JP2003133797A - Part mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a part mounting apparatus for reducing a tact time without using a complex driving structure in the part mounting apparatus with a constitution, in which a part held and carried by a mounting head is mounted on a mounting objective base on a mounting stage and a relative position of the part, and the mounting objective base is adjusted on the basis of the imaging positional information while an image pick-up means for imaging the part held by the mounting head and the mounting base on the mounting stage is provided. SOLUTION: A part carrying means 6 for carrying and feeding a part 4 to a mounting head 8 is provided at a shifting path of the mounting head 8 in a movable-in and -out state. At the same time a reflective member 16 included in an image pick-up means 9 is mounted on the part carrying means 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting electronic parts such as chip parts on a mounting object such as a board or a package.

[0002]

2. Description of the Related Art FIG. 16 shows an example of a conventional component mounting apparatus of this type. The component mounting apparatus holds the component 32 of the component supply unit 31 by the suction nozzle 34 of the mounting head 33 and conveys it to above the mounting stage 35.
An image pickup unit 38 including a reflecting member 36 such as a prism or a half mirror and a camera 37 is inserted between the mounting head 33 and the mounting stage 35, and the component 32 held by the mounting head 33 and the mounting target on the mounting stage 35. The position of the object 39 is imaged, the position information of each is captured, the image pickup means 38 is moved backward, and then the component 32 and the mounting target 39 based on the captured position information.
Is corrected, and then the mounting head 33 is lowered to press and mount the component 32 to the mounting target 39 placed on the mounting stage 35.

FIG. 18 shows an example of a conventional component mounting method. As shown in FIG. 18, in the conventional mounting method, when mounting of one set of components is completed, the mounting head 31 moves upward to receive the component 32 to be mounted next, and the mounting stage 33 is mounted next. The mounting target 34 to be mounted is moved below the mounting head 31. During this time, the component 32 is carried into the lower part of the mounting head 31 from the component supply unit by the component conveying means 35, and the mounting head 31 is lowered or the component conveying means 35 is raised so that the component 32 is a suction nozzle of the mounting head 31. Handed over to 36. Next, the mounting head 31 holding the component 32 rises again, the component transporting means 35 retracts from the ascending / descending movement path of the mounting head 31, and then the mounting head 31 holding the component 32 descends to move the component 32. The target object 34
Attach to. This completes the one-time component mounting, and thereafter, the above operation is repeated.

[0004]

However, in the conventional apparatus shown in FIG. 16, not only the mounting head moves up and down but also the structure moves horizontally for transporting components. Is complicated, and it is difficult to drive a large and heavy mounting head equipped with a heating and pressurizing mechanism vertically and horizontally at high speed, which leads to a long tact time and easy drive vibration. Was likely to cause a problem. In addition, in order to move a large-volume mounting head equipped with a complicated drive mechanism at high speed and with high accuracy, a highly rigid frame and a large-capacity drive source are required, which leads to an increase in the size of equipment. .

Therefore, as shown in FIG. 17, the front side and the back side of the component 32 are reversed by the component conveying means 40 and the mounting head 3 is mounted.
There is also proposed a configuration in which the mounting head is moved only up and down by handing over the position information and mounting components in the same manner as in the above example.

According to this structure, it is possible to alleviate the problems found in the structure of the prior example in which the mounting head is moved up and down and horizontally, but it is possible to avoid the interference between the component conveying means and the image pickup means. There is a problem that a waiting time is required, a takt time is delayed, a large number of drive sources are required, and the equipment cost is increased.

Further, in the conventional method shown in FIG. 18, since the mounting head includes two vertical movements in one cycle operation, the tact time becomes long, which is an obstacle to improving the mounting processing efficiency. Was there.

In such a conventional component mounting method, efforts have been made to increase the operating speed of the mounting head in order to shorten the tact time, but the mounting head which requires heating or pressure at the time of mounting is required. In this case, since the mounting head becomes large and the weight increases, the inertia becomes large, and thus there is a limit to the speedup.

Further, in the transfer of the component from the component conveying means to the mounting head, when the mounting head descends to the component of the component conveying means, there is a possibility that a large impact is given to the component due to the inertial force and gravity of the mounting head. is there.

In the step of delivering the component from the component conveying means to the mounting head, in the mode in which the component conveying means is raised toward the mounting head to deliver the component, the mounting head is lowered as described above. It is thought that the impact on the parts will be less than in the case of handing over,
The time required to raise the component conveying means for delivering the components is required separately from the mounting head lowering time, and the takt time becomes longer.

The present invention has been made in view of such a point, and mainly provides a component mounting apparatus capable of shortening the tact time without complicating the driving structure. Has an aim.

[0012]

In order to achieve the above object, the present invention is configured as follows.

That is, the component mounting apparatus of the invention according to the present invention transfers the components held by the mounting head and conveyed.
The camera is configured to be mounted on the mounting target mounted on the mounting stage, and the camera that images the component held by the mounting head and the mounting target on the mounting stage and the optical path from the component and the mounting target are bent. A component mounting apparatus configured to correct a relative position of a component and a mounting target based on position information obtained by imaging, the component mounting apparatus including an image capturing unit including a reflecting member, and supplying and transporting the component to the mounting head. The device is arranged so as to be able to move in and out of the moving path of the mounting head, the reflecting member is mounted on the component conveying unit, and the camera is on the optical path from the component and the mounted object bent through the reflecting member. It is characterized by being fixedly arranged.

In such a case, it is possible to image the component and the mounting object on the mounting stage in the step of retracting the component from the mounting head after the component is transferred to the mounting head by the component transporting means. Since the reflecting member is light in weight with respect to the weight of the entire image pickup unit, the weight increase of the component conveying unit is small. Further, since the mass to be moved by the component conveying means is lightened, the component conveying means can be moved at high speed and the vibration at the time of positioning is damped quickly, so that the takt time required for positioning can be shortened. Further, the component conveying means itself can be downsized. Furthermore, moving the camera may break the wiring of the camera, but fixing the camera eliminates such a problem. When the optical paths from the component and the mounting object are bent by a plurality of reflecting members, at least one reflecting member may be mounted on the component conveying means, and other reflecting members may be provided on the optical path from the component and the mounting object. It may be fixedly arranged.

Further, in the case of the present invention, preferably, there is provided means for optically recognizing a component holding state before the component transport means transports the component to the mounting head.

In such a case, the component holding state can be optically recognized by the time the component conveying means conveys the component to the mounting head. Therefore, when the component is transferred from the component conveying means to the mounting head, the component holding position on the mounting head can be changed. You can be proper.

Further, in the case of the present invention, preferably, the image pickup means is configured to simultaneously image the component and the mounting object in a state where the component held by the mounting head faces the mounting object.

In such a case, the image pickup time can be shortened as compared with the case where the component and the mounting object are imaged separately. Since it is not necessary to move the mounting head in the XY directions after imaging,
The positioning error after imaging can be minimized.

Further, in the case of the present invention, preferably, there is provided means for detecting the vertical vibration amplitude of the reflecting member provided in the component carrying means.

In such a case, when there is no displacement in the horizontal direction or when the displacement is small, the vibration amplitude in the vertical direction can be measured by imaging the recognition site at the same time as the component, and the component and the object to be mounted can be measured. It can be used as information for correcting relative positional deviation.

Further, in the case of the present invention, preferably, the mounting head is provided with a recognition portion which is imaged at the same time as the parts.

In such a case, even if the reflecting member vibrates during image pickup, the deviation of the reflecting member can be recognized. That is, as for the horizontal vibration of the reflecting member as shown in FIG. 13B, the deviation direction δ and the deviation direction δ of the image of the component taken into the camera and the object to be attached are the same. Although there is no relative displacement of the object, FIG.
Regarding vertical vibrations as shown in (a), the displacement direction δ and the displacement direction δ of the image of the component to be mounted on the camera and the component to be mounted are the same, but the displacement direction is opposite. The relative displacement of the mounting target is 2δ. Therefore, by detecting the vertical vibration amplitude δ of the reflecting member, it becomes possible to correct the relative positional deviation 2δ between the component and the mounting target.

In the case of the present invention, preferably, the mounting head is capable of moving toward and away from an object to be mounted, component transport means capable of moving in and out of a head movement locus and moving in the head movement direction, and mounting. And a control means for controlling the moving speed of at least one of the component conveying means and the mounting head so that the component conveying means moves in the head moving direction while the head is moving so as to bring them closer to each other. And

In such a case, for example, in the step of moving the mounting head away from the mounting object after one mounting operation is completed, the mounting means moves while moving the component conveying means within the head movement locus in the head movement direction. By moving the parts relatively close to the head, the parts can be transferred from the parts conveying means to the mounting head with less impact.

Further, the component mounting apparatus of the present invention is preferably fixedly mounted on a base portion of the component mounting apparatus in order to move the component conveying means in a vertical direction corresponding to the head moving direction. A certain up-and-down driving means, an up-and-down sliding part that can move in the up-and-down direction by the up-and-down driving means, and a first connecting part that moves up and down together with the up-and-down sliding part and can move in the left-and-right direction with respect to the up-and-down sliding part, A left-right direction driving means for moving the first connecting portion in the left-right direction in order to move the component carrying means in the left-right direction corresponding to the direction of movement in and out of the head movement locus; A left and right slide part that is movable in the left and right direction, and a second connection part that is slidable in the front-rear direction with the first connection part and that is vertically slidable with the left and right slide part. Together, characterized in that it provided the component conveying means to the second connecting portion.

In such a case, some of the components of the component conveying means and the image pickup means provided in the component conveying means are movable in the vertical direction, the horizontal direction, and the front-back direction, and the movable mass for moving them. Since it can be made as small as possible, the movement tact time of the component conveying means in the component conveying operation can be shortened.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a schematic structure of a component mounting apparatus according to the present invention, and FIG. 2 is a front view showing a schematic structure. On the upper surface of the device frame 1 in this component mounting apparatus, two left and right mounting stages 3 for mounting and supporting (including a mounted state) a package 2 which is an example of a mounting target, and chip components, etc. Is equipped with a component supply unit 5 in which the components 4 are aligned and housed, and above the apparatus frame 1, a component transport stage 6 as a component transport means, and a component 4 taken out from the component supply unit 5 to the component transport stage 6. Component supply unit 7 to be supplied, component 4 supplied to the component transfer stage 6 to receive and mount stage 3
The structure is provided with a mounting head 8 to be mounted on the upper package 2, an imaging means 9 for capturing the positional information (position, posture, shape, etc.) of the component 4 and the package 2 before mounting, and the like. The detailed configuration and function of the will be described below.

A tray 10 on which the packages 2 are aligned and loaded is detachably mounted on each of the two mounting stages 3, and a heater 11 is built in the tray mounting portion. 2 is heated appropriately.

Each mounting stage 3 is connected to the control device 3
It is connected to a driving means (not shown) that operates according to a command from 0, and can be moved left and right over a mounting area below the mounting head 8 and a standby position that is deviated to the left and right from the mounting area.
Moreover, it is configured to be movable in the front-back direction.

As shown in FIG. 2, the tray 10 is pressed against the mounting stage 3 by an appropriate load by the tray pressing member 12 provided on the upper surface of the tray 10 so as not to be warped by heating. The tray pressing member 12 has an opening 13 for exposing the package 2 and a large number of protrusions 14 provided at appropriate places on the lower surface of the tray pressing member 12 to press the tray 10 at a plurality of points in a point contact state. There is. By pressing the tray 10 in the point contact state in this manner, the tray pressing member 12 itself is prevented from warping and deforming due to heating or the like.
0 is completely adhered to the mounting stage 3 and the heater 11
The heat from is efficiently transmitted to the tray 10 so that each package 2 is uniformly heated. It should be noted that the present invention is not limited to supplying components to the combination of the tray 10 and the package 2, and may be a component supplying components such as a printed circuit board or an alumina substrate. When a printed circuit board or the like is used as the mounting target, the conductor electrodes on the circuit board may be used as alignment marks for image pickup for component mounting, or dedicated alignment marks may be provided.

The component supply unit 7 can be moved up and down and horizontally by a driving means (not shown) connected to the control device 30, and the components 4 lined up and accommodated in the component supply unit 5 are suction-held one by one by the suction nozzle 15. Then, it is carried out and supplied to the upper surface of the component carrying stage 6.

The component carrying stage 6 is also connected to a drive means A (not shown in FIG. 1) which will be described later and which operates according to a command from the control device 30, and mounts the component 4 supplied by the component supply unit 7. The head 8 is configured so that it can be moved up and down and left and right so as to be carried into the vertical movement locus and delivered to the mounting head 8. A reflecting member 16 (a prism, a reflecting mirror, a half mirror, or the like is used) that constitutes a part of the imaging unit 9 is provided on a side portion of the component carrying stage 6.

The mounting head 4 has a component transfer stage 6
Is provided with a component holder 17 such as a suction nozzle that receives the component 4 carried in the vertical movement locus, and is configured to be vertically movable between an upper standby position and a lower mounting position, and the angle of the retained component 4 The component holder 17 is configured to be rotationally controllable about the vertical axis in order to change

The image pickup means 9 includes the component 4 held by the component holder 17 of the mounting head 4, the package 2 on the tray 10, the reflecting member 16 provided on the component carrying stage 6, and the reflecting member 18 for fixing the position. It is composed of a camera 19 for a component and a camera 20 for a package, which are imaged through.

The basic structure of the component mounting apparatus according to the present invention is as described above.

Next, the drive means A for moving the component carrying stage 6 up, down, left and right will be described with reference to FIGS. 14 and 15. FIG. 14 is a perspective view schematically showing the entire driving means A, and FIG. 15 is a perspective view showing a schematic structure of a main part of the driving means A.

As shown in FIGS. 14 and 15, a Y-axis stage 26 as a front-back driving means and a Z-axis stage 27 as a vertical driving means are provided with a frame 28 as a base portion.
(Fixed to the device frame 1),
The X-axis stage 29 as a left-right driving unit is installed on a slide portion (details not shown) of the Y-axis stage 26. X-axis stage 29, Y-axis stage 26, and Z
Each of the shaft stages 27 is equipped with a linear actuator as a driving means.

Since the X-axis stage 29 is moved in the Y-axis direction (front-back direction) by the Y-axis stage 26, the linear guide rail 30 of the X-axis stage 29 is movable in the Y-axis direction.

Therefore, this linear guide rail 30
The left and right slide portion 41, which is slidably guided by and is moved in the left-right direction by the X-axis stage 29, is movable in the X-axis direction (left-right direction) and the Y-axis direction.

The linear guide rail 42 attached to the left and right slide portions 41 is constructed so that the second connecting portion 43 can be slidably guided in the Z-axis direction (vertical direction).

A vertical slide portion 44 that is vertically moved by the Z-axis stage 27 is provided, and the first connecting portion 46 is slidably guided in the horizontal direction on the vertical slide portion 44. A linear guide rail 45 is provided for this purpose.

Therefore, this linear guide rail 45
The first connecting portion 46 guided by is the linear guide rail 4
Since 5 moves in the Z-axis direction, it can move in the X-axis and Z-axis directions.

The first connecting portion 46 and the second connecting portion 4
3 are coupled to each other via linear guide rails 47 in a state of being relatively slidably guided in the front-rear direction.

The component carrying stage 6 is connected to the front end portion of the second connecting portion 43 in the front-rear direction.

Therefore, the driving force in the Z-axis direction to the second connecting portion 43 is applied from the Z-axis stage 27 to the vertical slide portion 4.
4, transmitted through the linear guide rail 45, the first connecting portion 46, and the linear guide rail 47.

The range of movement in the Y-axis direction is limited to a small range for position adjustment in the Y-axis, and is set smaller than the range of movement in the X-axis direction and Z-axis direction.

With the configuration of the driving means A described above, the component mounting portion 6a attached to the component carrying stage 6 and the reflecting member 16 including the prism are moved by the X-axis stage 29, the Y-axis stage 26, and the Z-axis stage 27 to the X-axis stage 29. Axis, Y axis, Z
It can move in the axial direction, the movable mass can be reduced, and the tact time can be shortened.

That is, the Z-axis stage 27 mainly has the vertical slide portion 44, the connecting portion 47, the second connecting portion 43, and the component carrying stage 6 as movable masses, and includes the X-axis stage 29 and the Y-axis. The stage 26 is not moved in the Z-axis direction. The Y-axis stage 26 is mainly used for X-axis.
Axis stage 29, left and right slide portion 41, second connecting portion 4
3. The component transfer stage 6 is a movable mass and is not moved in the Y axis direction including the Z axis stage 27. The X-axis stage 29 mainly has the left and right slide portions 41, the first connecting portion 46, the second connecting portion 43, and the component carrying stage 6 as movable masses, and the X-axis stage 27 and the X-axis stage 27 are included. It does not move in the axial direction.

Therefore, the moving parts for the X-axis stage 29, the Y-axis stage 26, and the Z-axis stage 27 can be downsized, and the small and lightweight moving parts can be driven. 6 can be operated lightly and quickly, and the tact time can be shortened.

Next, the component mounting operation will be described in the order of steps with reference to FIGS. The transfer from the component supply unit 7 to the component supply stage 6 is not limited to the transfer of the component 4 in the same posture, and the component 4 may be inverted and then transferred as shown in FIG.

(1) When it is confirmed that the mounting of the component 4 into the package 2 is completed as shown in FIG. 4, the mounting head 8 starts to rise as shown by the phantom line in FIG. At the same time, the component transfer stage 6 advances toward the movement path of the mounting head 8. In this case, a camera 23 for picking up an image of the conveyed component 4 is provided above the horizontal movement path of the component conveying stage 6, and the captured image information is
It is used for alignment when the component 4 is transferred to the mounting head 8. The camera 23 constitutes means for optically recognizing the component holding state before the component transport stage 6 transports the component 4 to the mounting head 8. The position of the component 4 before the component 4 is transferred to the mounting head 8 is corrected on the component transfer stage 6 based on the result of this imaging.

(2) As shown in FIG. 5, when the mounting head 8 rises, the mounting stage 3 moves horizontally in the pitch and sets the package 2 to be mounted next to the position directly below the mounting head 8.

(3) When the mounting head 8 rises to a certain height, the component carrying stage 6 which holds the component 4 and moves in the horizontal direction moves upward while slipping directly under the mounting head 8 which is being raised.

(4) Here, the control device 30 is operated to perform at least either deceleration control of the ascending speed of the mounting head 8 or acceleration control of the ascending speed of the component carrying stage 6. By gradually reducing the rising speed difference between the mounting head 8 and the component conveying stage 6, as shown in FIG. 6, the mounting head 8 is made to catch up with the component conveying stage 6 during the raising operation of the mounting head 8, so that the component 4 is removed. It is delivered to the component holder 17 of the mounting head 8.

(5) As shown in FIG. 7, when the mounting head 8 reaches the upper standby position after the components are transferred, the component transfer stage 6 moves laterally while descending, and the components held by the mounting head 8 are moved. 4 and the package 2 located immediately below the reflection member 16 so that the component camera 1
The component 4 and the package 2 are imaged by the camera 9 and the package camera 20, respectively.

In this case, as shown in FIG. 12, the image is taken at a position where the length of the optical path from the reflecting member 16 to the component camera 19 and the length of the optical path from the reflecting member 16 to the packaging camera 20 are equal. In addition, it is desirable to reduce the imaging error due to the vertical vibration of the reflecting member 16.

Further, in this image pickup process, the transparent plate 21 which is normally retracted is horizontally moved to cover the package 4 from above, and an image pickup error due to fluctuation of air warmed by the heat for heating the package. Suppress. Further, by blowing the air from the air blower 22 above the transparent plate 21 that covers the package 2 to remove the fluctuation of the air above the transparent plate 21, the imaging error can be further reduced. In this case, the wind from the blower 22 is not blocked by the transparent plate 21 and is not directly blown to the package 2, so that the temperature of the package 2 does not decrease.

The image pickup is performed a plurality of times, and the image pickup data is averaged according to a predetermined procedure stored and set in the control device 30 to further improve the accuracy of the position information.

(6) The obtained positional information is arithmetically analyzed in the control device 30 to determine the positional deviation between the component 4 and the package 2. Based on the displacement amount, the mounting head 8
The positional deviation is corrected by the rotation of the component holder 17 and the two-dimensional movement of the mounting stage 3 in the horizontal direction.

(7) As shown in FIG. 8, the component carrying stage 6 is horizontally returned to the standby position for receiving the component supply, and the mounting head 8 is moved downward to place the component 4 on the heated package 2. It is installed by pressing.

(8) With the above, one component mounting process is completed, and the above operation is repeated thereafter.

(9) While the component mounting process is being performed on the one mounting stage 3, the package 2 to be processed next is preheated on the other mounting stage 3.

(10) When the component mounting process on one of the mounting stages 3 is completed, as shown in FIG. 9, the mounting stage 3 moves to the standby position outside the mounting area below the mounting head and The other mounting stage 3 waiting while performing the preliminary overheat treatment is moved to the mounting area, and the component mounting process for the package group mounted on the other mounting stage 3 is performed by the above procedure.

(11) Then, on the mounting stage 3 retracted from the mounting area to the standby position, the tray 10 after the component mounting process is carried out and the tray 10 on which the new package 2 is mounted is loaded.

[Other Embodiments] FIG. 10 and FIG.
Another embodiment of the invention is shown.

The basic structure of this example is the same as that of the previous example, but is different in the following points. That is, a recognition portion 24 that can be imaged at the same time as the component 4 is provided near the suction nozzle 17 of the mounting head 8, and as shown in FIG. 13A, the displacement amount δ when the reflecting member 16 vibrates in the vertical direction. Is used to correct the relative positional deviation amount 2δ between the component 4 and the mounting target 2.

An acceleration sensor 25 as an example of means for detecting the vertical vibration amplitude of the reflecting member 16 is mounted on the component carrying stage 6, and the detection result is integrated to calculate the time of photographing. It is possible to measure the vertical shift amount of the reflecting member 16. A displacement sensor that directly detects the vibration amplitude can also be used as a means for detecting the vibration amplitude in the vertical direction of the reflecting member.

Further, the mounting head 8 of the component carrying stage 6
The forward / backward movement direction with respect to the vertical movement path is set to a direction orthogonal to the optical axes of the incident light and the reflected light on the reflecting member 16 provided in the component carrying stage 6.

[0070]

As is apparent from the above description, according to the present invention, the following effects can be expected.

According to the component mounting apparatus of the first aspect of the invention, by mounting the reflecting member constituting the image pickup means on the component conveying means, the component conveying means is retracted after the component is delivered to the mounting head. The parts and the object to be mounted can be imaged, and the time required from the delivery of the parts to the imaging is shortened, which is effective in shortening the tact time. Further, since the drive structure for moving the reflecting member of the image pickup means is common to the component carrying means, it is effective for downsizing of equipment and cost reduction. Further, when the camera is moved, the wiring of the camera may be broken, but since the camera is fixedly arranged on the optical path from the component bent through the reflecting member and the mounting target, The defect disappears. Further, in the image pickup means, the reflecting member is attached to the component conveying means, and the camera is separately fixed, so that it is possible to suppress an increase in weight and an increase in size of the entire component conveying means.

According to the component mounting apparatus of the second aspect of the invention, the component holding position on the mounting head can be made appropriate, and the component mounting accuracy can be improved.

According to the component mounting apparatus of the third aspect of the present invention, the tact time can be further shortened by simultaneously imaging the component and the mounting target. Further, since it is not necessary to move the mounting head in the XY directions after the image pickup, the positioning error after the image pickup can be minimized.

According to the component mounting apparatus of the fourth aspect of the present invention, the image pickup error due to the vertical displacement of the reflecting member mounted on the component conveying means can be reduced, so that the mounting accuracy can be improved.

According to the component mounting apparatus of the fifth aspect of the present invention, the image pickup error due to the vertical displacement of the reflecting member mounted on the component conveying means can be reduced, so that the mounting accuracy can be improved.

According to the component mounting apparatus of the sixth aspect of the invention, the components are delivered within the original movement time of the mounting head, so that the tact time can be shortened and the processing efficiency can be improved. Become. Further, in the step of delivering the component from the component transporting means to the mounting head, the component can be delivered while reducing the relative movement speed of the component transporting means and the mounting head, so that the impact damage to the component can be reduced. .

According to the component mounting apparatus of the seventh aspect of the invention, a part of the components of the component conveying means and the image pickup means provided in the component conveying means are movable in the vertical direction, the horizontal direction and the front-back direction. In addition, since the movable mass for the movement can be made as small as possible, the movement tact time of the component conveying means in the component conveying operation can be shortened.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of a component mounting apparatus according to the present invention.

FIG. 2 is a front view showing a schematic configuration of a component mounting apparatus according to the present invention.

FIG. 3 is a perspective view of the tray pressing member viewed from the back surface side.

FIG. 4 is a front view showing a component mounting process.

FIG. 5 is a front view showing a component mounting process.

FIG. 6 is a front view showing a component mounting process.

FIG. 7 is a front view showing a component mounting process.

FIG. 8 is a front view showing a component mounting process.

FIG. 9 is a front view showing a component mounting process.

FIG. 10 is a perspective view showing a schematic configuration of another embodiment of the present invention.

FIG. 11 is a front view showing a schematic configuration of another embodiment of the present invention.

FIG. 12 is an operation explanatory view of the reflecting member against rotational vibration.

FIG. 13 is an operation explanatory diagram of vertical and horizontal vibrations of the reflecting member.

FIG. 14 is a perspective view schematically showing the whole driving means for driving the component carrying means.

FIG. 15 is a perspective view showing a schematic structure of a main part of a driving unit that drives a component conveying unit.

FIG. 16 is a front view showing a schematic configuration of a conventional example.

FIG. 17 is a front view showing a schematic configuration of another conventional example.

FIG. 18 is a schematic front view showing a component mounting process of a conventional example.

[Explanation of symbols]

2 Target object 3 mounting stage 4 parts 6 Parts transfer means (Parts transfer stage) 8 mounting heads 9 Imaging means 16 Reflective member 19 cameras 20 cameras 24 recognition sites 27 Z-axis stage (vertical drive means) 28 frames (base) 29 X-axis stage (left and right driving means) 41 Left and right slide 43 Second connection part 44 Vertical slide part 46 First connection part

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toshiyuki Ishibe             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. F-term (reference) 5E313 AA02 AA11 AA23 AA31 CC04                       DD02 DD03 DD07 DD21 DD50                       EE02 EE03 EE24 EE35 FF24                       FF26 FF28 FF33 FG01 FG06                       FG10                 5F047 FA14 FA73 FA79 FA83

Claims (7)

[Claims] 1. A component held and carried by a mounting head is mounted on a mounting target mounted on a mounting stage, and a component held by the mounting head and a mounting target on the mounting stage are mounted. An image pickup unit including a camera for picking up an image of an object and a reflecting member for bending an optical path from the component and the mounting target is provided, and the relative position of the component and the mounting target is corrected based on the position information obtained by the imaging. In the component mounting apparatus configured, the component transporting means for supplying and transporting the component to the mounting head is arranged so as to be able to move in and out of the moving path of the mounting head, the reflecting member is mounted on the component transporting means, and the camera is set to the reflection unit. A component mounting apparatus characterized in that it is fixedly arranged on an optical path from a component bent through a member and a mounting target. 2. The component mounting apparatus according to claim 1, further comprising means for optically recognizing a component holding state before the component transporting unit transports the component to the mounting head. 3. The component mounting apparatus according to claim 1, wherein the imaging unit is configured to simultaneously image the component and the mounting object in a state where the component held by the mounting head faces the mounting object. Part mounting device. 4. The component mounting apparatus according to claim 1, further comprising means for detecting a vertical vibration amplitude of the reflecting member provided in the component transporting means. 5. The component mounting apparatus according to claim 1, wherein the mounting head includes a recognition portion that is imaged at the same time as the component. 6. The component mounting apparatus according to claim 1, wherein the mounting head is capable of moving toward and away from an object to be mounted, and a head moving direction capable of moving in and out of a head moving path. The moving speed of at least one of the component transporting means and the mounting head such that the component transporting means and the mounting head are relatively close to each other while moving the component transporting means in the head moving direction while the mounting head is moving. A component mounting apparatus comprising: a control unit. 7. The component mounting apparatus according to claim 6, wherein the component transporting means is fixedly mounted to a base of the component mounting apparatus in order to move the component transporting unit in a vertical direction corresponding to the head moving direction. A certain up-and-down driving means, an up-and-down sliding portion that can move in the up-and-down direction by the up-and-down driving means, and a first connecting portion that moves up and down together with the up-and-down sliding portion and can move in the left-and-right direction with respect to the up-and-down sliding portion, A left-right direction driving means for moving the first connecting portion in the left-right direction in order to move the component carrying means in the left-right direction corresponding to the direction of movement in and out of the head movement locus; A left and right slide part that is movable in the left and right direction, and a second connection part that is slidable in the front-rear direction with the first connection part and that is slidable in the up and down direction with the left and right slide part. In addition, the component mounting device is characterized in that the component transfer means is provided in the second connecting portion.