CN114220899A - Mini LED lamp bead, backlight module and display device - Google Patents
Mini LED lamp bead, backlight module and display device Download PDFInfo
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- CN114220899A CN114220899A CN202111281837.4A CN202111281837A CN114220899A CN 114220899 A CN114220899 A CN 114220899A CN 202111281837 A CN202111281837 A CN 202111281837A CN 114220899 A CN114220899 A CN 114220899A
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- led lamp
- lamp bead
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- 239000011324 bead Substances 0.000 title claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 claims abstract description 29
- 238000005530 etching Methods 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 238000009792 diffusion process Methods 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000005538 encapsulation Methods 0.000 abstract description 12
- 239000011049 pearl Substances 0.000 description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
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- 229910002027 silica gel Inorganic materials 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
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- 238000004020 luminiscence type Methods 0.000 description 6
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- 238000002360 preparation method Methods 0.000 description 3
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
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- 238000011049 filling Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 238000003756 stirring Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention belongs to the field of display devices, and particularly relates to a Mini LED lamp bead, a backlight module and a display device. The Mini LED chip is arranged on the bracket; the packaging glue is arranged on the support and wraps the Mini LED chip, an etching area is arranged on the outer surface of the packaging glue, and the etching area reflects part of light rays emitted by the Mini LED chip and transmits the part of light rays emitted by the Mini LED chip. This Mini LED lamp pearl utilizes the interior rough surface of sculpture region to reflect the partial light that Mini LED chip sent, partial light transmits, make the place outside the light-emitting angle that Mini LED chip originally also have the light to jet out, the light-emitting angle of lamp pearl has been increased, because the sculpture region of encapsulation surface can not lead to the fact light to shelter from, can not reduce the luminous luminance of lamp pearl, thereby realize the light-emitting angle that increases the lamp pearl when not reducing Mini LED lamp pearl luminance, reduce backlight unit's manufacturing cost.
Description
Technical Field
The invention relates to the technical field of display devices, in particular to a Mini LED lamp bead, a backlight module and a display device.
Background
With the rapid development of the Mini LED display technology, the Mini LED display products have been applied to ultra-large screen high definition display, such as monitoring and commanding, high definition broadcasting, high-end cinema, medical diagnosis, advertisement display, conference exhibition, office display, virtual reality and other fields.
Traditional LED lamp pearl light-emitting angle is about 120, and light-emitting angle is less, need set up more LED lamp pearl when being applied to backlight unit and just can realize better light-emitting effect. For the angle of light-emitting of enlarging lamp pearl among the correlation technique, as shown in fig. 6, plate one deck reflectance coating 20 at the top surface of luminescence chip 10 usually, reflectance coating 20 can weaken luminescence chip 10 top light-emitting, make more light through luminescence chip 10 side and jet out, and then the angle of light-emitting of increase lamp pearl, but reflectance coating 20 has reduced the light-emitting luminance of lamp pearl by a wide margin when enlarging the angle of light-emitting of lamp pearl, lead to the lamp pearl quantity that backlight unit needs to set up to increase, manufacturing cost has been increased.
Disclosure of Invention
The embodiment of the invention provides a Mini LED lamp bead, a backlight module and a display device, and aims to increase the light-emitting angle of the lamp bead and reduce the production cost of the backlight module while not reducing the brightness of the Mini LED lamp bead.
To achieve the above object, the present invention provides a method comprising:
therefore, according to an aspect of the present application, a Mini LED lamp bead is provided, including:
a support;
the Mini LED chip is arranged on the bracket; and
the packaging glue is arranged on the support and wraps the Mini LED chip, an etching area is arranged on the outer surface of the packaging glue, and the etching area reflects part of light rays emitted by the Mini LED chip and transmits the part of light rays emitted by the Mini LED chip.
Optionally, the surface roughness Ra of the etched area is 1.5-6 μm.
Optionally, an offset of the center of the etched region and the center of the Mini LED chip in a direction perpendicular to the light exit side of the Mini LED chip is less than 300 μm.
Optionally, the area of the etching region is larger than the area of the light exit side of the Mini LED chip and smaller than four times the area of the light exit side of the Mini LED chip.
Optionally, the shape of the etching area is a polygon or a circle or an ellipse.
Optionally, the support is provided with a containing groove, the Mini LED chip is arranged at the bottom of the containing groove, and the containing groove is filled and sealed with the packaging glue.
Optionally, one side of the packaging adhesive facing the opening of the accommodating groove is a plane or an arc surface.
Optionally, the arc surface is recessed inward or protruded outward relative to the accommodating groove.
According to another aspect of the present application, there is provided a backlight module including:
the Mini LED lamp bead is described above;
the Mini LED lamp beads are arranged on the PCB, and the Mini LED chip is electrically connected to the PCB; the diffusion plate is arranged on one side, away from the PCB, of the Mini LED lamp beads; and
the optical diaphragm is arranged on one side of the diffusion plate, which deviates from the Mini LED lamp beads.
According to another aspect of the present application, a display device is provided, which includes the backlight module.
The application provides a Mini LED lamp pearl, backlight unit and display device's beneficial effect lies in: compared with the prior art, this application Mini LED lamp pearl sets up the sculpture region through the surface at the encapsulation is glued, utilize the interior rough surface of sculpture region to reflect the partial light that Mini LED chip sent, partial light transmits, make the original light-emitting angle of Mini LED chip place beyond also have the light to jet out, the light-emitting angle of lamp pearl has been increased, because the sculpture region of encapsulation glue surface can not lead to the fact light to shelter from, can not reduce the luminous luminance of lamp pearl, thereby realize the light-emitting angle of increase lamp pearl when not reducing Mini LED lamp pearl luminance, reduce backlight unit's manufacturing cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
fig. 1 is a schematic structural diagram of a Mini LED lamp bead according to an embodiment of the present invention;
fig. 2 is a schematic light-emitting diagram of a Mini LED lamp bead according to an embodiment of the present invention;
fig. 3 is schematic diagrams of different shapes of etched regions on the outer surface of the packaging adhesive of the Mini LED lamp bead according to an embodiment of the present invention;
fig. 4 is a schematic view of a preparation process of a Mini LED lamp bead according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a backlight module according to an embodiment of the invention;
fig. 6 is a schematic diagram of a structure and light emission of an LED lamp bead in the related art.
Description of the main element symbols:
10. a light emitting chip;
20. a reflective film;
100. a support; 101. a containing groove;
200. a Mini LED chip;
300. packaging glue;
400. etching the area;
500. a PCB board;
600. a diffusion plate;
700. an optical film.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Just as record in the background art, traditional LED lamp pearl light-emitting angle is about 120, and light-emitting angle is less, need set up more LED lamp pearl when being applied to backlight unit and just can realize better light-emitting effect. For the angle of light-emitting of enlarging lamp pearl among the correlation technique, as shown in fig. 6, plate one deck reflectance coating 20 at the top surface of luminescence chip 10 usually, reflectance coating 20 can weaken luminescence chip 10 top light-emitting, make more light through luminescence chip 10 side and jet out, and then the angle of light-emitting of increase lamp pearl, but reflectance coating 20 has reduced the light-emitting luminance of lamp pearl by a wide margin when enlarging the angle of light-emitting of lamp pearl, lead to the lamp pearl quantity that backlight unit needs to set up to increase, manufacturing cost has been increased.
In order to solve the above problem, according to an aspect of the present application, an embodiment of the present application provides a Mini LED lamp bead, which increases a light-emitting angle without reducing light-emitting brightness, and when the Mini LED lamp bead is applied to a backlight module, the number of used lamp beads can be reduced, and the production cost of the backlight module can be reduced.
In the embodiment of the invention, as shown in fig. 1-2, the Mini LED lamp bead comprises a bracket 100, a Mini LED chip 200 and a packaging adhesive 300. The Mini LED chip 200 is arranged on the support 100, the packaging adhesive 300 is arranged on the support 100 and wraps the Mini LED chip 200, an etching area 400 is arranged on the outer surface of the packaging adhesive 300, and the etching area 400 reflects part of light rays emitted by the Mini LED chip 200 and transmits the part of light rays emitted by the Mini LED chip 200.
This Mini LED lamp pearl sets up sculpture region 400 through the surface at packaging adhesive 300, utilize the interior coarse surface of sculpture region 400 to reflect the partial light that Mini LED chip 200 sent, partial light transmits, make the place outside the light-emitting angle that Mini LED chip 200 originally also have the light to jet out, the light-emitting angle of lamp pearl has been increased, because the sculpture region 400 of packaging adhesive 300 surface can not lead to the fact the light to shelter from, can not reduce the luminous luminance of lamp pearl, thereby realize the light-emitting angle of increase lamp pearl when not reducing Mini LED lamp pearl luminance, reduce backlight unit's manufacturing cost.
It can be understood that the Mini LED chip 200 can be a blue GaN chip, the wavelength of the emitted light is 430-470nm, or a red LED chip, a white LED chip or other light LED chips. The packaging adhesive 300 may be a transparent adhesive such as a silicon adhesive or an epoxy adhesive. The etched region 400 may be formed by laser machining with a gas laser, such as a carbon dioxide laser.
In one embodiment, as shown in FIGS. 1-2, the etched region 400 has a surface roughness Ra of 1.5-6 μm.
The surface roughness Ra of the etched region 400 is set to 1.5-6 μm, and a large light emission brightness and light emission angle can be achieved. Meanwhile, the purpose of flexibly controlling the light-emitting angle of the Mini LED lamp bead can be realized by changing the surface roughness Ra of the etching area 400 during processing.
In one embodiment, as shown in fig. 1-2, the center of the etched area 400 and the center of the Mini LED chip 200 are offset by less than 300 μm in a direction perpendicular to the light exit side of the Mini LED chip 200.
It can be understood that the light emitted from the middle of the Mini LED chip 200 is generally concentrated, the offset between the center of the etching area 400 and the center of the Mini LED chip 200 in the direction perpendicular to the light emitting side of the Mini LED chip 200 is designed to be less than 300 μm, so that more light can be reflected and refracted through the etching area 400, the light emitting angle of the lamp bead is better improved, and the light emitting brightness of the whole Mini LED lamp bead in all directions is more uniform.
In a specific embodiment, as shown in fig. 1-2, the area of the etched area 400 is greater than the area of the light exit side of the Mini LED chip 200 and less than four times the area of the light exit side of the Mini LED chip 200.
It should be noted that if the area of the etching region 400 is too small, the effect of improving the light-emitting angle cannot be achieved, and if the area of the etching region 400 is too large, the cost of the etching process is increased, thereby increasing the production cost of the Mini LED chip 200.
In this embodiment, the area of the etching region 400 is designed to be 1-4 times the area of the light emitting side of the Mini LED chip 200, which not only ensures a large light emitting angle, but also reduces the production cost of the Mini LED lamp bead.
In some embodiments, as shown in fig. 1-3, the etched region 400 is polygonal or circular or elliptical in shape.
The shape of the display device that backlight unit used is different to the display screen is the example, has different shapes such as rectangle, circular, to the display device of different shapes, chooses for use the Mini LED lamp pearl of different shapes sculpture region 400, can realize backlight display effect better.
As shown in fig. 3, the shape of the etching region 400 may be formed by a surface directly or by a scattered point distribution, and besides the above-mentioned polygon, circle or ellipse, the shape of the etching region 400 may be designed into other irregular patterns according to the shape of the backlight module.
In one embodiment, as shown in fig. 1-2, the bracket 100 is provided with a receiving groove 101, the Mini LED chip 200 is disposed at the bottom of the receiving groove 101, and the packaging adhesive 300 fills and seals the receiving groove 101.
In this embodiment, the accommodating groove 101 is disposed on the support 100, and the Mini LED chip 200 and the packaging adhesive 300 are both disposed in the accommodating groove, so that light emitted from the Mini LED chip 200 can be emitted through the opening of the accommodating groove 101, and it is ensured that the light-emitting angle of the Mini LED chip 200 is enlarged by the etching area 400 on the packaging adhesive 300. In addition, the packaging adhesive 300 fills the accommodating groove and wraps the Mini LED chip 200, so that a better protection effect can be provided for the Mini LED chip 200.
Specifically, the receiving groove may be cylindrical or truncated cone-shaped. Further, for realizing better light-emitting effect, the design of holding tank is the round platform shape in this embodiment, the tank bottom diameter of holding tank is less than its opening diameter, from this design, make support 100 bottom thickness big, thereby strengthen support 100's support intensity, guarantee Mini LED chip 200 and the stability of encapsulation glue 300 in the holding tank, and simultaneously, because the opening diameter of holding tank is greater than its tank bottom diameter, and encapsulation glue 300 is located Mini LED chip 200 towards the opening one side of holding tank, consequently encapsulation glue 300 can be more comprehensive cover the light-emitting side of Mini LED chip 200, thereby guarantee the increase to Mini LED chip 200 light-emitting angle.
The support 100 can adopt an existing common support (such as a 2835 support or a 3030 support), so that the Mini LED lamp bead can directly use the existing common support during manufacturing, and the production cost is further reduced.
In order to further improve the light-emitting angle and the light-emitting brightness, the support 100 in this embodiment may also be a transparent support. Thus, the light reflected from the etching region 400 can directly exit through the support 100 to emit light, thereby increasing the light-emitting angle.
In an embodiment, a side of the encapsulation adhesive 300 facing the opening of the receiving groove 101 is a plane or a curved surface.
Set to the cambered surface through the open-ended one side that will encapsulate gluey 300 towards storage tank 101, can enough increase the light-emitting angle of light, can also carry out spotlight to the light that Mini LED chip 200 sent for most light can jet out through encapsulation gluey 300, has reduced light loss, has improved the luminance of light-emitting. When the LED lamp beads are applied to the backlight module, the using number of Mini LED lamp beads can be reduced, and further the production cost is reduced.
In a more specific embodiment, the arc surface is recessed inward or protruded outward relative to the receiving groove 101.
Specifically, the encapsulation adhesive 300 may be injection-molded silicone, which has high viscosity and is easy to shape, and the arc surface that is concave inward or convex outward relative to the accommodating groove 101 may be realized by a mold or by a dispensing process.
In the present embodiment, as shown in fig. 1-2, a side of the encapsulation adhesive 300 facing the opening of the receiving slot 101 is a spherical arc surface protruding outward relative to the receiving slot 101.
The preparation process of the Mini LED lamp bead is briefly described below by taking, as an example, a side of the packaging adhesive 300 facing the opening of the accommodating groove 101 as a spherical arc surface protruding outward relative to the accommodating groove 101:
as shown in fig. 4, S1: die bonding, namely bonding a Mini LED chip 200 on the LED packaging support 100, wherein the Mini LED chip 200 can be a forward chip or a flip chip;
s2: stirring the silica gel, wherein no filler is added into the silica gel;
s3: dispensing, namely filling the stirred silica gel in the accommodating groove 101 on the support 100 to form a spherical surface;
s4: baking, namely curing the silica gel at high temperature to form the packaging adhesive 300 in a positive baking mode;
s5: and etching, namely performing graphical etching on the outer surface of the packaging adhesive 300 corresponding to the Mini LED chip 200 by laser processing or other methods to form an etching area 400.
According to the Mini LED lamp bead with the structure, the existing conventional PLCC packaging technology can be adopted in the S1-S4 in the preparation process, the production cost is reduced, the functions of light reflection and refraction of the Mini LED chip 200 by utilizing the reflecting film in the related technology are transferred to the packaging adhesive 300 to be controlled, the light-emitting angle of the lamp bead can be flexibly controlled, and the light-emitting brightness of the lamp bead can not be reduced.
According to another aspect of the present application, an embodiment of the present application further provides a backlight module, as shown in fig. 5, the backlight module includes the Mini LED lamp bead, the PCB board 500, the diffusion plate 600, and the optical film 700. Mini LED lamp pearl sets up on PCB board 500, and Mini LED chip 200 electricity is connected in PCB board 500, and diffuser plate 600 sets up in one side that Mini LED lamp pearl deviates from PCB board 500, and optics diaphragm 700 sets up in one side that diffuser plate 600 deviates from Mini LED lamp pearl.
Because this backlight unit has adopted the Mini LED lamp pearl in the above-mentioned embodiment, consequently can reduce the quantity of Mini LED lamp pearl in the backlight unit, increase the interval between two adjacent Mini LED lamp pearls, reduce backlight unit's manufacturing cost.
Specifically, the PCB 500 may use an aluminum-based board or a BT board or an FR4 board. In this embodiment, the bracket 100 may be soldered to the PCB 500 using solder paste.
In another embodiment, the backlight module can be further formed by the following process flow:
s1. placing Mini LED chips 200 (which may be either face-up or flip-chip) on the PCB board 500;
s2, protecting the Mini LED chip 200 by dispensing silica gel (the height of the silica gel is 0.5-1.2mm, the diameter is 2.0-3.5mm, and the offset between the center of the silica gel and the center of the Mini LED chip 200 is less than 300 mu m);
s3. baking and curing the silica gel to form the packaging adhesive 300;
s4., and etching the outer surface of the packaging adhesive 300 corresponding to the MiniLED chip 200 by laser processing or other methods to form an etching area 400.
The production process of the backlight module omits the bracket 100, and the beneficial effects of the backlight module in the embodiment can be realized.
According to another aspect of the present application, an embodiment of the present application further provides a display device, including the backlight module described above.
The specific structure of the backlight module refers to the above embodiments, and since the display device adopts the technical scheme of the above embodiments, the backlight module has the beneficial effects brought by the technical scheme of the above embodiments, and is not repeated herein.
In summary, the Mini LED lamp bead, the backlight module and the display device provided in this embodiment have the following beneficial effects:
this application Mini LED lamp pearl sets up the sculpture region through the surface at the encapsulation is glued, utilize the interior rough surface of sculpture region to reflect the partial light that Mini LED chip sent, partial light transmits, make the place outside the light-emitting angle that Mini LED chip originally also have the light to jet out, the light-emitting angle of lamp pearl has been increased, because the sculpture region of encapsulation surface can not lead to the fact light to shelter from, can not reduce the luminous luminance of lamp pearl, thereby realize the light-emitting angle that increases the lamp pearl when not reducing Mini LED lamp pearl luminance, reduce backlight unit's manufacturing cost.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a Mini LED lamp pearl which characterized in that includes:
a support;
the Mini LED chip is arranged on the bracket; and
the packaging glue is arranged on the support and wraps the Mini LED chip, an etching area is arranged on the outer surface of the packaging glue, reflects part of light rays emitted by the Mini LED chip and transmits the part of light rays emitted by the Mini LED chip.
2. The Mini LED lamp bead of claim 1, wherein the etched region has a surface roughness Ra of 1.5-6 μm.
3. The Mini LED lamp bead of claim 1, wherein the offset between the center of the etched region and the center of the Mini LED chip in a direction perpendicular to the light exit side of the Mini LED chip is less than 300 μm.
4. The Mini LED lamp bead of claim 3, wherein the area of the etched region is greater than the area of the light exit side of the Mini LED chip and less than four times the area of the light exit side of the Mini LED chip.
5. The Mini LED lamp bead of claim 1, wherein the etched region is polygonal, circular or elliptical in shape.
6. The Mini LED lamp bead of claim 1, wherein the bracket is provided with a receiving groove, the Mini LED chip is disposed at the bottom of the receiving groove, and the receiving groove is filled and sealed by the packaging adhesive.
7. The Mini LED lamp bead of claim 6, wherein a side of the packaging adhesive facing the opening of the receiving groove is a flat surface or an arc surface.
8. The Mini LED lamp bead of claim 7, wherein the curved surface is inwardly or outwardly concave with respect to the receiving groove.
9. A backlight module, comprising:
the Mini LED lamp bead of any one of claims 1-8;
the Mini LED lamp beads are arranged on the PCB, and the Mini LED chips are electrically connected to the PCB;
the diffusion plate is arranged on one side, away from the PCB, of the Mini LED lamp beads; and
and the optical membrane is arranged on one side of the diffusion plate, which deviates from the Mini LED lamp beads.
10. A display device comprising the backlight module according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111281837.4A CN114220899A (en) | 2021-11-01 | 2021-11-01 | Mini LED lamp bead, backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111281837.4A CN114220899A (en) | 2021-11-01 | 2021-11-01 | Mini LED lamp bead, backlight module and display device |
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| Publication Number | Publication Date |
|---|---|
| CN114220899A true CN114220899A (en) | 2022-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111281837.4A Pending CN114220899A (en) | 2021-11-01 | 2021-11-01 | Mini LED lamp bead, backlight module and display device |
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| CN (1) | CN114220899A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI822078B (en) * | 2022-06-02 | 2023-11-11 | 智崴資訊科技股份有限公司 | Led display device |
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| CN101271941A (en) * | 2007-03-20 | 2008-09-24 | 亚伯A.S. | Encapsulation colloid structure of LED |
| CN203644813U (en) * | 2013-09-29 | 2014-06-11 | 深圳市聚飞光电股份有限公司 | LED support, LED, and LED light bar |
| CN209926055U (en) * | 2019-05-10 | 2020-01-10 | Tcl华瑞照明科技（惠州）有限公司 | LED lamp bead and backlight module |
| CN212255964U (en) * | 2020-06-30 | 2020-12-29 | 惠州视维新技术有限公司 | Lamp bead, backlight module and display device |
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2021
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Application publication date: 20220322 |