CN103050488A - Light-emitting diode (LED) for display screen and production method - Google Patents
Light-emitting diode (LED) for display screen and production method Download PDFInfo
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- CN103050488A CN103050488A CN201110312854XA CN201110312854A CN103050488A CN 103050488 A CN103050488 A CN 103050488A CN 201110312854X A CN201110312854X A CN 201110312854XA CN 201110312854 A CN201110312854 A CN 201110312854A CN 103050488 A CN103050488 A CN 103050488A
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- 210000003205 muscle Anatomy 0.000 claims description 5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a light-emitting diode (LED) for a display screen and a production method and relates to a plug-in LED for the display screen and a packaging method of the plug-in LED. Welding areas (15, 16, 17, 18 and 19) and die bonding area (20) are arranged at the tops of outer pins (10, 11, 12 and 13). Three groups of die bonding glue (9) are connected onto the die bonding area (20). An LED chip (2) is connected onto each group of die bonding glue (9). The LED chips (2) are connected with the welding areas (15, 16, 17, 18 and 19) through conducting wires (4) and then are sealed by using epoxy resin caps (14). The three LED chips (2) are equidistantly arranged in a line. Three curved-surface body optical structures (8) corresponding to the three LED chips (2) are arranged at the tops of the epoxy resin caps (14). The products which are produced by adopting the production method provided by the invention have the advantages of high brightness, large light output angle and good pixel resolution, and can be widely used in the fields of display screens, advertisement screens and the like.
Description
Technical field:
The present invention relates to display screen plug-in type light-emitting diode and method for packing thereof.
Background technology:
The technology of LED light-emitting diode is constantly updated progressive, uses more and more extensive.At present, being applied in the whole LED application market of LED display occupies a large portion ratio.
Display screen LED on the market mainly divides direct insertion, SMD.The contour structures of traditional display screen LED as depicted in figs. 1 and 2, direct insertion oval LED shown in Figure 1, the packaging body (1) of being made by epoxy resin, be generally oval hemisphere, led chip (2) is fixed in the matrix carrier cup (3), do electrical connection by wire (4) and get final product, light by two pins (5) plugged; And LED shown in Figure 2 is preformed cups type adopting surface mounted LED, be generally square, led chip (2) is fixed in the prefabricated cup (7) that PPA (6) makes, and does electrical connection by wire (4), again embedding silica gel or epoxy resin in the cup of PPA material.Wherein, straight cutting elliptic LED has the advantages such as high brightness, water resistance be good, but volume is large, lighting angle is little, be not suitable for the occasion of high-res, particularly the display screen of some semi-outdoors is limited at viewing distance, but require to possess waterproof ability, the image analytic degree occasion of having relatively high expectations again simultaneously; The volume of adopting surface mounted LED is little, lighting angle is large, but brightness is lower, water resistance is poor, light decay is large, anti-welding temperature is low.For occasion outdoor and semi-outdoor, adopting surface mounted LED just embodies its limitation.
Therefore out of doors or the display screen that uses of semi-outdoor occasion, mostly adopt plug-in type, pour into fluid sealant after water resistance better.Present colorful display screen on the market generally adopts 2R1G1B, 1R1G1B, 2R1G etc., because it adopts R, G, three monochromatic LED amalgamations of B together, its defective is at certain distance during with interior watching, and pixel resolution and color reducibility are difficult to embody real color.Also producer begins to attempt adopting adopting surface mounted LED to do at present, but basically all because of the weatherability problem, the market of having at last withdraw from.
Summary of the invention:
The object of the present invention is to provide a kind of brightness is high, rising angle is large, pixel resolution is good a kind of display screen with light-emitting diode and manufacture method.
The top of outer pin (10,11,12,13) arranges weld zone (15,16,17,18,19), crystal bonding area (20); The upper three groups of crystal-bonding adhesives (9) that connect of crystal bonding area (20), the upper led chip (2) that connects of every group of crystal-bonding adhesive (9), chip (2) is connected with weld zone (15,16,17,18,19) by wire (4); Use again epoxy resin cap (14) to be sealed.
Three led chips (2) are yi word pattern and equidistantly arrange.
Epoxy resin cap (14) top arranges three the curved body optical textures (8) corresponding with three led chips (2).
Adopt following processing step to finish: at first to make the mould bar that is provided with guide pillar (21), curved surface chamber (22), spacing stuck point (23), mould grain (24), steel disc (25), fixed gap (26), direction identifying hole (27);
Make afterwards support (28 → clean support (28) → die bond → curings → bonding wire → encapsulating → solidify → cut muscle → test → after cut → light splitting → packing puts in storage.
Plane layout weld zone (15,16,17,18,19), support (28) upper end, crystal bonding area (20).
The present invention has following advantage:
1, support is the plane for the part of die bond, routing, and die bond routing position can freely be adjusted with welding region in the die bond zone during production;
2, unique support Design and layout, make the three-primary color LED chip can become word order, do not intersect and routing do not occur, and the shortest in design object take the routing distance, avoid the routing overlap joint phenomenon in the production process, and can save the routing line length, and reduce the stress of the long generation of line length, improved the reliability in the production process;
3, the linear array of three primary colors chip cooperates three miniature linearly aligned curved bodies of corresponding mould bar, make finished product R, G, that the outgoing of B three primary colors light gets the light colour mixture is more even, angle is consistent;
4, obtain the LED of integrative packaging structure after employing epoxy resin integral encapsulating solidifies, make sealing and the good weatherability of LED of the present invention, be suitable for outdoor use;
5, the upper surface of LED of the present invention is three miniature linearly aligned curved bodies, adjacent curved surface is tangent, new style, so that light can be than the wide-angle outgoing at the curved body long axis direction, and at the curved body short-axis direction, dwindle the angle outgoing, such purpose is to reduce the bright dipping of non-viewing angle, has increased the brightness of LED;
6, when three chips are simultaneously luminous, no matter closely or at a distance watch LED, because the composite action of light, the white balance uniformity that presents, when New LED is made into display screen or other devices, no matter show dynamic menu or tableaux, the picture of demonstration is more true to nature.
Description of drawings:
Accompanying drawing 1 is that the master of the oval LED of prior art looks cross-sectional view.
Accompanying drawing 2 is perspective view of prior art adopting surface mounted LED.
Accompanying drawing 3 is three-dimensional installations diagram of LED of the present invention.
Accompanying drawing 4 is stereograms of led support of the present invention.
Accompanying drawing 5 is stereograms of the integral support of LED of the present invention.
Accompanying drawing 6 is main pseudosections of LED of the present invention.
Accompanying drawing 7 is to make the used mould bar of LED of the present invention.
Accompanying drawing 8 is process charts of the present invention.
Embodiment:
The top of pin arranges weld zone (15,16,17,18,19), crystal bonding area (20) outside support (28); The upper three groups of crystal-bonding adhesives (9) that connect of crystal bonding area (20), the upper led chip (2) that connects of every group of crystal-bonding adhesive (9), chip (2) is connected with weld zone (15,16,17,18,19) by wire (4); Use again epoxy resin cap (14) to be sealed.Three led chips (2) are yi word pattern and equidistantly arrange.Epoxy resin cap (14) top arranges three the curved body optical textures (8) corresponding with three led chips (2).
Adopt following processing step to finish:
At first make the mould bar that is provided with guide pillar (21), curved surface chamber (22), spacing stuck point (23), mould grain (24), steel disc (25), fixed gap (26), direction identifying hole (27);
Make afterwards support (28), in plane layout weld zone (15,16,17,18,19), support (28) upper end, crystal bonding area (20) → cleanings support (28) → die bond → curing → bonding wire → encapsulating → solidify → cut muscle → test → after cut → light splitting → packing puts in storage.
Production process: (such as Fig. 8):
1. check support of the present invention (as shown in Figure 5) whether oxidation and pin whether the bad items such as crooked are arranged, used after the passed examination.
2. clean: with ultrasonic wave or plasma cleaning support of the present invention, remove oxide or the pollutant on surface;
3. die bond: utilize automatic die bond machine, crystal-bonding adhesive (9) on crystal bonding area (20) point of support of the present invention is flattened on led chip (2) on the crystal-bonding adhesive (9).Three some glue positions must be positioned on the straight line at crystal bonding area (20) center, and three some glue location gap decide according to the curved-surface structure center distance of mould bar, and then the chip (2) with correspondence is fixed on a little good crystal-bonding adhesive (9);
4. solidify: the semi-finished product in the step 3 are toasted through putting into after the assay was approved baking box, crystal-bonding adhesive (9) is solidified, chip (2) is attached on the support tightly;
5. bonding wire: wire (4) is coupled together the electrode of each led chip (2) and corresponding weld zone (15), (16), (17), (18), (19) with bonder;
6. encapsulating: first mould bar is as shown in Figure 7 carried out preheating, then release agent is sprayed on the surface within it, and the semi-finished product that can allow encapsulating finish like this are easier to be finished from mould, avoids sticking on the mould bar after the glue curing and damages product.Epoxy resin or other the high-intensity resin heating through stirring, after removing bubble, liquid epoxy resin is poured in the mould grain (24) of mould bar, admittedly good support brilliant, that weld line is led by mould bar guide pillar (21), insert in the mould bar of encapsulating, press down whole piece support (28) to the spacing stuck point of mould bar (23), make support be inserted into the position;
7. solidify: the semi-finished product of will fill with glue, having inserted support are put into baking oven and are heated, and make epoxy resin cure;
8. solidify again: with the semi-finished product that are cured with carry out again one-step solidification after the mould bar separates, can guarantee that like this material such as epoxy resin has obtained sufficient curing;
9. cut muscle: the company's muscle between half-finished each utmost point pin of the LED that links together is cut off, become as shown in Figure 3;
10. light splitting: lamp is classified by test conditions such as forward voltage, brightness, dominant wavelengths;
11. warehouse-in: the product sampling observation warehousing after passing after will sealing.
Claims (5)
1. display screen light-emitting diode, it is characterized in that: the top of outer pin (10,11,12,13) arranges weld zone (15,16,17,18,19), crystal bonding area (20); The upper three groups of crystal-bonding adhesives (9) that connect of crystal bonding area (20), the upper led chip (2) that connects of every group of crystal-bonding adhesive (9), chip (2) is connected with weld zone (15,16,17,18,19) by wire (4); Use again epoxy resin cap (14) to be sealed.
2. a kind of display screen light-emitting diode as claimed in claim 1, it is characterized in that: three led chips (2) are yi word pattern and equidistantly arrange.
3. a kind of display screen light-emitting diode as claimed in claim 1 is characterized in that: epoxy resin cap (14) top setting three the curved body optical textures (8) corresponding with three led chips (2).
4. the manufacture method of a display screen usefulness light-emitting diode is characterized in that: adopt following processing step to finish: at first make the mould bar that is provided with guide pillar (21), curved surface chamber (22), spacing stuck point (23), mould grain (24), steel disc (25), fixed gap (26), direction identifying hole (27);
Make afterwards support (28) → cleaning support (28) → die bond → curing → bonding wire → encapsulating → solidify → cut muscle → test → after cut → light splitting → packing warehouse-in.
5. a kind of display screen as claimed in claim 4 is characterized in that: plane layout weld zone (15,16,17,18,19), support (28) upper end, crystal bonding area (20) with the manufacture method of light-emitting diode.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110312854XA CN103050488A (en) | 2011-10-14 | 2011-10-14 | Light-emitting diode (LED) for display screen and production method |
| PCT/CN2012/001026 WO2013053192A1 (en) | 2011-10-14 | 2012-07-31 | Light-emitting diode used by display screen and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110312854XA CN103050488A (en) | 2011-10-14 | 2011-10-14 | Light-emitting diode (LED) for display screen and production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103050488A true CN103050488A (en) | 2013-04-17 |
Family
ID=48063080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110312854XA Pending CN103050488A (en) | 2011-10-14 | 2011-10-14 | Light-emitting diode (LED) for display screen and production method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103050488A (en) |
| WO (1) | WO2013053192A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103343904A (en) * | 2013-07-11 | 2013-10-09 | 王珏越 | Integrated photoelectric engine module |
| CN111834514A (en) * | 2020-07-23 | 2020-10-27 | 中国振华集团永光电子有限公司（国营第八七三厂） | Bracket type infrared transmitting tube with ultra-large half-intensity angle and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6225139B1 (en) * | 2000-01-24 | 2001-05-01 | Chan Tsung-Wen | Manufacturing method of an led of a type of round concave cup with a flat bottom |
| CN1357868A (en) * | 2001-12-31 | 2002-07-10 | 王国忠 | Lens combination converged LED array display |
| JP2009194253A (en) * | 2008-02-15 | 2009-08-27 | Fuji Xerox Co Ltd | Method of manufacturing light-emitting element array chip, micro-lens molding die, light-emitting element head, and image forming apparatus |
| CN101551962A (en) * | 2009-05-08 | 2009-10-07 | 常州银河世纪微电子有限公司 | Full-color LED display device |
| CN101740708A (en) * | 2009-12-25 | 2010-06-16 | 杜姬芳 | Integration and package method for high-power light-emitting diode (LED) light source |
| CN201853735U (en) * | 2010-10-20 | 2011-06-01 | 木林森股份有限公司 | High-density light-emitting diode packaging module |
-
2011
- 2011-10-14 CN CN201110312854XA patent/CN103050488A/en active Pending
-
2012
- 2012-07-31 WO PCT/CN2012/001026 patent/WO2013053192A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6225139B1 (en) * | 2000-01-24 | 2001-05-01 | Chan Tsung-Wen | Manufacturing method of an led of a type of round concave cup with a flat bottom |
| CN1357868A (en) * | 2001-12-31 | 2002-07-10 | 王国忠 | Lens combination converged LED array display |
| JP2009194253A (en) * | 2008-02-15 | 2009-08-27 | Fuji Xerox Co Ltd | Method of manufacturing light-emitting element array chip, micro-lens molding die, light-emitting element head, and image forming apparatus |
| CN101551962A (en) * | 2009-05-08 | 2009-10-07 | 常州银河世纪微电子有限公司 | Full-color LED display device |
| CN101740708A (en) * | 2009-12-25 | 2010-06-16 | 杜姬芳 | Integration and package method for high-power light-emitting diode (LED) light source |
| CN201853735U (en) * | 2010-10-20 | 2011-06-01 | 木林森股份有限公司 | High-density light-emitting diode packaging module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103343904A (en) * | 2013-07-11 | 2013-10-09 | 王珏越 | Integrated photoelectric engine module |
| CN111834514A (en) * | 2020-07-23 | 2020-10-27 | 中国振华集团永光电子有限公司（国营第八七三厂） | Bracket type infrared transmitting tube with ultra-large half-intensity angle and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013053192A1 (en) | 2013-04-18 |
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Application publication date: 20130417 |