CN102147074A - Direct type ultrathin LED backlight module - Google Patents
Direct type ultrathin LED backlight module Download PDFInfo
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- CN102147074A CN102147074A CN2010101130606A CN201010113060A CN102147074A CN 102147074 A CN102147074 A CN 102147074A CN 2010101130606 A CN2010101130606 A CN 2010101130606A CN 201010113060 A CN201010113060 A CN 201010113060A CN 102147074 A CN102147074 A CN 102147074A
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- led
- led chip
- chip light
- light source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Abstract
The invention relates to a direct type ultrathin LED backlight module which is characterized in that unpackaged LED chip light sources are directly arranged on a PCB (Printed Circuit Board), then transparent glue or fluorescent glue is coated on the surface of one LED chip light source or a transparent glue layer or fluorescent glue layer is coated on the surfaces of a plurality of LED chip light sources, thus the same effect with the packaged LED chip light sources can be realized, the process of packaging the LED chip light sources in advance is reduced, the condition that an optical device is arranged on an LED for reducing the thickness of a backlight source is avoided, and cost is greatly saved. Meanwhile, light rays emitted by the LED chip light sources are refracted in the transparent glue layer or fluorescent glue layer, thus light-exiting surfaces of the light rays are increased; and by increasing the arrangement density of the LED chip light sources, the distance of the crossed light rays among the LED chip light sources is greatly reduced, thus the thickness of the backlight module can be greatly reduced to ensure that the scheme of the direct type ultrathin LED backlight module is realized.
Description
Technical field
The present invention relates to a kind of module backlight, relate in particular to a kind of straight-down negative ultra-thin LED module backlight, be applied to liquid crystal indicator field (as LCD TV, LCD etc.).
Background technology
Existing direct-light type LED backlight module, generally comprise LCD display, diffusion barrier and pcb board, pcb board is provided with the led light source after some encapsulation, after led light source emits beam, light becomes even, consistent behind diffusion barrier, shine on the LCD display equably then, thus the effect that realization is thrown light on to liquid crystal indicator.Though existing this module backlight is more common, but, because used LED power major part is more than 0.3 watt, so LED quantity lacking of each backlight with regard to usefulness, therefore its distribution density is just very little, the distance of the crosslights between the led light source is big, for the light that utilizes LED to send, will cause the thickness of module backlight bigger, be difficult to realize ultra-thinization, just must on LED, increase a lot of light refractions and optical reflection unit and want to make ultra-thin backlight source, cause cost very high; In addition, led light source all is through after the encapsulation, just can be used on the module backlight, and led light source is encapsulated, certainly will also can increase production cost, more important is that the light extraction efficiency of led light source also can partly be limited because the structural limitations of package support adds the refraction reflection unit that is increased, and causes cost height, efficient low.
Therefore, led chip directly not being produced on PCB in the prior art goes up and formation higher, low-cost, the high efficiency straight-down negative ultra-thin LED of LED distribution density module backlight.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of the needs that led chip is encapsulated, need refraction and reflective optical device be not set on the led chip, directly led chip is being produced on the PCB and form higher, low-cost, the high efficiency straight-down negative ultra-thin LED of LED distribution density module backlight.
The present invention realizes like this, a kind of straight-down negative ultra-thin LED module backlight, comprise LCD display, diffusion layer and pcb board, described pcb board surface is provided with the reflecting layer, also be provided with some not encapsulated LED chip light sources on the described pcb board, described led chip light source surface is coated with the material that can reflect the light that this led chip light source sends.
Particularly, described single led chip light source surface scribbles transparent adhesive tape or fluorescent glue by gluing process.
Particularly, described single led chip light source surface scribbles transparent adhesive tape or fluorescent glue by spraying coating process.
Particularly, described a plurality of led chip light sources surface is coated with substratum transparent or fluorescence glue-line by process for filling colloid into.
Further, described diffusion layer is provided with the lustre adding layer that light can be concentrated.
Particularly, described pcb board is a monolithic construction, and perhaps described pcb board is two or the spliced structure of polylith.
Further, be provided with a white light layer between described pcb board and the diffusion barrier, described white light layer is used for the versicolor light that described led chip light source sends is become white light.
Particularly, be provided with the LED of blue led, red LED, green LED, RGB any two or three kinds of colour mixtures in the described led chip light source.
Particularly, the circuit connecting mode of described led chip light source is series, parallel or string and series-parallel connection.
The direct not encapsulated LED chip light source of the present invention is arranged on the pcb board, then at single led chip light source surface-coated transparent adhesive tape or fluorescent glue, or at a plurality of led chip light source surface-coated substratum transparents or fluorescence glue-line, can realize and the prior same effect of encapsulated LED chip light source, reduced the technology that the led chip light source is encapsulated in advance, also avoided Optical devices being set on LED, provided cost savings greatly for reducing backlight thickness; Simultaneously, after the light that the led chip light source sends reflects in transparent adhesive tape or substratum transparent, increased the exiting surface of light, add the present invention by increasing the density of arranging of led chip light source, the distance of the crosslights between the led chip light source is reduced significantly, thereby can reduce module thickness backlight greatly, make the scheme of the ultra-thin module backlight of straight-down negative LED be achieved; Because the present invention has significantly reduced the optical loss that is brought by other light refraction and reflection unit, has improved light utilization greatly.
Description of drawings
Fig. 1 is the schematic diagram that led chip light source surface that the embodiment of the invention provides scribbles the module backlight of transparent adhesive tape;
Fig. 2 is the schematic diagram that led chip light source surface that the embodiment of the invention provides scribbles the module backlight of fluorescent glue;
Fig. 3 is the schematic diagram that led chip light source surface that the embodiment of the invention provides is coated with the module backlight of fluorescence glue-line;
Fig. 4 is a schematic diagram of setting up a white light layer between the pcb board of the module backlight in Fig. 2 and the diffusion barrier;
Fig. 5 is the schematic diagram that led chip light source parallel connection that the embodiment of the invention provides is arranged;
Fig. 6 is the schematic diagram of the led chip light source series arrangement that provides of the embodiment of the invention;
Fig. 7 is the led chip light source parallel connection that provides of the embodiment of the invention, the schematic diagram that series combination is arranged;
Fig. 8 be the embodiment of the invention comprising of providing a plurality of and string in conjunction with the schematic diagram of the led chip light source module of arranging.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
As Fig. 1～shown in Figure 3, the straight-down negative ultra-thin LED module backlight that the embodiment of the invention provides, comprise LCD display 1, diffusion barrier 2 and pcb board 3, described pcb board 3 is provided with some not encapsulated LED chip light sources 4, the material that described led chip light source 4 surface-coated can reflect the light that this led chip light source 4 sends.
Particularly, described single led chip light source 4 surfaces are coated with transparent adhesive tape 41 (as shown in Figure 1) or fluorescent glue 42 (as shown in Figure 2) by a glue or spraying coating process, and described transparent adhesive tape 41 can be a silica gel.
Perhaps, be coated with substratum transparent (not shown) or fluorescence glue-line 5 (as shown in Figure 3) by process for filling colloid on described a plurality of led chip light source 4.
The direct not encapsulated LED chip light source 4 of the present invention is contained on the pcb board 3, then at single led chip light source 4 surface-coated transparent adhesive tapes 41 or fluorescent glue 42, or on a plurality of led chip light sources 4, apply substratum transparent or fluorescence glue-line 5, can realize and the prior same effect of encapsulated LED chip light source, reduced the technology that the led chip light source is encapsulated in advance, also avoided Optical devices being set on LED, provided cost savings greatly for reducing backlight thickness; Simultaneously, after the light that led chip light source 4 sends reflects in transparent adhesive tape or substratum transparent 5, increased the exiting surface of light, add the present invention by increasing the density of arranging of led chip light source 4, the distance of the crosslights between the led chip light source 4 is reduced significantly, thereby can reduce module thickness backlight greatly, make the scheme of the ultra-thin module backlight of straight-down negative LED be achieved; Because the present invention has significantly reduced the optical loss that is brought by other light refraction and reflection unit, has improved light utilization greatly.
Further, also the lustre adding layer (not shown) can be set on the described diffusion layer 2, this lustre adding layer is used for light is concentrated, and improves brightness.
Particularly, described pcb board 3 is monoblock type or spliced structure, the pcb board 3 of the present invention preferred two or the spliced structure of polylith (as Fig. 1～shown in Figure 4), like this, the size of pcb board 3 just can standardization, and can produce in enormous quantities, during assembling, according to required size a plurality of standardized pcb boards 3 are stitched together, have improved efficiency of assembling greatly, significantly reduced production cost.
As shown in Figure 4, further, be provided with a white light layer 6 between described pcb board 3 and the diffusion barrier 2, described white light layer 6 is used for the versicolor light that led chip light source 4 sends is become white light, like this, the range of choice of led chip light source 4 is just very big, and when white light layer 6 is not set, can only select to send the led chip light source of white light.Particularly, can be provided with the LED of blue led, red LED, green LED, RGB any two or three kinds of colour mixtures in the described led chip light source 4, by white light layer 6 light of these colors is transformed into white light then, thereby reach the purpose that improves gamut range.
Particularly, described led chip light source 4 can adopt following arrangement mode: can be that parallel connection is arranged (as shown in Figure 5), it also can be series arrangement (as shown in Figure 6), perhaps string and series-parallel connection are arranged (as shown in Figure 7), the led chip light source module (as shown in Figure 8) that perhaps adopts a plurality of strings and series-parallel connection to arrange all belongs to the range of application of led chip light source 4 provided by the invention; Wherein, string and can connecting into of arranging of series-parallel connection guarantee to have only this led chip light source 4 not work and the operate as normal that do not influence other led chip light sources 4 when one of them led chip light source 4 open circuits.
Further, the one or both sides of described pcb board 3 are provided with some electronic devices and components that are used to control led chip light source 4, reach the purpose that control led chip light source 4 adapts to the different operating requirement with this.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. straight-down negative ultra-thin LED module backlight, comprise LCD display, diffusion layer and pcb board, described pcb board surface is provided with the reflecting layer, it is characterized in that: also be provided with some not encapsulated LED chip light sources on the described pcb board, described led chip light source surface is coated with the material that can reflect the light that this led chip light source sends.
2. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: described single led chip light source surface scribbles transparent adhesive tape or fluorescent glue by gluing process.
3. straight-down negative ultra-thin LED as claimed in claim 2 module backlight is characterized in that: described single led chip light source surface scribbles transparent adhesive tape or fluorescent glue by spraying coating process.
4. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: described a plurality of led chip light sources surface is coated with substratum transparent or fluorescence glue-line by process for filling colloid into.
5. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: described diffusion layer is provided with the lustre adding layer that light can be concentrated.
6. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: described pcb board is a monolithic construction, and perhaps described pcb board is two or the spliced structure of polylith.
7. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: be provided with a white light layer between described pcb board and the diffusion barrier, described white light layer is used for the versicolor light that described led chip light source sends is become white light.
8. straight-down negative ultra-thin LED as claimed in claim 7 module backlight is characterized in that: the LED that is provided with blue led, red LED, green LED, RGB any two or three kinds of colour mixtures in the described led chip light source.
9. straight-down negative ultra-thin LED as claimed in claim 1 module backlight is characterized in that: the circuit connecting mode of described led chip light source is series, parallel or string and series-parallel connection.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101130606A CN102147074A (en) | 2010-02-10 | 2010-02-10 | Direct type ultrathin LED backlight module |
| PCT/CN2010/070884 WO2011097834A1 (en) | 2010-02-10 | 2010-03-05 | Direct ultra-thin led backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101130606A CN102147074A (en) | 2010-02-10 | 2010-02-10 | Direct type ultrathin LED backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102147074A true CN102147074A (en) | 2011-08-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101130606A Pending CN102147074A (en) | 2010-02-10 | 2010-02-10 | Direct type ultrathin LED backlight module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102147074A (en) |
| WO (1) | WO2011097834A1 (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102890365A (en) * | 2012-10-22 | 2013-01-23 | 华南理工大学 | Direct-downward type LED (Liquid Crystal Display) liquid crystal module |
| CN103075684A (en) * | 2013-01-09 | 2013-05-01 | 东莞市新东方光电技术有限公司 | LED (Light-emitting Diode) backlight module |
| CN103137823A (en) * | 2011-11-24 | 2013-06-05 | 展晶科技(深圳)有限公司 | Light-emitting diode and direct type backlight using same |
| CN103604067A (en) * | 2013-11-19 | 2014-02-26 | 惠州市华瑞光源科技有限公司 | Television and direct-lit backlight module |
| WO2014040306A1 (en) * | 2012-09-11 | 2014-03-20 | 深圳市华星光电技术有限公司 | Direct-lit backlight module |
| WO2016106924A1 (en) * | 2014-12-31 | 2016-07-07 | 深圳市华星光电技术有限公司 | White light led module |
| CN107355691A (en) * | 2017-08-26 | 2017-11-17 | 重庆门里科技有限公司 | A kind of ultra-thin face shape light-source structure |
| CN108594528A (en) * | 2018-04-28 | 2018-09-28 | 合肥京东方视讯科技有限公司 | A kind of down straight aphototropism mode set, display device and preparation method thereof |
| CN110361891A (en) * | 2019-07-29 | 2019-10-22 | 武汉华星光电技术有限公司 | Backlight module |
| CN111240094A (en) * | 2020-03-12 | 2020-06-05 | 京东方科技集团股份有限公司 | Area light source |
| WO2020199251A1 (en) * | 2019-04-01 | 2020-10-08 | 深圳市华星光电半导体显示技术有限公司 | Backlight module and manufacturing method therefor |
| CN111965891A (en) * | 2020-08-05 | 2020-11-20 | 武汉华星光电技术有限公司 | LED lamp panel, spliced LED lamp panel and display device |
| CN112684631A (en) * | 2019-10-18 | 2021-04-20 | 群创光电股份有限公司 | Display device |
| CN114613268A (en) * | 2022-03-09 | 2022-06-10 | 深圳市南极光电子科技股份有限公司 | Backlight source, backlight module and display |
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| CN107315278B (en) * | 2017-07-14 | 2023-03-31 | 深圳市英达通电子有限公司 | Production method of ultrathin high-brightness LED backlight |
| CN108332109A (en) * | 2018-03-15 | 2018-07-27 | 江西申安亚明光电科技有限公司 | A kind of ultra-thin direct-injection type panel light |
| CN113927804B (en) * | 2021-09-18 | 2023-11-07 | 东莞阿尔泰显示技术有限公司 | Glue filling die of LED display module |
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Cited By (19)
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| CN103137823A (en) * | 2011-11-24 | 2013-06-05 | 展晶科技(深圳)有限公司 | Light-emitting diode and direct type backlight using same |
| CN103137823B (en) * | 2011-11-24 | 2015-10-07 | 展晶科技(深圳)有限公司 | Light-emitting diode and apply the direct-light-type backlight of this light-emitting diode |
| WO2014040306A1 (en) * | 2012-09-11 | 2014-03-20 | 深圳市华星光电技术有限公司 | Direct-lit backlight module |
| CN102890365A (en) * | 2012-10-22 | 2013-01-23 | 华南理工大学 | Direct-downward type LED (Liquid Crystal Display) liquid crystal module |
| CN103075684A (en) * | 2013-01-09 | 2013-05-01 | 东莞市新东方光电技术有限公司 | LED (Light-emitting Diode) backlight module |
| CN103604067A (en) * | 2013-11-19 | 2014-02-26 | 惠州市华瑞光源科技有限公司 | Television and direct-lit backlight module |
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| WO2016106924A1 (en) * | 2014-12-31 | 2016-07-07 | 深圳市华星光电技术有限公司 | White light led module |
| CN107355691A (en) * | 2017-08-26 | 2017-11-17 | 重庆门里科技有限公司 | A kind of ultra-thin face shape light-source structure |
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| CN114613268A (en) * | 2022-03-09 | 2022-06-10 | 深圳市南极光电子科技股份有限公司 | Backlight source, backlight module and display |
| CN114613268B (en) * | 2022-03-09 | 2024-01-23 | 深圳市南极光电子科技股份有限公司 | Backlight source, backlight module and display |
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|---|---|
| WO2011097834A1 (en) | 2011-08-18 |
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