CN101551962A - Full-color LED display device - Google Patents
Full-color LED display device Download PDFInfo
- Publication number
- CN101551962A CN101551962A CN 200910026796 CN200910026796A CN101551962A CN 101551962 A CN101551962 A CN 101551962A CN 200910026796 CN200910026796 CN 200910026796 CN 200910026796 A CN200910026796 A CN 200910026796A CN 101551962 A CN101551962 A CN 101551962A
- Authority
- CN
- China
- Prior art keywords
- pin
- paster
- dao
- chip
- full
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of electronic devices, in particular to a full-color LED display device which comprises three LED chips in colors of red, green and blue, four pins and a packaging body. The three LED chips are all packaged in the packaging body, the four pins all have a chip paddle respectively and all the chip paddles are in the laminate structure and packaged and fixed in the packaging body. The electrodes of the surfaces and backs of the three LED chips are different, and the backs of the three LED chips are in same electrode and respectively pasted on a first chip paddle; and the surfaces of the LED chips are respectively connected with a second chip paddle, a third chip paddle and a fourth chip paddle by metal leads. The full-color LED display device has small size and high reliability; and during assembling modules, the invention can realize SMD high-speed automatic assembly and achieve high productivity effect.
Description
Technical field
The present invention relates to technical field of electronic devices, be specifically related to a kind of full-color LED display device.
Background technology
The display screen of being made up of LED in the life becomes the sign of urban information modernization construction as a kind of important means of information propagation at present.LED display is a kind of by the luminous display screen that shows of control semiconductor light-emitting diode chip, reduce each 1024 grades of gray scale of red, green, blue truly by effective control of systems such as computing machine and constitute 10.73 hundred million kinds of colors, in real time the abundant various information such as literal, animation, picture and image of display color.Existing three light-emitting diode chip for backlight unit producing full-color LED display device are installed on the support, the positive pole of three diodes needs to utilize metal lead wire to be electrically connected with shared pin respectively, the negative pole of three diodes is electrically connected with three pins by metal lead wire respectively, pin is plug-in type, this structure exists sealing wire more, the shortcoming of rosin joint is consolidated and produced to not prison welding easily, thereby production cost height, production efficiency is low, reliability of products is low, again because pin is plug-in type, thereby occupation space is big, shortcomings such as volume is big, and its display screen that is assembled into generally has pixel big, and resolution is low, if being used for the nearer display screen of angular distance in the make-up room situation of colour mixture poor effect will occur, aberration is particularly evident when watching.
Summary of the invention
It is little to the purpose of this invention is to provide a kind of not only volume, and the high full-color LED display device of reliability.
In order to achieve the above object, technical scheme of the present invention is: a kind of full-color LED display device, comprise red light emitting diodes chip, green LED chip, blue led chips, first pin, second pin, the 3rd pin, the 4th pin and packaging body, described red light emitting diodes chip, green LED chip, blue led chips all are encapsulated in the packaging body, first pin, second pin, the 3rd pin, the 4th pin all have paster Ji Dao separately, and paster Ji Dao separately is schistose texture; The 3rd paster Ji Dao of the first paster Ji Dao of first pin, the second paster Ji Dao of second pin, the 3rd pin and the 4th paster Ji Dao of the 4th pin all encapsulate and are fixed in the packaging body; The surface of described red light emitting diodes chip, green LED chip and blue led chips is respectively different electrodes with the back side, and the back side is same polarity, and the back side of red light emitting diodes chip, green LED chip and blue led chips is mounted on respectively on the first paster Ji Dao; The surface of described red light emitting diodes chip, green LED chip and blue led chips is electrically connected with the second paster Ji Dao, the 3rd paster Ji Dao and the 4th paster Ji Dao by metal lead wire respectively.
The back side of described red light emitting diodes chip, green LED chip and blue led chips is negative pole.
The back side of described red light emitting diodes chip, green LED chip and blue led chips all is mounted on the first paster Ji Dao by the eutectic welding.
The back side of described red light emitting diodes chip, green LED chip and blue led chips is mounted on by conductive adhesive on the first paster Ji Dao.
Described red light emitting diodes chip, green LED chip and blue led chips are distributed on the first paster Ji Dao along straight line, and should equate with the distance of the dual-side of packaging body by the distribution straight line.
The close packaging body end of the extension of described first pin, second pin, the 3rd pin and the 4th pin all has bending, and the close external part place of extension all has bending, the back side of the external part of the extension of described first pin, second pin, the 3rd pin and the 4th pin is on same plane, and this same plane is positioned at the outside at the packaging body back side.
The straight line that described red light emitting diodes chip, green LED chip and blue led chips are distributed parallels with the direction of stretching out of first pin.
The described first paster Ji Dao is between the 3rd paster Ji Dao and the 4th paster base island, the second paster Ji Dao and the 3rd paster Ji Dao are positioned at the same side of the first paster Ji Dao, the direction of stretching out of first pin and second pin parallels, the direction of stretching out of the 3rd pin and the 4th pin parallels, second pin and the 3rd pin to stretch out direction opposite.
Described packaging body adopts transparent thermosetting epoxy resin.
The good effect that the present invention had is: because described four pins all have paster Ji Dao separately, and paster Ji Dao separately is schistose texture, the light-emitting diode chip for backlight unit of three different colours the back side be mounted on respectively on the first paster Ji Dao of first pin, and the back side of three light-emitting diode chip for backlight unit is same polarity, the surface of described three light-emitting diode chip for backlight unit respectively with the second paster Ji Dao, the 3rd paster Ji Dao and the 4th paster Ji Dao are electrically connected by metal lead wire, described three light-emitting diode chip for backlight unit and four pin paster Ji Dao separately all are encapsulated in the packaging body, metal lead wire and pad have been reduced, it is solid or produce the occurrence probability of rosin joint to have reduced not prison welding, thereby not only small product size is little, and the reliability height; Because after the volume of product was little, the pixel cell that unit area is held when the assembling display screen was more closeer, thereby can reduce dot spacing greatly and improve picture element density, thereby had effectively improved image resolution ratio; Because the back side of described three diodes is negative pole, thereby more helps guaranteeing the security of circuit, makes the components and parts in the circuit not fragile; Because described three light-emitting diode chip for backlight unit are distributed on the first paster Ji Dao along straight line, this distribution straight line equates with the distance of the dual-side of packaging body, and the first paster Ji Dao is between the 3rd paster Ji Dao and the 4th paster base island, thereby can improve the luminous homogeneity of product and the aberration when reducing to watch; Because the close packaging body end of the extension of described first pin, second pin, the 3rd pin and the 4th pin all has bending, and the close external part place of extension all has bending, the back side of the external part of the extension of four pins is on same plane, and this same plane is positioned at the outside at the packaging body back side, thereby when the assembling display module, can realize the high-speed automated assembling of SMD, the production efficiency height is fit to produce in enormous quantities.
Description of drawings
Fig. 1 is the structural representation that full-color LED display device of the present invention is cut packaging body open;
Fig. 2 is along the cross-sectional schematic of A-A direction among Fig. 1;
Fig. 3 is circuit theory diagrams of the present invention.
Embodiment
Below in conjunction with the embodiment that accompanying drawing provides, the present invention is described in further detail.
Referring to Fig. 1,2, shown in 3, a kind of full-color LED display device, comprise red light emitting diodes chip 1, green LED chip 2, blue led chips 3, first pin 4, second pin 5, the 3rd pin 6, the 4th pin 7 and packaging body 8, described red light emitting diodes chip 1, green LED chip 2, blue led chips 3 all is encapsulated in the packaging body 8, first pin 4, second pin 5, the 3rd pin 6, the 4th pin 7 all has paster base island 4-1 separately, 5-1,6-1,7-1, and paster base island 4-1 separately, 5-1,6-1,7-1 is schistose texture; The 3rd paster base island 6-1 of the first paster base island 4-1 of first pin 4, the second paster base island 5-1 of second pin 5, the 3rd pin 6 and the 4th paster base island 7-1 of the 4th pin 7 all encapsulate and are fixed in the packaging body 8; The surface of described red light emitting diodes chip 1, green LED chip 2 and blue led chips 3 is respectively different electrodes with the back side, and the back side is same polarity, and the back side of red light emitting diodes chip 1, green LED chip 2 and blue led chips 3 is mounted on respectively on the first paster base island 4-1; The surface of described red light emitting diodes chip 1, green LED chip 2 and blue led chips 3 is electrically connected with the second paster base island 5-1, the 3rd paster base island 6-1 and the 4th paster base island 7-1 by metal lead wire respectively.
Shown in Fig. 1,3, in order more to help guaranteeing the security of circuit, make the components and parts in the circuit not fragile, the back side of described red light emitting diodes chip 1, green LED chip 2 and blue led chips 3 is negative pole.
Shown in Fig. 1,2, reach good Ohmic contact when mounting for the back side that guarantees diode chip for backlight unit and pairing paster Ji Dao, the back side of described red light emitting diodes chip 1, green LED chip 2 and blue led chips 3 all is mounted on the first paster base island 4-1 by the eutectic welding.The back side of described red light emitting diodes chip 1, green LED chip 2 and blue led chips 3 is mounted on by conductive adhesive on the first paster base island 4-1.
Shown in Fig. 1,2, in order to improve the luminous homogeneity of product and aberration when reducing to watch, described red light emitting diodes chip 1, green LED chip 2 and blue led chips 3 are distributed on the first paster base island 4-1 along straight line, and should equate with the distance of the dual-side of packaging body 8 by the distribution straight line.
Referring to shown in Figure 2, in order to realize the high-speed automated assembling of SMD and to improve efficiency of assembling, close packaging body 8 ends of the extension of described first pin 4, second pin 5, the 3rd pin 6 and the 4th pin 7 all have bending, and the close external part place of extension all has bending, the back side of the external part of the extension of described first pin 4, second pin 5, the 3rd pin 6 and the 4th pin 7 is on same plane, and this same plane is positioned at the outside at packaging body 8 back sides.Promptly the outside at this same plane and packaging body 8 back sides has the discrepancy in elevation of δ in Fig. 2.
Referring to shown in Figure 1, in order to improve the luminous homogeneity of product, the straight line that described red light emitting diodes chip 1, green LED chip 2 and blue led chips 3 are distributed parallels with the direction of stretching out of first pin 4.The described first paster base island 4-1 is between the 3rd paster base island 6-1 and the 4th paster base island 7-1, the second paster base island 5-1 and the 3rd paster base island 6-1 are positioned at the same side of the first paster base island 4-1, the direction of stretching out of first pin 4 and second pin 5 parallels, the direction of stretching out of the 3rd pin 6 and the 4th pin 7 parallels, second pin 5 and the 3rd pin 6 to stretch out direction opposite.
Shown in Fig. 1,2, in order to guarantee can to show multiple color and improve light extraction efficiency in packaging body, described packaging body 8 adopts transparent thermosetting epoxy resin.
Referring to shown in Figure 3, the present invention in use, the anodal V1 end (being the 4th pin 7 among Fig. 1) of red light emitting diodes chip 1, the anodal V2 end (being the 3rd pin 6 among Fig. 1) of green LED chip 2 and the anodal V3 end (being second pin 5 among Fig. 1) of blue led chips 3 are electrically connected with the positive terminal of circuit respectively, the negative pole end of red light emitting diodes chip 1, the negative pole end of the negative pole end of green LED chip 2 and blue led chips 3 all is electrically connected with common port V4 (being first pin 4 among Fig. 1), and common port V4 is electrically connected with the negative pole end of circuit.
Claims (10)
1, a kind of full-color LED display device, comprise red light emitting diodes chip (1), green LED chip (2), blue led chips (3), first pin (4), second pin (5), the 3rd pin (6), the 4th pin (7) and packaging body (8), described red light emitting diodes chip (1), green LED chip (2), blue led chips (3) all are encapsulated in the packaging body (8), it is characterized in that:
A, first pin (4), second pin (5), the 3rd pin (6), the 4th pin (7) all have paster Ji Dao (4-1,5-1,6-1,7-1) separately, and paster Ji Dao separately (4-1,5-1,6-1,7-1) is schistose texture;
The 3rd paster Ji Dao (6-1) of the first paster Ji Dao (4-1) of b, first pin (4), the second paster Ji Dao (5-1) of second pin (5), the 3rd pin (6) and the 4th paster Ji Dao (7-1) of the 4th pin (7) all encapsulate and are fixed in the packaging body (8);
The surface of c, described red light emitting diodes chip (1), green LED chip (2) and blue led chips (3) is respectively different electrodes with the back side, and the back side is same polarity, and the back side of red light emitting diodes chip (1), green LED chip (2) and blue led chips (3) is mounted on respectively on the first paster Ji Dao (4-1);
The surface of d, described red light emitting diodes chip (1), green LED chip (2) and blue led chips (3) is electrically connected with the second paster Ji Dao (5-1), the 3rd paster Ji Dao (6-1) and the 4th paster Ji Dao (7-1) by metal lead wire respectively.
2, full-color LED display device according to claim 1 is characterized in that: the back side of described red light emitting diodes chip (1), green LED chip (2) and blue led chips (3) is negative pole.
3, full-color LED display device according to claim 1 is characterized in that: the back side of described red light emitting diodes chip (1), green LED chip (2) and blue led chips (3) all is mounted on the first paster Ji Dao (4-1) by the eutectic welding.
4, full-color LED display device according to claim 1 is characterized in that: the back side of described red light emitting diodes chip (1), green LED chip (2) and blue led chips (3) is mounted on by conductive adhesive on the first paster Ji Dao (4-1).
5, full-color LED display device according to claim 1, it is characterized in that: described red light emitting diodes chip (1), green LED chip (2) and blue led chips (3) are distributed on the first paster Ji Dao (4-1) along straight line, and should equate with the distance of the dual-side of packaging body (8) by the distribution straight line.
6, full-color LED display device according to claim 1, it is characterized in that: close packaging body (8) end of the extension of described first pin (4), second pin (5), the 3rd pin (6) and the 4th pin (7) all has bending, and the close external part place of extension all has bending, the back side of the external part of the extension of described first pin (4), second pin (5), the 3rd pin (6) and the 4th pin (7) is on same plane, and this same plane is positioned at the outside at packaging body (8) back side.
7, full-color LED display device according to claim 5 is characterized in that: the straight line that described red light emitting diodes chip (1), green LED chip (2) and blue led chips (3) are distributed parallels with the direction of stretching out of first pin (4).
8, according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 described full-color LED display devices, it is characterized in that: the described first paster Ji Dao (4-1) is positioned between the 3rd paster Ji Dao (6-1) and the 4th paster Ji Dao (7-1), the second paster Ji Dao (5-1) and the 3rd paster Ji Dao (6-1) are positioned at the same side of the first paster Ji Dao (4-1), the direction of stretching out of first pin (4) and second pin (5) parallels, the direction of stretching out of the 3rd pin (6) and the 4th pin (7) parallels, second pin (5) and the 3rd pin (6) to stretch out direction opposite.
9, according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 described full-color LED display devices, it is characterized in that: described packaging body (8) adopts transparent thermosetting epoxy resin.
10, full-color LED display device according to claim 8 is characterized in that: described packaging body (8) adopts transparent thermosetting epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910026796 CN101551962B (en) | 2009-05-08 | 2009-05-08 | Full-color LED display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910026796 CN101551962B (en) | 2009-05-08 | 2009-05-08 | Full-color LED display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101551962A true CN101551962A (en) | 2009-10-07 |
| CN101551962B CN101551962B (en) | 2012-07-11 |
Family
ID=41156185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910026796 Active CN101551962B (en) | 2009-05-08 | 2009-05-08 | Full-color LED display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101551962B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101834267A (en) * | 2010-04-30 | 2010-09-15 | 深圳市奥伦德元器件有限公司 | Planar bracket and encapsulating method |
| CN102157480A (en) * | 2011-01-30 | 2011-08-17 | 常州银河世纪微电子有限公司 | Bridge rectifier |
| WO2012151723A1 (en) * | 2011-05-10 | 2012-11-15 | 湖南创图视维科技有限公司 | Naked-eye 3d tv wall |
| CN103050488A (en) * | 2011-10-14 | 2013-04-17 | 深圳市蓝科电子有限公司 | Light-emitting diode (LED) for display screen and production method |
| CN110854254A (en) * | 2019-10-25 | 2020-02-28 | 深圳市鑫和众电子科技有限公司 | Intensive LED packaging mode |
-
2009
- 2009-05-08 CN CN 200910026796 patent/CN101551962B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101834267A (en) * | 2010-04-30 | 2010-09-15 | 深圳市奥伦德元器件有限公司 | Planar bracket and encapsulating method |
| CN102157480A (en) * | 2011-01-30 | 2011-08-17 | 常州银河世纪微电子有限公司 | Bridge rectifier |
| WO2012151723A1 (en) * | 2011-05-10 | 2012-11-15 | 湖南创图视维科技有限公司 | Naked-eye 3d tv wall |
| CN103050488A (en) * | 2011-10-14 | 2013-04-17 | 深圳市蓝科电子有限公司 | Light-emitting diode (LED) for display screen and production method |
| WO2013053192A1 (en) * | 2011-10-14 | 2013-04-18 | 深圳市蓝科电子有限公司 | Light-emitting diode used by display screen and preparation method |
| CN110854254A (en) * | 2019-10-25 | 2020-02-28 | 深圳市鑫和众电子科技有限公司 | Intensive LED packaging mode |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101551962B (en) | 2012-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207852672U (en) | A kind of tetrad RGB-LED encapsulation modules and its display screen | |
| CN207425855U (en) | A kind of 8 pin-type RGB-LED encapsulation modules of tetrad and its display screen | |
| CN102214651A (en) | LED (light emitting diode) pixel unit device structure and preparation method thereof | |
| CN101551962B (en) | Full-color LED display device | |
| CN201057438Y (en) | Three primary color sheets type light emitting diode | |
| CN204029292U (en) | A kind of wafer dispersion nation fixation element sequentially pulsed LED module | |
| CN102931330A (en) | Preparation method of LED (light-emitting diode) flat-panel display unit | |
| CN202795924U (en) | High-integration light-emitting diode (LED) display screen based on chip on board (COB) packaging technology | |
| CN106531730A (en) | LED packaging assembly and manufacturing method thereof | |
| CN101958387A (en) | Novel LED light resource module packaging structure | |
| CN201402572Y (en) | All-color LED display device | |
| CN203312292U (en) | Miniaturized full-color surface mounting LED | |
| CN210778582U (en) | Surface mounting type LED | |
| CN112582514A (en) | LED chip, all-in-one chip, display module and display screen | |
| CN204463727U (en) | Led display module | |
| US9257620B1 (en) | Package structure of light-emitting diode module and method for manufacturing the same | |
| CN203812902U (en) | LED light emitting device | |
| CN104916232A (en) | Package structure and package method for high definition LED display screen module | |
| JP2019175892A (en) | Light-emitting module and manufacturing method therefor | |
| CN201336320Y (en) | Light-emitting diode packaging structure and lead frame | |
| CN204680327U (en) | High definition LED display module encapsulation construction | |
| CN207398144U (en) | A kind of LED component, display module and display screen | |
| CN105023986A (en) | LED light-emitting device | |
| CN206282882U (en) | LED package assemblings | |
| CN215069979U (en) | Lamp-drive integrated LED |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee after: Changzhou Galaxy century microelectronics Limited by Share Ltd Address before: 213022 Chaohu Road, Xinbei District, Jiangsu, China, No. 208, No. Patentee before: Changzhou Galaxy Century Micro-Electronics Co., Ltd. |