component holding head 77 in the vertical direction. The swivel member 83 is, for example, a plate-shaped member extending in the vertical direction.
 部品保持ヘッド77は、旋回部材83において、例えば第1の回動軸81の中心軸よりも外端部(径方向外側の端部)に設けられる。本実施の形態のピックアップ部71は、複数の部品保持ヘッド77を有する。複数の部品保持ヘッド77のうちの少なくとも1組の部品保持ヘッド77は、ヘッドの向きが互いに反対方向を向くように構成される。例えば、ピックアップ部71は、2個の部品保持ヘッド77を有し、一方の部品保持ヘッド77と他方の部品保持ヘッド77とは互いに反対方向を向いている。具体的には、一方の部品保持ヘッド77の先端部は、他方の部品保持ヘッド77の先端部に対して180°反対方向を向いている。一方の部品保持ヘッド77が下向きで第1の部品をピックアップするとともに、他方の部品保持ヘッド77が上向きで部品を搭載ヘッド11に受け渡す。 The component holding head 77 is provided in the swivel member 83, for example, at an outer end portion (diameter outer end portion) of the first rotating shaft 81 with respect to the central axis. The pickup unit 71 of the present embodiment has a plurality of component holding heads 77. At least one set of component holding heads 77 among the plurality of component holding heads 77 is configured so that the heads are oriented in opposite directions to each other. For example, the pickup unit 71 has two component holding heads 77, and one component holding head 77 and the other component holding head 77 face each other in opposite directions. Specifically, the tip of one component holding head 77 faces 180 ° in the opposite direction to the tip of the other component holding head 77. One component holding head 77 faces downward to pick up the first component, and the other component holding head 77 faces upward to deliver the component to the mounting head 11.
 本実施の形態の部品保持ヘッド77は、ヘッド保持部85に対して着脱可能に設けられる。これにより、部品保持ヘッド77は、例えば搭載する部品の種類に応じて交換される。部品保持ヘッド77は、ヘッド保持部85を介して旋回部材83に接続されて旋回部材83と共に旋回する。 The component holding head 77 of the present embodiment is detachably provided with respect to the head holding portion 85. As a result, the component holding head 77 is replaced according to, for example, the type of component to be mounted. The component holding head 77 is connected to the swivel member 83 via the head holding portion 85 and swivels together with the swivel member 83.
 また、本実施の形態の部品保持ヘッド77は、第1の回動軸81の中心から遠ざかる径方向に部品保持ヘッド77を移動させる保持ヘッド駆動機構87を有する。保持ヘッド駆動機構87の具体的な構成については後述する。 Further, the component holding head 77 of the present embodiment has a holding head drive mechanism 87 that moves the component holding head 77 in the radial direction away from the center of the first rotation shaft 81. The specific configuration of the holding head drive mechanism 87 will be described later.
<中継部>
 図14~図16は、ピックアップ部71及び中継部73の概略構成を示す側面図である。図14~図16に示す中継部73は、ピックアップ部71(部品保持ヘッド77)によって第1の面が上向きの状態でピックアップされた第2の部品を部品保持ヘッド77から受け取って第1の面が上向きの状態で搭載ヘッド11に受け渡す。中継部73は、部品を保持する中継用部品保持ヘッド89を有し、中継用部品保持ヘッド89によって第2の部品を受け取って搭載ヘッド11に受け渡す。
<Relay section>
14 to 16 are side views showing a schematic configuration of the pickup unit 71 and the relay unit 73. The relay unit 73 shown in FIGS. 14 to 16 receives the second component picked up by the pickup unit 71 (component holding head 77) with the first surface facing upward from the component holding head 77, and receives the first surface from the component holding head 77. Is handed over to the mounting head 11 in a state of facing upward. The relay unit 73 has a relay component holding head 89 for holding the component, and the relay component holding head 89 receives the second component and delivers it to the mounting head 11.
 第2の部品は、部品保持ヘッド77によって第1の面が上向きの状態でキャリア27からピックアップされて、第1の面の向きが変更された状態(本実施の形態では、第1の面が斜め下向きの状態)で中継部73に受け渡される。第2の部品は、中継部73によって第2の面を保持されて、第1の面が上向きになるように向きを変更された後、搭載ヘッド11に受け渡される。さらに、第2の部品は、搭載ヘッド11によって、第1の面が上向きの状態(第2の面が下向きの状態)で第1の面を保持されて、第1の面が上向きの状態で基板9に搭載される。すなわち、第2の部品は、ダイアタッチ実装の場合に供給される部品である。 The second component is picked up from the carrier 27 by the component holding head 77 with the first surface facing upward, and the orientation of the first surface is changed (in the present embodiment, the first surface is It is delivered to the relay unit 73 in a diagonally downward state). The second component is held by the relay unit 73, is reoriented so that the first surface faces upward, and then is delivered to the mounting head 11. Further, in the second component, the mounting head 11 holds the first surface in a state where the first surface faces upward (a state in which the second surface faces downward), and the first surface faces upward. It is mounted on the substrate 9. That is, the second component is a component supplied in the case of die attach mounting.
 中継部73は、第2の移動機構91によって、ヘッドの向きを変更可能に構成される。具体的には、中継部73は、部品保持ヘッド77が下向きの状態から反転して上向きの状態になる途中において第2の部品を受け取る。本実施の形態の中継部73は、部品保持ヘッド77が斜め上向きの状態で第2の部品を受け取る(図16)。 The relay unit 73 is configured so that the direction of the head can be changed by the second moving mechanism 91. Specifically, the relay unit 73 receives the second component while the component holding head 77 is inverted from the downward state to the upward state. The relay unit 73 of the present embodiment receives the second component in a state where the component holding head 77 is obliquely upward (FIG. 16).
 本実施の形態の第2の移動機構91は、中継用部品保持ヘッド89を旋回させる旋回機構である。第2の移動機構91は、モータ92(図18)によって回動する第2の回動軸93と、第2の回動軸93の回動に伴って旋回する旋回部材95とを有する。第2の回動軸93は、中継部73を上下方向に回動させる。旋回部材95は、例えば、円盤状に形成される。 The second moving mechanism 91 of the present embodiment is a swivel mechanism that swivels the relay component holding head 89. The second moving mechanism 91 has a second rotating shaft 93 that is rotated by the motor 92 (FIG. 18), and a swivel member 95 that rotates with the rotation of the second rotating shaft 93. The second rotation shaft 93 rotates the relay portion 73 in the vertical direction. The swivel member 95 is formed in a disk shape, for example.
 本実施の形態では、第2の回動軸93の中心O2は、第1の回動軸81の中心O1よりも上方に配置される。また、図15に示すように、第2の回動軸93を中心とする中継部73の回動半径R2は、第1の回動軸81を中心とする部品保持ヘッド77の回動半径R1よりも小さい。中継部73の回動半径R2は、一定となるように構成される。すなわち、中継用部品保持ヘッド89と第2の回動軸93の中心O2との距離は一定となるように構成される。本実施の形態では、中継部73は、ピックアップ部71における保持ヘッド駆動機構87に相当する機構を有しない。すなわち、中継用部品保持ヘッド89は、第2の回動軸93の中心O2から遠ざかる径方向に移動しない。 In the present embodiment, the center O2 of the second rotation shaft 93 is arranged above the center O1 of the first rotation shaft 81. Further, as shown in FIG. 15, the turning radius R2 of the relay portion 73 centered on the second rotating shaft 93 is the turning radius R1 of the component holding head 77 centered on the first rotating shaft 81. Smaller than The turning radius R2 of the relay unit 73 is configured to be constant. That is, the distance between the relay component holding head 89 and the center O2 of the second rotating shaft 93 is configured to be constant. In the present embodiment, the relay unit 73 does not have a mechanism corresponding to the holding head drive mechanism 87 in the pickup unit 71. That is, the relay component holding head 89 does not move in the radial direction away from the center O2 of the second rotation shaft 93.
 本実施の形態では、ピックアップ部71が搭載ヘッド11へ第1の部品を受け渡す第1の受け渡し位置TP1、及び中継部73が搭載ヘッド11へ第2の部品を受け渡す第2の受け渡し位置TP2は、搭載ヘッド11の上下方向の可動範囲内の高さに位置する。また、受け渡し位置TP1,TP2は、基板認識カメラ17(図1)の焦点距離の範囲内に配置される。受け渡し位置TP1,TP2の高さは、例えば、同じ高さ(略同じ)であってもよい。第1の受け渡し位置TP1及び第2の受け渡し位置TP2は、互いに水平方向に離間する。 In the present embodiment, the first delivery position TP1 in which the pickup unit 71 delivers the first component to the mounting head 11, and the second delivery position TP2 in which the relay unit 73 delivers the second component to the mounting head 11. Is located at a height within the movable range of the mounting head 11 in the vertical direction. Further, the delivery positions TP1 and TP2 are arranged within the focal length of the substrate recognition camera 17 (FIG. 1). The heights of the delivery positions TP1 and TP2 may be, for example, the same height (substantially the same). The first delivery position TP1 and the second delivery position TP2 are separated from each other in the horizontal direction.
<部品撮像部>
 図13に示すように、部品撮像部75は、キャリア27に保持される部品を撮像する。本実施の形態の部品撮像部75は、ユニット移動機構63によってピックアップユニット23とともに移動可能に構成される。部品撮像部75は、水平方向に延びる撮像部本体97に対して、上下方向に延びる鏡筒99が接続される。鏡筒99は、下向き状態の部品保持ヘッド77の上方に配置される。鏡筒99内には、照明部101、ハーフミラー103、及びレンズ(対物レンズ)105が設けられる。照明部101によって照らされる光はハーフミラー103を通過して下方の部品を照らす。ハーフミラー103は、上方からの照明部101による光を透過し、下方からの光を撮像部本体97に向けて反射するように構成される。
<Parts imaging unit>
As shown in FIG. 13, the component imaging unit 75 images the components held by the carrier 27. The component imaging unit 75 of the present embodiment is configured to be movable together with the pickup unit 23 by the unit moving mechanism 63. In the component imaging unit 75, a lens barrel 99 extending in the vertical direction is connected to the imaging unit main body 97 extending in the horizontal direction. The lens barrel 99 is arranged above the component holding head 77 in the downward state. An illumination unit 101, a half mirror 103, and a lens (objective lens) 105 are provided in the lens barrel 99. The light illuminated by the illumination unit 101 passes through the half mirror 103 and illuminates the lower component. The half mirror 103 is configured to transmit the light from the illumination unit 101 from above and reflect the light from below toward the image pickup unit main body 97.
<保持ヘッド駆動機構>
 図17は、ピックアップユニット23の平面図である。図18は、図17のカバー67を取り外した状態のピックアップユニット23の平面図である。図19は、保持ヘッド駆動機構87の概略構成を示す図である。
<Holding head drive mechanism>
FIG. 17 is a plan view of the pickup unit 23. FIG. 18 is a plan view of the pickup unit 23 with the cover 67 of FIG. 17 removed. FIG. 19 is a diagram showing a schematic configuration of the holding head drive mechanism 87.
 図18に示すように、ピックアップユニット23は、カバー67(図17)内に保持ヘッド駆動機構87を有する。本実施の形態の保持ヘッド駆動機構87は、カム機構である。図18及び図19に示すように、保持ヘッド駆動機構87は、カム駆動モータ107と、第1のカム109と、第2のカム111とを有する。 As shown in FIG. 18, the pickup unit 23 has a holding head drive mechanism 87 in the cover 67 (FIG. 17). The holding head drive mechanism 87 of the present embodiment is a cam mechanism. As shown in FIGS. 18 and 19, the holding head drive mechanism 87 includes a cam drive motor 107, a first cam 109, and a second cam 111.
 カム駆動モータ107は、第1のカム109及び第2のカム111を回転させる。第1のカム109の回転によって、第1のレバー113が第1の支持軸115を中心に回転する。第2のカム111の回転によって、第2のレバー117が第2の支持軸119を中心に回転する。第1のレバー113の回転によって、第1の移動部材121が径方向に移動する。これにより、第1の移動部材121に接続される第1の移動片123が、第1の移動部材121とともに径方向に移動する。第2のレバー117の回転によって、第2の移動部材125は、径方向に移動する。これにより、第2の移動部材125に接続される第2の移動片127が、第2の移動部材125とともに径方向に移動する。 The cam drive motor 107 rotates the first cam 109 and the second cam 111. The rotation of the first cam 109 causes the first lever 113 to rotate about the first support shaft 115. The rotation of the second cam 111 causes the second lever 117 to rotate about the second support shaft 119. The rotation of the first lever 113 causes the first moving member 121 to move in the radial direction. As a result, the first moving piece 123 connected to the first moving member 121 moves in the radial direction together with the first moving member 121. The rotation of the second lever 117 causes the second moving member 125 to move in the radial direction. As a result, the second moving piece 127 connected to the second moving member 125 moves in the radial direction together with the second moving member 125.
 図15に示すように、本実施の形態の第1の移動片123は、部品保持ヘッド77が下向きの状態になったときに部品保持ヘッド77と接続される位置に配置される。これにより、下向きの部品保持ヘッド77は、第1の移動片123と共に上下方向に移動可能に設けられる。 As shown in FIG. 15, the first moving piece 123 of the present embodiment is arranged at a position where it is connected to the component holding head 77 when the component holding head 77 is in a downward state. As a result, the downward component holding head 77 is provided so as to be movable in the vertical direction together with the first moving piece 123.
 図16に示すように、本実施の形態の第2の移動片127は、部品保持ヘッド77が斜め上向きの状態になったときに部品保持ヘッド77と接続される位置に配置される。これにより、斜め上向きの部品保持ヘッド77は、第2の移動片127と共に、上下方向に対して傾斜した斜め方向に移動可能に設けられる。 As shown in FIG. 16, the second moving piece 127 of the present embodiment is arranged at a position where the component holding head 77 is connected to the component holding head 77 when the component holding head 77 is in an obliquely upward state. As a result, the diagonally upward component holding head 77 is provided together with the second moving piece 127 so as to be movable in the oblique direction inclined with respect to the vertical direction.
 図20は、下向きの部品保持ヘッド77が第1の移動片123に接続された状態のピックアップ部71の概略構成を示す側面図である。図20に示すように、ヘッド保持部85には、部品保持ヘッド77の径方向の移動をガイドするガイド部材129が設けられる。ガイド部材129には、第1の移動片123及び第2の移動片127に対して径方向に係合するカムフォロア131が設けられる。カムフォロア131は、旋回部材83の旋回時において、円筒カム132に沿って移動する。 FIG. 20 is a side view showing a schematic configuration of the pickup unit 71 in a state where the downward component holding head 77 is connected to the first moving piece 123. As shown in FIG. 20, the head holding portion 85 is provided with a guide member 129 that guides the radial movement of the component holding head 77. The guide member 129 is provided with a cam follower 131 that radially engages with the first moving piece 123 and the second moving piece 127. The cam follower 131 moves along the cylindrical cam 132 when the swivel member 83 is swiveled.
 本実施の形態のガイド部材129は、例えばばね等の弾性部材133によって、部品保持ヘッド77を径方向内側に付勢するように設けられる。部品のピックアップ時、及び中継用部品保持ヘッド89への部品の受け渡し時以外のときは、部品保持ヘッド77の回動半径はR1で一定となっている。 The guide member 129 of the present embodiment is provided so as to urge the component holding head 77 inward in the radial direction by, for example, an elastic member 133 such as a spring. The turning radius of the component holding head 77 is constant at R1 except when the component is picked up and when the component is delivered to the relay component holding head 89.
 部品保持ヘッド77が下向きの状態になったとき、カムフォロア131は第1の移動片123と接続して、第1の移動片123と共に部品保持ヘッド77を上下方向に移動させる。部品保持ヘッド77が斜め上向きの状態になったとき(図16)、カムフォロア131は第2の移動片127と接続して、第2の移動片127と共に部品保持ヘッド77を径方向に移動させる。 When the component holding head 77 is in the downward state, the cam follower 131 is connected to the first moving piece 123 and moves the component holding head 77 in the vertical direction together with the first moving piece 123. When the component holding head 77 is in an obliquely upward state (FIG. 16), the cam follower 131 is connected to the second moving piece 127 to move the component holding head 77 in the radial direction together with the second moving piece 127.
<保持ヘッドチェンジャ>
 図21は、保持ヘッドチェンジャ61の概略構成を示す側面図である。図22及び図23は、保持ヘッドチェンジャ61の概略構成を示す平面図である。図21~図23に示すように、保持ヘッドチェンジャ61は、部品保持ヘッド77を収納する収納部135と、ストッパ137とを備える。
<Holding head changer>
FIG. 21 is a side view showing a schematic configuration of the holding head changer 61. 22 and 23 are plan views showing a schematic configuration of the holding head changer 61. As shown in FIGS. 21 to 23, the holding head changer 61 includes a storage portion 135 for storing the component holding head 77 and a stopper 137.
 収納部135には、例えば、複数の種類の部品保持ヘッド77が収納される。本実施の形態の収納部135は、長手方向(X方向)を有し、長手方向に沿って部品保持ヘッド77を収納する。また、収納部135は、上方に開口した開口部141を有する。開口部141を通じて、部品保持ヘッド77が収納される。 For example, a plurality of types of component holding heads 77 are stored in the storage unit 135. The storage unit 135 of the present embodiment has a longitudinal direction (X direction), and stores the component holding head 77 along the longitudinal direction. Further, the storage portion 135 has an opening 141 that opens upward. The component holding head 77 is housed through the opening 141.
 ストッパ137は、収納部135の開口部141の一部を覆う。ストッパ137は、上下方向に貫通した開口部143を有する。平面視において、開口部143は、部品保持ヘッド77よりも大きい拡径部143aと、部品保持ヘッド77よりも小さい小径部143bとを有する。本実施の形態では、長手方向に沿って、拡径部143a及び小径部143bが交互に並んで形成される。 The stopper 137 covers a part of the opening 141 of the storage portion 135. The stopper 137 has an opening 143 that penetrates in the vertical direction. In a plan view, the opening 143 has an enlarged diameter portion 143a larger than the component holding head 77 and a smaller diameter portion 143b smaller than the component holding head 77. In the present embodiment, the enlarged diameter portion 143a and the small diameter portion 143b are alternately formed along the longitudinal direction.
 ストッパ137は、ストッパ駆動部139の駆動によって、収納部135に収納された部品保持ヘッド77の上方に拡径部143a又は小径部143bが位置するように移動する。ストッパ137が移動することで、収納部135に収納された部品保持ヘッド77の上方に小径部143bが位置する状態において、ストッパ137は、部品保持ヘッド77の係合部78aと上下方向に係合する。 The stopper 137 is driven by the stopper drive unit 139 so that the enlarged diameter portion 143a or the small diameter portion 143b is positioned above the component holding head 77 housed in the storage portion 135. By moving the stopper 137, the stopper 137 engages with the engaging portion 78a of the component holding head 77 in the vertical direction in a state where the small diameter portion 143b is located above the component holding head 77 housed in the housing portion 135. To do.
 本実施の形態の保持ヘッドチェンジャ61は、収納部135を上下方向に移動させる昇降部145を有する。部品保持ヘッド77の交換を行う際、収納部135は、昇降部145によってヘッド保持部85(図24B)に近づけられる。 The holding head changer 61 of the present embodiment has an elevating portion 145 that moves the accommodating portion 135 in the vertical direction. When replacing the component holding head 77, the accommodating portion 135 is brought closer to the head holding portion 85 (FIG. 24B) by the elevating portion 145.
 図24Aは、ヘッド保持部85に部品保持ヘッド77を取り付ける前の状態を示す概略図である。図24Bは、ヘッド保持部85に部品保持ヘッド77を取り付けた状態を示す概略図である。 FIG. 24A is a schematic view showing a state before attaching the component holding head 77 to the head holding portion 85. FIG. 24B is a schematic view showing a state in which the component holding head 77 is attached to the head holding portion 85.
 図24Aに示すように、ヘッド保持部85に部品保持ヘッド77を取り付ける前の状態において、収納部135は、ウエハW1を保持するキャリア27の高さよりも下方に配置されている。本実施の形態では、収納部135に収納された部品保持ヘッド77の上端部が、キャリア27の高さよりも下方に配置されている。 As shown in FIG. 24A, in the state before the component holding head 77 is attached to the head holding portion 85, the storage portion 135 is arranged below the height of the carrier 27 that holds the wafer W1. In the present embodiment, the upper end portion of the component holding head 77 housed in the storage portion 135 is arranged below the height of the carrier 27.
 部品保持ヘッド77の取り外し又は取り付けが行われるとき、図24Bに示すように、昇降部145によって、収納部135は上方に移動する。このとき、保持ヘッド駆動機構87によって、ヘッド保持部85は下方に移動する。本実施の形態では、ヘッド保持部85の上下方向の移動量は、収納部135の上下方向の移動量よりも少ない。昇降部145によって収納部135を上方に移動させることによって、ヘッド保持部85の上下方向の移動量を減らすことができる。これにより、保持ヘッド駆動機構87の駆動構成をより簡易にすることができる。 When the component holding head 77 is removed or attached, the accommodating portion 135 is moved upward by the elevating portion 145 as shown in FIG. 24B. At this time, the head holding portion 85 is moved downward by the holding head driving mechanism 87. In the present embodiment, the amount of vertical movement of the head holding portion 85 is smaller than the amount of vertical movement of the storage portion 135. By moving the storage portion 135 upward by the elevating portion 145, the amount of movement of the head holding portion 85 in the vertical direction can be reduced. As a result, the drive configuration of the holding head drive mechanism 87 can be simplified.
 図24Bの状態において、ヘッド保持部85の爪部85aは、部品保持ヘッド77の凹部78bと上下方向に係合している。爪部85aは、例えば弾性部材85bによって内側に付勢されている。これにより、ヘッド保持部85は、部品保持ヘッド77を保持する。爪部85aは、ヘッド保持部85において部品保持ヘッド77を保持する側に突き出して形成される。凹部78bは、部品保持ヘッド77の係合部78aよりも上方において内側にくぼんで形成される。 In the state of FIG. 24B, the claw portion 85a of the head holding portion 85 is vertically engaged with the recess 78b of the component holding head 77. The claw portion 85a is urged inward by, for example, an elastic member 85b. As a result, the head holding portion 85 holds the component holding head 77. The claw portion 85a is formed so as to project from the head holding portion 85 toward the side that holds the component holding head 77. The recess 78b is formed by being recessed inward above the engaging portion 78a of the component holding head 77.
 図25A~図25Dを用いて、部品保持ヘッド77をヘッド保持部85から取り外す場合の動作について説明する。図25A~図25Dは、部品保持ヘッド77をヘッド保持部85から取り外す動作を示す保持ヘッドチェンジャ61の断面図である。 The operation when the component holding head 77 is removed from the head holding portion 85 will be described with reference to FIGS. 25A to 25D. 25A to 25D are cross-sectional views of a holding head changer 61 showing an operation of removing the component holding head 77 from the head holding portion 85.
 図25Aに示すように、部品保持ヘッド77が、保持ヘッドチェンジャ61の開口部141の上方に位置するように移動する。 As shown in FIG. 25A, the component holding head 77 moves so as to be located above the opening 141 of the holding head changer 61.
 本実施の形態では、部品保持ヘッド77に対する開口部141の相対位置におけるY方向の位置調整は、保持ヘッドチェンジャ61を保持するキャリア保持部21の保持部移動機構33(図2)によって行われる。また、部品保持ヘッド77に対する開口部141の相対位置におけるX方向の位置調整は、ピックアップユニット23を移動させるユニット移動機構63によって行われる。 In the present embodiment, the position adjustment in the Y direction at the relative position of the opening 141 with respect to the component holding head 77 is performed by the holding portion moving mechanism 33 (FIG. 2) of the carrier holding portion 21 that holds the holding head changer 61. Further, the position adjustment in the X direction at the relative position of the opening 141 with respect to the component holding head 77 is performed by the unit moving mechanism 63 that moves the pickup unit 23.
 図25Aに示す状態から部品保持ヘッド77が下方に移動し収納部135が上方に移動して図25Bに示す状態となる。図25Bに示すように、保持ヘッドチェンジャ61の第1の開口部141a(図25A)に、部品保持ヘッド77の先端部が挿入される。また、保持ヘッドチェンジャ61の第2の開口部141b(図25A)において、部品保持ヘッド77の係合部78aが配置される。 From the state shown in FIG. 25A, the component holding head 77 moves downward and the storage unit 135 moves upward to reach the state shown in FIG. 25B. As shown in FIG. 25B, the tip of the component holding head 77 is inserted into the first opening 141a (FIG. 25A) of the holding head changer 61. Further, in the second opening 141b (FIG. 25A) of the holding head changer 61, the engaging portion 78a of the component holding head 77 is arranged.
 ストッパ137が図23の状態から図22の状態になるようにストッパ駆動部139を駆動する。すなわち、係合部78aの外縁よりも外側に拡径部143aが位置する状態から、係合部78aの外縁よりも内側に小径部143bが位置する状態になるように、ストッパ137を移動させる。これにより、図25Cに示すように、係合部78aは、小径部143bと上下方向に係合可能となる。 The stopper drive unit 139 is driven so that the stopper 137 changes from the state shown in FIG. 23 to the state shown in FIG. 22. That is, the stopper 137 is moved so that the enlarged diameter portion 143a is located outside the outer edge of the engaging portion 78a and the small diameter portion 143b is located inside the outer edge of the engaging portion 78a. As a result, as shown in FIG. 25C, the engaging portion 78a can be engaged with the small diameter portion 143b in the vertical direction.
 図25Cの状態から、ヘッド保持部85を上方に移動させると共に収納部135を下方に移動させる。このとき、係合部78aが小径部143bと上下方向に係合していることで、部品保持ヘッド77は、図25Dに示すようにヘッド保持部85から取り外される。これにより、部品保持ヘッド77をヘッド保持部85から取り外す動作が完了する。 From the state shown in FIG. 25C, the head holding portion 85 is moved upward and the storage portion 135 is moved downward. At this time, since the engaging portion 78a is vertically engaged with the small diameter portion 143b, the component holding head 77 is removed from the head holding portion 85 as shown in FIG. 25D. This completes the operation of removing the component holding head 77 from the head holding portion 85.
 図26A~図26Dを用いて、部品保持ヘッド77をヘッド保持部85に取り付ける動作について説明する。図26A~図26Dは、部品保持ヘッド77をヘッド保持部85に取り付ける動作を示す保持ヘッドチェンジャ61の断面図である。 The operation of attaching the component holding head 77 to the head holding portion 85 will be described with reference to FIGS. 26A to 26D. 26A to 26D are cross-sectional views of a holding head changer 61 showing an operation of attaching the component holding head 77 to the head holding portion 85.
 図26Aに示すように、ヘッド保持部85が、部品保持ヘッド77の上方に位置するように移動する。 As shown in FIG. 26A, the head holding portion 85 moves so as to be located above the component holding head 77.
 図26Aに示す状態からヘッド保持部85が下方に移動し収納部135が上方に移動して図26Bに示す状態となる。図26Bに示すように、爪部85aが凹部78bと上下方向に係合して、ヘッド保持部85に部品保持ヘッド77が保持される。 From the state shown in FIG. 26A, the head holding portion 85 moves downward and the storage portion 135 moves upward to reach the state shown in FIG. 26B. As shown in FIG. 26B, the claw portion 85a engages with the recess 78b in the vertical direction, and the component holding head 77 is held by the head holding portion 85.
 ストッパ137が図22の状態から図23の状態になるようにストッパ駆動部139を駆動する。すなわち、係合部78aの外縁よりも内側に小径部143bが位置する状態から、係合部78aの外縁よりも外側に拡径部143aが位置する状態になるように、ストッパ137を移動させる。これにより、図26Cに示すように、係合部78aは、小径部143bと上下方向に非係合状態となる。 The stopper drive unit 139 is driven so that the stopper 137 changes from the state shown in FIG. 22 to the state shown in FIG. 23. That is, the stopper 137 is moved so that the small diameter portion 143b is located inside the outer edge of the engaging portion 78a and the enlarged diameter portion 143a is located outside the outer edge of the engaging portion 78a. As a result, as shown in FIG. 26C, the engaging portion 78a is not engaged with the small diameter portion 143b in the vertical direction.
 図26Cの状態から、ヘッド保持部85を上方に移動させると共に収納部135を下方に移動させる。これにより、部品保持ヘッド77をヘッド保持部85に取り付ける動作が完了する。 From the state shown in FIG. 26C, the head holding portion 85 is moved upward and the storage portion 135 is moved downward. As a result, the operation of attaching the component holding head 77 to the head holding portion 85 is completed.
<エジェクタ>
 図27及び図28は、本実施の形態のエジェクタ25の概略構成を示す平面図である。図27及び図28に示すように、本実施の形態では、エジェクタ25は、第1のエジェクタ(第1の突き上げ部)25a及び第2のエジェクタ(第2の突き上げ部)25bを有する。第1のエジェクタ25a及び第2のエジェクタ25bは、例えばキャリア27に担持される部品の種類等に応じて選択的に用いられる。本実施の形態の第1のエジェクタ25a及び第2のエジェクタ25bは、選択部155によってY方向に移動可能に構成される。
<Ejector>
27 and 28 are plan views showing a schematic configuration of the ejector 25 of the present embodiment. As shown in FIGS. 27 and 28, in the present embodiment, the ejector 25 has a first ejector (first push-up portion) 25a and a second ejector (second push-up portion) 25b. The first ejector 25a and the second ejector 25b are selectively used depending on, for example, the type of parts supported on the carrier 27. The first ejector 25a and the second ejector 25b of the present embodiment are configured to be movable in the Y direction by the selection unit 155.
 エジェクタ25は、上下方向に延びて形成され、昇降部156によって上下移動可能に構成される。本実施の形態では、第1のエジェクタ25aは昇降部156aによって上下移動し、第2のエジェクタ25bは昇降部156bによって上下移動する。 The ejector 25 is formed so as to extend in the vertical direction, and is configured to be movable up and down by the elevating portion 156. In the present embodiment, the first ejector 25a moves up and down by the elevating part 156a, and the second ejector 25b moves up and down by the elevating part 156b.
 第1のエジェクタ25a及び第2のエジェクタ25bは、共に、ベース部材157に設けられる。本実施の形態では、ベース部材157は、エジェクタ移動機構(移動部)159によってX方向に移動可能に構成される。エジェクタ移動機構159は、一方向(X方向)にベース部材157を移動させる。エジェクタ移動機構159は、例えば、モータ159aと、送りねじ159bと、ガイドレール159cとを有する。送りねじ159bは、モータ159aによる回転運動でベース部材157をX方向に直線移動させる。送りねじ159bは、X方向に延びて設けられる。ガイドレール159cは、ベース部材157をX方向にスライド移動可能に支持する。ガイドレール159cは、例えば、X方向に延びて設けられてベース部材157のY方向両端部を支持する。 Both the first ejector 25a and the second ejector 25b are provided on the base member 157. In the present embodiment, the base member 157 is configured to be movable in the X direction by the ejector moving mechanism (moving portion) 159. The ejector moving mechanism 159 moves the base member 157 in one direction (X direction). The ejector moving mechanism 159 includes, for example, a motor 159a, a feed screw 159b, and a guide rail 159c. The feed screw 159b linearly moves the base member 157 in the X direction by the rotary motion of the motor 159a. The feed screw 159b is provided so as to extend in the X direction. The guide rail 159c supports the base member 157 so as to be slidable in the X direction. The guide rail 159c is provided, for example, extending in the X direction to support both ends of the base member 157 in the Y direction.
 次に、部品搭載装置1の動作について説明する。図29は、部品搭載装置1の制御部C1の概略ブロック図である。 Next, the operation of the component mounting device 1 will be described. FIG. 29 is a schematic block diagram of the control unit C1 of the component mounting device 1.
 図29に示すように、制御部C1は、ピックアップユニット23を制御するピックアップ制御部C2と、搭載ヘッド11を制御する搭載ヘッド制御部C3と、算出部C4と、部品実装に関する情報を記憶する記憶部M1とを有する。算出部C4は、ピックアップユニット23及び搭載ヘッド11の位置を算出する。本実施の形態の記憶部M1には、部品撮像部75及び基板認識カメラ17によって撮像される情報がさらに記憶される。 As shown in FIG. 29, the control unit C1 stores the pickup control unit C2 that controls the pickup unit 23, the mounting head control unit C3 that controls the mounting head 11, the calculation unit C4, and information related to component mounting. It has a part M1 and. The calculation unit C4 calculates the positions of the pickup unit 23 and the mounting head 11. The storage unit M1 of the present embodiment further stores information captured by the component image pickup unit 75 and the substrate recognition camera 17.
 制御部C1は、メモリに記憶されたプログラムをプロセッサ(処理回路)が実行することにより、記憶部M1の実装情報に基づいて予め定められた手順にて部品実装を行ってもよい。なお、サーバなどに実装情報が格納され、通信により制御部C1に実装情報が提供されるような場合であってもよい。 The control unit C1 may mount the components according to a predetermined procedure based on the mounting information of the storage unit M1 by executing the program stored in the memory by the processor (processing circuit). It should be noted that the implementation information may be stored in a server or the like, and the implementation information may be provided to the control unit C1 by communication.
 制御部C1は、基板搬送部8(図1)を駆動してX方向(基板搬送方向)に基板9を搬送し、基板9を所定の位置に配置する(基板搬送ステップ)。 The control unit C1 drives the board transfer unit 8 (FIG. 1) to transfer the board 9 in the X direction (board transfer direction), and arranges the board 9 at a predetermined position (board transfer step).
 部品供給装置2によって部品が供給され、当該部品が搭載ヘッド11によって基板9に搭載(実装)される。以下、第1の部品供給装置3による部品の供給動作について具体的に説明する。なお、第2の部品供給装置5による部品供給動作については、従来の部品供給動作と同様であるため、ここでは説明を省略する。 Parts are supplied by the parts supply device 2, and the parts are mounted (mounted) on the board 9 by the mounting head 11. Hereinafter, the component supply operation by the first component supply device 3 will be specifically described. Since the parts supply operation by the second parts supply device 5 is the same as the conventional parts supply operation, the description thereof is omitted here.
 制御部C1は、第1の部品供給装置3のキャリア搬送部31(図2)を駆動して、マガジン29に収納されたキャリア27をキャリア保持部21まで搬送する(キャリア搬送ステップ)。キャリア保持部21まで搬送されたとき、キャリア27は、押さえ部材39と支持ベース41との間の空間に挿入される。 The control unit C1 drives the carrier transport unit 31 (FIG. 2) of the first parts supply device 3 to transport the carrier 27 stored in the magazine 29 to the carrier holding unit 21 (carrier transfer step). When transported to the carrier holding portion 21, the carrier 27 is inserted into the space between the pressing member 39 and the support base 41.
 キャリア27がキャリア保持部21まで搬送された後、押さえ部材39(図8)によってエキスパンドされて、キャリア27はキャリア保持部21によって保持される(キャリア保持ステップ)。具体的には、制御部C1が、駆動部47を駆動して押さえ部材39を下方に移動させることでキャリア27をエキスパンドする。これにより、キャリア27がキャリア保持部21によって保持された状態となる。 After the carrier 27 is conveyed to the carrier holding portion 21, it is expanded by the pressing member 39 (FIG. 8), and the carrier 27 is held by the carrier holding portion 21 (carrier holding step). Specifically, the control unit C1 expands the carrier 27 by driving the drive unit 47 and moving the pressing member 39 downward. As a result, the carrier 27 is held by the carrier holding unit 21.
 ピックアップ制御部C2は、ピックアップユニット23を駆動して、キャリア27に担持された部品をキャリア27の上方からピックアップする(ピックアップステップ)。このとき、制御部C1は、エジェクタ25を駆動して、キャリア27に担持された部品をキャリア27の下方からピックアップユニット23に向けて突き上げる(突き上げステップ)。ピックアップステップ及び突き上げステップよりも前の段階で、ピックアップユニット23の位置及びエジェクタ25の位置の較正動作が行われる。当該較正動作により、ピックアップユニット23の水平方向の位置及びエジェクタ25の水平方向の位置を一致させることができ、ピックアップ動作をより精確に行うことができる。 The pickup control unit C2 drives the pickup unit 23 to pick up the parts supported on the carrier 27 from above the carrier 27 (pickup step). At this time, the control unit C1 drives the ejector 25 to push up the component supported on the carrier 27 from below the carrier 27 toward the pickup unit 23 (push-up step). A calibration operation for the position of the pickup unit 23 and the position of the ejector 25 is performed before the pickup step and the push-up step. By the calibration operation, the horizontal position of the pickup unit 23 and the horizontal position of the ejector 25 can be matched, and the pickup operation can be performed more accurately.
 ピックアップユニット23によってピックアップされた部品は、搭載ヘッド11に受け渡される(受渡ステップ)。受渡ステップよりも前の段階で、搭載ヘッド11の位置及びピックアップユニット23の位置の較正動作が行われる。当該較正動作により、搭載ヘッド11の水平方向の位置及びピックアップユニット23の水平方向の位置をより精確に把握することができるため、部品の受渡動作をより精確に行うことができる。本実施の形態では、ピックアップユニット23の部品撮像部75がエジェクタ25を撮像することによって位置の較正動作が行われる。 The parts picked up by the pickup unit 23 are delivered to the mounting head 11 (delivery step). A calibration operation is performed for the position of the mounting head 11 and the position of the pickup unit 23 at a stage prior to the delivery step. By the calibration operation, the horizontal position of the mounting head 11 and the horizontal position of the pickup unit 23 can be grasped more accurately, so that the parts delivery operation can be performed more accurately. In the present embodiment, the component imaging unit 75 of the pickup unit 23 images the ejector 25 to perform the position calibration operation.
 搭載ヘッド制御部C3は、搭載ヘッド11(ヘッド移動機構13)を駆動して、ピックアップユニット23から部品を受け取った搭載ヘッド11を基板9まで移動させて、部品を基板9に搭載する(部品搭載ステップ)。部品搭載ステップにおいて、例えば、基板認識カメラ17からの情報(例えば部品を搭載する位置等の情報)を用いて、部品の搭載が行われる。 The mounting head control unit C3 drives the mounting head 11 (head moving mechanism 13), moves the mounting head 11 that has received the components from the pickup unit 23 to the board 9, and mounts the components on the board 9 (component mounting). Step). In the component mounting step, the component is mounted using, for example, information from the board recognition camera 17 (for example, information such as a position where the component is mounted).
 次に、ピックアップユニット23の位置及びエジェクタ25の位置の較正動作について具体的に説明する。図30は、キャリア保持部21にキャリア27が保持された場合のエジェクタ25の位置の較正動作を示す断面図である。図31は、キャリア保持部21にキャリア27が保持されていない場合のエジェクタ25の位置の較正動作を示す断面図である。 Next, the calibration operation of the position of the pickup unit 23 and the position of the ejector 25 will be specifically described. FIG. 30 is a cross-sectional view showing a calibration operation of the position of the ejector 25 when the carrier 27 is held by the carrier holding portion 21. FIG. 31 is a cross-sectional view showing a calibration operation of the position of the ejector 25 when the carrier 27 is not held by the carrier holding portion 21.
 本実施の形態の制御部C1は、開口45,51よりも水平方向外側の開口外位置を通じてエジェクタ25の位置の較正動作を行う第1のモードと、開口45,51内の開口内位置を通じてエジェクタ25の位置の較正動作を行う第2のモードとを選択的に実施する。 The control unit C1 of the present embodiment has a first mode in which the position of the ejector 25 is calibrated through the position outside the opening horizontally outside the openings 45 and 51, and the ejector through the position inside the opening inside the openings 45 and 51. A second mode in which the calibration operation of the 25 positions is performed is selectively performed.
 第1のモードにおいて、図30に示すように、キャリア保持部21にキャリア27が保持されている場合、ピックアップユニット23の位置及びエジェクタ25の位置の較正動作は、貫通部52を通じて行われる。 In the first mode, as shown in FIG. 30, when the carrier 27 is held by the carrier holding portion 21, the calibration operation of the position of the pickup unit 23 and the position of the ejector 25 is performed through the penetrating portion 52.
 制御部C1は、ユニット移動機構63(図1)及びエジェクタ25を駆動して、ピックアップユニット23及びエジェクタ25を移動させる。この結果、ピックアップユニット23(部品撮像部75)が貫通部52の上方に位置し、エジェクタ25が貫通部52の下方に位置する状態となる。さらに、制御部C1は、エジェクタ25(昇降部156)を駆動して、エジェクタ25を上方に移動させる。 The control unit C1 drives the unit moving mechanism 63 (FIG. 1) and the ejector 25 to move the pickup unit 23 and the ejector 25. As a result, the pickup unit 23 (component imaging unit 75) is located above the penetrating portion 52, and the ejector 25 is located below the penetrating portion 52. Further, the control unit C1 drives the ejector 25 (elevating unit 156) to move the ejector 25 upward.
 本実施の形態では、エジェクタ25の上端部がキャリア27の高さよりも高くなるまでエジェクタ25を上昇させる。エジェクタ25が上昇した状態で、部品撮像部75がエジェクタ25を撮像する(第1の検出ステップ)。第1の検出(撮像)ステップは、キャリア保持ステップの後に行われる。撮像したエジェクタ25の水平方向の位置を用いて位置の較正が行われる(第1の較正ステップ)。本実施の形態の部品撮像部75は、エジェクタ25の水平方向の位置を検出する検出部としても機能する。 In the present embodiment, the ejector 25 is raised until the upper end of the ejector 25 is higher than the height of the carrier 27. With the ejector 25 raised, the component imaging unit 75 images the ejector 25 (first detection step). The first detection (imaging) step is performed after the carrier retention step. The position is calibrated using the imaged ejector 25 in the horizontal direction (first calibration step). The component imaging unit 75 of the present embodiment also functions as a detection unit that detects the horizontal position of the ejector 25.
 第2のモードにおいて、図31に示すように、キャリア保持部21にキャリア27が保持されていない場合、ピックアップユニット23の位置及びエジェクタ25の位置の較正動作は、キャリア保持部21の開口45を通じて行われる。 In the second mode, as shown in FIG. 31, when the carrier 27 is not held by the carrier holding portion 21, the calibration operation of the position of the pickup unit 23 and the position of the ejector 25 is performed through the opening 45 of the carrier holding portion 21. Will be done.
 制御部C1は、ユニット移動機構63(図1)及びエジェクタ25を駆動して、ピックアップユニット23及びエジェクタ25を移動させる。これにより、ピックアップユニット23(部品撮像部75)が開口45の上方に位置し、エジェクタ25が開口45の下方に位置する状態となる。さらに、制御部C1は、エジェクタ25を駆動して、エジェクタ25を上方に移動させる。 The control unit C1 drives the unit moving mechanism 63 (FIG. 1) and the ejector 25 to move the pickup unit 23 and the ejector 25. As a result, the pickup unit 23 (component imaging unit 75) is located above the opening 45, and the ejector 25 is located below the opening 45. Further, the control unit C1 drives the ejector 25 to move the ejector 25 upward.
 本実施の形態では、キャリア27が保持される場合のキャリア27の高さよりもエジェクタ25の上端部が高くなるまで、エジェクタ25を上昇させる。エジェクタ25が上昇した状態で、部品撮像部75がエジェクタ25を撮像する(第2の検出ステップ)。第2の検出(撮像)ステップは、キャリア保持ステップの前に行われる。撮像したエジェクタ25の位置を用いて位置の較正が行われる(第2の較正ステップ)。 In the present embodiment, the ejector 25 is raised until the upper end portion of the ejector 25 is higher than the height of the carrier 27 when the carrier 27 is held. With the ejector 25 raised, the component imaging unit 75 images the ejector 25 (second detection step). The second detection (imaging) step is performed before the carrier retention step. The position is calibrated using the position of the ejector 25 that has been imaged (second calibration step).
 次に、搭載ヘッド11の位置及びピックアップユニット23の位置の較正動作について具体的に説明する。図32は、搭載ヘッド11の位置及びピックアップユニット23の位置の較正動作を行う際のキャリア保持部21の概略構成図である。 Next, the calibration operation of the position of the mounting head 11 and the position of the pickup unit 23 will be specifically described. FIG. 32 is a schematic configuration diagram of the carrier holding unit 21 when performing a calibration operation of the position of the mounting head 11 and the position of the pickup unit 23.
 図32に示すように、搭載ヘッド11の位置及びピックアップユニット23の位置の較正動作を行う際、キャリア保持部21には較正用治具147が取り付けられる。較正用治具147は、搭載ヘッド11の位置及びピックアップユニット23の位置の較正動作を行うための治具である。較正用治具147は、例えば、キャリア保持部21にキャリア27が保持されていない状態において、支持部41bに支持される。較正用治具147は、例えば平板状に形成される。 As shown in FIG. 32, when performing the calibration operation of the position of the mounting head 11 and the position of the pickup unit 23, the calibration jig 147 is attached to the carrier holding portion 21. The calibration jig 147 is a jig for performing a calibration operation of the position of the mounting head 11 and the position of the pickup unit 23. The calibration jig 147 is supported by the support portion 41b, for example, in a state where the carrier 27 is not held by the carrier holding portion 21. The calibration jig 147 is formed in a flat plate shape, for example.
 較正用治具147は、第1の基準マーク149及び第2の基準マーク151を有する。第1の基準マーク149は、部品撮像部(第1の撮像部)75によって検出されるマークである。第2の基準マーク151は、基板認識カメラ(第2の撮像部)17によって検出されるマークである。本実施の形態の第2の基準マーク151は、上下方向に延びるポスト153上に形成される。第1の基準マーク149及び第2の基準マーク151を検出することによって、搭載ヘッド11の座標系及びピックアップユニット23の座標系の較正を行う。具体的には、第1の基準マーク149及び第2の基準マーク151の相対的な位置関係(本実施の形態では水平方向の距離D1)を用いて、搭載ヘッド11の座標系及びピックアップユニット23の座標系の座標変換を行う。 The calibration jig 147 has a first reference mark 149 and a second reference mark 151. The first reference mark 149 is a mark detected by the component imaging unit (first imaging unit) 75. The second reference mark 151 is a mark detected by the substrate recognition camera (second imaging unit) 17. The second reference mark 151 of the present embodiment is formed on the post 153 extending in the vertical direction. By detecting the first reference mark 149 and the second reference mark 151, the coordinate system of the mounting head 11 and the coordinate system of the pickup unit 23 are calibrated. Specifically, the coordinate system of the mounting head 11 and the pickup unit 23 are used by using the relative positional relationship between the first reference mark 149 and the second reference mark 151 (horizontal distance D1 in the present embodiment). Performs coordinate conversion of the coordinate system of.
 次に、ピックアップステップ及び受渡ステップについて詳細に説明する。図33は、部品保持ヘッド77、中継用部品保持ヘッド89、及び部品撮像部75の相対的な位置関係を示す概略構成図である。 Next, the pickup step and the delivery step will be described in detail. FIG. 33 is a schematic configuration diagram showing the relative positional relationship between the component holding head 77, the relay component holding head 89, and the component imaging unit 75.
 図33に示すように、ピックアップステップ及び受渡ステップの前段階として、一方の下向きの部品保持ヘッド77と他方の上向きの部品保持ヘッド77との相対的なヘッド間水平位置関係を求める。当該ヘッド間水平位置関係は、記憶部M1に記憶される。本実施の形態では、部品撮像部75の光軸L1と下向きの部品保持ヘッド77との相対的な光軸-ヘッド間水平位置関係を求める。具体的には、部品撮像部75の光軸L1からの部品保持ヘッド77のずれ量(オフセット)OF1,OF2を計測する。OF1は、下向きの状態の部品保持ヘッド77と光軸L1との水平方向の距離であって、OF2は、上向きの状態の部品保持ヘッド77と光軸L1との水平方向の距離である。 As shown in FIG. 33, as a preliminary step of the pickup step and the delivery step, the relative horizontal positional relationship between the heads of one downward component holding head 77 and the other upward component holding head 77 is obtained. The horizontal positional relationship between the heads is stored in the storage unit M1. In the present embodiment, the relative optical axis-head-to-head horizontal positional relationship between the optical axis L1 of the component imaging unit 75 and the downward component holding head 77 is obtained. Specifically, the deviation amounts (offsets) OF1 and OF2 of the component holding head 77 from the optical axis L1 of the component imaging unit 75 are measured. OF1 is the horizontal distance between the component holding head 77 in the downward state and the optical axis L1, and OF2 is the horizontal distance between the component holding head 77 in the upward state and the optical axis L1.
 さらに、上向きの中継用部品保持ヘッド89の中心が位置すると推定される推定位置EP1からの、基板認識カメラ17によって認識される上向きの中継用部品保持ヘッド89の位置のずれ量(オフセット)OF3を計測する。OF3は、推定位置EP1と上向きの中継用部品保持ヘッド89の位置との間の水平方向の距離である。OF1,OF2,OF3は、記憶部M1(図29)に記憶される。 Further, the amount of deviation (offset) OF3 of the position of the upward relay component holding head 89 recognized by the board recognition camera 17 from the estimated position EP1 where the center of the upward relay component holding head 89 is estimated to be located is set. measure. OF3 is the horizontal distance between the estimated position EP1 and the position of the upward relay component holding head 89. OF1, OF2, and OF3 are stored in the storage unit M1 (FIG. 29).
 図34は、部品保持ヘッド77及び部品保持ヘッド77に保持される部品を基板認識カメラ17によって撮像した画像を示す。図34に示すように、本実施の形態では、OF1は、基板認識カメラ17によって計測される。基板認識カメラ17は、下向きの部品保持ヘッド77が部品をピックアップして上向きに反転した状態において、当該部品保持ヘッド77に保持される部品の部品位置P1を撮像する。さらに、基板認識カメラ17は、部品を保持していない状態の当該部品保持ヘッド77のヘッド位置P2を撮像する。これにより、部品位置P1とヘッド位置P2との水平方向のずれ量を計測し、当該ずれ量をOF1とする。例えば、部品位置P1は、基板認識カメラ17によって撮像される部品の中心位置であって、ヘッド位置P2は、基板認識カメラ17によって撮像されるヘッドの中心位置である。 FIG. 34 shows an image of the component holding head 77 and the component held by the component holding head 77 taken by the substrate recognition camera 17. As shown in FIG. 34, in the present embodiment, OF1 is measured by the substrate recognition camera 17. The board recognition camera 17 takes an image of the component position P1 of the component held by the component holding head 77 in a state where the component holding head 77 facing downward picks up the component and flips it upward. Further, the substrate recognition camera 17 takes an image of the head position P2 of the component holding head 77 in a state where the component is not held. As a result, the amount of deviation between the component position P1 and the head position P2 in the horizontal direction is measured, and the amount of deviation is set to OF1. For example, the component position P1 is the center position of the component imaged by the substrate recognition camera 17, and the head position P2 is the center position of the head imaged by the substrate recognition camera 17.
 OF2は、基板認識カメラ17によって計測される。基板認識カメラ17は、光軸L1上に移動して、上向きの状態の部品保持ヘッド77を撮像する。OF2は、例えば、部品保持ヘッド77の中心位置と光軸L1との水平方向の距離である。 OF2 is measured by the board recognition camera 17. The substrate recognition camera 17 moves on the optical axis L1 and images the component holding head 77 in an upward state. OF2 is, for example, the horizontal distance between the center position of the component holding head 77 and the optical axis L1.
 基板認識カメラ17は、推定位置EP1に移動して上向きの中継用部品保持ヘッド89を撮像してOF3を計測する。ここで、推定位置EP1は、例えば、光軸L1から所定の距離D2離れた位置である。所定の距離D2は、例えば、光軸L1と上向きの中継用部品保持ヘッド89との間の水平方向の距離の設計値である。 The board recognition camera 17 moves to the estimated position EP1 and takes an image of the upward relay component holding head 89 to measure OF3. Here, the estimated position EP1 is, for example, a position separated from the optical axis L1 by a predetermined distance D2. The predetermined distance D2 is, for example, a design value of a horizontal distance between the optical axis L1 and the upward relay component holding head 89.
 複数の部品保持ヘッド77のうち、一方の部品保持ヘッドを第1の部品保持ヘッド77a、他方の部品保持ヘッドを第2の部品保持ヘッド77bとして説明する。ここで、部品保持ヘッド77aが下向きのときのOF1をOFa1とし、部品保持ヘッド77aが上向きのときのOF2をOFa2とし、部品保持ヘッド77bが下向きのOF1をOFb1とし、部品保持ヘッド77bが上向きのときのOF2をOFb2とする。 Of the plurality of component holding heads 77, one component holding head will be referred to as a first component holding head 77a, and the other component holding head will be referred to as a second component holding head 77b. Here, the OF1 when the component holding head 77a is downward is OFa1, the OF2 when the component holding head 77a is upward is OFa2, the OF1 with the component holding head 77b downward is OFb1, and the component holding head 77b is upward. Let OF2 be OFb2.
 計測したOF1を用いて、算出部C4は、下向きの部品保持ヘッド77がキャリア27から部品をピックアップできる目標位置OP1を算出する。部品保持ヘッド77aの目標位置OPa1を下記の数式(1)を用いて算出し、部品保持ヘッド77bの目標位置OPb1を下記の数式(2)を用いて算出する。 Using the measured OF1, the calculation unit C4 calculates the target position OP1 at which the downward component holding head 77 can pick up components from the carrier 27. The target position OPa1 of the component holding head 77a is calculated using the following mathematical formula (1), and the target position OPb1 of the component holding head 77b is calculated using the following mathematical formula (2).
Figure JPOXMLDOC01-appb-M000001
Figure JPOXMLDOC01-appb-M000001
Figure JPOXMLDOC01-appb-M000002
Figure JPOXMLDOC01-appb-M000002
 計測したOF1,OF2を用いて、算出部C4は、ピックアップ部71(下向きの部品保持ヘッド77)が目標位置OP1に位置するときの上向きの部品保持ヘッド77の停止位置TP1を算出する。部品保持ヘッド77aが下向きのときにおける上向きの部品保持ヘッド77bの停止位置TPb1を下記の数式(3)を用いて算出する。部品保持ヘッド77bが下向きのときにおける上向きの部品保持ヘッド77aの停止位置TPa1を下記の数式(4)を用いて算出する。 Using the measured OF1 and OF2, the calculation unit C4 calculates the stop position TP1 of the upward component holding head 77 when the pickup unit 71 (downward component holding head 77) is located at the target position OP1. The stop position TPb1 of the upward component holding head 77b when the component holding head 77a is downward is calculated using the following mathematical formula (3). The stop position TPa1 of the upward component holding head 77a when the component holding head 77b is downward is calculated using the following mathematical formula (4).
Figure JPOXMLDOC01-appb-M000003
Figure JPOXMLDOC01-appb-M000003
Figure JPOXMLDOC01-appb-M000004
Figure JPOXMLDOC01-appb-M000004
 計測したOF1,OF3を用いて、算出部C4は、ピックアップ部71が目標位置OP1に位置するときの上向きの中継用部品保持ヘッド89の停止位置TP2を算出する。部品保持ヘッド77aがピックアップした部品を中継用部品保持ヘッド89が受け取る場合の、中継用部品保持ヘッド89の上向きの停止位置TPa2を下記の数式(5)を用いて算出する。部品保持ヘッド77bがピックアップした部品を中継用部品保持ヘッド89が受け取る場合の、中継用部品保持ヘッド89の上向きの停止位置TPb2を下記の数式(6)を用いて算出する。 Using the measured OF1 and OF3, the calculation unit C4 calculates the stop position TP2 of the upward relay component holding head 89 when the pickup unit 71 is located at the target position OP1. When the relay component holding head 89 receives the component picked up by the component holding head 77a, the upward stop position TPa2 of the relay component holding head 89 is calculated using the following mathematical formula (5). When the relay component holding head 89 receives the component picked up by the component holding head 77b, the upward stop position TPb2 of the relay component holding head 89 is calculated using the following mathematical formula (6).
Figure JPOXMLDOC01-appb-M000005
Figure JPOXMLDOC01-appb-M000005
Figure JPOXMLDOC01-appb-M000006
Figure JPOXMLDOC01-appb-M000006
 フリップチップ実装の場合のピックアップステップ及び受渡ステップについて説明する。図35A~図35Fは、フリップチップ実装の場合のピックアップ動作及び受渡動作を示す概略図である。 The pickup step and delivery step in the case of flip chip mounting will be explained. 35A to 35F are schematic views showing a pickup operation and a delivery operation in the case of flip-chip mounting.
 まず、図35Aに示すように、部品撮像部75によって、キャリア27に担持された部品を撮像する。部品撮像部75は、部品撮像部75の下方に部品保持ヘッド77が位置しない状態で部品を撮像する(第1の部品撮像ステップ)。 First, as shown in FIG. 35A, the component imaging unit 75 images the component supported on the carrier 27. The component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (first component imaging step).
 第1の部品撮像ステップの後、図35Bに示すように、部品保持ヘッド77aが下向きになるように旋回部材83(図13)を旋回させる。このとき、ユニット移動機構63を駆動して、下向きの部品保持ヘッド77aが目標位置OPa1に位置するように、ピックアップユニット23を移動させる。具体的には、部品撮像部75によって撮像した位置からOFa1分、ピックアップユニット23を移動させる。 After the first component imaging step, as shown in FIG. 35B, the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77a faces downward. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is located at the target position OPa1. Specifically, the pickup unit 23 is moved by OFa 1 minute from the position imaged by the component imaging unit 75.
 さらに、保持ヘッド駆動機構87を駆動して、下向きの部品保持ヘッド77aを下方に移動させて部品をピックアップする。部品のピックアップ後、保持ヘッド駆動機構87を駆動して、下向きの部品保持ヘッド77aを上方に移動させる。 Further, the holding head drive mechanism 87 is driven to move the downward component holding head 77a downward to pick up the component. After picking up the parts, the holding head drive mechanism 87 is driven to move the downward parts holding head 77a upward.
 図35Cに示すように、旋回部材83を旋回させて、部品をピックアップした下向きの部品保持ヘッド77aの姿勢を上向きへと変更する。部品保持ヘッド77aの旋回を行うとともに、部品保持ヘッド77bによってピックアップされる次の部品を移動させる。 As shown in FIG. 35C, the swivel member 83 is swiveled to change the posture of the downward component holding head 77a that picks up the component upward. While turning the component holding head 77a, the next component picked up by the component holding head 77b is moved.
 部品撮像部75によって、次にピックアップする部品を撮像する。部品撮像部75は、部品撮像部75の下方に部品保持ヘッド77が位置しない状態で部品を撮像する(第2の部品撮像ステップ)。 The component imaging unit 75 images the component to be picked up next. The component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (second component imaging step).
 第2の部品撮像ステップの後、図35Dに示すように、部品保持ヘッド77bが下向きになるように旋回部材83(図13)を旋回させる。このとき、ユニット移動機構63を駆動して、下向きの部品保持ヘッド77bが目標位置OPb1に位置するように、ピックアップユニット23を移動させる。具体的には、部品撮像部75によって撮像した位置からOFb1分、ピックアップユニット23を移動させる。 After the second component imaging step, as shown in FIG. 35D, the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77b faces downward. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77b is located at the target position OPb1. Specifically, the pickup unit 23 is moved by OFb 1 minute from the position imaged by the component imaging unit 75.
 算出部C4は、上記数式(4)を用いて上向きの部品保持ヘッド77aの停止位置TPa1を算出する。算出部C4によって算出された停止位置TPa1に搭載ヘッド11を移動させて部品を受け取る。このとき、保持ヘッド駆動機構87を駆動して下向きの部品保持ヘッド77bを下方に移動させて部品をピックアップする。部品のピックアップ後、保持ヘッド駆動機構87を駆動して、下向きの部品保持ヘッド77bを上方に移動させる。このように、部品保持ヘッド77bで部品をピックアップするとともに部品保持ヘッド77aで搭載ヘッド11に部品を受け渡す動作(第1動作)が行われる。 The calculation unit C4 calculates the stop position TPa1 of the upward component holding head 77a using the above mathematical formula (4). The mounting head 11 is moved to the stop position TPa1 calculated by the calculation unit C4 to receive the component. At this time, the holding head drive mechanism 87 is driven to move the downward component holding head 77b downward to pick up the component. After picking up the parts, the holding head drive mechanism 87 is driven to move the downward parts holding head 77b upward. In this way, the component holding head 77b picks up the component, and the component holding head 77a delivers the component to the mounting head 11 (first operation).
 次に、図35Eに示すように、旋回部材83を旋回させて、部品をピックアップした下向きの部品保持ヘッド77bの姿勢を上向きへと変更する。部品保持ヘッド77bの旋回を行うとともに、部品保持ヘッド77aによってピックアップされる部品を移動させる。 Next, as shown in FIG. 35E, the swivel member 83 is swiveled to change the posture of the downward component holding head 77b that picks up the component upward. While turning the component holding head 77b, the component picked up by the component holding head 77a is moved.
 部品撮像部75によって、次にピックアップする部品を撮像する。部品撮像部75は、部品撮像部75の下方に部品保持ヘッド77が位置しない状態で部品を撮像する(第3の部品撮像ステップ)。 The component imaging unit 75 images the component to be picked up next. The component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (third component imaging step).
 第3の部品撮像ステップの後、図35Fに示すように、部品保持ヘッド77aが下向きになるように旋回部材83(図13)を旋回させる。このとき、ユニット移動機構63を駆動して、下向きの部品保持ヘッド77aが目標位置OPa1に位置するように、ピックアップユニット23を移動させる。具体的には、部品撮像部75によって撮像した位置からOFa1分、ピックアップユニット23を移動させる。 After the third component imaging step, as shown in FIG. 35F, the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77a faces downward. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is located at the target position OPa1. Specifically, the pickup unit 23 is moved by OFa 1 minute from the position imaged by the component imaging unit 75.
 算出部C4は、上記数式(3)を用いて上向きの部品保持ヘッド77bの停止位置TPb1を算出する。算出部C4によって算出された停止位置TPb1に搭載ヘッド11を移動させて部品を受け取る。このとき、保持ヘッド駆動機構87を駆動して下向きの部品保持ヘッド77aを下方に移動させて部品をピックアップする。部品のピックアップ後、保持ヘッド駆動機構87を駆動して、下向きの部品保持ヘッド77aを上方に移動させる。このように、部品保持ヘッド77aで部品をピックアップするとともに部品保持ヘッド77bで搭載ヘッド11に部品を受け渡す動作(第2動作)が行われる。 The calculation unit C4 calculates the stop position TPb1 of the upward component holding head 77b using the above mathematical formula (3). The mounting head 11 is moved to the stop position TPb1 calculated by the calculation unit C4 to receive the component. At this time, the holding head drive mechanism 87 is driven to move the downward component holding head 77a downward to pick up the component. After picking up the parts, the holding head drive mechanism 87 is driven to move the downward parts holding head 77a upward. In this way, the component holding head 77a picks up the component, and the component holding head 77b delivers the component to the mounting head 11 (second operation).
 以上のように、フリップチップ実装の場合、第1動作及び第2動作を交互に繰り返し行って、キャリア27から搭載ヘッド11へ部品を供給する。 As described above, in the case of flip-chip mounting, the first operation and the second operation are alternately repeated to supply the components from the carrier 27 to the mounting head 11.
 ダイアタッチ実装の場合のピックアップステップ及び受渡ステップについて説明する。図36A~図36Hは、ダイアタッチ実装の場合のピックアップ動作及び受渡動作を示す概略図である。 The pickup step and delivery step in the case of die attach mounting will be explained. 36A to 36H are schematic views showing a pickup operation and a delivery operation in the case of the die attach mounting.
 まず、図36Aに示すように、部品撮像部75によって、キャリア27に担持された部品を撮像する。部品撮像部75は、部品撮像部75の下方に部品保持ヘッド77が位置しない状態で部品を撮像する(第4の部品撮像ステップ)。 First, as shown in FIG. 36A, the component imaging unit 75 images the component supported on the carrier 27. The component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (fourth component imaging step).
 第4の部品撮像ステップの後、図36Bに示すように、部品保持ヘッド77aが下向きになるように旋回部材83(図13)を旋回させる。このとき、ユニット移動機構63を駆動して、下向きの部品保持ヘッド77aが目標位置OPa1に位置するように、ピックアップユニット23を移動させる。具体的には、部品撮像部75によって撮像した位置からOFa1分、ピックアップユニット23を移動させる。 After the fourth component imaging step, as shown in FIG. 36B, the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77a faces downward. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is located at the target position OPa1. Specifically, the pickup unit 23 is moved by OFa 1 minute from the position imaged by the component imaging unit 75.
 さらに、保持ヘッド駆動機構87を駆動して、下向きの部品保持ヘッド77aを下方に移動させて部品をピックアップする。部品のピックアップ後、保持ヘッド駆動機構87を駆動して、下向きの部品保持ヘッド77aを上方に移動させる。 Further, the holding head drive mechanism 87 is driven to move the downward component holding head 77a downward to pick up the component. After picking up the parts, the holding head drive mechanism 87 is driven to move the downward parts holding head 77a upward.
 図36Cに示すように、旋回部材83を旋回させて、部品をピックアップした下向きの部品保持ヘッド77aの姿勢を上向きへと変更する。部品保持ヘッド77aの旋回を行うとともに、部品保持ヘッド77bによってピックアップされる部品を移動させる。 As shown in FIG. 36C, the swivel member 83 is swiveled to change the posture of the downward component holding head 77a that picks up the component upward. While turning the component holding head 77a, the component picked up by the component holding head 77b is moved.
 部品撮像部75によって、次にピックアップする部品を撮像する。部品撮像部75は、部品撮像部75の下方に部品保持ヘッド77が位置しない状態で部品を撮像する(第5の部品撮像ステップ)。 The component imaging unit 75 images the component to be picked up next. The component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (fifth component imaging step).
 図36Dに示すように、部品保持ヘッド77aが斜め上向きになるように旋回部材83(図13)を旋回させる。このとき、第2の移動機構91(図14)の駆動によって中継用部品保持ヘッド89が斜め下向きに向いた状態となっている。具体的には、部品保持ヘッド77a及び中継用部品保持ヘッド89が、同一直線上で互いに向かい合った状態となっている。 As shown in FIG. 36D, the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77a faces diagonally upward. At this time, the relay component holding head 89 is oriented diagonally downward by driving the second moving mechanism 91 (FIG. 14). Specifically, the component holding head 77a and the relay component holding head 89 are in a state of facing each other on the same straight line.
 さらに、保持ヘッド駆動機構87を駆動して、斜め上向きの部品保持ヘッド77aを斜め上方に(中継用部品保持ヘッド89に向けて)移動させて部品を中継用部品保持ヘッド89に受け渡す。部品の受け渡し後、保持ヘッド駆動機構87を駆動して、斜め上向きの部品保持ヘッド77aを斜め下方に移動させる。 Further, the holding head drive mechanism 87 is driven to move the component holding head 77a diagonally upward (toward the relay component holding head 89) and deliver the component to the relay component holding head 89. After the parts are delivered, the holding head drive mechanism 87 is driven to move the diagonally upward component holding head 77a diagonally downward.
 次に、図36Eに示すように、中継用部品保持ヘッド89が上向きになるように旋回させ、部品保持ヘッド77bが下向きになるように旋回させる。このとき、ユニット移動機構63を駆動して、下向きの部品保持ヘッド77bが目標位置OPb1に位置するように、ピックアップユニット23を移動させる。具体的には、部品撮像部75によって撮像した位置からOFb1分、ピックアップユニット23を移動させる。 Next, as shown in FIG. 36E, the relay component holding head 89 is swiveled upward, and the component holding head 77b is swiveled downward. At this time, the unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77b is located at the target position OPb1. Specifically, the pickup unit 23 is moved by OFb 1 minute from the position imaged by the component imaging unit 75.
 算出部C4は、上記数式(5)を用いて上向きの中継用部品保持ヘッド89の停止位置TPa2を算出する。算出部C4によって算出された停止位置TPa2に搭載ヘッド11を移動させて部品を受け取る。このとき、保持ヘッド駆動機構87を駆動して下向きの部品保持ヘッド77bを下方に移動させて部品をピックアップする。部品のピックアップ後、保持ヘッド駆動機構87を駆動して、下向きの部品保持ヘッド77bを上方に移動させる。このように、部品保持ヘッド77bで部品をピックアップするとともに中継用部品保持ヘッド89で搭載ヘッド11に部品を受け渡す動作(第3動作)が行われる。 The calculation unit C4 calculates the stop position TPa2 of the upward relay component holding head 89 using the above mathematical formula (5). The mounting head 11 is moved to the stop position TPa2 calculated by the calculation unit C4 to receive the component. At this time, the holding head drive mechanism 87 is driven to move the downward component holding head 77b downward to pick up the component. After picking up the parts, the holding head drive mechanism 87 is driven to move the downward parts holding head 77b upward. In this way, the component holding head 77b picks up the component, and the relay component holding head 89 delivers the component to the mounting head 11 (third operation).
 次に、図36Fに示すように、部品保持ヘッド77bを旋回させ、部品撮像部75によって次にピックアップする部品を撮像する。部品撮像部75は、部品撮像部75の下方に部品保持ヘッド77が位置しない状態で部品を撮像する(第6の部品撮像ステップ)。 Next, as shown in FIG. 36F, the component holding head 77b is swiveled, and the component imaging unit 75 images the component to be picked up next. The component imaging unit 75 images the component in a state where the component holding head 77 is not located below the component imaging unit 75 (sixth component imaging step).
 次に、図36Gに示すように、部品保持ヘッド77bが斜め上向きになるように旋回部材83(図13)を旋回させる。このとき、第2の移動機構91(図14)の駆動によって中継用部品保持ヘッド89が斜め下向きに向いた状態となっている。具体的には、部品保持ヘッド77b及び中継用部品保持ヘッド89が、同一直線上で互いに向かい合った状態となっている。 Next, as shown in FIG. 36G, the swivel member 83 (FIG. 13) is swiveled so that the component holding head 77b faces diagonally upward. At this time, the relay component holding head 89 is oriented diagonally downward by driving the second moving mechanism 91 (FIG. 14). Specifically, the component holding head 77b and the relay component holding head 89 are in a state of facing each other on the same straight line.
 さらに、保持ヘッド駆動機構87を駆動して、斜め上向きの部品保持ヘッド77bを斜め上方に(中継用部品保持ヘッド89に向けて)移動させて部品を中継用部品保持ヘッド89に受け渡す。部品の受け渡し後、保持ヘッド駆動機構87を駆動して、斜め上向きの部品保持ヘッド77bを斜め下方に移動させる。 Further, the holding head drive mechanism 87 is driven to move the component holding head 77b diagonally upward (toward the relay component holding head 89) and deliver the component to the relay component holding head 89. After the parts are delivered, the holding head drive mechanism 87 is driven to move the diagonally upward component holding head 77b diagonally downward.
 次に、図36Hに示すように、中継用部品保持ヘッド89が上向きになるように旋回させ、部品保持ヘッド77aが下向きになるように旋回させる。ユニット移動機構63を駆動して、下向きの部品保持ヘッド77aが目標位置OPa1に位置するように、ピックアップユニット23を移動させる。具体的には、部品撮像部75によって撮像した位置からOFa1分、ピックアップユニット23を移動させる。 Next, as shown in FIG. 36H, the relay component holding head 89 is swiveled upward, and the component holding head 77a is swiveled downward. The unit moving mechanism 63 is driven to move the pickup unit 23 so that the downward component holding head 77a is located at the target position OPa1. Specifically, the pickup unit 23 is moved by OFa 1 minute from the position imaged by the component imaging unit 75.
 算出部C4は、上記数式(6)を用いて上向きの中継用部品保持ヘッド89の停止位置TPb2を算出する。算出部C4によって算出された停止位置TPb2に搭載ヘッド11を移動させて部品を受け取る。このとき、保持ヘッド駆動機構87を駆動して下向きの部品保持ヘッド77aを下方に移動させて部品をピックアップする。部品のピックアップ後、保持ヘッド駆動機構87を駆動して、下向きの部品保持ヘッド77aを上方に移動させる。このように、部品保持ヘッド77aで部品をピックアップするとともに中継用部品保持ヘッド89で搭載ヘッド11に部品を受け渡す動作(第4動作)が行われる。 The calculation unit C4 calculates the stop position TPb2 of the upward relay component holding head 89 using the above mathematical formula (6). The mounting head 11 is moved to the stop position TPb2 calculated by the calculation unit C4 to receive the component. At this time, the holding head drive mechanism 87 is driven to move the downward component holding head 77a downward to pick up the component. After picking up the parts, the holding head drive mechanism 87 is driven to move the downward parts holding head 77a upward. In this way, the component holding head 77a picks up the component, and the relay component holding head 89 delivers the component to the mounting head 11 (fourth operation).
 以上のように、ダイアタッチ実装の場合、第3動作及び第4動作を交互に繰り返し行って、キャリア27から搭載ヘッド11へ部品を供給する。 As described above, in the case of the die attach mounting, the third operation and the fourth operation are alternately repeated to supply the parts from the carrier 27 to the mounting head 11.
 なお、本発明は上記実施の形態に限定されるものではなく、その他種々の態様で実施できる。上記実施の形態では、部品位置P1とヘッド位置P2との水平方向のずれ量を計測し、当該ずれ量をOF1とするとしたが、これに限定されない。例えば、下向きの一方の部品保持ヘッド77が上向きに反転した状態における部品保持ヘッド77のヘッド位置を撮像し、光軸L1と当該ヘッド位置との相対的な水平位置関係をOF1とみなしてもよい。 The present invention is not limited to the above embodiment, and can be implemented in various other embodiments. In the above embodiment, the amount of horizontal deviation between the component position P1 and the head position P2 is measured, and the amount of deviation is defined as OF1, but the present invention is not limited to this. For example, the head position of the component holding head 77 in a state where one of the component holding heads 77 facing downward is inverted upward may be imaged, and the relative horizontal positional relationship between the optical axis L1 and the head position may be regarded as OF1. ..
 また、OF1は、基板認識カメラ17によって計測されるとしたが、これに限定されない。OF1は、例えば、部品保持ヘッド77の下方に設けられるカメラによって計測されてもよい。 Also, OF1 is measured by the substrate recognition camera 17, but the present invention is not limited to this. OF1 may be measured by, for example, a camera provided below the component holding head 77.
 また、ピックアップ部71の水平方向の位置、及び部品撮像部75によって撮像されたエジェクタ25の水平方向の位置を較正する例について説明したが、当該較正を行わなくてもよい。例えば、部品撮像部75は、当該較正を行わずエジェクタ25の状態(異物の付着状態)を確認するだけでもよい。 Further, although an example of calibrating the horizontal position of the pickup unit 71 and the horizontal position of the ejector 25 imaged by the component imaging unit 75 has been described, the calibration may not be performed. For example, the component imaging unit 75 may simply check the state of the ejector 25 (the state of foreign matter adhering) without performing the calibration.
 また、部品保持ヘッド77は第1の移動機構79によって旋回し、中継用部品保持ヘッド89は第2の移動機構91によって旋回する構成を説明したが、これに限定されない。すなわち、部品保持ヘッド77及び中継用部品保持ヘッド89は、第1の回動軸81及び第2の回動軸93を中心として回動(旋回)する構成でなくてもよい。部品保持ヘッド77及び中継用部品保持ヘッド89は、例えばロボットアーム等によってヘッドの向きを変更可能に構成されてもよい。 Further, the configuration in which the component holding head 77 is swiveled by the first moving mechanism 79 and the relay component holding head 89 is swiveled by the second moving mechanism 91 has been described, but the present invention is not limited to this. That is, the component holding head 77 and the relay component holding head 89 do not have to be configured to rotate (turn) around the first rotating shaft 81 and the second rotating shaft 93. The component holding head 77 and the relay component holding head 89 may be configured so that the orientation of the head can be changed by, for example, a robot arm or the like.
 なお、上記様々な実施の形態のうちの任意の実施の形態を適宜組み合わせることにより、それぞれの有する効果を奏するようにすることができる。 It should be noted that, by appropriately combining any of the above-mentioned various embodiments, the effects of each can be achieved.
 本発明は、添付図面を参照しながら好ましい実施形態に関連して充分に記載されているが、この技術の熟練した人々にとっては種々の変形や修正は明白である。そのような変形や修正は、添付した特許請求の範囲による本発明の範囲から外れない限りにおいて、その中に含まれると理解されるべきである。また、実施形態における要素の組み合わせや順序の変化は、本発明の範囲および思想を逸脱することなく実現し得るものである。 Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various modifications and modifications are obvious to those skilled in the art. It should be understood that such modifications and modifications are included within the scope of the invention as long as it does not deviate from the scope of the invention according to the appended claims. In addition, changes in the combination and order of elements in the embodiments can be realized without departing from the scope and ideas of the present invention.
 本発明に係る部品供給装置は、例えば、キャリアに担持された部品をピックアップし、基板に部品を搭載する搭載ヘッドに対して部品を供給する場合に有用である。 The component supply device according to the present invention is useful, for example, when picking up a component supported on a carrier and supplying the component to a mounting head for mounting the component on a substrate.
 1 部品搭載装置
 2 部品供給装置
 3 第1の部品供給装置
 5 第2の部品供給装置
 7 部品搭載部
 8 基板搬送部
 9 基板
 11 搭載ヘッド
 13 ヘッド移動機構
 13A X軸テーブル
 13B Y軸テーブル
 15 部品認識カメラ
 17 基板認識カメラ
 19 天板
 21 キャリア保持部
 23 ピックアップユニット
 25 エジェクタ
 25a 第1のエジェクタ
 25b 第2のエジェクタ
 27 キャリア
 29 マガジン
 31 キャリア搬送部
 33 保持部移動機構
 33a モータ
 33b 送りねじ
 33c ガイドレール
 35 保持部本体
 37 移動ベース
 39 押さえ部材
 41 支持ベース
 41a キャリアガイド
 41b 支持部
 43 環状部材
 45 開口
 47 駆動部
 49 ロッド
 51 開口
 52 貫通部
 53 旋回用ギア
 54 モータ
 55 従動ギア
 57 支持ローラ
 59 旋回ガイド
 61 保持ヘッドチェンジャ
 63 ユニット移動機構
 63a モータ
 63b 送りねじ
 63c ガイドレール
 65 開口部
 67 カバー
 69 開口部
 71 ピックアップ部
 73 中継部
 75 部品撮像部
 77,77a,77b 部品保持ヘッド
 78a 係合部
 78b 凹部
 79 第1の移動機構
 80 モータ
 81 第1の回動軸
 83 旋回部材
 85 ヘッド保持部
 85a 爪部
 85b 弾性部材
 87 保持ヘッド駆動機構
 89 中継用部品保持ヘッド
 91 第2の移動機構
 92 モータ
 93 第2の回動軸
 95 旋回部材
 97 撮像部本体
 99 鏡筒
 101 照明部
 103 ハーフミラー
 105 レンズ
 107 カム駆動モータ
 109 第1のカム
 111 第2のカム
 113 第1のレバー
 115 第1の支持軸
 117 第2のレバー
 119 第2の支持軸
 121 第1の移動部材
 123 第1の移動片
 125 第2の移動部材
 127 第2の移動片
 129 ガイド部材
 131 カムフォロア
 132 円筒カム
 133 弾性部材
 135 収納部
 137 ストッパ
 139 ストッパ駆動部
 141 開口部
 141a 第1の開口部
 141b 第2の開口部
 143 開口部
 143a 拡径部
 143b 小径部
 145 昇降部
 147 較正用治具
 149 第1の基準マーク
 151 第2の基準マーク
 153 ポスト
 155 選択部
 156,156a,156b 昇降部
 157 ベース部材
 159 エジェクタ移動機構
 159a モータ
 159b 送りねじ
 159c ガイドレール
 C1 制御部
 C2 ピックアップ制御部
 C3 搭載ヘッド制御部
 M1 記憶部
 W1 ウエハ
1 Parts mounting device 2 Parts supply device 3 1st parts supply device 5 2nd parts supply device 7 Parts mounting part 8 Board transfer part 9 Board 11 Mounting head 13 Head movement mechanism 13A X-axis table 13BY Y-axis table 15 Parts recognition Camera 17 Board recognition camera 19 Top plate 21 Carrier holding part 23 Pickup unit 25 Ejector 25a First ejector 25b Second ejector 27 Carrier 29 Magazine 31 Carrier transport part 33 Holding part Moving mechanism 33a Motor 33b Feed screw 33c Guide rail 35 Holding Part Main body 37 Moving base 39 Holding member 41 Support base 41a Carrier guide 41b Support part 43 Circular member 45 Opening 47 Drive part 49 Rod 51 Opening 52 Penetration part 53 Swivel gear 54 Motor 55 Driven gear 57 Support roller 59 Swivel guide 61 Holding head Changer 63 Unit movement mechanism 63a Motor 63b Feed screw 63c Guide rail 65 Opening 67 Cover 69 Opening 71 Pickup part 73 Relay part 75 Parts imaging part 77, 77a, 77b Parts holding head 78a Engagement part 78b Recess 79 First movement Mechanism 80 Motor 81 First rotation shaft 83 Swivel member 85 Head holding part 85a Claw part 85b Elastic member 87 Holding head drive mechanism 89 Relay part holding head 91 Second moving mechanism 92 Motor 93 Second rotation shaft 95 Swivel member 97 Imaging unit body 99 Lens barrel 101 Lighting unit 103 Half mirror 105 Lens 107 Cam drive motor 109 First cam 111 Second cam 113 First lever 115 First support shaft 117 Second lever 119 Second Support shaft 121 1st moving member 123 1st moving piece 125 2nd moving member 127 2nd moving piece 129 Guide member 131 Cam follower 132 Cylindrical cam 133 Elastic member 135 Storage part 137 Stopper 139 Stopper drive part 141 Opening 141a 1st opening 141b 2nd opening 143 Opening 143a Widening part 143b Small diameter part 145 Lifting part 147 Calibration jig 149 1st reference mark 151 2nd reference mark 153 Post 155 Selection part 156, 156a, 156b Elevating part 157 Base member 159 Ejector movement mechanism 159a Motor 159b Feed screw 159c Guide rail C1 Control unit C2 Pickup control unit C3 Mounted head control unit M1 Storage unit W1 Wafer

Claims (11)

  1.  基板に部品を搭載する搭載ヘッドに対して、第1の面及び前記第1の面と反対側の第2の面を有する部品を供給する部品供給装置であって、
     部品を保持する部品保持ヘッドを有し、第1の部品の第1の面が上向きの状態で、下向きにした前記部品保持ヘッドによって前記第1の部品をピックアップし、前記第1の部品をピックアップした前記部品保持ヘッドを上向きに反転させて前記第1の部品の第2の面が上向きの状態で前記搭載ヘッドに受け渡すピックアップ部と、
     第2の部品をピックアップした前記部品保持ヘッドが下向きから上向きに反転する途中において、前記部品保持ヘッドが斜め上向きの状態で、前記第2の部品を前記部品保持ヘッドから受け取って前記搭載ヘッドに受け渡す中継部と、
    を備える、部品供給装置。
    A component supply device for supplying a component having a first surface and a second surface opposite to the first surface to a mounting head for mounting the component on a substrate.
    It has a component holding head that holds a component, and the first component is picked up by the component holding head that is turned downward while the first surface of the first component is facing upward, and the first component is picked up. A pickup unit that flips the component holding head upward and delivers it to the mounting head with the second surface of the first component facing upward.
    While the component holding head that picks up the second component is flipping from downward to upward, the second component is received from the component holding head and received by the mounting head while the component holding head is obliquely upward. The relay part to pass and
    A parts supply device.
  2.  前記第1の部品を下向きの状態でピックアップした前記部品保持ヘッドが、上向きに反転して前記第1の部品を前記搭載ヘッドに受け渡すように、前記部品保持ヘッドを上下方向に回動させる第1の回動軸と、
     前記第2の部品を前記部品保持ヘッドから斜め下向きの状態で受け取った前記中継部が、上向きに反転して前記第2の部品を前記搭載ヘッドに受け渡すように、前記中継部を上下方向に回動させる第2の回動軸と、
    を有する、請求項1に記載の部品供給装置。
    The component holding head is rotated in the vertical direction so that the component holding head that picks up the first component in a downward direction reverses upward and delivers the first component to the mounting head. 1 rotation axis and
    The relay unit is moved up and down so that the relay unit that receives the second component from the component holding head in a diagonally downward direction reverses upward and delivers the second component to the mounting head. A second rotating shaft to rotate and
    The component supply device according to claim 1.
  3.  前記第2の回動軸を中心とする前記中継部の回動半径は、前記第1の回動軸を中心とする前記部品保持ヘッドの回動半径よりも小さい、請求項2に記載の部品供給装置。 The component according to claim 2, wherein the radius of rotation of the relay portion centered on the second rotation axis is smaller than the radius of rotation of the component holding head centered on the first rotation axis. Supply device.
  4.  前記第2の回動軸の中心は、前記第1の回動軸の中心よりも上方に位置する、請求項3に記載の部品供給装置。 The component supply device according to claim 3, wherein the center of the second rotation shaft is located above the center of the first rotation shaft.
  5.  前記ピックアップ部が前記搭載ヘッドへ前記第1の部品を受け渡す第1の受け渡し位置、及び前記中継部が前記搭載ヘッドへ前記第2の部品を受け渡す第2の受け渡し位置は、同じ高さに位置する、請求項4に記載の部品供給装置。 The first delivery position where the pickup unit delivers the first component to the mounting head and the second delivery position where the relay unit delivers the second component to the mounting head are at the same height. The component supply device according to claim 4, which is located.
  6.  前記第1の受け渡し位置及び前記第2の受け渡し位置は、互いに水平方向に離間する、請求項5に記載の部品供給装置。 The parts supply device according to claim 5, wherein the first delivery position and the second delivery position are separated from each other in the horizontal direction.
  7.  前記ピックアップ部は、前記第1の回動軸の中心から遠ざかる径方向に前記部品保持ヘッドを移動させる保持ヘッド駆動機構を有する、請求項2から6のいずれか一項に記載の部品供給装置。 The component supply device according to any one of claims 2 to 6, wherein the pickup unit has a holding head drive mechanism for moving the component holding head in a radial direction away from the center of the first rotating shaft.
  8.  前記中継部は、前記第2の部品を前記部品保持ヘッドから受け取って前記搭載ヘッドに受け渡す中継用部品保持ヘッドを有し、
     前記中継用部品保持ヘッドと前記第2の回動軸の中心との距離は一定となるように構成される、請求項2から7のいずれか一項に記載の部品供給装置。
    The relay unit has a relay component holding head that receives the second component from the component holding head and delivers it to the mounting head.
    The component supply device according to any one of claims 2 to 7, wherein the distance between the relay component holding head and the center of the second rotating shaft is constant.
  9.  前記ピックアップ部は、複数の前記部品保持ヘッドを有し、
     複数の前記部品保持ヘッドのうちの少なくとも1組の前記部品保持ヘッドは、互いに反対方向を向くように構成される、請求項1から8のいずれか一項に記載の部品供給装置。
    The pickup unit has a plurality of the component holding heads, and has a plurality of the component holding heads.
    The component supply device according to any one of claims 1 to 8, wherein at least one set of the component holding heads of the plurality of component holding heads is configured to face in opposite directions to each other.
  10.  前記ピックアップ部及び前記中継部は、ピックアップユニットを構成し、
     前記ピックアップユニットの位置を調整するユニット移動機構をさらに有する、請求項1から9のいずれか一項に記載の部品供給装置。
    The pickup unit and the relay unit constitute a pickup unit, and the pickup unit and the relay unit form a pickup unit.
    The component supply device according to any one of claims 1 to 9, further comprising a unit moving mechanism for adjusting the position of the pickup unit.
  11.  上下方向に延びる鏡筒を有し、前記ピックアップ部によってピックアップされる部品を撮像する部品撮像部をさらに備え、
     前記鏡筒は、下向き状態の前記部品保持ヘッドの上方に配置される、請求項1から10のいずれか一項に記載の部品供給装置。
    It has a lens barrel extending in the vertical direction, and further includes a component imaging unit that images components picked up by the pickup unit.
    The component supply device according to any one of claims 1 to 10, wherein the lens barrel is arranged above the component holding head in a downward state.
PCT/JP2019/040302 2019-10-11 2019-10-11 Component supply device WO2021070381A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE112019007800.3T DE112019007800T5 (en) 2019-10-11 2019-10-11 component feeder
CN201980100829.XA CN114556535B (en) 2019-10-11 2019-10-11 Component supply device
PCT/JP2019/040302 WO2021070381A1 (en) 2019-10-11 2019-10-11 Component supply device
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JP2005517289A (en) * 2002-01-30 2005-06-09 シーメンス アクチエンゲゼルシヤフト Chip removal apparatus, chip removal system, mounting system, and method for removing chips from a wafer
US7028392B1 (en) * 1999-03-05 2006-04-18 Siemens Dematic Ag Device for fitting a substrate with a flip chip
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JP2019080061A (en) * 2017-10-20 2019-05-23 エーエスエム・アセンブリー・システムズ・ゲーエムベーハー・ウント・コ・カーゲー Supplementary tool for chip transfer device with removal tool and turning tool

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US7028392B1 (en) * 1999-03-05 2006-04-18 Siemens Dematic Ag Device for fitting a substrate with a flip chip
JP2003124238A (en) * 2001-10-12 2003-04-25 Matsushita Electric Ind Co Ltd Electronic part mounting device and electronic part mounting method
JP2005517289A (en) * 2002-01-30 2005-06-09 シーメンス アクチエンゲゼルシヤフト Chip removal apparatus, chip removal system, mounting system, and method for removing chips from a wafer
JP2008066472A (en) * 2006-09-06 2008-03-21 Canon Machinery Inc Composite processor for workpiece
DE102016117815A1 (en) * 2016-09-21 2018-03-22 Asm Assembly Systems Gmbh & Co. Kg Caching of FCOB chips in a chip transfer device
JP2019080061A (en) * 2017-10-20 2019-05-23 エーエスエム・アセンブリー・システムズ・ゲーエムベーハー・ウント・コ・カーゲー Supplementary tool for chip transfer device with removal tool and turning tool

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DE112019007800T5 (en) 2022-08-11

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