CN100498464C - Backlight module and light-emitting diode driving board - Google Patents
Backlight module and light-emitting diode driving board Download PDFInfo
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- CN100498464C CN100498464C CNB2006100791963A CN200610079196A CN100498464C CN 100498464 C CN100498464 C CN 100498464C CN B2006100791963 A CNB2006100791963 A CN B2006100791963A CN 200610079196 A CN200610079196 A CN 200610079196A CN 100498464 C CN100498464 C CN 100498464C
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Abstract
The invention is about a backlight module and the LED driver board. The backlight module with a smooth, backlight modules include a shell, LED driver board and a optical thin films. LED driver board is set up shell. LED driver board with a substrate, the plural LED driver circuit and a grain, the grain complex light-emitting diodes were set directly on substrates, respectively grain LED drive circuit and electrical connections, respectively driven by the drive circuit. O optical thin film is based on LED driver board. The invention also exposes a LED driver board. The invention use of light-emitting diodes grain surface mount, bump, flip chip or a joint ways of light-emitting diodes placed in direct grain substrates, the light-emitting diodes can be saved for when the grain package bearing substrates the cost of raw materials. It is very convenient to assemble, LED driver board a standby gasket raw materials and waste can be avoided.
Description
Technical field
The present invention relates to a kind of module backlight and light-emitting diode driving board, particularly relate to a kind of display that is applied to, LED crystal particle directly is arranged at substrate, can saves the module backlight and the light-emitting diode driving board of required bearing substrate raw materials cost when LED crystal particle encapsulates in the prior art.
Background technology
Light emitting diode is by the made light-emitting component of semiconductor material, and element has two electrode terminals, applies voltage between terminal, feeds minimum voltage, via the combination in electronics electricity hole, dump energy can be excited with the form of light and disengage.
Be different from general incandescent lamp bulb, light emitting diode is to belong to chemiluminescence, has advantages such as power consumption is low, component life long, need not warm up the lamp time, reaction velocity is fast.Add that its volume is little, vibration resistance, be fit to volume production, the demand on the fit applications is made the element of minimum or array easily.Light emitting diode generally is used on the indicator and display device of information, communication, consumption electronic products at present, becomes critical elements indispensable in the daily life.Recently, utilize light emitting diode more to be used as LCD (Liquid Crystal Display, the LCD) light source in the module backlight, and the trend that replaces traditional cold cathode fluorescent lamp pipe is gradually arranged.
Please consult Figure 1 and Figure 2 simultaneously, Fig. 1 is a schematic top plan view that has the known module backlight with plural light emitting diode now, and Fig. 2 is the diagrammatic cross-section along A-A ' section among Fig. 1.In the prior art,, have a housing 11, plural light emitting diode 12, a support plate 13, one drive circuit plate 14 and at least one optical thin film 15 with the module backlight 1 of light emitting diode as light source.
Each light emitting diode 12 has a plural light-emitting diode 121 (LED Device) and a printed circuit board (PCB) 122 respectively.Wherein, plural light-emitting diode 121 is to be arranged at printed circuit board (PCB) 122.Then, each light emitting diode 12 is fixed on the support plate 13, support plate 13 is and housing 11 locking (not shown) that support plate 13 can be metal material, to assist light emitting diode 12 heat radiations again.
Yet, the assembling process of the module backlight 1 of existing known techniques is very complicated, want earlier light-emitting diode 121 to be arranged at printed circuit board (PCB) 122, after forming light emitting diode 12, just respectively each light emitting diode 12 and drive circuit board 14 are fixed in support plate 13, and then support plate 13 is locked in housing 11.At last, again with optical thin film 15, be a diffuser plate for example, be arranged on the support plate 13.So complicated number of assembling steps can cause production cost of products to increase really.
Then seeing also shown in Figure 3ly, is the structural representation of light emitting diode 121 elements in the existing known techniques.The substrate 121a of light-emitting diode 121 is arranged at radiating seat 121b to be beneficial to heat radiation, and crystal grain 121c is arranged at substrate 121a to be engaged to lead frame 121d via routing, so that crystal grain 121c electrically connects with other elements by lead frame 121d.By among the figure as can be known, the crystal grain 121c of light emitting diode after earlier finishing encapsulation with substrate 121a, just is installed on the radiating seat 121b, adds the processing procedure that routing engages, so also suitable complexity of the manufacturing process of light-emitting diode 121.
This shows that above-mentioned existing module backlight and light emitting diode obviously still have inconvenience and defective, and demand urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.How therefore a kind of module backlight and light-emitting diode driving board of new structure are provided, real one of the current important topic that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing module backlight and light emitting diode exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge thereof, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of assembling process complexity that can solve module backlight, and cause the production cost to increase the module backlight and the light-emitting diode driving board of the new structure of problem, can improve general existing module backlight and light emitting diode, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The objective of the invention is to, overcome the defective that existing module backlight and light emitting diode exist, be module backlight and the light-emitting diode driving board that is arranged at same substrate and a kind of luminous disome crystal grain is provided and drives the loop, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.Module a kind of backlight according to the present invention proposes has an exiting surface, and this module backlight comprises: a housing; One light-emitting diode driving board, be arranged at this housing, this light-emitting diode driving board has a substrate, plural LED crystal particle and drives the loop, those LED crystal particle are directly to be arranged at this substrate respectively, those LED crystal particle are to electrically connect with this driving loop respectively, and drive drive circuit by this respectively; And an optical thin film, being adjacent to this light-emitting diode driving board, wherein said substrate more comprises at least one standby gasket, this standby gasket is and this driving loop or this LED crystal particle electrically connect.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid module backlight, wherein said substrate are to be a tellite or a glass circuit substrate.
Aforesaid module backlight, the size of wherein said light-emitting diode driving board are the sizes that approximates this exiting surface.
Aforesaid module backlight, wherein said those LED crystal particle are to engage and electrically connect with those driving loops by chip bonding or by routing.
Aforesaid module backlight, wherein said driving loop comprise that one drives loop crystal grain, and it is to electrically connect with those LED crystal particle.
Aforesaid module backlight, wherein said driving loop crystal grain is directly to be arranged at this substrate.
Aforesaid module backlight, wherein said driving loop more comprises at least one active member, this active member is to electrically connect with this driving loop.
Aforesaid module backlight, wherein said driving loop more comprises at least one passive device, this passive device is to electrically connect with this driving loop.
Aforesaid module backlight, wherein said standby gasket are to be a wafer pad or a joint sheet.
The object of the invention to solve the technical problems also adopts following technical scheme to realize.According to a kind of light-emitting diode driving board that the present invention proposes, it comprises: a substrate; The plural number LED crystal particle is directly to be arranged at this substrate respectively; And one drive the loop, and those LED crystal particle are to electrically connect with this drivings loop respectively, and drive drive circuit by this respectively, and wherein said substrate more comprises at least one standby gasket, and this standby gasket is and those drive loops electric connections.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid light-emitting diode driving board, wherein said substrate are to be a tellite or a glass circuit substrate.
Aforesaid light-emitting diode driving board, wherein said those LED crystal particle are to engage and electrically connect with those driving loops by chip bonding or by routing.
Aforesaid light-emitting diode driving board, wherein said driving loop comprise that one drives loop crystal grain, and this driving loop crystal grain is to electrically connect with those LED crystal particle.
Aforesaid light-emitting diode driving board, wherein said driving loop crystal grain is directly to be arranged at this substrate.
Aforesaid light-emitting diode driving board, wherein said driving loop more comprises at least one active member, this active member is to electrically connect with this driving loop.
Aforesaid light-emitting diode driving board, wherein said driving loop more comprises at least one passive device, this passive device is to electrically connect with this driving loop.
Aforesaid light-emitting diode driving board, wherein said standby gasket are to be a wafer pad or a joint sheet.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
For achieving the above object, according to module backlight of the present invention, be to have an exiting surface, module backlight comprises a housing, light-emitting diode driving board and an optical thin film.Wherein, light-emitting diode driving board is to be arranged at housing.Light-emitting diode driving board is to have a substrate, plural LED crystal particle and a driving loop, the plural number LED crystal particle is directly to be arranged at substrate respectively, LED crystal particle is to electrically connect with driving the loop respectively, and respectively by driving drive circuit.Optical thin film is to be adjacent to light-emitting diode driving board.
In addition, for achieving the above object, according to light-emitting diode driving board of the present invention, be to have a substrate, plural LED crystal particle and a driving loop, the plural number LED crystal particle is directly to be arranged at substrate respectively, LED crystal particle is to electrically connect with driving the loop respectively, and respectively by driving drive circuit.
By technique scheme, the present invention's module backlight and light-emitting diode driving board have following advantage at least:
1, because according in a kind of module backlight of the present invention and the light-emitting diode driving board, be to have the LED crystal particle that directly is arranged at substrate, so compare with existing known techniques, LED crystal particle of the present invention is to utilize mounted on surface, projection, cover the mode that crystalline substance or routing engage and LED crystal particle directly is arranged at substrate, so can save the raw materials cost of needed bearing substrate when LED crystal particle encapsulates in the existing known techniques.
2, in addition, module assembling backlight of the present invention is very convenient, as long as light-emitting diode driving board is fixed on the housing, and can finish assembling after putting optical thin film.
3, in an embodiment of the present invention, light-emitting diode driving board more can have standby gasket, when one of them LED crystal particle is damaged, then need not change the whole circuit board that is laid with plural light emitting diode, only need new light-emitting diodes crystal grain and standby gasket electric connection are got final product, so can avoid the waste of former material.
In sum, the invention relates to a kind of module backlight and light-emitting diode driving board.This module backlight has an exiting surface, and module backlight comprises a housing, light-emitting diode driving board and an optical thin film.Wherein, light-emitting diode driving board is arranged at housing.Light-emitting diode driving board has a substrate, plural LED crystal particle and drives the loop, and plural LED crystal particle directly is arranged at substrate respectively, and LED crystal particle electrically connects with driving the loop respectively, and drives drive circuit by this respectively.Optical thin film is to be adjacent to light-emitting diode driving board.The present invention also discloses a kind of light-emitting diode driving board.The present invention is to be arranged at same substrate with luminous disome crystal grain and driving loop, can save the raw materials cost of needed bearing substrate when LED crystal particle encapsulates in the prior art.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing module backlight and light emitting diode have the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is an existing known schematic top plan view with module backlight of plural light emitting diode.
Fig. 2 is the diagrammatic cross-section along A-A ' section among Fig. 1.
Fig. 3 is a synoptic diagram of light-emitting diode in the existing known techniques.
Fig. 4 is a synoptic diagram of module backlight of the present invention.
Fig. 5 is a part of synoptic diagram of the light-emitting diode driving board of the present invention's module backlight.
Fig. 6 is another synoptic diagram of the light-emitting diode driving board of the present invention's module backlight.
Fig. 7 is in the light-emitting diode driving board of Fig. 5, and in dashed circle, substrate is the synoptic diagram with standby gasket.
Fig. 8 is that in dashed circle, substrate is another synoptic diagram with standby gasket in the light-emitting diode driving board among Fig. 5.
Fig. 9 is another synoptic diagram of light-emitting diode driving board of the present invention.
1: module 11 backlight: housing
12: light emitting diode 121: light-emitting diode
121a: substrate 121b: radiating seat
121c: crystal grain 121d: lead frame
122: printed circuit board (PCB) 13: support plate
14: drive circuit board 15: optical thin film
2: module 21 backlight: housing
22: light-emitting diode driving board 221: substrate
221a: standby gasket 222: LED crystal particle
223: drive loop 223a: drive loop crystal grain
223: active member 223c: passive device
23: optical thin film 24: the blooming piece combination
3: light-emitting diode driving board 31: substrate
32: LED crystal particle 33: drive the loop
B: the LED crystal particle D of damage: exiting surface
Dtotal: always drive loop crystal grain G: good LED crystal particle
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to module backlight and its embodiment of light-emitting diode driving board, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Hereinafter with reference to correlative type, the plural embodiment according to module backlight of the present invention and light-emitting diode driving board is described.
See also Fig. 4 to shown in Figure 8, with the embodiment of explanation the present invention module backlight.
At first, seeing also shown in Figure 4ly, is a synoptic diagram of module backlight of the present invention.The module backlight 2 of preferred embodiment of the present invention comprises a housing 21, light-emitting diode driving board 22 and an optical thin film 23.Wherein, module 2 backlight can be a side-light type module backlight or a direct-type backlight module, present embodiment then is example with the down straight aphototropism mode set, and module backlight 2 is to have a light-emitting area D, and the size of light-emitting area D is the rough size that equals light-emitting diode driving board 22.
Above-mentioned housing 21, its material can be metal or are plastic cement, and the size of housing 21 and shape can design according to module 2 actual required size and forms backlight, and for example: housing 21 can be a framework, a tabular or other shapes.
Above-mentioned light-emitting diode driving board 22 is can lock or be arranged on the housing 21 with other mode of connection, and supported by housing 21.
Seeing also shown in Figure 5ly, is a part of synoptic diagram of the light-emitting diode driving board of the present invention's module backlight.Above-mentioned light-emitting diode driving board 22 has a substrate 221, plural LED crystal particle (die) 222 and a driving loop 223; Wherein:
This substrate 221 can be a tellite (PCB) or a glass circuit substrate.Wherein, the thermal expansivity of glass substrate is similar to the thermal expansivity of LED crystal particle 222.
This plural number LED crystal particle 222 is directly to be arranged at substrate 221 respectively, is that the LED crystal particle 222 with part is an example among Fig. 5, and wherein, the quantity of LED crystal particle 222 and the demand of arranging visual actual product design.So-called " directly being provided with " is that representative utilizes processing procedures such as mounted on surface (SMT) or projection, directly LED crystal particle 222 is engaged with joint sheet 221a (as Fig. 7 or shown in Figure 8) on the substrate 221, at this, be not to refer to just be arranged on the substrate 21 after LED crystal particle 222 has encapsulated.
In the present embodiment, plural LED crystal particle 222 is to have the crystal grain that can send redness, green, blueness or other color light, and certain plural LED crystal particle 222 also can be for sending the crystal grain of identical colour system.
Because LED crystal particle 222 is modes of utilizing surface encapsulation (SMT), covering crystalline substance or routing joint, directly is arranged at substrate 221, and electrically connects with driving loop 223, and drive each LED crystal particle 222 by driving loop 223.Do not need to carry the substrate (as the substrate 121a among existing known techniques Fig. 3) of LED crystal particle 222 in the processing procedure, not only can save former material cost, more can reduce the fabrication steps that LED crystal particle 222 is arranged at substrate 21.
Please consult shown in Figure 5ly again, this drives loop 223, is and LED crystal particle 222 electrically connects, and drives each LED crystal particle 222 respectively.In the present embodiment, driving loop 223 is to comprise that one drives loop crystal grain (die) 223a, drives loop crystal grain 223a and be directly to be arranged at substrate 221 and to electrically connect with each LED crystal particle 222, to carry out the drive controlling of plural light source.
In addition, drive loop 223 and more can comprise an active member 223b or a passive device 223c, wherein, active member 223b or passive device 223c are and drive loop crystal grain 223a electric connection.In the present embodiment, be to comprise that to drive loop 223 plural active member 223b and passive device 223c are that example describes, wherein, active member 223b can be an on-off element, for example is an electric crystal or is a diode; Passive device 223c then can be an electric capacity, a resistance, an inductance or its combination.
Seeing also shown in Figure 6ly, is another synoptic diagram of the light-emitting diode driving board of the present invention's module backlight.Certainly, this driving loop 223 also can have plural number and drive loop crystal grain 223a, each drives loop crystal grain 223a and electrically connects with plural LED crystal particle 222 respectively, for example same row's LED crystal particle 222 is to electrically connect with same driving loop crystal grain 223a, and the driving loop crystal grain 223a of plural number then is electrically connected to total loop crystal grain Dtotal (as shown in Figure 6) of driving more respectively.
Please consult Fig. 5, Fig. 7 and shown in Figure 8 simultaneously, wherein Fig. 7 and Fig. 8 are the enlarged diagrams of LED crystal particle 222 and near zone thereof in Fig. 5 dotted line, Fig. 7 be in the light-emitting diode driving board of Fig. 5 in dashed circle, substrate is the synoptic diagram with standby gasket, Fig. 8 be in the light-emitting diode driving board among Fig. 5 in dashed circle, substrate is another synoptic diagram with standby gasket.In the present embodiment, substrate 221 more can comprise a standby gasket 221a, and wherein, this standby gasket 221a can be a joint sheet (bonding pad) or a wafer pad (die pad), to electrically connect with driving loop 223 or LED crystal particle 222.
In the past, when dispatching from the factory Pretesting,, often need directly to change the circuit board that is provided with plural light-emitting diode if find wherein when damaging of plural light emitting diode, and lost many normally functioning light-emitting diodes, and caused the waste of former material.In the present embodiment, because substrate 221 is to have standby gasket 221a to electrically connect with LED crystal particle 222 or driving loop crystal grain 223a, therefore when a LED crystal particle B damages, can utilize other space, utilize the mode of routing joint, projection, mounted on surface or chip bonding to come and standby gasket 221a electrically connect a good LED crystal particle G (being represented by dotted lines) in close proximity to crystal grain B.Wherein, be that to engage with standby gasket 221a routing with crystal grain G be example among Fig. 7, and Fig. 8 is to be example with crystal grain G and standby gasket 221a chip bonding.And the light emitting diode B that damages also can select not remove, to reduce the step of maintenance.Therefore, can reduce the step of the cost and the maintenance processing procedure of former material.
Please consult shown in Figure 4ly again, optical thin film 23 is to be adjacent to light-emitting diode driving board 22.In the present embodiment, this optical thin film 23 can be a diffusion barrier or a diffuser plate.
In addition, module 2 backlight more can comprise blooming piece combination 24, and it is to be arranged on the optical thin film 23.Wherein, this blooming piece combination 24 can comprise diffuser plate, Polarizer or brightness enhancement film or the like.
In the present embodiment, only light-emitting diode driving board 22 need be fixed on the housing 21, add optical thin film 23, can finish the assembling of module 2 backlight, its step is simple quite rapidly.
Then, see also the embodiment of Fig. 9 with explanation light-emitting diode driving board of the present invention.
Seeing also shown in Figure 9ly, is another synoptic diagram of light-emitting diode driving board of the present invention.Light-emitting diode driving board 3 comprises that a substrate 31, plural LED crystal particle (die) 32 and drive loop 33.In the present embodiment, light-emitting diode driving board 3 be with aforementioned module 2 backlight in light-emitting diode driving board 22 can have identical technical characterictic and effect, so do not repeat them here.
In addition, light-emitting diode driving board 3 in can being applied to module 2 backlight, more can drive plural LED crystal particle 32 via driving loop 33, can make that LED crystal particle 32 is luminous directly as a light emitting diode indicator (LED Display).Wherein, plural LED crystal particle 32 can be sent the light of color identical or inequality.
In sum, in module backlight of the present invention and the light-emitting diode driving board, be to have the LED crystal particle that directly is arranged at substrate.Compared with prior art, LED crystal particle of the present invention is to utilize mounted on surface, projection, cover the mode that crystalline substance or routing engage and LED crystal particle directly is arranged at substrate, so can save the raw materials cost of needed bearing substrate when LED crystal particle encapsulates in the prior art.In addition, module assembling backlight of the present invention is very convenient, as long as light-emitting diode driving board is fixed on the housing, and can finish assembling after putting optical thin film.In embodiments of the present invention, light-emitting diode driving board more can have standby gasket, when one of them LED crystal particle is damaged, then need not change the whole circuit board that is laid with plural light emitting diode, only need new light-emitting diodes crystal grain and standby gasket electric connection are got final product, so can avoid the waste of former material.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (17)
1, a kind of module backlight has an exiting surface, it is characterized in that this module backlight comprises:
One housing;
One light-emitting diode driving board, be arranged at this housing, this light-emitting diode driving board has a substrate, plural LED crystal particle and drives the loop, those LED crystal particle are directly to be arranged at this substrate respectively, those LED crystal particle are to electrically connect with this driving loop respectively, and drive drive circuit by this respectively; And
One optical thin film is adjacent to this light-emitting diode driving board,
Wherein said substrate also comprises at least one standby gasket, and this standby gasket is to electrically connect with this driving loop or this LED crystal particle.
2, module backlight according to claim 1 is characterized in that wherein said substrate is to be a tellite or a glass circuit substrate.
3, module backlight according to claim 1, the size that it is characterized in that wherein said light-emitting diode driving board is the size that approximates this exiting surface.
4, module backlight according to claim 1 is characterized in that wherein said those LED crystal particle are to engage and electrically connect with those driving loops by chip bonding or by routing.
5, module backlight according to claim 1 is characterized in that wherein said driving loop comprises that one drives loop crystal grain, and it is to electrically connect with those LED crystal particle.
6, module backlight according to claim 5 is characterized in that wherein said driving loop crystal grain is directly to be arranged at this substrate.
7, module backlight according to claim 1 is characterized in that wherein said driving loop more comprises at least one active member, and this active member is to electrically connect with this driving loop.
8, module backlight according to claim 1 is characterized in that wherein said driving loop more comprises at least one passive device, and this passive device is to electrically connect with this driving loop.
9, module backlight according to claim 1 is characterized in that wherein said standby gasket is to be a wafer pad or a joint sheet.
10, a kind of light-emitting diode driving board is characterized in that it comprises:
One substrate;
The plural number LED crystal particle is directly to be arranged at this substrate respectively; And
One drives the loop, and those LED crystal particle are to electrically connect with this driving loop respectively, and drive drive circuit by this respectively,
Wherein said substrate also comprises at least one standby gasket, and this standby gasket is to drive the loop with those to electrically connect.
11, light-emitting diode driving board according to claim 10 is characterized in that wherein said substrate is to be a tellite or a glass circuit substrate.
12, light-emitting diode driving board according to claim 10 is characterized in that wherein said those LED crystal particle are to engage and electrically connect with those driving loops by chip bonding or by routing.
13, light-emitting diode driving board according to claim 10 is characterized in that wherein said driving loop comprises that one drives loop crystal grain, and this driving loop crystal grain is to electrically connect with those LED crystal particle.
14, light-emitting diode driving board according to claim 10 is characterized in that wherein said driving loop crystal grain is directly to be arranged at this substrate.
15, light-emitting diode driving board according to claim 10 is characterized in that wherein said driving loop more comprises at least one active member, and this active member is to electrically connect with this driving loop.
16, light-emitting diode driving board according to claim 10 is characterized in that wherein said driving loop more comprises at least one passive device, and this passive device is to electrically connect with this driving loop.
17, light-emitting diode driving board according to claim 10 is characterized in that wherein said standby gasket is to be a wafer pad or a joint sheet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100791963A CN100498464C (en) | 2006-05-12 | 2006-05-12 | Backlight module and light-emitting diode driving board |
| US11/715,232 US20070211492A1 (en) | 2006-03-09 | 2007-03-08 | Backlight module and driving circuit board of light emitting diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100791963A CN100498464C (en) | 2006-05-12 | 2006-05-12 | Backlight module and light-emitting diode driving board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101071231A CN101071231A (en) | 2007-11-14 |
| CN100498464C true CN100498464C (en) | 2009-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100791963A Expired - Fee Related CN100498464C (en) | 2006-03-09 | 2006-05-12 | Backlight module and light-emitting diode driving board |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102148470A (en) * | 2010-02-09 | 2011-08-10 | 唯联工业有限公司 | Method and device for arranging matrix array assembly |
| KR101899063B1 (en) | 2012-04-16 | 2018-09-17 | 엘지디스플레이 주식회사 | Display device and reworking methode thereof |
| CN109031773A (en) * | 2017-06-09 | 2018-12-18 | 群创光电股份有限公司 | Display device |
| CN112669714B (en) * | 2020-12-22 | 2022-09-20 | 业成科技（成都）有限公司 | Light emitting diode display and manufacturing method thereof |
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