CN210723086U

CN210723086U - LED lamp bead

Info

Publication number: CN210723086U
Application number: CN201921647861.3U
Authority: CN
Inventors: 叶就信; 郑如萍
Original assignee: Leeleds Lighting Xiamen Co Ltd
Current assignee: Leeleds Lighting Xiamen Co Ltd
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-06-09
Anticipated expiration: 2029-09-29

Abstract

The utility model relates to a LED lamp pearl adopts non-metallic's reflecting layer to replace the silvered film to realize the light reflex action, owing to choose the material of not taking place to vulcanize for use, has thoroughly solved the problem that the light efficiency that leads to reduces because of the silvered film vulcanizes, colour temperature drift. The utility model discloses need not set up the support cup, and then avoided the influence that the support cup formed the beam angle for LED lamp pearl except that the bottom surface all can the light-emitting, promotes the beam angle greatly in other faces. The utility model discloses can be applied to on lamps and lanterns such as straight following formula panel light or down lamp, owing to break through the restriction of beam angle, leave out and set up lens and carry out the technical characteristic of secondary grading, simplify overall structure and production technology, reduce overall cost.

Description

LED lamp bead

Technical Field

The utility model relates to an optics technical field, more specifically say, relate to a LED lamp pearl.

Background

In the LED lamp bead packaging in the prior art, the light emitted by the LED chip is reflected by the silver coating on the metal support bonding pad to improve the light extraction efficiency. Due to the existence of the silver coating, a tiny gap exists between the silica gel (fluorescent glue layer) covering the LED chip and the metal bracket bonding pad, and a gap also exists between a bracket cup made of optical plastics (PPA \ PCT \ EMC and the like) and the silica gel or the metal bracket bonding pad; further, O in the air is easily caused₂And substances containing S, Cl, Br and the like which are easy to react with the silver coating layer enter the lamp bead through the gap of the silica gel or the gap between the support cup and the silica gel or the metal support welding disc and react with the silver coating layer irreversibly, so that black Ag is generated after the silver coating layer reacts chemically₂O、Ag₂S, AgBr, AgCl and the like, namely vulcanization occurs, so that the reflection performance of the silver coating to light is greatly reduced, the lighting effect is reduced, and the color temperature drift of the lamp bead is also caused.

Due to the existence of the support cup, the beam angle of the LED lamp bead in the prior art can only reach 120 degrees at most, and when a larger beam angle needs to be obtained, secondary light distribution needs to be carried out by matching with the lens, for example, the traditional direct type panel lamp requires good light-emitting uniformity, and the beam angle of the LED lamp bead is only 120 degrees, so that the uniformity requirement can be met by matching with the lens for secondary light distribution; further, the complexity of the entire structure is increased, and the cost is also increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a LED lamp pearl, solved the vulcanization problem that is used for the silvered film of reflection, furtherly, leave out the support cup, solved the limiting displacement of support cup to beam angle, reach bigger beam angle.

The technical scheme of the utility model as follows:

an LED lamp bead comprises a support bonding pad and an LED chip, wherein a convex island is arranged on a light source surface of the support bonding pad, the LED chip is arranged on the convex island, and a non-metal reflecting layer covers the light source surface of the support bonding pad except the convex island; the fluorescent glue layer is coated on the LED chip and the light source surface of the bracket bonding pad; and coating a light diffusion layer on the fluorescent glue layer.

Preferably, the bracket bonding pad and the convex island are of an integrally formed structure, and the convex island is provided with a silver coating; or the light source surface of the bracket bonding pad and the convex island are both provided with silver coatings.

Preferably, the thickness of the reflective layer gradually increases from far to near the islands, and is not higher than the islands.

Preferably, the surface of the reflective layer is an inclined surface having a constant slope.

Preferably, the convex islands are multi-surface platforms or multi-surface columns, and the reflecting layer forms an inclined plane corresponding to each side of the convex islands.

Preferably, the protruding island is a circular truncated cone or a cylinder, and the reflecting layer forms an inclined surface smoothly passing around the protruding island corresponding to the circumference of the protruding island.

Preferably, the fluorescent glue layer covers the side surface of the support welding pad and does not exceed the welding surface of the support welding pad.

Preferably, the bracket bonding pad comprises a sub bonding pad and a main bonding pad which are separated, the convex island comprises a main convex island, a first wiring convex island and a second wiring convex island, the main convex island and the first wiring convex island are arranged on the light source surface of the main bonding pad, and the second wiring convex island is arranged on the light source surface of the sub bonding pad; the first bonding wire is connected to the first wiring convex island and one pin end of the LED chip, and the second bonding wire is connected to the second wiring convex island and the other pin end of the LED chip.

The utility model has the advantages as follows:

LED lamp pearl, adopt non-metallic reflecting layer to replace the silvered film to realize the light reflex action, owing to choose the material of not taking place to vulcanize for use, thoroughly solved because of the problem that the light efficiency that the silvered film vulcanizes and lead to reduces, the colour temperature drift. The utility model discloses need not set up the support cup, and then avoided the influence that the support cup formed the beam angle for LED lamp pearl except that the bottom surface all can the light-emitting, promotes the beam angle greatly in other faces.

The utility model discloses can be applied to on lamps and lanterns such as straight following formula panel light or down lamp, owing to break through the restriction of beam angle, leave out and set up lens and carry out the technical characteristic of secondary grading, simplify overall structure and production technology, reduce overall cost.

Drawings

FIG. 1 is a cross-sectional view of a prior art LED lamp bead;

fig. 2 is a cross-sectional view of the present invention;

fig. 3 is a schematic structural diagram of the present invention;

FIG. 4 is an exploded view of the structure of the present invention;

in the figure: 10 is a mount pad, 11 is a sub-pad, 12 is a main pad, 20 is a land, 21 is a main land, 22 is a first wiring land, 23 is a second wiring land, 31 is a first bonding wire, 32 is a second bonding wire, 40 is a reflective layer, 50 is an LED chip, 60 is a fluorescent glue layer, and 70 is a light diffusion layer.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples.

The utility model discloses a solve the silvered film that prior art exists and vulcanize easily and influence light efficiency and colour temperature, beam angle limited etc. not enough, provide a LED lamp pearl, adopt the reflecting layer that does not take place to vulcanize to replace the silvered film to carry out light reflection, thoroughly avoided because of the silvered film takes place to vulcanize the problem that the light efficiency of drawing reduces and the colour temperature drifts. The utility model discloses still left out the inherent support cup of prior art, broken through the restriction of beam angle, promoted beam angle greatly.

As shown in fig. 2, LED lamp pearl, including support pad 10, LED chip 50, a side surface of support pad 10 is the light source face for set up LED chip 50, the opposite side surface is the bonding pad, is used for welding to light source module's base plate. The LED light source structure comprises a support bonding pad 10, an LED chip 50, a non-metal reflecting layer 40, a plurality of LED light sources and a plurality of LED light sources, wherein the light source surface of the support bonding pad 10 is provided with a convex island 20, the LED chip 50 is arranged on the convex island 20, and the position of the light source surface of the support bonding pad 10 except the convex; the fluorescent glue layer 60 is coated on the LED chip 50 and the light source surface of the bracket bonding pad 10; a light diffusion layer 70 is coated on the fluorescent glue layer 60.

In this embodiment, the support bonding pad 10 and the protruding island 20 are an integrated structure, wherein the protruding island 20 is provided with a silver coating; alternatively, the light source surface of the mount pad 10 and the land 20 are both provided with silver plating layers. That is, the frame pad 10 and the bump 20 are made of the same material, such as copper or aluminum. And silver plating is carried out after molding to obtain the silver plating layer. The silver coating obtained is no longer used to achieve reflection of light, and thus, the light efficiency and color temperature are no longer affected whether or not vulcanization occurs.

The reflective layer 40 is used to replace a conventional silver-plated layer and is used to reflect light emitted from the LED chip 50. Because the reflecting layer 40 covers almost all positions of the light source surface of the bracket bonding pad 10, under the performance of no sulfuration, even if the silver coating (used for realizing the conductive function) is arranged at other positions and the silver coating is sulfurated, the light effect and the color temperature are not influenced. In this embodiment, the reflective layer 40 is white, and the material of the white reflective layer 40 may be silica gel and ZnO or TiO₂Or SiO₂Or BaSO₄Or Al₂O₃The mixture of the materials can be prepared by mixing one or more of the materials with silica gel; and the white reflecting layer 40 is coated on the light source surface (except the surface of the convex island 20) of the support pad 10 by means of molding, spraying or dispensing.

In order to enable the light generated by the LED chip 50 to be reflected by the reflective layer 40 to form a larger beam angle, the arrangement structure of the reflective layer 40 is based on the principle that the thickness of the reflective layer 40 gradually increases from far to near from the convex island 20, and is not higher than the convex island 20, so as to avoid interference on the installation of the LED chip 50, and simultaneously avoid shielding the side surface of the LED chip 50.

Preferably, the surface of the reflective layer 40 is an inclined surface with a fixed slope to form a reflection angle of a certain angle; optimally, the thickness of the reflecting layer 40 is uniformly increased from the edge of the bracket bonding pad 10 to the convex island 20, so that the reflecting effect of light rays is convenient to calculate and control in the design stage, and a more uniform light emitting effect is convenient to obtain.

Meanwhile, the shape of the convex island 20 may be implemented as a square, a circle, or any other shape. Specifically, when the island 20 is a multi-faced mesa or a multi-faced pillar, the reflective layer 40 forms an inclined plane corresponding to each side of the island 20. When the island 20 is a circular truncated cone or a cylinder, the reflective layer 40 forms an inclined surface smoothly passing around the island 20 corresponding to the circumference of the island 20.

The utility model discloses left out traditional support cup, then required fluorescence glue film 60 can satisfy the fixed action as far as possible. In this embodiment, as shown in fig. 3, the fluorescent glue layer 60 covers the side surface of the support pad 10 and does not exceed the bonding surface of the support pad 10. After the fluorescent glue layer 60 is coated on the side surface of the bracket bonding pad 10, the limiting is formed in the transverse direction, so that the transverse separation can be prevented, and a better supporting effect is obtained. The fluorescent adhesive layer 60 is prepared by mixing silica gel and fluorescent powder to obtain a mixture, the mixture is directly coated on the LED chip 50, the light source surface of the support bonding pad 10 and the side surface of the support bonding pad 10 in a mould pressing mode, and the fluorescent adhesive layer 60 is obtained after curing. Then, the white light diffusion layer 70 is coated on the upper surface of the fluorescent glue layer 60, light can be emitted from the four sides and the upper surface of the utility model, the beam angle is greatly increased, and 165-170 degrees can be reached. Wherein, the material of the light diffusion layer 70 can be silica gel and ZnO or TiO₂Or SiO₂Or BaSO₄Or Al₂O₃And the like, and may be a mixture of a light diffusing agent such as acrylic acid and silica gel.

In this embodiment, as shown in fig. 4, the support pad 10 includes a sub-pad 11 and a main pad 12 that are separated from each other, the island 20 includes a main island 21, a first connection island 22, and a second connection island 23, the main island 21 and the first connection island 22 are disposed on the light source surface of the main pad 12, and the second connection island 23 is disposed on the light source surface of the sub-pad 11; the first bonding wire 31 is connected to the first bonding pad 22 and one lead terminal of the LED chip 50, and the second bonding wire 32 is connected to the second bonding pad 23 and the other lead terminal of the LED chip 50.

The above embodiments are merely illustrative, and not restrictive, of the present invention. Changes, modifications, etc. to the above-described embodiments are intended to fall within the scope of the claims of the present invention, as long as they are in accordance with the technical spirit of the present invention.

Claims

1. An LED lamp bead comprises a support bonding pad and an LED chip, and is characterized in that a convex island is arranged on a light source surface of the support bonding pad, the LED chip is arranged on the convex island, and a non-metal reflecting layer covers the light source surface of the support bonding pad except the convex island; the fluorescent glue layer is coated on the LED chip and the light source surface of the bracket bonding pad; and coating a light diffusion layer on the fluorescent glue layer.

2. The LED lamp bead according to claim 1, wherein the bracket bonding pad and the protruding island are of an integrally formed structure, and the protruding island is provided with a silver coating; or the light source surface of the bracket bonding pad and the convex island are both provided with silver coatings.

3. The LED lamp bead according to claim 1, wherein the thickness of the reflective layer gradually increases from far to near from the convex island and is not higher than the convex island.

4. The LED lamp bead according to claim 3, wherein the surface of the reflective layer is an inclined surface with a fixed slope.

5. The LED lamp bead according to claim 4, wherein the convex island is a multi-surface table or a multi-surface column, and each side of the reflecting layer corresponding to the convex island forms an inclined plane.

6. The LED lamp bead according to claim 4, wherein the protruding island is a circular truncated cone or a circular cylinder, and the reflecting layer forms an inclined surface smoothly transiting around the protruding island corresponding to the circumference of the protruding island.

7. The LED lamp bead according to claim 1, wherein the fluorescent glue layer covers the side surface of the support bonding pad and does not exceed the bonding surface of the support bonding pad.

8. The LED lamp bead according to any one of claims 1 to 7, wherein the support pad comprises a sub-pad and a main pad which are separated from each other, the island comprises a main convex island, a first connection convex island and a second connection convex island, the main convex island and the first connection convex island are arranged on the light source surface of the main pad, and the second connection convex island is arranged on the light source surface of the sub-pad; the first bonding wire is connected to the first wiring convex island and one pin end of the LED chip, and the second bonding wire is connected to the second wiring convex island and the other pin end of the LED chip.