KR100894561B1 - Surface Light Source Lens Type LED Package Manufacturing Method - Google Patents

Abstract

The present invention relates to a lens type light distribution / adjustable light emitting diode package and a method of manufacturing the same. More specifically, the light distribution of the light emitting diode light source can be arbitrarily adjusted by utilizing an aspherical surface of an optical system, A light distribution / adjustable light emitting diode package of a lens type for achieving radiation and a method of manufacturing the same.

The lens type light distribution / adjusting light emitting diode package according to the present invention includes a lead frame through which a molding material injection hole and an air discharge hole for lens molding are formed; At least one LED chip mounted on the lead frame and including a circuit board containing a metal oxide and an LED coupled to the circuit board; A bonding wire configured to electrically connect the lead frame and the LED chip to each other; And a lens-shaped reflector configured to mount the LED chip and the bonding wire therein and formed to a predetermined thickness on the lead frame, wherein the lens-shaped reflector includes a mold or an injection molded article having a lens-shaped forming groove. It is characterized in that it is molded into a convex lens shape by injection molding and curing using.

In addition, a method of manufacturing a lens type light distribution / adjustable light emitting diode package according to the present invention includes an adhesion process for adhering an LED chip onto a lead frame; A wire connection process of connecting the lead frame and the LED chip with a bonding wire; A molding process of placing the lead frame bonded through the bonding process upside down in a mold or an injection molded product having a lens-shaped forming groove and injecting a molding material to cure the molding; And a separating process of separating the LED package formed through the molding process from the mold or the injection molded product.

Light Emitting Diode, Phosphor, LED Chip, Lead Frame, Bonding Wire, Silicon

Description

Surface Light Source Lens Type LED Package Manufacturing Method

The present invention relates to a lens type light distribution / adjustable light emitting diode package and a method of manufacturing the same. More specifically, the light distribution of the light emitting diode light source can be arbitrarily adjusted by utilizing an aspherical surface of an optical system, A light distribution / adjustable light emitting diode package of a lens type for achieving radiation and a method of manufacturing the same.

In recent years, LED devices have been driven by the rapid development of semiconductor technology, so that they can escape from low-intensity general-purpose products and produce high-brightness and high-quality products. In addition, as the implementation of high-performance blue and white diodes becomes a reality, the application value of LEDs is being extended to displays, next-generation lighting sources, and the like.

In particular, as high-quality full-color display is possible, large-scale full-color outdoor LED video display of more than 100 inches has appeared one after another, and combined with a computer raises the level of outdoor commercial advertising to the next level and provides various video information including news. It has evolved into an advanced image medium that can be implemented in real time. As such LED products, LED packages in the form of surface mounting devices have been commercialized.

For example, in the accompanying drawings, FIG. 1A is a cross-sectional view showing a configuration of a conventional LED package, and FIG. 1B is experimental data showing a luminance distribution according to a radiation surface of a conventional LED package. Referring first to FIG. 1A, a conventional LED The package 10 includes a pair of electrodes 11, a package 12 formed of a synthetic resin material to accommodate a portion of the electrode 11 inside, and a package on the electrodes 11 inside the package 12. One or more LED chips 13, a conducting wire 14 for energizing the LED chip 13 and the electrode 11, and an LED chip 13 and a wire ( 14 is made of a molding material 15 to protect.

And, the molding material 15 for protecting the LED chip 13 is made of a light-transmissive resin containing a transparent material or a phosphor according to the color of the LED chip to be implemented.

Among the conventional LEDs configured as described above, the white light emitting diode is configured to emit blue light by passing blue light generated from an LED chip through a phosphor resin portion containing other phosphors, for example, yellow phosphors, in order to emit white light. The light emitted by the method of converting the color by passing the resin containing the phosphor, without directly emitting a desired color such as white light, and the distribution of the phosphor resin to pass through to obtain a uniform color of light after the passage. Or it is important to keep the distance uniform.

However, these LEDs have a disadvantage that the center part is bright but the surrounding area is dark due to the characteristic that the emitted light is concentrated to the center of the LED due to the flat type structure. There was a problem of not being able to focus to a narrow area.

In addition, in the case of arranging LEDs and applying the LCD backlight as a light source, it is difficult to form the same brightness on all planes of the LCD panel due to uniform brightness.

As a result, in the case of the conventional flat type LED, the light intensity distribution cannot be effectively implemented in an application, and only one light distribution can be manufactured in one type of lead frame structure. When the) is changed, the size and design of the LED package must be changed, which causes a problem that a number of additional equipments for manufacturing are provided.

On the other hand, the conventional lens type LED takes the form of adhering a separately formed lens on the existing flat type (Flat Type), which increases the manufacturing cost and reduces the reliability.

If the flat type LED and the LENS bonded on top are configured separately, the process is divided into two, and the process of attaching it again must be added, causing a cost increase. In addition, when LENS and flat type LEDs are glued together with adhesives, they tend to separate LENS and products due to weak adhesiveness when LED chips are heated.

In order to bond the LENS to a flat type LED, a spot for raising the LENS must be created, and the spot portion prevents precise light distribution. Bonding LENS to the same location on a flat type LED in process equipment also remains a challenge.

In addition, a separate injection hole is formed in the LENS portion to inject the molding material of the flat type LED into the inside, which causes a problem of uneven emission distribution of the LED chip, and silicon injection to prevent the injection hole. There was a problem that the front surface of the LED is not formed clean due to the lamp.

The present invention for solving the above problems by allowing the light distribution of the LED light source to be arbitrarily adjusted by utilizing the aspherical surface of the optical system, the radiation angle in the light source in the general radiation form of the point light source can be adjusted to a large area It is an object of the present invention to provide a lens type light distribution / adjustable light emitting diode package capable of irradiating light at the same time and intensively irradiating emission at a specific angle to increase the linearity of light.

In addition, the lens type light distribution / adjusted light emission can be provided to suit the application so that the uniform brightness can be formed and the light loss of the emitted light of the LED can be eliminated to maximize the use efficiency of the LED light source. Another object is to provide a diode package and a method of manufacturing the same.

In addition, by forming a molding material injection hole for injecting the molding material into the light emitting diode package on the rear of the lead frame, it is possible to prevent the scattering of light through the lens-shaped reflector, the lens type of which can cleanly form the front surface of the LED It is another object to provide a light distribution / adjustable light emitting diode package and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a lens type light distribution / adjusting light emitting diode package manufacturing method comprising: bonding an LED chip onto a lead frame; A wire connection process of connecting the lead frame and the LED chip with a bonding wire; After placing the lead frame to which the LED chip is bonded through the bonding process, the mold is formed in a mold or an injection molded product in which a lens-shaped forming groove is formed, and then injection molding material is injected through the molding material injection hole formed in the lead frame. A molding process of forming internal lens through the formed air outlet to discharge the outside air and curing the injected molding material to form a lenticular reflector; A sealing process of injecting a molding material into the molding material inlet and the air outlet after curing the lenticular reflector; And a separating process of separating the LED package formed by forming the lens-shaped reflector through the molding process from the mold or the injection molded product.

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Preferably, the bonding process may include a first coating process of first applying and curing a molding material in which at least one of red, green, and yellow phosphors is mixed on a blue LED chip; And a second coating process of applying and curing the transparent molding material on the first applied blue LED chip.

According to the lens type light distribution / adjustment light emitting diode package and the manufacturing method thereof according to the present invention as described above, it is possible to arbitrarily adjust the light distribution of the LED light source, thereby enabling the surface light source radiation in the general radiation form of the point light source Therefore, it is possible to irradiate light to a wide area and at the same time has the effect of irradiating light to a narrow area.

In addition, it is possible to form a uniform brightness, there is an effect that can be provided according to the application (Application) to maximize the use efficiency of the LED light source by eliminating the light loss for the emitted light of the LED.

In addition, by forming a molding material injection hole for injecting the molding material into the light emitting diode package on the rear of the lead frame, it is possible to prevent the scattering of light through the lens-shaped reflecting portion, it is possible to clean the LED front surface clean. .

The present invention can be used to adjust the light distribution of the light emitting diode light source by utilizing the aspherical surface of the optical system, and to provide a lens type light distribution / adjustment light emitting diode package having a structure that achieves light emission with uniform brightness and a manufacturing method thereof It is about.

Hereinafter, a lens type light distribution / adjusting light emitting diode package and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 2 is a perspective view showing the configuration of a light emitting diode package according to an embodiment of the present invention, Figure 3 is a side cross-sectional view of a light emitting diode package according to an embodiment of the present invention, Figure 4 is another embodiment of the present invention 5 is a side cross-sectional view of a light emitting diode package according to an embodiment, and FIG. 5 is an exemplary view showing a shape of a lens-shaped reflector according to an embodiment of the present invention, and FIG. 6 is a light distribution / adjusted light emission of a lens type according to an embodiment of the present invention. A diagram showing a manufacturing state of a diode package.

2, the lens type light distribution / adjustable light emitting diode package 100 according to an exemplary embodiment of the present invention may include a lead frame 110 and at least one LED chip 120 coupled to the lead frame 110. And a bonding wire 130 for connecting and energizing the lead frame 110 and the LED chip 120 to each other, and the lens-shaped reflector 140.

2 to 4 and 6, the LED chip 120 is coupled to the lead frame 110 so that current flows through the lead frame 110.

In addition, the inner side shape of the lead frame 110 has a narrow funnel shape of the lower side and the upper side, and serves as a reflector in which light emitted through the LED chip 120 is dispersed and reflected. In addition, a molding material injection hole 111 into which a molding material for forming the lens-shaped reflector 140 to be described later is injected into the coupling surface to which the LED chip 120 is coupled, and an air outlet for extracting internal air due to injection of the molding material ( 112 is formed. The molding material injection hole 111 and the air outlet 112 are sealed by using a molding material to prevent the LED 122 light from leaking after molding of the lens-shaped reflector 140.

On the other hand, the LED chip 120 is coupled to the coupling surface of the lead frame 110, the LED chip 120 is composed of a circuit board 121 and the LED (122). The circuit board 121 forms a semiconductor layer, and when it is a nitride semiconductor layer, it is preferable to contain Al 2 O 3 (sapphire) crystals, which are metal oxides, in the solidifying body constituting the light conversion material. This Al2O3 crystal has a good conformation in crystal structure with a representative InGaN constituting a nitride semiconductor layer that emits visible light, and can form a good light emitting layer of a nitride semiconductor.

Referring to FIG. 4, in the case where the white light emitting diode is formed in the LED chip 120, the LED chip 120 may include a blue LED chip, and a red, red, blue on the blue LED chip. The molding material 150 in which at least one phosphor of green or yellow phosphor is mixed may be applied.

The bonding wire 130 is coupled to electrically connect the lead frame 110 and the circuit board 121 of the LED chip 120 to each other. Electricity transmitted through the lead frame 110 through the bonding wire 130 is supplied onto the LED chip 120 to allow the LED 122 to emit light.

Meanwhile, referring to FIGS. 5 and 6, the lens-shaped reflector 140 constituting the lens type light distribution / adjustable light emitting diode package 100 according to the embodiment of the present invention has a lens-shaped forming groove 210 formed therein. It is molded into a convex lens shape through injection and curing of a molding material using a mold 200 or an injection molded product.

As mentioned in the prior art, in the case of the conventional flat type LED package, due to its structural characteristics, the emitted light is concentrated to the center of the upper part of the LED. There was a problem in that it did not reveal a large area uniformly or could not focus on a narrow area.

However, in the light emitting diode package according to the embodiment of the present invention, by forming the lenticular reflector and changing the shape of the lenticular reflector, the light distribution of the LED light source can be arbitrarily adjusted. The surface light source can be radiated to emit light in a wide area.

In the conventional flat type light emitting diode package, light is concentrated only at the center of the LED chip, whereas in the case of the lens type light distribution / adjusting light emitting diode package of the present invention, a large area or a certain portion of the focusing area of the LED chip is focused. Illumination). This allows light distribution / adjustment depending on the lens design.

The distribution area of the light may vary depending on the shape of the lens-shaped reflector, which can be arbitrarily adjusted as required by the application.

That is, in the accompanying drawings, as shown in FIG. 5A, the lenticular reflector 140 may be formed as a lens 140a having a semicircular shape with a rounded surface, and as shown in FIG. 5B. The predetermined portion 140b 'of the upper surface may be formed as a lens 140b having a planar shape. This is an embodiment of the present invention, the shape of the lenticular reflector 140 is shown as two examples, but as mentioned above, it will be clear that it may vary as required by the application (Application) to be applied.

In addition, the lens-shaped reflector 140 is formed of a molding material made of epoxy or silicon. Conventionally, epoxy resin has been used as a molding material, but the luminous flux decreases or yellowing is caused by the disconnection of the bonding wire 130 caused by the relatively high hardness value of the epoxy resin and the absorption of the short wavelength visible light by the epoxy resin. In order to solve such a problem, silicon (silicone) material has been used a lot recently. It is known that the molding material of the silicon material has a small hardness and a high restoring force, thereby reducing the occurrence of disconnection of the bonding wire 130 and exhibiting no yellowing tendency with prolonged use.

Meanwhile, FIG. 7 is a block diagram illustrating a manufacturing process of a lens type light distribution / adjustable light emitting diode package according to an exemplary embodiment of the present invention.

2, 6, and 7, a method of manufacturing a lens type light distribution / adjustable light emitting diode package according to an embodiment of the present invention includes an adhesion process 10S for adhering an LED chip onto a lead frame, and Wire connection process (20S) for connecting the lead frame and the LED chip with a bonding wire, the lead frame bonded through the gluing process upside down in a mold or an injection molding formed with a lens-shaped molding groove, and then injection molding material It comprises a molding process (30S) for curing to form an LED package, and the separation process (40S) for separating the LED package formed through the molding process (30S) from the mold or injection.

Before the bonding process 10S, inspection of raw materials for manufacturing a light emitting diode package is performed in advance, and the bonding process 10S bonds the LED chip 120 to the lead frame 110 using an epoxy resin. It is a process.

In addition, the bonding process 10S is a first coating process of first applying a molding material mixed with at least one of red, green, and yellow phosphors on a blue LED chip to cure it. 11S, and a second coating process 12S for coating and curing the transparent molding material on the first applied blue LED chip.

This is to form a white light emitting diode using a high brightness blue LED chip, the light emitted from the high brightness blue LED chip excites the phosphor to generate red, green or yellow light. The light generated by being excited through the phosphor emits white light by constructing interference with light emitted from the blue LED chip.

After the bonding process 10S is performed, a process of inspecting twisting and inclination of the LED chip 120 adhered on the lead frame 110 and the supply amount of the epoxy resin is additionally performed.

In addition, the wire connection process 20S is a process of connecting the bonding wires 130 to electrically connect the lead frame 110 and the LED chip 120, and generally uses gold wires having a low electrical resistance to connect them. do. After the wire connection process 20S is performed, an external inspection is additionally performed to verify that the lead frame 110 to which the bonding wire 130 is connected has no problem in appearance.

In addition, the molding process 30S is a process of forming the lenticular reflector 140 after the wire connection process 20S, and a molding material for forming the lenticular reflector 140 using an injector. Inserting process.

The molding process 30S will be described in more detail. First, the lead frame 110 formed through the wire connection process 20S is inverted and placed on the mold 200 or the injection molded product in which the lens-shaped forming groove 210 is formed. Then, the molding material is injected through the molding material injection hole 111 penetrated through the lead frame 110, and the lens-shaped reflector 140 is formed by heat curing or UV curing. In this process, the internal air is sucked separately through the air outlet 112 to extract the air that will be present therein when the molding material is injected. It is preferable that the molding material uses an epoxy resin or a silicone resin.

In addition, the separation process 40S is a process of separating the LED package formed through the molding process 30S from the mold 200 or an injection molded product.

The LED package 100 according to the present invention constituting the lenticular reflector 140 as described above can be arbitrarily adjusted by varying the shape of the lenticular reflector 140, and the LED emission light distribution can be arbitrarily adjusted. It is possible to irradiate light to a wide area by allowing controlled radiation, and to irradiate light to a narrow area at the same time. The shape of the lens-shaped reflector 140 may be formed differently depending on the application.

In addition, according to the manufacturing method of the LED package 100 according to the present invention, the productivity, quality, yield, etc. of the product is improved compared to the conventional lens type products. Conventionally, the lens is separately molded and bonded, whereas the present invention reduces the process since LENS shape molding is possible in one LED package process.

In addition, since it is molded in one material in terms of quality, heat resistance is superior to the method in which the two materials are bonded. In particular, when two conventional materials are bonded, they may be an element that inhibits the linearity of light due to scattering of light at the bonding interface. In addition, while the conventional adhesive method may cause an error of the lens point (LENS POINT), in the case of the present invention there is no error because the molded product in a mold designed in terms of yield.

FIG. 8 shows luminance distributions according to the lens-shaped reflectors of the light distribution / adjustment LED package according to an embodiment of the present invention, and FIG. 8A illustrates luminance distributions according to the shape of the lens-shaped reflectors of FIG. 5A. FIG. 8B shows the luminance distribution according to the shape of the lenticular reflector of FIG. 5B. According to this, it can be seen that the surface light source radiation is emitted to the LED light source is a large area. Meanwhile, in FIG. 8, the vertical axis represents the relative intensity of light, and the horizontal axis represents the angular displacement of the light.

1A is a cross-sectional view showing the configuration of a conventional LED package;

1B is experimental data showing a luminance distribution along a radiation plane of a conventional LED package;

2 is a perspective view showing the configuration of a light emitting diode package according to an embodiment of the present invention;

3 is a side cross-sectional view of a light emitting diode package according to an embodiment of the present invention;

4 is a side cross-sectional view of a light emitting diode package according to another embodiment of the present invention;

5 is an exemplary view showing a shape of a lenticular reflector according to an embodiment of the present invention;

6 is a view showing a manufacturing state of a lens type light distribution / adjustable light emitting diode package according to an embodiment of the present invention;

7 is a block diagram illustrating a manufacturing process of a lens type light distribution / adjustable light emitting diode package according to an embodiment of the present invention; And

8 is a graph illustrating luminance distribution according to a lenticular reflector of a light distribution / adjustment light emitting diode package according to an exemplary embodiment of the present invention.

※ Explanation of symbols for main parts of drawing

100: light distribution / adjustable light emitting diode package 110: lead frame

111: molding material inlet 112: air outlet

120: LED chip 121: circuit board

122: LED 130: bonding wire

140: lens type reflector 200: mold

210: molding groove

Claims (6)

delete delete delete delete Bonding process of bonding the LED chip onto the lead frame; A wire connection process of connecting the lead frame and the LED chip with a bonding wire; After placing the lead frame to which the LED chip is bonded through the bonding process, the mold is formed in a mold or an injection molded product in which a lens-shaped forming groove is formed, and then injection molding material is injected through the molding material injection hole formed in the lead frame. A molding process of forming internal lens through the formed air outlet to discharge the outside air and curing the injected molding material to form a lenticular reflector; A sealing process of injecting a molding material into the molding material inlet and the air outlet after curing the lenticular reflector; And And a separation process of separating the LED package formed by forming the lenticular reflector from the mold or the injection molding through the molding process. The method of claim 5, The bonding process may include a first coating process of first applying and curing a molding material in which at least one phosphor of red, green, or yellow phosphor is mixed on a blue LED chip; And a second coating process of coating and curing the transparent molding material on the first applied blue LED chip, thereby curing the light distribution / adjusting LED package of a lens type.

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