CN209928846U - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN209928846U CN209928846U CN201920672188.2U CN201920672188U CN209928846U CN 209928846 U CN209928846 U CN 209928846U CN 201920672188 U CN201920672188 U CN 201920672188U CN 209928846 U CN209928846 U CN 209928846U
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Abstract
A backlight module and a display device are provided, wherein the backlight module comprises: the back plate, the light bar and the optical diaphragm assembly; the back plate is provided with an accommodating groove, the light bar is arranged at the bottom of the accommodating groove, and the optical diaphragm assembly is covered on the back plate and closes the accommodating groove; the lamp strip includes PCB and LED lamp pearl, LED lamp pearl includes the support, LED wafer and packaging layer, the support includes base plate and transparent side wall, transparent side wall and base connection just inboard form the mounting groove, the packaging layer includes first refraction glue film and second refraction glue film, first refraction glue film sets up in the mounting groove and covers the LED wafer, the setting of second refraction glue film is in the mounting groove and cover on first refraction glue film, wherein, the refracting index of first refraction glue film is greater than the refracting index of second refraction glue film, the support sets up on PCB. By the backlight module and the display device, the problem that the axial brightness of the LED lamp beads is too high is avoided, and the thickness of the backlight module is reduced.
Description
Technical Field
The utility model relates to a backlight technical field especially relates to a backlight module and display device.
Background
The backlight module is one of the key components of the display device and is used for providing a backlight source for the display device. The current backlight module is a reflective backlight structure, specifically: the reflective backlight structure is manufactured by using a direct-emitting LED (light emitting Diode) lamp bead with a cup-shaped bracket, attaching the LED lamp bead on a PCB (Printed Circuit Board) Board through an SMT (Surface Mount Technology) process to manufacture the LED lamp bead, and covering a reflective lens on the LED lamp bead to manufacture the reflective backlight structure. Most of the light emitted by the reflective backlight structure is emitted to the side surface through the action of the reflective lens, so that the purpose of uniform light emission is achieved when the light is emitted to a diffusion plate in the backlight module.
In the existing reflective backlight structure, most of light directly emitted by the LED lamp beads needs to be converted into light emitted from the side surface, a reflective lens needs to be used, so that the use of materials is increased, in addition, the lens needs to be covered on the LED lamp beads, the production process is increased, the investment of materials, labor and equipment is finally caused, and meanwhile, due to the use of the lens, the lens has a certain thickness and the light mixing distance, so that the backlight module is thicker as a whole; in addition, the direct-emitting LED lamp beads have overhigh axial brightness, so that yellow spots are easy to appear on the backlight module.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a backlight module and a display device, aiming at the problem that the brightness of the existing LED lamp bead in the axial direction is too high, and yellow spots appear on a diffusion plate when the LED lamp bead is applied to the backlight module.
A backlight module includes: the back plate, the light bar and the optical diaphragm assembly; the back plate is provided with an accommodating groove, the light bar is arranged at the bottom of the accommodating groove, and the optical diaphragm assembly is covered on the back plate and closes the accommodating groove; the light bar comprises a PCB and an LED lamp bead arranged on the PCB, wherein the LED lamp bead comprises a bracket, an LED wafer and a packaging layer, the support comprises a substrate and a transparent side wall arranged around the edge of the substrate, the transparent side wall is connected with the substrate, the inner side of the transparent side wall forms a mounting groove, the LED wafer is arranged on the substrate and positioned in the mounting groove, the LED chip is electrically connected with the substrate, the packaging layer comprises a first refraction adhesive layer and a second refraction adhesive layer, the first refraction glue layer is arranged in the mounting groove and covers the LED wafer, the second refraction glue layer is arranged in the mounting groove and covers the first refraction glue layer, the refractive index of the first refraction adhesive layer is greater than that of the second refraction adhesive layer, the support is arranged on the PCB, and the light-emitting surface of the LED wafer faces the optical diaphragm assembly.
In one embodiment, the distance between the optical film assembly and the surface of the second refractive adhesive layer adjacent to the optical film assembly is less than 8 mm.
In one embodiment, the backlight module further includes a diffusion plate and a quantum dot film, the diffusion plate is covered on the back plate and closes the receiving groove, and the quantum dot film and the optical film are sequentially covered on the diffusion plate.
In one embodiment, at least one of the first and second refractive glue layers is provided with phosphor particles; or at least one of the first refraction adhesive layer and the second refraction adhesive layer is provided with diffusion powder particles.
In one embodiment, the packaging layer further includes a light blocking adhesive layer, and the light blocking adhesive layer is disposed in the mounting groove and covers the second refraction adhesive layer.
In one embodiment, the packaging layer further comprises a transparent adhesive layer in the shape of an optical lens, and the transparent adhesive layer is arranged in the mounting groove and covers the second refraction adhesive layer.
In one embodiment, the number of the LED lamp beads is multiple, and the LED lamp beads are uniformly arranged on the PCB at intervals.
In one embodiment, the distance between two adjacent LED lamp beads is 0.2mm to 4 mm.
In one embodiment, the number of the light bars is multiple, and the light bars are arranged at the bottom of the accommodating groove at intervals in parallel.
A display device comprises the backlight module as described in any of the above embodiments.
Above-mentioned backlight unit and display device, through cover the higher first refraction glue film of refracting index and the lower second refraction glue film of refracting index in proper order on the LED wafer, make the side light that the LED wafer sent send from transparent side wall, most front light that the LED wafer sent gets into the lower light from the higher optical dense medium of refracting index in proper order and drew the medium emergence total reflection and also sent from transparent side wall, luminous angle has been increased, and the axial light intensity of LED lamp pearl has been reduced, it is too high to have avoided LED lamp pearl at axial luminance, also can avoid the problem that the macula lutea appears on backlight unit need not use lens, and thereby the mixed light distance has been reduced backlight unit's thickness.
Drawings
FIG. 1 is a schematic structural diagram of a backlight module according to an embodiment;
FIG. 2 is a schematic structural diagram of an LED lamp bead of the backlight module according to the embodiment;
FIG. 3 is a schematic structural diagram of an LED lamp bead of a backlight module according to another embodiment;
FIG. 4 is a schematic structural diagram of an LED lamp bead of a backlight module according to yet another embodiment;
fig. 5 is a schematic view of light emission of an LED lamp bead of the backlight module according to an embodiment.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature. In addition, "upper" and "lower" in the present invention indicate only relative positions, and do not indicate absolute positions.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The present application provides a backlight module, as shown in fig. 1 and 2, the backlight module 20 includes: a back plate 21, a light bar 22 and an optical diaphragm assembly 23; the back plate 21 has a containing groove 201, the light bar 22 is arranged at the bottom of the containing groove 201, and the optical diaphragm assembly 23 is arranged on the back plate 21 in a covering manner and closes the containing groove 201; the light bar 22 comprises a PCB221 and LED lamp beads 10 arranged on the PCB221, wherein the LED lamp beads 10 comprise a support 100, an LED wafer 200 and a packaging layer 300, the support 100 comprises a substrate 110 and a transparent side wall 120 surrounding the edge of the substrate 110, the transparent side wall 120 is connected with the substrate 110 and forms an installation groove 101 on the inner side, the LED wafer 200 is arranged on the substrate 110 and is positioned in the installation groove 101, the LED wafer 200 is electrically connected with the substrate 110, the packaging layer 300 comprises a first refraction adhesive layer 310 and a second refraction adhesive layer 320, the first refraction adhesive layer 310 is arranged in the installation groove 101 and covers the LED wafer 200, the second refraction adhesive layer 320 is arranged in the installation groove 101 and covers the first refraction adhesive layer 310, wherein the refractive index of the first refraction adhesive layer 310 is larger than that of the second refraction adhesive layer 320, the support 100 is disposed on the PCB221, and the light-emitting surface of the LED chip 200 faces the optical film assembly 23. It should be noted that, the first refraction glue layer and the second refraction glue layer are both made of existing materials, which enable the refractive index of the formed first refraction glue layer to be larger than the refractive index of the formed second glue layer.
Referring to fig. 5, in the backlight module 20, the LED wafer 200 is sequentially covered with the first refractive adhesive layer 310 with a higher refractive index and the second refractive adhesive layer 320 with a lower refractive index, so that the side light emitted from the LED wafer 200 is emitted from the transparent side wall 120, most of the front light emitted from the LED wafer 200 sequentially enters the optically thinner medium with a lower refractive index from the optically denser medium with a higher refractive index to be totally reflected and also emitted from the transparent side wall 120, thereby increasing the light emitting angle, reducing the axial light intensity of the LED lamp bead 10, avoiding the problem of yellow spots on the backlight module without using a lens, and reducing the light mixing distance and thus reducing the thickness of the backlight module.
In one embodiment, the substrate is an epoxy substrate, a ceramic substrate, or a copper foil substrate. In one embodiment, the transparent sidewall is made of a high molecular polymer made of a transparent material. Specifically, the holder is formed by injection molding a polymer of a transparent material around the periphery of the substrate. In one embodiment, the mounting slot is a bowl-shaped slot. In one embodiment, the depth of the mounting groove is 0.55 mm. In one embodiment, the LED wafer is a positive mounting type wafer, the LED wafer is fixedly arranged on the substrate through die bonding insulating glue, and the surface of the LED wafer, which is far away from the substrate, is electrically connected with the substrate through a lead; in another embodiment, the LED chip is a flip chip, and the LED chip is fixedly disposed on the substrate by a conductive adhesive such as silver paste or solder paste and electrically connected to the substrate. In one embodiment, the refractive index of the first refractive glue layer is 1.53 and the refractive index of the second refractive glue layer is 1.41. In one embodiment, the first refractive adhesive layer and the second refractive adhesive layer may be made of epoxy resin, silica gel, silicone resin, or the like. In one embodiment, the first refractive adhesive layer is made of epoxy resin, in one embodiment, the first refractive adhesive layer is made of silica gel, and in one embodiment, the first refractive adhesive layer is made of silicone resin; in one embodiment, the second refraction adhesive layer is made of epoxy resin, in one embodiment, the second refraction adhesive layer is made of silica gel, and in one embodiment, the second refraction adhesive layer is made of silicone resin.
In order to convert the light emitted from the LED chip into white light, in one embodiment, at least one of the first and second refractive adhesive layers is provided with phosphor particles. In one embodiment, the phosphor particles are uniformly dispersed and disposed in the first refractive glue layer and/or the second refractive glue layer. In one embodiment, the first refractive glue layer is provided with phosphor particles; in another embodiment, the second refraction glue layer is provided with phosphor particles; in another embodiment, the first and second refractive glue layers are both provided with phosphor particles. Because the light emitted by the LED wafer is blue light generally, and the backlight source required by the backlight module is white light generally, the fluorescent powder particles are arranged on the first refractive adhesive layer and/or the second refractive adhesive layer, so that the light emitted by the LED wafer can be converted into the white light under the action of the fluorescent powder particles, and the white light is provided for the backlight module to be used as the backlight source. It should be noted that the matching of the LED chip converted into white light by the phosphor particles is the prior art, and is not described herein again.
In order to make the light emitted by the LED chip emit more uniformly, in one embodiment, at least one of the first and second refraction glue layers is provided with diffusion powder particles. In one embodiment, the diffusion powder particles are uniformly dispersed in the first refraction glue layer and/or the second refraction glue layer. In one embodiment, the first refractive glue layer is provided with the diffusion powder particles; in another embodiment, the second refraction glue layer is provided with the diffusion powder particles; in another embodiment, the first and second refraction glue layers are both provided with the diffusion powder particles. Through setting up the diffusion powder granule for the effect of light process diffusion powder granule is more even jets out.
In order to convert the light emitted by the LED chip into uniform white light, in one embodiment, at least one of the first and second refraction glue layers is provided with phosphor particles and dustproof starch particles. In one embodiment, the phosphor particles and the dustproof starch particles are uniformly dispersed in the first refraction glue layer and/or the second refraction glue layer. In one embodiment, the first refraction glue layer is provided with phosphor particles and the dustproof starch particles; in another embodiment, the second refraction glue layer is provided with fluorescent powder particles and the dustproof starch particles; in another embodiment, the first refraction glue layer and the second refraction glue layer are both provided with fluorescent powder particles and dustproof starch particles. Because phosphor powder granule can take place to deposit in the glue film usually, make phosphor powder granule distribute inhomogeneously, cause LED light inhomogeneous after the effect of phosphor powder granule, like this, through set up phosphor powder granule and dustproof starch granule at first refraction glue film and/or second refraction glue film packing, avoid phosphor powder granule to deposit in the glue film, make the light that the LED wafer sent can convert into even white light under the effect of phosphor powder granule, provide backlight unit and do the backlight. It should be noted that the collocation of the fluorescent powder and the dustproof starch granule is the prior art, and is not described herein again.
In order to ensure the light emitting effect of the LED, in one embodiment, the ratio of the thickness of the first refraction glue layer to the thickness of the second refraction glue layer is (3-5): 1, namely, the height ratio of the surface distance of the first refraction glue layer to the bottom of the mounting groove to the surface distance of the second refraction glue layer to the bottom of the mounting groove is (3-5): 1. In one embodiment, a ratio of the thickness of the first refraction adhesive layer to the thickness of the second refraction adhesive layer is 4:1, that is, a height ratio of the surface of the first refraction adhesive layer to the bottom of the mounting groove to the surface of the second refraction adhesive layer to the bottom of the mounting groove is 4: 1. In one embodiment, the depth of the mounting groove is 0.55mm, the height of the surface of the first refraction glue layer from the bottom of the mounting groove is 0.44mm, and the height of the surface of the second refraction glue layer from the bottom of the mounting groove is 0.11 mm. Therefore, most of LED light rays are emitted from the first refractive glue layer with higher refractive index, and the light emitting effect of the LED is ensured.
In order to avoid the overflow of the second refraction adhesive layer during dispensing, in one embodiment, the sum of the thickness of the first refraction adhesive layer and the thickness of the second refraction adhesive layer is smaller than the thickness of the transparent side wall protruding from the substrate, that is, the surface of the second refraction adhesive layer away from the substrate does not protrude from the surface of the transparent side wall away from the substrate. Like this, can avoid the second to refract the gluey layer and spill over when the point is glued, simultaneously, through experimental proof for light is more even from smooth surface or slightly concave surperficial emission.
In order to avoid the light of the LED from being emitted from the front surface of the LED chip and further reduce the axial light intensity of the LED bead, in one embodiment, as shown in fig. 2, the encapsulation layer 300 further includes a light blocking adhesive layer 330, and the light blocking adhesive layer 330 is disposed in the mounting groove 101 and covers the second refractive adhesive layer 320. Because the glue film 330 that is in the light is opaque, light can not follow the glue film 330 that is in the light and jets out, like this, through setting up glue film 330 that is in the light at second refraction glue film 320, avoid light to jet out from the front of LED wafer 200, further reduce the axial light intensity of LED lamp pearl.
In one embodiment, the light blocking glue layer is a white light blocking glue layer. In one embodiment, the white light blocking glue layer is formed by mixing transparent glue and white particles and then curing the mixture. For example, the transparent glue may be epoxy, silicone, and the like. For example, the white particulates are silica, titanium dioxide, calcium carbonate, boron nitride, barium sulfate, and the like.
In order to avoid that the light-blocking adhesive layer excessively blocks light rays from being emitted from the transparent side walls, in one embodiment, the surface of the light-blocking adhesive layer facing the substrate is arranged adjacent to the surface of the transparent side walls away from the substrate. Because the glue film that is in the light does not allow light to pass through, through making the glue film that is in the light towards the surface setting of the surface of base plate neighbouring base plate avoids the glue film that is in the light to block light and jets out from transparent side wall. The sum of the thickness of the first refraction glue layer, the thickness of the second refraction glue layer and the thickness of the light blocking glue layer is larger than the thickness of the transparent side wall protruding from the substrate. Therefore, the surface, far away from the substrate, of the light blocking adhesive layer is not lower than the surface, far away from the substrate, of the transparent side wall, the light blocking adhesive layer is made to have enough thickness, and the effect of the light blocking adhesive layer is guaranteed.
In order to obtain the required optical effect, in one embodiment, as shown in fig. 3, the encapsulation layer further includes a transparent adhesive layer 340 having an optical lens shape, and the transparent adhesive layer 340 is disposed in the mounting groove 101 and covers the second refractive adhesive layer 320. Specifically, the optical lens shape is an optical lens shape used in a backlight module in the related art, that is, an existing lens shape. For example, the optical lens shape is a reflective lens shape, for example, the optical lens shape is a refractive lens shape, for example, the optical lens shape is a ball lens shape, for example, the optical lens shape is a cusp lens shape, for example, the optical lens shape is a concave cup lens shape, for example, the optical lens shape is a peanut lens shape. In one embodiment, the transparent adhesive layer 340 is formed by a molding process using a transparent adhesive, that is, the transparent adhesive layer with different lens shapes is formed by different molds using a transparent adhesive. Therefore, the transparent adhesive layer 340 has a lens shape and has a refraction or reflection function of the lens, so that when the LED lamp bead is applied to the backlight module, the desired optical angle can be obtained without using the lens, and the desired optical effect can be obtained.
In order to reasonably set the distance between the optical film assembly and the surface of the second refractive adhesive layer adjacent to the optical film assembly, in one embodiment, the distance between the optical film assembly and the surface of the second refractive adhesive layer adjacent to the optical film assembly is less than 8mm, so as to further obtain uniform light and avoid the thickness of the backlight module from being too thick. Through setting up the distance between the adjacent optics diaphragm subassembly of optical diaphragm subassembly and second refraction glue film layer surface and being less than 8mm, rationally set up the distance of optics diaphragm subassembly to further obtain evenly ground light and avoid backlight unit's thickness too thick simultaneously.
In order to improve the light emitting effect of the backlight module, in one embodiment, the backlight module further includes a diffusion plate and a quantum dot film, the diffusion plate is covered on the back plate and closes the receiving groove, and the quantum dot film and the optical film are sequentially covered on the diffusion plate. Through set up diffuser plate and quantum dot diaphragm at backlight unit, make backlight unit's light-emitting effect better.
In order to enable the backlight module to obtain a larger irradiation range, in one embodiment, the number of the LED lamp beads is multiple, and the LED lamp beads are uniformly arranged on the PCB at intervals. Because the general luminous angle of LED lamp pearl is 120, luminous scope is limited, through setting up a plurality of LED lamp pearls for backlight unit obtains bigger irradiation range.
In order to reasonably set an optical path after the plurality of LED lamp beads emit light together so as to enable the backlight module to emit light uniformly, in one embodiment, the distance between every two adjacent LED lamp beads is 0.2mm to 4 mm. Preferably, the distance between two adjacent LED lamp beads is 2 mm. Because the luminous angle of LED lamp pearl is only 120 usually, the light scope that sends between two adjacent LED lamp pearls can partially overlap, and LED lamp pearl is inconsistent toward different angle luminance, is 0.2mm to 4mm through setting up the distance between two adjacent LED lamp pearls, rationally sets up the optical path after a plurality of LED lamp pearls give off light jointly so that backlight unit light-emitting is even.
In order to enable the backlight module to form a surface light source so as to further obtain a larger irradiation range, in one embodiment, the number of the light bars is multiple, and the light bars are arranged at the bottom of the accommodating cavity at intervals in parallel. Because can only set up one row of LED lamp pearl in a lamp strip usually, can only form the line source, luminous scope is limited, through setting up a plurality of lamp strips for backlight unit forms the area source and in order to further obtain bigger irradiation range.
The application also provides a display device, which comprises the backlight module.
Above-mentioned display device, through cover the higher first refraction glue film of refracting index and the lower second refraction glue film of refracting index in proper order on the LED wafer, make the side light that the LED wafer sent send from transparent side wall, most front light that the LED wafer sent gets into the lower light from the higher dense medium of refracting index in proper order and dredges the medium emergence total reflection and also send from transparent side wall, luminous angle has been increased, and the axial light intensity of LED lamp pearl has been reduced, the yellow spot problem also can avoid appearing on backlight unit need not use lens, thereby and reduced the thickness that mixes the light distance and reduced backlight unit, thereby make display device's display effect better.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A backlight module is characterized in that the backlight module comprises: the back plate, the light bar and the optical diaphragm assembly;
the back plate is provided with an accommodating groove, the light bar is arranged at the bottom of the accommodating groove, and the optical diaphragm assembly is covered on the back plate and closes the accommodating groove;
the light bar comprises a PCB and an LED lamp bead arranged on the PCB, wherein the LED lamp bead comprises a bracket, an LED wafer and a packaging layer,
the bracket comprises a substrate and a transparent side wall arranged around the edge of the substrate, the transparent side wall is connected with the substrate, and an installation groove is formed on the inner side of the transparent side wall,
the LED wafer is arranged on the substrate and positioned in the mounting groove, and the LED wafer is electrically connected with the substrate,
the packaging layer comprises a first refraction glue layer and a second refraction glue layer, the first refraction glue layer is arranged in the mounting groove and covers the LED wafer, the second refraction glue layer is arranged in the mounting groove and covers the first refraction glue layer, wherein the refractive index of the first refraction glue layer is larger than that of the second refraction glue layer,
the support is arranged on the PCB, and the light-emitting surface of the LED wafer faces the optical diaphragm assembly.
2. The backlight module according to claim 1, wherein the distance between the optical film assembly and the surface of the second refractive adhesive layer adjacent to the optical film assembly is less than 8 mm.
3. The backlight module of claim 1, further comprising a diffuser plate and a quantum dot film, wherein the diffuser plate covers the back plate and closes the receiving groove, and the quantum dot film and the optical film are sequentially covered on the diffuser plate.
4. The backlight module as claimed in claim 1, wherein at least one of the first and second refractive glue layers is provided with phosphor particles; or at least one of the first refraction adhesive layer and the second refraction adhesive layer is provided with diffusion powder particles.
5. The backlight module according to claim 1, wherein the encapsulation layer further comprises a light-blocking glue layer, and the light-blocking glue layer is disposed in the mounting groove and covers the second refraction glue layer.
6. The backlight module according to claim 1, wherein the encapsulation layer further comprises a transparent adhesive layer having an optical lens shape, the transparent adhesive layer being disposed in the mounting groove and covering the second refraction adhesive layer.
7. The backlight module as claimed in claim 1, wherein the number of the LED beads is plural, and each of the LED beads is uniformly spaced on the PCB.
8. The backlight module according to claim 7, wherein the distance between two adjacent LED beads is 0.2mm to 4 mm.
9. The backlight module of claim 1, wherein the number of the light bars is plural, and each light bar is disposed at the bottom of the receiving groove in parallel and at intervals.
10. A display device comprising the backlight module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920672188.2U CN209928846U (en) | 2019-05-10 | 2019-05-10 | Backlight module and display device |
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| CN201920672188.2U CN209928846U (en) | 2019-05-10 | 2019-05-10 | Backlight module and display device |
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| CN209928846U true CN209928846U (en) | 2020-01-10 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112164335A (en) * | 2020-08-03 | 2021-01-01 | 深圳市真屏科技发展有限公司 | Novel packaging structure of LED display screen |
| CN115877612A (en) * | 2022-12-26 | 2023-03-31 | 惠科股份有限公司 | Backlight module and display device |
| WO2023103127A1 (en) * | 2021-12-06 | 2023-06-15 | 武汉创维光显电子有限公司 | Light-emitting assembly and backlight module |
| CN116646445A (en) * | 2023-04-10 | 2023-08-25 | 深圳市华皓伟业光电有限公司 | Optical element |
| WO2024207866A1 (en) * | 2023-04-06 | 2024-10-10 | 惠州视维新技术有限公司 | Light-emitting device and display module |
-
2019
- 2019-05-10 CN CN201920672188.2U patent/CN209928846U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112164335A (en) * | 2020-08-03 | 2021-01-01 | 深圳市真屏科技发展有限公司 | Novel packaging structure of LED display screen |
| WO2023103127A1 (en) * | 2021-12-06 | 2023-06-15 | 武汉创维光显电子有限公司 | Light-emitting assembly and backlight module |
| CN115877612A (en) * | 2022-12-26 | 2023-03-31 | 惠科股份有限公司 | Backlight module and display device |
| CN115877612B (en) * | 2022-12-26 | 2023-11-21 | 惠科股份有限公司 | Backlight module and display device |
| WO2024207866A1 (en) * | 2023-04-06 | 2024-10-10 | 惠州视维新技术有限公司 | Light-emitting device and display module |
| CN116646445A (en) * | 2023-04-10 | 2023-08-25 | 深圳市华皓伟业光电有限公司 | Optical element |
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