CN209926056U

CN209926056U - LED lamp bead and backlight module

Info

Publication number: CN209926056U
Application number: CN201920678767.8U
Authority: CN
Inventors: 邹英华; 丁香荣; 张国波; 戴兆宇
Original assignee: Huarui Photoelectric (huizhou) Co Ltd; TCL Very Lighting Technology Huizhou Co Ltd
Current assignee: Huarui Photoelectric (huizhou) Co Ltd; Very Optoelectronics Huizhou Co Ltd; TCL Very Lighting Technology Huizhou Co Ltd
Priority date: 2019-05-10
Filing date: 2019-05-10
Publication date: 2020-01-10
Anticipated expiration: 2029-05-10

Abstract

The utility model relates to a LED lamp pearl and backlight unit, wherein, LED lamp pearl includes: the LED chip comprises a support, an LED chip and an encapsulation layer; the support comprises a substrate and transparent side walls arranged around the edge of the substrate, the transparent side walls are connected with the substrate, and mounting grooves are formed in the inner sides of the transparent side walls and the substrate; the LED wafer is arranged on the substrate and positioned in the mounting groove, and the LED wafer is electrically connected with the substrate; the packaging layer comprises a first refraction glue layer and a second refraction glue layer, the first refraction glue layer is arranged in the mounting groove and covers the LED wafer, the second refraction glue layer is arranged in the mounting groove and covers the first refraction glue layer, and the refractive index of the first refraction glue layer is larger than that of the second refraction glue layer. Above-mentioned LED lamp pearl has increased luminous angle, and has reduced the axial light intensity of LED lamp pearl, has avoided LED lamp pearl too high at axial luminance, avoids appearing the yellow spot problem on backlight unit's diffuser plate when using on backlight unit.

Description

LED lamp bead and backlight module

Technical Field

The utility model relates to a LED technical field especially relates to a LED lamp pearl and backlight unit.

Background

The backlight module is one of the key components of the display device and is used for providing a backlight source for the display device. The current backlight module is a reflective backlight structure, specifically: the reflective backlight structure is manufactured by using a direct-emitting LED (light emitting Diode) lamp bead with a cup-shaped bracket, attaching the LED lamp bead on a PCB (Printed Circuit Board) Board through an SMT (Surface Mount Technology) process to manufacture the LED lamp bead, and covering a reflective lens on the LED lamp bead to manufacture the reflective backlight structure. Most of the light emitted by the reflective backlight structure is emitted to the side surface through the action of the reflective lens, so that the purpose of uniform light emission is achieved when the light is emitted to a diffusion plate in the backlight module.

In the existing reflective backlight structure, most of light directly emitted by the LED lamp beads needs to be converted into light emitted from the side surface, a reflective lens needs to be used, so that the use of materials is increased, in addition, the lens needs to be covered on the LED lamp beads, the production process is increased, the investment of materials, labor and equipment is finally caused, and meanwhile, due to the use of the lens, the lens has a certain thickness and the light mixing distance, so that the backlight module is thicker as a whole; in addition, the direct-emitting LED lamp beads have overhigh axial brightness, so that the yellow spots can be generated on the diffusion plate when the direct-emitting LED lamp beads are applied to the backlight module.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide an LED lamp bead and a backlight module aiming at the problem that the brightness of the existing LED lamp bead in the axial direction is too high and yellow spots appear on a diffusion plate when the LED lamp bead is applied to the backlight module.

An LED lamp bead, comprising: the LED chip comprises a support, an LED chip and an encapsulation layer; the support comprises a substrate and transparent side walls arranged around the edge of the substrate, the transparent side walls are connected with the substrate, and mounting grooves are formed in the inner sides of the transparent side walls and the substrate; the LED wafer is arranged on the substrate and positioned in the mounting groove, and the LED wafer is electrically connected with the substrate; the packaging layer includes first refraction glue film and second refraction glue film, first refraction glue film sets up just cover in the mounting groove the LED wafer, the second refraction glue film sets up cover in the mounting groove on the first refraction glue film, wherein, the refracting index of first refraction glue film is greater than the refracting index of second refraction glue film.

In one embodiment, at least one of the first and second refractive glue layers is provided with phosphor particles.

In one embodiment, at least one of the first and second refractive glue layers is provided with diffusing powder particles.

In one embodiment, the ratio of the thickness of the first refraction glue layer to the thickness of the second refraction glue layer is (3-5): 1.

In one embodiment, the sum of the thickness of the first refraction adhesive layer and the thickness of the second refraction adhesive layer is smaller than the thickness of the transparent side wall protruding from the substrate.

In one embodiment, the encapsulation layer further includes a light blocking layer, and the light blocking layer is disposed in the mounting groove and covers the second refraction glue layer.

In one embodiment, the surface of the light blocking layer facing the substrate is adjacent to the surface of the transparent side wall away from the substrate.

In one embodiment, the sum of the thickness of the first refraction glue layer, the thickness of the second refraction glue layer and the thickness of the light blocking layer is greater than the thickness of the transparent side wall protruding from the substrate.

In one embodiment, the packaging layer further comprises a transparent adhesive layer in the shape of an optical lens, and the transparent adhesive layer is arranged in the mounting groove and covers the second refraction adhesive layer.

A backlight module comprises the LED lamp bead in any one of the embodiments.

Above-mentioned LED lamp pearl and backlight unit, through cover the higher first refraction glue film of refracting index and the lower second refraction glue film of refracting index in proper order on the LED wafer, make the side light that the LED wafer sent send from transparent side wall, most front light that the LED wafer sent gets into the lower light from the higher optical dense medium of refracting index in proper order and drew the medium emergence total reflection and also sent from transparent side wall, luminous angle has been increased, and the axial light intensity of LED lamp pearl has been reduced, it is too high to have avoided LED lamp pearl at axial luminance, avoid appearing the yellow spot problem on backlight unit's diffuser plate when using on backlight unit, and thereby the mixed light distance has been reduced backlight unit's thickness.

Drawings

FIG. 1 is a schematic structural diagram of an LED lamp bead of an embodiment;

FIG. 2 is a schematic structural diagram of another embodiment of an LED lamp bead;

FIG. 3 is a schematic structural diagram of a further embodiment of an LED lamp bead;

fig. 4 is a schematic view of light emission of the LED lamp bead according to an embodiment.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature. In addition, "upper" and "lower" in the present invention indicate only relative positions, and do not indicate absolute positions.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The application provides a LED lamp pearl, as shown in fig. 1, LED lamp pearl 10 includes: a support 100, an LED chip 200 and an encapsulation layer 300; the support 100 comprises a substrate 110 and a transparent side wall 120 arranged around the edge of the substrate 110, wherein the transparent side wall 120 is connected with the substrate 110 and forms a mounting groove 101 on the inner side; the LED chip 200 is disposed on the substrate 110 and located in the mounting groove 101, and the LED chip 200 is electrically connected to the substrate 110; the packaging layer 300 comprises a first refraction glue layer 310 and a second refraction glue layer 320, the first refraction glue layer 310 is arranged in the mounting groove 101 and covers the LED wafer 200, the second refraction glue layer 320 is arranged in the mounting groove 101 and covers the first refraction glue layer 310, wherein the refractive index of the first refraction glue layer 310 is larger than that of the second refraction glue layer 320. It should be noted that, the first refraction glue layer and the second refraction glue layer are both made of existing materials, which enable the refractive index of the formed first refraction glue layer to be larger than the refractive index of the formed second glue layer.

Referring to fig. 4, the LED lamp bead 10 is formed by sequentially covering the LED wafer 200 with the first refractive adhesive layer 310 having a higher refractive index and the second refractive adhesive layer 320 having a lower refractive index, so that the side light emitted from the LED wafer 200 is emitted from the transparent sidewall 120, most of the front light emitted from the LED wafer 200 sequentially enters the optically thinner medium having a lower refractive index from the optically denser medium having a higher refractive index to be totally reflected and also emitted from the transparent sidewall 120, thereby increasing the light emitting angle, reducing the axial light intensity of the LED lamp bead 10, avoiding the problem of yellow spots on the diffusion plate of the backlight module when the LED lamp bead 10 is applied to the backlight module, and reducing the light mixing distance to reduce the thickness of the backlight module.

In one embodiment, the substrate is an epoxy substrate, a ceramic substrate, or a copper foil substrate. In one embodiment, the transparent sidewall is made of a high molecular polymer made of a transparent material. Specifically, the holder is formed by injection molding a polymer of a transparent material around the periphery of the substrate. In one embodiment, the mounting slot is a bowl-shaped slot. In one embodiment, the depth of the mounting groove is 0.55 mm. In one embodiment, the LED wafer is a positive mounting type wafer, the LED wafer is fixedly arranged on the substrate through die bonding insulating glue, and the surface of the LED wafer, which is far away from the substrate, is electrically connected with the substrate through a lead; in another embodiment, the LED chip is a flip chip, and the LED chip is fixedly disposed on the substrate by a conductive adhesive such as silver paste or solder paste and electrically connected to the substrate. In one embodiment, the refractive index of the first refractive glue layer is 1.53 and the refractive index of the second refractive glue layer is 1.41. In one embodiment, the first refractive adhesive layer and the second refractive adhesive layer may be made of epoxy resin, silica gel, silicone resin, or the like. In one embodiment, the first refractive adhesive layer is made of epoxy resin, in one embodiment, the first refractive adhesive layer is made of silica gel, and in one embodiment, the first refractive adhesive layer is made of silicone resin; in one embodiment, the second refraction adhesive layer is made of epoxy resin, in one embodiment, the second refraction adhesive layer is made of silica gel, and in one embodiment, the second refraction adhesive layer is made of silicone resin.

In order to convert the light emitted from the LED chip into white light, in one embodiment, at least one of the first and second refractive adhesive layers is provided with phosphor particles. In one embodiment, the phosphor particles are uniformly dispersed and disposed in the first refractive glue layer and/or the second refractive glue layer. In one embodiment, the first refractive glue layer is provided with phosphor particles; in another embodiment, the second refraction glue layer is provided with phosphor particles; in another embodiment, the first and second refractive glue layers are both provided with phosphor particles. Because the light emitted by the LED wafer is blue light generally, and the backlight source required by the backlight module is white light generally, the fluorescent powder particles are arranged on the first refractive adhesive layer and/or the second refractive adhesive layer, so that the light emitted by the LED wafer can be converted into the white light under the action of the fluorescent powder particles, and the white light is provided for the backlight module to be used as the backlight source. It should be noted that the matching of the LED chip converted into white light by the phosphor particles is the prior art, and is not described herein again.

In order to make the light emitted by the LED chip emit more uniformly, in one embodiment, at least one of the first and second refraction glue layers is provided with diffusion powder particles. In one embodiment, the diffusion powder particles are uniformly dispersed in the first refraction glue layer and/or the second refraction glue layer. In one embodiment, the first refractive glue layer is provided with the diffusion powder particles; in another embodiment, the second refraction glue layer is provided with the diffusion powder particles; in another embodiment, the first and second refraction glue layers are both provided with the diffusion powder particles. Through setting up the diffusion powder granule for the effect of light process diffusion powder granule is more even jets out.

In order to convert the light emitted by the LED chip into uniform white light, in one embodiment, at least one of the first and second refraction glue layers is provided with phosphor particles and dustproof starch particles. In one embodiment, the phosphor particles and the dustproof starch particles are uniformly dispersed in the first refraction glue layer and/or the second refraction glue layer. In one embodiment, the first refraction glue layer is provided with phosphor particles and the dustproof starch particles; in another embodiment, the second refraction glue layer is provided with fluorescent powder particles and the dustproof starch particles; in another embodiment, the first refraction glue layer and the second refraction glue layer are both provided with fluorescent powder particles and dustproof starch particles. Because phosphor powder granule can take place to deposit in the glue film usually, make phosphor powder granule distribute inhomogeneously, cause LED light inhomogeneous after the effect of phosphor powder granule, like this, through set up phosphor powder granule and dustproof starch granule at first refraction glue film and/or second refraction glue film packing, avoid phosphor powder granule to deposit in the glue film, make the light that the LED wafer sent can convert into even white light under the effect of phosphor powder granule, provide backlight unit and do the backlight. It should be noted that the collocation of the fluorescent powder and the dustproof starch granule is the prior art, and is not described herein again.

In order to ensure the light emitting effect of the LED, in one embodiment, the ratio of the thickness of the first refraction glue layer to the thickness of the second refraction glue layer is (3-5): 1, namely, the height ratio of the surface distance of the first refraction glue layer to the bottom of the mounting groove to the surface distance of the second refraction glue layer to the bottom of the mounting groove is (3-5): 1. In one embodiment, a ratio of the thickness of the first refraction adhesive layer to the thickness of the second refraction adhesive layer is 4:1, that is, a height ratio of the surface of the first refraction adhesive layer to the bottom of the mounting groove to the surface of the second refraction adhesive layer to the bottom of the mounting groove is 4: 1. In one embodiment, the depth of the mounting groove is 0.55mm, the height of the surface of the first refraction glue layer from the bottom of the mounting groove is 0.44mm, and the height of the surface of the second refraction glue layer from the bottom of the mounting groove is 0.11 mm. Therefore, most of LED light rays are emitted from the first refractive glue layer with higher refractive index, and the light emitting effect of the LED is ensured.

In order to avoid the overflow of the second refraction adhesive layer during dispensing, in one embodiment, the sum of the thickness of the first refraction adhesive layer and the thickness of the second refraction adhesive layer is smaller than the thickness of the transparent side wall protruding from the substrate, that is, the surface of the second refraction adhesive layer away from the substrate does not protrude from the surface of the transparent side wall away from the substrate. Like this, can avoid the second to refract the gluey layer and spill over when the point is glued, simultaneously, through experimental proof for light is more even from smooth surface or slightly concave surperficial emission.

In order to avoid the LED light from being emitted from the front surface of the LED chip and further reduce the axial light intensity of the LED lamp bead, in one embodiment, as shown in fig. 2, the encapsulation layer 300 further includes a light blocking layer 330, and the light blocking layer 330 is disposed in the mounting groove 101 and covers the second refractive adhesive layer 320. Since the light blocking layer 330 is opaque, light cannot be emitted from the light blocking layer 330, and thus, the light is prevented from being emitted from the front surface of the LED chip 200 by arranging the light blocking layer 330 on the second refraction adhesive layer 320, and the axial light intensity of the LED lamp bead is further reduced.

In one embodiment, the light-blocking layer is a white light-blocking layer. In one embodiment, the white light blocking layer is formed by mixing transparent glue and white particles and then curing the mixture. For example, the transparent glue may be epoxy, silicone, and the like. For example, the white particulates are silica, titanium dioxide, calcium carbonate, boron nitride, barium sulfate, and the like.

In order to avoid excessive blocking light from the light blocking adhesive layer to be emitted from the transparent side wall, in one embodiment, the surface of the light blocking layer facing the substrate is disposed adjacent to the surface of the transparent side wall away from the substrate. Because the glue film that is in the light does not allow light to pass through, through making the glue film that is in the light towards the surface setting of the surface of base plate neighbouring base plate avoids the glue film that is in the light to block light and jets out from transparent side wall. The sum of the thickness of the first refraction adhesive layer, the thickness of the second refraction adhesive layer and the thickness of the light blocking layer is larger than the thickness of the transparent side wall protruding from the substrate. Therefore, the surface of the light blocking layer, which is far away from the substrate, is not lower than the surface of the transparent side wall, which is far away from the substrate, so that the light blocking adhesive layer has enough thickness, and the effect of the light blocking adhesive layer is ensured.

In order to obtain the required optical effect, in one embodiment, as shown in fig. 3, the encapsulation layer further includes a transparent adhesive layer 340 having an optical lens shape, and the transparent adhesive layer 340 is disposed in the mounting groove 101 and covers the second refractive adhesive layer 320. Specifically, the optical lens shape is an optical lens shape used in a backlight module in the related art, that is, an existing lens shape. For example, the optical lens shape is a reflective lens shape, for example, the optical lens shape is a refractive lens shape, for example, the optical lens shape is a ball lens shape, for example, the optical lens shape is a cusp lens shape, for example, the optical lens shape is a concave cup lens shape, for example, the optical lens shape is a peanut lens shape. In one embodiment, the transparent adhesive layer 340 is formed by a molding process using a transparent adhesive, that is, the transparent adhesive layer with different lens shapes is formed by different molds using a transparent adhesive. Therefore, the transparent adhesive layer 340 has a lens shape and has a refraction or reflection function of the lens, so that when the LED lamp bead is applied to the backlight module, the desired optical angle can be obtained without using the lens, and the desired optical effect can be obtained.

The application also provides a backlight module, the backlight module comprises the LED lamp bead as described in any one of the above.

Above-mentioned backlight unit, through cover the higher first refraction glue film of refracting index and the lower second refraction glue film of refracting index in proper order on the LED wafer, make the side light that the LED wafer sent send from transparent side wall, most front light that the LED wafer sent gets into the lower light from the higher dense medium of refracting index in proper order and drew the medium emergence total reflection and also sent from transparent side wall, luminous angle has been increased, and the axial light intensity of LED lamp pearl has been reduced, it is too high at axial luminance to have avoided LED lamp pearl, avoid the problem of macula lutea appearing on backlight unit's diffuser plate, thereby and reduced mixed light distance and reduced backlight unit's thickness.

In one embodiment, the backlight module includes: a light bar, a back plate and an optical diaphragm assembly; the lamp strip comprises a PCB and at least one LED lamp bead, and the LED lamp beads are respectively arranged on the PCB at intervals; the back plate is provided with a containing cavity, a light outlet is formed in one side of the containing cavity, the light bar is arranged at the bottom of the containing cavity, and the light emitting surface of the LED lamp bead faces the light outlet; the optical diaphragm assembly covers the back plate and seals the light outlet.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a LED lamp pearl which characterized in that, LED lamp pearl includes: the LED chip comprises a support, an LED chip and an encapsulation layer;

the support comprises a substrate and transparent side walls arranged around the edge of the substrate, the transparent side walls are connected with the substrate, and mounting grooves are formed in the inner sides of the transparent side walls and the substrate;

the LED wafer is arranged on the substrate and positioned in the mounting groove, and the LED wafer is electrically connected with the substrate;

the packaging layer includes first refraction glue film and second refraction glue film, first refraction glue film sets up just cover in the mounting groove the LED wafer, the second refraction glue film sets up cover in the mounting groove on the first refraction glue film, wherein, the refracting index of first refraction glue film is greater than the refracting index of second refraction glue film.

2. The LED lamp bead of claim 1, wherein at least one of the first and second refractive glue layers is provided with phosphor particles.

3. The LED lamp bead of claim 2, wherein at least one of the first and second refractive glue layers is provided with diffusing powder particles.

4. The LED lamp bead according to claim 1, wherein the ratio of the thickness of the first refraction glue layer to the thickness of the second refraction glue layer is (3-5): 1.

5. The LED lamp bead according to claim 1, wherein the sum of the thickness of the first refraction adhesive layer and the thickness of the second refraction adhesive layer is smaller than the thickness of the transparent sidewall protruding from the substrate.

6. The LED lamp bead according to claim 1, wherein the encapsulation layer further includes a light blocking layer, and the light blocking layer is disposed in the mounting groove and covers the second refraction glue layer.

7. The LED lamp bead according to claim 6, wherein the surface of the light blocking layer facing the substrate is disposed adjacent to the surface of the transparent sidewall away from the substrate.

8. The LED lamp bead according to claim 7, wherein the sum of the thickness of the first refraction glue layer, the thickness of the second refraction glue layer and the thickness of the light blocking layer is greater than the thickness of the transparent side wall protruding from the substrate.

9. The LED lamp bead according to claim 1, wherein the encapsulation layer further includes a transparent adhesive layer having an optical lens shape, the transparent adhesive layer being disposed in the mounting groove and covering the second refraction adhesive layer.

10. A backlight module, comprising the LED lamp bead of any one of claims 1 to 9.