WO2022247941A1 - Dispositif d'affichage - Google Patents

Dispositif d'affichage Download PDF

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Publication number
WO2022247941A1
WO2022247941A1 PCT/CN2022/095745 CN2022095745W WO2022247941A1 WO 2022247941 A1 WO2022247941 A1 WO 2022247941A1 CN 2022095745 W CN2022095745 W CN 2022095745W WO 2022247941 A1 WO2022247941 A1 WO 2022247941A1
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WO
WIPO (PCT)
Prior art keywords
light
emitting chip
emitting
display device
angle
Prior art date
Application number
PCT/CN2022/095745
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English (en)
Chinese (zh)
Inventor
宗志豪
李富琳
张楠楠
刘晓杰
丛晓东
石磊
袁光军
张继兵
Original Assignee
海信视像科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202110590520.2A external-priority patent/CN115407547B/zh
Priority claimed from CN202110593057.7A external-priority patent/CN115407551B/zh
Priority claimed from CN202110984187.3A external-priority patent/CN115732525A/zh
Priority claimed from CN202122019685.2U external-priority patent/CN215416207U/zh
Application filed by 海信视像科技股份有限公司 filed Critical 海信视像科技股份有限公司
Publication of WO2022247941A1 publication Critical patent/WO2022247941A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present application relates to the field of display technology, and in particular to a display device.
  • liquid crystal display LCD
  • LCD liquid crystal display
  • the backlight module provides sufficient brightness and evenly distributed light source for the liquid crystal panel, so that it can display images normally.
  • commonly used backlight modules include side-type backlight modules and direct-type backlight modules.
  • direct-type backlight modules in order to ensure uniform brightness of the display screen, a certain light mixing distance needs to be set between the light source and the diffusion plate.
  • reducing the light mixing distance when the number of light sources and the distance between light sources remain unchanged will cause the position above the light source to be brighter in the backlight module, and the handover position of two adjacent light sources to be biased. It is dark, and the display effect of the display device is not uniform.
  • the display device includes: a display panel and a backlight module;
  • the backlight module includes: a backboard and a lamp board; It has a reflection effect on at least part of the incident light, which can weaken the intensity of the outgoing light at the top of the light source; and when the light reflected by the shielding part reaches the bottom of the light source, it can be reflected again, and finally exits on the side of the light source, which not only increases the light output from the side of the light source
  • the intensity of the emitted light homogenizes the light intensity everywhere in the light emitting range, and increases the light emitting angle of the light source.
  • the present application also provides a display device, the display device comprising: a display panel, used for image display; a backlight module, located on the light incident side of the display panel, for providing backlight; the backlight module includes: The bottom plate has the function of supporting and carrying; the light-emitting chip is located on one side of the bottom plate and is used to provide backlight for the display panel; the shielding part is arranged relative to the light-emitting chip, and the geometric center of the shielding part is the same as the The light-emitting axes of the light-emitting chips are coincident, and are used to block the light beams emitted by the light-emitting chips that are smaller than the set outgoing angle.
  • FIG. 1 is a schematic cross-sectional structure diagram of a display device provided by an embodiment of the present application
  • FIG. 2 is one of the partial cross-sectional structural schematic diagrams of the backlight module provided by the embodiment of the present application;
  • Fig. 3 is a schematic cross-sectional structure diagram of a light source provided in an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a light source provided in an embodiment of the present application.
  • Fig. 5 is a schematic cross-sectional view of a light source in which the shielding part is located above the packaging part according to an embodiment of the present application;
  • Fig. 6 is a schematic cross-sectional view of a light source in which the shielding part is located in the groove of the packaging part provided by the embodiment of the present application;
  • Fig. 7A is a schematic cross-sectional view of a light source including a cylindrical shielding part provided by an embodiment of the present application;
  • Fig. 7B is a schematic bottom view of a cylindrical shielding part provided by the embodiment of the present application.
  • Fig. 8A is a schematic cross-sectional view of a light source including a frustum-shaped shielding part provided by an embodiment of the present application;
  • Fig. 8B is a schematic bottom view of a frustum-shaped shielding part provided by the embodiment of the present application.
  • Fig. 9 is a schematic cross-sectional view of a light source including a hemispherical shield provided by an embodiment of the present application.
  • Fig. 10 is a schematic cross-sectional view of another light source including a cylindrical shielding part provided by the embodiment of the present application;
  • Fig. 11 is one of the cross-sectional schematic diagrams of the light source provided by the embodiment of the present application.
  • Fig. 12 is the second schematic cross-sectional structure diagram of the light source provided by the embodiment of the present application.
  • Fig. 13 is the third schematic diagram of the cross-sectional structure of the light source provided by the embodiment of the present application.
  • Fig. 14a is the fourth schematic cross-sectional structure diagram of the light source provided by the embodiment of the present application.
  • Fig. 14b is the fifth schematic diagram of the cross-sectional structure of the light source provided by the embodiment of the present application.
  • Fig. 14c is the sixth schematic diagram of the cross-sectional structure of the light source provided by the embodiment of the present application.
  • Fig. 15a is the seventh schematic diagram of the cross-sectional structure of the light source provided by the embodiment of the present application.
  • Fig. 15b is the eighth schematic diagram of the cross-sectional structure of the light source provided by the embodiment of the present application.
  • Fig. 16 is a schematic cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • Fig. 17 is a schematic cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • Fig. 18 is a schematic cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • Fig. 19 is a schematic cross-sectional structure diagram of a light-emitting chip provided by an embodiment of the present application.
  • Fig. 20 is a schematic top view of the base of the bracket provided by the embodiment of the present application.
  • Fig. 21 is a schematic cross-sectional structure diagram of the base of the bracket provided by the embodiment of the present application.
  • Fig. 22 is a schematic cross-sectional structure diagram of the bracket provided by the embodiment of the present application.
  • FIG. 23 is a schematic top view of the backlight module provided by the embodiment of the present application.
  • FIG. 24 is a flow chart of a manufacturing method of a display device provided by an embodiment of the present application.
  • Fig. 25 is a schematic diagram of a partial cross-sectional structure of a backlight module provided in some embodiments of the present application.
  • Fig. 26 is a schematic diagram of a partial cross-sectional structure of a backlight module provided in some embodiments of the present application.
  • Fig. 27 is a working principle diagram of the angle selective film provided by the embodiment of the present application.
  • a liquid crystal display device is mainly composed of a backlight module and a liquid crystal display panel.
  • the liquid crystal display panel itself does not emit light, and needs to rely on the light source provided by the backlight module to achieve brightness display.
  • the imaging principle of the liquid crystal display device is to place the liquid crystal between two pieces of conductive glass, driven by the electric field between the two electrodes, to cause the electric field effect of twisting the liquid crystal molecules, so as to control the transmission or shielding function of the backlight, so as to display the image come out. If color filters are added, color images can be displayed.
  • FIG. 1 is a schematic cross-sectional structure diagram of a display device provided by an embodiment of the present application.
  • the display device includes: a backlight module 100 and a display panel 200 .
  • the display panel 200 is located on the light-emitting side of the backlight module 100.
  • the shape and size of the display panel usually match the backlight module.
  • the display panel 200 can be set as a rectangle, including the sky side, the ground side, the left side and the right side.
  • the sky side is opposite to the ground side
  • the left side is opposite to the right side
  • the sky side is connected to one end on the left side and one side on the right side respectively
  • the ground side is connected to the other end on the left side and the other end on the right side respectively.
  • the display panel 200 is a transmissive display panel, which can modulate the transmittance of light, but does not emit light itself.
  • the display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the light transmittance and color of the backlight module 100 incident on the pixel unit, so that the light transmitted by all the pixel units constitutes displayed image.
  • the backlight module 100 is generally located at the bottom of the display device, and its shape and size are adapted to the shape and size of the display device. When applied to fields such as televisions or mobile terminals, the backlight module usually adopts a rectangular shape.
  • FIG. 2 is one of the partial cross-sectional structural schematic diagrams of the backlight module provided by the embodiment of the present application.
  • the backlight module includes: a back panel 11 , a lamp panel 12 , a diffuser plate 13 , an optical film 14 and a diffuser plate bracket 15 .
  • the back plate 11 is located at the bottom of the backlight module and has the function of supporting and carrying.
  • the backplane 11 is generally a rectangular structure, and when applied to a display device with a special shape, its shape is adapted to the shape of the display device.
  • the backplane 11 includes a sky side, a ground side, a left side and a right side.
  • the sky side is opposite to the ground side
  • the left side is opposite to the right side
  • the sky side is connected to one end on the left side and one side on the right side respectively
  • the ground side is connected to the other end on the left side and the other end on the right side respectively.
  • the material of the back plate 11 is aluminum, iron, aluminum alloy or iron alloy.
  • the backboard 11 is used to support the lamp board 12 and to support and fix the edge positions of components such as the diffuser plate 13 and the optical film 14 .
  • the backlight module is a direct type backlight module
  • the lamp panel 12 is located on the backplane 11 .
  • the overall shape of the lamp panel 12 can be square or rectangular.
  • its shape and size are adapted to the shape and size of the display device.
  • a plurality of lamp panels 12 may be provided, and the lamp panels 12 jointly provide a backlight by splicing.
  • the seams between the adjacent lamp panels 12 should be as small as possible, and even seamless splicing can be realized.
  • the lamp board 12 specifically includes: a circuit board 121 , a light source 122 and a reflective layer 123 .
  • the circuit board 121 includes a substrate 1211 and a circuit layer 1212 ; the substrate 1211 is located on the backplane 11 , and the shape of the substrate 1211 is the same as the overall shape of the light board 12 . Under normal circumstances, the substrate 1211 is plate-shaped and generally rectangular or square.
  • the material used for the substrate 1211 can be glass with a high thermal conductivity, and the substrate 1211 is made of glass with a high thermal conductivity, so that the heat emitted by the display device can be dissipated quickly when displaying. The problem of reducing luminous efficiency caused by excessive temperature is avoided.
  • the surface of the glass substrate is smooth and flat, which is beneficial to later processing and production.
  • the material used for the substrate 1211 may be made of materials such as FR4 or PET, which is not limited here.
  • the circuit layer 1212 provided in the embodiment of the present application is deposited on the substrate 1211 by electroplating with a conductive material, and formed by etching the circuit as required.
  • the conductive material can be copper, which is not limited here.
  • a fracture is etched out of the conductive material, and the two sides of the fracture are respectively connected to the positive pole and the negative pole of the light source 122 .
  • the substrate 1211 and the circuit layer 1212 can form a circuit board, and the circuit board can be a printed circuit board (PCB for short); or, when the circuit layer 1212 adopts a thin film
  • the substrate 1211 and the circuit layer 1212 may also constitute an array substrate, which is not limited here.
  • the light source 122 is located on the circuit layer 1212. After the circuit layer 1212 is fabricated, a pad for welding the light source 122 will be formed on its surface. The light source 122 is soldered on the pad, so that the light source 122 is driven by controlling the driving signal of the circuit layer 1212. glow.
  • the light emitting surface of the light source 122 facing away from the back plate 11 is provided with a shielding portion 1223, the shielding portion 1223 has a reflection effect on at least part of the incident light, and can weaken the intensity of the outgoing light at the top of the light source 122; and is When the light reflected by the shielding part 1223 reaches the bottom of the light source 122, it can be reflected again, and finally emerges on the side of the light source 122, which not only increases the intensity of the light emitted from the side of the light source 122, but also homogenizes the light intensity everywhere in the light emitting range. The light emitting angle of the light source 122 is also increased.
  • the problems of brightening above the light source 122 and darkening at the junction of two adjacent light sources 122 can be avoided.
  • the light mixing distance can be appropriately reduced, so the development demand for thinner display devices can be met without increasing the production cost; in addition, the light mixing distance can also be changed without changing the light mixing distance , reduce the number of light sources 122 used, and reduce costs.
  • the reflective layer 123 is located on the side of the circuit board 121 close to the light source 122.
  • the shape and size of the reflective layer 123 are consistent with the shape and size of the circuit board 121.
  • the reflective layer 123 includes a plurality of openings for exposing the light source 122, and has the property of reflecting light .
  • the reflective layer 123 is coated on the surface of the circuit board 121 on the side away from the back plate 11 with a reflective material.
  • the material can be a white ink that reflects light, and the reflection of the white ink The rate is greater than or equal to 85%, which is not limited here.
  • the reflective layer 123 can also be a reflective sheet, which is made by coating the surface of the substrate with colloid mixed with reflective particles, and the reflective rate of the reflective sheet is greater than or equal to 97%.
  • the reflective layer 123 provided in the embodiment of the present application may be a diffuse reflective layer, and the diffuse reflective layer may randomize the reflection path of the reflected light and play a role in homogenizing the light.
  • the diffuser plate 13 is located on the light emitting side of the light source 122 , and the shape of the diffuser plate 13 is the same as the overall shape of the lamp plate 12 .
  • the diffuser plate 13 can be set as a rectangle or a square.
  • the function of the diffusion plate 13 is to scatter the incident light so as to make the light passing through the diffusion plate 13 more uniform.
  • Scattering particle materials are arranged in the diffusion plate 13 , and light incident on the scattering particle materials will continuously undergo refraction and reflection, so as to achieve the effect of scattering the light and realizing the effect of light uniformity.
  • the diffuser plate 13 has higher haze and more uniform effect, and can usually be processed by extrusion process.
  • the material used for the diffuser plate 13 is generally selected from polymethyl methacrylate PMMA, polycarbonate PC, polystyrene-based material PS, At least one of polypropylene PP.
  • a quantum dot material can also be arranged in the diffusion plate 13 to form a quantum dot diffusion plate.
  • the quantum dot material includes a red quantum dot material and a green quantum dot material, and the red quantum dot material is Under the excitation of blue light, the red light with a wavelength of about 620nm-640nm is emitted; the green quantum dot material emits green light with a wavelength of about 520nm-540nm under the excitation of blue light, and the red light, green light and transmitted blue light are stimulated to emit The colored light is mixed into white light.
  • the quantum dot film is no longer installed, which not only reduces the cost, but also makes the display device lighter and thinner.
  • the optical film 14 is located on the side of the diffusion plate 13 facing away from the lamp panel 12 .
  • the optical film 14 is arranged in a whole layer, and its shape is the same as the overall shape of the diffusion plate 13 . Usually, it can be set as a rectangle or a square.
  • the arrangement of the optical film 14 can make the backlight module adapt to various practical applications.
  • the light source 122 may be a blue light device, and the optical film 14 includes a quantum dot layer or a fluorescent layer.
  • the quantum dot layer includes red quantum dot material and green quantum dot material, the red quantum dot material emits red light under the excitation of blue light, the green quantum dot material emits green light under the excitation of blue light, and the red light emitted by stimulation, Green light and transmitted blue light are mixed to produce white light.
  • the fluorescent layer includes fluorescent materials that are stimulated to emit red light and stimulated to emit green light, and the stimulated emitted red light, green light and transmitted blue light are mixed to form white light that is emitted.
  • the optical film 14 may also include a prism sheet, which can change the outgoing angle of the light, thereby changing the viewable angle of the display device.
  • the optical film 14 may also include a reflective polarizer.
  • the reflective polarizer can increase the brightness of the backlight module, improve the utilization efficiency of light, and at the same time make the outgoing light have the property of polarization, omitting the need for a liquid crystal display panel. Use of polarizers.
  • a diffuser plate bracket 15 is arranged between the diffuser plates 13 for supporting the diffuser plate 13 .
  • the diffuser plate bracket 15 is generally made of polycarbonate PC.
  • the shape of the diffusion plate support 15 may be a simple triangle, trapezoid, cone, etc., which is not limited here.
  • Fig. 3 is a schematic cross-sectional structure diagram of a light source provided by some embodiments of the present application.
  • the light source 122 specifically includes: a light emitting chip 1221 , a packaging part 1222 and a shielding part 1223 .
  • the light emitting chip 1221 is located on a side of the circuit board 121 away from the backplane 11 .
  • the light emitting chip 1221 specifically refers to a micro light emitting diode chip. Since the size of the miniature LED chip is very small, it is beneficial to control the dynamic light emission of the backlight module to a smaller partition, and it is beneficial to improve the contrast of the picture.
  • the size of the micro LED chip is less than 500 ⁇ m.
  • Micro light emitting diodes can be manufactured in corresponding sizes according to actual applications, which is not limited here.
  • the miniature light emitting diode chip is a mini LED (Mini Light Emitting Diode, Mini LED for short) chip.
  • the light-emitting chip 1221 used in the embodiment of the present application may be a light-emitting chip of one color, or may be a light-emitting chip of multiple colors, which is not limited herein.
  • the encapsulation part 1222 is located on the surface of the light emitting chip 1221 , and is used for encapsulating and protecting the light emitting chip 1221 , and preventing foreign matter from entering into the light emitting chip 1221 .
  • the package part 1222 is a package holder; specifically, the light-emitting chip 1221 is packaged in a POB package, and a package holder is provided outside the light-emitting chip 1221 .
  • the light-emitting chip 1221 when the light-emitting chip 1221 is packaged by POB packaging, patch electrodes will be formed on its lower surface at the same time, and the patch electrodes are electrically connected to the electrodes of the light-emitting chip 1221.
  • the packaged light-emitting chip 1221 is attached to the corresponding position of the circuit layer 1212 .
  • the POB packaging method has mature technology and good adaptability.
  • the encapsulation part 1222 is an encapsulation glue; specifically, when the light-emitting chip 1221 is packaged by COB encapsulation, the light-emitting chip 1221 is first soldered to the pad corresponding to the circuit layer 1212, and then the light-emitting The surface of the chip 1221 is encapsulated by dispensing glue.
  • the encapsulation glue on the surface of the light-emitting chip 1221 can be made of transparent colloidal materials, such as silica gel, modified silica gel or epoxy resin with better permeability.
  • the shielding portion 1223 is located on a side of the packaging portion 1222 away from the circuit board 121 .
  • the shielding part 1223 is a diffusion layer, and the diffusion layer is provided with scattering particle materials, and the light incident on the scattering particle materials will continuously refract and reflect, so as to achieve the effect of breaking up the light, which can Avoid the problem of partial brightness above the light source 122; in addition, the light reflected back to the bottom of the light source 122 by the scattering particle material can be reflected again, and finally emerges at the side of the light source 122, which not only increases the intensity of the light emitted from the side of the light source 122, but also The light intensity of each place in the light emitting range is reduced, and the light emitting angle of the light source 122 is increased.
  • the problems of brightening above the light source 122 and darkening at the junction of two adjacent light sources 122 can be avoided.
  • the light mixing distance can be appropriately reduced, so the development demand for thinner display devices can be met without increasing the production cost; in addition, the light mixing distance can also be changed without changing the light mixing distance , reduce the number of light sources 122 used, and reduce costs.
  • the shielding part 1223 includes a matrix and reflective particles, and the reflective particles reflect incident light.
  • the reflective particles reflect incident light.
  • part of the incident light will enter the reflective particles and be reflected.
  • Particle reflection thereby weakening the intensity of the outgoing light at the top of the light source 122; Intensity, homogenizes the light intensity everywhere in the light emitting range, and increases the light emitting angle of the light source 122. In this way, the problems of brightening above the light source 122 and darkening at the junction of two adjacent light sources 122 can be avoided.
  • the light mixing distance can be appropriately reduced, so the development demand for thinner display devices can be met without increasing the production cost; in addition, the light mixing distance can also be changed without changing the light mixing distance , reduce the number of light sources 122 used, and reduce costs.
  • the reflective particles provided in the embodiment of the present application may be titanium dioxide.
  • the H/P value (the distance from the upper surface of the lamp panel 12 to the lower surface of the diffuser plate 13, that is, the light mixing distance/the distance between two adjacent light sources 122) is usually used to measure the cost of the backlight module (the number of light sources 122) and thickness relationship.
  • the H/P value in the industry is generally above 0.6, and the smaller the H/P value, the thinner the thickness of the module, or the fewer the number of 122 light sources used.
  • the content of titanium dioxide provided by the embodiment of the present application is 30%, the H/P value can be reduced from above 0.6 to about 0.5, which can meet the development needs of thinning display devices without increasing the production cost (without changing the number of light sources 122). .
  • FIG. 4 it exemplarily shows a schematic cross-sectional view of a light source.
  • the light source shown in FIG. 4 includes a bottom plate 301 , an electrode 302 , a gold wire 303 , a light emitting chip 304 , a packaging part 305 , and a shielding part 306 .
  • the electrodes 302 are disposed in the bottom plate 301 and are used to supply power to the light emitting chip 304 .
  • the gold wire 303 connects the electrode and the light-emitting chip, and has the function of conducting electricity. It should be noted that the light source shown in FIG. 4 is only an example.
  • the shielding part that shields the direct light of the light-emitting chip is located directly above the packaging part, the position of the shielding part is shown in FIG. 4 . Therefore, most of the light emitted by the light-emitting chip may be blocked, and the light is only emitted from the side, the light angle is small, the light utilization rate is reduced, and the light efficiency is lost. In order to improve light utilization efficiency, the light output angle can be increased.
  • a feasible way to increase the light output angle is to reduce the size of the package.
  • the shading part is located above the packaging part, and the size of the shading part is reduced while reducing the size of the packaging part, so as to increase the angle of light output.
  • this solution needs to reduce the processing size, it increases the difficulty of processing.
  • reducing the size of the package part may also lead to the problem of overflow of tin used for soldering. Tin overflow will affect the reflection of light and reduce the yield of production.
  • An embodiment of the present application provides a display device.
  • different types of shielding parts are used to replace the existing shielding parts, so as to reduce the angle of the light emitted by the light-emitting chips that are shielded, and improve the intensity of the light. utilization rate.
  • the present application does not need to reduce the size of the packaging part, but can increase the light output angle, avoid the problem of tin overflow, and improve the yield rate of production.
  • the size of the packaging part can also be increased to facilitate processing.
  • the shading part proposed in the embodiment of the present application is set relative to the light-emitting chip, and the geometric center of the shading part coincides with the light-emitting axis of the light-emitting chip, and is used to block the light beam emitted by the light-emitting chip with an emission angle smaller than a set emission angle.
  • the set emission angle may be set according to the light emission angle of the light emitting chip.
  • the thickness of the liquid crystal display device is reduced, the light mixing distance of the backlight module used to provide the light source in the display device will be reduced. If the light mixing distance becomes smaller, the light emitted from the light-emitting chip will not be sufficiently mixed, resulting in uneven brightness.
  • There are two known methods to ensure sufficient light mixing one is to have a long enough light mixing distance, and the other is to have enough light.
  • the specific angle of the mini LED can be 160°.
  • the light emitting angle of the mini LED is 160°, it can ensure that the thickness of the display device meets the requirements and at the same time, the cost is low.
  • the light-emitting angle of the light emitting chip can be understood as the scattering angle of the light emitted by the light emitting chip, and the light distribution curve of the light emitting chip is used to represent the light intensity distribution of the light emitted by the light emitting chip in space. It can be understood that the light distribution curve of the light-emitting chip includes the corresponding relationship between the light-emitting angle and the emission angle of the light-emitting chip.
  • the backlight module in the display device proposed by the present application further includes an encapsulation part, and the encapsulation part is located between the light-emitting chip and the shielding part for protecting the light-emitting chip.
  • the shielding part can be located on the packaging part, or the side of the packaging part facing away from the light-emitting chip has a groove, and the shielding part can be located in the groove.
  • the surface of the shielding portion near the light-emitting chip is circular.
  • titanium dioxide (TiO 2 ) may be used as a material of the shielding portion.
  • the shielding part when the shielding part is located above the encapsulation part, the shielding part shields the light beam emitted by the light-emitting chip that is smaller than the set exit angle, wherein the set exit angle can satisfy the following formulas (1)-(2) relation:
  • ⁇ is the set emission angle
  • k is the radius of the surface circle of the side of the shielding part close to the light-emitting chip
  • d is the distance from the side of the shielding part close to the light-emitting chip to the light-emitting chip
  • L is any point on the side of the shielding part to The distance of the light axis.
  • FIG. 5 shows a schematic cross-sectional view of the light source when the shielding part is located above the packaging part.
  • the schematic cross-sectional view of the light source shown in FIG. 5 it includes a shielding part 401, a packaging part 402, a light emitting chip 403, a bottom plate 404, an electrode 405 for supplying power to the light emitting chip, and a connecting wire 406 for connecting the electrode and the light emitting chip.
  • Figure 5 is only an example, and the present application does not specifically limit the specific shape of the shielding part, it only needs to meet the requirement that the surface of the shielding part close to the light-emitting chip is circular and satisfy the formulas (1) and (2) conditions.
  • the shielding part may be a cylinder, a cone, a frustum of a cone, a hemisphere or other irregular shapes.
  • the shielding component is taken as an example of a circular frustum for introduction.
  • the shading part when the shading part is located in the groove on the side of the packaging part away from the light-emitting chip, the shading part can block the light beam emitted by the light-emitting chip that is smaller than the set outgoing angle, where the set outgoing angle can satisfy the following formula ( The relationship shown in 3)-(4):
  • ⁇ is the set outgoing angle
  • k is the radius of the surface circle on the side of the shielding part away from the light-emitting chip
  • d is the distance from the side of the shielding part away from the light-emitting chip to the light-emitting chip
  • L is any point on the side of the shielding part to
  • p is the distance from any point to the plane on the side of the light-emitting chip that is close to the shielding portion.
  • FIG. 6 shows a schematic cross-sectional view of the light source when the shielding part is located in the groove of the packaging part.
  • the schematic cross-sectional view of the light source shown in FIG. 6 includes a shielding part 501, a packaging part 502, a light-emitting chip 503, a bottom plate 504, electrodes 505 for supplying power to the light-emitting chip, and connecting wires 506 for connecting the electrodes and the light-emitting chip.
  • Figure 6 is only an example, and the present application does not specifically limit the specific shape of the shielding part, it only needs to meet the requirement that the surface of the shielding part close to the light-emitting chip is circular and satisfy the formulas (3) and (4) conditions.
  • the shielding part is a cylinder, a truncated cone, a cone, or a hemisphere. It should be noted that the hemisphere involved in this application may not be a hemisphere in the standard sense, and the radius of the section of the hemisphere involved in this application is greater than or equal to the distance from the apex of the hemisphere to the section.
  • the shielding part is a cylinder and is located in the groove on the side of the packaging part away from the light-emitting chip.
  • FIG. 7A shows a schematic cross-sectional view of the light source provided by the embodiment of the present application when the shielding part is a cylinder and is located in the groove of the packaging part.
  • the shielding part includes a shielding part 601, a packaging part 602, a light emitting chip 603, a bottom plate 604, an electrode 605 for supplying power to the light emitting chip, and a connecting wire 606 for connecting the electrode and the light emitting chip.
  • connection wire 606 is a connection wire made of conductive material, for example, a gold wire may be used.
  • the shielding part 601 is used for shielding the light beam emitted by the light-emitting chip that is smaller than the set outgoing angle.
  • FIG. 7B shows a top view of a shielding part in this embodiment.
  • the relationship between setting the outgoing angle, the radius of the bottom circle of the cylindrical shielding part, and the distance from the side of the cylindrical shielding part close to the light-emitting chip to the light-emitting chip can satisfy the relationship shown in formula (5):
  • ⁇ is the set outgoing angle
  • k is the radius of the bottom circle of the cylindrical shielding part
  • d is the distance from the side of the cylindrical shielding part close to the light-emitting chip to the light-emitting chip.
  • the set emission angle ⁇ may be determined according to the light emitting angle of the light emitting chip.
  • the light-emitting angle of the light-emitting chip is a specific angle
  • the purpose of ensuring that the display screen is sufficiently thin and that the cost is low can be achieved.
  • the specific angle of the mini LED can be 160°.
  • the light emitting angle of the mini LED is 160°, it can ensure that the thickness of the display device meets the requirements and at the same time, the cost is low.
  • the thickness of the cylindrical shielding portion is 0.1 mm.
  • the thickness of the cylindrical shielding portion may also take other values, which are not specifically limited in this embodiment of the present application.
  • the shielding portion is a circular truncated portion, and is located in a groove on a side of the packaging portion away from the light-emitting chip.
  • FIG. 8A shows a schematic cross-sectional view of a light source provided by an embodiment of the present application when the shielding portion is a truncated cone and is located in a groove.
  • the cross-sectional view of the light source shown in FIG. 8A it includes a shielding part 701, a packaging part 702, a light emitting chip 703, a bottom plate 704, an electrode 705 for supplying power to the light emitting chip, and a connecting wire 706 for connecting the electrode and the light emitting chip.
  • connection wire 706 is a connection wire made of conductive material, for example, a gold wire may be used.
  • the shielding part 701 is used for shielding the light beam emitted by the light-emitting chip that is smaller than the set outgoing angle. It should be noted that FIG. 8A is only an example, and the present application does not specifically limit whether the area of the surface circle on the side of the frustum-shaped shielding portion close to the light-emitting chip is larger than the area of the surface circle on the side of the frustum-shaped shielding portion away from the light-emitting chip. . In FIG.
  • the area of the surface circle of the frustum-shaped shielding portion close to the light-emitting chip is smaller than the area of the surface circle of the frustum-shaped shielding portion away from the light-emitting chip as an example.
  • FIG. 8B shows a schematic bottom view of a frustum-shaped shielding part in this embodiment.
  • setting the outgoing angle can satisfy the relationship shown in the following formulas (6)-(7):
  • ⁇ is the set emission angle
  • a is the radius of the surface circle on the side of the circular platform away from the light-emitting chip
  • b is the distance from the side of the circular platform away from the light-emitting chip to the light-emitting chip
  • c is the surface circle on the side of the circular platform close to the light-emitting chip
  • the radius of , e is the distance from the side of the circular table close to the light-emitting chip to the plane on the side of the light-emitting chip close to the shielding part.
  • the output angle ⁇ can be determined first, and the value range of ⁇ can be [25°, 30°].
  • the distance from the side of the frustum-shaped shielding part away from the light-emitting chip to the light-emitting chip and the radius of the surface circle of the side of the frustum-shaped shielding part away from the light-emitting chip can be determined according to the relationship shown in formulas (6)-(7). The corresponding relationship, and determine the radius of the surface circle of the frustum-shaped shielding portion close to the light-emitting chip, and then determine the structure of the light source.
  • the thickness of the truncated-conical shielding portion may be 0.1 mm.
  • the thickness of the truncated-conical shielding portion may also be other values, which are not specifically limited in this embodiment of the present application.
  • the shielding portion has a hemispherical shape and is located in a groove on a side of the packaging portion away from the light-emitting chip.
  • FIG. 9 shows a schematic cross-sectional view of a light source provided by an embodiment of the present application when the shielding portion is hemispherical and located in a groove on one side of the light-emitting chip.
  • the light source shown in FIG. 9 it includes a shielding part 801, a packaging part 802, a light emitting chip 803, a bottom plate 804, an electrode 805 for supplying power to the light emitting chip, and a connecting wire 806 for connecting the electrode and the light emitting chip.
  • connection wire 806 is a connection wire with electrical conductivity, for example, a gold wire may be used as the connection wire.
  • the shielding part 801 is used for shielding the light beams emitted by the light-emitting chip that are smaller than the set outgoing angle. It should be noted that FIG. 9 is only an example. In an actual light source, whether the side of the hemispherical shielding part close to the light-emitting chip is used as the hemispherical section or the side of the hemispherical shielding part away from the light-emitting chip is used as the hemisphere The cross section is not limited. In FIG.
  • the side of the hemispherical shielding portion facing away from the light-emitting chip is taken as a cross-section of the hemisphere as an example for illustration. It should be noted that the radius of the section of the hemisphere involved in this embodiment may be greater than the distance from the apex of the hemisphere to the section, or equal to the distance from the apex of the hemisphere to the section.
  • setting the outgoing angle may satisfy the relationship shown in the following formula (8):
  • ⁇ is the set emission angle
  • k is the radius of the surface circle of the hemispherical shielding part facing away from the light-emitting chip
  • d is the distance from the side of the hemispherical shielding part away from the light-emitting chip to the light-emitting chip.
  • the thickness of the hemispherical shielding part is 0.1 mm, that is, the distance from the cross section of the hemisphere to the apex of the hemisphere can be 0.1 mm.
  • the thickness of the hemispherical shielding part can also take other values , which is not specifically limited in this embodiment of the present application.
  • the shielding part is a cylinder and is located on the packaging part.
  • FIG. 10 shows a schematic cross-sectional view of the light source provided by the embodiment of the present application when the shielding component is a cylinder and is located on the packaging part.
  • the schematic cross-sectional view of the light source shown in FIG. 10 it includes a shielding part 901, a packaging part 902, a light-emitting chip 903, a bottom plate 904, an electrode 905 for supplying power to the light-emitting chip, and a connecting wire for connecting the electrode 905 and the light-emitting chip 903. 906.
  • connection wire 906 is a connection wire with electrical conductivity, for example, a gold wire may be used as the connection wire.
  • the shielding part 901 is used for shielding the light beam emitted by the light-emitting chip which is smaller than the set angle.
  • the relationship between setting the outgoing angle, the distance from the side of the cylindrical shielding part close to the light-emitting chip to the light-emitting chip, and the radius of the bottom circle of the cylindrical shielding part can satisfy the relationship shown in formula (9):
  • ⁇ is the set outgoing angle
  • k is the radius of the bottom circle of the cylindrical shielding part
  • d is the distance from the side of the cylindrical shielding part close to the light-emitting chip to the light-emitting chip.
  • the thickness of the cylindrical shielding part is 0.1 mm.
  • the thickness of the cylindrical shielding part may also take other values, which are not specifically limited in this embodiment of the present application.
  • the different forms of the shielding part can be used for the light source of POB package and also can be used for the light source of COB package.
  • FIG. 11 is a schematic cross-sectional structure diagram of a light source provided by an embodiment of the present application.
  • the light source 13-1 includes: a shielding part 131-1, a light emitting chip 132-1 and a packaging part 133-1.
  • the shielding part 131-1 is located on the light emitting side of the light source 13-1, and the shielding part 131-1 has a reflection effect on at least part of the incident light, which can weaken the intensity of the outgoing light at the top of the light source 13-1; and the light reflected by the shielding part 131-1 When it reaches the bottom of the light source 13-1, it can be reflected again, and finally emits on the side of the light source 13-1, which not only increases the intensity of the light emitted from the side of the light source 13-1, but also homogenizes the light intensity of all places in the light output range. The light emitting angle of the light source 13-1 is also increased.
  • the problems of the upper part of the light source 13 - 1 being brighter and the handover position of two adjacent light sources 13 - 1 being darker can be avoided.
  • the light mixing distance can be appropriately reduced, so the development demand for thinner display devices can be met without increasing the production cost; in addition, the light mixing distance can also be not changed.
  • the number of light sources 13-1 used and reducing the cost can be reduced.
  • the orthographic projection of the shielding part 131-1 on the backplane 11 and the orthographic projection of the light-emitting chip 132-1 on the backplane 11 have overlapping areas, thereby ensuring that the light emitted by the light-emitting chip 132-1
  • the shielding part 131-1 When the light is incident on the overlapping area above the light-emitting chip 132-1, it can be reflected by the shielding part 131-1, weakening the intensity of the outgoing light at the top of the light source 13-1, and the light reflected by the shielding part 131-1 reaches the light source 13-1. 1, it can be reflected again, and finally emitted at the side of the light source 13-1, thereby avoiding the problem that the top of the light source 13-1 is brighter and the junction of two adjacent light sources 13-1 is darker.
  • the shielding part 131-1 has a centrally symmetrical structure, and the light emitted by the light source 13-1 after being shielded by the shielding part 131-1 is also symmetrical to each other, so that the light emitted by the display device is more uniform, and the display effect of the display device is improved. .
  • the light emitting chip 132-1 is located on the circuit layer 122-1, and the light emitting chip 132-1 can be an LED chip, a mini LED chip or an RGB chip.
  • the miniature light-emitting diode chip includes but is not limited to a Mini LED chip (Mini-Light Emitting Diode, Mini LED for short), which is different from an ordinary light-emitting diode.
  • the light-emitting chip 132-1 specifically refers to a miniature light-emitting diode chip with a size smaller than 500 ⁇ m.
  • the light-emitting chip 132-1 Since the size of the light-emitting chip 132-1 is very small, the light-emitting chip 132-1 is beneficial to control the dynamic light emission to a smaller partition, and is beneficial to improve the contrast of the picture.
  • the light-emitting chips 132-1 are arranged in an array, which is beneficial to design the spacing of the light-emitting chips according to the light emission requirements of the backlight module.
  • the existence of the shielding part 131-1 can appropriately reduce the light mixing distance. When it is applied to an ultra-thin display device, the light mixing distance needs to be further reduced. Due to the limitation of the light emission angle of the light-emitting chip 132-1, when the light mixing distance is further reduced, the light mixing distance still needs to be reduced. There will be problems that the top of the light source 13-1 is brighter and the handover position of two adjacent light sources 13-1 is darker.
  • the light source 13-1 provided by the embodiment of the present application further includes two reflective layers 134-1, and the two reflective layers 134-1 are respectively located on the light-emitting side and the side away from the light-emitting side of the light-emitting chip 132-1.
  • the two reflective layers 134-1 On the surface, the two reflective layers 134-1 have the property of reflecting light. When the light emitted by the light-emitting chip 132-1 reaches the reflective layer on the light-emitting side, part of the light is transmitted and most of the light is reflected.
  • the light emitting angle of 132-1 reduces the brightness at the center of the light-emitting chip 132-1, improves the light mixing effect of two adjacent light sources 13-1, and avoids the obvious light shadow due to the reduction of the light mixing distance
  • the phenomenon improves the display effect of the display device.
  • the existence of the reflective layer 134-1 can also avoid the black ring phenomenon that may occur after the shielding portion 131-1 is provided, further improving the display effect of the display device.
  • the two reflective layers 134-1 include: a first reflective layer 134-11 and a second reflective layer 134-12.
  • the first reflective layer 134-11 is located on the surface of the light emitting chip 132-1 close to the circuit layer 122-1
  • the second reflective layer 134-12 is located on the surface of the light emitting chip 132-1 away from the circuit layer 122-1.
  • the reflectivity of the first reflective layer 134-11 is greater than the reflectivity of the second reflective layer 134-12, and the reflectivity of the first reflective layer 134-11 is greater than or equal to 90%, thus ensuring Most of the light incident on the first reflective layer 134-11 is reflected, and part of the light incident on the second reflective layer 134-12 is transmitted, and most of the light is reflected, thereby preventing the central position of the light-emitting chip 132-1 from The brightness is too dim.
  • the two reflective layers 134-1 are Bragg reflective layers.
  • Both the first reflective layer 134-11 and the second reflective layer 134-12 are formed by alternately stacking the first dielectric layer and the second dielectric layer with two different refractive indices.
  • the materials of the first dielectric layer and the second dielectric layer can be determined according to It depends on the different requirements of different display devices, as long as the reflectivity of the first reflective layer 134-11 is greater than the reflectivity of the second reflective layer 134-12, and the reflectivity of the first reflective layer 134-11 is greater than or equal to 90%. Yes, there is no limitation here.
  • the first reflective layer 134-11 and the second reflective layer 134-12 provided in the embodiment of the present application can set the number of the first medium layer and the second medium layer according to different requirements of different display devices, which is not limited here.
  • the encapsulation part 133-1 is arranged around the light emitting chip 132-1, and is used for encapsulating and protecting the light emitting chip 132-1, and preventing foreign objects from entering into the light source 13-1.
  • the package part 133-1 can be a package bracket; specifically, the light-emitting chip 132-1 is packaged in a POB package, and a package is provided outside the light-emitting chip 132-1.
  • the bracket, the packaging bracket is used to package and protect the light-emitting chip 132-1, and prevent foreign matter from entering the inside of the light-emitting chip 132-1.
  • patch electrodes will be formed on its lower surface at the same time, and the patch electrodes are electrically connected to the electrodes of the light-emitting chip 132-1. Then the packaged light-emitting chip 132-1 is pasted on the corresponding pad of the circuit board.
  • the POB packaging method has mature technology and good adaptability.
  • the shielding part 131 - 1 may be disposed on the package holder. In this way, the design can be simplified, and it only needs to attach the shielding part to the surface of the packaging bracket.
  • a groove is provided on the light-emitting surface of the package holder, and the groove is used for placing the shielding part 131 - 1 , and the shielding part 131 - 1 is placed in the groove.
  • the use of grooves to set the shielding portion 131 - 1 is more securely fixed, the surface of the light source can be made into a planar structure, and the service life of the display device is increased.
  • the shielding part 131-1 is a diffusion layer, and the diffusion plate is provided with scattering particle materials, and the light incident on the scattering particle materials will continuously refract and reflect, so as to achieve the effect of breaking up the light, which can Avoid the problem of partial brightness above the light source 13-1; in addition, the light reflected by the scattering particle material back to the bottom of the light source 13-1 can be reflected again, and finally exits at the side of the light source 13-1, which not only increases the light source 13-1 1.
  • the intensity of the light emitted from the side which homogenizes the light intensity of all places in the light emitting range, and increases the light emitting angle of the light source 13-1.
  • the problems of the upper part of the light source 13 - 1 being brighter and the handover position of two adjacent light sources 13 - 1 being darker can be avoided.
  • the light mixing distance can be appropriately reduced, so the development demand for thinner display devices can be met without increasing the production cost; in addition, the light mixing distance can also be not changed.
  • the number of light sources 13-1 used is reduced and the cost is reduced.
  • the shielding portion 131-1 may also be a reflective layer, the reflective layer includes a matrix and reflective particles, and the reflective particles reflect incident light.
  • the reflective layer includes a matrix and reflective particles
  • the reflective particles reflect incident light.
  • the problem of brightening above the light source 13-1 and darkening at the handover position of two adjacent light sources 13-1 can be avoided.
  • the light mixing distance can be appropriately reduced, so the development demand for thinner display devices can be met without increasing the production cost; in addition, the light mixing distance can also be not changed.
  • the number of light sources 13-1 used is reduced and the cost is reduced.
  • the material of the shielding part may be made of materials having reflection and/or scattering properties such as titanium dioxide or titanium dioxide, which is not limited herein.
  • Fig. 14a is the fourth schematic cross-sectional structure diagram of the light source provided by the embodiment of the present application.
  • Fig. 14b is the fifth schematic diagram of the cross-sectional structure of the light source provided by the embodiment of the present application.
  • Fig. 14c is the sixth schematic diagram of the cross-sectional structure of the light source provided by the embodiment of the present application.
  • the packaging part 133-1 can also be a packaging glue; specifically, the COB packaging method is used to package the light-emitting chip 132-1, and the light-emitting chip 132-1 is first welded to the circuit On the pad corresponding to the layer 122-1, the light-emitting chip 132-1 is packaged by dispensing glue on the surface of the light-emitting chip 132-1.
  • the packaging glue on the surface of the light-emitting chip 132-1 can be a transparent colloid material, such as through Better silicone, modified silicone or epoxy resin, etc. COB packaging has higher efficiency and lower cost.
  • the shielding part 131-1 is made of a material that reflects light, such as white ink.
  • white ink When light enters the shielding part 131-1, part of the incident light will enter the white ink and be reflected by the white ink. , thereby weakening the intensity of the outgoing light at the top of the light source 13-1; and when the light reflected by the white ink reaches the bottom of the light source 13-1, it can be reflected again, and finally emerges at the side of the light source 13-1, which not only increases the light source
  • the intensity of the light emitted from the side of 13-1 homogenizes the light intensity of all places in the light emitting range, and increases the light emitting angle of the light source 13-1.
  • the problems of the upper part of the light source 13 - 1 being brighter and the handover position of two adjacent light sources 13 - 1 being darker can be avoided.
  • the light mixing distance can be appropriately reduced, so the development demand for thinner display devices can be met without increasing the production cost; in addition, the light mixing distance can also be not changed.
  • the number of light sources 13-1 used is reduced and the cost is reduced.
  • the white ink provided by the embodiment of the present application is located inside the encapsulation glue 133-1.
  • the encapsulation glue is dotted on the surface of the light-emitting chip 132-1
  • white ink is dotted on the surface of the encapsulation glue before the encapsulation glue is solidified. Since both the encapsulation glue and the white ink have fluidity, the white ink will flow into the interior of the encapsulation glue, forming a shielding portion 131-1 as shown in FIG. 14a.
  • the shielding part 131-1 is located inside the encapsulant, which can make the shielding part 131-1 fixed more firmly and increase the service life of the display device.
  • a groove for containing the white ink is formed on the encapsulation adhesive, and then the white ink is injected into the groove. Finally, due to the fluidity of the encapsulation adhesive and the white ink, the white The ink will flow into the inside of the encapsulant, forming a shielding portion 131-1 as shown in FIG. 14a.
  • a groove for containing the white ink is formed by pressing on the encapsulation glue, and after injecting the white ink into the groove, dot the encapsulation glue on the top to seal the white ink inside the encapsulation glue. It is sufficient to form the shielding portion 131 - 1 as shown in FIG. 14 a and seal the white ink inside the encapsulant, and the specific operation method is not limited here.
  • the white ink is located on the surface of the encapsulant 133-1, and after the encapsulant is solidified, white ink is dotted on the top of the shielding part 131-1 to form the form shown in Figure 14a
  • the shielding part 131-1 of this method is easy to operate and saves manufacturing time.
  • the parameters of the shielding part 131-1 meet the conditions of light intensity distribution of the light source 13-1; wherein, the parameters of the shielding part 131-1 include: setting position, material, shape, concentration, thickness and Reflectivity.
  • the thickness in the middle of the shielding part 131-1 can be set larger than the thickness at both ends; or, as shown in Figure 15b, further increase the thickness in the middle of the white ink (compared to Figure 14a), In this way, the intensity of the reflected light in the middle area of the shading part 131-1 can be increased.
  • the light emission pattern of each light source can be simulated according to the final light emission effect of the backlight module, so as to change the setting area, shape, material and thickness of the shielding part 131-1 according to the simulation structure and other parameters to adjust the light output rate of each position, so that the final light output light pattern of the light source meets the condition of emitting uniform backlight.
  • the embodiment of the present application does not limit the specific shape of the shielding portion 131-1.
  • the embodiment of the present application also provides a display device, which can increase the light-emitting angle of the light-emitting chip, reduce the number of light-emitting chips used in the display device, and avoid the problem of uneven brightness and darkness.
  • FIG. 16 is a schematic cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • the backlight module includes a circuit board 100-2, a light emitting chip 500-2, an encapsulation part 200-2, and a reflection part 210-2 located in the encapsulation part.
  • the size of the circuit board 100-2 is adapted to the size of the display device, and the shape can also be square, rectangular or irregular, which is not limited here.
  • the backlight module may also include a plurality of circuit boards 100-2, and the circuit boards 100-2 jointly provide backlight for the display device by splicing.
  • the splicing seam between adjacent circuit boards 100-2 should be as small as possible, and even seamless splicing can be realized.
  • the light emitting chips 500-2 are arranged in an array on the circuit board 100-2.
  • the light emitting chip is welded on the circuit board 100-2.
  • the light-emitting chip 500-2 is a miniature light-emitting diode chip, which includes but is not limited to Mini LED chips (Mini-Light Emitting Diode, Mini LED for short), which are different from ordinary light-emitting diodes.
  • the light-emitting chip specifically refers to a miniature light-emitting diode chip with a size between 50 ⁇ m and 200 ⁇ m.
  • the light-emitting chip 500-2 Since the size of the light-emitting chip 500-2 is very small, the light-emitting chip is beneficial to control the dynamic light emission to a smaller partition and improve the contrast of the picture.
  • the light-emitting chips 500-2 are arranged in an array, which is beneficial to design the spacing of the light-emitting chips according to the light emission requirements of the backlight module.
  • the package part 200-2 covers the light emitting chip 500-2.
  • the encapsulation part 200-2 may use transparent colloid material.
  • a separate package part 200-2 is formed on each light-emitting chip 500-2 by using a glue dispenser.
  • the shape of the package part 200-2 may be a hemisphere.
  • the encapsulation part 200-2 uses a transparent silicone material.
  • the hemispherical package part 200-2 has a height of 0.65mm and a diameter of 2.5mm.
  • the transparency of the encapsulation part 200-2 is greater than 95%, the viscosity is 12Pa ⁇ s/(25°C, 10rpm) ⁇ 16Pa ⁇ s/(25°C, 10rpm), and the thixotropic coefficient is 2.5/(3rpm/30rpm) ⁇ 3.0/( 3rpm/30rpm), the hardness is 35HA ⁇ 40HA. Therefore, the encapsulation part 200-2 has good light transmittance, good ability to restore the original structure after the structure is destroyed, and has certain hardness.
  • the formation of the encapsulation part 200-2 provides elastic protection for the light-emitting chip 500-2, which can be used to prevent the light-emitting chip 500-2 from being knocked and invalidated in each process flow, and improves the manufacturing quality of the display device. Rate.
  • a reflective part 210-2 is disposed in the packaging part 200-2, and the reflective part 210-2 is located on the light emitting side of the light emitting chip 500-2 for reflecting light.
  • FIG. 17 is a schematic cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • a reflective part 210-2 is disposed inside the packaging part 200-2, and the reflective part 210-2 is located on the light-emitting side of the light-emitting chip 500-2 for reflecting light.
  • the orthographic projection of the central point of the reflective part 210 - 2 on the circuit board coincides with the orthographic projection of the central point of the light emitting chip on the circuit board. Because the reflective part 210-2 has the property of reflecting light, part of the emitted light from the light-emitting chip 500-2 will be reflected by the reflective part 210-2 onto the circuit board 100-2 after being incident on the reflective part 210-2. The light will be reflected again by the circuit board 100-2; the outgoing light of the light-emitting chip 500-2 will form scattered outgoing light after multiple reflections, which increases the light-emitting angle of the light-emitting chip.
  • the outgoing light n near the midline area of the light-emitting chip is reflected by the reflecting part 210-2, and is reflected on the circuit board 100-2, and after being reflected again by the circuit board 100-2, a light n near the circuit board is formed.
  • the light m not reflected by the reflecting part 210-2 is normally emitted along the outgoing angle. Therefore, the arrangement of the reflection part 210-2 increases the light emission angle of the light-emitting chip 500-2, makes the emission light of the backlight module more uniform, and improves the utilization rate of light.
  • the distance c between the reflective part 210 - 2 and the light emitting chip 500 - 2 is 2 mils to 4 mils. In this way, it can be ensured that the outgoing light of the light emitting chip 500-2 can be reflected by the reflecting part 210-2 to the circuit board 100-2 for re-reflection, forming outgoing light scattered around, and increasing the light emitting angle of the light emitting chip 500-2. , so that the light output of the light panel is more uniform.
  • the reflective part 210-2 is spherical in shape, and its diameter is 3/4 of the width of the light-emitting chip 500-2. Therefore, the orthographic projection pattern of the reflection part 210-2 on the circuit board 100-2 and the orthographic projection pattern of the light emitting chip 500-2 on the circuit board 100-2 have a large overlapping range. This can ensure that most of the light emitted by the light-emitting chip 500-2 can be reflected by the reflecting part 210-2 to the circuit board 100-2, and then be reflected by the circuit board 100-2 again, and pass through the circuit board 100. -2 and the reflective part 210-2 reflect multiple times to form outgoing light scattered around, which increases the light emitting angle of the light-emitting chip 500-2 and makes the light emitting from the lamp panel more uniform.
  • the reflective part 210-2 includes a matrix and reflective materials dispersed in the matrix.
  • the reflective material is titanium dioxide.
  • the reflective part 210-2 may be formed by injection into the packaging part 200-2 again by a dispensing device after the packaging part 200-2 is formed.
  • the reflective material in the reflective part 210-2 has the property of reflecting light. Therefore, the emitted light from the light-emitting chip 500-2 enters the reflective part 210-2, and will be reflected by the reflective material in the reflective part 210-2 to the circuit board 100-2, and then reflected by the circuit board 100-2 again, The outgoing light scattered to the surroundings is formed, thereby increasing the light emitting angle of the light-emitting chip and making the light emitting of the backlight module more uniform.
  • the reflection part 210-2 since the reflection part 210-2 is provided, the light emitting angle of each light emitting chip 500-2 is increased. Therefore, on the circuit board 100-2 of the same size, the number of light-emitting chips used can be reduced, the distance between each light-emitting chip can be increased, and the backlight module can also form uniform outgoing light without uneven brightness and darkness. The problem.
  • FIG. 18 is a schematic cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • a circuit board 100-2 includes a substrate 110-2, a wiring layer 120-2 and a reflective layer 130-2.
  • the circuit board 100-2 can be manufactured by using a currently mature printed circuit board manufacturing process.
  • the substrate 110-2 can be made of metal aluminum material with good thermal conductivity and good mechanical durability.
  • the size of the substrate 110-2 is adapted to the size of the display device, and slightly smaller than the display device.
  • the shape of the substrate 110-2 can be square, rectangular or heterosexual, which is not limited here.
  • the circuit layer 120-2 may use one of various metal foils such as metal copper, metal nickel, and metal aluminum.
  • copper foil is selected as the material of the circuit layer 120-2.
  • the current mature copper-clad process can be used to set the conductive lines.
  • an insulating layer (not shown in the figure) between the substrate 110-2 and the circuit layer 120-2, which mainly serves the functions of adhesion, insulation and heat conduction.
  • the material of the insulating layer can be epoxy resin with high thermal conductivity and high insulation. The better the thermal conductivity of the insulating layer is, the more favorable it is to conduct the heat generated during the operation of the device, effectively reducing the operating temperature of the device and prolonging the life of the circuit board 100-2.
  • the reflective layer 130-2 is located on the side of the circuit layer 120-2 away from the substrate 110-2; as shown in FIG. 18 , the reflective layer 130-2 includes a first opening exposing each light emitting chip 500-2 131-2.
  • the reflective layer 130-2 can be made of a resin material with good insulating and reflective properties, such as white oil.
  • the reflective layer 130-2 has a plurality of first openings 131-2 for exposing the light emitting chip 500-2, so that the light emitting chip 500-2 is electrically connected with the conductive circuit in the circuit layer 120-2.
  • the light emitted by the light-emitting chip 500-2 is reflected by the reflecting part 210-2 onto the reflective layer 130-2, and the reflective layer 130-2 reflects this part of the light again.
  • the outgoing light is reflected multiple times by the reflective part 210-2 and the reflective layer 130-2 to form light that diffuses to the surroundings, increasing the light emitting angle of the light-emitting chip 500-2, making the outgoing light of the backlight module more uniform, and Improved light utilization.
  • the circuit board 100-2 is a single-sided board, and only one side has wiring, and the other side is a substrate or is directly covered with insulating ink. Only the side with lines in its cross-section contains copper foil, which can effectively reduce the cost.
  • Fig. 19 is a schematic cross-sectional structure diagram of a light emitting chip provided by some embodiments of the present application.
  • the light emitting chip 500-2 includes a first Bragg reflective layer 510-2, a first doped layer 520-2, a light emitting layer 530-2, a second doped layer 540-2, a second Bragg reflective layer 550- 2 and two electrodes 560-2.
  • the light-emitting chip 500-2 is a miniature light-emitting diode chip, which includes but is not limited to Mini LED chips (Mini-Light Emitting Diode, Mini LED for short), which are different from ordinary light-emitting diodes.
  • the light-emitting chip specifically refers to a miniature light-emitting diode chip with a size between 50 ⁇ m and 200 ⁇ m.
  • the light-emitting chip 500-2 can be manufactured using the current mature manufacturing process.
  • the first Bragg reflective layer 510-2, the first doped layer 520-2, the light emitting layer 530-2, and the second doped layer 540-2 can be sequentially grown on the substrate by chemical vapor deposition. 2 and the second Bragg reflective layer 550-2.
  • the first doped layer 520-2 and the second doped layer 540-2 can be obtained by using the same material, such as gallium nitride, etc., and performing P-type doping and N-type doping respectively; and photolithography to form two electrodes 560-2 on the second Bragg reflective layer 550-2; finally, a plurality of light-emitting chips 500-2 are formed on the substrate by etching.
  • the first Bragg reflection layer 510-2 and the second Bragg reflection layer 550-2 are periodic structures formed by alternately stacking layers of two materials with different refractive indices, for example, AlGaAs and AlxOy materials can be used. Because the two materials have a large difference in refractive index, it is beneficial to improve the reflection effect.
  • the product of the geometric thickness of each film layer and the refractive index of the material used in the film layer is called the optical thickness, and the optical thickness of each layer of material is 1/4 of its central reflection wavelength, so the first Bragg reflection layer 510-2 and the second Bragg reflection layer 510-2 Bragg reflector 550-2 is a 1/4 wavelength multilayer system, equivalent to a group of simple photonic crystals.
  • the light-emitting chip 500-2 After the light-emitting chip 500-2 is excited, the light emitted by the two Bragg reflective layers is changed by the Bragg reflective layer, so that most of the light cannot be emitted directly above the light-emitting chip 500-2, but toward the light-emitting chip 500-2.
  • the two sides of the light-emitting chip 500-2 emit light, so that the light emitted toward the two sides of the light-emitting chip 500-2 increases, and therefore the light-emitting angle of the light-emitting chip 500-2 increases, which can be increased to 165°.
  • each light-emitting chip 500-2 is transferred to a circuit board, and the position of each light-emitting chip 500-2 corresponds to the first opening on the reflective layer one by one. Then use the currently mature bonding process to electrically connect the light emitting chip 500-2 to the circuit board.
  • the backlight module also includes a diffusion plate 13 located on the light-emitting side of the light-emitting chip for uniform light; therefore, a bracket 15 for supporting the diffusion plate is also provided between the circuit board and the diffusion plate 13 .
  • the bracket 15 includes a base and a supporting body.
  • FIG. 20 is a schematic top view of the base of the bracket provided by some embodiments of the present application
  • FIG. 21 is a schematic cross-sectional structure diagram of the base of the bracket provided by some embodiments of the present application.
  • the base is located on the circuit board, and the base includes at least two embedded pieces erected towards the diffuser plate.
  • the base 15-2 is disc-shaped with a diameter of 4 mm, and can be processed into one of metal materials such as metal gold, metal silver, metal copper, metal iron and metal tin.
  • the hollowed-out areas on both sides of the base are the embedded sheet areas that are processed to stand upright toward the diffuser plate.
  • the base 15-2 includes two embedded pieces 15-21 erected towards the diffuser plate, the distance a between the two embedded pieces 15-21 is 1.30mm, and the two embedded pieces The width b is 0.75 mm.
  • Fig. 22 is a schematic cross-sectional structure diagram of the bracket provided by the embodiment of the present application.
  • the support body 15-3 of the bracket is connected to the base, and the embedded piece 15-21 is embedded into the interior of the support body 15-3.
  • the support body 15-3 is made of materials such as high-temperature-resistant nylon (Polyphthalamide, PPA for short), and the support body 15-3 and the embedded sheet 15-21 are injected together by injection molding technology, thereby ensuring that the support body 15
  • the connection strength between -3 and the base ensures the push-pull force strength of the bracket, which can make the diffusion plate supported by the bracket have better stability.
  • the stent provided by the embodiment of the present application has good high temperature resistance. Therefore, even at a relatively high operating temperature, the bracket can maintain its strength, making the support between the circuit board and the diffuser plate more stable.
  • the circuit board includes a plurality of first pads for connecting the bracket, and the position of each first pad corresponds to the position of the bracket one by one, and the reflective layer also includes an exposed first pad the second opening.
  • the first pad is used for soldering connection with the base of the bracket.
  • the bracket can be fixed more stably by welding.
  • the power is relatively high, which will lead to a high temperature of the lamp board.
  • the glue connection method will be affected by higher temperature, while the welding connection method will be less affected, which makes the structure of the backlight module more stable and prolongs its service life.
  • the bracket provided in the embodiment of the present application may be connected to the circuit board by welding. Therefore, the soldering and fixing of the bracket can be performed simultaneously with the soldering and fixing of the light-emitting chip, which simplifies the process flow and improves the manufacturing efficiency.
  • FIG. 23 is a schematic top view of a backlight module provided by some embodiments of the present application.
  • the circuit board 100-2 includes a light emitting chip covered by the encapsulation part 200-2, a support 15, at least one driving chip 400-2 and some peripheral circuit components 700-2.
  • the circuit board further includes a plurality of second welding pads
  • the reflective layer further includes a plurality of third openings exposing the second welding pads.
  • the position of each driving chip 400-2 and the peripheral circuit element 700-2 corresponds to each second pad, and the second pad connects the driving chip 400-2, the peripheral circuit element 700-2 and the circuit in the circuit board. layers are electrically connected.
  • the driving chip 400-2 provides a driving signal to the circuit layer in the circuit board, and then transmits the driving signal to each light-emitting chip through the conductive circuit in the circuit layer, so as to control the brightness of the light-emitting chip.
  • the peripheral circuit components 700-2 include components such as capacitors and resistors.
  • the arrangement of the peripheral circuit components 700-2 ensures the reliability of the operation of the driving chip 400-2 and improves the stability of the display device.
  • the number of light-emitting chips can be reduced, so that the driving chip 400-2 and the peripheral circuit element 700-2 can be set at the distance between the light-emitting chips.
  • the driving chip and peripheral circuit components are located on the side of the circuit board where the light emitting chip is disposed.
  • the circuit board uses a single-sided printed circuit board.
  • the number of pins of the driving chip 400-2 used to control the light emitting chip is also significantly reduced, which reduces the cost of terminals and wires.
  • each light-emitting chip can be directly electrically connected to each pin of the driver chip 400-2 through the circuit layer, so as to avoid signal transmission from being transferred to the circuit board end through terminals and transfer lines. Stability improves the stability of signal transmission, thereby improving the reliability of the display device.
  • FIG. 24 is a flow chart of the method for manufacturing a display device provided by the embodiment of the present application.
  • the manufacturing method of the display device includes:
  • the embodiment of the present application provides a manufacturing method by injecting a reflective material into the packaging part of the light-emitting chip.
  • the backlight module is limited by the light emission angle of the light-emitting chip, and needs to use a large number of micro light-emitting diodes; if the number of light-emitting chips used is reduced, the light will be bright and dark. uneven problem.
  • the manufacturing method provided by the embodiment of the present application can increase the light-emitting angle of the light-emitting chip, reduce the number of light-emitting chips used in the display device, and avoid the problem of uneven brightness and darkness.
  • the circuit board can be manufactured using a currently mature circuit board manufacturing process.
  • the circuit board can be a single-sided board, only one side has lines, and the other side is a substrate or directly covered with insulating ink. Only the side with lines in its cross-section contains copper foil, which can effectively reduce the cost.
  • the circuit board after the circuit board is fabricated, a plurality of light-emitting chips need to be connected to the circuit board.
  • the first doped layer and the second doped layer can be obtained by using the same material, such as gallium nitride, and performing P-type doping and N-type doping respectively; Two electrodes are formed on the two Bragg reflection layers; finally, a plurality of light-emitting chips are formed by etching.
  • the current mass transfer technology is used to transfer each light-emitting chip to the circuit board, and electrically connect each light-emitting chip to the circuit board.
  • the support While transferring the light-emitting chip, the support can be transferred together, so that the support and the circuit board are welded and fixed, which simplifies the process flow and improves the preparation efficiency.
  • each light-emitting chip after connecting a plurality of light-emitting chips on the circuit board, each light-emitting chip needs to be packaged, and glue is dispensed on the surface of each light-emitting chip to form a packaging part.
  • the encapsulation part can be made of transparent organic silicon material and formed on the surface of the light-emitting chip by dispensing equipment. The formation of the encapsulation part provides elastic protection for the light-emitting chip, which can be used to prevent the light-emitting chip from being knocked and invalidated in various technological processes, and improves the manufacturing yield of the display device.
  • a reflective material is injected into the sealing portion to form the reflecting portion.
  • the reflective part is located on the light emitting side of the light emitting chip and is used for reflecting light.
  • the reflective material may be titanium dioxide.
  • the reflective part can be formed by secondary injection of glue in the packaging part by a dispensing device.
  • the reflective material in the reflective part has the property of reflecting light. Therefore, when the light emitted by the light-emitting chip enters the reflection part, it will be reflected to the circuit board by the reflective material in the reflection part, and after being reflected again by the circuit board, the light emitted by the light-emitting chip will be scattered around, thereby increasing the size of the light-emitting chip.
  • the light emitting angle of the backlight module makes the light emitting from the backlight module more uniform, reduces the number of light-emitting chips used in the display device, and avoids the problem of uneven brightness and darkness.
  • the reflective part has a shielding effect.
  • the present application also provides a display device.
  • FIG. 25 is a schematic partial cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • FIG. 26 is a partial cross-sectional structural schematic diagram of a backlight module provided by some embodiments of the present application.
  • the backlight module further includes: an angle selection film 16 .
  • the angle selection film 16 is located on the side of the diffuser plate 13 close to the lamp panel 12.
  • the angle selection film 16 can increase the reflection of the light in the range of 0°-70° and increase the reflection of the light in the range of 70°-90°.
  • the range of 0°-70° refers to the small-angle light emitted by the light source 122
  • the range of 70°-90° refers to the large-angle light emitted by the light source 122 .
  • the shielding portion 1223 can reflect at least part of the incident light, but some small-angle light still passes through the shielding portion 1223 .
  • the angle-selective film 16 can increase the reflection of the small-angle light emitted through the shielding part 1223, and the light is reflected by the angle-selective film 16 back to the direction of the lamp board 12, while the outgoing light with a large angle is enhanced and emitted; it is reflected back to the lamp board
  • the small-angle light rays in the 12 direction will form part of the large-angle light rays after being scattered or diffusely reflected by the reflective layer 123, so that they will be emitted by the angle selective film 16, thereby reducing the emission of small-angle light rays near the center of the emission.
  • the intensity increases the emission intensity of the large-angle light away from the emission center, so that the final emission illuminance is consistent, and the uniformity of the light emitted by the light source 122 is improved.
  • the shape of the angle selection film 16 is the same as that of the diffuser plate 13, and the thickness of the angle selection film 16 is in the range of 30-60 ⁇ m. Since the thickness of the angle selection film 16 is relatively thin, in the embodiments provided by this application, the angle The selective film 16 is formed on the surface of the diffusion plate 13 close to the lamp panel 12 , so as to ensure the flatness of the angle selective film 16 itself, and further ensure the optical effect of the angle selective film 16 .
  • the angle selective film 16 uses the principle of thin film interference to increase reflection or anti-reflection of light that can respond to a specific incident angle, and the anti-reflection or anti-reflection effect on light depends on the incident angle of light incident on the film layer, the film The refractive index of the layer and the thickness of the film layer, so in order not to affect the calculation of the thickness of the film layer, it should be avoided to arrange two film layers with the same refractive index adjacent to each other. Moreover, the single-layer film layer has a limited anti-reflection or anti-reflection effect on the incident light. In specific implementation, multiple film layers can be used as a group, and multiple sets of film layers can be stacked to improve the anti-reflection or anti-reflection effect of the angle selection sheet. transparent effect.
  • the thickness of the film with the refractive index n2 is d, and it is a film with uniform thickness, because and So you can get:
  • n2 is the refractive index of a certain layer of medium
  • i is the angle of incidence from the air layer.
  • the angle selection film 16 provided in the embodiment of the present application can transfer a part of the small-angle light originally irradiated directly above the light source 122 to the junction of the light source 122 and the light source 122 after reflection, thereby improving the thickness of the backlight module. Uniformity of brightness.
  • the reflectivity of the angle selective film 16 provided by the embodiment of the present application to the 0° incident light is 70%-90%, and the reflectivity of the angle selective film 16 to the 0°-70° incident light decreases sequentially, and the transmittance increases sequentially.
  • the blocking part 1223 is set on the light emitting surface of the light source 122 facing away from the back plate 11, which can increase the light emitting angle of the light source 122, and at the same time, combined with the angle selection film 16, the irradiation range of a single light source 122 can be maximized to further reduce the backlight. H/P value.
  • the shading part 1223 limits the light intensity above the light source 122, that is, at small angles, and the angle selective film 16 has a reflectivity of 90% for light at small angles, the combination of the two will excessively reduce the intensity of light emitted above the light source 122. As a result, black shadows appear above the light source 122, affecting the display effect of the display device.
  • the embodiment provided by the present application is obtained through multiple optical simulation experiments: when the shielding part 1223 includes a matrix and reflective particles, the content of the reflective particles and the reflectivity of the angle-selective film to 0° incident light satisfy the following relationship:
  • a represents the content of reflective particles
  • b represents the reflectivity of angle selective film 16 to 0° incident light
  • the uniformity of the backlight output of the display device can be guaranteed, as shown in Figure 5, so that a single light source
  • the light output range of 122 is increased from D1 to D2, and the H/P value is greatly reduced to below 0.2; without increasing the production cost (without changing the number of light sources 122), it meets the development needs of thinner display devices.
  • the content a of the reflective particles and the reflectivity of the angle selective film 16 to the 0° incident light are set within the range of 75% ⁇ (a+b) ⁇ 115%.
  • a represents the content of reflective particles
  • b represents the reflectivity of the angle-selective film to 0° incident light
  • H represents the light mixing distance (the distance from the circuit layer to the lower surface of the diffuser plate)
  • P represents the distance between two adjacent light sources spacing
  • A represents the concentration coefficient of the shielding part 1223
  • B represents the reflectance coefficient of the angle selective film 16
  • the value range of the concentration coefficient A of the shielding part 1223 is 6.8-7.0; The value range is 4.5-4.7. Therefore, the embodiments of the present application can adjust the light mixing distance and the distance between two adjacent light sources according to the above relationship, so as to meet the requirements of different display devices.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)

Abstract

La présente demande concerne un dispositif d'affichage, comprenant un panneau d'affichage et un module de rétroéclairage. Le module de rétroéclairage comprend une plaque arrière et un panneau de lampe. Le panneau de lampe comprend une source de lumière. Une surface de sortie de lumière de la source de lumière est pourvue d'une partie de blindage. La partie de blindage a un effet de réflexion sur au moins une partie de la lumière incidente, et peut ainsi affaiblir l'intensité de la lumière émergente au sommet de la source de lumière. De plus, lorsqu'elle atteint le fond de la source de lumière, la lumière réfléchie par la partie de blindage peut être à nouveau réfléchie et est finalement émise sur une surface latérale de la source de lumière, de telle sorte que l'intensité de la lumière émergente sur la surface latérale de la source de lumière est augmentée, l'intensité lumineuse à chaque position à l'intérieur d'une plage de sortie de lumière est homogénéisée, et un angle de sortie de lumière de la source de lumière est augmenté.
PCT/CN2022/095745 2021-05-28 2022-05-27 Dispositif d'affichage WO2022247941A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
CN202110590520.2A CN115407547B (zh) 2021-05-28 2021-05-28 一种显示装置
CN202110590520.2 2021-05-28
CN202110593057.7A CN115407551B (zh) 2021-05-28 2021-05-28 一种显示装置
CN202110593057.7 2021-05-28
CN202110984187.3 2021-08-25
CN202122019685.2 2021-08-25
CN202110984187.3A CN115732525A (zh) 2021-08-25 2021-08-25 一种显示装置及其制作方法
CN202122019685.2U CN215416207U (zh) 2021-08-25 2021-08-25 一种显示装置

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CN116344723A (zh) * 2023-05-31 2023-06-27 硅能光电半导体(广州)有限公司 一种蝙蝠翼光型led灯珠结构及其制备方法
CN117174704A (zh) * 2023-08-31 2023-12-05 惠科股份有限公司 发光基板及显示装置
WO2024197536A1 (fr) * 2023-03-27 2024-10-03 京东方科技集团股份有限公司 Dispositif électroluminescent, module de rétroéclairage et appareil d'affichage

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CN112162428A (zh) * 2020-08-28 2021-01-01 福州大学 一种Mini-LED通孔调光结构背光源及其制造方法
CN112666757A (zh) * 2020-12-31 2021-04-16 广东晶科电子股份有限公司 一种多层结构的发光器件及背光模组
CN215416207U (zh) * 2021-08-25 2022-01-04 海信视像科技股份有限公司 一种显示装置

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CN101175946A (zh) * 2005-04-01 2008-05-07 索尼株式会社 背光装置、液晶显示装置和光偏转片
JP2010062305A (ja) * 2008-09-03 2010-03-18 Hitachi Displays Ltd 照明装置、及び液晶表示装置
CN103939793A (zh) * 2013-01-23 2014-07-23 Lg电子株式会社 面状照明装置
CN106526973A (zh) * 2016-12-30 2017-03-22 深圳Tcl新技术有限公司 直下式背光模组和液晶显示装置
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CN215416207U (zh) * 2021-08-25 2022-01-04 海信视像科技股份有限公司 一种显示装置

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WO2024197536A1 (fr) * 2023-03-27 2024-10-03 京东方科技集团股份有限公司 Dispositif électroluminescent, module de rétroéclairage et appareil d'affichage
CN116344723A (zh) * 2023-05-31 2023-06-27 硅能光电半导体(广州)有限公司 一种蝙蝠翼光型led灯珠结构及其制备方法
CN116344723B (zh) * 2023-05-31 2023-08-29 硅能光电半导体(广州)有限公司 一种蝙蝠翼光型led灯珠结构及其制备方法
CN117174704A (zh) * 2023-08-31 2023-12-05 惠科股份有限公司 发光基板及显示装置

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