CN104319345A - Packaging method of LED filament and LED filament - Google Patents
Packaging method of LED filament and LED filament Download PDFInfo
- Publication number
- CN104319345A CN104319345A CN201410626642.2A CN201410626642A CN104319345A CN 104319345 A CN104319345 A CN 104319345A CN 201410626642 A CN201410626642 A CN 201410626642A CN 104319345 A CN104319345 A CN 104319345A
- Authority
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- China
- Prior art keywords
- silicones
- led
- fluorescent powder
- mould
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000843 powder Substances 0.000 claims abstract description 41
- 239000000084 colloidal system Substances 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 52
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 13
- 238000012856 packing Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 241000218202 Coptis Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 6
- 239000011347 resin Substances 0.000 abstract 6
- 229920005989 resin Polymers 0.000 abstract 6
- 229910052710 silicon Inorganic materials 0.000 abstract 6
- 239000010703 silicon Substances 0.000 abstract 6
- 239000010980 sapphire Substances 0.000 description 7
- 229910052594 sapphire Inorganic materials 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009992 mercerising Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a packaging method of an LED filament. The packaging method of the LED filament includes the steps that a liquid silicon resin and fluorescent powder mixture is injected into a mould, and a metal conductive pin is arranged at one end of the silicon resin and fluorescent powder mixture inside the mould; the mould is removed after being heated and solidified, and silicon resin and fluorescent powder colloid with the metal conductive pin at one end is obtained; a plurality of LED chips are installed on the silicon resin and fluorescent powder colloid, and the LED chips are mutually connected through a wire and then connected to the metal conductive pin to form a conductive path; the silicon resin and fluorescent powder colloid with the LED chips is put into the mould, and a liquid silicon resin and fluorescent powder mixture is injected into the mould to cover the LED chips and the wire; the mould is removed after being heated and solidified, and the packaged LED filament finished product with a supporting frame is obtained. The LED filament is packaged without the supporting frame, and the quality problems of low yield, low light transmittance of the supporting frame and the like are resolved.
Description
Technical field
?the present invention relates to LED technical field, particularly relate to a kind of LED silk without support method for packing and the LED silk that is made according to this method for packing.
Background technology
lED silk is also LED post, and LED light source will reach certain illuminance and illuminating area in the past, need install the optics of lens and so on additional, affect lighting effect, can reduce the due energy-saving effect of LED.LED silk realizes 360 ° of full angle luminescences by encapsulating structure, and wide-angle is luminous and do not need to add lens, realizes three-dimensional light source.As far back as 2008, the imitative conventional incandescent being made up of filament LED lamp bead that Japanese oxtail light source is released, caused and greatly pays close attention in the industry, and realize mass production.Start occur and accepted by increasing consumer in a large number with the LED silk candle lamp that is light source, Crystal lamp, bulb lamp subsequently, the occasion be suitable at that time is mainly in room lighting places such as five-star commercial hotel, high-grade mansions.
Although LED mercerising source can be good at alternative incandescent lamp, technically still there is certain problem at present.Existing LED silk encapsulation all needs to use support, and the encapsulation of LED silk mainly adopts pottery, sapphire, metal three kinds of supports, based on sapphire support on market.Adopt sapphire and ceramics bracket to encapsulate because support itself is frangible, sapphire and the problem such as pottery and metal adhesive make finished product yield still not high.Adopt metallic support then can yielding because of metal itself, support is oxidizable and the reason such as PPA non-refractory makes easily to occur quality problem in the not high and follow-up use procedure of yields.Secondly sapphire and ceramics bracket itself on the high side, LED silk cost is made to be difficult to decline, 3rd problem needs to realize 360 ° of uniformly light-emittings due to LED silk, and be that sapphire or the light transmittance of ceramics bracket are all on the low side at present, general at about 40-50%, although and metallic support is holed for light efficiency is dredged to the back side on support, light transmission is appointed so not as good as sapphire and ceramics bracket.Because the light transmission of support own is good thus have impact on the uniformity of LED silk light extraction efficiency and positive and negative luminescence.
So, how to solve LED silk encapsulation yield, control cost further, improve and the necessity that its optical efficiency and uniformity of luminance will be the designs of this kind of encapsulating structure.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of method for packing and LED silk of LED silk, does not need support to encapsulate, and realizes without support encapsulation, and effective solution yields is lower, the lower problem of support light transmittance.
In order to solve the problems of the technologies described above, the present invention takes following technical scheme:
On the one hand, the invention provides a kind of method for packing of LED silk, comprise the following steps:
In mould, inject liquid silicones and phosphor mixture, and metal conductive pin is placed in one end of silicones and phosphor mixture in mould;
Remove mould after mold heated being solidified, obtain silicones and the fluorescent powder colloid of an end band metal conductive pin;
Silicones and fluorescent powder colloid are installed several LED chips, with wire, each LED chip is connected mutual and be connected to metal conductive pin formation conductive path;
The silicones and fluorescent powder colloid that set LED chip are put into mould, and injects liquid silicones to this mould and LED chip and wire cover by phosphor mixture;
Remove mould after mold heated being solidified, obtain without support packaged LED filament finished product.
By crystal-bonding adhesive, this LED chip is bonded on silicones and fluorescent powder colloid when LED chip is installed.
The silicones of described liquid state and phosphor mixture first reinject in mould after deaeration process.
The described wire for connecting each LED chip is gold thread.
For being connected in series between each LED chip described.
On the other hand, the present invention also provides a kind of LED silk, comprise silicones and fluorescent powder colloid and metallic conduction pin, this silicones and fluorescent powder colloid viscous are connected to some LED chips, metallic conduction pin one end is located in silicones and fluorescent powder colloid, the other end exposed silicones and phosphor gel external, be connected to metallic conduction pin after being interconnected by wire between each LED chip and form conductive path.
The present invention is completely different from traditional structure needing support to carry out packaged LED filament, give up support completely, realize encapsulating without support to LED silk, directly shaping LED chip in colloid, and by adopting silicones and fluorescent powder colloid, ensure light transmittance, due to without support, reduce production cost, improve yields, the uniformity of light extraction efficiency and bright dipping is all improved.In addition, due to support that need not be extra, the steadiness of LED chip is ensured.
Accompanying drawing explanation
Accompanying drawing 1 is perspective view of the present invention;
Accompanying drawing 2 is part section structural representation of the present invention;
The LED chip that accompanying drawing 3 is is installed and wiring construction schematic diagram.
Embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with accompanying drawing, the invention will be further described.
Present invention is disclosed a kind of method for packing of LED silk, the method realizes, without support encapsulation, not needing to use support in whole encapsulation process.Comprise the following steps:
Step 1, injects liquid silicones and phosphor mixture in mould, and metal conductive pin is placed in one end of silicones and phosphor mixture in mould.Deaeration process is carried out to silicones and fluorescent material mixing and stirring, thus obtains required silicones and fluorescent material liquefied mixture.The bubble in mixture is removed by deaeration process.Metal conductive pin is two, realizes current circuit.
Step 2, remove mould after mold heated being solidified, obtain silicones and the fluorescent powder colloid of an end band metal conductive pin, this silicones and fluorescent powder colloid have certain hardness and thickness.After mold heated, the silicones in mould and fluorescent powder colloid are by hot curing, and now metal conductive pin one end is just molded directly within this silicones and fluorescent powder colloid.
Step 3, silicones and fluorescent powder colloid are installed several LED chips, connect mutual and be connected to metal conductive pin formation conductive path with wire by each LED chip.After the process of step 2, obtain silicones and fluorescent powder colloid that one has metal conductive pin, the hardness utilizing silicones and fluorescent powder colloid itself to have and light transmission, using silicones and fluorescent powder colloid as die bond substrate, directly on this silicones and fluorescent powder colloid, LED chip is installed on same surface with metal conductive pin, gives up extra support or substrate completely to install LED chip.With gold thread, each LED chip is connected with each other, in the present embodiment, adopt series system to connect between each LED chip, and then be connected to metal conductive pin formation conductive path, it is shinny that metal conductive pin and extraneous power supply are connected the luminescence that can realize LED chip.When concrete installation LED chip, crystal-bonding adhesive is usually adopted to be bonded on silicones and fluorescent powder colloid by LED chip.
Step 4, puts into mould by the silicones and fluorescent powder colloid that set LED chip, and injects liquid silicones to this mould and LED chip and wire cover by phosphor mixture.After the process of step 3, now obtain semi-finished product, identical with step 1 of the silicones re-injected to mould and fluorescent material liquefied mixture.
Step 5, by mold heated, silicones in mould and fluorescent material liquefied mixture are by hot curing, and be molded as one with silicones before this and fluorescent powder colloid, mould is removed after solidification, obtain without support packaged LED filament finished product, in LED chip and gold thread, metal conductive pin one end are wrapped in by this LED silk finished product, as shown in Figure 1.
The LED silk obtained is made according to said method, as shown in accompanying drawing 1,2 and 3, comprise silicones and fluorescent powder colloid 1 and metallic conduction pin 2, this silicones and fluorescent powder colloid 1 viscous are connected to some LED chips 4, metallic conduction pin 2 one end is located in silicones and fluorescent powder colloid 1, the other end is exposed outside silicones and fluorescent powder colloid 1, is connected to metallic conduction pin 2 forms conductive path between each LED chip 4 by wire after being interconnected.LED chip 4 is bonded in silicones and fluorescent powder colloid 1 by crystal-bonding adhesive 3.Using silicones and fluorescent powder colloid as die bond substrate, do not need extra support and substrate for installing LED chip.
In the present embodiment, silicones and fluorescent powder colloid are strip, arrange two row's LED chips altogether.It should be noted that, enumerating of the present embodiment is not restriction to the present invention program, in different application scenarios and in the face of different demands, silicones and fluorescent powder colloid can be arranged to various shape, and a row, three row or the LED chips of more rows are set, or LED chip is arranged according to array format, there is no at this and do concrete restriction.
In addition, described LED chip can be unified color, as white, or yellow.The LED chip of white that can certainly to be part light source be, other part light sources are yellow LED chip or light source is the LED chip of other colors.Or can be made up of the LED chip of more than three kinds or three kinds Different Light colors.
It should be noted that, the above is not the restriction to technical solution of the present invention, and without departing from the concept of the premise of the invention, any apparent replacement is all within protection scope of the present invention.
Claims (6)
1. a method for packing for LED silk, comprises the following steps:
In mould, inject liquid silicones and phosphor mixture, and metal conductive pin is placed in one end of silicones and phosphor mixture in mould;
Remove mould after mold heated being solidified, obtain silicones and the fluorescent powder colloid of an end band metal conductive pin;
Silicones and fluorescent powder colloid are installed several LED chips, with wire, each LED chip is connected mutual and be connected to metal conductive pin formation conductive path;
The silicones and fluorescent powder colloid that set LED chip are put into mould, and injects liquid silicones to this mould and LED chip and wire cover by phosphor mixture;
Remove mould after mold heated being solidified, obtain without support packaged LED filament finished product.
2. the method for packing of LED silk according to claim 1, is characterized in that, is bonded on silicones and fluorescent powder colloid by this LED chip when installing LED chip by crystal-bonding adhesive.
3. the method for packing of LED silk according to claim 2, is characterized in that, the silicones of described liquid state and phosphor mixture first reinject in mould after deaeration process.
4. the method for packing of the LED silk according to claim 1 or 2 or 3, is characterized in that, the described wire for connecting each LED chip is gold thread.
5. the method for packing of LED silk according to claim 4, is characterized in that, for being connected in series between each LED chip described.
6. one kind according to claim 1 method make LED silk, it is characterized in that, comprise silicones and fluorescent powder colloid and metallic conduction pin, this silicones and fluorescent powder colloid viscous are connected to some LED chips, metallic conduction pin one end is located in silicones and fluorescent powder colloid, the other end exposed silicones and phosphor gel external, be connected to metallic conduction pin after being interconnected by wire between each LED chip and form conductive path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410626642.2A CN104319345A (en) | 2014-11-10 | 2014-11-10 | Packaging method of LED filament and LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410626642.2A CN104319345A (en) | 2014-11-10 | 2014-11-10 | Packaging method of LED filament and LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104319345A true CN104319345A (en) | 2015-01-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410626642.2A Pending CN104319345A (en) | 2014-11-10 | 2014-11-10 | Packaging method of LED filament and LED filament |
Country Status (1)
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|---|---|
| CN (1) | CN104319345A (en) |
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140381A (en) * | 2015-09-17 | 2015-12-09 | 浙江锐迪生光电有限公司 | Substrate-free LED filament and manufacturing method thereof, and substrate-free LED filament lamp |
| CN106468405A (en) * | 2015-08-17 | 2017-03-01 | 嘉兴山蒲照明电器有限公司 | LED filament and its manufacture method and the LEDbulb lamp applying described LED filament |
| GB2547085A (en) * | 2015-12-19 | 2017-08-09 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED filament |
| DE102016109665A1 (en) * | 2016-05-25 | 2017-11-30 | Osram Opto Semiconductors Gmbh | FILAMENT AND LIGHTING DEVICE |
| US9995474B2 (en) | 2015-06-10 | 2018-06-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament, LED filament assembly and LED bulb |
| CN108224126A (en) * | 2017-12-06 | 2018-06-29 | 广明源光科技股份有限公司 | filament shaping method |
| CN109323135A (en) * | 2018-10-24 | 2019-02-12 | 浙江鼎鑫工艺品有限公司 | A kind of filament of integrated control chip and LED wafer |
| US10240724B2 (en) | 2015-08-17 | 2019-03-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
| DE102017122410A1 (en) * | 2017-09-27 | 2019-03-28 | Osram Opto Semiconductors Gmbh | Leadframe device and method of manufacturing a plurality of devices |
| US10359152B2 (en) | 2015-08-17 | 2019-07-23 | Zhejiang Super Lighting Electric Appliance Co, Ltd | LED filament and LED light bulb |
| US10473271B2 (en) | 2015-08-17 | 2019-11-12 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament module and LED light bulb |
| US10487987B2 (en) | 2015-08-17 | 2019-11-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
| US10544905B2 (en) | 2014-09-28 | 2020-01-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10655792B2 (en) | 2014-09-28 | 2020-05-19 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10677396B2 (en) | 2006-07-22 | 2020-06-09 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with symmetrical filament |
| US10784428B2 (en) | 2014-09-28 | 2020-09-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US10790419B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US10790420B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Light bulb with a symmetrical LED filament |
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| US10845008B2 (en) | 2014-09-28 | 2020-11-24 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
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| US11015764B2 (en) | 2014-09-28 | 2021-05-25 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with flexible LED filament having perpendicular connecting wires |
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