CN115469481B - Backlight module, preparation method thereof, display module and electronic equipment - Google Patents
Backlight module, preparation method thereof, display module and electronic equipment Download PDFInfo
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- CN115469481B CN115469481B CN202211130581.1A CN202211130581A CN115469481B CN 115469481 B CN115469481 B CN 115469481B CN 202211130581 A CN202211130581 A CN 202211130581A CN 115469481 B CN115469481 B CN 115469481B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000002096 quantum dot Substances 0.000 claims abstract description 58
- 238000003475 lamination Methods 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims abstract description 17
- 239000012788 optical film Substances 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 190
- 238000004806 packaging method and process Methods 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 230000001052 transient effect Effects 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 19
- 230000001070 adhesive effect Effects 0.000 abstract description 19
- 238000000034 method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 239000008393 encapsulating agent Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
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- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
The application provides a backlight unit and preparation method thereof, display module assembly and electronic equipment, backlight unit includes the drive circuit layer, the adhesive linkage, the quantum dot layer, the quantum dot encapsulation layer, optical film layer and a plurality of lighting unit, a side surface on drive circuit layer is provided with the adhesive linkage, the quantum dot layer sets up in the adhesive linkage one side surface that deviates from the drive circuit layer, the quantum dot encapsulation layer sets up in the quantum dot layer one side surface that deviates from the adhesive linkage, optical film layer sets up in the quantum dot encapsulation layer one side surface that deviates from the quantum dot layer, a plurality of lighting unit bonds in the drive circuit layer one side surface that deviates from the adhesive linkage, lighting unit is used for sending light towards one side on drive circuit layer. By directly bonding the light emitting unit to one side surface of the driving circuit layer, the thickness of the backlight module in the lamination direction is reduced. The direction of the light rays emitted by the light emitting unit faces one side of the driving circuit layer, so that the whole structure of the backlight module is compact, and the thickness of the backlight module in the stacking direction is reduced.
Description
Technical Field
The application relates to the technical field of display, in particular to a backlight module, a preparation method thereof, a display module and electronic equipment.
Background
Display technology is one of important research directions in electronic equipment all the time, along with development of display technology, a display panel can present a clearer display picture, but because a larger backlight source is needed, the thickness of a backlight module is possibly increased, the whole thickness of the electronic equipment is finally increased, and the appearance of the electronic equipment is always the main reference aspect of a user. Therefore, it is required to reduce the thickness of the backlight module without affecting the display function of the display panel.
Disclosure of Invention
The application discloses backlight module can solve the great technical problem of backlight module thickness.
In a first aspect, the application provides a backlight module, the backlight module includes driving circuit layer, adhesive linkage, quantum dot layer, quantum dot encapsulation layer, optical film layer and a plurality of light-emitting unit, a side surface of driving circuit layer is provided with the adhesive linkage, the quantum dot layer set up in the adhesive linkage deviates from a side surface of driving circuit layer, the quantum dot encapsulation layer set up in the quantum dot layer deviates from a side surface of adhesive linkage, optical film layer set up in the quantum dot encapsulation layer deviates from a side surface of quantum dot layer, a plurality of light-emitting unit bond in the driving circuit layer deviates from a side surface of adhesive linkage, light-emitting unit is used for facing one side of driving circuit layer sends light.
By directly bonding the light emitting unit to one side surface of the driving circuit layer, that is, by carrying the light emitting unit and the circuits in the driving circuit layer on the same substrate, the thickness of the backlight module in the lamination direction is reduced. Meanwhile, the direction of the light rays emitted by the light emitting unit faces one side of the driving circuit layer, namely, the light emitting unit is in a flip-chip mode, so that the whole structure of the backlight module is compact, and the thickness of the backlight module in the stacking direction is further reduced.
Optionally, the backlight module further includes a reflective layer, where the reflective layer is disposed on a side of the light emitting unit facing away from the driving circuit layer, and is configured to reflect light emitted by the light emitting unit.
Optionally, the backlight module further includes an isolation layer, where the isolation layer is disposed on a surface of the reflection layer facing away from the light emitting unit, and is used for isolating the outside or light rays emitted by the light emitting unit from propagating.
Optionally, the circuit in the driving circuit layer is formed outside the orthographic projection of the light emitting unit on the driving circuit layer.
Optionally, the driving circuit layer is at least partially hollowed out corresponding to the adjacent light emitting units.
Optionally, the backlight module further includes transparent packaging glue, and the transparent packaging glue is filled between adjacent light emitting units.
Optionally, the thickness of the transparent encapsulation adhesive is equal to the thickness of the light emitting unit along the stacking direction of the light emitting unit and the driving circuit layer.
In a second aspect, the present application further provides a method for preparing a backlight module, where the method for preparing a backlight module includes:
providing a transient substrate;
forming an adhesive layer on one side surface of the transient substrate;
forming a driving circuit layer on one side surface of the bonding layer;
bonding a plurality of light emitting units on one side surface of the driving circuit layer;
encapsulating the light emitting unit;
forming a reflecting layer on one side of the light-emitting unit, which is away from the driving circuit layer;
stripping the transient substrate;
forming a quantum dot layer on the surface of one side of the bonding layer, which is away from the driving circuit layer;
forming a quantum dot packaging layer on the surface of one side of the quantum dot layer, which is away from the bonding layer;
and forming an optical film layer on the surface of one side of the quantum dot packaging layer, which is away from the quantum dot layer.
In a third aspect, the present application further provides a display module, where the display module includes a display panel and the backlight module according to the first aspect, where the display panel is configured to change transmittance of light emitted by the backlight module through the display panel under control of an electric field.
In a fourth aspect, the application further provides an electronic device, which includes a housing and the display module set according to the third aspect, where the housing is used to carry the display module set.
Drawings
For a clearer description of the technical solutions in the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic top view of a backlight module according to an embodiment of the disclosure.
Fig. 2 is a schematic cross-sectional view taken along line I-I in fig. 1.
Fig. 3 is a schematic cross-sectional view of a backlight module according to an embodiment of the disclosure.
Fig. 4 is a schematic cross-sectional view of a backlight module according to another embodiment of the present disclosure.
Fig. 5 is a schematic circuit top view of a driving circuit layer according to an embodiment of the present disclosure.
Fig. 6 is a schematic cross-sectional view of a backlight module according to another embodiment of the present disclosure.
Fig. 7 is a schematic cross-sectional view of a backlight module according to another embodiment of the present disclosure.
Fig. 8 is a flowchart of a method for manufacturing a backlight module according to an embodiment of the present disclosure.
Fig. 9 is a schematic cross-sectional view of a transient substrate according to an embodiment of the disclosure.
Fig. 10 is a schematic cross-sectional view of a display panel according to an embodiment of the present application.
Fig. 11 is a schematic top view of an electronic device according to an embodiment of the present application.
Reference numerals illustrate: the light-emitting device comprises a backlight module group-1, a driving circuit layer-11, an adhesive layer-12, a quantum dot layer-13, a quantum dot packaging layer-14, an optical film layer-15, a light-emitting unit-16, a reflecting layer-17, an insulating layer-18, a transparent packaging adhesive-19, a transient substrate-2, a display module group-3, a display panel-31, electronic equipment-4 and a shell-41.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic top view of a backlight module according to an embodiment of the present disclosure; fig. 2 is a schematic cross-sectional view taken along line I-I in fig. 1. The backlight module 1 comprises a driving circuit layer 11, an adhesive layer 12, a quantum dot layer 13, a quantum dot packaging layer 14, an optical film 15 layer and a plurality of light-emitting units 16, wherein the adhesive layer 12 is arranged on one side surface of the driving circuit layer 11, the quantum dot layer 13 is arranged on one side surface of the adhesive layer 12, which is away from the driving circuit layer 11, the quantum dot packaging layer 14 is arranged on one side surface of the quantum dot layer 13, which is away from the adhesive layer 12, the optical film 15 layer is arranged on one side surface of the quantum dot packaging layer 14, which is away from the quantum dot layer 13, the light-emitting units 16 are bonded on one side surface of the driving circuit layer 11, which is away from the adhesive layer 12, and the light-emitting units 16 are used for emitting light rays towards one side of the driving circuit layer 11.
It should be noted that, for a display panel in which the pixel unit cannot emit light autonomously, for example, a liquid crystal display panel, a backlight source needs to be provided to realize the display function of the display panel. The backlight module 1 provided by the application can be used as a backlight source of a liquid crystal display panel, and the thickness of the whole display panel can be reduced by reducing the thickness of the backlight module 1 in the stacking direction.
In this embodiment, the bonding layer 12 is used to bond the driving circuit layer 11 and the quantum dot layer 13, the light emitting unit 16 may be a blue light Mini LED light source, and the light emitting unit 16 emits blue light under the driving of the circuit in the driving circuit layer 11, as indicated by a dashed arrow in fig. 2, which is a possible optical path for the light emitting unit 16 to emit blue light. Blue light emitted by the light emitting unit 16 is incident to the quantum dot layer 13, and excites green and red quantum dots in the quantum dot layer 13, so that white light is formed by mixing, and the white light is emitted after being homogenized by the optical film 15 layer.
Specifically, in the lamination direction of the adhesive layer 12 and the driving circuit layer 11, that is, as shown by solid arrows in fig. 2, the thickness of the adhesive layer 12 may be in the range of 20 μm to 30 μm, so as to ensure that the thickness of the backlight module 1 in the lamination direction is not excessively large. Further, the thickness of the adhesive layer 12 may be 22 μm, 25.3 μm, 27 μm, 28.8 μm, etc., which is not limited in this application. The quantum dot layer 13 is formed by film spraying, so that the thickness of the quantum dot layer 13 along the stacking direction can be controlled to be less than 50 μm, and it is understood that in other possible embodiments, the quantum dot layer 13 can be formed in other ways, so long as the thickness of the quantum dot layer 13 along the stacking direction is not affected, which is not limited in this application. The material of the quantum dot packaging layer 14 may include an alumina material, and is formed by adopting an atomic deposition manner, so as to protect the quantum dot layer 13 and prevent water vapor, oxygen and the like from eroding the quantum dot layer 13, and the thickness range of the quantum dot packaging layer 14 may be less than 100nm. The optical film 15 layer is formed by compounding a prism film, a diffusion film, or the like, and the thickness range of the optical film 15 layer in the lamination direction may be less than 200 μm.
It can be appreciated that in the present embodiment, by directly bonding the light emitting unit 16 to one side surface of the driving circuit layer 11, that is, the light emitting unit 16 and the circuits in the driving circuit layer 11 are carried on the same substrate, the thickness of the backlight module 1 in the lamination direction is reduced. Meanwhile, the light emitted by the light emitting unit 16 faces one side of the driving circuit layer 11, that is, the light emitting unit 16 is in a flip-chip manner, so that the overall structure of the backlight module 1 is compact, and the thickness of the backlight module 1 in the stacking direction is further reduced.
In one possible embodiment, please refer to fig. 3, fig. 3 is a schematic cross-sectional view of a backlight module according to an embodiment of the present application. The backlight module 1 further includes a reflective layer 17, where the reflective layer 17 is disposed on a side of the light emitting unit 16 away from the driving circuit layer 11, and is configured to reflect light emitted by the light emitting unit 16.
It will be appreciated that the light emitting unit 16 is typically a point light source, and emits light not only as indicated by the dashed arrow in fig. 2, but also laterally. In this embodiment, the reflective layer 17 is disposed on a side of the light emitting unit 16 away from the driving circuit layer 11, so that the light emitted by the light emitting unit 16 is as shown by the dashed arrow in fig. 3, which makes up for the shortage of light at the gap between adjacent light emitting units 16, so that the final light output of the backlight module 1 is more uniform and has higher brightness. Meanwhile, the arrangement reduces the Optical Distance (OD) of the backlight module 1, and further reduces the thickness of the backlight module 1 in the stacking direction.
In one possible embodiment, please refer to fig. 4, fig. 4 is a schematic cross-sectional view of a backlight module according to another embodiment of the present application. The backlight module 1 further includes an isolation layer 18, where the isolation layer 18 is disposed on a surface of the reflection layer 17 facing away from the light emitting unit 16, and is used for isolating the outside or light emitted by the light emitting unit 16 from propagating.
It will be appreciated that the material of the insulating layer 18 may be a light-impermeable material. In order to achieve a better reflection effect, the isolation layer 18 is disposed on a surface of the reflection layer 17 facing away from the light emitting unit 16, so that on one hand, the influence of external light on the backlight module 1 can be isolated; on the other hand, the reflectance of the reflecting layer 17 to reflect the light emitted from the light emitting unit 16 and the utilization of the emitted light from the light emitting unit 16 can be further improved.
In one possible embodiment, the thickness of the reflective layer 17 is in the range of 10 μm to 50 μm along the lamination direction of the light emitting unit 16 and the reflective layer 17.
In particular, the reflective layer 17 is formed by plating silver on the encapsulation layer of the light emitting unit 16, and it is understood that in other possible embodiments, the reflective layer 17 may be formed by other materials and other manners, which are not limited in this application. The thickness of the reflection layer 17 in the lamination direction may be 12 μm, 23 μm, 38.7 μm, 41.1 μm, or the like, as long as the thickness of the reflection layer 17 in the lamination direction is ensured not to be excessively large, which is not limited in the present application.
In one possible embodiment, please refer to fig. 5, fig. 5 is a schematic diagram illustrating a circuit top view of a driving circuit layer according to an embodiment of the present application. The wiring in the driving circuit layer 11 is formed outside the orthographic projection of the light emitting unit 16 on the driving circuit layer 11.
It will be appreciated that, in order to avoid as much as possible the influence of the lines in the driving circuit layer 11 on the light emitted by the light emitting unit 16, in this embodiment, the lines in the driving circuit layer 11 are formed outside the orthographic projection of the light emitting unit 16 on the driving circuit layer 11.
Specifically, as shown in fig. 5, the light emitting units 16 are shown in perspective in fig. 5, and the lines in the driving circuit layer 11 are distributed in a grid pattern and are disposed corresponding to the gaps between the adjacent pixel units, so that most of the light emitted by the light emitting units 16 is not affected by the lines in the driving circuit layer 11.
In one possible embodiment, please refer to fig. 6, fig. 6 is a schematic cross-sectional view of a backlight module according to another embodiment of the present application. The driving circuit layer 11 is hollow at least partially corresponding to the adjacent light emitting units 16.
Specifically, at least a portion of the driving circuit layer 11 corresponding to the adjacent light emitting units 16 means at least a portion of a region surrounded by the driving circuit layer 11 adjacent to the light emitting units 16 in the stacking direction. Through an etching process, the driving circuit layer 11 is hollowed out at least partially corresponding to the adjacent light emitting units 16, so as to form a plurality of driving circuit layers 11 arranged at intervals. It will be appreciated that this arrangement enables the light emitted from the light emitting unit 16 to both sides or to exit with higher light transmittance via the reflective layer 17.
In one possible embodiment, the thickness of the driving circuit layer 11 is less than 5 μm along the lamination direction of the light emitting unit 16 and the driving circuit layer 11.
Specifically, the circuit in the driving circuit layer 11 may be patterned by using a mask plate chemical etching process, a photoresist etching process, and other techniques, so as to form a circuit with a relatively thin thickness. It will be appreciated that in other possible embodiments, the lines in the driving circuit layer 11 may be formed in other manners, so long as the line thickness in the driving circuit layer 11 is not affected, which is not limited in this application. The thickness of the driving circuit layer 11 in the lamination direction may be 12 μm, 23 μm, 38.7 μm, 41.1 μm, or the like, as long as the thickness of the reflection layer 17 in the lamination direction is ensured not to be excessively large, which is not limited in the present application.
In one possible embodiment, referring to fig. 2, 3, 4 and 6 again, the backlight module 1 further includes a transparent encapsulant 19, and the transparent encapsulant 19 is filled between adjacent light emitting units 16.
It will be appreciated that, in order not to affect the reflection of the light emitting unit 16 by the reflecting layer 17, the transparent encapsulant 19 is made of a light-transmitting material, for example, epoxy or silicone resin may be used for the transparent encapsulant 19, and by thermally curing the material, it is ensured that sufficient strength is maintained at an ultra-thin thickness. In this embodiment, the transparent encapsulation adhesive 19 is also used to protect the light emitting unit 16.
It can be appreciated that, as shown in fig. 6, the transparent packaging adhesive 19 is further filled in the hollowed-out portion of the driving circuit layer 11, so as to better support the driving circuit layer 11 and the adhesive layer 12, so that the overall strength of the backlight module 1 is greater.
Specifically, the thickness of the transparent encapsulation adhesive 19 in the stacking direction is slightly greater than the thickness of the light emitting unit 16, and may be less than 100 μm. The transparent encapsulation glue 19 is flat on a side surface facing away from the light emitting unit 16, so that the reflecting layer 17 is arranged on a side surface of the transparent encapsulation glue 19 facing away from the light emitting unit 16, and can reflect light emitted by the light emitting unit 16 at a good angle.
In one possible embodiment, please refer to fig. 7, fig. 7 is a schematic cross-sectional view of a backlight module according to another embodiment of the present application. The thickness of the transparent encapsulation adhesive 19 is equal to the thickness of the light emitting unit 16 along the lamination direction of the light emitting unit 16 and the driving circuit layer 11.
Specifically, the present embodiment differs from the previous embodiment in that in the present embodiment, the thickness of the transparent encapsulation adhesive 19 is equal to the thickness of the light emitting unit 16, in other words, the transparent encapsulation adhesive 19 is flush with the surface of the light emitting unit 16 in a direction perpendicular to the lamination direction.
It can be understood that in the present embodiment, the thickness of the backlight module 1 in the lamination direction is further reduced by reducing the thickness of the transparent encapsulation adhesive 19 in the lamination direction.
It should be noted that, the above embodiments may be arranged and combined, which is not listed here.
The present application also provides a method for manufacturing a backlight module, please refer to fig. 8, fig. 8 is a flow chart of a method for manufacturing a backlight module according to an embodiment of the present application. The preparation method of the backlight module comprises steps S801, S802, S803, S804, S805, S608, S807, S808, S809 and S810, wherein the steps S801, S802, S803, S804, S805, S808, S807, S608, S809 and S810 are described in detail below.
S801, providing a transient substrate 2;
s802, forming an adhesive layer 12 on one side surface of the transient substrate 2;
s803, forming a driving circuit layer 11 on one side surface of the adhesive layer 12;
s804 bonding a plurality of light emitting units 16 to one side surface of the driving circuit layer 11;
s805 packaging the light emitting unit 16;
s806, forming a reflective layer 17 on a side of the light emitting unit 16 facing away from the driving circuit layer 11;
s807, peeling off the transient substrate 2;
s808, forming a quantum dot layer 13 on the surface of one side of the bonding layer 12 away from the driving circuit layer 11;
s809, forming a quantum dot packaging layer 14 on the surface of one side of the quantum dot layer 13, which is away from the bonding layer 12;
s810, forming an optical film 15 layer on the surface of one side of the quantum dot packaging layer 14, which is away from the quantum dot layer 13.
Specifically, the adhesive layer 12, the driving circuit layer 11, the light emitting unit 16, the reflecting layer 17, the quantum dot layer 13, the quantum dot packaging layer 14, and the optical film 15 are described above, and will not be described again.
In this embodiment, please refer to fig. 9, fig. 9 is a schematic cross-sectional view of a transient substrate according to an embodiment of the disclosure. By forming the adhesive layer 12 and the driving circuit layer 11 on the transient substrate 2, bonding the light emitting unit 16 to the driving circuit layer 11, and then peeling off the transient substrate 2 by using laser, the purpose of reducing the glass substrate used by the backlight module 1 is achieved, so that the thickness of the backlight module 1 in the lamination direction is reduced.
The application further provides a display module 3, please refer to fig. 10, fig. 10 is a schematic cross-sectional view of the display module according to an embodiment of the application. The display module 3 includes a display panel 31 and the backlight module 1 as described above, where the display panel 31 is configured to change the transmittance of light emitted by the backlight module 1 through the display panel 31 under the control of an electric field. Specifically, the backlight module 1 is described above, and will not be described herein.
Specifically, the display panel 31 further includes a color filter, and the electric field of the pixel definition area in the display panel 31 is controlled to change the light transmittance of each different pixel definition area, and the display function of the display module 3 can be realized by combining the color filter.
It can be appreciated that in the present embodiment, by directly bonding the light emitting unit 16 to one side surface of the driving circuit layer 11, that is, the light emitting unit 16 and the circuits in the driving circuit layer 11 are carried on the same substrate, the thickness of the backlight module 1 in the lamination direction is reduced. Meanwhile, the light emitted by the light emitting unit 16 faces one side of the driving circuit layer 11, that is, the light emitting unit 16 is in a flip-chip manner, so that the overall structure of the backlight module 1 is compact, and the thickness of the backlight module 1 in the stacking direction is further reduced, so that the thickness of the display module 3 in the stacking direction is reduced.
The application further provides an electronic device 4, please refer to fig. 11, and fig. 11 is a schematic top view of the electronic device according to an embodiment of the application. The electronic device 4 includes a housing 41 and the display module 3 as described above, where the housing 41 is used to carry the display module 3. Specifically, the display module 3 is described above, and will not be described herein.
It should be noted that, in the embodiment of the present application, the electronic device 4 may be an electronic device 4 in a mobile phone, a smart phone, a tablet personal computer, an electronic reader, a portable device when worn, a notebook computer, or the like, and may communicate with a data transfer server through the internet, where the data transfer server may be an instant messaging server, an SNS (Social Networking Services, social network service) server, or the like, and the embodiment of the present application is not limited thereto.
It can be appreciated that in the present embodiment, by directly bonding the light emitting unit 16 to one side surface of the driving circuit layer 11, that is, the light emitting unit 16 and the circuits in the driving circuit layer 11 are carried on the same substrate, the thickness of the backlight module 1 in the lamination direction is reduced. Meanwhile, the light emitted by the light emitting unit 16 faces one side of the driving circuit layer 11, that is, the light emitting unit 16 is in a flip-chip manner, so that the overall structure of the backlight module 1 is compact, and the thickness of the backlight module 1 in the stacking direction is further reduced, thereby reducing the thickness of the electronic device 4 in the stacking direction.
The principles and embodiments of the present application are described herein with specific examples applied thereto, the description of the above embodiments being merely for aiding in understanding of the core ideas of the present application; meanwhile, as those skilled in the art will have modifications in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.
Claims (7)
1. The backlight module is characterized by comprising a driving circuit layer, an adhesive layer, a quantum dot packaging layer, an optical film layer and a plurality of light-emitting units, wherein the adhesive layer is arranged on one side surface of the driving circuit layer, the quantum dot layer is arranged on one side surface of the adhesive layer, which is away from the driving circuit layer, the quantum dot packaging layer is arranged on one side surface of the quantum dot layer, which is away from the adhesive layer, the optical film layer is arranged on one side surface of the quantum dot packaging layer, which is away from the quantum dot layer, the light-emitting units are bonded on one side surface of the driving circuit layer, which is away from the adhesive layer, the light-emitting units are used for emitting light rays towards one side of the driving circuit layer, a circuit in the driving circuit layer is formed outside the orthographic projection of the light-emitting units on the driving circuit layer, the driving circuit layer is hollow and forms a plurality of driving circuit layers which are arranged at least partially at intervals corresponding to adjacent to the light-emitting units, transparent packaging glue is filled between the adjacent light-emitting units, and the transparent packaging glue is filled between the light-emitting units and is in contact with the driving circuit layer.
2. The backlight module according to claim 1, further comprising a reflective layer disposed on a side of the light emitting unit facing away from the driving circuit layer, for reflecting light emitted by the light emitting unit.
3. The backlight module according to claim 2, further comprising an isolation layer disposed on a surface of the reflective layer facing away from the light emitting unit, for isolating light from the outside or from light emitted by the light emitting unit.
4. The backlight module according to claim 1, wherein the thickness of the transparent encapsulation is equal to the thickness of the light emitting unit along the lamination direction of the light emitting unit and the driving circuit layer.
5. The preparation method of the backlight module is characterized by comprising the following steps:
providing a transient substrate;
forming an adhesive layer on one side surface of the transient substrate;
forming a driving circuit layer on one side surface of the bonding layer, wherein the driving circuit layer is hollowed out corresponding to at least part of the adjacent light-emitting units and a plurality of driving circuit layers arranged at intervals are formed;
bonding a plurality of light-emitting units on one side surface of the driving circuit layer, wherein a circuit in the driving circuit layer is formed outside orthographic projection of the light-emitting units on the driving circuit layer;
packaging the light emitting unit, comprising: transparent packaging glue is filled between the adjacent light-emitting units, and the transparent packaging glue is also filled in the hollowed-out parts of the driving circuit layers which are arranged at intervals and directly contacts with the bonding layer;
forming a reflecting layer on one side of the light-emitting unit, which is away from the driving circuit layer;
stripping the transient substrate;
forming a quantum dot layer on the surface of one side of the bonding layer, which is away from the driving circuit layer;
forming a quantum dot packaging layer on the surface of one side of the quantum dot layer, which is away from the bonding layer;
and forming an optical film layer on the surface of one side of the quantum dot packaging layer, which is away from the quantum dot layer.
6. A display module, wherein the display module comprises a display panel and the backlight module according to any one of claims 1-4, the display panel is used for changing the transmittance of light rays emitted by the backlight module through the display panel under the control of an electric field.
7. An electronic device, comprising a housing and the display module of claim 6, wherein the housing is configured to carry the display module.
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| CN202211130581.1A CN115469481B (en) | 2022-09-15 | 2022-09-15 | Backlight module, preparation method thereof, display module and electronic equipment |
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| CN115469481A (en) | 2022-12-13 |
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