WO2023165212A1 - Module de rétroéclairage et dispositif de rétroéclairage à éclairage direct - Google Patents

Module de rétroéclairage et dispositif de rétroéclairage à éclairage direct Download PDF

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Publication number
WO2023165212A1
WO2023165212A1 PCT/CN2022/138427 CN2022138427W WO2023165212A1 WO 2023165212 A1 WO2023165212 A1 WO 2023165212A1 CN 2022138427 W CN2022138427 W CN 2022138427W WO 2023165212 A1 WO2023165212 A1 WO 2023165212A1
Authority
WO
WIPO (PCT)
Prior art keywords
transparent substrate
backlight module
light
direct
led
Prior art date
Application number
PCT/CN2022/138427
Other languages
English (en)
Chinese (zh)
Inventor
姚黎晓
李健林
李沛
王代青
Original Assignee
惠州视维新技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠州视维新技术有限公司 filed Critical 惠州视维新技术有限公司
Publication of WO2023165212A1 publication Critical patent/WO2023165212A1/fr

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • the present application relates to the field of backlight technology, in particular to a backlight module and a direct-lit backlight device.
  • the direct-lit mini LED backlight module has the advantages of good display effect and partition control, and gradually occupies most of the market share in the high-end market. But straight-down Mini
  • the LED backlight module uses a large number of LEDs, which increases the cost; and reducing the number of LEDs will increase the light mixing distance (commonly known as OD, which refers to the distance required for the light emitted by the LED to cover the diffuser plate evenly), thereby increasing The overall thickness reduces the appearance taste of the product.
  • Embodiments of the present application provide a backlight module and a direct-lit backlight device to reduce the thickness of the backlight module at the same light mixing distance and reduce the number of light sources at the same thickness.
  • the present application provides a backlight module, which includes a plurality of light sources, a transparent substrate, and a diffusion plate for diffusing the light emitted by the plurality of light sources, the diffusion plate is arranged opposite to the transparent substrate, A plurality of the light sources are arranged on the back of the transparent substrate, and the back of the transparent substrate is a side of the transparent substrate facing away from the diffusion plate.
  • the light source is an LED front-mount chip
  • a transparent ITO circuit layer is arranged on the back of the transparent substrate, and the pins of the LED front-mount chip are welded to the ITO circuit layer.
  • the LED front-mount chip is a mini LED front-mount chip.
  • the light source is an LED flip chip
  • a circuit layer is provided on the back of the transparent substrate, and the pins of the LED flip chip are electrically connected to the circuit layer through wires.
  • the LED flip chip is a mini LED flip chip.
  • the transparent substrate is a glass substrate or a PET substrate.
  • the front side of the transparent substrate is printed with a light refraction pattern, the refractive index of the light refraction pattern is greater than the refractive index of the transparent substrate, and the front side of the transparent substrate faces the direction of the transparent substrate. one side of the diffuser plate.
  • the thickness of the light refraction pattern is 12 ⁇ m-24 ⁇ m.
  • the refractive index of the light refraction pattern is 1.54-1.72.
  • the backlight module further includes an encapsulation shell, the encapsulation shell is arranged on the back of the transparent substrate, the light source is encapsulated in the encapsulation shell, and the inner side of the encapsulation shell A reflective layer is provided on the wall.
  • the reflective layer is a reflective coating or a reflective coating layer.
  • the inner wall surface of the package shell is an arc-shaped surface.
  • the backlight module further includes encapsulation glue, the light source is encapsulated in the encapsulation glue, and the encapsulation glue is bonded to the back of the transparent substrate.
  • the present application also provides a direct-type backlight device, wherein the direct-type backlight device includes a backlight module, and the backlight module includes a plurality of light sources, a transparent substrate, and a device for emitting light from the plurality of light sources.
  • a diffusion plate for diffusing the light the diffusion plate is arranged opposite to the transparent substrate, a plurality of the light sources are arranged on the back of the transparent substrate, and the back of the transparent substrate is that the transparent substrate faces away from the diffusion side of the board.
  • the light source is an LED front-mount chip
  • a transparent ITO circuit layer is provided on the back of the transparent substrate, and the pins of the LED front-mount chip are welded to the ITO circuit layer.
  • the LED front-mount chip is a mini LED front-mount chip.
  • the light source is an LED flip chip
  • a circuit layer is provided on the back of the transparent substrate
  • pins of the LED flip chip are electrically connected to the circuit layer through wires.
  • the LED flip chip is a mini LED flip chip.
  • a light refraction pattern is printed on the front side of the transparent substrate, the refractive index of the light refraction pattern is greater than that of the transparent substrate, and the front side of the transparent substrate is the transparent substrate The side facing the diffuser plate.
  • the backlight module further includes an encapsulation shell, the encapsulation shell is arranged on the back side of the transparent substrate, the light source is encapsulated in the encapsulation shell, and the encapsulation shell A reflective layer is provided on the inner wall surface.
  • the beneficial effects of the present application are: by arranging the diffuser plate opposite to the transparent substrate, multiple light sources are arranged on the side of the transparent substrate away from the diffuser plate, so that the thickness of the transparent substrate can be converted into a part of the light mixing distance to achieve the same light mixing
  • the reduction of the thickness of the backlight module under the distance and the reduction of the number of light sources under the same thickness of the backlight module are conducive to the thinning of the product, and the reduction of the number of light sources under the same overall thickness of the backlight module is conducive to saving costs.
  • FIG. 1 is a schematic diagram of a first structure of a backlight module provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of the second structure of the backlight module provided by the embodiment of the present application.
  • FIG. 3 is a schematic diagram of a third structure of the backlight module provided by the embodiment of the present application.
  • FIG. 4 is a schematic diagram of the first connection between the transparent substrate and the light source provided by the embodiment of the present application.
  • FIG. 5 is a schematic diagram of a second connection between the transparent substrate and the light source provided by the embodiment of the present application.
  • the embodiment of the present application provides a backlight module. As shown in FIGS. Diffusion plate 30 for diffusion.
  • the diffusion plate 30 is set opposite to the transparent substrate 20 .
  • the backlight module provided in the embodiment of the present application can convert the thickness of the transparent substrate 20 into a light mixing distance by arranging the diffuser plate 30 opposite to the transparent substrate 20 and setting the light source 10 on the side of the transparent substrate 20 away from the diffuser plate 30
  • a part of D realizes the reduction of the thickness of the backlight module under the same light mixing distance D (that is, the same number of light sources 10 ) and the reduction of the number of light sources 10 under the same overall thickness of the backlight module.
  • the reduction of the overall thickness of the backlight module under the same light mixing distance D is beneficial to the thinning of the product, and the reduction of the number of light sources 10 under the same overall thickness of the backlight module is beneficial to cost saving.
  • the backlight module converts the thickness of the transparent substrate 20 into a part of the light mixing distance D, under the premise of achieving the same backlight effect, the overall thickness of the backlight module can be reduced when the light mixing distance D is the same , making the product thinner, and reducing the overall thickness of the backlight module without increasing the number of light sources 10; and when the overall thickness of the backlight module is the same, the light mixing distance D can be increased, so that two adjacent light sources 10 The distance D between them increases, so the number of light sources 10 can be reduced and the cost can be reduced.
  • a plurality of light sources 10 are arranged at intervals on the back of the transparent substrate 20 .
  • the light source 10 is an LED front-mount chip, and the light-emitting surface and two pins of the LED front-mount chip are all facing the transparent substrate 20.
  • a transparent ITO circuit layer 41 is provided, and the two pins of the LED front-mounted chip are welded to the ITO circuit layer 41 to realize the electrical connection between the LED front-mounted chip and the ITO circuit layer 41 .
  • the LED formal chip can be a mini LED formal chip.
  • the light source 10 can also be an LED flip chip.
  • the light-emitting surface of the LED flip chip faces the transparent substrate 20, and the LED flip chip The two pins are away from the transparent substrate 20 , and a circuit layer is arranged on the back of the transparent substrate 20 , and the pins of the LED flip chip are electrically connected to the circuit layer through wires 42 .
  • the LED flip chip can be a mini LED flip chip.
  • the transparent substrate 20 may be a glass substrate or a PET (Polyethylene terephthalate, polyethylene terephthalate) substrate.
  • Both glass and PET have high refractive index characteristics. Among them, the refractive index of glass is 1.51, and the refractive index of PET is 1.71. Therefore, the use of glass substrates and PET substrates can increase the light output at a large angle, further expand the light angle, and reduce the light emitted by the light source 10. The light is scattered, so that the backlight module can emit more uniform light with the same number of light sources 10, and can reduce the number of light sources 10 and reduce the cost when the same light output effect is achieved.
  • the high-refractive-index silica gel the refractive index of high-refractive-index silica gel is 1.51
  • the cost can be reduced by using glass substrates and PET substrates.
  • a light refraction pattern 50 is printed on the front side of the transparent substrate 20, the refractive index of the light refraction pattern 50 is greater than that of the transparent substrate 20, and the front side of the transparent substrate 20 is a transparent substrate 20 faces the side of the diffusion plate 30 , that is, the light-emitting surface of the transparent substrate 20 .
  • the light refraction pattern 50 needs to have a certain thickness and a certain refractive index.
  • the thickness of the light refraction pattern 50 is 12 ⁇ m-24 ⁇ m, and the refractive index is 1.54-1.72.
  • the light output angle can be further increased, the light mixing effect can be increased, and the brightness uniformity of the backlight module can be improved.
  • the light refraction pattern 50 can be printed on the front side of the transparent substrate 20 by using high refractive index glue.
  • the backlight module further includes an encapsulation glue 60
  • the light source 10 is packaged in the encapsulation glue 60
  • the encapsulation glue 60 is bonded on the back of the transparent substrate 20, that is, The light source 10 is encapsulated and fixed on the transparent substrate 20 through the encapsulation glue 60 .
  • the encapsulation glue 60 may be transparent silicone or epoxy resin.
  • the backlight module further includes an encapsulation shell 70, the encapsulation shell 70 is arranged on the back side of the transparent substrate 20, and the light source 10 is encapsulated in the encapsulation shell 70 A reflective layer having a reflective effect is provided on the inner wall surface of the packaging case 70 .
  • the reflective layer can reflect the incident light toward the light-emitting side of the backlight module (that is, the diffuser plate 30 ), and the reflective layer can be a reflective coating formed by coating the inner wall surface of the package shell 70 with a reflective material, or the reflective layer It may also be a reflective coating formed by coating the inner wall surface of the package case 70 with a material having a reflective effect.
  • the light source 10 is packaged in the package case 70 by providing a package case 70 with a reflective layer on the inner side wall surface on the back of the transparent substrate 20, so that the light emitted from the side of the light source 10 can be reflected by the reflective layer, increasing the utilization rate of the side light, Improve light effect.
  • the inner side wall surface of the packaging case 70 may be a plane or an arc surface, preferably an arc surface.
  • the arc surface has a better effect of collecting light emitted from the side of the light source 10 and can further improve light efficiency.
  • the embodiment of the present application also provides a direct-type backlight device.
  • the direct-type backlight device provided in the embodiment of the present application includes the backlight module in any one of the above embodiments.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Planar Illumination Modules (AREA)

Abstract

La présente invention concerne un module de rétroéclairage et un dispositif de rétroéclairage à éclairage direct. Le module de rétroéclairage comprend une pluralité de sources de lumière, un substrat transparent et une plaque de diffusion servant à diffuser la lumière émise par la pluralité de sources de lumière ; la plaque de diffusion et le substrat transparent sont disposés l'un en face de l'autre ; la pluralité de sources de lumière sont disposées sur une surface arrière du substrat transparent ; la surface arrière du substrat transparent est la surface du substrat transparent qui est à l'opposé de la plaque de diffusion. Selon la présente invention, l'épaisseur du substrat transparent peut être convertie en une partie d'une distance de mélange de lumière, de façon à contribuer à l'amincissement d'un produit.
PCT/CN2022/138427 2022-03-01 2022-12-12 Module de rétroéclairage et dispositif de rétroéclairage à éclairage direct WO2023165212A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202220441936.8 2022-03-01
CN202220441936.8U CN217061299U (zh) 2022-03-01 2022-03-01 背光模组及直下式背光装置

Publications (1)

Publication Number Publication Date
WO2023165212A1 true WO2023165212A1 (fr) 2023-09-07

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CN (1) CN217061299U (fr)
WO (1) WO2023165212A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217061299U (zh) * 2022-03-01 2022-07-26 惠州视维新技术有限公司 背光模组及直下式背光装置
CN115469481B (zh) * 2022-09-15 2024-01-09 惠科股份有限公司 背光模组及其制备方法、显示模组及电子设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200837390A (en) * 2007-03-03 2008-09-16 Au Optronics Corp Diffuser having optical structures
CN202419335U (zh) * 2011-10-28 2012-09-05 Tcl光电科技(惠州)有限公司 液晶显示器及直下式led背光模组
CN105556202A (zh) * 2013-09-10 2016-05-04 飞利浦照明控股有限公司 发光设备
CN209325530U (zh) * 2018-09-14 2019-08-30 海迪科（南通）光电科技有限公司 一种新型面板灯
CN111913320A (zh) * 2019-05-09 2020-11-10 北京易美新创科技有限公司 一种背光模组以及显示装置
CN214067532U (zh) * 2020-09-17 2021-08-27 易美芯光（北京）科技有限公司 一种直下式背光模组及显示器
CN113625489A (zh) * 2019-09-20 2021-11-09 海信视像科技股份有限公司 一种显示装置
CN217061299U (zh) * 2022-03-01 2022-07-26 惠州视维新技术有限公司 背光模组及直下式背光装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200837390A (en) * 2007-03-03 2008-09-16 Au Optronics Corp Diffuser having optical structures
CN202419335U (zh) * 2011-10-28 2012-09-05 Tcl光电科技(惠州)有限公司 液晶显示器及直下式led背光模组
CN105556202A (zh) * 2013-09-10 2016-05-04 飞利浦照明控股有限公司 发光设备
CN209325530U (zh) * 2018-09-14 2019-08-30 海迪科（南通）光电科技有限公司 一种新型面板灯
CN111913320A (zh) * 2019-05-09 2020-11-10 北京易美新创科技有限公司 一种背光模组以及显示装置
CN113625489A (zh) * 2019-09-20 2021-11-09 海信视像科技股份有限公司 一种显示装置
CN214067532U (zh) * 2020-09-17 2021-08-27 易美芯光（北京）科技有限公司 一种直下式背光模组及显示器
CN217061299U (zh) * 2022-03-01 2022-07-26 惠州视维新技术有限公司 背光模组及直下式背光装置

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