CN216488133U - MiniLED device packaging structure - Google Patents

Abstract

The utility model discloses a Mini LED device packaging structure, which comprises a substrate, wherein a reflecting structure is arranged on the substrate, an arc reflecting surface is arranged on the reflecting structure, the concave surface of the arc reflecting surface is back to the substrate, and a light-emitting chip is fixedly arranged at the bottom of the arc reflecting surface through a solder layer; the opening end of the arc-shaped reflecting surface of the reflecting structure is covered with a euphotic layer, and the euphotic layer is fixed through a first adhesive layer. The utility model discloses the setting of arc-shaped reflecting surface can play good spotlight effect, reduces the light scattering scope of LED light, compares in traditional LED structure, can show the utilization efficiency who promotes light to promote LED's controllability; the utility model discloses reflective structure's arc plane of reflection's opening end coats and is stamped the one deck euphotic layer, and the one side or the two sides of euphotic layer coat have the phosphor layer, and this kind of design is compared in traditional structure, can reduce the use amount of phosphor powder granule, and can not influence packaging structure's light-emitting effect.

Description

MiniLED device packaging structure

Technical Field

The utility model belongs to the technical field of the LED device, concretely relates to Mini LED device packaging structure.

Background

The Mini LED is defined as an LED device with a chip size of 50-200 μm, and with the rapid development of the Mini LED display technology, the Mini LED display product has begun to be applied to the commercial fields of ultra-large screen high definition display, such as monitoring and commanding, high definition broadcasting, high-end cinema, medical diagnosis, advertisement display, conference exhibition, office display, virtual reality, and the like.

At present, for the application of Mini backlight, a direct type design is adopted, and a large number of densely distributed LED chips are used, so that regional dimming in a smaller range is realized, better brightness uniformity and higher color contrast are realized in a smaller light mixing distance, and further ultrathin, high color rendering and power saving of a terminal product are realized. However, the cost and the reliability still remain to be solved, and the process technology and the process yield still need to be continuously improved, and the light scattering range that LED sent is big among the packaging structure among the prior art in addition, and light dispersion has the problem that the light source is lost, in order to solve above-mentioned problem, the utility model provides a following technical scheme.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a Mini LED device packaging structure solves among the prior art problem that straight following formula design cost is high and LED light source light dispersion, light source lose.

The purpose of the utility model can be realized by the following technical scheme:

a Mini LED device packaging structure comprises a substrate, wherein a reflection structure is arranged on the substrate, an arc-shaped reflection surface is arranged on the reflection structure, the concave surface of the arc-shaped reflection surface is opposite to the substrate, and a light-emitting chip is fixedly arranged at the bottom of the arc-shaped reflection surface through a solder layer;

the opening end of the arc-shaped reflecting surface of the reflecting structure is covered with a light transmitting layer, and the light transmitting layer is fixed through a first glue layer.

As a further proposal of the utility model, the reflecting structure is a structure fixedly arranged on the base plate or the reflecting structure and the base plate are integrated;

as a further proposal of the utility model, the bottom surface of the arc reflecting surface is set as a plane.

As a further proposal of the utility model, the arc reflecting surface is provided with a silver coating on the surface.

As a further proposal of the utility model, one side or two sides of the euphotic layer are covered with the fluorescent powder layer, and the first glue layer is made of the euphotic glue.

As a further proposal of the utility model, one surface of the euphotic layer far away from the arc reflecting surface is covered with a fluorescent powder layer.

As a further scheme of the utility model, first glue film adopts dispensing compression molding behind phosphor powder granule and the adhesive misce bene.

The utility model has the advantages that:

(1) the arrangement of the arc-shaped reflecting surface can play a good light condensation effect, the light scattering range of the LED light is reduced, and compared with the traditional LED structure, the light utilization efficiency can be obviously improved, and the adjustability of the LED is improved;

(2) compared with the traditional structure, the design can reduce the use amount of fluorescent powder particles, reduce the production cost and cannot influence the light emitting effect of the packaging structure;

(3) mini LED device packaging structure can not prolong the process, compare in prior art, its flow is not prolonged, can not bring obvious reduction to production efficiency, and most flow can match each other with the step in the current production flow, consequently can also reduce the transformation cost of production line.

Drawings

The present invention will be further described with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an embodiment of a Mini LED device package structure of the present invention;

fig. 2 is a partial structure diagram of a Mini LED device package structure in fig. 1;

fig. 3 is a schematic structural diagram of another embodiment of a Mini LED device package structure according to the present invention;

in the figure: 1. a substrate; 2. a reflective structure; 3. a silver coating layer; 4. a solder layer; 5. a light emitting chip; 6. a light transmitting layer; 7. a first glue layer; 9. a phosphor layer; 21. an arc-shaped reflecting surface.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

A Mini LED device packaging structure is shown in figures 1 to 2 and comprises a substrate 1, wherein a reflection structure 2 is arranged on the substrate 1, the reflection structure 2 is made of opaque materials, preferably opaque white materials, an arc reflection surface 21 is arranged on the reflection structure 2, the concave surface of the arc reflection surface 21 is opposite to the substrate 1, and a light emitting chip 5 is fixedly arranged at the bottom of the arc reflection surface 21 through a solder layer 4;

the bottom surface of the arc reflecting surface 21 is set to be a plane, so that the light emitting chip 5 is convenient to mount, and under the technical permission condition, the bottom plane area of the arc reflecting surface 21 is as small as possible on the premise of not influencing the normal mounting of the light emitting chip 5, so that the light quantity reflected by the arc reflecting surface 21 is reduced;

the reflecting structure 2 is fixedly arranged on the substrate 1 or the reflecting structure 2 and the substrate 1 are integrated;

preferably, the silver coating 3 is disposed on the surface of the arc reflecting surface 21, so as to improve the reflecting effect of the arc reflecting surface 21 and reduce light diffusion and light loss;

the arc-shaped reflecting surface 21 can achieve a good light condensation effect, the light scattering range of the LED light is reduced, and compared with the traditional LED structure, the light utilization efficiency can be obviously improved, and the adjustability of the LED is improved;

the opening end of the arc-shaped reflecting surface 21 of the reflecting structure 2 is covered with a light transmitting layer 6, the light transmitting layer 6 is fixed through a first glue layer 7, and the light transmitting layer 6 is made of high light transmitting materials such as glass and acrylic materials;

in an embodiment of the present invention, one or both surfaces of the transparent layer 6 are covered with a phosphor layer 9, the phosphor layer 9 is formed by uniformly mixing phosphor particles and an adhesive and then coating or spraying, and the first adhesive layer 7 is made of a transparent glue;

preferably, one surface of the light-transmitting layer 6 far away from the arc-shaped reflecting surface 21 is covered with a fluorescent powder layer 9;

when the LED lamp works, the blue light emitted by the light-emitting chip 5 and the light emitted by the fluorescent powder can be compounded to obtain white light by using the fluorescent powder particles;

the fluorescent powder layer 9 is arranged on the surface, far away from the arc-shaped reflecting surface 21, of the light transmitting layer 6, so that the fluorescent powder layer 9 can be protected, and the fluorescent powder particles are prevented from being oxidized due to the fact that the fluorescent powder layer 9 is in direct contact with a small amount of residual air in a closed space formed by the arc-shaped reflecting surface 21 and the light transmitting layer 6 under a high-temperature environment;

the structure can reduce the use amount of fluorescent powder particles and reduce the cost;

in another embodiment of the present invention, as shown in fig. 3, the first adhesive layer 7 is formed by dispensing and molding after the phosphor particles and the adhesive are uniformly mixed, and the surface of the light-transmitting layer 6 is not coated with the phosphor layer 9;

compared with the structure of the previous embodiment, the method can reduce the processing flow and improve the production efficiency;

the processing method of the Mini LED device packaging structure comprises the following steps:

firstly, printing a solder layer 4 on the bottom of the arc-shaped reflecting surface 21;

secondly, after the substrate 1 printed with the solder layer 4 is detected by the SPI, fixing the light-emitting chip 5 to the bottom of the arc reflecting surface 21;

thirdly, after AOI detection is carried out on the substrate 1 after die bonding, reflow soldering is carried out, and the light-emitting chip 5 is soldered to the bottom of the arc-shaped reflecting surface 21;

fourthly, cleaning the light-emitting chip 5 and residues and impurities on the periphery of the light-emitting chip 5;

fifthly, covering the light transmission layer 6 on the opening end of the arc-shaped reflecting surface 21, wherein in the step, if the fluorescent powder layer 9 is coated on the surface of the light transmission layer 6 in advance, the next step operation is directly carried out, if not, the next step operation is carried out after one fluorescent powder layer 9 is coated on the surface of the light transmission layer 6, and if the fluorescent powder particles are directly added into the first adhesive layer 7, the next step operation is directly carried out;

sixthly, applying glue of the first glue layer 7, and performing compression molding;

and seventhly, baking and curing after cleaning.

A Mini LED device packaging structure, through the arc plane of reflection 21 that forms the curved surface in the bottom of emitting chip 5, carry out the spotlight to the light that emitting chip 5 sent, compare in traditional LED structure, can effectively avoid the light scattering, promote the controllability of light utilization efficiency and LED light, can also reduce the use of phosphor powder granule, reduction in production cost.

In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, only for convenience of description and simplification of description, but not for indicating or implying that the referred device or element must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through two or more elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.

Claims (7)

1. A MiniLED device packaging structure is characterized by comprising a substrate (1), wherein a reflecting structure (2) is arranged on the substrate (1), an arc reflecting surface (21) is arranged on the reflecting structure (2), the concave surface of the arc reflecting surface (21) is opposite to the substrate (1), and a light-emitting chip (5) is fixedly mounted at the bottom of the arc reflecting surface (21) through a solder layer (4);

an opening end of the arc-shaped reflecting surface (21) of the reflecting structure (2) is covered with a light transmitting layer (6), and the light transmitting layer (6) is fixed through a first glue layer (7).

2. The MiniLED device package structure of claim 1, wherein the reflective structure (2) is fixedly mounted on the substrate (1) or the reflective structure (2) and the substrate (1) are integrated.

3. A MiniLED device package according to claim 2, wherein the bottom surface of the curved reflective surface (21) is arranged as a plane.

4. The MiniLED device package structure of claim 2, wherein the curved reflective surface (21) is provided with a silver coating (3) on its surface.

5. The MiniLED device package structure of claim 1, wherein one or both sides of the transparent layer (6) are covered with a phosphor layer (9), and the first adhesive layer (7) is made of a transparent glue.

6. The MiniLED device package structure of claim 5, wherein the surface of the light transmitting layer (6) away from the arc-shaped reflective surface (21) is covered with a phosphor layer (9).

7. The MiniLED device package structure of claim 1, wherein the first adhesive layer (7) is formed by uniformly mixing phosphor particles and an adhesive and then dispensing and molding the mixture.

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