CN217061299U

CN217061299U - Backlight module and direct type backlight device

Info

Publication number: CN217061299U
Application number: CN202220441936.8U
Authority: CN
Inventors: 姚黎晓; 李健林; 王代青; 其他发明人请求不公开姓名
Original assignee: Huizhou Shiwei New Technology Co Ltd
Current assignee: Huizhou Shiwei New Technology Co Ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-07-26
Anticipated expiration: 2032-03-01
Also published as: WO2023165212A1

Abstract

The application provides a backlight module and a direct type backlight device. Backlight unit includes a plurality of light sources, transparent substrate and is used for carrying out the diffuser plate that diffuses to the light that a plurality of light sources sent, and the diffuser plate sets up with transparent substrate is relative, and a plurality of light sources set up on transparent substrate's the back, and transparent substrate's the back is the one side that transparent substrate deviates from the diffuser plate. The application provides a backlight unit is through setting up diffuser plate and transparent substrate relatively, with the one side that the light source setting deviates from the diffuser plate at transparent substrate to can turn into the thickness of transparent substrate and mix partly of light distance, realize the reduction of backlight unit thickness and the reduction of light source quantity under the whole thickness of the same backlight unit under the same distance of mixing light. The reduction of the whole thickness of the backlight module under the same light mixing distance is beneficial to thinning of products, and the reduction of the number of light sources under the same whole thickness of the backlight module is beneficial to saving cost.

Description

Backlight module and direct type backlight device

Technical Field

The application belongs to the technical field of display backlight, and particularly relates to a backlight module and a direct type backlight device.

Background

The direct type mini LED backlight module has the advantages of good display effect, zone control and the like, and gradually occupies most market share in a high-end market. However, the direct type Mini LED backlight module uses a large number of LEDs, which increases the cost; reducing the number of LEDs increases the light mixing distance (commonly referred to as OD, which is the distance required for the light emitted by the LEDs to uniformly cover the diffusion plate), thereby increasing the overall thickness and reducing the appearance and taste of the product.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a backlight module and a direct type backlight device, so as to achieve the purpose of reducing the thickness of the backlight module under the same light mixing distance and reducing the number of light sources under the same thickness.

In a first aspect, an embodiment of the present application provides a backlight module, where the backlight module includes a plurality of light sources, a transparent substrate, and a diffusion plate for diffusing light emitted by the plurality of light sources, the diffusion plate is disposed opposite to the transparent substrate, the plurality of light sources are disposed on a back surface of the transparent substrate, and the back surface of the transparent substrate is a surface of the transparent substrate deviating from the diffusion plate.

Optionally, the light source is an LED front-mounted chip, a transparent ITO circuit layer is disposed on the back surface of the transparent substrate, and pins of the LED front-mounted chip are welded to the ITO circuit layer.

Optionally, the LED front chip is a mini LED front chip.

Optionally, the light source is an LED flip chip, a circuit layer is disposed on the back surface of the transparent substrate, and pins of the LED flip chip are electrically connected to the circuit layer through wires.

Optionally, the LED flip chip is a mini LED flip chip.

Optionally, the transparent substrate is a glass substrate or a PET substrate.

Optionally, a light refraction pattern is printed on the front surface of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front surface of the transparent substrate is a surface of the transparent substrate facing the diffuser plate.

Optionally, the thickness of the light refraction pattern is 12 μm to 24 μm and/or the refractive index of the light refraction pattern is 1.54 to 1.72.

Optionally, the backlight module further includes a package case, the package case is disposed on the back surface of the transparent substrate, the light source is packaged in the package case, and a reflective layer is disposed on an inner side wall surface of the package case.

Optionally, the inner side wall surface of the package casing is an arc surface.

Optionally, the backlight module further includes a packaging adhesive, the light source is packaged in the packaging adhesive, and the packaging adhesive is adhered to the back surface of the transparent substrate.

Optionally, the encapsulation adhesive is transparent silicone resin or epoxy resin.

In a second aspect, embodiments of the present application further provide a direct type backlight device, including the backlight module as described above.

The backlight module and straight following formula backlight unit that this application embodiment provided through setting up diffuser plate and transparent substrate relatively, set up a plurality of light sources in the one side that the transparent substrate deviates from the diffuser plate to can turn into the partly of mixing the light distance with transparent substrate thickness, realize the reduction of backlight module thickness and the reduction of light source quantity under the same backlight module thickness under the same distance of mixing the light. The reduction of the overall thickness of the backlight module under the same light mixing distance is beneficial to thinning of products, and the reduction of the number of light sources under the same overall thickness of the backlight module is beneficial to saving cost.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can also be derived from them without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.

Fig. 1 is a schematic view of a first structure of a backlight module according to an embodiment of the present disclosure.

Fig. 2 is a schematic view of a second structure of a backlight module according to an embodiment of the present disclosure.

Fig. 3 is a schematic view of a third structure of a backlight module according to an embodiment of the present disclosure.

Fig. 4 is a schematic view illustrating a first connection between a transparent substrate and a light source according to an embodiment of the present disclosure.

Fig. 5 is a schematic diagram of a second connection between a transparent substrate and a light source according to an embodiment of the present disclosure.

The reference numbers illustrate:

10. a light source; 20. a transparent substrate; 30. a diffusion plate; 41. an ITO circuit layer; 42. a wire; 50. a light refraction pattern; 60. packaging glue; 70. and (5) packaging the shell.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to 5, the backlight module provided in the embodiment of the present application includes a plurality of light sources 10, a transparent substrate 20, and a diffusion plate 30 for diffusing light emitted from the plurality of light sources 10, where the diffusion plate 30 is disposed opposite to the transparent substrate 20, the plurality of light sources 10 are disposed on a back surface of the transparent substrate 20, and the back surface of the transparent substrate 20 is a surface of the transparent substrate 20 away from the diffusion plate 30.

The backlight module provided by the embodiment of the application sets up the diffuser plate 30 and the transparent substrate 20 relatively, and sets up the light source 10 on the one side of the transparent substrate 20 departing from the diffuser plate 30, thereby can turn into the thickness of the transparent substrate 20 and mix a part of the light distance D, realize the reduction of backlight module thickness under the same mixed light distance D (that is, the light source 10 quantity is the same) and the reduction of light source 10 quantity under the whole thickness of the same backlight module. The reduction of the overall thickness of the backlight module at the same light mixing distance D is beneficial to thinning of products, and the reduction of the number of the light sources 10 at the same overall thickness of the backlight module is beneficial to saving cost.

It should be understood that, on the premise of achieving the same backlight effect, when the number of the light sources 10 is reduced, the light mixing distance D needs to be increased, which results in an increase in the thickness of the backlight module; when the number of the light sources 10 is increased, the light mixing distance D can be reduced, so as to reduce the overall thickness of the backlight module, but the cost is increased. Because the backlight module provided by the embodiment of the application converts the thickness of the transparent substrate 20 into a part of the light mixing distance D, the overall thickness of the backlight module can be reduced when the light mixing distance D is the same on the premise of achieving the same backlight effect, so that the product is thinned, and the number of the light sources 10 is not required to be increased while the overall thickness of the backlight module is reduced; when the overall thickness of the backlight module is the same, the light mixing distance D can be increased, so that the distance D between two adjacent light sources 10 is increased, the number of the light sources 10 can be reduced, and the cost can be reduced.

Specifically, the plurality of light sources 10 are arranged at intervals on the back surface of the transparent substrate 20. As shown in fig. 4, in some embodiments of the present application, the light source 10 is an LED chip, a light emitting surface and two pins of the LED chip face the transparent substrate 20, as shown in the figure, a transparent ITO circuit layer 41 is disposed on a back surface of the transparent substrate 20, and the two pins of the LED chip are soldered to the ITO circuit layer 41, so as to electrically connect the LED chip to the ITO circuit layer 41. Optionally, the LED front chip may be a mini LED front chip.

Alternatively, as shown in fig. 5, in other embodiments of the present application, the light source 10 may also be an LED flip chip, as shown in the figure, a light emitting surface of the LED flip chip faces the transparent substrate 20, two pins of the LED flip chip face away from the transparent substrate 20, a circuit layer is disposed on a back surface of the transparent substrate 20, and the pins of the LED flip chip are electrically connected to the circuit layer through wires 42. Optionally, the LED flip chip may be a mini LED flip chip.

Alternatively, the transparent substrate 20 may be a glass substrate or a PET (Polyethylene terephthalate) substrate. Glass and PET all have the high refractive index characteristic, and wherein, glass's refracting index is 1.51, and PET's refracting index is 1.71, consequently adopts glass substrate and PET substrate can increase the wide-angle light-emitting, further enlarges the light field angle, breaks up the light that light source 10 sent to it is more even to realize backlight unit light-emitting under the same light source 10 quantity, and can reduce light source 10 quantity under reaching the condition of the same light-emitting effect, reduce cost. In addition, compared with high-refractive-index silica gel (the refractive index of the high-refractive-index silica gel is 1.51) which is high in cost by adopting the packaging glue, the cost can be reduced by adopting the glass substrate and the PET substrate.

As shown in fig. 2, in some embodiments of the present application, the front surface of the transparent substrate 20 is printed with a light refraction pattern 50, the refractive index of the light refraction pattern 50 is greater than that of the transparent substrate 20, and the front surface of the transparent substrate 20 is a surface of the transparent substrate 20 facing the diffuser plate 30, i.e., a light-emitting surface of the transparent substrate 20. The light refraction pattern 50 needs to have a certain thickness and a certain refractive index, and optionally, the thickness of the light refraction pattern 50 is 12 μm to 24 μm, and the refractive index is 1.54 to 1.72. By printing the light refraction pattern 50 on the front surface of the transparent substrate 20, the light-emitting angle can be further increased, the light mixing effect can be increased, and the brightness consistency of the backlight module is better. Alternatively, the light refraction pattern 50 may be printed on the front surface of the transparent substrate 20 by using a high refractive index glue.

As shown in fig. 1, in some embodiments of the present application, the backlight module further includes an encapsulation adhesive 60, the light source 10 is encapsulated in the encapsulation adhesive 60, and the encapsulation adhesive 60 is adhered to the back surface of the transparent substrate 20, that is, the light source 10 is encapsulated and fixed on the transparent substrate 20 by the encapsulation adhesive 60. Alternatively, the encapsulation adhesive 60 may be transparent silicone or epoxy.

Alternatively, as shown in fig. 2 and fig. 3, in other embodiments of the present application, the backlight module further includes an encapsulating cover 70, the encapsulating cover 70 is disposed on the back surface of the transparent substrate 20, the light source 10 is encapsulated in the encapsulating cover 70, and a reflective layer having a reflective effect is disposed on an inner side wall surface of the encapsulating cover 70. The reflective layer can reflect incident light to the light exit side (i.e., the diffusion plate 30) of the backlight module, and the reflective layer may be a reflective coating formed by coating a material having a reflective effect on the inner sidewall surface of the package case 70, or the reflective layer may also be a reflective coating formed by coating a material having a reflective effect on the inner sidewall surface of the package case 70. The packaging shell 70 with the reflecting layer on the inner side wall surface is arranged on the back surface of the transparent substrate 20, and the light source 10 is packaged in the packaging shell 70, so that light rays emitted from the side surface of the light source 10 can be reflected through the reflecting layer, the utilization rate of side light emitting is increased, and the light effect is improved.

Optionally, the inner side wall surface of the package 70 may be a plane or an arc surface, preferably an arc surface, and the arc surface has a better effect of collecting light emitted from the side surface of the light source 10, so that the lighting effect can be further improved.

The embodiment of the application also provides a direct type backlight device, which comprises the backlight module in any one of the embodiments.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.

The backlight module and the direct-type backlight device provided by the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the embodiments above is only used to help understand the method and the core ideas of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The backlight module is characterized by comprising a plurality of light sources (10), a transparent substrate (20) and a diffusion plate (30) for diffusing light emitted by the light sources (10), wherein the diffusion plate (30) is arranged opposite to the transparent substrate (20), the light sources (10) are arranged on the back surface of the transparent substrate (20), and the back surface of the transparent substrate (20) is the surface of the transparent substrate (20) departing from the diffusion plate (30).

2. The backlight module according to claim 1, wherein the light source (10) is an LED front mounted chip, a transparent ITO circuit layer (41) is disposed on the back surface of the transparent substrate (20), and the leads of the LED front mounted chip are soldered to the ITO circuit layer (41).

3. The backlight module of claim 2, wherein the LED front-mounted chip is a mini LED front-mounted chip.

4. The backlight module according to claim 1, wherein the light source (10) is an LED flip chip, a circuit layer is disposed on the back surface of the transparent substrate (20), and the leads of the LED flip chip are electrically connected to the circuit layer through wires (42).

5. The backlight module of claim 4, wherein the LED flip chip is a mini LED flip chip.

6. The backlight module according to claim 1, wherein the transparent substrate (20) is a glass substrate or a PET substrate.

7. The backlight module according to claim 1, wherein the front surface of the transparent substrate (20) is printed with a light refraction pattern (50), the light refraction pattern (50) has a refractive index larger than that of the transparent substrate (20), and the front surface of the transparent substrate (20) is a surface of the transparent substrate (20) facing the diffuser plate (30).

8. The backlight module according to claim 7, wherein the thickness of the light refraction pattern (50) is 12 μm to 24 μm and/or the refractive index of the light refraction pattern (50) is 1.54 to 1.72.

9. The backlight module according to claim 1, further comprising an encapsulation shell (70), wherein the encapsulation shell (70) is disposed on the back surface of the transparent substrate (20), the light source (10) is encapsulated in the encapsulation shell (70), and a reflective layer is disposed on the inner side wall surface of the encapsulation shell (70).

10. The backlight module according to claim 9, wherein the inner side wall surface of the package case (70) is an arc surface.

11. The backlight module according to claim 1, further comprising an encapsulation adhesive (60), wherein the light source (10) is encapsulated in the encapsulation adhesive (60), and the encapsulation adhesive (60) is adhered to the back surface of the transparent substrate (20).

12. A direct type backlight device, characterized in that the direct type backlight device comprises the backlight module set according to any one of claims 1 to 11.