CN203950801U - A kind of backlight module and paster type encapsulation LED - Google Patents
A kind of backlight module and paster type encapsulation LED Download PDFInfo
- Publication number
- CN203950801U CN203950801U CN201420229289.XU CN201420229289U CN203950801U CN 203950801 U CN203950801 U CN 203950801U CN 201420229289 U CN201420229289 U CN 201420229289U CN 203950801 U CN203950801 U CN 203950801U
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 83
- 238000004806 packaging method and process Methods 0.000 claims abstract description 36
- 230000004907 flux Effects 0.000 claims description 31
- 230000009977 dual effect Effects 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 20
- 238000000465 moulding Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 239000003292 glue Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000005142 aphototropism Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model discloses a kind of backlight module and paster type encapsulation LED, described paster type encapsulation LED comprises support, LED chip and packaging body, wherein said LED chip is fixed on described support, described packaging body is package lens, and it is arranged on, and on described support, it is arranged at the light direction of LED chip at least partly.By the way, the utility model can reduce production costs, and is conducive to the lightening of product.
Description
Technical field
The utility model relates to LED technical field, particularly relates to a kind of backlight module and paster type encapsulation LED.
Background technology
Compared with traditional cathode fluorescent tube (CCFL) backlight module, adopt the screen of the backlight module of LED to there is the advantages such as brightness is more even, low in energy consumption, outward appearance is more frivolous, therefore increasing light source product adopts LED as backlight.LED-backlit technology mainly comprises direct-type backlight and side entrance back.
Wherein, it is backlight that side-edge type backlight is mainly used in small size, for example mobile phone screen backlight, if it is backlight that side-edge type backlight is applied to large scale, the LCD TV of for example large-size, the weight of its light guide plate and cost will increase along with the increase of size, and the shortcoming that its luminosity is lower and uniformity is poor is also obvious all the more.Therefore, large area backlight mainly adopts direct-type backlight.In direct-type backlight technology, do not need the light of light guide plate conduction LED, it is mainly that the form that adopts small size LED lamp pearl to add lens forms backlight, outside the LED lamp pearl of encapsulated moulding, install lens additional, the object exhaling to reach light that LED lamp pearl is sent, thus, on the basis of LED lamp pearl, also need additionally to increase lens, make product thickening, and lens are normally by being manually mounted on LED lamp pearl, the cost that has increased artificial subsides lens, is unfavorable for cost.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of backlight module and paster type encapsulation LED, can reduce production costs, and be conducive to the lightening of product.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of paster type encapsulation LED is provided, comprise support, LED chip and packaging body, described LED chip is fixed on described support, described packaging body is package lens, and it is arranged on described support and is arranged at least partly the light direction of described LED chip.
Wherein, described package lens has reservation shape, to make distribution curve flux that described paster type encapsulation LED formed as symmetric shape.
Wherein, described package lens is shaped as dual hump shape at least one cross section at described LED chip optical axis place.
Wherein, the exiting surface of described LED chip to the distance between the exiting surface of the light of LED chip described in described package lens transmission is less than 20mm.
Wherein, described support is flat bracket.
For solving the problems of the technologies described above, another technical scheme that the utility model adopts is: a kind of backlight module is provided, comprises circuit board and paster type encapsulation LED; Described paster type encapsulation LED is arranged on described circuit board, comprise support, LED chip and packaging body, described LED chip is fixed on described support, and described packaging body is package lens, and it is arranged on described support and is arranged at least partly the light direction of described LED chip.
Wherein, described package lens has reservation shape, to make distribution curve flux that described paster type encapsulation LED formed as symmetric shape.
Wherein, described package lens is shaped as dual hump shape at least one cross section at described LED chip optical axis place.
Wherein, the exiting surface of described LED chip to the distance between the exiting surface of the light of LED chip described in described package lens transmission is less than 20mm.
Wherein, described support is flat bracket.
The beneficial effects of the utility model are: the situation that is different from prior art, in the utility model paster type encapsulation LED, comprise support, LED chip and packaging body, wherein LED chip is fixed on support, packaging body is package lens, and be arranged on the light direction that is arranged on support and at least partly LED chip, in the utility model, packaging body is package lens, therefore package lens is as one of potted element of LED chip, be fixed on support to have obtained the paster type encapsulation LED after encapsulation with LED chip one, package lens is both as the packaging of paster type encapsulation LED thus, play again the effect of lens simultaneously, compared with the existing way that additionally increases by lens on the LED of encapsulated moulding, the packaging of the utility model using package lens as LED chip, can omit the lens of extra use, when reducing costs, can reduce the thickness of product, be conducive to lightening development.And packaging body of the present utility model is package lens, therefore package lens can directly be formed on support in LED chip is packaged in the process of support, can reduce thus and even omit the artificial cost that pastes lens, be conducive to the reduction of production cost, and can improve the efficiency of encapsulation.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model paster type encapsulation LED mono-execution mode;
Fig. 2 is the distribution curve flux that the LED light source of prior art forms;
Fig. 3 is the light type figure of the LED light source of prior art;
Fig. 4 is that the utility model forms the distribution curve flux that the paster type encapsulation LED that obtains after package lens forms on support;
Fig. 5 is the light type figure that the utility model forms the paster type encapsulation LED obtaining after package lens on support;
Fig. 6 is the structural representation of another execution mode of the utility model paster type encapsulation LED;
Fig. 7 is the structural representation of the utility model backlight module one execution mode;
Fig. 8 is the flow chart of packaging technology one execution mode of the utility model paster type encapsulation LED;
Fig. 9 is in another execution mode of packaging technology of the utility model paster type encapsulation LED, forms the flow chart of package lens on the support that is fixed with LED chip;
Figure 10 is the intensity map of single paster type encapsulation LED of the present utility model on the display screen apart from 15mm;
Figure 11 is the intensity map on the display screen apart from 15mm according to many of 3*3 matrix distribution paster type encapsulation LED of the present utility model.
Embodiment
Below in conjunction with drawings and embodiments, the utility model is elaborated.
Consult Fig. 1, in an execution mode of the utility model paster type encapsulation LED, paster type encapsulation LED comprises support 11, LED chip 12 and packaging body, and wherein packaging body is package lens 13.Wherein, support 11 is flat bracket, and LED chip 12 is fixed on support 11.Package lens arranges 13 and is arranged on support 11, and preferably, package lens 13 covers LED chip 12.Certainly, package lens 13 can be only also that part is arranged on the light direction of LED chip 12.
In present embodiment, package lens 13 is as the packaging body of LED chip 12, for LED chip 12 is encapsulated, be package lens 13 as one of packaging of LED chip 12, with LED chip 12 integral packagings on support 11, it was both used for packaging LED chips 12 as packaging, play again the effect of lens simultaneously, obtain compared with lens effect with the existing lens that install additional on the LED lamp pearl of encapsulated moulding, present embodiment need to not install lens additional on the LED of encapsulated moulding, but be formed directly into package lens 13 as packaging on support 11, with packaging LED chips 12, can omit thus the use of extra lens, when reducing costs, also can reduce the thickness of product, be conducive to the lightening development of product.
In addition, package lens 13 is as the packaging body of LED chip 12, therefore can in LED chip 12 is packaged in the process of support 11, package lens 13 be directly formed on support 11, be packaged in the process of support 11 at LED chip 12, package lens 13 is formed directly on support by production equipment, instead of manually the lens of moulding are installed on support, with the existing lens that manually mount to compared with the technology on support, present embodiment can reduce even omits the artificial cost that pastes lens, and is conducive to improve packaging efficiency.
The luminous intensity distribution process of LED chip is generally the process that light is evenly distributed and brightness is concentrated that LED chip sends that makes.Existing LED light source normally installs lens additional and forms outside the LED lamp pearl of encapsulated moulding, reaches best light mixing effect, to complete the luminous intensity distribution of LED chip by adjusting lens to the thickness in the lamp chamber between LED chip.But, carry out in this way the luminous intensity distribution of LED lamp pearl, the uniformity of the brightness of the LED light source obtaining is poor, as shown in Figures 2 and 3, Fig. 2 is the distribution curve flux that the LED light source of prior art forms, and wherein abscissa represents lighting angle, ordinate represents brightness, Fig. 3 is the light type figure of the LED light source of prior art, the numeral lighting angle of the circle periphery shown in Fig. 3, the numeral lighting angle in circle.As can be seen from Figures 2 and 3, the distribution curve flux fluctuation of the LED light source of prior art is larger, and within the scope of lighting angle, all less than comparatively smooth curve, the brightness uniformity that shows LED light source is poor.
Different from the luminous intensity distribution process of prior art, by the package lens 13 of present embodiment, can realize the luminous intensity distribution that can complete LED chip 12 in package level.In present embodiment, package lens 13 is as one of packaging of LED chip 12, it has reservation shape, and the distribution curve flux forming taking the paster type encapsulation LED that makes to be obtained after package lens 13 is arranged on the light direction of LED chip 12 is as symmetric shape.In conjunction with the distribution curve flux shown in Fig. 4 and Fig. 5, the distribution curve flux that the paster type encapsulation LED that Fig. 4 obtains after package lens 13 for the utility model forms on support 11 forms, wherein, abscissa represents that LED chip 12 sees through the lighting angle of package lens 13 outgoing, ordinate represents brightness, Fig. 5 is the light type figure that the utility model forms the paster type encapsulation LED obtaining after package lens 13 on support 11, this light type figure and Fig. 4 are similar, are equally to represent to form the distribution curve flux that the adopting surface mounted LED that obtains after package lens forms.As shown in Figure 4, compared with the distribution curve flux shown in Fig. 2, distribution curve flux of the present utility model at-40 degree to more steady within the scope of the lighting angle of 40 degree, fluctuate less, brightness is basically identical, therefore the brightness that obtained is more even and concentrated, and the distribution curve flux of this section is the distribution curve flux of symmetric shape.Therefore, by the package lens 13 of present embodiment, symmetrical distribution curve flux can be obtained, uniformity and the centrality of brightness can be improved thus.
The package lens 13 of present embodiment has reservation shape, be that the utility model is packaged in the process of support 11 at LED chip 12, on support 11, directly form the package lens 13 with reservation shape, the distribution curve flux that the package lens 13 of this reservation shape can be configured to make LED chip 12 form through package lens 13 is symmetric shape, thereby can make light be more evenly distributed, brightness is more concentrated.Therefore, the luminous intensity distribution process of LED chip 12 of the present utility model is to complete in package level, the luminous intensity distribution that passes through formed package lens 13 in the encapsulation process of LED chip 12 time and complete LED chip 12, it is symmetric shape that the package lens 13 obtaining can make distribution curve flux.Compared with prior art, the utility model can be realized package lens 13 and support 11 integrative packagings, and the package lens 13 that direct formation has reservation shape on support 11 can complete luminous intensity distribution, does not need artificial mounted lens to carry out luminous intensity distribution.
Preferably, package lens 13 is shaped as dual hump shape in the cross section at the optical axis place of LED chip 12.Experiment shows, the package lens 13 of dual hump shape can obtain the distribution curve flux of better symmetric shape, makes being more evenly distributed of light, and brightness is more concentrated.Certainly, the shape of package lens 13 can be also other shapes, and only needing the distribution curve flux that can make the paster type encapsulation LED obtaining after encapsulation form is symmetric shape.
Preferably, the thickness of package lens 13 is lower than 20mm, and the thickness of package lens 13 refers to from the exiting surface of LED chip 12 to the distance between the exiting surface of the light of package lens 13 transmission LED chips 12, i.e. lamp chamber thickness.Make the thickness of package lens 13 lower than 20mm, can make package lens 13 there is less thickness, can make thus the thickness of the LED finished product after encapsulation less, be conducive to the lightening of product.And experiment shows, at lamp chamber thickness, during lower than 20mm, the light that can make LED chip 12 send is dispersed, and the light uniformity reaches and is greater than 85%.Therefore, by making the thickness of package lens 13 lower than 20mm, can either ensure the uniformity of brightness, also be conducive to lightening development.
Preferably, the material of package lens 13 is transparent silica gel.Package lens 13 adopts molding (mould note) technique to form.After LED chip 12 is fixed on support 11, directly use modling technique additional transparent silica gel on support 11, to form package lens 13, manually mount compared with lens with existing, when reducing cost of labor, can enhance productivity.
In order to realize white light, paster type encapsulation LED of the present utility model also comprises a fluorescent adhesive layer 14.Fluorescent adhesive layer 14, between LED chip 12 and package lens 13, covers LED chip.Therefore, be packaged in the process of support 11 at LED chip 12, after LED chip 12 is fixed on support 11, and after bonding wire point fluorescent glue, on support 11, molding forms package lens 13.Certainly, also can adopt the modes such as a glue, overlay film to form package lens 13.
In the utility model alternate embodiment, support 11 can be also bowl-shape support, as shown in Figure 6, support 11 has a groove structure, LED chip 12 is fixed in the groove of support 11, and fluorescent adhesive layer 14 fills up groove to cover LED chip 12, and package lens 13 is positioned on the bowl face of support 11.Wherein, package lens 13 is as the packaging body of paster type encapsulation LED, in order to packaging LED chips 12, package lens 13 is as one of packaging thus, can in being packaged in the process of support 11, LED chip 12 directly be formed on support 11, can reduce thus the cost that manually mounts lens, and its at least one cross section at the optical axis place of LED chip 12 be shaped as dual hump shape, thereby making to form on support 11 distribution curve flux that rear the obtained paster type encapsulation LED of package lens 13 forms is symmetric shape, can in package level, complete thus the luminous intensity distribution of LED chip 12.
Consult Fig. 7, the utility model also provides an execution mode of backlight module, comprises circuit board 21 and paster type encapsulation LED22, and paster type encapsulation LED22 is installed on circuit board 21.Wherein, the paster type encapsulation LED that paster type encapsulation LED22 is above-mentioned arbitrary execution mode.
Wherein, utilizing in the backlight module that LED is backlight, conventionally need plurality of LEDs composition backlight.Therefore, the quantity of the paster type encapsulation LED of present embodiment is many, preferably, between adjacent two paster type encapsulation LED, is spaced apart 50mm.
The backlight module of present embodiment is down straight aphototropism mode set, can certainly be other backlight modules.
Consult Fig. 8, in an execution mode of the packaging technology of the utility model paster type encapsulation LED, the paster type encapsulation LED that wherein paster type encapsulation LED is above-mentioned arbitrary execution mode, comprises the steps:
Step S801 a: support and LED chip are provided.
Support can be flat bracket (support as shown in Figure 1), can be also bowl-shape support (support as shown in Figure 3).
Step S802: LED chip is fixed on support, and the weld zone on the solder joint of LED chip and support is welded.
This step is in order to realize the die bond bonding wire of LED chip.
Step S803: form package lens on the support that is fixed with LED chip, and make package lens be arranged at least partly the light direction of LED chip, complete the encapsulation of LED chip.
After die bond bonding wire, on support, directly form package lens, and make package lens cover LED chip, to complete the encapsulation of LED chip.Thus, package lens is the packaging body of paster type encapsulation LED, one of its packaging as LED chip, both played the effect of encapsulation, effect simultaneously that play again lens, do not need thus additionally increases by lens on the LED that completes encapsulation, can omit the use of these extra lens that increase, the thickness that can also reduce product when reducing costs, is conducive to the lightening of product.In addition, the package lens of present embodiment is directly formed on support as one of packaging, instead of mounts by manual type, can reduce thus the cost that manually mounts lens.
Certainly, package lens can be also that part is arranged on the light direction of LED chip.
Wherein, the step that forms package lens on the support that is fixed with LED chip comprises: be fixed with on the support of LED chip and forming the package lens with reservation shape, the distribution curve flux being formed taking the paster type encapsulation LED that has made to obtain after the encapsulation of LED chip is as symmetric shape.Thus, the distribution curve flux forming by the paster type encapsulation LED that package lens has been arranged so that obtain after encapsulation is symmetric shape, can make light be more evenly distributed, and brightness is more concentrated.And, in the process of packaging LED chips, can complete the luminous intensity distribution of LED chip, be conducive to enhance productivity, and reduce follow-up luminous intensity distribution operation.
Further, package lens is shaped as dual hump shape the cross section at LED chip optical axis place, can form thus the preferably distribution curve flux of symmetric shape.
Preferably, the utility model adopts molding (mould note) technique to carry out sealing, adopts molding technique on support, to form package lens.Particularly, consult Fig. 9, the step that forms package lens comprises as follows:
Step S901: the mould of making the cavity with reservation shape according to the distribution curve flux of symmetric shape.
The utility model adopts molding technique to form package lens, therefore needs first die sinking.The distribution curve flux that package lens need be configured to have made the paster type encapsulation LED obtaining after LED chip encapsulation form is symmetric shape, therefore, first the shape of designing mould, adjust distribution curve flux according to optical analog, to meet angle backlight and mixed light requirement, experiment shows, the distribution curve flux of symmetric shape can make light be more evenly distributed, and brightness is more concentrated.Therefore, make the shape of mould according to the distribution curve flux of symmetric shape, can meet distribution curve flux requirement with the package lens that makes to obtain by this mould.
Wherein, have the brightness that is more evenly distributed of light that cyrtoid package lens can make LED chip more concentrated, therefore, the shape of mould is designed to dual hump shape, and the cavity of mould is dual hump shape.
Step S902: the cavity with reservation shape of the support that is fixed with LED chip being put into mould.
Wherein, LED chip is being fixed on after support, is also needing to carry out bonding wire, further, in order to realize white light, after die bond bonding wire, on LED chip, sealing fluorescent glue, and making fluorescent glue cover LED chip.
After fluorescent glue solidifies, carry out molding technique to form package lens, the support that is about to be fixed with LED chip and fluorescent glue is put into the cavity of mould, this cavity be shaped as hump shape.
Step S903: encapsulating material is filled up to the cavity with reservation shape, and cure package material, to form the package lens with reservation shape on the support that is fixed with LED chip.
The support that is fixed with LED chip and fluorescent glue is put into after the cavity of mould, in cavity, pour into encapsulating material, and fill up the cavity of mould, then mould is heated with cure package material, there is cyrtoid package lens thereby can form on support, complete thus the encapsulation of LED chip.Wherein, encapsulating material can use transparent silica gel, or other glue etc.
Certainly, in other embodiments, can also form package lens by modes such as a glue or overlay films, and be not limited to adopt above-mentioned molding technique to form.
After the encapsulation that completes LED chip, obtained paster type encapsulation LED is carried out to the test of photoelectric parameter, be mainly the photodistributed uniformity of the paster type encapsulation LED after test package and the centrality of brightness.Paster type encapsulation LED is widely used in the backlight of display,, in the time of test, is therefore mainly the environment that simulation paster type encapsulation LED is applied to the backlight of display, to test as the luminous situation of the paster type encapsulation LED of backlight.Current display is main toward lightening development, therefore backlight is conventionally all less to the distance of display screen, with reference to existing backlight after the distance between display screen, in the time that paster type encapsulation LED of the present utility model is tested, making the distance between paster type encapsulation LED and display screen (can utilize a Planar realization) is 15mm, driving paster type encapsulation LED is luminous and light is exposed on display screen, with the photoelectric parameter of test patch formula packaged LED.Test result is illustrated in fig. 10 shown below, and Figure 10 is the intensity map of single paster type encapsulation LED of the present utility model on the display screen apart from 15mm.As seen from Figure 10, the brightness of paster type encapsulation LED is more evenly concentrated.Therefore, in the time that paster type encapsulation LED of the present utility model is applied to backlight, preferably, the distance of paster type encapsulation LED and display screen is 15mm, both can ensure thus evenly concentrating of brightness, and also be conducive to the lightening of display.
In paster type encapsulation LED of the present utility model is applied to backlight module time, conventionally need the backlight of many paster type encapsulation LED composition backlight modules.LED arranges more intensive, and the brightness of the backlight obtaining is more even, but cost is also more.Therefore, in order to obtain the inhomogeneity while of better brightness, can not spend again more cost, preferably, interval 50mm between each paster type encapsulation LED.Taking by many paster type encapsulation LED distribution as example test brightness according to 3*3 matrix distribution, make interval 50mm between adjacent two paster type encapsulation LED, the backlight distance that many paster type encapsulation LED form is 15mm, and the Luminance Distribution of the backlight obtaining as shown in figure 11.Figure 11 is the intensity map on the display screen apart from 15mm according to many of 3*3 matrix distribution paster type encapsulation LED of the present utility model.As seen in Figure 11, the Luminance Distribution obtaining on display screen is comparatively even and concentrated.
The foregoing is only execution mode of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (10)
1. a paster type encapsulation LED, it is characterized in that, comprise support, LED chip and packaging body, described LED chip is fixed on described support, described packaging body is package lens, and it is arranged on described support and is arranged at least partly the light direction of described LED chip.
2. LED according to claim 1, is characterized in that,
Described package lens has reservation shape, to make distribution curve flux that described paster type encapsulation LED formed as symmetric shape.
3. LED according to claim 2, is characterized in that,
Described package lens is shaped as dual hump shape at least one cross section at described LED chip optical axis place.
4. LED according to claim 1, is characterized in that,
The exiting surface of described LED chip to the distance between the exiting surface of the light of LED chip described in described package lens transmission is less than 20mm.
5. LED according to claim 1, is characterized in that,
Described support is flat bracket.
6. a backlight module, is characterized in that, comprises circuit board and paster type encapsulation LED;
Described paster type encapsulation LED is arranged on described circuit board, comprise support, LED chip and packaging body, described LED chip is fixed on described support, and described packaging body is package lens, and it is arranged on described support and is arranged at least partly the light direction of described LED chip.
7. backlight module according to claim 6, is characterized in that,
Described package lens has reservation shape, to make distribution curve flux that described paster type encapsulation LED formed as symmetric shape.
8. backlight module according to claim 7, is characterized in that,
Described package lens is shaped as dual hump shape at least one cross section at described LED chip optical axis place.
9. backlight module according to claim 6, is characterized in that,
The exiting surface of described LED chip to the distance between the exiting surface of the light of LED chip described in described package lens transmission is less than 20mm.
10. backlight module according to claim 6, is characterized in that,
Between adjacent two described paster type encapsulation LED, be spaced apart 50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201420229289.XU CN203950801U (en) | 2014-05-05 | 2014-05-05 | A kind of backlight module and paster type encapsulation LED |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420229289.XU CN203950801U (en) | 2014-05-05 | 2014-05-05 | A kind of backlight module and paster type encapsulation LED |
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| CN203950801U true CN203950801U (en) | 2014-11-19 |
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| CN201420229289.XU Expired - Lifetime CN203950801U (en) | 2014-05-05 | 2014-05-05 | A kind of backlight module and paster type encapsulation LED |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
-
2014
- 2014-05-05 CN CN201420229289.XU patent/CN203950801U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10380925B2 (en) | 2013-12-31 | 2019-08-13 | Ultravision Technologies, Llc | Modular display panel |
| US10410552B2 (en) | 2013-12-31 | 2019-09-10 | Ultravision Technologies, Llc | Modular display panel |
| US10540917B2 (en) | 2013-12-31 | 2020-01-21 | Ultravision Technologies, Llc | Modular display panel |
| US10871932B2 (en) | 2013-12-31 | 2020-12-22 | Ultravision Technologies, Llc | Modular display panels |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
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