CN109950233A - A kind of LED encapsulation structure and packaging method - Google Patents
A kind of LED encapsulation structure and packaging method Download PDFInfo
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- CN109950233A CN109950233A CN201910207385.1A CN201910207385A CN109950233A CN 109950233 A CN109950233 A CN 109950233A CN 201910207385 A CN201910207385 A CN 201910207385A CN 109950233 A CN109950233 A CN 109950233A
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Abstract
The invention discloses a kind of LED encapsulation structure and packaging method, LED encapsulation structure includes substrate；Several LED chips are distributed on the substrate；Encapsulated layer, including several encapsulation units, the encapsulation unit is corresponding to be covered in a LED chip；Substratum transparent covers the encapsulated layer.It is luminous to achieve the effect that by uniformly arranging LED chip on substrate that the beneficial effects of the present invention are LED encapsulation structures of the invention and packaging method, in order to become apparent from the illumination effect of LED chip, fluorescent adhesive layer is encapsulated in each LED chip, LED chip volume after making encapsulation becomes larger, light shape in power angular range is more uniform, light mixing effect is more, the spacing of itself and adjacent LED chip is set to become larger on single packaging LED chips simultaneously, the dosage for reducing LED chip in unit area, reduces cost.
Description
Technical field
The present invention relates to illumination field, in particular to a kind of LED encapsulation structure and packaging method.
Background technique
The hot spot that secondary millimeter light emitting diode (mini LED) is developed as market at present, with frivolous, power saving, flexibility
It is flexible, brightness is high, can making narrow frame, comprehensive panel type display part and high dynamic contrast (HDR) display device etc. are many excellent
Gesture becomes the emphasis of market concern.Conventional mini LED technology generallys use the technology system of COB (chip on board)
Make, in the technical solution, since chip size is smaller, and light emitting angle is limited, causes the quantity of lamp chip on board more, light mixing
Performance is also general.Therefore the mini LED needs of COB scheme preparation cover multiple diffusion sheets just above area source and can meet and is mixed
Optical uniformity demand, and multiple diffusion sheets will lead to light efficiency decline, and chip more on lamp plate also result in mini LED at
This raising is unfavorable for the popularization in market.
The characteristics of LED is because of good energy saving property, long service life, so that its application surface is more and more extensive, the LED packet of the prior art
Substrate, the LED chip on substrate, the fluorescence coating for wrapping up LED chip and the hyaline layer for wrapping up fluorescence coating are included, wherein LED
Chip is light source, and light emits from other surfaces of the LED chip in addition to bottom surface, and the light emitted line of LED chip side wall successively passes through
It crosses fluorescence coating and hyaline layer and reflects, fluorescence coating and hyaline layer shape are typically approximately arch or rectangle, and LED chip is general
Among hyaline layer, which can reduce the reflection of light contact surface between the layers, but light by rolling over twice
It penetrates rear direction to change, especially the light that is issued of LED chip side wall, since the hyaline layer of the prior art is generally epoxy
Resin, refractive index 1.5, air refraction 1, being computed the angle of total reflection is 41.8 °, and radiation direction is downward after hyaline layer refraction
0-48.2 ° of deflection, causes quite a few light to all point to substrate, although can be by reflective layer being arranged on substrate come into one
Reflection light is walked, but in reflection process, part luminous energy is converted into thermal energy, reduces the overall brightness of LED encapsulation.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of LED encapsulation structure and packaging methods, by single LED
Chip is packaged to solve the problems, such as that LED chip luminous efficiency is poor in the prior art.
The technical solution to solve the above problems is: it includes substrate that the present invention, which provides a kind of LED encapsulation structure,；Several LED cores
Piece is distributed on the substrate；Encapsulated layer, including several encapsulation units, the encapsulation unit is corresponding to be covered in a LED chip
On；Substratum transparent covers the encapsulated layer.
Further, the encapsulated layer material therefor is consistent with the substratum transparent material therefor.
Further, the encapsulated layer material therefor is fluorescent glue, includes fluorescent powder grain, scattering grain in the fluorescent glue
At least one of son and quantum dot particles.
Further, the thickness of the LED chip is less than the thickness of the substratum transparent.
Further, there are gaps between the encapsulation unit.
Further, the LED chip is flip-chip, and the size of the LED chip is between 100 μm to 500 μm.
Further, the encapsulated layer refractive index is less than or equal to the substratum transparent refractive index.
Further, the LED chip is completely covered in the encapsulation unit,；The encapsulation unit includes the first encapsulation part,
It is covered in the upper surface of the LED chip；And second encapsulation part, it is covered in the side of the LED chip；Wherein, described
2 times or 3 times of the thickness with a thickness of second encapsulation part of one encapsulation part.
The present invention also provides the packaging methods of LED a kind of, including S1) substrate is provided；S2) on the substrate uniformly
Distribution and fixed several LED chips；S3 encapsulated layer) is packaged in the LED chip；Wherein, if including in the encapsulated layer
Dry encapsulation unit, the encapsulation unit is corresponding to be covered in a LED chip；S4 transparent adhesive tape) is covered on the LED chip,
And form substratum transparent.
Further, by gluing process packaging plastic is encapsulated in each LED chip in step S3) and described in being formed
Encapsulation unit.
The invention has the advantages that LED encapsulation structure of the invention reaches hair by uniformly arranging LED chip on substrate
The effect of light encapsulates fluorescent glue in each LED chip to become apparent from the illumination effect of LED chip, after making encapsulation
LED chip volume becomes larger, and the light shape in power angular range is more uniform, light mixing effect more, while single packaging LED chips
On so that the spacing of itself and adjacent LED chip is become larger, reduce unit area in LED chip dosage, reduce cost, it is of the invention
Packaging method carries out single encapsulation to LED chip by gluing process, and controls single by adjusting dispensing amount and dispensing number
The encapsulation amount and packaging appearance of LED chip guarantee the uniformity of luminance of chip all angles, while single packaging LED chips can
To reduce the fluorescent powder dosage in fluorescent glue, cost is greatly reduced.
Detailed description of the invention
The present invention is further explained with reference to the accompanying drawings and examples.
Fig. 1 is that LED chip schematic diagram is fixed in embodiment 1.
Fig. 2 is packaging LED chips schematic diagram in embodiment 1.
Fig. 3 is LED encapsulation structure schematic diagram in embodiment 1.
Fig. 4 is LED encapsulation structure schematic diagram in embodiment 2.
In figure
10 substrates；20 LED chips；
30 encapsulated layers；40 substratum transparents；
301 encapsulation units；
310 first encapsulation parts；320 second encapsulation parts；
Specific embodiment
Below in conjunction with Figure of description, the preferred embodiments of the present invention are described in detail, with complete to those of skill in the art
It is whole to introduce technology contents of the invention, prove that the present invention can be implemented with citing, so that technology contents disclosed by the invention are more
It is clear, so that will more readily understand how implement the present invention by those skilled in the art.However the present invention can pass through many differences
The embodiment of form emerges from, and protection scope of the present invention is not limited only to the embodiment mentioned in text, Examples below
The range that is not intended to limit the invention of explanation.
The direction term that the present invention is previously mentioned, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outside", "
Side " etc. is only the direction in attached drawing, and direction term used herein is of the invention for explanation and illustration, rather than is used
To limit the scope of protection of the present invention.
In the accompanying drawings, the identical component of structure is indicated with same numbers label, everywhere the similar component of structure or function with
Like numeral label indicates.In addition, in order to facilitate understanding and description, the size and thickness of each component shown in the drawings are any
It shows, the present invention does not limit the size and thickness of each component.
When certain components, when being described as " " another component "upper", the component can be placed directly within described another group
On part；There may also be an intermediate module, the component is placed on the intermediate module, and the intermediate module is placed in another group
On part.When a component is described as " installation is extremely " or " being connected to " another component, the two can be understood as direct " installation "
Or " connection " or a component pass through an intermediate module " installation is extremely " or " being connected to " another component.
Embodiment 1
As shown in figure 3, LED encapsulation structure of the invention includes substrate 10, LED chip 20, encapsulated layer 30 in the present embodiment
With substratum transparent 40.
The substrate 10 includes one of flexible circuit board or hard circuit board.
The LED chip 20 is flip-chip and to use as light source, size between 100 μm to 500 μm simultaneously
It arranges and is uniformly set on the substrate 10 in length and breadth, the LED chip 20 includes that chip pin is convenient for electrically connecting with the substrate 10
It connects.
The encapsulated layer 30 is transparent silica gel, refractive index 1.4, as shown in Fig. 2, the encapsulated layer 30 includes several envelopes
Unit 301 is filled, each encapsulation unit 301 includes the first encapsulation part 310 for being covered in the upper surface of the LED chip, with
And be covered in the second encapsulation part 320 of the side of the LED chip, wherein first encapsulation part 310 with a thickness of described
2 times or 3 times of the thickness of two encapsulation parts 320 make the 20 all angles luminous intensity of LED chip tend to equalize.
The substratum transparent 40 is transparent silica gel, and refractive index 1.4, the substratum transparent 40 is covered in the encapsulated layer
On 30, the thickness of any LED chip 20 is respectively less than the thickness of the substratum transparent 40.
In the present embodiment, the packaging method of LED of the invention a kind of, including
S1) one substrate 10 is provided；
S2) as shown in Figure 1, fixing several LED chips 20 on the substrate 10, LED chip 20 is uniformly distributed in described
10 on substrate；
S3) as shown in Fig. 2, packaging plastic is encapsulated in each LED chip 20 by gluing process and described in being formed
Encapsulation unit 301, while the encapsulation amount and encapsulation of the encapsulation unit 301 can be controlled by control dispensing amount and dispensing number
Shape guarantees the uniformity of luminance of 20 all angles of LED chip；
S4 the substrate 10) is encapsulated by substratum transparent 40, wherein the substratum transparent 40 covers the LED chip 20.
Embodiment 2
As shown in figure 4, LED encapsulation structure of the invention includes substrate 10, LED chip 20, encapsulated layer 30 in the present embodiment
With substratum transparent 40.
The substrate 10 includes one of flexible circuit board or hard circuit board.
The LED chip 20 is flip-chip and to use as light source, size between 100 μm to 500 μm simultaneously
It arranges and is uniformly set on the substrate 10 in length and breadth, the LED chip 20 includes that chip pin is convenient for electrically connecting with the substrate 10
It connects.
The encapsulated layer 30 is that the encapsulated layer material therefor is fluorescent glue, can increase shining for the LED chip 20
Intensity includes at least one of fluorescent powder grain, scattering particles and quantum dot particles in the fluorescent glue, and refractive index is
1.5, the encapsulated layer 30 includes several encapsulation units 301, and each encapsulation unit 301 includes being covered in the LED chip
Upper surface the first encapsulation part 310, and be covered in the second encapsulation part 320 of the side of the LED chip, wherein described
2 times or 3 times of the thickness with a thickness of second encapsulation part 320 of first encapsulation part 310 make each angle of the LED chip 20
Degree luminous intensity tends to equalize.Fluorescence Fluorescence powder particles can be saved by being packaged to the single LED chip 20
Dosage, save the cost.
The substratum transparent 40 is transparent silica gel, and refractive index 1.4, the refractive index of the substratum transparent 40 is less than described
The refractive index of encapsulated layer 30, the substratum transparent 40 are covered on the encapsulated layer 30, the thickness of any LED chip 20
Degree is respectively less than the thickness of the substratum transparent 40.
In the present embodiment, the packaging method of LED of the invention a kind of, including
S1) one substrate 10 is provided；
S2 several LED chips 20) are fixed on the substrate 10, LED chip 20 is uniformly distributed in 10 on the substrate；
S3) packaging plastic is encapsulated in each LED chip 20 by gluing process and forms the encapsulation unit
301, wherein the encapsulation unit 301 is the substratum transparent doped with fluorescent powder, while control dispensing amount and dispensing can be passed through
Number controls the encapsulation amount and packaging appearance of the encapsulation unit 301, guarantees the luminous uniform of 20 all angles of LED chip
Property；
S4 the substrate 10) is encapsulated by substratum transparent 40, wherein the substratum transparent 40 covers the LED chip 20.
The above is merely preferred embodiments of the present invention, it should be appreciated that illustrative embodiments as described herein should only by
It is considered descriptive, is used to help understand method and its core concept of the invention, and is not intended to restrict the invention.Every
The class suitable for other exemplary embodiments should be usually considered to the description of features or aspect in a illustrative embodiments
Like features or aspect.Although reference example embodiment describes the present invention, it can suggest those skilled in the art's progress
Various change and change.The invention is intended to cover these variations and change in the scope of the appended claims.
Claims (10)
1. a kind of LED encapsulation structure, which is characterized in that including
Substrate；
Several LED chips are distributed on the substrate；
Encapsulated layer, including several encapsulation units, the encapsulation unit is corresponding to be covered in a LED chip；
Substratum transparent covers the encapsulated layer.
2. a kind of LED encapsulation structure according to claim 1, which is characterized in that
The encapsulated layer material therefor is consistent with the substratum transparent material therefor.
3. a kind of LED encapsulation structure according to claim 1, which is characterized in that
The encapsulated layer material therefor is fluorescent glue, includes fluorescent powder grain, scattering particles and quantum dot in the fluorescent glue
At least one of particle.
4. a kind of LED encapsulation structure according to claim 1, which is characterized in that
The thickness of the LED chip is less than the thickness of the substratum transparent.
5. a kind of LED encapsulation structure according to claim 1, which is characterized in that
There are gaps between the encapsulation unit.
6. a kind of LED encapsulation structure according to claim 1, which is characterized in that
The LED chip is flip-chip, and the size of the LED chip is between 100 μm to 500 μm.
7. a kind of LED encapsulation structure according to claim 1, which is characterized in that
The encapsulated layer refractive index is less than or equal to the substratum transparent refractive index.
8. a kind of LED encapsulation structure according to claim 1, which is characterized in that
The LED chip is completely covered in the encapsulation unit,；
The encapsulation unit includes
First encapsulation part is covered in the upper surface of the LED chip；And
Second encapsulation part is covered in the side of the LED chip；
Wherein, 2 times or 3 times of the thickness with a thickness of second encapsulation part of first encapsulation part.
9. a kind of packaging method of LED, which is characterized in that including
S1) one substrate is provided；
S2 several LED chips) are uniformly distributed and fixed on the substrate；
S3 encapsulated layer) is packaged in the LED chip；It wherein, include several encapsulation units in the encapsulated layer, the encapsulation is single
Member is corresponding to be covered in a LED chip；
S4 transparent adhesive tape) is covered on the LED chip, and forms substratum transparent.
10. the packaging method of LED according to claim 9, which is characterized in that
Packaging plastic is encapsulated in each LED chip by gluing process in step S3) and forms the encapsulation unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910207385.1A CN109950233A (en) | 2019-03-19 | 2019-03-19 | A kind of LED encapsulation structure and packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910207385.1A CN109950233A (en) | 2019-03-19 | 2019-03-19 | A kind of LED encapsulation structure and packaging method |
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| CN109950233A true CN109950233A (en) | 2019-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910207385.1A Pending CN109950233A (en) | 2019-03-19 | 2019-03-19 | A kind of LED encapsulation structure and packaging method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113327933A (en) * | 2021-05-20 | 2021-08-31 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
| CN117008377A (en) * | 2023-10-08 | 2023-11-07 | 合肥泰沃达智能装备有限公司 | Direct type backlight source with zero light mixing distance and display equipment using direct type backlight source |
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| CN103199185A (en) * | 2008-05-30 | 2013-07-10 | 夏普株式会社 | Light emitting device, planar light source, liquid crystal display device and method for manufacturing light emitting device |
| CN105449083A (en) * | 2016-01-12 | 2016-03-30 | 华中科技大学 | LED fluorescent powder glue coating method |
| CN105720174A (en) * | 2016-04-20 | 2016-06-29 | 漳州立达信光电子科技有限公司 | LED (Light Emitting Diode) surface light source and preparation method thereof |
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2019
- 2019-03-19 CN CN201910207385.1A patent/CN109950233A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199185A (en) * | 2008-05-30 | 2013-07-10 | 夏普株式会社 | Light emitting device, planar light source, liquid crystal display device and method for manufacturing light emitting device |
| CN105449083A (en) * | 2016-01-12 | 2016-03-30 | 华中科技大学 | LED fluorescent powder glue coating method |
| CN105720174A (en) * | 2016-04-20 | 2016-06-29 | 漳州立达信光电子科技有限公司 | LED (Light Emitting Diode) surface light source and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113327933A (en) * | 2021-05-20 | 2021-08-31 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
| CN117008377A (en) * | 2023-10-08 | 2023-11-07 | 合肥泰沃达智能装备有限公司 | Direct type backlight source with zero light mixing distance and display equipment using direct type backlight source |
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Application publication date: 20190628 |
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