WO2023165212A1

WO2023165212A1 - Backlight module and direct-lit backlight device

Info

Publication number: WO2023165212A1
Application number: PCT/CN2022/138427
Authority: WO
Inventors: 姚黎晓; 李健林; 李沛; 王代青
Original assignee: 惠州视维新技术有限公司
Priority date: 2022-03-01
Filing date: 2022-12-12
Publication date: 2023-09-07
Also published as: CN217061299U

Abstract

The present application provides a backlight module and a direct-lit backlight device. The backlight module comprises a plurality of light sources, a transparent substrate and a diffusion plate for diffusing light emitted by the plurality of light sources; the diffusion plate and the transparent substrate are arranged opposite to each other; the plurality of light sources are provided on a back surface of the transparent substrate; the back surface of the transparent substrate is the surface of the transparent substrate away from the diffusion plate. According to the present application, the thickness of the transparent substrate can be converted into a part of a light mixing distance, so that thinning of a product is facilitated.

Description

Backlight module and direct-lit backlight device

technical field

The present application relates to the field of backlight technology, in particular to a backlight module and a direct-lit backlight device.

Background technique

The direct-lit mini LED backlight module has the advantages of good display effect and partition control, and gradually occupies most of the market share in the high-end market. But straight-down Mini The LED backlight module uses a large number of LEDs, which increases the cost; and reducing the number of LEDs will increase the light mixing distance (commonly known as OD, which refers to the distance required for the light emitted by the LED to cover the diffuser plate evenly), thereby increasing The overall thickness reduces the appearance taste of the product.

technical problem

Embodiments of the present application provide a backlight module and a direct-lit backlight device to reduce the thickness of the backlight module at the same light mixing distance and reduce the number of light sources at the same thickness.

technical solution

In one aspect, the present application provides a backlight module, which includes a plurality of light sources, a transparent substrate, and a diffusion plate for diffusing the light emitted by the plurality of light sources, the diffusion plate is arranged opposite to the transparent substrate, A plurality of the light sources are arranged on the back of the transparent substrate, and the back of the transparent substrate is a side of the transparent substrate facing away from the diffusion plate.

In the backlight module, the light source is an LED front-mount chip, a transparent ITO circuit layer is arranged on the back of the transparent substrate, and the pins of the LED front-mount chip are welded to the ITO circuit layer.

In the backlight module, the LED front-mount chip is a mini LED front-mount chip.

In the backlight module, the light source is an LED flip chip, a circuit layer is provided on the back of the transparent substrate, and the pins of the LED flip chip are electrically connected to the circuit layer through wires.

In the backlight module, the LED flip chip is a mini LED flip chip.

In the backlight module, the transparent substrate is a glass substrate or a PET substrate.

In the backlight module, the front side of the transparent substrate is printed with a light refraction pattern, the refractive index of the light refraction pattern is greater than the refractive index of the transparent substrate, and the front side of the transparent substrate faces the direction of the transparent substrate. one side of the diffuser plate.

In the backlight module, the thickness of the light refraction pattern is 12 μm-24 μm.

In the backlight module, the refractive index of the light refraction pattern is 1.54-1.72.

In the backlight module, the backlight module further includes an encapsulation shell, the encapsulation shell is arranged on the back of the transparent substrate, the light source is encapsulated in the encapsulation shell, and the inner side of the encapsulation shell A reflective layer is provided on the wall.

In the backlight module, the reflective layer is a reflective coating or a reflective coating layer.

In the backlight module described above, the inner wall surface of the package shell is an arc-shaped surface.

In the backlight module, the backlight module further includes encapsulation glue, the light source is encapsulated in the encapsulation glue, and the encapsulation glue is bonded to the back of the transparent substrate.

On the other hand, the present application also provides a direct-type backlight device, wherein the direct-type backlight device includes a backlight module, and the backlight module includes a plurality of light sources, a transparent substrate, and a device for emitting light from the plurality of light sources. A diffusion plate for diffusing the light, the diffusion plate is arranged opposite to the transparent substrate, a plurality of the light sources are arranged on the back of the transparent substrate, and the back of the transparent substrate is that the transparent substrate faces away from the diffusion side of the board.

In the direct type backlight device, the light source is an LED front-mount chip, a transparent ITO circuit layer is provided on the back of the transparent substrate, and the pins of the LED front-mount chip are welded to the ITO circuit layer.

In the direct-lit backlight device, the LED front-mount chip is a mini LED front-mount chip.

In the direct-lit backlight device, the light source is an LED flip chip, a circuit layer is provided on the back of the transparent substrate, and pins of the LED flip chip are electrically connected to the circuit layer through wires.

In the direct-lit backlight device, the LED flip chip is a mini LED flip chip.

In the direct type backlight device, a light refraction pattern is printed on the front side of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front side of the transparent substrate is the transparent substrate The side facing the diffuser plate.

In the direct type backlight device, the backlight module further includes an encapsulation shell, the encapsulation shell is arranged on the back side of the transparent substrate, the light source is encapsulated in the encapsulation shell, and the encapsulation shell A reflective layer is provided on the inner wall surface.

Beneficial effect

The beneficial effects of the present application are: by arranging the diffuser plate opposite to the transparent substrate, multiple light sources are arranged on the side of the transparent substrate away from the diffuser plate, so that the thickness of the transparent substrate can be converted into a part of the light mixing distance to achieve the same light mixing The reduction of the thickness of the backlight module under the distance and the reduction of the number of light sources under the same thickness of the backlight module. Among them, the reduction of the overall thickness of the backlight module under the same light mixing distance is conducive to the thinning of the product, and the reduction of the number of light sources under the same overall thickness of the backlight module is conducive to saving costs.

Description of drawings

The technical solutions and other beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application below in conjunction with the accompanying drawings.

FIG. 1 is a schematic diagram of a first structure of a backlight module provided by an embodiment of the present application.

FIG. 2 is a schematic diagram of the second structure of the backlight module provided by the embodiment of the present application.

FIG. 3 is a schematic diagram of a third structure of the backlight module provided by the embodiment of the present application.

FIG. 4 is a schematic diagram of the first connection between the transparent substrate and the light source provided by the embodiment of the present application.

FIG. 5 is a schematic diagram of a second connection between the transparent substrate and the light source provided by the embodiment of the present application.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

The embodiment of the present application provides a backlight module. As shown in FIGS. Diffusion plate 30 for diffusion. The diffusion plate 30 is set opposite to the transparent substrate 20 .

The backlight module provided in the embodiment of the present application can convert the thickness of the transparent substrate 20 into a light mixing distance by arranging the diffuser plate 30 opposite to the transparent substrate 20 and setting the light source 10 on the side of the transparent substrate 20 away from the diffuser plate 30 A part of D realizes the reduction of the thickness of the backlight module under the same light mixing distance D (that is, the same number of light sources 10 ) and the reduction of the number of light sources 10 under the same overall thickness of the backlight module. Wherein, the reduction of the overall thickness of the backlight module under the same light mixing distance D is beneficial to the thinning of the product, and the reduction of the number of light sources 10 under the same overall thickness of the backlight module is beneficial to cost saving.

It should be understood that, under the premise of achieving the same backlight effect, when the number of light sources 10 decreases, it is necessary to increase the light mixing distance D, resulting in an increase in the thickness of the backlight module; and when the number of light sources 10 increases, the light mixing distance D can be reduced, so that Reducing the overall thickness of the backlight module will increase the cost. Since the backlight module provided by the embodiment of the present application converts the thickness of the transparent substrate 20 into a part of the light mixing distance D, under the premise of achieving the same backlight effect, the overall thickness of the backlight module can be reduced when the light mixing distance D is the same , making the product thinner, and reducing the overall thickness of the backlight module without increasing the number of light sources 10; and when the overall thickness of the backlight module is the same, the light mixing distance D can be increased, so that two adjacent light sources 10 The distance D between them increases, so the number of light sources 10 can be reduced and the cost can be reduced.

Specifically, a plurality of light sources 10 are arranged at intervals on the back of the transparent substrate 20 . As shown in FIG. 4, in some embodiments of the present application, the light source 10 is an LED front-mount chip, and the light-emitting surface and two pins of the LED front-mount chip are all facing the transparent substrate 20. As shown in the figure, on the back of the transparent substrate 20 A transparent ITO circuit layer 41 is provided, and the two pins of the LED front-mounted chip are welded to the ITO circuit layer 41 to realize the electrical connection between the LED front-mounted chip and the ITO circuit layer 41 . Optionally, the LED formal chip can be a mini LED formal chip.

Or, as shown in FIG. 5, in other embodiments of the present application, the light source 10 can also be an LED flip chip. As shown in the figure, the light-emitting surface of the LED flip chip faces the transparent substrate 20, and the LED flip chip The two pins are away from the transparent substrate 20 , and a circuit layer is arranged on the back of the transparent substrate 20 , and the pins of the LED flip chip are electrically connected to the circuit layer through wires 42 . Optionally, the LED flip chip can be a mini LED flip chip.

Optionally, the transparent substrate 20 may be a glass substrate or a PET (Polyethylene terephthalate, polyethylene terephthalate) substrate. Both glass and PET have high refractive index characteristics. Among them, the refractive index of glass is 1.51, and the refractive index of PET is 1.71. Therefore, the use of glass substrates and PET substrates can increase the light output at a large angle, further expand the light angle, and reduce the light emitted by the light source 10. The light is scattered, so that the backlight module can emit more uniform light with the same number of light sources 10, and can reduce the number of light sources 10 and reduce the cost when the same light output effect is achieved. In addition, compared with the high-refractive-index silica gel (the refractive index of high-refractive-index silica gel is 1.51), which is expensive for packaging glue, the cost can be reduced by using glass substrates and PET substrates.

As shown in Figure 2, in some embodiments of the present application, a light refraction pattern 50 is printed on the front side of the transparent substrate 20, the refractive index of the light refraction pattern 50 is greater than that of the transparent substrate 20, and the front side of the transparent substrate 20 is a transparent substrate 20 faces the side of the diffusion plate 30 , that is, the light-emitting surface of the transparent substrate 20 . The light refraction pattern 50 needs to have a certain thickness and a certain refractive index. Optionally, the thickness of the light refraction pattern 50 is 12 μm-24 μm, and the refractive index is 1.54-1.72. By printing the light refraction pattern 50 on the front side of the transparent substrate 20, the light output angle can be further increased, the light mixing effect can be increased, and the brightness uniformity of the backlight module can be improved. Optionally, the light refraction pattern 50 can be printed on the front side of the transparent substrate 20 by using high refractive index glue.

As shown in FIG. 1 , in some embodiments of the present application, the backlight module further includes an encapsulation glue 60, the light source 10 is packaged in the encapsulation glue 60, and the encapsulation glue 60 is bonded on the back of the transparent substrate 20, that is, The light source 10 is encapsulated and fixed on the transparent substrate 20 through the encapsulation glue 60 . Optionally, the encapsulation glue 60 may be transparent silicone or epoxy resin.

Or, as shown in FIG. 2 and FIG. 3 , in other embodiments of the present application, the backlight module further includes an encapsulation shell 70, the encapsulation shell 70 is arranged on the back side of the transparent substrate 20, and the light source 10 is encapsulated in the encapsulation shell 70 A reflective layer having a reflective effect is provided on the inner wall surface of the packaging case 70 . Wherein, the reflective layer can reflect the incident light toward the light-emitting side of the backlight module (that is, the diffuser plate 30 ), and the reflective layer can be a reflective coating formed by coating the inner wall surface of the package shell 70 with a reflective material, or the reflective layer It may also be a reflective coating formed by coating the inner wall surface of the package case 70 with a material having a reflective effect. The light source 10 is packaged in the package case 70 by providing a package case 70 with a reflective layer on the inner side wall surface on the back of the transparent substrate 20, so that the light emitted from the side of the light source 10 can be reflected by the reflective layer, increasing the utilization rate of the side light, Improve light effect.

Optionally, the inner side wall surface of the packaging case 70 may be a plane or an arc surface, preferably an arc surface. The arc surface has a better effect of collecting light emitted from the side of the light source 10 and can further improve light efficiency.

The embodiment of the present application also provides a direct-type backlight device. The direct-type backlight device provided in the embodiment of the present application includes the backlight module in any one of the above embodiments.

In the foregoing embodiments, the descriptions of each embodiment have their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.

The backlight module and the direct-lit backlight device provided by the embodiment of the present application have been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present application. The description of the above embodiment is only used to help understand the present application. The method of application and its core idea; at the same time, for those skilled in the art, according to the idea of this application, there will be changes in the specific implementation and application scope. limits.

Claims

A backlight module, which includes a plurality of light sources, a transparent substrate and a diffusion plate for diffusing the light emitted by the plurality of light sources, the diffusion plate is arranged opposite to the transparent substrate, and the plurality of light sources are arranged On the back side of the transparent substrate, the back side of the transparent substrate is a side of the transparent substrate facing away from the diffusion plate.
The backlight module according to claim 1, wherein the light source is an LED front-mount chip, a transparent ITO circuit layer is provided on the back of the transparent substrate, and the pins of the LED front-mount chip are connected to the ITO circuit layer. welding.
The backlight module according to claim 2, wherein the LED front-mount chip is a mini LED front-mount chip.
The backlight module according to claim 1, wherein the light source is an LED flip chip, a circuit layer is provided on the back of the transparent substrate, and the pins of the LED flip chip are connected to the circuit layer through wires. electrical connection.
The backlight module according to claim 4, wherein the LED flip chip is a mini LED flip chip.
The backlight module according to claim 1, wherein the transparent substrate is a glass substrate or a PET substrate.
The backlight module according to claim 1, wherein a light refraction pattern is printed on the front side of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front side of the transparent substrate is the The side of the transparent substrate facing the diffusion plate.
The backlight module according to claim 7, wherein the thickness of the light refraction pattern is 12 μm-24 μm.
The backlight module according to claim 7, wherein the refractive index of the light refraction pattern is 1.54-1.72.
The backlight module according to claim 1, wherein the backlight module further comprises an encapsulation, the encapsulation is arranged on the back of the transparent substrate, the light source is encapsulated in the encapsulation, the A reflective layer is provided on the inner wall surface of the packaging shell.
The backlight module according to claim 10, wherein the reflective layer is a reflective coating or a reflective coating layer.
The backlight module according to claim 10, wherein the inner wall surface of the packaging case is an arc-shaped surface.
The backlight module according to claim 1, wherein the backlight module further comprises encapsulation glue, the light source is packaged in the encapsulation glue, and the encapsulation glue sticks the .
A direct-type backlight device, wherein the direct-type backlight device includes a backlight module;

The backlight module includes a plurality of light sources, a transparent substrate, and a diffusion plate for diffusing the light emitted by the plurality of light sources. The diffusion plate is arranged opposite to the transparent substrate, and the plurality of light sources are arranged on the On the back of the transparent substrate, the back of the transparent substrate is the side of the transparent substrate facing away from the diffusion plate.
The direct-lit backlight device according to claim 14, wherein the light source is an LED front-mount chip, a transparent ITO circuit layer is arranged on the back side of the transparent substrate, and the pins of the LED front-mount chip are connected to the ITO circuit layer. layer welding.
The direct-lit backlight device according to claim 15, wherein the LED front-mount chip is a mini LED front-mount chip.
The direct-lit backlight device according to claim 14, wherein the light source is an LED flip-chip, a circuit layer is provided on the back of the transparent substrate, and the pins of the LED flip-chip are connected to the circuit through wires. layer electrical connection.
The direct-lit backlight device according to claim 17, wherein the LED flip chip is a mini LED flip chip.
The direct-lit backlight device according to claim 14, wherein a light refraction pattern is printed on the front side of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front side of the transparent substrate is A side of the transparent substrate facing the diffusion plate.
The direct-lit backlight device according to claim 14, wherein the backlight module further comprises an encapsulation shell, the encapsulation shell is arranged on the back surface of the transparent substrate, the light source is encapsulated in the encapsulation shell, the A reflective layer is provided on the inner wall surface of the packaging shell.