CN209926055U

CN209926055U - LED lamp bead and backlight module

Info

Publication number: CN209926055U
Application number: CN201920674012.0U
Authority: CN
Inventors: 丁香荣; 邹英华; 段秋艳; 张国波
Original assignee: Huarui Photoelectric (huizhou) Co Ltd; TCL Very Lighting Technology Huizhou Co Ltd
Current assignee: Huarui Photoelectric (huizhou) Co Ltd; Very Optoelectronics Huizhou Co Ltd; TCL Very Lighting Technology Huizhou Co Ltd
Priority date: 2019-05-10
Filing date: 2019-05-10
Publication date: 2020-01-10
Anticipated expiration: 2029-05-10

Abstract

An LED lamp bead and a backlight module are provided, wherein the LED lamp bead comprises a bracket, an LED wafer and a packaging adhesive layer; the support comprises a substrate and transparent side walls arranged around the edge of the substrate, the transparent side walls are connected with the substrate, and mounting grooves are formed in the inner sides of the transparent side walls and the substrate; the LED wafer is arranged on the substrate and positioned in the mounting groove, and the LED wafer is electrically connected with the substrate; the packaging adhesive layer is arranged in the mounting groove and covers the LED wafer, and one surface of the packaging adhesive layer, back to the substrate, is in an optical lens shape. Above-mentioned LED lamp pearl and backlight unit, the axial light intensity that has reduced LED lamp pearl has just optimized light, has avoided LED lamp pearl too high at axial luminance to make LED lamp pearl obtain predetermined optical effect through the encapsulation glue film, avoid appearing the yellow spot problem on backlight unit's diffuser plate, and need not use lens again on LED lamp pearl, reduced manufacturing procedure, saved material and cost of labor.

Description

LED lamp bead and backlight module

Technical Field

The utility model relates to a LED technical field especially relates to a LED lamp pearl and backlight unit.

Background

The backlight module is one of the key components of the display device and is used for providing a backlight source for the display device. The current backlight module is a reflective backlight structure, specifically: the reflective backlight structure is manufactured by using a direct-emitting LED (light emitting Diode) lamp bead with a cup-shaped bracket, attaching the LED lamp bead on a Printed Circuit Board (Printed Circuit Board) Board by using an SMT (Surface Mount Technology) process to manufacture the LED lamp bead, and covering a reflective lens on the LED lamp bead to manufacture the reflective backlight structure. Most of the light emitted by the reflective backlight structure is emitted to the side surface through the action of the reflective lens, so that the purpose of uniform light emission is achieved when the light is emitted to a diffusion plate in the backlight module.

In the existing reflective backlight structure, most of light directly emitted by the LED lamp beads needs to be converted into light emitted from the side surface, a reflective lens needs to be used, so that the use of materials is increased, and in addition, the lens needs to be covered on the LED lamp beads, so that the production procedures are increased, and finally, the input of materials, labor and equipment is caused; in addition, the direct-emitting LED lamp beads have overhigh axial brightness, so that the yellow spots can be generated on the diffusion plate when the direct-emitting LED lamp beads are applied to the backlight module.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide an LED lamp bead and a backlight module aiming at the problem that the brightness of the existing LED lamp bead in the axial direction is too high and yellow spots appear on a diffusion plate when the LED lamp bead is applied to the backlight module.

An LED lamp bead comprises a support, an LED wafer and a packaging adhesive layer; the support comprises a substrate and transparent side walls arranged around the edge of the substrate, the transparent side walls are connected with the substrate, and mounting grooves are formed in the inner sides of the transparent side walls and the substrate; the LED wafer is arranged on the substrate and positioned in the mounting groove, and the LED wafer is electrically connected with the substrate; the packaging adhesive layer is arranged in the mounting groove and covers the LED wafer, and one surface of the packaging adhesive layer, back to the substrate, is in an optical lens shape.

In one embodiment, one surface of the encapsulation adhesive layer, which faces away from the substrate, protrudes from one surface of the transparent side wall, which is far away from the substrate.

In one embodiment, a surface of the encapsulation adhesive layer facing away from the substrate has a convex cup lens shape.

In one embodiment, a side of the encapsulation adhesive layer facing away from the substrate has a concave cup lens shape.

In one embodiment, the packaging adhesive layer is a transparent adhesive layer.

In one embodiment, phosphor particles are disposed within the clear adhesive layer.

In one embodiment, the phosphor particles are uniformly dispersed in the transparent adhesive layer.

In one embodiment, the transparent adhesive layer is also provided with diffusion powder particles.

In one embodiment, the diffusion powder particles are uniformly dispersed in the transparent adhesive layer.

A backlight module comprises the LED lamp bead in any one of the embodiments.

Above-mentioned LED lamp pearl and backlight unit, the side through setting up the support is transparent side wall, and cover the encapsulation glue film that the surface has the surface of optical lens shape on the LED wafer, make the side light that the LED wafer sent send from transparent side wall, most front light that the LED wafer sent evenly jets out through the class lens effect of encapsulation glue film, the axial light intensity that has reduced LED lamp pearl has just optimized light, it is too high to have avoided LED lamp pearl at axial luminance, and make LED lamp pearl obtain predetermined optical effect through the encapsulation glue film, avoid appearing the yellow spot problem on backlight unit's diffuser plate when using on backlight unit, and need not use lens again on LED lamp pearl, production processes have been reduced, material and cost of labor have been saved.

Drawings

FIG. 1 is a schematic structural diagram of an LED lamp bead of an embodiment;

FIG. 2 is a schematic structural diagram of an LED lamp bead of an embodiment;

FIG. 3 is a schematic structural diagram of an LED lamp bead of an embodiment;

FIG. 4 is a schematic structural diagram of an LED lamp bead of an embodiment;

FIG. 5 is a schematic structural diagram of an LED lamp bead of an embodiment;

FIG. 6 is a schematic structural diagram of an LED lamp bead of an embodiment;

FIG. 7 is a schematic structural diagram of an LED lamp bead of an embodiment;

FIG. 8 is a schematic structural diagram of an LED lamp bead of an embodiment;

fig. 9 is a schematic structural diagram of a backlight module according to an embodiment.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature. In addition, "upper" and "lower" in the present invention indicate only relative positions, and do not indicate absolute positions.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The application provides a LED lamp pearl, as shown in fig. 1, LED lamp pearl 10 includes: the LED chip packaging structure comprises a support 100, an LED chip 200 and a packaging adhesive layer 300; the support 100 comprises a substrate 110 and a transparent side wall 120 arranged around the edge of the substrate 110, wherein the transparent side wall 120 is connected with the substrate 110 and forms a mounting groove 101 on the inner side; the LED chip 200 is disposed on the substrate 110 and located in the mounting groove 101, and the LED chip 200 is electrically connected to the substrate 110; the packaging adhesive layer 300 is disposed in the mounting groove 101 and covers the LED chip 200, and a surface of the packaging adhesive layer 300 opposite to the substrate 110 has an optical lens shape. That is, the surface of the encapsulation adhesive layer 300 opposite to the substrate 110 has the same shape as the surface of the optical lens.

The LED lamp bead of this embodiment directly forms the encapsulation glue film that the shape of the one side of backing to the base plate is the same with optical lens's surface on the LED wafer, compares with prior art, need not again to match optical lens and use in whole LED lamp bead periphery, and need not set up solitary encapsulation glue film again on the LED wafer, has reduced the process, and has saved material and cost of labor.

In one embodiment, the substrate is an epoxy substrate, a ceramic substrate, or a copper foil substrate. Above-mentioned LED lamp pearl 10, the side through setting up support 100 is transparent side wall 120, and cover the encapsulation glue film 300 that the surface has the surface of optical lens shape on LED wafer 200, make the side light that LED wafer 200 sent send out from transparent side wall 120, most front light that LED wafer 200 sent evenly jets out through the class lens effect of encapsulation glue film 300, the axial light intensity of LED lamp pearl 10 has been reduced and light has been optimized, LED lamp pearl 10 has been avoided at the axial luminance too high, and make LED lamp pearl obtain predetermined optical effect through encapsulation glue film 300, avoid appearing the yellow spot problem on backlight unit's diffuser plate when using on backlight unit, and need not use lens on LED lamp pearl 10 again, production processes have been reduced, material and cost of labor have been saved.

In one embodiment, the transparent sidewall is made of a transparent polymer, for example, the polymer is at least one of PPA (Polyphthalamide), PCT (Poly1, 4-cycloheylenedimethylene terephthalate, Poly1, 4-cyclohexanedimethanol terephthalate), EMC (Epoxy molding compound), and SMC (Sheet molding compound). Specifically, the holder is formed by injection molding a polymer of a transparent material around the periphery of the substrate. In one embodiment, the mounting slot is a bowl-shaped slot. In one embodiment, the depth of the mounting groove is 0.55 mm. In one embodiment, the LED wafer is a positive mounting type wafer, the LED wafer is fixedly arranged on the substrate through die bonding insulating glue, and the surface of the LED wafer, which is far away from the substrate, is electrically connected with the substrate through a lead; in another embodiment, the LED chip is a flip chip, and the LED chip is fixedly disposed on the substrate by a conductive adhesive such as silver paste or solder paste and electrically connected to the substrate.

In order to make more light rays emitted from the transparent side walls to reduce the axial light intensity, in one embodiment, one surface of the packaging adhesive layer, which is opposite to the substrate, protrudes from one surface of the transparent side walls, which is far away from the substrate. Namely, the height of the encapsulation adhesive layer protruding from the surface of the substrate is greater than the height of the transparent side wall protruding from the surface of the substrate. Because the light that the LED wafer sent can follow the transparent adhesive layer and jet out after the surface of transparent adhesive layer from the transparent adhesive layer incidenting, and make light jet out from the transparent side wall and can reduce the axial light intensity, through making the surface protrusion of keeping away from the base plate of encapsulation glue film in the surface that the base plate was kept away from to the transparent side wall for more light jets out from the transparent side wall, further reduces the axial light intensity.

In one embodiment, a molding process is used to form the encapsulant layer having a surface with the shape of the optical lens. As shown in fig. 1, a surface of the encapsulation adhesive layer facing away from the substrate has a reflective lens shape; as shown in fig. 2, a surface of the encapsulation adhesive layer facing away from the substrate has a refractive lens shape; as shown in fig. 3, a surface of the encapsulation adhesive layer facing away from the substrate has a ball lens shape; as shown in fig. 4, a side of the encapsulation adhesive layer facing away from the substrate has a pointed lens shape; as shown in fig. 5, a surface of the encapsulation adhesive layer facing away from the substrate has a concave cup lens shape; as shown in fig. 6, a surface of the encapsulation adhesive layer facing away from the substrate has a peanut lens shape. Specifically, the process for forming the packaging adhesive layer by compression molding comprises the following steps: uniformly stirring and vacuumizing materials required by the packaging adhesive layer to form a glue mixture; injecting the glue mixture into a mold cavity with a preset shape; and curing and molding the glue mixture in the mold cavity into a packaging glue layer under the conditions of high temperature and high pressure. It should be noted that, the shape of the optical lens is the shape of the optical lens used in the backlight module in the prior art, that is, the shape of the existing lens, although the existing optical lens is disposed on the LED lamp bead and has a larger size than the encapsulating adhesive layer, the encapsulating adhesive layer has the same effect as the existing optical lens, and therefore, the optical path of the encapsulating adhesive layer with the surface having different lens shapes can refer to the optical path of the optical lens in the prior art. In one embodiment, a molding process is adopted to form a packaging adhesive layer with the surface having the shape of an optical lens, and when the packaging adhesive layer covers the LED wafer, the surface of the packaging adhesive layer far away from the substrate protrudes out of the surface of the transparent side wall far away from the substrate. The compression molding process is to form the packaging adhesive layer and then cover the packaging adhesive layer on the LED wafer, so that the packaging adhesive layer in any shape can be formed.

In another embodiment, a packaging adhesive layer with an optical lens shape on the surface is formed in the mounting groove by adopting a dispensing process. As shown in fig. 7, in one embodiment, a surface of the encapsulation adhesive layer facing away from the substrate has a shape of a convex-cup lens; as shown in fig. 8, in one embodiment, a surface of the encapsulation adhesive layer facing away from the substrate has a concave cup lens shape. Specifically, the process for forming the packaging adhesive layer by the dispensing process comprises the following steps: uniformly stirring and vacuumizing materials required by the packaging adhesive layer to form a glue mixture; injecting the glue mixture into a glue dispensing needle tube of a glue dispenser and setting glue amount; starting a dispenser to enable the glue mixture to be dispensed into the mounting groove from the glue dispensing needle tube to form a preset LED lamp bead; and curing and molding the glue of the LED lamp bead under the conditions of high temperature and high pressure to form a packaging glue layer. In the process of the dispensing process, by controlling the glue amount, when the glue amount is controlled to enable the glue mixture to overflow the mounting groove, the surface of the packaging glue layer is enabled to have a surface in the shape of a convex cup type lens, and when the glue amount is controlled to enable the glue mixture not to fill the mounting groove, the surface of the packaging glue layer is enabled to have a surface in the shape of a concave cup type lens. Because the dispensing process is to directly form the packaging adhesive layer on the LED wafer, only the packaging adhesive layer with the surface in the shape of a convex cup type lens or the packaging adhesive layer with the surface in the shape of a concave cup type lens can be formed.

In order to make the LED lamp bead obtain the light of the original color emitted by the LED chip, in one embodiment, the encapsulation adhesive layer is a transparent adhesive layer. Through setting up the encapsulation glue film into the transparent adhesive layer for the light that the LED wafer sent jets out with original light through the transparent adhesive layer, for example when the LED wafer sends the blue light, makes LED lamp pearl obtain the blue light. In one embodiment, the transparent adhesive layer is made of a high molecular polymer, in one embodiment, the transparent adhesive layer is made of silica gel, and in another embodiment, the transparent adhesive layer is made of silicone resin.

In order to convert the light emitted from the LED chip into white light, in one embodiment, phosphor particles are disposed in the transparent adhesive layer. Because the light emitted by the LED wafer is blue light generally, and the backlight source required by the backlight module is white light generally, the fluorescent powder particles are arranged on the first refractive adhesive layer and/or the second refractive adhesive layer, so that the light emitted by the LED wafer can be converted into the white light under the action of the fluorescent powder particles, and the white light is provided for the backlight module to be used as the backlight source. It should be noted that the matching of the LED chip converted into white light by the phosphor particles is the prior art, and is not described herein again. In one embodiment, the phosphor particles are uniformly dispersed in the transparent adhesive layer.

In order to make the light emitted by the LED chip emit more uniformly, in one embodiment, the transparent adhesive layer is provided with diffusing powder particles. Through setting up the diffusion powder granule for the effect of light process diffusion powder granule is more even jets out.

In order to convert the light emitted by the LED chip into uniform white light, in an embodiment, dustproof starch particles are further disposed in the transparent adhesive layer. Because the phosphor powder granule can take place to deposit in the glue film usually for the phosphor powder granule distributes inhomogeneously, causes LED light inhomogeneous after the effect of phosphor powder granule, like this, through setting up phosphor powder granule and dustproof starch granule at encapsulation glue film dispersion, avoids the phosphor powder granule to deposit in the glue film, makes the light that the LED wafer sent can convert into even white light under the effect of phosphor powder granule, provides backlight unit and does the backlight. It should be noted that the collocation of the fluorescent powder and the dustproof starch granule is the prior art, and is not described herein again. The application also provides a backlight module, the backlight module comprises the LED lamp bead as described in any one of the above.

Above-mentioned backlight unit, side through setting up the support is transparent side wall, and cover the encapsulation glue film that the surface has the surface of optical lens shape on the LED wafer, make the side light that the LED wafer sent send from transparent side wall, most front light that the LED wafer sent evenly jets out through the class lens effect of encapsulation glue film, the axial light intensity that has reduced LED lamp pearl has just optimized light, it is too high at axial luminance to have avoided LED lamp pearl, and make LED lamp pearl obtain predetermined optical effect through the encapsulation glue film, avoid the yellow spot problem appearing on backlight unit's diffuser plate, and need not use lens again on LED lamp pearl, production processes have been reduced, material and cost of labor have been saved.

In one embodiment, as shown in fig. 9, the backlight module 20 includes: light bar 400, back panel 500, and optical film assembly 600; the light bar 400 comprises a circuit board 410 and at least one LED lamp bead 10, and the LED lamp beads 10 are respectively arranged on the circuit board 410 at intervals; the back plate 500 is provided with a containing cavity 501, a light outlet is formed in one side of the containing cavity 501, the light bar 400 is arranged at the bottom of the containing cavity 501, and a light outlet surface of the LED lamp bead 10 faces the light outlet; the optical film assembly 600 covers the back plate 500 and closes the light outlet.

In order to reasonably set the distance between the optical film assembly and the packaging adhesive layer to further obtain uniform light and avoid the thickness of the backlight module from being too thick, in one embodiment, the distance between the optical film assembly and the packaging adhesive layer is less than 8 mm. Through setting up the distance between the adjacent optics diaphragm subassembly of optical diaphragm subassembly and second refraction glue film layer surface and being less than 8mm, rationally set up the distance of optics diaphragm subassembly to further obtain evenly ground light and avoid backlight unit's thickness too thick simultaneously.

In order to improve the light emitting effect of the backlight module, in one embodiment, the backlight module further includes a diffusion plate and a quantum dot film, the diffusion plate is covered on the back plate and closes the receiving groove, and the quantum dot film and the optical film are sequentially covered on the diffusion plate. Through set up diffuser plate and quantum dot diaphragm at backlight unit, make backlight unit's light-emitting effect better.

In order to enable the backlight module to obtain a larger irradiation range, in one embodiment, the number of the LED lamp beads is multiple, and the LED lamp beads are uniformly arranged on the circuit board at intervals. Because the general luminous angle of LED lamp pearl is 120, luminous scope is limited, through setting up a plurality of LED lamp pearls for backlight unit obtains bigger irradiation range.

In order to reasonably set an optical path after the plurality of LED lamp beads emit light together so as to enable the backlight module to emit light uniformly, in one embodiment, the distance between every two adjacent LED lamp beads is 0.2mm to 4 mm. Preferably, the distance between two adjacent LED lamp beads is 2 mm. Because the luminous angle of LED lamp pearl is only 120 usually, the light scope that sends between two adjacent LED lamp pearls can partially overlap, and LED lamp pearl is inconsistent toward different angle luminance, is 0.2mm to 4mm through setting up the distance between two adjacent LED lamp pearls, rationally sets up the optical path after a plurality of LED lamp pearls give off light jointly so that backlight unit light-emitting is even.

In order to enable the backlight module to form a surface light source so as to further obtain a larger irradiation range, in one embodiment, the number of the light bars is multiple, and the light bars are arranged at the bottom of the accommodating cavity at intervals in parallel. Because can only set up one row of LED lamp pearl in a lamp strip usually, can only form the line source, luminous scope is limited, through setting up a plurality of lamp strips for backlight unit forms the area source and in order to further obtain bigger irradiation range.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An LED lamp bead is characterized by comprising a support, an LED wafer and a packaging adhesive layer;

the support comprises a substrate and transparent side walls arranged around the edge of the substrate, the transparent side walls are connected with the substrate, and mounting grooves are formed in the inner sides of the transparent side walls and the substrate;

the LED wafer is arranged on the substrate and positioned in the mounting groove, and the LED wafer is electrically connected with the substrate;

the packaging adhesive layer is arranged in the mounting groove and covers the LED wafer, and one surface of the packaging adhesive layer, back to the substrate, is in an optical lens shape.

2. The LED lamp bead according to claim 1, wherein one surface of the packaging adhesive layer, which faces away from the substrate, protrudes from one surface of the transparent side wall, which is away from the substrate.

3. The LED lamp bead according to claim 1, wherein a surface of the encapsulation adhesive layer facing away from the substrate has a convex-cup lens shape.

4. The LED lamp bead according to claim 1, wherein a surface of the encapsulation adhesive layer facing away from the substrate has a concave-cup lens shape.

5. The LED lamp bead according to claim 1, wherein the encapsulation adhesive layer is a transparent adhesive layer.

6. The LED lamp bead according to claim 5, wherein phosphor particles are disposed in the transparent adhesive layer.

7. The LED lamp bead according to claim 6, wherein the phosphor particles are uniformly dispersed in the transparent adhesive layer.

8. The LED lamp bead according to claim 5, wherein diffusion powder particles are provided in the transparent adhesive layer.

9. The LED lamp bead according to claim 8, wherein the diffusion powder particles are uniformly dispersed in the transparent adhesive layer.

10. A backlight module, comprising the LED lamp bead of any one of claims 1 to 9.