JP2006243617A - Reflective mirror device, manufacturing method for the same and component mounting head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To hinder distortion of the surfaces (reflecting surfaces) of reflective mirrors in a reflective mirror device in which the reflective mirrors are held on a mirror holding member using an adhesive material. <P>SOLUTION: The reflective mirror device includes the reflective mirrors of a rectangular flat plate, and a mirror holding member having a mirror disposition faces on which almost the entire backs of the corresponding reflective mirrors are disposed. The reflective mirrors are disposed such that their backs are in direct contact with the corresponding mirror disposition faces of the mirror holding member. A pair of opposite side faces of the reflective mirrors are partially joined and fixed to the mirror holding member via an adhesive material at their bonded positions opposite to each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a reflection mirror device that holds a reflection mirror on a mirror holding member by using an adhesive material, a method of manufacturing the reflection mirror device, and a reflection portion that reflects an image of a component mounted on a circuit board so as to be imaged. The present invention also relates to a component mounting head using the reflecting mirror device.

  Conventionally, various reflection mirror devices are known. For example, there is a reflection mirror device having a structure in which an adhesive is applied to the arrangement surface of the mirror arrangement base on which the reflection mirror is arranged, and the back surface of the reflection mirror is adhered to the arrangement surface via the adhesive.

  Such a reflection mirror device is often used to configure various forms of optical axis paths in an optical device or the like. For example, a component such as a semiconductor chip is mounted (mounted) on a circuit board with high positional accuracy. It is used in a component imaging device for recognizing a component holding posture in a component mounting head. In such an application, in order to ensure the high positional accuracy, it is required to acquire the image of the holding posture of the component with high accuracy by the component imaging device via the reflection mirror device. Accordingly, it is desired that the reflection mirror device and the mirror holding base are manufactured and processed with high accuracy in the reflection mirror device so that the reflection angle deviation due to the reflection mirror does not occur or can be reduced in the bonded and fixed state. Yes.

Japanese Utility Model Publication No. 4-109712

  However, such a conventional reflection mirror device employs a configuration in which an adhesive is interposed between the back surface of the reflection mirror and the arrangement surface of the mirror arrangement base, and the reflection mirror is bonded and fixed. Even if the processing accuracy of the mirror and the mirror arrangement base is improved, there is a problem that it is unavoidable that partial distortion occurs on the surface (reflection surface) of the reflection mirror due to adhesion by the adhesive.

  As a cause of the occurrence of distortion on the surface of the reflection mirror as described above, it is conceivable that the adhesive stress varies depending on the location on the back surface of the reflection mirror or the adhesive coating thickness varies. However, it is practically difficult to make such variations uniform.

  In the conventional reflection mirror device, in order to suppress the occurrence of distortion on the surface of the reflection mirror caused by such adhesive fixing with an adhesive as much as possible, for example, various contrivances including the contrivance as in Patent Document 1 are performed. ing. However, in either case, the back surface of the reflecting mirror is bonded and fixed to the arrangement surface of the mirror holding base with an adhesive interposed therebetween, and it is possible to achieve significant suppression of the above-described variation. There is a problem that it is difficult.

  In addition, when the surface of the reflecting mirror is distorted in the reflecting mirror device as described above, for example, in a component mounting head using the reflecting mirror device, a deviation occurs in the optical axis for imaging the image of the component. There is a problem in that it may be difficult to achieve high-precision component mounting.

  Accordingly, an object of the present invention is to solve the above-described problem, and in a reflection mirror device in which a reflection mirror is held on a mirror holding member using an adhesive material, distortion on the surface (reflection surface) of the reflection mirror is reduced. A reflection mirror device capable of suppressing generation, a method of manufacturing the reflection mirror device, and a component mounting head using the reflection mirror device in a reflection portion that reflects an image of a component mounted on a circuit board so as to be imaged It is to provide.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a flat plate-shaped reflection mirror;
A mirror holding member having a mirror arrangement surface on which substantially the entire back surface of the reflection mirror is arranged,
The mirror back surface is directly disposed on the mirror arrangement surface of the mirror holding member, and the pair of side surfaces facing each other of the reflecting mirrors are bonded to each other through an adhesive material at respective bonding positions facing each other. Provided is a reflection mirror device characterized in that it is partially bonded and fixed to a holding member.

  According to the second aspect of the present invention, the respective bonding positions of the pair of side surfaces facing each other of the reflecting mirror are bonded and fixed to the mirror arrangement surface of the mirror holding member via the adhesive material. A reflecting mirror device according to the first aspect is provided.

  According to the third aspect of the present invention, each of the bonding positions of the pair of side surfaces of the reflecting mirror facing each other is adjacent to the mirror arrangement surface of the mirror holding member via the adhesive material. The reflection mirror device according to the first aspect, which is adhesively fixed to a side surface, is provided.

  According to the 4th aspect of this invention, the said back surface of the said reflective mirror and the said mirror arrangement | positioning surface of the said mirror holding member are directly in contact without passing through the said adhesive material. A reflection mirror device according to any one of the above is provided.

According to the fifth aspect of the present invention, the mirror holding member is arranged at each end of the mirror arrangement surface facing each other, and the set of the reflecting mirrors in the state arranged on the mirror arrangement surface. It has a side wall for defining the side surface that defines the position of the side surface,
Each of the side surface defining side wall portions has a through-hole portion formed in a portion corresponding to each of the bonding positions of the reflection mirror,
The reflection according to any one of the first to fourth aspects, wherein the adhesive material is supplied to the respective bonding positions from the outside of the respective side surface defining side wall parts through the respective through-hole parts. A mirror device is provided.

  According to a sixth aspect of the present invention, there is provided the reflecting mirror device according to the fifth aspect, wherein substantially the entire inside of each through hole is filled with the adhesive material.

  According to the seventh aspect of the present invention, each of the adhesive materials supplied to the respective adhesion positions of the reflection mirror has a surface opposite to the adhesion surface to the respective adhesion positions, and the mirror holding member. The reflection mirror device according to any one of the first to sixth aspects is provided.

  According to the eighth aspect of the present invention, the length dimension in the direction along the surface of the reflecting mirror of the respective adhesion positions on the respective side surfaces is 1/2 to 1/4 of the length dimension of the entire side surface. The reflection mirror device according to any one of the first to seventh aspects, which has a double length dimension, is provided.

According to the ninth aspect of the present invention, the plurality of component holding members that hold the components releasably are arranged in a line, and the plurality of components held by the respective component holding members can be mounted on the circuit board. In the component mounting head,
An image sensor unit capable of capturing an image of the component held by the component holding member along the optical axis with an axis different from the axis of the component holding member as the optical axis, and the component A reflection unit configured to reflect the image of the component in the direction along the axis of the holding member along the optical axis of the imaging element unit and enter the imaging element unit, and is held by the component holding member; A component imaging device capable of capturing an image of the component in a direction along the axis of the component holding member;
A moving device for moving the component imaging device between the component holding members arranged at both ends of the row along the arrangement direction of the component holding members;
While moving the component imaging device along the arrangement direction by the moving device, the component imaging device sequentially captures images of the components held by the respective component holding members, and the captured each of the captured images. A control device capable of recognizing the holding posture of the component by each of the component holding members based on the image of the component;
Provided is a component mounting head characterized in that the reflection mirror device according to any one of the first to eighth aspects is used as the reflection part.

According to the tenth aspect of the present invention, the flat plate-shaped reflection mirror is arranged on the mirror arrangement surface of the mirror holding member, and substantially the entire back surface of the reflection mirror is brought into direct contact with the mirror arrangement surface. ,
Thereafter, a pair of side surfaces facing each other of the mirror are partially bonded and fixed to the mirror holding member via an adhesive material at respective bonding positions facing each other. I will provide a.

  According to an eleventh aspect of the present invention, there is provided a method in which the respective bonding positions on the pair of side surfaces facing each other of the reflecting mirror are bonded and fixed to the mirror arrangement surface of the mirror holding member via the bonding material. The manufacturing method of the reflective mirror apparatus as described in 10th aspect is provided.

  According to a twelfth aspect of the present invention, the bonding positions of the pair of side surfaces of the reflecting mirror facing each other are set to be adjacent to the mirror arrangement surface of the mirror holding member via the adhesive material. The manufacturing method of the reflective mirror apparatus as described in the 10th aspect which adheres and fixes to a side surface is provided.

  According to the present invention, in the reflection mirror device, substantially the entire back surface of the reflection mirror is brought into direct contact with the mirror arrangement surface without arranging an adhesive material between the reflection mirror and the mirror arrangement surface. In this state, the side surfaces facing each other of the reflection mirror are partially adhered and fixed to the mirror holding member via an adhesive material, thereby causing variations in the coating thickness of the adhesive material and the adhesive material on the back surface of the reflection mirror. It is possible to reliably suppress or greatly reduce the occurrence of distortion on the reflecting surface of the reflecting mirror due to the variation in stress due to the above.

  Therefore, it is possible to provide a reflection mirror device that suppresses or reduces the occurrence of distortion on the reflection surface and has high accuracy of the reflection axis.

  In addition, by using such a reflection mirror device as a reflection part for imaging an image of a component in the component mounting head, it is possible to realize high-accuracy component recognition and cope with high-accuracy component mounting. .

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  In describing a reflection mirror device according to an embodiment of the present invention, first, the structure of a head unit 100 which is an example of a component mounting head in which the reflection mirror device is used will be described. In the description, a schematic side view (with a partial cross section) of the head unit 100 is shown in FIG.

  As shown in FIG. 1, the head unit 100 is a suction nozzle 11 that is an example of a component holding member that can releasably hold an electronic component 1 that is an example of a component on a holding surface 11 a that is a tip of the electronic component 1. A plurality of, for example, 8, are arranged in a line at a constant interval pitch.

  Such a head unit 100 is provided in an XY robot or the like in an electronic component mounting apparatus (not shown), thereby performing an electronic component mounting operation on a circuit board held on the stage of the electronic component mounting apparatus. be able to. Specifically, the plurality of electronic components 1 supplied by the electronic component supply unit in the electronic component supply apparatus are sucked and held by the respective suction nozzles 11 included in the head unit 100, and the head unit 100 is driven by the XY robot. Is moved above the circuit board to align the mounting position of the electronic component 1 on the circuit board with the electronic component 1 sucked and held by the suction nozzle 11 of the head part 100, and then the head part. By lowering the suction nozzle 11 at 100, the electronic component 1 can be mounted at the mounting position of the circuit board.

  When such an electronic component 1 is mounted, an image of the electronic component 1 sucked and held by each suction nozzle 11 of the head unit 100 is picked up by a component image pickup device provided in the head unit 100, and each electronic component 1 is picked up. The suction holding posture of the component 1 is recognized, and based on these recognition results, the positional deviation between the respective suction holding posture and the mounting posture of each electronic component 1 on the circuit board is corrected, respectively. The electronic component 1 is mounted on the circuit board.

  The structure of the head unit 100 will be described in detail below with a focus on the structure of the component imaging unit. FIG. 2 is a schematic cross-sectional view along a plane orthogonal to the arrangement direction of the suction nozzles 11 of the head unit 100.

  As shown in FIGS. 1 and 2, in the head portion 100, eight shaft portions 51 are arranged in a line at a constant interval, and the suction nozzle 11 is disposed at the tip of each shaft portion 51. Each is detachably equipped. Each shaft portion 51 is supported on a head frame 52 formed of a rigid body through a spline nut, a bearing, and the like so as to be able to move up and down along its axis and to be rotatable around the axis. . Further, the head unit 100 includes an elevating device 53 that performs the elevating operation of each shaft unit 51 and a rotating device 54 that performs the rotating operation. The elevating device 53 and the rotating device 54 are heads. It is fixed to the frame 52. Each lifting / lowering device 53 includes a mechanism using a ball screw shaft and a nut portion (used in this embodiment), which is a mechanism generally used in such a head portion, and a mechanism using an air cylinder. Etc. can be used. In addition, a mechanism for rotating the shaft portion 51 via a belt (used in the present embodiment), a mechanism for directly rotating the shaft portion 51, or the like can be used for each rotating device 54.

  Further, as shown in FIGS. 1 and 2, each suction nozzle 11 provided in the head unit 100 has a holding surface 11 a that is a tip part thereof exposed from a lower frame 52 a that is a lower part of the head frame 52. It is in a state. In the lower frame, as the component imaging device, an image of the mounting surface of the electronic component 1 held by the suction nozzle 11 on the circuit board on the lower surface side (that is, the suction holding posture of the electronic component 1 by the suction nozzle 11). A component imaging device 20 capable of capturing an image) is provided. A partial enlarged cross-sectional view of the component imaging apparatus 20 is shown in FIG.

  As shown in FIG. 3, the component imaging device 20 is disposed on the left side of the respective suction nozzles 11 in the drawing, and the two suction mirrors 31 and 32 are disposed on the optical axis of the suction nozzles 11. An example of an image pickup device unit that can pick up an image of the electronic component 1 sucked and held on the holding surface 11a from the lower side in the drawing, that is, an image of a mounting surface (an example of a component image pickup plane) of the electronic component 1 The camera unit 23 is provided. In addition, the component imaging device 20 includes an imaging frame 24 that is an example of a support member having a substantially U-shaped cross-sectional shape arranged so as to surround the suction nozzle 11 without interfering with the suction nozzle 11. In addition, the camera unit 23 and the reflecting mirrors 31 and 32 are fixed to the imaging frame 24 in a state in which the positional relationship is maintained. Further, such two reflection mirrors 31 and 32 are fixed to the mirror arrangement base 33 and further fixed to the imaging frame 24 via the mirror arrangement base 33. The reflecting mirror device 30 is configured by the reflecting mirrors 31 and 32 and the mirror arrangement base 33.

  Further, as shown in FIG. 3, the camera unit 23 is arranged downward in the figure with the optical axis thereof being inclined about 40 degrees toward the suction nozzle 11 side with respect to the axis of the suction nozzle 11. ing. In addition, the reflection mirror 31 which is also an example of the reflection unit arranged on the left side of the drawing has a reflection surface inclined toward the suction nozzle 11 on the optical axis and inclined approximately 65 degrees with respect to the axis. The reflection mirror 32, which is also an example of the reflection unit arranged on the right side of the figure, is inclined by approximately 45 degrees with respect to the axis so that the reflection surface thereof faces the reflection surface of the reflection mirror 31. And it arrange | positions so that it may be located under the suction nozzle 11 on the axial center of the suction nozzle 11.

  Also, as shown in FIGS. 1 and 3, the component imaging device 20 faces each other through the suction nozzles 11 along the arrangement direction of the suction nozzles 11 provided in the head unit 100. , And two linear guide rails 25 having an elongated bar shape fixed to the lower surface of the lower frame 52a (this linear guide rail 25 is also an example of a support member). Linear guide sliders 26 having a substantially concave cross-sectional shape fixed to the respective upper ends of the substantially U-shaped cross-sectional shape of the imaging frame 24 (the linear guide slider 26 is also an example of a support member) are engaged. Has been. In addition, each linear guide slider 26 is engaged with each linear guide rail 25 and extends along the longitudinal direction of each linear guide rail 25 (that is, the arrangement direction of each suction nozzle 11). The slide movement is possible. That is, the imaging frame 24 that fixes and supports the camera unit 23 and the respective reflection mirrors 31 and 32 is supported by the lower frame 52 a via the respective linear guide sliders 26 and the respective linear guide rails 25. In addition, while being guided by the respective linear guide rails 25, it is possible to slide along the direction in which the respective suction nozzles 11 are arranged.

  Further, as shown in FIGS. 1 and 3, the component imaging device 20 slides the imaging frame 24 along the arrangement direction of the respective suction nozzles 11 while being guided by the respective linear guide rails 25. The slide drive unit 27 includes a drive motor 28, and the drive direction of the drive motor 28 is rotated in either the forward or reverse direction, whereby the above-described arrangement direction of the imaging frames 24 is provided. It is possible to perform a slide movement (reciprocal movement) along. As shown in FIG. 1, the drive motor 28 is fixed to the head frame 52, and the fixing position thereof is shown in FIG. 3 (the drive motor 28 is not shown in FIG. 3) via the suction nozzle 11. Thus, the position can be opposed to the camera unit 23. That is, in FIG. 3, the camera unit 23 is arranged and fixed on the left side of the drawing with respect to the suction nozzle 11, the drive motor 28 is arranged and fixed on the right side of the drawing, and the drive motor 28 is connected to the camera unit. It is installed away from 23 installation positions.

  Further, as shown in FIGS. 1 and 3, the slide drive unit 27 includes a drive belt 29 that is engaged with the drive shaft of the drive motor 28 and can travel by the rotational drive of the drive motor 28. The drive belt 29 is disposed along the arrangement direction of the suction nozzles 11, and a part of the drive belt 29 is fixed to an arm 24 a that is a portion protruding upward in the upper right of the imaging frame 24 in FIG. 3. Thereby, the slide drive of the imaging frame 24 is enabled by the rotational drive of the drive motor 28 via the drive belt 29 and the arm 24a. The drive belt 29 and the arm 24a are disposed so as to face the camera unit 23 via the suction nozzle 11 in FIG. 3, as in the installation position of the drive motor 28.

  Further, the range of the slide movement of the imaging frame 24 by the slide drive unit 27 is from the position of the imaging frame 24 on the left side (shown in the solid line in the figure) shown in FIG. ) Until the position. That is, the sliding movement of the imaging frame 24 is possible so that all the eight suction nozzles 11 included in the head unit 100 pass through the inside of the imaging frame 24 in the substantially U-shaped cross section.

  In addition, since the imaging frame 24 is slidable in this way, the camera unit 23 and the reflection mirrors 31 and 32 (that is, the reflection mirror device 30) fixed to the imaging frame 24 can be moved in the imaging frame. 24, the sliding movement is possible in a state where the respective arrangement relations are maintained. As a result, the respective electronic components 1 sucked and held by the holding surfaces 11a of the eight suction nozzles 11 included in the head unit 100 are moved downward by the camera unit 23 via the respective reflecting mirrors 31 and 32. It is possible to take an image from the side (that is, the direction along the axis of the suction nozzle 11).

  Note that in the component imaging device 20, a plurality of illumination units that can irradiate light along the optical axis of the camera unit 23 and irradiate the electronic component 1 held by suction by the suction nozzle 11. In the state where these illumination units are turned on, images of the respective electronic components 1 are taken.

  Further, in the head unit 100, a control unit that is an example of a control device that recognizes and holds the suction holding posture of the electronic component 1 by the suction nozzle 11 based on the image of each electronic component 1 captured by the component imaging device 20. 9 is provided. The control unit 9 can control the lifting / lowering operation of each lifting / lowering device 53 provided in the head unit 100 and the rotating operation of each rotating device 54. Furthermore, the control unit 9 can control the operation of irradiation / stopping of each light by each of the illumination units in association with the movement operation of the imaging frame 24 during the imaging. .

  Next, the configuration of the reflection mirror device 30 provided in the component mounting head 100 having such a configuration will be described below.

  First, with respect to the structure of the mirror arrangement base (which is an example of a mirror holding member) 33 in the reflection mirror device 30, a plan view in a state where the reflection mirrors 31 and 32 are not arranged is shown in FIG. 4, and a side view is shown in FIG. Further, FIG. 6 shows a cross-sectional view taken along line AA in the mirror arrangement base 33 of FIG.

  As shown in FIGS. 4, 5, and 6, the mirror arrangement base 33 includes a mirror arrangement surface 34 on which the reflection mirror 31 is arranged, a mirror arrangement surface 35 on which the reflection mirror 32 is arranged, and the suction nozzle 11. And a base side wall portion 36 provided at the end of each mirror arrangement surface 34, 35 in the arrangement direction (that is, the vertical direction in FIG. 4 and the direction perpendicular to the drawings in FIGS. 5 and 6). Are integrally formed. As shown in FIG. 4, a substantially rectangular opening 37 is formed between the mirror arrangement bases 33 and 35, that is, between the mirror arrangement surfaces 34 and 35. Furthermore, brackets 38 and 39 for fixing to the imaging frame 24 are provided outside the respective base side wall portions 36 of the mirror arrangement base 33, and these brackets 38 and 39 are used to arrange the mirror with bolts. The base 33 can be detachably mounted on the imaging frame 24.

  In the mirror arrangement base 33, the mirror arrangement surface 34 is formed at an angle inclined by 65 degrees from the direction along the axis of the suction nozzle 11 and is a surface parallel to the arrangement direction of the suction nozzles 11. The mirror arrangement surface 35 is formed at an angle inclined by 45 degrees from the direction along the axis, and is formed as a surface parallel to the arrangement direction of the respective suction nozzles 11. Further, the mirror arrangement surface 34 is processed and formed so that the back surface of the reflection mirror 31 can be arranged, and has a size such that substantially the entire back surface can be arranged. Similarly, the mirror arrangement surface 35 is processed and formed so that the back surface of the reflection mirror 32 can be arranged, and has a size such that substantially the entire back surface can be arranged. In the mirror arrangement base 33, each mirror arrangement surface 34 and 35 has a flat shape without being provided with a portion protruding from the slope, such as a side wall, at each end in the slope direction of the slope. is doing.

  Further, as shown in FIGS. 4, 5, and 6, the base side wall portions 33 are penetrated through the base side wall portions 33 so as to face each other at the portions where the base side wall portions 33 and the mirror arrangement surfaces 34 and 35 are in contact with each other. Holes 40 and 41 are formed. That is, a pair of through-holes 40 facing each other are formed so as to expose the mirror arrangement surface 34 from the outside of each base side wall portion 33 so as to be visible through the through-holes 40. A pair of through holes 41 facing each other are formed so as to expose the mirror arrangement surface 35 from the outside of the portion 33 so as to be visible through the through holes 41. Moreover, although each through-hole 40 and 41 has semicircle shape, for example, the case where various shapes are employ | adopted may be sufficient.

  Here, a schematic perspective view further schematically showing the configuration of the mirror arrangement base 33 having such a configuration is shown in FIG. In FIG. 7, the configuration of the mirror arrangement base 33 in the vicinity of the mirror arrangement surface 34 is shown as a representative of the mirror arrangement surfaces 34 and 35 in order to facilitate the understanding of the description. This is because, in the mirror arrangement base 33, the mirror arrangement surface 34 and the mirror arrangement surface 35 have the same configuration and function, although their inclination angles are different. Moreover, in the mirror arrangement | positioning base 33 shown in FIG. 7, the state where the reflective mirror 31 is not arrange | positioned is shown.

  As shown in FIG. 7, in the mirror arrangement base 33, a part 34 a of each end in the direction in which the base side wall 36 is provided on the mirror arrangement surface 34 is formed on each base side wall 36. Through the through hole 40, it is visible from the outside.

  FIG. 8 is a schematic perspective view showing a state in which the reflection mirror 31 is arranged so that the back surface thereof is in contact with the mirror arrangement surface 34 of the mirror arrangement base 33 in such a state. As shown in FIG. 8, the reflection mirror 31 has a flat plate shape, and is arranged on the mirror arrangement surface 34 with its reflection surface (front surface) 31a as the upper side in the drawing and its back surface 31b as the lower side in the drawing. Yes.

  Further, as shown in FIG. 8, each side surface 31 c of the reflection mirror 31 in a direction orthogonal to the tilt direction of the mirror arrangement surface 34 (that is, the arrangement direction of the respective suction nozzles 11) It is in a state of being substantially in contact with the inner side surface 36a, and thereby the arrangement of the reflection mirror 31 in the direction orthogonal to the tilt direction is defined. That is, the inner side surface 36a of each base side wall portion 36 has a function of defining the arrangement of the side surface 31c of the reflecting mirror 31, and each base side wall portion 36 is also an example of a side surface defining side wall portion. .

  Further, as shown in FIG. 8, in the state of being arranged on the mirror arrangement surface 34, a part of each side surface 31 c of the reflection mirror 31 is visible from the outside of the base side wall portion 36 through each through hole 40. It is in an exposed state. In addition, the said exposed part in each side surface 31c becomes the adhesion position P by the adhesive agent mentioned later.

  In this embodiment, the mirror arrangement base 33 is made of, for example, an iron material having a small coefficient of thermal expansion in order to avoid distortion of the mirror reflecting surface. However, when used in a temperature-controlled room or the like, importance is attached to weight reduction, and for example, aluminum may be used. The reflecting mirror 31 is formed with a thickness of 3 mm, a width of 14 mm, a length of 15 or 30 mm, and the reflecting surface 31a is polished and then a protective film is formed by aluminum vapor deposition. Further, the width dimension of the mirror arrangement surface 34 in the mirror arrangement base 33 is formed to be slightly larger than the width dimension of the reflection mirror 31. For example, in the state where the reflection mirror 31 is arranged, the reflection mirror 31 is arranged. A gap of about 0.2 mm is formed between the side surface 31 c and the base side wall 33.

  Here, in the state shown in FIG. 8, an adhesive 42, which is an example of an adhesive material, is supplied by application or filling to the adhesion position P on each side surface 31 c of the reflection mirror 31 through each through hole 40, and reflected. FIG. 9 shows a schematic cross-sectional view corresponding to the cross section taken along line BB in FIG. 8 in a state where the mirror 31 is fixed to the mirror arrangement surface 34. FIG. 10 shows a schematic cross-sectional view corresponding to a cross section taken along the line CC of the reflecting mirror 31 and the mirror arrangement base 33 shown in FIG.

  As shown in FIGS. 9 and 10, the adhesive 42 supplied from the outside of the base side wall portion 36 through the respective through holes 40, the side surface 31 c at each bonding position P of the reflection mirror 31, and the mirror arrangement surface 34. The side surface 34b, which is a surface including a part 34a of the end portion, is arranged so as to be adhered and fixed to each other. That is, the reflecting mirror 31 is partially bonded and fixed to the mirror arrangement base 33 at a bonding position P that is a position facing each other on a pair of side surfaces 31c facing each other in a direction orthogonal to the tilt direction. Further, when such an adhesive 42 is supplied, the back surface 31b of the reflecting mirror 31 and the mirror arrangement surface 34 are arranged so as to be in direct contact with each other. Even if the adhesive 42 is supplied to P, the adhesive fixing is performed in a state where the adhesive 42 is not disposed between the back surface 31b and the mirror arrangement surface 34.

  In the reflection mirror 31, the length dimension of each bonding position P in the direction along the surface of the reflection surface 31a is about 1/2 to 1/4 of the length dimension of the entire side surface 31c. Has been. Further, the surface of about 2/3 is covered in the thickness direction of each side surface 31c so that the adhesive 42 supplied at each bonding position P does not adhere from the reflecting surface 31a of the reflecting mirror 31. As described above, it is preferable that the adhesive 42 is supplied to each side surface 31c. Note that at each bonding position P, the supplied adhesive 42 is not divided (that is, is not divided into a plurality of locations separated from each other), and the adhesive 42 is integrally formed. Is preferably arranged. This is because if the adhesives 42 are arranged so as to be separated from each other at one bonding position P, the reflection surface 31a of the reflection mirror 31 may be distorted. However, in the case where the reflecting mirror having a length dimension that is twice or more the length dimension of the reflecting mirror 31 exemplified as described above in the present embodiment is fixed, vibration is generated by fixing only two positions facing each other. Since there is a possibility that the suppression effect is weakened, for example, fixing at four locations is preferable. This is because such a mirror has high rigidity in the width direction, and the influence on the distortion of the reflecting surface can be negligible compared with the influence caused by the vibration.

  By adopting such an adhesive fixing structure in the reflecting mirror device 30, the reflecting mirror 31 can be bonded and fixed without arranging the adhesive 42 between the reflecting mirror 31 and the mirror arrangement surface 34. The distortion of the reflection surface 31a of the reflection mirror 31 due to the variation in the coating thickness of the adhesive and the stress due to the adhesive on the back surface of the reflection mirror 31 can be reliably suppressed or greatly reduced. it can.

  Further, since the applied and supplied adhesive 42 is disposed only in a part of the side surface 31 c of the reflection mirror 31, that is, only in the bonding position P, the stress caused by the solidification of the adhesive 42 is applied to the side surface of the reflection mirror 31. It can be prevented or suppressed from being transmitted to the entire 31c and further to the reflecting surface 31a and the back surface 31b. Furthermore, by arranging the bonding positions P so as to oppose each other, stable bonding and fixing can be realized.

  Further, as shown in FIG. 9, in each of the adhesives 42 applied and supplied, the surface on the side (that is, the opposite side) opposite to the adhesive surface with the side surface 31 c of the reflecting mirror 31 is adhered to another member or the like. Therefore, even if stress is generated due to solidification of the adhesive 42 or the like, the stress is released to the opening side. The stress transmitted to the side surface 31c of the reflection mirror 31 can be greatly reduced.

  Further, in the mirror arrangement base 33, the through holes 40 are formed in the respective base side wall portions 36, so that the reflection mirror 31 is arranged on the mirror arrangement surface 34 so as to be in direct contact with each other. Since the adhesive 42 can be supplied from the outside of the base side wall portion 36 through each through hole 40, the supply operation can be facilitated and the adhesive 42 is bonded to the back surface 31b of the reflecting mirror 31. Without supplying the agent 42, it can be reliably supplied to the side surface 31c. Therefore, it is possible to manufacture the reflection mirror device 30 using the adhesive 42 while reliably preventing the reflection mirror 31 from being distorted.

  As such an adhesive 42, for example, an adhesive having elasticity in its solidified state, for example, an epoxy resin adhesive is used. By using the adhesive having elasticity in the solidified state in this way, the adhesive 42 has even when the reflection mirror 31 is stretched or contracted by heat generated during the component mounting operation. The elongation and contraction can be absorbed by the elastic function, and the occurrence of distortion or the like on the surface of the reflection mirror 31 can be suppressed. In addition, an epoxy resin adhesive generally refers to an adhesive that cures a compound containing an epoxy group with amines or acid anhydrides.

  In addition, as shown in FIG. 9, it replaces with the case where a part of side surface 31c of the reflective mirror 31 and a part of side surface 34b of the mirror arrangement | positioning surface 34 are adhere | attached with the adhesive agent 42, and it shows in FIG. In this manner, a part of the side surface 31 c of the reflection mirror 31 and a part near the end of the mirror arrangement surface 34 may be adhered by the adhesive 42. Even in such a case, in the reflecting mirror 31, a part of the side surface 31c is still bonded, and the opposite side of the bonding portion in the adhesive 42 is bonded to another member. This is because there is no change in the open state. Further, the adhesive 42 may be supplied so that the adhesive 42 is filled in almost the entire through holes 40.

  Next, in the head unit 100 including the reflection mirror device 30 having such a configuration, the electronic component 1 is sucked and held by each suction nozzle 11, and an image of each electronic component 1 is captured by the component imaging device 20. The operation of recognizing the suction holding posture of each electronic component 1 from these images and mounting each electronic component 1 on the circuit board based on the recognition result will be described below. In addition, each operation | movement of the head part 100 demonstrated below is controlled by the control part 9. FIG.

  First, in the electronic component mounting apparatus (not shown) provided with such a head unit 100, the head unit 100 is moved above the electronic component supply unit by the XY robot and the head unit 100 is moved by the XY robot. Positioning of the holding surface 11a of each suction nozzle 11 and each electronic component 1 accommodated in the electronic component supply unit so as to be removable is performed. After the above alignment, the respective suction nozzles 11 are lowered by the respective lifting devices 53 of the head portion 100 via the respective shaft portions 51 so that the upper surfaces of the respective electronic components 1 are brought into contact with the holding surface 11a. Then, the respective suction nozzles 11 are raised, and the respective electronic components 1 are picked up from the electronic component supply unit. Accordingly, the electronic component 1 is sucked and held on the holding surfaces 11a of the suction nozzles 11 included in the head unit 100. Note that the electronic component 1 may be sucked and taken out simultaneously for all the suction nozzles 11 provided in the head unit 100, or instead of such a case. It may be. After the suction and taking out, the head unit 100 starts to move toward the upper side of the circuit board held on the stage by the XY robot.

  In the moving process of the head unit 100, the component imaging device 20 provided in the head unit 100 captures an image of the suction holding posture of each of the electronic components 1 held by suction.

  Specifically, as shown in FIG. 1, in the head unit 100, the imaging frame 24 of the component imaging device 20 is a linear guide rail as the illustrated left end position in the sliding movement range along the arrangement direction of the respective suction nozzles 11. 25 is positioned in the vicinity of the left end of the figure. In such a state, the drive motor 28 of the slide drive unit 27 is rotationally driven, and the rightward slide movement of the imaging frame 24 in the drawing is started via the drive belt 29 and the arm 24a. In addition, the moving speed of the imaging frame 24 by the slide drive unit 27 is, for example, 950 mm / s.

  When the slide movement is started, first, the electronic component 1 sucked and held by the suction nozzle 11 positioned at the left end in the drawing passes through the inside of the imaging frame 24 and is refracted upward by the reflection mirror 22. It passes on the optical axis of the camera unit 23. Furthermore, by continuously sliding the imaging frame 24, the electronic component 1 sucked and held by the next suction nozzle 11 passes through the inside of the imaging frame 24 and is directed upward by the reflection mirror 22. It passes on the optical axis of the reflected camera unit 23. Thereafter, similarly, the other electronic components 1 are sequentially passed, and all the eight electronic components 1 are passed.

  When each electronic component 1 passes through the component imaging device 20, the electronic component 1 sucked and held by the first suction nozzle 11 passes through the inside of the imaging frame 24 after the slide movement starts. Thus, before the optical axis of the camera unit 23 refracted upward by the reflection mirror 22 substantially coincides with the axis of the first suction nozzle 11, the respective illumination units attached to the imaging frame 24 are turned on. As a result, the mounting surface of the electronic component 1 is irradiated with the respective lights substantially evenly. Thereafter, when the optical axis substantially matches the axis of the first suction nozzle 11, the camera unit 23 uses the electronic shutter function, for example, to display the image of the electronic component 1 as a reflection mirror 22, and An image is taken through the reflection mirror 21. Similarly, when the axis of the next suction nozzle 11 is substantially aligned with the optical axis of the camera unit 23, the electronic component 1 held by the next suction nozzle 11-2 is held by the camera unit 23. An image is taken. Further, the imaging frame 24 is continuously moved, and images of the respective electronic components 1 are sequentially captured by the camera unit 23. After the images of all the electronic components 1 are taken, the respective illumination units are turned off.

  Note that the respective imaging timings in the component imaging apparatus 20 are detected when the movement position of the imaging frame 24 on the linear guide rail 25 is detected and input to the control unit 9 or the elapsed time from the start of the slide movement. Is controlled by being measured by the control unit 9.

  When the images of all the electronic components 1 are captured and the imaging frame 24 is positioned in the vicinity of the right end of the linear guide rail 25 shown in FIG. 1 in the slide movement range, the slide drive unit 27 is driven. The rotational drive of the motor 28 is stopped, and the sliding movement of the imaging frame 24 is stopped.

  Each image captured by the component imaging device 20 in this way is sequentially output to the control unit 9 as image data which is an example of imaging result information during or after the slide movement of the imaging frame 24, and Position data of the moving position of the imaging frame 24 on the linear guide rail 25 at the time of each imaging is also sequentially output to the control unit 9.

  In the control unit 9, recognition processing of each of the input image data is sequentially performed, and each of the image data is collated with position data of the moving position of the imaging frame 24 input from the moving position reading head 62. Accordingly, it is recognized which image data corresponds to the electronic component 1 held by which suction nozzle 11.

  Thereby, in the control part 9, based on the image of each electronic component 1 imaged by the component imaging device 20, the electronic component by each suction nozzle 11 along the direction substantially orthogonal to the axis of each suction nozzle 11 1 suction holding posture is recognized.

  The suction holding postures of the respective electronic components 1 recognized in this way in the respective directions and the mounting postures of the respective electronic components 1 input in advance to the control unit 9 are compared in the control unit 9, and both The amount of misalignment is recognized.

  Thereafter, the head unit 100 moved by the XY robot is moved above the circuit board, and the electronic component 1 sucked and held by the suction nozzle 11 that is mounted first, and the circuit board. Alignment with the mounting position of is performed. At the time of this alignment, for example, based on the positional deviation amount recognized by the control unit 9, the positional deviation in the rotational direction around the axis of the suction nozzle 11 is corrected by the rotating device 54 of the head unit 100. The XY robot corrects misalignment in a direction parallel to the mounting surface of the circuit board. Further, after that, the suction nozzle 11 is lowered by the elevating device 53 of the head unit 100 and the electronic component 1 is mounted at the mounting position. At the time of the lowering, the position of the suction nozzle 11 in the axial direction is determined. Deviation correction is performed by the lifting device 53. In the same procedure, with respect to the other suction nozzles 11, the respective electronic components 1 are mounted on the circuit board while being combined with the respective corrections based on the respective positional deviations.

  In such a head part 100, since distortion etc. generate | occur | produce in each reflection mirror 31 and 32 reliably is prevented, light and an electron from an illumination part are used using each reflection mirror 31 and 32. The image of the component 1 can be reliably reflected. Therefore, the component imaging apparatus 20 can capture the image of the electronic component 1 with high accuracy, and the recognition processing of the electronic component 1 can be performed with high accuracy. Therefore, it is possible to provide a head unit that can cope with high component mounting accuracy.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

It is a typical side sectional view of the head part concerning one embodiment of the present invention. It is a schematic cross section along the plane orthogonal to the arrangement direction of the suction nozzle of the head part of FIG. It is a partial expanded schematic cross section of the component imaging device in the said head part. It is a top view of the mirror arrangement | positioning base of the reflective mirror apparatus with which the said head part is provided. It is a side view of the said mirror arrangement | positioning base. It is the sectional view on the AA line in the mirror arrangement | positioning base of FIG. It is a partial model perspective view of the said mirror arrangement | positioning base. It is a partial model perspective view which shows the state by which the reflective mirror was arrange | positioned at the mirror arrangement | positioning base of FIG. It is a BB line schematic cross section in the mirror arrangement base of FIG. FIG. 9 is a schematic cross-sectional view taken along the line CC in the mirror arrangement base of FIG. 8. FIG. 10 is a schematic cross-sectional view showing a mirror arrangement base according to a modification of the present embodiment and showing a cross-section corresponding to FIG. 9.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 9 Control part 11 Adsorption nozzle 20 Component imaging device 24 Imaging frame 30 Reflection mirror apparatus 31, 32 Reflection mirror 31c Side 33 Mirror arrangement base 34, 35 Mirror arrangement surface 36 Base side wall part 40, 41 Through-hole 42 Adhesive 100 Head

Claims (12)

A flat plate-shaped reflection mirror;
A mirror holding member having a mirror arrangement surface on which substantially the entire back surface of the reflection mirror is arranged,
The mirror back surface is directly disposed on the mirror arrangement surface of the mirror holding member, and the pair of side surfaces facing each other of the reflecting mirrors are bonded to each other through an adhesive material at respective bonding positions facing each other. A reflection mirror device characterized in that it is partially bonded and fixed to a holding member.   2. The reflection mirror device according to claim 1, wherein the bonding positions of the pair of side surfaces of the reflection mirror facing each other are bonded and fixed to the mirror arrangement surface of the mirror holding member via the bonding material. .   2. The bonding positions of the pair of side surfaces facing each other of the reflecting mirror are bonded and fixed to the side surfaces adjacent to the mirror arrangement surface of the mirror holding member via the adhesive material. Reflective mirror device described in 1.   The reflection mirror device according to any one of claims 1 to 3, wherein the back surface of the reflection mirror and the mirror arrangement surface of the mirror holding member are in direct contact with each other without the adhesive material. The mirror holding member is disposed at each end of the mirror arrangement surface facing each other, and a side surface defining side wall that defines the position of the pair of side surfaces of the reflecting mirror in a state of being arranged on the mirror arrangement surface. Part
Each of the side surface defining side wall portions has a through-hole portion formed in a portion corresponding to each of the bonding positions of the reflection mirror,
5. The reflection mirror device according to claim 1, wherein the adhesive material is supplied to the respective bonding positions from the outside of the respective side surface defining side wall portions through the respective through hole portions. 6. .   The reflection mirror device according to claim 5, wherein the adhesive material is filled in substantially the entire inside of each through-hole portion.   Each of the adhesive materials supplied to the respective adhesion positions of the reflection mirror has a surface opposite to the adhesion surface to the respective adhesion positions open to the mirror holding member. Item 7. The reflection mirror device according to any one of Items 1 to 6.   2. The length dimension in the direction along the surface of the reflecting mirror at the respective adhesion positions on the respective side surfaces is 1/2 to 1/4 times the length dimension of the entire side surface. 8. The reflection mirror device according to any one of items 1 to 7. In a component mounting head that includes a plurality of component holding members that hold components releasably in a row, and that can mount the plurality of components held by the respective component holding members on a circuit board.
An image sensor unit capable of capturing an image of the component held by the component holding member along the optical axis with an axis different from the axis of the component holding member as the optical axis, and the component A reflection unit configured to reflect the image of the component in the direction along the axis of the holding member along the optical axis of the imaging element unit and enter the imaging element unit, and is held by the component holding member; A component imaging device capable of capturing an image of the component in a direction along the axis of the component holding member;
A moving device for moving the component imaging device between the component holding members arranged at both ends of the row along the arrangement direction of the component holding members;
While moving the component imaging device along the arrangement direction by the moving device, the component imaging device sequentially captures images of the components held by the respective component holding members, and the captured each of the captured images. A control device capable of recognizing the holding posture of the component by each of the component holding members based on the image of the component;
9. A component mounting head using the reflecting mirror device according to claim 1 as the reflecting portion. A flat plate-shaped reflection mirror is arranged on the mirror arrangement surface of the mirror holding member, and the entire rear surface of the reflection mirror is brought into direct contact with the mirror arrangement surface,
Thereafter, a pair of side surfaces facing each other of the mirror are partially bonded and fixed to the mirror holding member via an adhesive material at respective bonding positions facing each other. .   The manufacturing method of the reflecting mirror device according to claim 10, wherein the bonding positions of the pair of side surfaces of the reflecting mirror facing each other are bonded and fixed to the mirror arrangement surface of the mirror holding member via the adhesive material. Method. 11. The bonding positions of the pair of side surfaces facing each other of the reflecting mirror are bonded and fixed to the side surfaces adjacent to the mirror arrangement surface of the mirror holding member via the adhesive material. Method of manufacturing the reflection mirror device of the present invention.

Images