CN215069979U - Lamp-drive integrated LED - Google Patents

Lamp-drive integrated LED Download PDF

Info

Publication number
CN215069979U
CN215069979U CN202121121806.8U CN202121121806U CN215069979U CN 215069979 U CN215069979 U CN 215069979U CN 202121121806 U CN202121121806 U CN 202121121806U CN 215069979 U CN215069979 U CN 215069979U
Authority
CN
China
Prior art keywords
chip
support
lamp
led
integrated led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202121121806.8U
Other languages
Chinese (zh)
Inventor
王路颖
韩婷婷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Refond Optoelectronics Co Ltd
Original Assignee
Shenzhen Refond Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Refond Optoelectronics Co Ltd filed Critical Shenzhen Refond Optoelectronics Co Ltd
Priority to CN202121121806.8U priority Critical patent/CN215069979U/en
Application granted granted Critical
Publication of CN215069979U publication Critical patent/CN215069979U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model provides a lamp drives integrative LED, lamp drives integrative LED includes an at least lamp pearl, the lamp pearl includes support, IC chip, R chip, G chip and B chip, be provided with the support electrode on the support, the support with the support electrode electricity is connected, the IC chip set up in on the support and with the support electricity is connected, at least one in R chip, G chip, the B chip set up in on the support electrode and with the support electrode electricity is connected, all the other are not fixed in on the support electrode R chip, G chip, B chip set up the IC chip is kept away from in the one side of support, and with the IC chip electricity is connected. The utility model discloses a lamp drives integrative LED and can realize point to point control for the lamp drives integrative LED's have high penetrating rate, the volume is littleer, the higher characteristics of luminance.

Description

Lamp-drive integrated LED
[ technical field ] A method for producing a semiconductor device
The utility model relates to photoelectricity, illumination field, in particular to integrative LED is driven to lamp.
[ background of the invention ]
With the rapid development of science and technology, the use and popularization of the LED are very wide, and the performance requirements of the LED are higher and higher because the LED can be seen everywhere in life, such as automobile lamps, advertising boards, cameras and the like.
The transmittance of the LED is an important index that affects the transmittance of the LED, and therefore, how to improve the transmittance of the LED and how to make the LED bead smaller becomes a problem that needs to be solved urgently.
[ Utility model ] content
For overcoming the problem that current LED exists, the utility model provides a lamp drives integrative LED.
The utility model provides a technical problem's scheme provides a lamp drives integrative LED, lamp drives integrative LED includes an at least lamp pearl, the lamp pearl includes support, IC chip, R chip, G chip and B chip, be provided with the support electrode on the support, the support with the support electrode electricity is connected, the IC chip set up in on the support and with the support electricity is connected, at least one set up in R chip, G chip, the B chip in the support electrode and with the support electrode electricity is connected, all the other are not fixed in on the support electrode R chip, G chip, B chip set up the IC chip is kept away from in the one side of support, and with the IC chip electricity is connected.
Preferably, the number of the support electrodes is multiple, the support electrodes are respectively arranged at the edge of the support, and at least one of the R chip, the G chip and the B chip is arranged on one of the support electrodes.
Preferably, the R chip is disposed on one of the support electrodes and electrically connected to the support electrode, and the G chip and the B chip are disposed on a surface of the IC chip away from the support and electrically connected to the IC chip.
Preferably, the R chip, the G chip and the B chip are all arranged on one surface of the IC chip, which is far away from the support, and are electrically connected with the IC chip.
Preferably, the IC chip and the R chip are mounted on the support in a face-up or flip-chip manner, and the G chip and the B chip are mounted on a face of the IC chip away from the support in a face-up or flip-chip manner.
Preferably, the IC chip is mounted on the bracket in a face-up or flip-chip manner, and the R chip, the G chip, and the B chip are mounted on the IC chip in a face-up or flip-chip manner.
Preferably, the lamp-drive integrated LED comprises a substrate and an encapsulant, wherein the encapsulant encapsulates one or more of the lamp beads on the substrate; and/or the packaging colloid is made of transparent materials or semitransparent materials.
Preferably, when the lamp drives integrative LED and passes through the encapsulation colloid with many the lamp pearl encapsulation is in on the base plate, it is two liang of intervals the same that be many between the lamp pearl, just the base plate is flexible transparent material.
Preferably, when the lamp beads are irregularly arranged, the substrate is made of hard transparent material.
Preferably, the substrate is made of any one of transparent plastic, transparent glass and sapphire; the support is made of any one of iron, copper, aluminum and ceramic.
Compared with the prior art, the utility model discloses a lamp drives integrative LED and manufacturing method has following advantage:
1. the utility model provides a lamp drives integrative LED, it includes the lamp pearl, the lamp pearl includes support, IC chip, R chip, G chip and B chip, IC chip and R chip set up in on the support, the B chip and the G chip sets up the IC chip is kept away from in the one side of support. Through this design, can will reduce the volume of lamp pearl, improve lamp and drive integrative LED's penetrating rate and luminance.
2. The LED lamp comprises a plurality of lamp beads, wherein the lamp beads are irregularly arranged, or the lamp beads are arranged in parallel at intervals, so that the lamp beads can form LED modules with different styles, and the lamp drives the LEDs into a whole, so that the applicability of the lamp is stronger.
3. The material of base plate can be flexible material to make the lamp drives integrative LED and can lap packing, or a plurality of the lamp drives concatenation equipment between the integrative LED, makes the lamp drives integrative LED and has good storage nature, portability, and further improves the suitability that integrative LED was driven to the lamp.
4. The utility model discloses a will the B chip and the G chip sets up on the IC chip to reduced the area of the shared base plate of single lamp pearl, and then made the pixel interval littleer, and avoided the IC chip to shelter from the luminous problem of R chip, G chip and B chip.
[ description of the drawings ]
Fig. 1 is the utility model relates to a lamp drives integrative LED and just looks structural schematic.
Fig. 2 is the utility model relates to a lamp drives integrative LED's lamp pearl structure schematic diagram.
Fig. 3a is a schematic structural view of an embodiment of the present invention.
Fig. 3b is a schematic structural view of another embodiment of the integrated LED of the present invention.
Fig. 4 is the utility model discloses a lamp drives integrative LED and warp example structure schematic diagram.
Description of reference numerals: 1. a lamp-drive integrated LED; 11. a lamp bead; 12. a substrate; 13. packaging the colloid; 111. a support; 112. an IC chip; 113. an R chip; 114. g chip; 115. b, chip; 1111. and (3) a stent electrode.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Referring to fig. 1 and 2, the utility model provides a lamp drives integrative LED1, the lamp drives integrative LED and includes base plate 12 and at least one lamp pearl 11, at least one lamp pearl 11 sets up on base plate 12. The lamp bead 11 is provided with a support 111, an IC chip 112, an R chip 113, a G chip 114 and a B chip 115, the IC chip 112 and the R chip 113 are arranged on the support 111, and the B chip 115 and the G chip 114 are arranged on one surface of the IC chip 112, which is far away from the support 111.
It can be understood that the material of the support 111 may be any one of iron, copper, aluminum, and ceramic, and the number of the lamp beads 11 may be set to the substrate 12 corresponding to the number of the lamp beads 11 required according to actual requirements. The IC chip 112, the R chip 113, the G chip 114, and the B chip 115 are electrically connected to each other.
The G chip 114 and the B chip 115 are stacked on the IC chip 112, so that the volume of the lamp bead 11 is reduced. And point-to-point control is realized among the IC chip, the R chip 113, the G chip 114 and the B chip 115, so that the brightness and the transmittance of the LED1 integrated with the lamp driver are higher.
In the embodiment of the present invention, one of the lamp beads 11 is provided with 1 chip of IC chip 112, R chip 113, G chip 114 and B chip 115. In other embodiments of the present invention, the number of the IC chip 112, the R chip 113, the G chip 114 and the B chip 115 in the lamp bead 11 may be multiple.
As a modified example, the R chip 113, the G chip 114, and the B chip 115 may be disposed over the IC chip 112.
Referring to fig. 2, a stent electrode 1111 is disposed on the stent 111, and the R chip 113 is disposed on the stent electrode 1111 and electrically connected to the stent electrode 1111. In the embodiment of the present invention, the shape of the bracket 111 is a rectangle, the number of the bracket electrodes 1111 is four, four the bracket electrodes 1111 are respectively disposed at four corners of the rectangle, that is, four the bracket electrodes 1111 are respectively disposed at four corners of the bracket 111. The R chip 113 is disposed on one of the support electrodes 1111.
In other embodiments of the present invention, the shape of the bracket 111 may be triangular, circular, etc. The number and the positions of the stent electrodes 1111 can be set correspondingly according to actual requirements, for example, the number of the stent electrodes 1111 can be three, five, six, and the like.
As a modified example, the B chip 115 may be disposed on the mount electrode 1111, and the R chip 113 and the G chip 114 may be disposed on the IC chip 112. Or the G chip 114 is disposed on the mount electrode 1111, and the R chip 113 and the B chip 115 are disposed on the IC chip 112.
Referring to fig. 1, fig. 3a and fig. 3b, the light-driving-integrated LED1 further includes an encapsulant 13, and a single or multiple beads 11 are encapsulated on the substrate 12 by the encapsulant 13. When the lamp drives integrative LED1 will be many through packaging colloid 13 the lamp pearl 11 encapsulation is in when on the base plate 12, it is same that many be two liang of intervals between the lamp pearl 11, and set up side by side, promptly the range of lamp pearl 11 is neat, regular, as shown in figure 3 a. In addition, a plurality of the lamp beads 11 can be irregularly arranged, so that a special-shaped module is formed, as shown in fig. 3 b.
Further, the encapsulant 13 may be a transparent or translucent material, and the substrate 12 may be a hard material, such as a hard PCB, a glass substrate, a sapphire substrate, a ceramic substrate, etc.; the substrate 12 may also be a flexible material, such as a plastic substrate or the like. When the substrate 12 is made of transparent hard material such as glass substrate and the plurality of beads 11 are irregularly arranged, the substrate 12 and the beads 11 can form a special-shaped transparent module. When the substrate 12 is made of a transparent flexible material such as a plastic substrate, and the plurality of beads 11 are arranged in parallel with the same interval in pairs, that is, the beads 11 are arranged orderly, orderly and regularly, the substrate 12 and the beads 11 can form a flexible transparent module.
In the embodiment of the present invention, the IC chip 112 and the R chip 113 are mounted on the bracket 111 by way of mounting, and the G chip 114 and the B chip 115 are mounted on the IC chip 112 by way of mounting or flipping. And then the lamp driver integrated LED1 is packaged by die bonding and wire bonding while using the encapsulant 13. The manufacturing steps of the lamp-drive integrated LED are as follows: fixing the IC chip 112 on the support 111, fixing the R chip 113 on the support electrode 1111, then fixing the G chip 114 and the B chip 115 on the IC chip 112, then bonding the IC chip 112, the R chip 113, the G chip 114 and the B chip, attaching the lamp bead 11 to the substrate 12, and finally packaging the lamp bead 11 and the substrate 12 through the packaging adhesive 13.
In other embodiments of the present invention, as shown in fig. 4, the G chip 114, the B chip 115, the IC chip 112 and the R chip 113 are mounted on the bracket 111 by flip-chip mounting, and at this time, the R chip 113, the G chip 114, the B chip 115 are disposed on the IC chip by chip transferring. The die bonding, wire bonding, and chip transferring are all in the prior art, and are not described herein again.
Compared with the prior art, the utility model discloses a lamp drives integrative LED has following advantage:
1. the utility model provides a lamp drives integrative LED, it includes the lamp pearl, the lamp pearl includes support, IC chip, R chip, G chip and B chip, IC chip and R chip set up in on the support, the B chip and the G chip sets up the IC chip is kept away from in the one side of support. Through this design, can will reduce the volume of lamp pearl, improve lamp and drive integrative LED's penetrating rate and luminance.
2. The LED lamp comprises a plurality of lamp beads, wherein the lamp beads are irregularly arranged, or the lamp beads are arranged in parallel at intervals, so that the lamp beads can form LED modules with different styles, and the lamp drives the LEDs into a whole, so that the applicability of the lamp is stronger.
3. The material of base plate can be flexible material to make the lamp drives integrative LED and can lap packing, or a plurality of the lamp drives concatenation equipment between the integrative LED, makes the lamp drives integrative LED and has good storage nature, portability, and further improves the suitability that integrative LED was driven to the lamp.
4. The utility model discloses a will the B chip and the G chip sets up on the IC chip to reduced the area of the shared base plate of single lamp pearl, and then made the pixel interval littleer, and avoided the IC chip to shelter from the luminous problem of R chip, G chip and B chip.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the principles of the present invention should be included within the protection scope of the present invention.

Claims (10)

1. The utility model provides a lamp drives integrative LED which characterized in that: the lamp drives integrative LED and includes an at least lamp pearl, the lamp pearl includes support, IC chip, R chip, G chip and B chip, be provided with the support electrode on the support, the support with the support electrode electricity is connected, the IC chip set up in on the support and with the support electricity is connected, at least one in R chip, G chip, the B chip set up in on the support electrode and with the support electrode electricity is connected, all the other are not fixed in on the support electrode R chip, G chip, B chip set up the IC chip is kept away from in the one side of support, and with the IC chip electricity is connected.
2. The lamp-drive integrated LED of claim 1, wherein: the number of the support electrodes is multiple, the support electrodes are respectively arranged at the edge of the support, and at least one of the R chip, the G chip and the B chip is arranged on one of the support electrodes.
3. The lamp-drive integrated LED of claim 2, wherein: the R chip is arranged on one of the support electrodes and is electrically connected with the support electrode, and the G chip and the B chip are arranged on one surface, far away from the support, of the IC chip and are electrically connected with the IC chip.
4. The lamp-drive integrated LED of claim 2, wherein: the R chip, the G chip and the B chip are all arranged on one surface, far away from the support, of the IC chip and are electrically connected with the IC chip.
5. The lamp-drive integrated LED of claim 3, wherein: the IC chip and the R chip are mounted on the support in a face-up or flip-chip mode, and the G chip and the B chip are mounted on one face, far away from the support, of the IC chip in a face-up or flip-chip mode.
6. The lamp-drive integrated LED of claim 4, wherein: the IC chip is installed on the support in a forward installation or flip-chip mode, and the R chip, the G chip and the B chip are installed on the IC chip in a forward installation or flip-chip mode.
7. The lamp-drive integrated LED of claim 1, wherein: the lamp-drive integrated LED comprises a substrate and an encapsulation colloid, wherein the encapsulation colloid encapsulates one or more lamp beads on the substrate; and/or the packaging colloid is made of transparent materials or semitransparent materials.
8. The lamp-drive integrated LED of claim 7, wherein: when the lamp-driving integrated LED encapsulates a plurality of lamp beads on the substrate through an encapsulation colloid, the lamp beads are spaced in pairs at the same interval, and the substrate is made of a flexible transparent material.
9. The lamp-drive integrated LED of claim 7, wherein: when the lamp beads are irregularly arranged, the substrate is made of hard transparent materials.
10. The lamp-drive integrated LED of claim 7, wherein: the substrate is made of any one of transparent plastic, transparent glass and sapphire; the support is made of any one of iron, copper, aluminum and ceramic.
CN202121121806.8U 2021-05-24 2021-05-24 Lamp-drive integrated LED Active CN215069979U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121121806.8U CN215069979U (en) 2021-05-24 2021-05-24 Lamp-drive integrated LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121121806.8U CN215069979U (en) 2021-05-24 2021-05-24 Lamp-drive integrated LED

Publications (1)

Publication Number Publication Date
CN215069979U true CN215069979U (en) 2021-12-07

Family

ID=79213879

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121121806.8U Active CN215069979U (en) 2021-05-24 2021-05-24 Lamp-drive integrated LED

Country Status (1)

Country Link
CN (1) CN215069979U (en)

Similar Documents

Publication Publication Date Title
US9966367B2 (en) Light emitting device
CN113257980A (en) LED device, backlight module and display unit
CN102214776B (en) Light emitting diode package, lighting device and light emitting diode package substrate
CN107086263A (en) Display device and its four sides are emitting led
CN203659368U (en) Led display screen
CN106531730A (en) LED packaging assembly and manufacturing method thereof
US7508007B2 (en) Package structure of light-emitting diode
CN213546315U (en) Light-emitting unit
US20070252167A1 (en) Surface mounting optoelectronic device
CN206497891U (en) LED modules and LED package assemblings
CN113380778A (en) Lamp-drive integrated LED and manufacturing method thereof
CN2874691Y (en) Surface adhesive type light emitting diode display module for outdoor use
CN215069979U (en) Lamp-drive integrated LED
CN2886737Y (en) LED display module
CN2606943Y (en) Light-emitting diode dot matrix display module
CN209180714U (en) The flexible filament and filament lamp that can be independently formed
CN101551962A (en) Full-color LED display device
CN103996676B (en) A kind of LED encapsulation structure
CN100498464C (en) Backlight module and light-emitting diode driving board
CN215418213U (en) LED device, backlight module and display unit
CN215527753U (en) LED display module and LED display screen
CN210167355U (en) Transparent display screen and LED light source thereof
CN210402971U (en) Four-side light emitting source and backlight module
KR20080029351A (en) The apparatus of led blu and that of manufacture method
KR100809225B1 (en) Light emitting diode module

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant