WO2011097834A1 - Direct ultra-thin led backlight module - Google Patents

Direct ultra-thin led backlight module Download PDF

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Publication number
WO2011097834A1
WO2011097834A1 PCT/CN2010/070884 CN2010070884W WO2011097834A1 WO 2011097834 A1 WO2011097834 A1 WO 2011097834A1 CN 2010070884 W CN2010070884 W CN 2010070884W WO 2011097834 A1 WO2011097834 A1 WO 2011097834A1
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Prior art keywords
led
backlight module
light source
led chip
direct
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PCT/CN2010/070884
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French (fr)
Chinese (zh)
Inventor
宋义
苏遵惠
张俊锋
李英翠
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深圳帝光电子有限公司
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Publication of WO2011097834A1 publication Critical patent/WO2011097834A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Definitions

  • the invention relates to a backlight module, in particular to a direct-type ultra-thin LED backlight module, which is applied to the field of liquid crystal display devices (such as liquid crystal televisions, liquid crystal displays, etc.).
  • liquid crystal display devices such as liquid crystal televisions, liquid crystal displays, etc.
  • the existing direct-lit LED backlight module generally includes an LCD display, a diffusion film and a PCB board.
  • the PCB board is provided with a plurality of encapsulated LED light sources. After the LED light source emits light, the light becomes uniform and uniform after being diffused, and then uniformly irradiated onto the LCD display screen, thereby realizing illumination of the liquid crystal display device.
  • the existing backlight module is relatively versatile, since the LED power used is mostly above 0.3 watts, the number of LEDs per backlight is used less, so the distribution density is small, and the LED light source is small. The distance between the intersecting rays is large. In order to utilize the light emitted by the LED, the thickness of the backlight module is large, and it is difficult to achieve ultra-thinning.
  • the LED chip is not directly fabricated on the PCB to form a direct-type ultra-thin LED backlight module with high LED distribution density, low cost, and high efficiency.
  • the technical problem to be solved by the present invention is to provide a LED with a high density and low cost, without requiring packaging of the LED chip, without providing refraction and reflection optics on the LED chip, and directly forming the LED chip on the PCB. High-efficiency direct-type ultra-thin LED backlight module.
  • the invention is realized by the invention, a direct-type ultra-thin LED backlight module, comprising an LCD display screen, a diffusion layer and a PCB board, the PCB board surface is provided with a reflective layer, and the PCB board is further provided with a plurality of unpackaged
  • the LED chip light source is coated with a material that can refract light emitted by the LED chip light source.
  • the invention directly sets the unpackaged LED chip light source on the PCB board, then applies a transparent glue or a fluorescent glue on the surface of the single LED chip light source, or applies a transparent glue layer or a fluorescent glue layer on the surface of the plurality of LED chip light sources, that is, The same effect as the LED chip light source packaged in advance can be realized, the process of pre-packaging the LED chip light source is reduced, and the optical device is disposed on the LED to reduce the thickness of the backlight, thereby greatly saving the cost; meanwhile, the LED chip After the light emitted by the light source is refracted in the transparent glue or the transparent adhesive layer, the light emitting surface of the light is increased, and the invention increases the arrangement density of the LED chip light source to make the distance between the LED chip light sources large.
  • the amplitude is reduced, thereby greatly reducing the thickness of the backlight module, so that the scheme of the direct-type LED ultra-thin backlight module can be realized; since the invention greatly reduces the optical loss caused by other optical refraction and reflection devices, the light is greatly improved. Utilization rate.
  • FIG. 4 is a schematic view showing the addition of a white light layer between the PCB board of the backlight module of FIG. 2 and the diffusion film;
  • FIG. 5 is a schematic diagram of a parallel arrangement of LED chip light sources according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of parallel connection and series arrangement of LED chip light sources according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of an LED chip light source module including a plurality of parallel and parallel arrangement according to an embodiment of the present invention.
  • a direct-type ultra-thin LED backlight module includes an LCD display 1, a diffusion film 2, and a PCB 3.
  • the PCB 3 is provided with a plurality of unpackaged LED chip light sources 4,
  • the surface of the LED chip light source 4 is coated with a material that refracts light emitted from the LED chip light source 4.
  • the plurality of LED chip light sources 4 are covered with a transparent adhesive layer (not shown) or a fluorescent adhesive layer 5 (as shown in FIG. 3) by a potting process.
  • the PCB board 3 is a monolithic or spliced structure.
  • the present invention preferably has two or more spliced structure PCB boards 3 (as shown in FIGS. 1 to 4), so that the size of the PCB board 3 is It can be standardized and can be mass-produced.
  • multiple standardized PCB boards 3 are spliced according to the required size, which greatly improves the assembly efficiency and significantly reduces the production cost.
  • a white light layer 6 is disposed between the PCB board 3 and the diffusion film 2, and the white light layer 6 is used to turn white light of various colors emitted by the LED chip light source 4 into white light.
  • the selection range of the LED chip light source 4 is large, and when the white light layer 6 is not provided, only the LED chip light source that can emit white light can be selected.
  • the LED chip light source 4 may be provided with blue LEDs, red LEDs, green LEDs, red, green and blue, or two or three mixed colors of LEDs, and then the light of these colors is converted into white light by the white light layer 6. Thereby achieving the purpose of increasing the color gamut range.
  • one or both sides of the PCB board 3 are provided with a plurality of electronic components for controlling the LED chip light source 4, thereby achieving the purpose of controlling the LED chip light source 4 to meet different working requirements.

Abstract

A direct ultra-thin LED backlight module is provided by present invention. The first, non-packaged LED chips light source are mounted on a PCB board directly, and then, transparent gel or fluorecent gel is coated on the surface of a single LED chip, or a transparent gel layer or a fluorecent gel layer is coated on the surfaces of the multiple LED chips. The present invention has the same effect as the LED chips light source whose chips are pre-packaged, reduces the pre-packaging craft, and avoids setting optical equipment on the LED for decreasing the thickness of backlight, thus saving cost considerably. At the same time, because the light from LED chips is reflected in the transparent gel or the transparent gel layer, the light out plane is expanded, and by increasing the arrangement density of the LED chips light source, the distance between the cross rays of the LED chips light source can be greatly decreased , so the thickness of the backlight module is reduced considerably, and the direct ultra-thin LED backlight module is enabled.

Description

直下式超薄LED背光模组  Straight-type ultra-thin LED backlight module 技术领域Technical field
本发明涉及一种背光模组，尤其涉及一种直下式超薄LED背光模组，应用于液晶显示装置领域（如液晶电视、液晶显示器等）。 The invention relates to a backlight module, in particular to a direct-type ultra-thin LED backlight module, which is applied to the field of liquid crystal display devices (such as liquid crystal televisions, liquid crystal displays, etc.).
背景技术Background technique
现有的直下式LED背光模组，一般包括LCD显示屏、扩散膜及PCB板， PCB板上设有若干封装后的LED光源，LED光源发出光线后，经扩散膜后光线变得均匀、一致，然后均匀地照射到LCD显示屏上，从而实现对液晶显示装置进行照明的作用。现有的这种背光模组虽然比较通用，但是，由于所用的LED功率大部分在0.3瓦以上，因此每个背光源的LED数量就用的少，因此其分布密度就很小，LED光源之间的交叉光线的距离大，为了利用LED发出的光线，就会导致背光模组的厚度较大，难以实现超薄化，而要想做成超薄型背光源就必须在LED上增加很多的光学折射和光学反射装置，导致成本很高；另外，LED光源都是经过封装后，才可以用在背光模组上，而对LED光源进行封装，势必也会增加生产成本，更重要是因为封装支架的结构限制加上所增加的折射反射装置，LED光源的出光效率也会被部分限制，导致成本高、效率低。The existing direct-lit LED backlight module generally includes an LCD display, a diffusion film and a PCB board. The PCB board is provided with a plurality of encapsulated LED light sources. After the LED light source emits light, the light becomes uniform and uniform after being diffused, and then uniformly irradiated onto the LCD display screen, thereby realizing illumination of the liquid crystal display device. Although the existing backlight module is relatively versatile, since the LED power used is mostly above 0.3 watts, the number of LEDs per backlight is used less, so the distribution density is small, and the LED light source is small. The distance between the intersecting rays is large. In order to utilize the light emitted by the LED, the thickness of the backlight module is large, and it is difficult to achieve ultra-thinning. To make an ultra-thin backlight, it is necessary to add a lot of LEDs. Optical refraction and optical reflection devices result in high cost; in addition, LED light sources are packaged before they can be used on backlight modules, and packaging LED light sources will inevitably increase production costs, more importantly because of packaging. The structural limitations of the bracket plus the added refractive reflector, the light extraction efficiency of the LED light source is also partially limited, resulting in high cost and low efficiency.
因此，现有技术中没有将LED芯片直接制作在PCB上而形成LED分布密度较高、低成本、高效率的直下式超薄LED背光模组。Therefore, in the prior art, the LED chip is not directly fabricated on the PCB to form a direct-type ultra-thin LED backlight module with high LED distribution density, low cost, and high efficiency.
技术问题technical problem
本发明所要解决的技术问题在于提供一种不需要对LED芯片进行封装、不需要在LED芯片上设置折射和反射光学器件、直接将LED芯片制作在PCB上而形成LED分布密度较高、低成本、高效率的直下式超薄LED背光模组。 The technical problem to be solved by the present invention is to provide a LED with a high density and low cost, without requiring packaging of the LED chip, without providing refraction and reflection optics on the LED chip, and directly forming the LED chip on the PCB. High-efficiency direct-type ultra-thin LED backlight module.
技术解决方案Technical solution
本发明是这样实现的，一种直下式超薄LED背光模组，包括LCD显示屏、扩散层及PCB板，所述PCB板表面设有反射层，所述PCB板上还设有若干未封装的LED芯片光源，所述LED芯片光源表面涂覆有可对该LED芯片光源发出的光线进行折射的材料。 The invention is realized by the invention, a direct-type ultra-thin LED backlight module, comprising an LCD display screen, a diffusion layer and a PCB board, the PCB board surface is provided with a reflective layer, and the PCB board is further provided with a plurality of unpackaged The LED chip light source is coated with a material that can refract light emitted by the LED chip light source.
有益效果Beneficial effect
本发明直接将未封装的LED芯片光源设置在PCB板上，然后在单个LED芯片光源表面涂覆透明胶或荧光胶，或在多个LED芯片光源表面涂覆透明胶层或荧光胶层，即可实现与事先封装的LED芯片光源同样的效果，减少了对LED芯片光源事先封装的工艺，也避免了为减小背光源厚度而在LED上设置光学装置，大大节省了成本；同时，LED芯片光源发出的光线在透明胶或透明胶层内折射后，增大了光线的出光面，再加上本发明通过增加LED芯片光源的排布密度，使LED芯片光源之间的交叉光线的距离大幅度减小，从而可大大降低背光模组厚度，使得直下式LED超薄背光模组的方案得以实现；由于本发明大大减少了由其它光学折射和反射装置带来的光学损失，大大提高了光线利用率。 The invention directly sets the unpackaged LED chip light source on the PCB board, then applies a transparent glue or a fluorescent glue on the surface of the single LED chip light source, or applies a transparent glue layer or a fluorescent glue layer on the surface of the plurality of LED chip light sources, that is, The same effect as the LED chip light source packaged in advance can be realized, the process of pre-packaging the LED chip light source is reduced, and the optical device is disposed on the LED to reduce the thickness of the backlight, thereby greatly saving the cost; meanwhile, the LED chip After the light emitted by the light source is refracted in the transparent glue or the transparent adhesive layer, the light emitting surface of the light is increased, and the invention increases the arrangement density of the LED chip light source to make the distance between the LED chip light sources large. The amplitude is reduced, thereby greatly reducing the thickness of the backlight module, so that the scheme of the direct-type LED ultra-thin backlight module can be realized; since the invention greatly reduces the optical loss caused by other optical refraction and reflection devices, the light is greatly improved. Utilization rate.
附图说明DRAWINGS
图1是本发明实施例提供的LED芯片光源表面涂有透明胶的背光模组的示意图；1 is a schematic diagram of a backlight module coated with a transparent glue on a surface of an LED chip light source according to an embodiment of the present invention;
图2是本发明实施例提供的LED芯片光源表面涂有荧光胶的背光模组的示意图；2 is a schematic diagram of a backlight module coated with a fluorescent glue on a surface of an LED chip light source according to an embodiment of the present invention;
图3是本发明实施例提供的LED芯片光源表面覆盖有荧光胶层的背光模组的示意图；3 is a schematic diagram of a backlight module with a fluorescent adhesive layer on a surface of an LED chip light source according to an embodiment of the present invention;
图4是在图2中的背光模组的PCB板与扩散膜之间增设一白光层的示意图；4 is a schematic view showing the addition of a white light layer between the PCB board of the backlight module of FIG. 2 and the diffusion film;
图5是本发明实施例提供的LED芯片光源并联排布的示意图；FIG. 5 is a schematic diagram of a parallel arrangement of LED chip light sources according to an embodiment of the present invention; FIG.
图6是本发明实施例提供的LED芯片光源串联排布的示意图；6 is a schematic diagram of a LED chip light source arranged in series according to an embodiment of the present invention;
图7是本发明实施例提供的LED芯片光源并联、串联结合排布的示意图；7 is a schematic diagram of parallel connection and series arrangement of LED chip light sources according to an embodiment of the present invention;
图8是本发明实施例提供的包括多个并串结合排布的LED芯片光源模块的示意图。FIG. 8 is a schematic diagram of an LED chip light source module including a plurality of parallel and parallel arrangement according to an embodiment of the present invention.
本发明的实施方式Embodiments of the invention
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
如图1~图3 所示，本发明实施例提供的直下式超薄LED背光模组，包括LCD显示屏1、扩散膜2及PCB板3，所述PCB板3上设有若干未封装的LED芯片光源4，所述LED芯片光源4表面涂覆可对该LED芯片光源4发出的光线进行折射的材料。Figure 1 to Figure 3 As shown in the embodiment of the present invention, a direct-type ultra-thin LED backlight module includes an LCD display 1, a diffusion film 2, and a PCB 3. The PCB 3 is provided with a plurality of unpackaged LED chip light sources 4, The surface of the LED chip light source 4 is coated with a material that refracts light emitted from the LED chip light source 4.
具体地，所述单个LED芯片光源4表面通过点胶或喷涂工艺覆盖有透明胶41（如图1所示）或荧光胶42（如图2所示），所述透明胶41可以是硅胶。Specifically, the surface of the single LED chip light source 4 is covered with a transparent glue 41 (as shown in FIG. 1) or a fluorescent glue 42 (shown in FIG. 2) by a dispensing or spraying process, and the transparent adhesive 41 may be a silica gel.
或者，所述多个LED芯片光源4上通过灌胶工艺覆盖有透明胶层（图中未示出）或荧光胶层5（如图3所示）。Alternatively, the plurality of LED chip light sources 4 are covered with a transparent adhesive layer (not shown) or a fluorescent adhesive layer 5 (as shown in FIG. 3) by a potting process.
本发明直接将未封装的LED芯片光源4装在PCB板3上，然后在单个LED芯片光源4表面涂覆透明胶41或荧光胶42，或在多个LED芯片光源4上涂覆透明胶层或荧光胶层5，即可实现与事先封装的LED芯片光源同样的效果，减少了对LED芯片光源事先封装的工艺，也避免了为减小背光源厚度而在LED上设置光学装置，大大节省了成本；同时，LED芯片光源4发出的光线在透明胶或透明胶层5内折射后，增大了光线的出光面，再加上本发明通过增加LED芯片光源4的排布密度，使LED芯片光源4之间的交叉光线的距离大幅度减小，从而可大大降低背光模组厚度，使得直下式LED超薄背光模组的方案得以实现；由于本发明大大减少了由其它光学折射和反射装置带来的光学损失，大大提高了光线利用率。The invention directly mounts the unpackaged LED chip light source 4 on the PCB board 3, and then applies a transparent glue 41 or a fluorescent glue 42 on the surface of the single LED chip light source 4, or applies a transparent adhesive layer on the plurality of LED chip light sources 4. Or the fluorescent glue layer 5 can achieve the same effect as the LED chip light source previously packaged, reduce the process of pre-packaging the LED chip light source, and avoid the optical device on the LED to reduce the thickness of the backlight, thereby greatly saving At the same time, after the light emitted by the LED chip light source 4 is refracted in the transparent adhesive or transparent adhesive layer 5, the light emitting surface of the light is increased, and the present invention increases the arrangement density of the LED chip light source 4 to make the LED The distance of the crossed light between the chip light sources 4 is greatly reduced, thereby greatly reducing the thickness of the backlight module, so that the scheme of the direct-type LED ultra-thin backlight module can be realized; since the invention greatly reduces the other optical refraction and reflection The optical loss caused by the device greatly improves the light utilization rate.
进一步地，所述扩散层2上还可设置增光层（图中未示出），该增光层用于将光线集中，提高光亮度。Further, a light-increasing layer (not shown) may be disposed on the diffusion layer 2, and the light-increasing layer is used to concentrate light and improve light brightness.
具体地，所述PCB板3为整体式或拼接式结构，本发明优选两块或多块拼接式结构的PCB板3（如图1~图4所示），这样，PCB板3的尺寸就可以标准化，并可以大批量生产，装配时，根据所需尺寸将多个标准化的PCB板3拼接起来，大大提高了装配效率，显著降低了生产成本。 Specifically, the PCB board 3 is a monolithic or spliced structure. The present invention preferably has two or more spliced structure PCB boards 3 (as shown in FIGS. 1 to 4), so that the size of the PCB board 3 is It can be standardized and can be mass-produced. When assembling, multiple standardized PCB boards 3 are spliced according to the required size, which greatly improves the assembly efficiency and significantly reduces the production cost.
如图4所示，进一步地，所述PCB板3与扩散膜2之间设有一白光层6，所述白光层6用于将LED芯片光源4发出的各种颜色的光变成白光，这样，LED芯片光源4的选择范围就很大了，而在没有设置白光层6时，只能选择可发出白光的LED芯片光源。具体地，所述LED芯片光源4内可设置有蓝色LED、红色LED、绿色LED、红绿蓝任两种或三种混色的LED，然后通过白光层6将这些颜色的光转变成白光，从而达到提高色域范围的目的。As shown in FIG. 4, further, a white light layer 6 is disposed between the PCB board 3 and the diffusion film 2, and the white light layer 6 is used to turn white light of various colors emitted by the LED chip light source 4 into white light. The selection range of the LED chip light source 4 is large, and when the white light layer 6 is not provided, only the LED chip light source that can emit white light can be selected. Specifically, the LED chip light source 4 may be provided with blue LEDs, red LEDs, green LEDs, red, green and blue, or two or three mixed colors of LEDs, and then the light of these colors is converted into white light by the white light layer 6. Thereby achieving the purpose of increasing the color gamut range.
具体地，所述LED芯片光源4可以采用以下排布方式：可以是并联排布（如图5所示），也可以是串联排布（如图6所示），或者串并混联排布（如图7所示），或者采用多个串并混联排布的LED芯片光源模块（如图8所示），均属于本发明提供的LED芯片光源4的应用范围；其中，串并混联排布的方可连接成当其中一个LED芯片光源4开路时，保证只有该LED芯片光源4不亮而不影响其他LED芯片光源4的正常工作。Specifically, the LED chip light source 4 can adopt the following arrangement: it can be arranged in parallel (as shown in FIG. 5), or can be arranged in series (as shown in FIG. 6), or can be arranged in series and in parallel. (As shown in FIG. 7), or an LED chip light source module (shown in FIG. 8) using a plurality of serial and parallel arrangement, all of which belong to the application range of the LED chip light source 4 provided by the present invention; The joint arrangement can be connected such that when one of the LED chip light sources 4 is open, it is ensured that only the LED chip light source 4 is not illuminated without affecting the normal operation of the other LED chip light sources 4.
进一步地，所述PCB板3的一面或两面设置有若干用于控制LED芯片光源4的电子元器件，以此来达到控制LED芯片光源4适应不同工作要求的目的。Further, one or both sides of the PCB board 3 are provided with a plurality of electronic components for controlling the LED chip light source 4, thereby achieving the purpose of controlling the LED chip light source 4 to meet different working requirements.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

Claims (9)

  1. 一种直下式超薄LED背光模组，包括LCD显示屏、扩散层及PCB板，所述PCB板表面设有反射层，其特征在于：所述PCB板上还设有若干未封装的LED芯片光源，所述LED芯片光源表面涂覆有可对该LED芯片光源发出的光线进行折射的材料。 The invention relates to a direct-type ultra-thin LED backlight module, which comprises an LCD display screen, a diffusion layer and a PCB board. The surface of the PCB board is provided with a reflective layer, and the PCB board is further provided with a plurality of unpackaged LED chips. A light source, the surface of the LED chip light source is coated with a material that refracts light emitted by the LED chip light source.
  2. 如权利要求1所述的直下式超薄LED背光模组，其特征在于：所述单个LED芯片光源表面通过点胶工艺涂有透明胶或荧光胶。The direct-type ultra-thin LED backlight module according to claim 1, wherein the surface of the single LED chip light source is coated with a transparent glue or a fluorescent glue by a dispensing process.
  3. 如权利要求2所述的直下式超薄LED背光模组，其特征在于：所述单个LED芯片光源表面通过喷涂工艺涂有透明胶或荧光胶。The direct-type ultra-thin LED backlight module according to claim 2, wherein the surface of the single LED chip light source is coated with a transparent glue or a fluorescent glue by a spraying process.
  4. 如权利要求1所述的直下式超薄LED背光模组，其特征在于：所述多个LED芯片光源表面通过灌胶工艺覆盖有透明胶层或荧光胶层。The direct-type ultra-thin LED backlight module of claim 1 , wherein the surface of the plurality of LED chip light sources is covered with a transparent adhesive layer or a fluorescent adhesive layer by a potting process.
  5. 如权利要求1所述的直下式超薄LED背光模组，其特征在于：所述扩散层上设有可将光线集中的增光层。The direct-type ultra-thin LED backlight module according to claim 1, wherein the diffusion layer is provided with a brightness enhancement layer for concentrating light.
  6. 如权利要求1所述的直下式超薄LED背光模组，其特征在于：所述PCB板为整体式结构，或者所述PCB板为两块或多块拼接式结构。The direct-type ultra-thin LED backlight module of claim 1 , wherein the PCB board has a monolithic structure, or the PCB board has two or more spliced structures.
  7. 如权利要求1所述的直下式超薄LED背光模组，其特征在于：所述PCB板与扩散膜之间设有一白光层，所述白光层用于将所述LED芯片光源发出的各种颜色的光变成白光。The direct-type ultra-thin LED backlight module of claim 1 , wherein a white light layer is disposed between the PCB board and the diffusion film, and the white light layer is used for emitting various light sources of the LED chip. The light of the color turns white.
  8. 如权利要求7所述的直下式超薄LED背光模组，其特征在于：所述LED芯片光源内设置有蓝色LED、红色LED、绿色LED、红绿蓝任两种或三种混色的LED。The direct-type ultra-thin LED backlight module according to claim 7, wherein the LED chip light source is provided with blue LED, red LED, green LED, red, green and blue, or two or three mixed colors. .
  9. 如权利要求1所述的直下式超薄LED背光模组，其特征在于：所述LED芯片光源的电路连接方式为串联、并联或串并混联。The direct-type ultra-thin LED backlight module of claim 1 , wherein the LED chip light source is connected in series, in parallel or in series and in parallel.
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